Mounting device, method, apparatus and storage medium for printed circuit board heat spreader

Abstract

The application discloses a mounting device, method and equipment of a printed circuit board radiator and a storage medium, and relates to the technical field of servers.When the printed circuit board is transported to a mounting position, the lifting assembly is used to lift the support, so that the support is supported below the printed circuit board, the clamping assembly is used to clamp the radiator and place the radiator on the printed circuit board, and finally, the pressing assembly is used to press the fixing pin of the radiator, so that one end of the fixing pin penetrates through the mounting hole on the printed circuit board, and the fixing pin can fix the radiator on the printed circuit board.Therefore, the technical problems of low efficiency of manual installation of the radiator and damage of the printed circuit board can be solved, the installation efficiency of the radiator of the printed circuit board is improved, and the probability of damage of the printed circuit board is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of servers, and particularly relates to a mounting device, a mounting method, equipment and a storage medium for a printed circuit board heat sink. BACKGROUND

[0002] With the total power of a server board (a printed circuit board) being larger and larger, the number of heat sinks that need to be arranged on the board is also increasing, and the most common type of heat sink on the board is a passive heat sink, and the number of passive heat sinks in a board is ten or even dozens of times that of active heat sinks.

[0003] At present, the fixed pins of the heat sink are mostly pressed to the mounting holes of the printed circuit board by manual work, so as to mount the heat sink on the printed circuit board. However, the manual mounting method of the heat sink in the related art has low efficiency and is prone to cause deformation and damage of the printed circuit board during mounting. SUMMARY

[0004] The present application provides a mounting device, a mounting method, equipment and a storage medium for a printed circuit board heat sink to at least solve the problems of low mounting efficiency of the heat sink and deformation and damage of the printed circuit board in the related art.

[0005] In a first aspect, the present application provides a mounting device for a printed circuit board heat sink, comprising:

[0006] The support, the lifting assembly, the clamping assembly, the pressing assembly and the controller are in communication connection; the lifting assembly is arranged below a printed circuit board transportation path, and the support is placed at an upper end of the lifting assembly;

[0007] The controller is configured to control the lifting assembly to drive the support to move to the mounting position to support below the printed circuit board after the printed circuit board is transported to the mounting position; the printed circuit board is provided with mounting holes, the support is provided with avoiding holes, and the mounting holes correspond to the avoiding holes;

[0008] The controller is further configured to control the clamping assembly to clamp the heat sink and place the heat sink on the printed circuit board, and after the heat sink is placed in position, one end of the fixed pin of the heat sink corresponds to the mounting hole.

[0009] The controller is further configured to control the pressing assembly to press the end of the fixed pin of the heat sink away from the mounting hole, so that the end of the fixed pin passes through the mounting hole, and the fixed pin is used to clamp the heat sink on the printed circuit board.

[0010] In a second aspect, the present application further provides a mounting method for a printed circuit board heat sink, comprising:

[0011] After the printed circuit board is transported to the mounting position, the lifting assembly is controlled to move the support to the mounting position to support under the printed circuit board; the printed circuit board is provided with a mounting hole, the support is provided with an avoiding hole, and the mounting hole corresponds to the avoiding hole;

[0012] The clamping assembly is controlled to clamp the heat sink and place the heat sink on the printed circuit board; and after the heat sink is placed in position, one end of the fixing pin of the heat sink corresponds to the mounting hole;

[0013] The pressing assembly is controlled to press the fixing pin of the heat sink away from the one end of the mounting hole, so that the one end of the fixing pin passes through the mounting hole, and the fixing pin is used to clamp the heat sink on the printed circuit board.

[0014] In a third aspect, the present application also provides an electronic device, comprising: a memory for storing a computer program;

[0015] A processor is configured to execute the computer program to implement the steps of the printed circuit board heat sink mounting method provided in the second aspect.

[0016] In a fourth aspect, the present application also provides a computer readable storage medium, and the computer readable storage medium stores a computer program, wherein the computer program is executed by a processor to implement the steps of the printed circuit board heat sink mounting method provided in the second aspect.

