Installation device, method and equipment of printed circuit board radiator and storage medium

Abstract

The invention discloses an installation device, method and equipment of a printed circuit board radiator and a storage medium, and relates to the technical field of servers. After the printed circuit board is transported to an installation position, the supporting piece is lifted through the arranged lifting assembly so that the supporting piece can be supported below the printed circuit board, then the radiator is clamped through the clamping assembly and placed on the printed circuit board, and finally the fixed pins of the radiator are pressed through the arranged press-fitting assembly. And one end of the fixing pin passes through the mounting hole on the printed circuit board, so that the radiator can be fixed on the printed circuit board by the fixing pin. Therefore, the technical problems of low efficiency of manual installation of the radiator and damage to the printed circuit board can be solved, the installation efficiency of the radiator of the printed circuit board is improved, and the damage probability of the printed circuit board is reduced.

Description

Technical Field

[0001] The present application relates to the field of server technology, and in particular to an installation device, method, equipment and storage medium for a printed circuit board heat sink. Background Art

[0002] As the total power of the server's boards (printed circuit boards) increases, the number of heat sinks required on the boards also increases. Among them, the most common type of heat sink on the boards is the passive heat sink. The number of passive heat sinks in a board is more than ten times or even dozens of times that of active heat sinks.

[0003] At present, most of the methods of manually pressing the fixing pins of the heat sink into the mounting holes of the printed circuit board are adopted to install the heat sink on the printed circuit board. However, the manual installation method of the heat sink in the related art is inefficient and easily causes deformation and damage of the printed circuit board during installation. Summary of the invention

[0004] The present application provides a device, method, equipment and storage medium for installing a printed circuit board heat sink, so as to at least solve the problems of low installation efficiency of the heat sink and deformation and damage of the printed circuit board in the related art.

[0005] In a first aspect, the present application provides a mounting device for a printed circuit board heat sink, comprising:

[0006] A support member, a lifting assembly, a clamping assembly, a press-fitting assembly and a controller, wherein the lifting assembly, the clamping assembly and the press-fitting assembly are all connected to the controller in communication; the lifting assembly is arranged below the transport path of the printed circuit board, and the support member is placed on the upper end of the lifting assembly;

[0007] A controller is used to control the lifting assembly to drive the support member to move to the installation position to support the bottom of the printed circuit board after the printed circuit board is transported to the installation position; the printed circuit board is provided with a mounting hole, the support member is provided with an avoidance hole, and the mounting hole corresponds to the avoidance hole;

[0008] The controller is also used to control the clamping assembly to clamp the heat sink and place the heat sink on the printed circuit board, and after the heat sink is placed in place, one end of the fixing pin of the heat sink corresponds to the mounting hole;

[0009] The controller is also used to control the press-fit assembly to press the fixing pin of the heat sink away from one end of the mounting hole so that one end of the fixing pin passes through the mounting hole. The fixing pin is used to clamp the heat sink onto the printed circuit board.

[0010] In a second aspect, the present application also provides a method for installing a printed circuit board heat sink, comprising:

[0011] After the printed circuit board is transported to the installation position, the lifting assembly is controlled to drive the support member to move to the installation position to support the bottom of the printed circuit board; the printed circuit board is provided with a mounting hole, the support member is provided with an avoidance hole, and the mounting hole corresponds to the avoidance hole;

[0012] Controlling the clamping assembly to clamp the radiator and place the radiator on the printed circuit board; and after the radiator is placed in place, one end of the fixing pin of the radiator corresponds to the mounting hole;

[0013] The press-fit assembly is controlled to press the fixing pin of the heat sink away from one end of the mounting hole so that one end of the fixing pin passes through the mounting hole. The fixing pin is used to clamp the heat sink onto the printed circuit board.

[0014] In a third aspect, the present application further provides an electronic device, comprising: a memory for storing a computer program;

[0015] The processor is used to implement the steps of the method for installing the printed circuit board heat sink provided in the second aspect when executing the computer program.

[0016] In a fourth aspect, the present application further provides a computer-readable storage medium, in which a computer program is stored, wherein when the computer program is executed by a processor, the steps of the method for installing the printed circuit board heat sink provided in the second aspect are implemented.

[0017] In a fifth aspect, the present application further provides a computer program product, including a computer program, which, when executed by a processor, implements the steps of the method for installing a printed circuit board heat sink provided in the second aspect above.

[0018] Through the installation device, method, equipment and storage medium of the printed circuit board heat sink provided by the present application, when the printed circuit board is transported to the installation position, the support member is lifted by the provided lifting assembly so that the support member is supported under the printed circuit board, and then the heat sink is automatically clamped by the clamping assembly and placed on the printed circuit board, and finally the fixed pin of the heat sink is pressed by the provided pressing assembly so that one end of the fixed pin passes through the installation hole on the printed circuit board, so that the fixed pin can fix the heat sink on the printed circuit board. Therefore, the technical problems of low efficiency of manual installation of heat sinks and damage to printed circuit boards can be solved, the installation efficiency of the heat sink of the printed circuit board is improved, and the probability of damage to the printed circuit board is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 A schematic diagram of the structure of a radiator provided for related technology;

[0021] Figure 2 A schematic diagram of the structure of the fixed pin provided for the related technology;

[0022] Figure 3 A schematic diagram of the installation of fixed pins and printed circuit boards provided for related technologies;

[0023] Figure 4 A schematic diagram of the structure of a mounting device for a printed circuit board heat sink provided in one embodiment of the present application;

[0024] Figure 5 A schematic diagram of a press-fit installation device for a printed circuit board heat sink provided in one embodiment of the present application;

[0025] Figure 6 A schematic structural diagram of a second support member provided in one embodiment of the present application;

[0026] Figure 7 A schematic diagram of a clamping assembly clamping a heat sink provided in an embodiment of the present application;

[0027] Figure 8 A schematic diagram of a press-fit installation device for a printed circuit board heat sink provided in yet another embodiment of the present application;

[0028] Fig. 9 A schematic diagram of a process for installing a printed circuit board heat sink provided in an embodiment of the present application;

[0029] Fig.10 A schematic diagram of the structure of an electronic device provided in one embodiment of the present application.

[0030] The above drawings include the following reference numerals:

[0031] 100-heat sink body; 200-fixing pin; 201-main rod; 202-umbrella-shaped structure; 203-compression spring; 300-printed circuit board; 301-mounting hole;

[0032] 10-installation device of printed circuit board heat sink; 11-lifting assembly; 12-clamping assembly; 121-movable assembly; 122-grabbing arm; 13-pressing assembly; 131-vertical press-fitting component; 132-horizontal press-fitting component; 14-controller; 15-support member. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0034] It should be noted that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. The terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. The terms "parallel", "perpendicular" and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement being discussed and the errors associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either one. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0035] It should be noted that, in the description of this application, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. The terms "first", "second", etc. in this application are used to distinguish similar objects, and are not used to describe a specific order or sequence.

