Complex curved surface conformal high-resolution embedded circuit manufacturing method

Abstract

The invention belongs to the field of micro-nano manufacturing technology and microelectronic manufacturing, and particularly relates to a method for manufacturing a complex curved surface conformal high-resolution embedded circuit, which comprises the following steps of: firstly, processing a nano groove structure with a specific pattern on a hard curved surface substrate according to a preset path; a metal seed layer is deposited in the groove, then the groove is filled with a conductive material by adopting filling technologies such as precise electroplating / chemical plating, fusion strengthening is generated among various metals by adopting a laser heating mode, and the adhesive force with the hard curved surface substrate groove structure can be further enhanced after the metals are cooled. And the requirements of extremely severe service environments are met. A new solution is provided for low-cost manufacturing of the embedded curved surface circuit which is high in resolution, adjustable in height-width ratio, high in electrical performance, high in adhesive force and capable of combining multiple materials.

Description

Technical Field

[0001] The present application belongs to the field of micro-nano manufacturing technology and microelectronics manufacturing, and specifically relates to a method for manufacturing a complex curved surface conformal high-resolution embedded circuit, which can achieve an embedded conformal circuit manufacturing method with high adhesion, high resolution, and high conductivity on any complex curved surface substrate. Background Art

[0002] Curved circuits refer to circuit components with specific functions that are conformally fabricated onto a three-dimensional curved substrate. Curved circuits not only have similar electrical functions to two-dimensional planar circuits, but can also be integrated with other electronic components on a curved substrate to achieve three-dimensional conformal electronic devices with new characteristics and functions.

[0003] However, in harsh and severe service environments, higher requirements are placed on curved conformal circuits. For example, in the application of hypersonic missiles (such as radar radome FSS, conformal antennas, etc.), higher standards are placed on the adhesion between conformal circuits and the substrate.

[0004] Existing surface relief conformal circuits (circuits formed on the surface of curved substrates) can no longer meet the requirements of super strong adhesion and high electrical performance, while embedded curved conformal circuits (embedded in the substrate) provide an ideal solution. However, existing curved conformal circuit manufacturing technology makes it difficult to achieve the manufacture of embedded conformal circuits with high adhesion, high resolution, and high conductivity on any complex curved surface.

[0005] The existing methods for manufacturing curved conformal circuits can be divided into three types: curved circuit manufacturing processes based on conformal printing technology, transfer technology, and other composite manufacturing processes. Common conformal printing technologies include direct writing extrusion printing, aerosol jet printing, electrohydrodynamic jet printing, laser direct writing printing, etc. The above technologies have the advantages of simple processing technology, high molding accuracy, and free molding on expandable and non-expandable curved substrates, but can only realize surface relief conformal circuit manufacturing. The curved circuit manufacturing process based on transfer technology combines two-dimensional planar circuit manufacturing technology with transfer technology to achieve rapid manufacturing of circuit structures on curved substrates. Common technologies include flexible mold-assisted transfer, thermoforming transfer, water transfer, etc., which have the advantages of simple process and high processing efficiency, but the transfer process has problems such as low positioning accuracy, wrinkles when transferred to non-expandable surfaces, poor adhesion to curved substrates, and inability to realize embedded curved conformal circuit manufacturing. The composite manufacturing process usually pre-fabricates masks and templates, and then realizes the manufacturing of curved circuits through a variety of composite processes such as lithography, deposition, and etching. There are problems such as complex manufacturing process and expensive masks required for lithography. Although embedded curved circuit manufacturing can be achieved, it is difficult to meet high adhesion requirements.

[0006] In summary, the existing technology has problems such as complex and expensive preparation process, poor adhesion between the circuit and the curved substrate, which makes it difficult to meet the requirements of extremely harsh service environments, and limited resolution of the curved circuit. Therefore, it is urgent to develop a simplified, high-adhesion, high-resolution, and high-conductivity embedded curved conformal circuit manufacturing method.