[0017] In a fifth aspect, the present application also provides a computer program product comprising a computer program, wherein the computer program is executed by a processor to implement the steps of the printed circuit board heat sink mounting method provided in the second aspect.

[0018] Through the printed circuit board heat sink mounting device, method, equipment and storage medium provided by the present application, when the printed circuit board is transported to the mounting position, the lifting assembly is set to lift the support, so that the support supports under the printed circuit board, then the clamping assembly automatically clamps the heat sink and places the heat sink on the printed circuit board, and finally the pressing assembly is set to press the fixing pin of the heat sink, so that one end of the fixing pin passes through the mounting hole on the printed circuit board, so that the fixing pin can fix the heat sink on the printed circuit board. Therefore, the technical problems of low efficiency of manual installation of heat sink and damage of printed circuit board can be solved, the installation efficiency of the heat sink of the printed circuit board is improved, and the probability of damage of the printed circuit board is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort based on these drawings.

[0020] Figure 1 Structure diagram of the heat sink provided by the related art;

[0021] Figure 2 Structure diagram of the fixing pin provided by the related art;

[0022] Figure 3 Installation diagram of the fixing pin and the printed circuit board provided by the related art;

[0023] Figure 4 Structure diagram of the mounting device of the printed circuit board heat sink provided by an embodiment of the present application;

[0024] Figure 5 Pressing diagram of the mounting device of the printed circuit board heat sink provided by an embodiment of the present application;

[0025] Figure 6 Structure diagram of the second support provided by an embodiment of the present application;

[0026] Figure 7 Diagram of the clamping assembly clamping the heat sink provided by an embodiment of the present application;

[0027] Figure 8 Pressing diagram of the mounting device of the printed circuit board heat sink provided by another embodiment of the present application;

[0028] Figure 9 Flow diagram of the mounting method of the printed circuit board heat sink provided by an embodiment of the present application;

[0029] Figure 10 Structure diagram of the electronic device provided by an embodiment of the present application.

[0030] Among the above drawings, the following reference signs are included:

[0031] 100-heat sink body; 200-fixing pin; 201-main body rod part; 202-umbrella structure; 203-compression spring; 300-printed circuit board; 301-mounting hole;

[0032] 10 - mounting device of printed circuit board heat sink; 11 - lifting assembly; 12 - clamping assembly; 121 - movable assembly; 122 - gripping arm; 13 - press fitting assembly; 131 - vertical press fitting component; 132 - horizontal press fitting component; 14 - controller; 15 - support. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the protection scope of the present application.

[0034] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. The terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or the communication between two elements. The terms "parallel", "perpendicular", "equal" include the described case and the approximate case of the described case, and the approximate case is within the acceptable deviation range, wherein the acceptable deviation range is determined by the ordinary skill in the art considering the measurement being discussed and the error related to the measurement of the specific quantity (i.e. the limitation of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, wherein the acceptable deviation range of approximate parallel can be within 5°, for example; "perpendicular" includes absolute perpendicular and approximate perpendicular, wherein the acceptable deviation range of approximate perpendicular can also be within 5°, for example. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood in specific cases.

[0035] It should be noted that in the description of the present application, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that processes, methods, articles or devices that include a series of elements not only include those elements, but also include other elements not explicitly listed, or further include elements inherent in such processes, methods, articles or devices. The terms "first", "second" and the like in the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence.

[0036] In order for those skilled in the art to better understand the present application, the present application will be further described in detail below in conjunction with the drawings and specific embodiments.

[0037] With the rise of artificial intelligence, the performance requirement of the server is getting higher and higher, which also makes the total power of the server board (printed circuit board) higher and higher, and then more heat sinks need to be set on the board to ensure the normal working state of the board. Among them, the most common type of heat sink is passive heat sink, which means the heat sink directly contacts the board and passively increases the heat dissipation area of the board.