[0036] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0037] With the rise of artificial intelligence, the performance requirements for servers are getting higher and higher, which also makes the total power of server boards (printed circuit boards) higher and higher. As a result, more heat sinks need to be installed on the boards to dissipate heat to ensure the normal working state of the boards. Among them, the most common type of heat sink is a passive heat sink, which refers to a heat sink that directly contacts the board and passively increases the heat dissipation area of ​​the board.

[0038] Currently, the installation of the heat sink is mostly achieved by manually pressing the fixing pins of the heat sink onto the mounting holes of the printed circuit board. Figure 1 It is a structural schematic diagram of a radiator provided in the related art; Figure 2 It is a structural schematic diagram of a fixed pin provided in the related art; Figure 3 This is a schematic diagram of the installation of fixed pins and printed circuit boards in the related art. Figures 1 to 3 As shown in the figure, the fixing pin 200 includes: a main rod 201 and an umbrella-shaped structure 202 integrally arranged with the main rod 201, the umbrella-shaped structure 202 can be contracted under the action of external force, the outer periphery of the main rod 201 is sleeved with a compression spring 203, the radiator body 100 is provided with a fixing hole, the main rod 201 is penetrated with the fixing hole, and the printed circuit board 300 is provided with a mounting hole 301. When fixing the radiator, one end of the fixing pin 200 is pressed by manpower, so that the compression spring 203 is in a compressed state. The fixing pin 200 is in the state of being pressed, and the umbrella-shaped structure 202 of the fixing pin 200 is passed through the mounting hole 301, and then the fixing pin 200 is stopped being pressed, and the umbrella-shaped structure 202 is abutted against the peripheral side of the mounting hole 301 under the action of the elastic restoring force of the compression spring 203. Since one end of the compression spring 203 is abutted against the heat sink body 100, and the other end is abutted against the end of the main body rod 201 away from the umbrella-shaped structure 202, the heat sink is installed on the printed circuit board 300 under the cooperation of the compression spring 203 and the umbrella-shaped structure 202. However, in the related art, when the fixing pin 200 is manually passed through the mounting hole 301 of the printed circuit board 300, the reference Figure 3As shown in the figure, due to the lack of support for the printed circuit board 300, the printed circuit board 300 will be deformed due to force, which may cause damage to the printed circuit board or components of the printed circuit board; in addition, due to the large number of heat sinks that need to be installed, manual installation also makes the assembly efficiency of the printed circuit board low.

[0039] Therefore, in the face of the above technical problems, in order to improve the installation efficiency of the printed circuit board heat sink, the heat sink can be automatically picked up and the fixing pins of the heat sink can be automatically pressed by automated means, so that the heat sink can be fixedly installed on the printed circuit board. Specifically, when the printed circuit board moves to the installation position, the automatic grabbing structure can automatically grab the heat sink to be installed and place the heat sink to be installed on the printed circuit board; the automatic pressing structure can automatically press one end of the fixing pin when the heat sink to be installed is grabbed to the installation position, so as to achieve the fixing of the heat sink on the printed circuit board. In this way, the degree of manual participation can be reduced and the installation efficiency of the heat sink can be improved. In addition, a support structure is provided to support the bottom of the printed circuit board. When the pressing structure presses the fixing pin, the support structure can avoid or reduce the deformation of the printed circuit board, thereby reducing the probability of damage to the printed circuit board.

[0040] Figure 4 A schematic diagram of the structure of a mounting device for a printed circuit board heat sink provided in one embodiment of the present application; Figure 5 A schematic diagram of a press-fit installation device for a printed circuit board heat sink provided in an embodiment of the present application. Figure 4 and Figure 5 As shown in , the printed circuit board heat sink installation device 10 provided in this embodiment specifically includes: a support member 15, a lifting assembly 11, a clamping assembly 12, a press-fitting assembly 13 and a controller 14.

[0041] Specifically, the lifting assembly 11, the clamping assembly 12 and the pressing assembly 13 are all connected to the controller 14 in communication; the lifting assembly 11 is arranged below the transportation path of the printed circuit board 300, and the support member 15 is placed on the upper end of the lifting assembly 11; the controller 14 is used to control the lifting assembly 11 to drive the support member 15 to move to the installation position to support the bottom of the printed circuit board 300 after the printed circuit board 300 is transported to the installation position; the printed circuit board 300 is provided with an installation hole 301, and the support member 15 is provided with an avoidance hole, and The mounting hole 301 corresponds to the avoidance hole; the controller 14 is also used to control the clamping component 12 to clamp the radiator and place the radiator on the printed circuit board 300, and after the radiator is in place, one end of the radiator's fixing pin 200 corresponds to the mounting hole 301; the controller 14 is also used to control the pressing component 13 to press one end of the radiator's fixing pin 200 away from the mounting hole 301, so that one end of the fixing pin 200 passes through the mounting hole 301, and the fixing pin 200 is used to clamp the radiator onto the printed circuit board 300.

[0042] Among them, the support member 15 is used to support the printed circuit board 300 to ensure that the printed circuit board 300 will not be greatly deformed when the fixed pin 200 is pressed and installed, thereby reducing the probability of damage to the printed circuit board 300. Optionally, the specific form of the support member 15 can be various, such as a support column or a support pad, etc.; in addition, the material of the support member 15 can also be selected from metal or rubber, such as aluminum alloy or stainless steel to ensure its strength and stability. Specifically, the support member 15 should be provided with an avoidance hole corresponding to the mounting hole 301 of the printed circuit board 300. The avoidance hole can be circular, oval or square, etc., to ensure that the fixing pin 200 of the radiator can pass through the mounting hole 301 smoothly. Furthermore, the aperture of the avoidance hole should be greater than or equal to the aperture of the mounting hole 301 to avoid collision between the avoidance hole and one end of the fixing pin 200.

[0043] The lifting assembly 11 is used to drive the support member 15 to move up and down, so that when the printed circuit board 300 is transported to the installation position, the lifting assembly 11 lifts the support member 15 to support it under the printed circuit board 300 .

[0044] Optionally, there can be multiple choices for the structure of the lifting component 11. For example, the lifting component 11 can include components such as a lifting motor, a lead screw, a nut seat, a guide rod and a lifting platform. The support member 15 is placed on the lifting platform. The output end of the lifting motor is connected to the lead screw through a coupling, and the nut seat is threadedly connected to the lead screw. When the lead screw rotates, the nut seat can move along the length direction of the lead screw. The lifting platform is fixedly connected to the nut seat, so that when the nut seat moves, it can drive the lifting platform to lift and lower. The guide rod is inserted into the guide hole of the lifting platform, and the guide rod is used to guide the lifting platform to ensure the stability of the lifting platform when it moves. Among them, the lifting motor is the power source of the lifting component 11, and the lifting motor is connected to the controller 14 in communication. When the printed circuit board 300 is transported to the installation position, the controller 14 controls the lifting motor to rotate forward, so that the lifting platform drives the support member 15 to rise and support it under the printed circuit board 300. After the radiator is installed on the printed circuit board 300, the printed circuit board 300 is transported to the next assembly area, and the controller 14 controls the lifting motor to rotate in the opposite direction, so that the lifting platform drives the support member 15 to descend. Optionally, the lifting component 11 can also be an electric telescopic cylinder and a lifting platform arranged at the telescopic end of the electric telescopic cylinder. The electric telescopic cylinder is connected to the controller 14 in communication. The controller 14 can control the telescopic end of the electric telescopic cylinder to extend or retract, thereby driving the lifting platform to move up and down. Specifically, in this embodiment, the composition of the lifting component 11 is not specifically limited, as long as it can achieve the purpose of driving the support member 15 to move up and down.