[0007] The information in this background technology section is only intended to enhance the understanding of the overall background of the application and should not be construed as an admission or any form of suggestion that the information constitutes the prior art already known to a person of ordinary skill in the art. Summary of the invention

[0008] In order to overcome the shortcomings of the above-mentioned prior art, the present application proposes a method for manufacturing curved surface high-resolution embedded circuits with high adhesion, high resolution and high conductivity. By embedding the circuit into a curved surface substrate, the adhesion between the circuit and the substrate can be greatly improved. The manufacturing method also realizes low-cost manufacturing of curved surface circuits with high resolution and high electrical performance.

[0009] In some embodiments of the present application, a method for manufacturing a complex surface conformal high-resolution embedded circuit is provided, comprising the following steps:

[0010] (1) Preparing a nano-groove structure on a hard curved substrate: pre-treating the hard curved substrate, and then processing a desired patterned nano-groove structure on the curved substrate according to a preset path;

[0011] (2) Depositing a metal seed layer: depositing a layer of metal inside the nano-groove and removing the metal layer outside the nano-groove structure;

[0012] (3) Filling the nano-groove structure: filling the groove structure with a conductive material;

[0013] (4) Laser heating and melting strengthening: A laser is used to heat the conductive material filled in the groove structure according to the circuit pattern path, so that fusion strengthening occurs between the metal seed layer and the filling material, further filling the groove structure while enhancing the adhesion between the conductive metal and the curved substrate;

[0014] (5) Post-processing: removing the excess metal material outside the nano-grooves of the curved substrate and the portion of the nano-grooves filling material that protrudes above the surface of the substrate.

[0015] In some embodiments of the present application, the hard curved substrate in step (1) includes but is not limited to a flat substrate and a non-flat substrate, a developable curved substrate and a non-developable curved substrate. Common curved substrates include curved ceramic substrates, curved quartz glass substrates, etc.

[0016] In some embodiments of the present application, a five-axis linkage laser direct writing device is used to process the desired patterned nano-groove structure on a curved substrate.

[0017] In some embodiments of the present application, the substrate pretreatment step in step (1) is: placing the substrate in an isopropanol solution for ultrasonic treatment, then placing the substrate in deionized water for ultrasonic cleaning to remove residual isopropanol solution, and finally blowing the substrate dry with nitrogen or other inert gases.

[0018] In some embodiments of the present application, the nano-groove pattern ablated on the curved substrate by a laser in step (1) includes but is not limited to wire grids, meshes, diamonds, triangles, hexagons, etc., and the laser parameters and ablation time can be adjusted as needed to form a nano-groove structure of the required size (line width, aspect ratio, etc.).

[0019] In some embodiments of the present application, the method of depositing the metal seed layer in step (2) includes but is not limited to physical vapor deposition, etc., and the deposition time can be adjusted and optimized according to actual needs, and the thickness of the deposited seed layer can be controlled. The metal seed layer material includes but is not limited to copper, silver and other materials.

[0020] In some embodiments of the present application, the method of filling the nano-groove structure in step (3) includes but is not limited to precision electroplating / chemical plating / direct writing extrusion and the like.

[0021] The conductive materials filled include but are not limited to nickel, silver and other materials. This step can be implemented as a single material or multiple metal materials according to actual needs to meet specific functional needs. If precision electroplating is used, it mainly includes: connecting the nano-grooves with a metal seed layer to the micro-electroforming equipment, and adding an anode activator, a buffer and an anti-pinhole agent to the electroforming solution to improve solubility, increase conductivity and prevent pinhole formation; using a nanosecond pulse power supply for high-frequency, narrow pulse width electroplating, controlling the temperature and pH value, and using a circulating pump to stir the plating solution and discharge bubbles; finally, removing the structure from the cathode and cleaning to remove residual materials.

[0022] In some embodiments of the present application, the laser heating melting strengthening method in step (4) comprises the following steps:

[0023] The workpiece filled with conductive material is installed in a fixed position; then a laser is used to heat and melt the filled conductive material and metal seed layer according to the planned circuit pattern path. The molten metal is completely filled into the micro-nano structure of the nano-groove. After the metal cools, an interlocking structure is formed at the heterogeneous interface between the metal and the nano-groove. The interlocking structure is used to achieve strong adhesion between the metal pattern and the curved substrate.

[0024] In some embodiments of the present application, in step (4), the workpiece that has been filled with conductive material is mounted on a laser multi-module three-dimensional surface graphics printing device, and a positioning camera is used in combination with alignment marks to align the workpiece on the printing device.