[0038] At present, the installation of the heat sink is mostly realized by manually pressing the fixing pin of the heat sink to the mounting hole of the printed circuit board. Specifically, Figure 1 a structural diagram of a heat sink provided in the related art; Figure 2 a structural diagram of a fixing pin provided in the related art; Figure 3 a mounting diagram of the fixing pin and the printed circuit board in the related art. As shown in Figures 1 to 3 The fixing pin 200 includes a main body rod part 201 and an umbrella-shaped structure 202 integrally provided with the main body rod part 201, the umbrella-shaped structure 202 can be contracted under external force, a compression spring 203 is sleeved on the outer peripheral part of the main body rod part 201, a fixing hole is provided on the heat sink body 100, the main body rod part 201 is inserted into the fixing hole, and a mounting hole 301 is opened on the printed circuit board 300. When fixing the heat sink, one end of the fixing pin 200 is pressed by manual force, so that the compression spring 203 is in a compressed state, and the umbrella-shaped structure 202 of the fixing pin 200 is inserted through the mounting hole 301, then the pressing of the fixing pin 200 is stopped, and the umbrella-shaped structure 202 is in abutment with the peripheral side of the mounting hole 301 under the elastic restoring force of the compression spring 203. Since one end of the compression spring 203 is in abutment with the heat sink body 100, and the other end is in abutment with the end of the main body rod part 201 away from the umbrella-shaped structure 202, the heat sink is installed on the printed circuit board 300 by the cooperation of the compression spring 203 and the umbrella-shaped structure 202. However, when the fixing pin 200 is inserted through the mounting hole 301 of the printed circuit board 300 by manual force in the related art, as shown in Figure 3As shown in FIG. 1, due to the lack of support for the printed circuit board 300, the printed circuit board 300 will be deformed under stress, which may result in damage to the printed circuit board or components of the printed circuit board. In addition, the number of heat sinks to be installed is large, and the manual installation method also makes the assembly efficiency of the printed circuit board low.

[0039] Therefore, in order to improve the installation efficiency of the printed circuit board heat sink, an automatic means can be used to automatically pick up the heat sink and automatically press the fixing pin of the heat sink, so as to fix and install the heat sink on the printed circuit board. Specifically, when the printed circuit board moves to the installation position, the automatic grabbing structure can automatically grab the heat sink to be installed and place the heat sink to be installed on the printed circuit board. The automatic pressing structure can automatically press one end of the fixing pin when the heat sink to be installed is grabbed to the installation position, so as to fix and install the heat sink on the printed circuit board. In this way, the participation of manual work can be reduced, and the installation efficiency of the heat sink can be improved. In addition, the support structure is arranged below the printed circuit board, and when the pressing structure presses the fixing pin, the support structure can avoid or reduce the deformation of the printed circuit board, thereby reducing the probability of damage to the printed circuit board.

[0040] Figure 4 The structure schematic diagram of the printed circuit board heat sink installation device provided by an embodiment of the present application is shown in FIG. 1. Figure 5 The pressing installation schematic diagram of the printed circuit board heat sink installation device provided by an embodiment of the present application is shown in FIG. 2. Figure 4 And Figure 5 As shown in FIG. 1 and FIG. 2, the printed circuit board heat sink installation device 10 provided in the embodiment specifically includes a support 15, a lifting assembly 11, a clamping assembly 12, a pressing assembly 13 and a controller 14.

[0041] Specifically, the lifting assembly 11, the clamping assembly 12 and the press-fitting assembly 13 are in communication connection with the controller 14; the lifting assembly 11 is arranged below the transportation path of the printed circuit board 300, and the support 15 is placed on the upper end of the lifting assembly 11; the controller 14 is configured to control the lifting assembly 11 to drive the support 15 to move to the mounting position to support below the printed circuit board 300 after the printed circuit board 300 is transported to the mounting position; the mounting hole 301 is arranged on the printed circuit board 300, the support 15 is provided with a avoiding hole, and the mounting hole 301 corresponds to the avoiding hole; the controller 14 is further configured to control the clamping assembly 12 to clamp the heat sink and place the heat sink on the printed circuit board 300, and after the heat sink is placed in place, one end of the fixing pin 200 of the heat sink corresponds to the mounting hole 301; the controller 14 is further configured to control the press-fitting assembly 13 to press the end of the fixing pin 200 of the heat sink away from the mounting hole 301, so that the end of the fixing pin 200 passes through the mounting hole 301, and the fixing pin 200 is used to clamp the heat sink on the printed circuit board 300.