[0045] Optionally, there are multiple ways to determine whether the printed circuit board 300 has been transported to the installation position. An infrared sensor is set at the installation position, and the infrared sensor is communicatively connected to the controller 14. When the printed circuit board 300 is transported to the installation position, the detection signal of the infrared sensor changes. Thus, the controller 14 determines that the printed circuit board 300 has moved into place based on the change in the received detection signal, and then controls the lifting assembly 11 to drive the support member 15 to rise to support the printed circuit board 300.

[0046] The clamping assembly 12 is used to clamp the heat sink and place the heat sink on the area to be installed on the printed circuit board 300 .

[0047] Optionally, the clamping assembly 12 can be composed of multiple components. Exemplarily, the clamping assembly 12 includes a multi-axis robotic arm, a pneumatic gripper, a clamping cylinder and a connecting rod. The pneumatic gripper is installed at one end of the multi-axis robotic arm. The connecting rod is used to connect the clamping cylinder and the pneumatic gripper and transmit power. The multi-axis robotic arm and the clamping cylinder are both communicated with the controller 14. When it is necessary to grasp the radiator, the multi-axis robotic arm is controlled to rotate to drive the pneumatic gripper to move to the side of the radiator. The controller 14 controls the clamping cylinder to intake air so that the pneumatic gripper grasps the radiator. When the grasping is completed, the multi-axis robotic arm is controlled to move to the area to be installed of the printed circuit board 300. The controller 14 controls the clamping cylinder to exhaust air so that the pneumatic gripper releases the radiator. Optionally, the multi-axis robot arm can also be replaced by a track and a track trolley, the track is set on the assembly path of the printed circuit board 300, the track trolley is provided with a drive motor and a rolling wheel, the drive motor is connected to the controller 14 in communication, the drive motor can drive the rolling wheel to rotate to drive the track trolley to move on the track, and the pneumatic clamp and the cylinder are connected to the track trolley through a connector, so as to place the radiator on the printed circuit board 300. Specifically, in this embodiment, the composition of the clamping assembly 12 is not limited, as long as it can clamp the radiator and place it in the installation area on the printed circuit board 300.

[0048] The press-fit assembly 13 is used to press one end of the fixing pin 200 after the heat sink is placed in place so that the other end of the fixing pin 200 passes through the mounting hole 301 , thereby firmly clamping the heat sink on the printed circuit board 300 .

[0049] Optionally, the press-fitting assembly 13 may be composed of various components. For example, the press-fitting assembly 13 includes components such as a press-fitting plate, a press-fitting cylinder, a guide structure, and a pressure sensor. The press-fitting cylinder is connected to the controller 14 for communication. The press-fitting plate is fixedly mounted on the telescopic end of the press-fitting cylinder. The press-fitting plate is used to press the fixing pin 200 of the heat sink. The guide structure is used to guide the press-fitting plate and ensure the stability of the press-fitting plate during the pressing process. The pressure sensor is connected to the controller 14 for communication. The pressure sensor is used to monitor the pressure change during the pressing process to prevent the printed circuit board 300 from being damaged due to excessive pressure. Optionally, the press-fitting cylinder can also be replaced by a press-fitting hydraulic cylinder or a press-fitting electric cylinder. Specifically, in this embodiment, the specific composition of the press-fitting assembly 13 is not limited, as long as the function of pressing the fixing pin 200 can be achieved.

[0050] The controller 14 is the control core of the installation device for heat dissipation of the printed circuit board 300. The controller 14 is responsible for receiving signals from various sensors and sending control instructions to the lifting component 11, the clamping component 12 and the press-fitting component 13 according to a preset program to ensure that each component can work in a predetermined order and action, thereby realizing automatic installation of the radiator. Optionally, the controller 14 can be a microprocessor or a programmable logic controller 14.

[0051] Specifically, the process of installing the heat sink by the installation device of the printed circuit board heat sink is as follows:

[0052] First, when the printed circuit board 300 is transported to the installation position, the controller 14 controls the lifting assembly 11 to lift the support member 15 so that the support member 15 is supported under the printed circuit board 300; secondly, the controller 14 controls the clamping assembly 12 to clamp the heat sink and place the heat sink on the printed circuit board 300; finally, the controller 14 controls the pressing assembly 13 to press the fixing pin 200 of the heat sink so that one end of the fixing pin 200 passes through the installation hole 301, thereby completing the installation process of a heat sink on the printed circuit board 300. The installation device for the printed circuit board heat sink can automatically complete the task of installing the heat sink on the printed circuit board 300 by setting the clamping assembly 12 and the pressing assembly 13, thereby improving the installation efficiency of the heat sink, and by setting the lifting assembly 11 and the support member 15 to support the printed circuit board 300, it is avoided that the printed circuit board 300 is damaged due to excessive deformation of the printed circuit board 300 during the pressing of the fixing pin 200.

[0053] refer to Figure 4 and Figure 5 As shown in , as an optional implementation, based on any of the above embodiments, the support member 15 includes:

[0054] A first support member and a second support member, the first support member is used to support the end surface of the printed circuit board 300, and the support area of ​​the first support member matches the area of ​​the printed circuit board 300, and the second support member is used to support the peripheral side of the mounting hole 301; the controller 14, when controlling the lifting component 11 to drive the support member 15 to move to the mounting position to support the bottom of the printed circuit board 300, is specifically used to: obtain the aperture value of the mounting hole 301, the length value and the width value of the printed circuit board 300; in response to determining that the ratio of the aperture value of the mounting hole 301 to the length value or the width value of the printed circuit board 300 is greater than a preset ratio, control the lifting component 11 to lift the first support member to support the bottom of the printed circuit board 300; in response to determining that the ratio of the aperture value of the mounting hole 301 to the length value or the width value of the printed circuit board 300 is less than or equal to the preset ratio, control the lifting component 11 to lift the second support member to support the bottom of the printed circuit board 300.

[0055] It should be noted that, in general, the diameter of the mounting hole 301 on the printed circuit board 300 (or the diameter of the fixing pin 200 of the heat sink) is very different from the size of the printed circuit board 300 (length value or width value). For example, the diameter of the mounting hole 301 is generally 4.2 mm, while the size of a small printed circuit board 300 is generally more than 100 mm (length value or width value). In this case, when supporting, only the surrounding of the mounting hole 301 needs to be supported. In addition, there is also a situation where the diameter of the mounting hole 301 on the printed circuit board 300 (or the diameter of the fixing pin 200 of the heat sink) is smaller than the size of the printed circuit board 300. For example, when the width of the printed circuit board 300 is ≤10 times the diameter of the mounting hole 301, when the press-fit assembly 13 presses the fixing pin 200, the entire printed circuit board 300 will be subjected to pressure and deformed. Therefore, the support member 15 is required to support the entire printed circuit board 300.