[0025] In some embodiments of the present application, when laser heating and melting are performed, a high power mode is used.

[0026] In some embodiments of the present application, the post-treatment of the curved substrate surface in step (5) may be performed by polishing or other techniques to remove excess metal material outside the nano-grooves and the portion of the filler metal protruding above the substrate surface.

[0027] Compared with the prior art, this application has the following beneficial effects:

[0028] (1) It can realize efficient, low-cost, and large-area manufacturing of high-resolution embedded curved circuits. Compared with technologies such as photolithography, the method combines laser ablation, deposition of seed layers, and filling of conductive materials to effectively reduce manufacturing costs and simplify manufacturing steps. In addition, the size of the curved circuit is only limited by the size of the workbench, which is conducive to large-area manufacturing.

[0029] (2) Curved circuits of any shape can be manufactured according to actual needs. Laser direct writing technology can be used to ablate high-precision nano-groove structures (square, diamond, etc.) of any pattern, and the size and aspect ratio are adjustable. Through subsequent conductive material filling and laser heating and melting strengthening, customizable, high-resolution, and high-conductivity curved circuit manufacturing can be finally achieved.

[0030] (3) According to actual needs, the deposited metal seed layer material and the conductive material filled in the nano groove can be replaced. These materials can be the same type or different types. When filling the nano groove with conductive material, multiple materials can also be filled to meet special needs such as electromagnetic shielding.

[0031] (4) Laser heating and melting strengthening method can be used to achieve high-strength bonding between the curved substrate and the metal pattern heterogeneous interface. On the one hand, this method embeds the metal pattern (conformal circuit) into the three-dimensional curved substrate, and enhances the adhesion by increasing the contact area between the metal material and the curved substrate. On the other hand, the metal material and the curved substrate heterogeneous interface are laser heated and melted to form an interlocking structure, thereby enhancing the adhesion between the metal pattern and the curved substrate.

[0032] (5) The laser heating and melting strengthening method can effectively achieve high-density filling of metal materials inside the nano-grooves, eliminate the pore structure generated during electroplating / chemical plating filling, and realize high-density curved circuit manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1Schematic diagram of the process flow of the method for manufacturing a high-resolution embedded circuit with a complex surface conformal shape in some embodiments of the present application Figure 1 ,in:

[0034] (a) Laser ablation of nanogrooves; (b) deposition of metal seed layer; (c) precision electroplating / chemical plating / filling; (d) laser melting strengthening; (e) polishing; (f) final sample.

[0035] Figure 2 Schematic diagram of the process flow of the method for manufacturing a high-resolution embedded circuit with a complex surface conformal shape in some embodiments of the present application Figure 2 .

[0036] Figure 3 This is a schematic diagram of electroplating and filling nano-grooves in some embodiments of the present application, wherein:

[0037] (a) Initial sample; (b) Precision electroplating; (c) Laser ablation melting strength; (d) Polishing; (e) Final sample.

[0038] Figure 4 Example 1 Schematic diagram of the manufacturing process of curved embedded circuits.

[0039] Figure 5 Composite double cross FSS graphic. DETAILED DESCRIPTION

[0040] In order to enable those skilled in the art to better understand the technical solution of the present disclosure, the present disclosure is described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0041] All terms (including technical terms or scientific terms) used in the present disclosure have the same meanings as those understood by ordinary technicians in the field to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries, such as general dictionaries, should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined herein.

[0042] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0043] The following is combined with Figure 1-5 To illustrate the detailed technical solution of this application.

[0044] This application first processes a nano-groove structure of a specific pattern on a hard curved surface substrate according to a preset path, then uses physical vapor deposition and other technologies to deposit a metal seed layer inside the groove, and then uses precision electroplating / chemical plating and other filling technologies to fill the groove with conductive materials, and then uses laser heating to produce fusion and reinforcement between multiple metals. After the metal cools, it can further enhance the adhesion to the groove structure of the hard curved surface substrate to meet the requirements of extremely harsh service environments. This application provides a new solution for the low-cost manufacturing of embedded curved circuits with high resolution, adjustable aspect ratio, high electrical performance, high adhesion, and multi-material combination.