[0042] The support 15 is used to support the printed circuit board 300, so as to ensure that the printed circuit board 300 does not deform greatly when the fixing pin 200 is pressed, and the probability of damage to the printed circuit board 300 is reduced. Alternatively, the specific form of the support 15 can be various, such as a support column or a support pad, etc.; in addition, the material of the support 15 can also be selected as metal or rubber, such as aluminum alloy or stainless steel, so as to ensure its strength and stability. Specifically, the support 15 should be provided with an avoiding hole corresponding to the mounting hole 301 of the printed circuit board 300, and the avoiding hole can be circular, oval or square, etc., so as to ensure that the fixing pin 200 of the heat sink can smoothly pass through the mounting hole 301. Further, the diameter of the avoiding hole should be greater than or equal to the diameter of the mounting hole 301, so as to avoid the avoiding hole from colliding with one end of the fixing pin 200.

[0043] The lifting assembly 11 is used to drive the support 15 to move up and down, so that when the printed circuit board 300 is transported to the mounting position, the lifting assembly 11 lifts the support 15 to support below the printed circuit board 300.

[0044] Optionally, the configuration of the lifting assembly 11 can be various, for example, the lifting assembly 11 can include a lifting motor, a lead screw, a nut seat, a guide rod and a lifting platform, etc. The support 15 is placed on the lifting platform. The output end of the lifting motor is connected with the lead screw through a shaft coupling. The nut seat is threadedly connected with the lead screw. When the lead screw rotates, the nut seat can move along the length direction of the lead screw. The lifting platform is fixedly connected with the nut seat, so that the lifting platform can be lifted when the nut seat moves. The guide rod is arranged in the guide hole of the lifting platform, and the guide rod is used for guiding the lifting platform to ensure the stability of the lifting platform when moving. The lifting motor is the power source of the lifting assembly 11, and the lifting motor is in communication connection with the controller 14. When the printed circuit board 300 is transported to the mounting position, the controller 14 controls the lifting motor to rotate forward, so that the lifting platform drives the support 15 to rise and support under the printed circuit board 300. When the heat sink is mounted on the printed circuit board 300, the printed circuit board 300 is transported to the next assembly area, and the controller 14 controls the lifting motor to rotate reversely, so that the lifting platform drives the support 15 to descend. Optionally, the lifting assembly 11 can also be an electric telescopic cylinder and a lifting platform arranged at the telescopic end of the electric telescopic cylinder. The electric telescopic cylinder is in communication connection with the controller 14. The controller 14 can control the telescopic end of the electric telescopic cylinder to extend or retract, so as to drive the lifting platform to lift. Specifically, in the embodiment, the configuration of the lifting assembly 11 is not limited as long as the support 15 can be lifted.

[0045] Optionally, the way of determining whether the printed circuit board 300 is transported to the mounting position can be various. An infrared sensor is arranged at the mounting position. The infrared sensor is in communication connection with the controller 14. When the printed circuit board 300 is transported to the mounting position, the detection signal of the infrared sensor changes, so that the controller 14 determines that the printed circuit board 300 is moved to the position according to the change of the received detection signal. Then, the lifting assembly 11 is controlled to drive the support 15 to rise to support the printed circuit board 300.

[0046] The clamping assembly 12 is used for clamping the heat sink and placing the heat sink on the mounting area on the printed circuit board 300.