[0056] Based on the above two situations, in this embodiment, two kinds of support members 15 are provided to deal with two different situations. Specifically, the support member 15 includes a first support member and a second support member.

[0057] The first support member is suitable for the second case mentioned above, that is, the case where the diameter of the mounting hole 301 of the printed circuit board 300 is too small to match the size of the printed circuit board 300. In this case, the first support member is used to support the entire end surface of the printed circuit board 300, and its supporting area matches the area of ​​the printed circuit board 300, so that a uniform supporting force can be provided for the printed circuit board 300. Optionally, there are multiple options for the composition of the first support member. For example, the first support member can be a rubber pad of the same size as the printed circuit board 300, and the rubber pad is provided with an avoidance hole corresponding to the mounting hole 301; or the first support member can be a plurality of small-sized rubber columns assembled into a shape matching the area of ​​the printed circuit board 300, which can also achieve full support for the printed circuit board 300. Specifically, in this embodiment, the specific form of the first support member is not limited, as long as it can fully support the printed circuit board 300.

[0058] Among them, the second support member is applicable to the first case mentioned above, that is, the case where the diameter of the mounting hole 301 of the printed circuit board 300 is too different from the size of the printed circuit board 300. At this time, the second support member is used to support the peripheral side of the mounting hole 301 of the printed circuit board 300 for partial support. Optionally, there are multiple choices for the composition of the second support member. For example, the second support member can be an annular rubber pad, and the inner diameter of the annular rubber pad is greater than or equal to the diameter of the mounting hole 301. In addition, the second support member can be composed of a plurality of cylindrical rubber blocks, and the plurality of cylindrical rubber blocks are arranged around and supported on the peripheral side of the mounting hole 301. Specifically, in this embodiment, the specific form of the second support member is not limited, as long as it can support the peripheral side of the mounting hole 301.

[0059] Specifically, when the lifting assembly 11 is controlled to drive the support member 15 to move to the installation position to support the bottom of the printed circuit board 300, the specific steps are as follows:

[0060] The aperture value of the mounting hole 301, the length value and the width value of the printed circuit board 300 are obtained by obtaining the aperture value of the mounting hole 301. The aperture value of the mounting hole 301, the length value and the width value of the printed circuit board 300 can be input into the controller 14 through an input device according to the size information of the printed circuit board 300. When it is determined that the ratio of the aperture value of the mounting hole 301 to the length value or the width value of the printed circuit board 300 is greater than a preset ratio, the lifting component 11 is controlled to lift the first support member to support the bottom of the printed circuit board 300; in response to determining that the ratio of the aperture value of the mounting hole 301 to the length value or the width value of the printed circuit board 300 is less than or equal to the preset ratio, the lifting component 11 is controlled to lift the second support member to support the bottom of the printed circuit board 300.

[0061] Optionally, when it is determined that the ratio of the aperture value of the mounting hole 301 to the width value of the printed circuit board 300 is greater than a preset ratio, the lifting component 11 is controlled to lift the first support member; when it is determined that the ratio of the aperture value of the mounting hole 301 to the width value of the printed circuit is less than or equal to the preset ratio, the lifting component 11 is controlled to lift the second support member.

[0062] The preset ratio is a preset value used to determine whether to control the lifting component 11 to lift the first support component or to control the lifting component 11 to lift the second support component.

[0063] For example, the preset ratio may be: 1: 10. Of course, the preset ratio may also have other values, which are not specifically limited in this embodiment and may be flexibly adjusted according to actual conditions.

[0064] Specifically, the controller 14 calculates the ratio of the mounting hole 301 to the printed circuit board 300 based on the aperture value of the mounting hole 301 and the length and width values ​​of the printed circuit board 300, and based on the preset ratio, the controller 14 selectively raises the first support member or the second support member to adapt to different support requirements.

[0065] refer to Figure 5 As shown in, as an optional implementation, based on any one of the above embodiments, the first support member includes a plurality of first support cylinders, the outer diameter of the first support cylinders is smaller than the aperture of the mounting hole 301, the upper end surfaces of the plurality of first support cylinders form a support plane for the printed circuit board 300, the area of ​​the support plane matches the area of ​​the printed circuit board 300, the plurality of first support cylinders are further surrounded to form an avoidance hole, and the aperture of the avoidance hole is larger than the aperture of the mounting hole 301; the second support member is a second support cylinder, the second support cylinder is provided with an avoidance hole, the outer diameter of the second support cylinder and the aperture of the avoidance hole are both larger than the aperture of the mounting hole 301, and the second support cylinder is supported on the outer periphery of the mounting hole 301.

[0066] Specifically, in this embodiment, the first support member includes a plurality of support cylinders, the outer diameter of the first support cylinders is smaller than the aperture of the mounting hole 301, the upper end surfaces of the plurality of first support cylinders form a support plane for the printed circuit board 300, the area of ​​the support plane matches the area of ​​the printed circuit board 300, and the plurality of first support cylinders are also surrounded to form avoidance holes, and the aperture of the avoidance holes is larger than the aperture of the mounting hole 301, to ensure that there will be no interference with the fixing pin 200 when the radiator is installed.

[0067] In this embodiment, the second support member is a separate cylindrical structure, and a avoidance hole is opened in the cylindrical structure to ensure that there is no interference with the fixing pin 200 when installing the heat sink. The outer diameter of the cylindrical structure and the aperture of the avoidance hole are larger than the aperture of the mounting hole 301. The cylindrical structure is used to provide local support on the periphery of the mounting hole 301. An elastic material (such as rubber or silicone) is used at the top of the cylindrical structure, or the entire material of the cylindrical structure is an elastic material, so as to increase the protection of the printed circuit board 300 and prevent scratches or crushing. For example, Figure 6 This is a schematic diagram of the structure of the second support member provided in one embodiment of the present application, refer to Figure 6As shown in the figure, the support member 15 is the second support member. Since the printed circuit board 300 is provided with four mounting holes 301, four second support members are configured accordingly. It can be seen that the shape of the second support member is annular. Of course, in other embodiments, the number and shape of the second support members can be adjusted according to actual conditions. Optionally, the inner diameter size of the second support member (i.e., the aperture of the avoidance hole) is set to the aperture of the mounting hole 301 plus 0.5mm, so as to ensure that the fixing pin 200 will not be blocked from passing through the mounting hole 301. The outer diameter size of the second support member is selected to be three times the aperture of the mounting hole 301, so as to ensure that the bottom of the printed circuit board 300 can be safely supported. Optionally, the second support member can also be composed of a plurality of smaller supporting cylinders, for example, the diameter of each small supporting cylinder is 0.5mm, and a plurality of small supporting cylinders are used to form a large annular cylindrical structure to support the peripheral side of the mounting hole 301, which can also achieve support for the printed circuit board 300.

[0068] Specifically, the support member 15 provided in the present application can adapt to the installation requirements of printed circuit boards 300 and heat sinks of different sizes and shapes.