[0045] Example 1

[0046] The embedded circuit pattern is manufactured on the surface of the hemispherical quartz glass curved substrate, which is applied to the field of curved transparent antenna. The specific manufacturing process is shown in the attached Figure 1-2 .

[0047] Step 1: Surface base pretreatment

[0048] A semi-cylindrical quartz glass curved substrate was selected as the substrate, and the curved substrate was placed in an isopropanol solution for ultrasonic cleaning for 5 minutes, then placed in deionized water for ultrasonic cleaning for 5 minutes to remove the residual isopropanol solution, and finally dried with nitrogen gas.

[0049] Step 2: Preparation of nanogroove structure

[0050] After setting the laser parameters and sintering time, the five-axis linkage laser direct writing equipment laser ablates the required patterned nano-groove structure on the semi-cylindrical quartz glass curved substrate according to the preset path.

[0051] The pattern of this embodiment is a grid structure with an area of ​​60×60 mm, a period of 1 mm, and a groove structure with a depth-to-width ratio of 2:1.

[0052] Step 3: Deposit the metal seed layer

[0053] Physical vapor deposition technology is used to deposit a layer of highly conductive silver inside the nano groove as a conductive layer. The physical vapor deposition equipment is a TRP450 magnetron sputtering system, which uses a magnetron sputtering coating process. The basic principle of sputtering coating is to make argon gas glow discharge under vacuum conditions filled with argon (Ar). At this time, argon (Ar) atoms are ionized into argon ions (Ar+). Under the action of the electric field force, the argon ions are accelerated to bombard the cathode target made of silver plating material. The target material will be sputtered and deposited on the surface of the workpiece. The thickness of the deposited layer is 400nm. After the deposition is completed, wipe the metal layer except for the groove.

[0054] Step 4: Electroforming and depositing nickel (Ni) metal layer

[0055] The nano-grooves with metal seed layers are connected to the micro-electroforming equipment, and anode activators, buffers and anti-pinhole agents are added to the electroforming solution to improve solubility, increase conductivity and prevent pinhole formation; a nanosecond pulse power supply is used for high-frequency, narrow pulse width electroplating, the temperature and pH value are controlled, and a circulating pump is used to stir the plating solution and discharge bubbles; finally, the structure is removed from the cathode and cleaned to remove residual materials. The temperature of the electroforming solution is controlled at 60°C, the pH value is controlled at 4.5 using a pH monitoring system, and the pump is used to flush the liquid at a flushing speed of 1m / s. Electroforming is performed using a nanosecond pulse power supply with a frequency of 500kHz and a duty cycle of 1:10, the current density is 1.5A / dm2, and the electroforming time is about 2min.

[0056] Step 5: Laser Heating and Melting Strengthening

[0057] A laser is used to heat the conductive material filled inside the groove structure according to the grid pattern path, so that fusion and reinforcement are generated between the metal silver seed layer and the filling metal nickel, which further fills the groove structure and enhances the adhesion between the conductive metal and the curved substrate.

[0058] (5) Post-processing: Using polishing post-processing technology, the excess nickel metal material outside the nano-grooves of the curved substrate and the part of the nano-grooves filled with metal that protrudes above the surface of the substrate can be removed by polishing. This embodiment can be applied to the field of curved transparent antennas.

[0059] Example 2

[0060] The embedded circuit pattern is manufactured on the surface of the hemispherical ceramic curved substrate, which is applied to the curved FSS radome field. The specific manufacturing process is shown in the attached Figure 3-4 .

[0061] Step 1: Surface base pretreatment

[0062] A hemispherical ceramic curved surface substrate was selected as the substrate, and the curved surface substrate was placed in an ethanol solution for ultrasonic cleaning for 3 minutes, then placed in deionized water for ultrasonic cleaning for 5 minutes to remove the residual ethanol solution, and finally dried with nitrogen gas.

[0063] Step 2: Preparation of nanogroove structure

[0064] After setting the laser parameters and sintering time, the five-axis linkage laser direct writing equipment processes the required patterned nano-groove structure on the hemispherical curved surface substrate according to the preset path. The FSS pattern of this embodiment is a composite double cross FSS pattern (attached Figure 5 ), the depth-to-width ratio of the groove structure is 1:1.