[0047] Optionally, the components of the clamping assembly 12 can be various, and exemplarily, the clamping assembly 12 comprises a multi-axis mechanical arm, a pneumatic clamp jaw, a clamping cylinder and a connecting rod, the pneumatic clamp jaw is installed at one end of the multi-axis mechanical arm, the connecting rod is used to connect the clamping cylinder and the pneumatic clamp jaw and transmit power, and the multi-axis mechanical arm and the clamping cylinder are both in communication connection with the controller 14. When it is needed to grab the heat sink, the multi-axis mechanical arm is controlled to rotate to drive the pneumatic clamp jaw to move to the side of the heat sink, the controller 14 controls the clamping cylinder to intake air to make the pneumatic clamp jaw grab the heat sink, when the grabbing is completed, the multi-axis mechanical arm is controlled to move to the mounting area of the printed circuit board 300, and the controller 14 controls the clamping cylinder to exhaust air to make the pneumatic clamp jaw release the heat sink. Optionally, the multi-axis mechanical arm can also be replaced by a track and a track trolley, the track is erected on the assembly path of the printed circuit board 300, the track trolley is provided with a driving motor and a rolling wheel, the driving motor is in communication connection with the controller 14, the driving motor can drive the rolling wheel to rotate to drive the track trolley to move on the track, and the pneumatic clamp jaw and the cylinder are connected to the track trolley through a connecting piece, so that the heat sink is placed on the printed circuit board 300. Specifically, in the embodiment, the components of the clamping assembly 12 are not limited as long as the heat sink can be grabbed and placed on the mounting area of the printed circuit board 300.

[0048] The press-fitting assembly 13 is used to press one end of the fixing pin 200 after the heat sink is placed in place, so that the other end of the fixing pin 200 passes through the mounting hole 301, thereby firmly clamping the heat sink on the printed circuit board 300.

[0049] Optionally, the components of the clamping assembly 12 can be various, and exemplarily, the clamping assembly 12 comprises a multi-axis mechanical arm, a pneumatic clamp jaw, a clamping cylinder and a connecting rod, the pneumatic clamp jaw is installed at one end of the multi-axis mechanical arm, the connecting rod is used to connect the clamping cylinder and the pneumatic clamp jaw and transmit power, and the multi-axis mechanical arm and the clamping cylinder are both in communication connection with the controller 14. When it is needed to grab the heat sink, the multi-axis mechanical arm is controlled to rotate to drive the pneumatic clamp jaw to move to the side of the heat sink, the controller 14 controls the clamping cylinder to intake air to make the pneumatic clamp jaw grab the heat sink, when the grabbing is completed, the multi-axis mechanical arm is controlled to move to the mounting area of the printed circuit board 300, and the controller 14 controls the clamping cylinder to exhaust air to make the pneumatic clamp jaw release the heat sink. Optionally, the multi-axis mechanical arm can also be replaced by a track and a track trolley, the track is erected on the assembly path of the printed circuit board 300, the track trolley is provided with a driving motor and a rolling wheel, the driving motor is in communication connection with the controller 14, the driving motor can drive the rolling wheel to rotate to drive the track trolley to move on the track, and the pneumatic clamp jaw and the cylinder are connected to the track trolley through a connecting piece, so that the heat sink is placed on the printed circuit board 300. Specifically, in the embodiment, the components of the clamping assembly 12 are not limited as long as the heat sink can be grabbed and placed on the mounting area of the printed circuit board 300.

[0050] The controller 14 is a control core of the mounting device for the heat dissipation of the printed circuit board 300. The controller 14 is responsible for receiving signals from various sensors and issuing control instructions to the lifting assembly 11, the clamping assembly 12 and the pressing assembly 13 according to a preset program, so as to ensure that the various assemblies can work in a predetermined order and action, thereby realizing the automatic mounting of the heat dissipation device. Optionally, the controller 14 can be a microprocessor or a programmable logic controller 14.