[0069] Figure 7 A schematic diagram of a clamping assembly clamping a heat sink provided in an embodiment of the present application, as an optional implementation, based on any of the above embodiments, refer to Figure 4 , Figure 5 and Figure 7 As shown in FIG. 1 , the gripping assembly 12 includes:

[0070] A movable component 121 and two grabbing arms 122 arranged at intervals, the two grabbing arms 122 are connected to the movable component 121, and the two grabbing arms 122 are configured to be able to move closer to or farther away from each other to clamp or release the radiator; the movable component 121 is configured to be able to drive the two grabbing arms 122 to move so as to place the radiator on the printed circuit board 300; the controller 14, when controlling the grabbing component 12 to clamp the radiator and place it on the printed circuit board 300, is specifically used to: obtain the length value and width value of the radiator; control the two grabbing arms 122 to move away from each other so that the distance between the two grabbing arms 122 is at the maximum distance position; controlling the movable component 121 to drive the two grabbing arms 122 to move to the radiator grabbing position, and in the radiator grabbing position, the two grabbing arms 122 are respectively located on both sides of the radiator; in response to the two grabbing arms 122 moving to the radiator grabbing position, controlling the two grabbing arms 122 to approach each other; in response to the spacing between the two grabbing arms 122 being less than or equal to a preset spacing, controlling the two grabbing arms 122 to stop moving so that the two grabbing arms 122 clamp the radiator; wherein the preset spacing is one of the length value and the width value of the radiator; controlling the movable component 121 to move to drive the radiator to move onto the printed circuit board 300.

[0071] The movable component 121 is used to drive the grabbing arms 122 to move onto the printed circuit board 300 after the two grabbing arms 122 grab the heat sink.

[0072] The two grab arms 122 are spaced apart and are both connected to the movable assembly 121 . The main function of the grab arms 122 is to clamp and release the radiator. The two grab arms 122 can move closer to or farther from each other to accommodate radiators of different sizes.

[0073] Exemplarily, in this embodiment, the movable component 121 uses a multi-axis robotic arm, and two electric telescopic cylinders are fixed at one end of the multi-axis robotic arm at intervals. Two clamps are respectively fixed at the two telescopic ends of the two electric telescopic cylinders. The two electric telescopic cylinders can drive the two clamps to move closer to or away from each other, so that the two electric telescopic cylinders and the two clamps constitute two grabbing arms 122. The multi-axis robotic arm and the two electric telescopic cylinders are both communicatively connected to the controller 14. When working, the controller 14 controls the multi-axis robotic arm to move the two clamps to the surrounding side of the radiator, and the controller 14 then controls the telescopic ends of the two electric telescopic cylinders to extend so that the clamps clamp the radiator.

[0074] Specifically, in this embodiment, the specific steps of controlling the clamping assembly 12 to clamp the radiator through the controller 14 are as follows:

[0075] First, the length and width of the radiator are obtained. This is done to ensure that the grabbing arm 122 can accurately grab the radiator and avoid deformation of the radiator. The length and width of the radiator are input by the user through the input device according to the actual size of the radiator.

[0076] Secondly, the controller 14 controls the two grabbing arms 122 to move away from each other so that the distance between them is maximized. In this way, it is ensured that the two grabbing arms 122 have enough space to adapt to the size of the radiator. After that, the controller 14 controls the movable component 121 to drive the two grabbing arms 122 to move to the grabbing position of the radiator. After moving to the grabbing position of the radiator, the two grabbing arms 122 are located on both sides of the radiator. Further, refer to Figure 1 As shown in the figure, since the radiator body 100 of the radiator is composed of a plurality of heat sinks spaced apart along the length direction of the radiator body 100, in order to avoid the situation where the heat sink is deformed when the clamping assembly 12 clamps the radiator, when the two grabbing arms 122 are located at the grabbing position for heat dissipation, the two grabbing arms 122 are spaced apart on both sides of the radiator body 100 along the width direction of the radiator body 100, so that the width value of the radiator is the spacing value when the two grabbing arms 122 grab the radiator.

[0077] Again, when the grabbing arms 122 reach the grabbing position, the controller 14 controls the two grabbing arms 122 to move closer to each other. When the distance between the two grabbing arms 122 is less than or equal to the preset distance, the controller 14 controls the two grabbing arms 122 to stop moving. At this point, it is considered that the two grabbing arms 122 have clamped the radiator. Specifically, in this embodiment, the preset distance value is the width value of the radiator. Optionally, in order to further prevent the grabbing arms 122 from scratching or crushing the radiator, a rubber shock-absorbing pad is provided at one end of the grabbing arm 122 that contacts the radiator. Finally, the controller 14 controls the movable component 121 to move, so as to drive the radiator to move onto the printed circuit board 300. Thereby, the process of grabbing the radiator is completed.

[0078] Specifically, the clamping assembly 12 provided in this embodiment can adapt to radiators of different sizes by controlling and adjusting the distance between the two grabbing arms 122. By accurately controlling the moving assembly to drive the movement of the two grabbing arms 122, it can ensure that the radiator can be correctly clamped and placed, thereby ensuring the grabbing efficiency and accuracy of the radiator.

[0079] As an optional implementation, based on any of the above embodiments, refer to Figure 2 , Figure 4 and Figure 5 As shown in FIG. , the fixing pin 200 includes:

[0080] A main body rod 201 and an umbrella-shaped structure 202 integrally connected to the main body rod 201; the umbrella-shaped structure 202 can be retracted and expanded; in the expanded state of the umbrella-shaped structure 202, the outer diameter of the umbrella-shaped structure 202 is larger than the diameter of the mounting hole 301, and in the maximum retracted state of the umbrella-shaped structure 202, the outer diameter of the umbrella-shaped structure 202 is less than or equal to the diameter of the mounting hole 301;

[0081] The controller 14, when controlling the press-fit assembly 13 to press one end of the fixing pin 200 of the heat sink away from the mounting hole 301 so that one end of the fixing pin 200 passes through the mounting hole 301, is specifically used to: obtain the height value of the umbrella-like structure 202 and the thickness value of the printed circuit board 300; control the press-fit assembly 13 to press one end of the main rod 201; in response to the pressing distance of the press-fit assembly 13 being greater than the sum of the height value of the umbrella-like structure 202 and the thickness value of the printed circuit board 300, determine that the umbrella-like structure 202 passes through the mounting hole 301.

[0082] The main rod 201 is the main part of the fixing pin 200, and the umbrella-shaped structure 202 is used to abut against the main body of the printed circuit board 300 after passing through the mounting hole 301. The umbrella-shaped structure 202 can be retracted and expanded. In the expanded state, the outer diameter of the umbrella-shaped structure 202 is larger than the diameter of the mounting hole 301, ensuring that the heat sink can be firmly fixed on the printed circuit board 300. In the maximum contraction state, the outer diameter of the umbrella-shaped structure 202 is less than or equal to the diameter of the mounting hole 301, so that the fixing pin 200 can smoothly pass through the mounting hole 301. Optionally, the material of the umbrella-shaped structure 202 is soft plastic, which has a certain elasticity and can be deformed under the action of external force, and return to the initial state after the external force is removed.