[0065] Step 3: Deposit a silver metal seed layer

[0066] Physical vapor deposition technology is used to deposit a layer of highly conductive silver inside the nano groove as a conductive layer. The physical vapor deposition equipment is a TRP450 magnetron sputtering system, which uses a magnetron sputtering coating process. After the deposition is completed, wipe off the metal layer except for the groove.

[0067] Step 4: Filling with conductive silver paste using direct write extrusion 3D printing process

[0068] The printing slurry selected the nano-conductive silver slurry (viscosity 30000cp, silver content>90%) independently configured by the laboratory, the inner diameter of the printing nozzle was 200μm, and after setting the printing parameters (printing height 0.25mm, printing pressure 180Kpa, workbench moving speed 20mm / s), the printing program was run to completely fill the nano groove.

[0069] Step 5: Laser Heating and Melting Strengthening

[0070] The laser is used to heat the conductive material filled inside the groove structure according to the FSS graphic path, so that the metal silver seed layer and the filling silver paste are fused and strengthened, and the adhesion between the conductive metal and the curved substrate can be enhanced while further filling the groove structure. The specific steps are: reinstall the workpiece that has been filled with conductive materials onto the laser multi-module three-dimensional surface graphic printing equipment. Use a positioning camera and alignment marks to align the workpiece on the printing equipment; then use a laser (high power mode) and heat and melt the filled conductive material and metal seed layer according to the planned circuit pattern path. The molten metal is completely filled into the micro-nano structure of the nano-groove. After the metal cools, the metal and the nano-groove heterogeneous interface form an interlocking structure. The interlocking structure is used to achieve strong adhesion between the metal graphic and the curved substrate.

[0071] (5) Post-processing: Use post-processing techniques such as polishing to remove the excess silver metal outside the nano-grooves of the curved substrate and the portion of the nano-grooves filled with metal that is higher than the surface of the substrate. This embodiment can be applied to the field of curved ceramic FSS antenna covers.

[0072] Example 3

[0073] An embedded circuit pattern is manufactured on the surface of a hemispherical glass curved substrate, which is applied in the field of curved transparent electromagnetic shielding.

[0074] Step 1: Surface base pretreatment

[0075] A hemispherical glass curved surface substrate was selected as the substrate, and the curved surface substrate was placed in an ethanol solution for ultrasonic cleaning for 3 minutes, then placed in deionized water for ultrasonic cleaning for 5 minutes to remove the residual ethanol solution, and finally dried with nitrogen gas.

[0076] Step 2: Preparation of nanogroove structure

[0077] After setting the laser parameters and sintering time, the five-axis linkage laser direct writing equipment processes the required patterned nano-groove structure on the hemispherical glass curved substrate according to the preset path. The pattern of this embodiment is a grid structure with an area of ​​60×60mm, a period of 0.25mm, and a groove structure aspect ratio of 1.5:1.

[0078] Step 3: Deposit the metal seed layer

[0079] Physical vapor deposition technology is used to deposit a layer of silver with strong conductivity inside the nano groove as a conductive layer. The physical vapor deposition equipment is a TRP450 magnetron sputtering system.

[0080] Step 4: Electroless plating deposits copper (Cu) metal layer and nickel (Ni) metal layer

[0081] A copper (Cu) metal layer and a nickel (Ni) metal layer are deposited respectively by chemical plating.

[0082] Step 5: Laser Heating and Melting Strengthening

[0083] A laser is used to heat the conductive material filled inside the groove structure according to the grid pattern path, so that fusion and reinforcement are generated between the metal silver seed layer and the filled metal copper and metal nickel, which further fills the groove structure and enhances the adhesion between the conductive metal and the curved substrate.

[0084] (5) Post-processing: Use post-processing techniques such as polishing to remove the excess nickel metal outside the nano-grooves of the curved substrate and the portion of the nano-grooves filled with metal that is higher than the surface of the substrate. This embodiment can be applied to the field of curved transparent electromagnetic shielding.