[0051] Specifically, the mounting process of the heat dissipation device for the printed circuit board is as follows:

[0052] Firstly, when the printed circuit board 300 is transported to the mounting position, the controller 14 controls the lifting assembly 11 to lift the support 15 so that the support 15 is supported below the printed circuit board 300. Secondly, the controller 14 controls the clamping assembly 12 to clamp the heat dissipation device and place the heat dissipation device on the printed circuit board 300. Finally, the controller 14 controls the pressing assembly 13 to press the fixing pin 200 of the heat dissipation device, so that one end of the fixing pin 200 penetrates through the mounting hole 301, thereby completing the mounting process of the heat dissipation device on the printed circuit board 300. The heat dissipation device for the printed circuit board can automatically complete the task of mounting the heat dissipation device on the printed circuit board 300 by setting the clamping assembly 12 and the pressing assembly 13, thereby improving the mounting efficiency of the heat dissipation device. The lifting assembly 11 and the support 15 are arranged to support the printed circuit board 300, so as to avoid the case that the printed circuit board 300 is damaged due to the excessive deformation of the printed circuit board 300 in the process of pressing the fixing pin 200.

[0053] Reference Figure 4 and Figure 5 As an optional implementation, on the basis of any one of the above embodiments, the support 15 comprises:

[0054] The first support is used for supporting the end face of the printed circuit board 300, and the supporting area of the first support matches the area of the printed circuit board 300. The second support is used for supporting the circumferential side of the mounting hole 301. When the controller 14 controls the lifting assembly 11 to move the support 15 to the mounting position to be supported below the printed circuit board 300, the controller 14 is specifically used for: acquiring the hole diameter value of the mounting hole 301, the length value and the width value of the printed circuit board 300; in response to determining that the ratio of the hole diameter value of the mounting hole 301 to the length value or the width value of the printed circuit board 300 is greater than a preset ratio, controlling the lifting assembly 11 to lift the first support to be supported below the printed circuit board 300; in response to determining that the ratio of the hole diameter value of the mounting hole 301 to the length value or the width value of the printed circuit board 300 is less than or equal to the preset ratio, controlling the lifting assembly 11 to lift the second support to be supported below the printed circuit board 300.

[0055] It should be noted that, generally, the diameter of the mounting hole 301 on the printed circuit board 300 (or the diameter of the fixing pin 200 of the heat sink) is much larger than the size difference (length value or width value) of the printed circuit board 300. For example, the diameter of the mounting hole 301 is generally 4.2 mm, and the size of the general small printed circuit board 300 exceeds 100 mm (length value or width value). In this case, only the surrounding of the mounting hole 301 needs to be supported when supporting. In addition, there is also a case where the diameter of the mounting hole 301 on the printed circuit board 300 (or the diameter of the fixing pin 200 of the heat sink) is relatively small compared to the size difference of the printed circuit board 300. For example, when the width value of the printed circuit board 300 is ≤10 times the diameter value of the mounting hole 301. At this time, when the press-fit assembly 13 presses the fixing pin 200, the entire printed circuit board 300 will be subjected to pressure and thus deformed, and therefore, the support piece 15 is needed to support the entire printed circuit board 300.

[0056] Based on the above two cases, in the embodiment, two support pieces 15 are provided to cope with the two different cases. Specifically, the support piece 15 includes a first support piece and a second support piece.

[0057] The first support piece is suitable for the second case mentioned above, that is, the case where the diameter of the mounting hole 301 on the printed circuit board 300 is too small compared to the size difference of the printed circuit board 300. At this time, the first support piece is used to support the entire end surface of the printed circuit board 300, and the support area thereof matches the area of the printed circuit board 300, so as to be able to provide uniform support force for the printed circuit board 300. Optionally, the composition of the first support piece can have multiple choices. For example, the first support piece can be a rubber pad with the same size as the printed circuit board 300, and the rubber pad is provided with an avoidance hole corresponding to the mounting hole 301; or the first support piece can be a plurality of small-sized rubber columns spliced into a shape matching the area of the printed circuit board 300, which can also achieve comprehensive support for the printed circuit board 300. Specifically, in the embodiment, the specific form of the first support piece is not limited, as long as it can comprehensively support the printed circuit board 300.