[0083] More specifically, the fixing pin 200 also includes a compression spring, which is sleeved on the main rod 201. One end of the compression spring abuts against the main body of the radiator, and the other end abuts against one end of the main rod 201, so that the umbrella-shaped structure 202 abuts against the surrounding side of the mounting hole 301 of the printed circuit board 300 by relying on the elastic restoring force of the compression spring.

[0084] Specifically, the specific steps of controlling the press-fit assembly 13 to press one end of the fixing pin 200 of the heat sink away from the mounting hole 301 so that one end of the fixing pin 200 passes through the mounting hole 301 are as follows:

[0085] First, obtain the height value of the umbrella-like structure 202 and the thickness value of the printed circuit board 300. The above two parameters are the key to determine the pressing distance of the press-fit assembly 13. Optionally, the height value of the umbrella-like structure 202 and the thickness value of the printed circuit board 300 are input by the user through the input device according to actual parameters.

[0086] Secondly, the controller 14 controls the press-fit assembly 13 to press one end of the main rod 201, so that one end of the fixing pin 200 gradually passes through the mounting hole 301. In this process, the pressing distance of the press-fit assembly 13 is used to determine whether the umbrella-like structure 202 has completely passed through the mounting hole 301. Specifically, when the pressing distance is greater than the sum of the height value of the umbrella-like structure 202 and the thickness value of the printed circuit board 300, it can be determined that the umbrella-like structure 202 has passed through the mounting hole 301. After the umbrella-like structure 202 passes through the mounting hole 301, it will return to the unfolded state because it is no longer subjected to external force. At this time, the press-fit assembly 13 cancels the pressure on one end of the main rod 201. Under the elastic restoring force of the compression spring, the umbrella-like structure 202 abuts against the peripheral side of the mounting hole 301, thereby achieving the purpose of fixing the radiator to the printed circuit board 300.

[0087] Specifically, in this embodiment, by precisely controlling the pressing distance of the press-fit assembly 13, it is ensured that the umbrella-shaped structure 202 can accurately pass through the mounting hole 301 and unfold. Thus, the purpose of automatically pressing the fixing pins 200 to fix the heat sink to the printed circuit board 300 is achieved, thereby improving the installation efficiency of the heat sink.

[0088] Figure 8 A schematic diagram of a press-fit installation device for a printed circuit board heat sink provided in another embodiment of the present application is provided. As an optional implementation, based on any one of the above embodiments, refer to Figure 4 and Figure 8 As shown in , the press-fit assembly 13 includes:

[0089] A vertical pressing component 131 and a horizontal pressing component 132, the vertical pressing component 131 is used to press one end of the main rod 201 so that the umbrella-like structure 202 passes through the mounting hole 301, and the horizontal pressing component 132 is used to squeeze the outer periphery of the umbrella-like structure 202 so that the umbrella-like structure 202 shrinks; the controller 14, before controlling the pressing component 13 to press one end of the main rod 201, is also used to: obtain the maximum shrinkage distance value of the umbrella-like structure 202; control the horizontal pressing component 132 to squeeze the outer periphery of the umbrella-like structure 202 so that the umbrella-like structure 202 shrinks; the controller 14, when controlling the pressing component 13 to press one end of the main rod 201, is specifically used to: in response to determining that the squeezing distance of the horizontal pressing component 132 is equal to the maximum shrinkage distance value of the umbrella-like structure 202, control the vertical pressing component 131 to press one end of the main rod 201.

[0090] Specifically, in this embodiment, the press-fitting assembly 13 includes a vertical press-fitting component 131 and a horizontal press-fitting component 132. The main function of the vertical press-fitting component 131 is to press one end of the main rod 201, thereby pushing the umbrella-like structure 202 through the mounting hole 301. The horizontal press-fitting component 132 is mainly responsible for squeezing the outer periphery of the umbrella-like structure 202 to shrink it. Since the outer diameter of the umbrella-like structure 202 in the unfolded state is larger than the aperture of the mounting hole 301, the umbrella-like structure 202 will inevitably exert force on the peripheral wall of the mounting hole 301 during the process of passing through the mounting hole 301, which may cause the risk of the umbrella-like structure 202 scratching the printed circuit board 300. Therefore, when the vertical press-fitting component 131 is used to press-fit the fixing pins 200, the umbrella-like structure 202 is first squeezed by the horizontal press-fitting component 132 to change it from a fully expanded state to a maximum contracted state, and then the vertical press-fitting component 131 is used to press one end of the main rod 201, so that the umbrella-like structure 202 can be easily passed through the mounting hole 301, and the risk of the umbrella-like structure 202 scratching the printed circuit board 300 can also be reduced.

[0091] Optionally, the vertical pressing component 131 can be realized by a linear drive device such as a cylinder, a hydraulic cylinder or an electric push rod, providing a stable and controllable vertical downward pressure to ensure that one end of the main rod 201 is accurately and steadily pressed, thereby pushing the umbrella-shaped structure 202 through the mounting hole 301. The horizontal pressing component 132 can be realized by a cylinder, a servo motor with a lead screw nut mechanism, or a linear module, etc., which can accurately control the force and distance of squeezing the outer periphery of the umbrella-shaped structure 202.

[0092] Specifically, before controlling the press-fitting assembly 13 to press one end of the main rod 201, the maximum contraction distance value of the umbrella-like structure 202 is first obtained, and the maximum contraction distance value is used to determine the degree to which the horizontal press-fitting component 132 squeezes the umbrella-like structure 202. Optionally, the maximum contraction distance value of the umbrella-like structure 202 is determined by the user according to the factory parameter table of the fixed pin and input through the input device. Afterwards, the controller 14 controls the horizontal press-fitting component 132 to squeeze the outer periphery of the umbrella-like structure 202 until the squeezing distance is equal to the maximum contraction distance value of the umbrella-like structure 202. At this time, the umbrella-like structure 202 is in the maximum contraction state and can smoothly pass through the mounting hole 301.

[0093] Specifically, when it is determined that the squeezing distance of the horizontal pressing component 132 reaches the maximum contraction distance value of the umbrella-shaped structure 202, the controller 14 controls the vertical pressing component 131 to press one end of the main rod 201 until the pressing action of the vertical pressing component 131 pushes the fixing pin 200 through the mounting hole 301.

[0094] Specifically, in this embodiment, the press-fitting assembly 13 includes a vertical press-fitting component 131 and a horizontal press-fitting component 132. The vertical press-fitting component 131 and the horizontal press-fitting component 13 work in coordination to ensure that the umbrella-shaped structure 202 of the fixing pin 200 can easily pass through the mounting hole 301 without causing damage to the printed circuit board 300. The accuracy and reliability of the entire installation process are ensured by precisely controlling the extrusion distance of the horizontal press-fitting component 132 and the pressing timing of the vertical press-fitting component 131.