[0085] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for manufacturing a high-resolution embedded circuit on a complex surface, characterized in that: The steps include: (1) Preparing a nano-groove structure on a hard curved substrate: pre-treating the hard curved substrate, and then processing a desired patterned nano-groove structure on the curved substrate according to a preset path; (2) Depositing a metal seed layer: depositing a layer of metal inside the nano-groove and removing the metal layer outside the nano-groove structure; (3) Filling the nano-groove structure: filling the groove structure with a conductive material; (4) Laser heating and melting strengthening: A laser is used to heat the conductive material filled in the groove structure according to the circuit pattern path, so that fusion strengthening occurs between the metal seed layer and the filling material, further filling the groove structure while enhancing the adhesion between the conductive metal and the curved substrate; (5) Post-processing: removing the excess metal material outside the nano-grooves of the curved substrate and the portion of the nano-grooves filling material that protrudes above the surface of the substrate.

2. The method for manufacturing a complex surface conformal high-resolution embedded circuit according to claim 1, characterized in that: In the step (1), the hard curved surface substrate includes a flat substrate or a non-flat substrate, a developable curved surface substrate or a non-developable curved surface substrate.

3. The method for manufacturing a complex surface conformal high-resolution embedded circuit according to claim 1, characterized in that: A five-axis laser direct writing device is used to process the required patterned nano-groove structure on the curved substrate.

4. The method for manufacturing a complex surface conformal high-resolution embedded circuit according to claim 1, characterized in that: The substrate pretreatment step in step (1) is: placing the substrate in an isopropanol solution for ultrasonic treatment, then placing the substrate in deionized water for ultrasonic cleaning to remove the residual isopropanol solution, and finally blowing the substrate dry with nitrogen or other inert gas.

5. The method for manufacturing a complex surface conformal high-resolution embedded circuit according to claim 1, characterized in that: The nano-groove pattern ablated on the curved substrate by laser in step (1) includes one or more of a wire grid, a mesh, a rhombus, a triangle, and a hexagon; the laser parameters and ablation time can be adjusted as needed to form a nano-groove structure of a desired size.

6. The method for manufacturing a complex surface conformal high-resolution embedded circuit according to claim 1, characterized in that: The method for depositing the metal seed layer in step (2) includes chemical vapor deposition or physical vapor deposition, and the deposition time can be adjusted and optimized to control the thickness of the deposited seed layer according to actual needs; the metal seed layer material includes copper and / or silver; the conductive material filled in step (3) includes nickel and / or silver material, and single material filling or multiple metal material filling can be achieved according to actual needs to meet specific functional requirements.

7. The method for manufacturing a complex surface conformal high-resolution embedded circuit according to claim 1, characterized in that: The method of filling the nano-groove structure in step (3) includes but is not limited to precision electroplating / chemical plating / direct writing extrusion and the like; Preferably, in step (5), the surface post-treatment of the curved substrate may be performed by polishing or other techniques to remove excess metal material outside the nano-grooves and the portion of the filler metal protruding above the surface of the substrate.

8. The method for manufacturing a complex surface conformal high-resolution embedded circuit according to claim 1, characterized in that: The precision electroplating method includes: connecting the nano-grooves with the metal seed layer to the micro-electroforming equipment, and adding anode activators, buffers and anti-pinhole agents to the electroforming solution to improve solubility, increase conductivity and prevent pinhole formation; using a nanosecond pulse power supply for high-frequency, narrow pulse width electroplating, controlling the temperature and pH value, and using a circulating pump to stir the plating solution and expel bubbles; finally, removing the structure from the cathode and cleaning to remove residual materials.

9. The method for manufacturing a complex surface conformal high-resolution embedded circuit according to claim 1, characterized in that: The laser heating melting strengthening method in step (4) comprises the following steps: The workpiece filled with conductive material is installed in a fixed position; then the filled conductive material and metal seed layer are heated and melted using a laser according to the planned circuit pattern path, and the molten metal is completely filled into the micro-nano structure of the nano-groove. After the metal is cooled, an interlocking structure is formed at the heterogeneous interface between the metal and the nano-groove; the interlocking structure is used to achieve strong adhesion between the metal pattern and the curved substrate; Preferably, in step (4), the workpiece filled with the conductive material is mounted on a laser multi-module three-dimensional surface graphics printing device, and a positioning camera is used in combination with alignment marks to align the workpiece on the printing device.

10. A complex surface conformal high-resolution embedded circuit, characterized in that: Prepared by the manufacturing method according to any one of claims 1 to 9.

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