[0095] As an optional implementation, based on any of the above embodiments, refer to Figure 4 and Figure 8 As shown in FIG. 1 , the controller 14, after controlling the vertical pressing component 131 to press one end of the main rod 201, is also used to:

[0096] In response to determining that the distance between the end surface of the horizontal pressing component 132 and the printed circuit board 300 is less than or equal to the preset safety distance, the horizontal pressing component 132 is controlled to release the umbrella structure 202 and move in a direction away from the printed circuit board 300 .

[0097] Specifically, after controlling the vertical pressing component 131 to press one end of the main rod 201, the controller 14 will detect the distance between the horizontal pressing component 132 and the end face of the printed circuit board 300, thereby avoiding the horizontal pressing component 132 from colliding with the end face of the printed circuit board 300 and causing damage to the printed circuit board 300.

[0098] Optionally, an infrared sensor may be provided to detect the distance between the horizontal press-fitting component 132 and the end surface of the printed circuit board 300, and the infrared sensor is in communication with the controller 14. When the controller 14 determines that the distance value is less than the preset installation distance based on the signal generated by the infrared sensor, it means that the horizontal press-fitting component 132 may be in a dangerous position and may cause damage to the printed circuit board 300. At this time, the horizontal press-fitting component 132 is controlled to release the umbrella structure 202 and move away from the printed circuit board 300, thereby avoiding the collision between the horizontal press-fitting component 132 and the printed circuit board 300.

[0099] The preset safety distance is a pre-set distance value used to determine whether the horizontal press-fitting component 132 is in a safe position. Optionally, the preset safety distance is input by the user through an input device according to actual conditions.

[0100] Specifically, in this embodiment, the timing for the horizontal press-fitting component 132 to release the umbrella-shaped structure 202 is determined by presetting a safety distance, so that the horizontal press-fitting component 132 can be prevented from colliding with the printed circuit board 300 during the press-fitting process, thereby causing damage to the printed circuit board 300, thereby improving the reliability and safety of the press-fitting assembly 13.

[0101] Fig. 9 This is a flow chart of a method for installing a printed circuit board heat sink provided in one embodiment of the present application. The execution subject of this embodiment is a device for installing a printed circuit board heat sink. The device for installing a printed circuit board heat sink can be implemented by a computer program; it can also be implemented by a medium storing relevant computer programs, such as a USB flash drive and / or a CD, or it can also be implemented by a physical device integrated or installed with relevant computer programs, such as a chip or an electronic device. The electronic device can be a computer or a server, such as Fig. 9 As shown, the method for installing the printed circuit board heat sink specifically includes the following steps:

[0102] Step S401, after the printed circuit board is transported to the installation position, the lifting assembly is controlled to drive the support member to move to the installation position to support the bottom of the printed circuit board; the printed circuit board is provided with a mounting hole, the support member is provided with an avoidance hole, and the mounting hole corresponds to the avoidance hole.

[0103] Step S402, control the clamping assembly to clamp the heat sink and place the heat sink on the printed circuit board; and after the heat sink is placed in place, one end of the fixing pin of the heat sink corresponds to the mounting hole.

[0104] Step S403, controlling the press-fit assembly to press one end of the fixing pin of the heat sink away from the mounting hole so that one end of the fixing pin passes through the mounting hole, and the fixing pin is used to clamp the heat sink onto the printed circuit board.

[0105] It should be noted that the printed circuit board heat sink installation method provided in this embodiment is used to be implemented in the above-mentioned embodiment of the printed circuit board heat sink installation device, and the specific implementation principle and technical effect are similar, which will not be repeated here.

[0106] Optionally, when controlling the lifting assembly to drive the support member to move to the installation position to support the bottom of the printed circuit board, the method includes:

[0107] Obtain the aperture value of the mounting hole, the length value and the width value of the printed circuit board; in response to determining that the ratio of the aperture value of the mounting hole to the length value or the width value of the printed circuit board is greater than a preset ratio, control the lifting component to lift the first support member to support the bottom of the printed circuit board; in response to determining that the ratio of the aperture value of the mounting hole to the length value or the width value of the printed circuit board is less than or equal to the preset ratio, control the lifting component to lift the second support member to support the bottom of the printed circuit board.

[0108] Optionally, when controlling the clamping assembly to clamp the heat sink and place it on the printed circuit board, the method includes:

[0109] Obtain the length and width values ​​of the radiator; control the two grabbing arms to move away from each other so that the distance between the two grabbing arms is at the maximum distance position; control the movable component to drive the two grabbing arms to move to the radiator grabbing position, and at the radiator grabbing position, the two grabbing arms are respectively located on both sides of the radiator; in response to the two grabbing arms moving to the radiator grabbing position, control the two grabbing arms to move closer to each other; in response to the distance between the two grabbing arms being less than or equal to a preset distance, control the two grabbing arms to stop moving so that the two grabbing arms clamp the radiator; wherein the preset distance is one of the length and width values ​​of the radiator; control the movable component to move to drive the radiator to move onto the printed circuit board.

[0110] Optionally, when controlling the press-fit assembly to press the fixing pin of the heat sink away from one end of the mounting hole so that one end of the fixing pin passes through the mounting hole, the method includes:

[0111] The height value of the umbrella-like structure and the thickness value of the printed circuit board are obtained; the press-fit assembly is controlled to press one end of the main rod; in response to the pressing distance of the press-fit assembly being greater than the sum of the height value of the umbrella-like structure and the thickness value of the printed circuit board, it is determined that the umbrella-like structure passes through the mounting hole.

[0112] Optionally, before controlling the press-fitting assembly to press one end of the main body rod, the method further includes:

[0113] Obtaining a maximum shrinkage distance value of the umbrella-like structure; controlling the horizontal press-fitting component to squeeze the outer periphery of the umbrella-like structure so as to shrink the umbrella-like structure;

[0114] When the press-fit assembly is controlled to press one end of the main rod, it includes:

[0115] In response to determining that the squeezing distance of the horizontal press-fitting component is equal to the maximum contraction distance value of the umbrella-shaped structure, the vertical press-fitting component is controlled to press one end of the main body rod.

[0116] Optionally, after controlling the vertical press-fitting component to press one end of the main body rod, the method further includes:

[0117] In response to determining that the distance between the horizontal pressing component and the end surface of the printed circuit board is less than or equal to the preset safety distance, the horizontal pressing component is controlled to release the umbrella structure and move in a direction away from the printed circuit board.

[0118] Fig.10 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application is shown in FIG. Fig.10 As shown, the electronic device 50 provided in the embodiment of the present application includes: a memory 51 and a processor 52.

[0119] The memory 51 stores a computer program, and the processor 52 is configured to run the computer program to execute the steps in any of the above-mentioned embodiments of the method for installing a printed circuit board heat sink.

[0120] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored, wherein the computer program is configured to execute the steps of any of the above-mentioned embodiments of the method for installing a printed circuit board heat sink when running.

[0121] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk or an optical disk.

[0122] An embodiment of the present application also provides another computer program product, including a non-volatile computer-readable storage medium, the non-volatile computer-readable storage medium storing a computer program, and when the computer program is executed by a processor, the steps in any of the above-mentioned embodiments of the method for installing a printed circuit board heat sink are implemented.

[0123] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0124] The above is a detailed introduction to a printed circuit board heat sink installation device, method, electronic device, storage medium and program product provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A mounting device for a printed circuit board heat sink, characterized in that: include: A support member, a lifting assembly, a clamping assembly, a press-fitting assembly and a controller, wherein the lifting assembly, the clamping assembly and the press-fitting assembly are all in communication connection with the controller; the lifting assembly is arranged below the transport path of the printed circuit board, and the support member is placed at the upper end of the lifting assembly; The controller is used to control the lifting assembly to drive the support member to move to the installation position to support the bottom of the printed circuit board after the printed circuit board is transported to the installation position; the printed circuit board is provided with a mounting hole, the support member is provided with an avoidance hole, and the mounting hole corresponds to the avoidance hole; The controller is further used to control the clamping assembly to clamp the heat sink and place the heat sink on the printed circuit board, and after the heat sink is placed in place, one end of the fixing pin of the heat sink corresponds to the mounting hole; The controller is also used to control the press-fit assembly to press the fixing pin of the heat sink away from one end of the mounting hole so that one end of the fixing pin passes through the mounting hole. The fixing pin is used to clamp the heat sink onto the printed circuit board.

2. The device according to claim 1, characterized in that The support member comprises: A first support member and a second support member, wherein the first support member is used to support the end surface of the printed circuit board, and the support area of ​​the first support member matches the area of ​​the printed circuit board, and the second support member is used to support the peripheral side of the mounting hole; The controller, when controlling the lifting assembly to drive the support member to move to the installation position to support the bottom of the printed circuit board, is specifically used to: obtain the aperture value of the installation hole, the length value and the width value of the printed circuit board; in response to determining that the ratio of the aperture value of the installation hole to the length value or the width value of the printed circuit board is greater than a preset ratio, control the lifting assembly to lift the first support member to support the bottom of the printed circuit board; in response to determining that the ratio of the aperture value of the installation hole to the length value or the width value of the printed circuit board is less than or equal to a preset ratio, control the lifting assembly to lift the second support member to support the bottom of the printed circuit board.

3. The device according to claim 2, characterized in that The first support member includes a plurality of first support cylinders, the outer diameter of the first support cylinders is smaller than the aperture of the mounting hole, the upper end surfaces of the plurality of first support cylinders form a support plane for the printed circuit board, the area of ​​the support plane matches the area of ​​the printed circuit board, and the plurality of first support cylinders are further surrounded to form the avoidance hole, and the aperture of the avoidance hole is larger than the aperture of the mounting hole; The second support member is a second support cylinder, the second support cylinder is provided with the avoidance hole, the outer diameter of the second support cylinder and the aperture of the avoidance hole are both larger than the aperture of the mounting hole, and the second support cylinder is supported on the outer periphery of the mounting hole.

4. The device according to claim 1, characterized in that The clamping assembly comprises: A movable component and two grab arms arranged at intervals, the two grab arms are connected to the movable component, and the two grab arms are configured to move closer to or farther from each other to clamp or release the heat sink; the movable component is configured to drive the two grab arms to move to place the heat sink on the printed circuit board; The controller, when controlling the clamping assembly to clamp the heat sink and place it on the printed circuit board, is specifically used to: obtain the length value and width value of the heat sink; control the two grabbing arms to move away from each other so that the distance between the two grabbing arms is at the maximum distance position; control the movable assembly to drive the two grabbing arms to move to the heat sink grabbing position, and in the heat sink grabbing position, the two grabbing arms are respectively located on both sides of the heat sink; in response to the two grabbing arms moving to the heat sink grabbing position, control the two grabbing arms to move closer to each other; in response to the distance between the two grabbing arms being less than or equal to a preset distance, control the two grabbing arms to stop moving so that the two grabbing arms clamp the heat sink; wherein the preset distance is one of the length value and the width value of the heat sink; control the movable assembly to move to drive the heat sink to move onto the printed circuit board.

5. The device according to any one of claims 1 to 4, characterized in that: The fixed pin comprises: A main body rod and an umbrella-shaped structure integrally connected to the main body rod; the umbrella-shaped structure can be retracted and expanded; in the expanded state of the umbrella-shaped structure, the outer diameter of the umbrella-shaped structure is larger than the diameter of the mounting hole, and in the maximum retracted state of the umbrella-shaped structure, the outer diameter of the umbrella-shaped structure is less than or equal to the diameter of the mounting hole; The controller, when controlling the press-fit assembly to press the fixing pin of the heat sink away from one end of the mounting hole so that one end of the fixing pin passes through the mounting hole, is specifically used to: obtain a height value of the umbrella-like structure and a thickness value of the printed circuit board; control the press-fit assembly to press one end of the main rod; and determine that the umbrella-like structure passes through the mounting hole in response to a pressing distance of the press-fit assembly being greater than the sum of the height value of the umbrella-like structure and the thickness value of the printed circuit board.

6. The device according to claim 5, characterized in that The press-fit assembly comprises: A vertical press-fitting component and a horizontal press-fitting component, wherein the vertical press-fitting component is used to press one end of the main body rod to allow the umbrella-like structure to pass through the mounting hole, and the horizontal press-fitting component is used to squeeze the outer periphery of the umbrella-like structure to cause the umbrella-like structure to shrink; The controller, before controlling the press-fitting assembly to press one end of the main body rod, is further used to: obtain the maximum contraction distance value of the umbrella-like structure; control the horizontal press-fitting component to squeeze the outer periphery of the umbrella-like structure to shrink the umbrella-like structure; The controller, when controlling the press-fitting assembly to press one end of the main rod, is specifically used to: in response to determining that the extrusion distance of the horizontal press-fitting component is equal to the maximum contraction distance value of the umbrella-shaped structure, control the vertical press-fitting component to press one end of the main rod.

7. The device according to claim 6, characterized in that The controller, after controlling the vertical press-fitting component to press one end of the main body rod, is further used to: In response to determining that the distance between the horizontal pressing component and the end surface of the printed circuit board is less than or equal to the preset safety distance, the horizontal pressing component is controlled to release the umbrella-shaped structure and move in a direction away from the printed circuit board.

8. A method for installing a printed circuit board heat sink, characterized in that: include: After the printed circuit board is transported to the installation position, the lifting assembly is controlled to drive the support member to move to the installation position to support the bottom of the printed circuit board; the printed circuit board is provided with a mounting hole, the support member is provided with an avoidance hole, and the mounting hole corresponds to the avoidance hole; Controlling the clamping assembly to clamp the heat sink and place the heat sink on the printed circuit board; and after the heat sink is placed in place, one end of the fixing pin of the heat sink corresponds to the mounting hole; The press-fit assembly is controlled to press the fixing pin of the heat sink away from one end of the mounting hole so that one end of the fixing pin passes through the mounting hole. The fixing pin is used to clamp the heat sink onto the printed circuit board.

9. An electronic device, characterized in that: include: Memory for storing computer programs; A processor is used to implement the steps of the method for installing a printed circuit board heat sink as claimed in claim 8 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, wherein the computer program implements the steps of the method for installing the printed circuit board heat sink according to claim 8 when executed by a processor.

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