[0058] The second support member is suitable for the first case mentioned above, i.e., the case where the size of the mounting hole 301 of the printed circuit board 300 is greatly different from the size of the printed circuit board 300. In this case, the second support member is used to support the peripheral side of the mounting hole 301 of the printed circuit board 300. Optionally, the second support member can have various forms, such as a ring-shaped rubber pad, the inner diameter of which is greater than or equal to the diameter of the mounting hole 301. In addition, the second support member can be composed of a plurality of cylindrical rubber blocks arranged around the mounting hole 301. Specifically, in the embodiment, the specific form of the second support member is not limited, as long as it can support the peripheral side of the mounting hole 301.

[0059] Specifically, when the lifting assembly 11 drives the support member 15 to move to the mounting position to support the lower side of the printed circuit board 300, the specific steps are as follows:

[0060] The diameter of the mounting hole 301, the length of the printed circuit board 300, and the width of the printed circuit board 300 are obtained by inputting the size information of the printed circuit board 300 into the controller 14 through the input device. When it is determined that the ratio of the diameter of the mounting hole 301 to the length or width of the printed circuit board 300 is greater than a preset ratio, the lifting assembly 11 is controlled to lift the first support member to support the lower side of the printed circuit board 300; and when it is determined that the ratio of the diameter of the mounting hole 301 to the length or width of the printed circuit board 300 is less than or equal to the preset ratio, the lifting assembly 11 is controlled to lift the second support member to support the lower side of the printed circuit board 300.

[0061] Optionally, when it is determined that the ratio of the diameter of the mounting hole 301 to the width of the printed circuit board 300 is greater than a preset ratio, the lifting assembly 11 is controlled to lift the first support member; and when it is determined that the ratio of the diameter of the mounting hole 301 to the width of the printed circuit board 300 is less than or equal to the preset ratio, the lifting assembly 11 is controlled to lift the second support member.

[0062] The preset ratio is a preset value used to determine whether the lifting assembly 11 lifts the first support member or the lifting assembly 11 lifts the second support member.

[0063] For example, the preset ratio can be 1:10. Of course, the preset ratio can also have other values, which are not specifically limited in the embodiment and can be flexibly adjusted according to actual conditions.

[0064] Specifically, the controller 14 calculates the ratio of the mounting hole 301 to the size of the printed circuit board 300 according to the hole diameter value of the mounting hole 301, the length value and the width value of the printed circuit board 300, and selectively raises the first support or the second support according to the preset ratio to adapt to different support requirements.

[0065] Reference Figure 5 As an optional embodiment, as shown in FIG. 1, based on any one of the above embodiments, the first support includes a plurality of first support cylinders, the outer diameter of the first support cylinder is smaller than the hole diameter of the mounting hole 301, the upper end surface of the plurality of first support cylinders forms a support plane of the printed circuit board 300, the area of the support plane matches the area of the printed circuit board 300, and the plurality of first support cylinders further surround to form an avoidance hole, and the hole diameter of the avoidance hole is greater than the hole diameter of the mounting hole 301; the second support is a second support cylinder, the second support cylinder is provided with an avoidance hole, the outer diameter of the second support cylinder and the hole diameter of the avoidance hole are both greater than the hole diameter of the mounting hole 301, and the second support cylinder is supported on the outer periphery of the mounting hole 301.

[0066] Specifically, in this embodiment, the first support includes a plurality of support cylinders, the outer diameter of the first support cylinder is smaller than the hole diameter of the mounting hole 301, the upper end surface of the plurality of first support cylinders forms a support plane of the printed circuit board 300, the area of the support plane matches the area of the printed circuit board 300, and the plurality of first support cylinders further surround to form an avoidance hole, and the hole diameter of the avoidance hole is greater than the hole diameter of the mounting hole 301, so as to ensure that the heat sink will not interfere with the fixing pin 200 when the heat sink is installed.

[0067] In this embodiment, the second support is a single cylindrical structure, the cylindrical structure is provided with an avoidance hole, so as to ensure that the heat sink will not interfere with the fixing pin 200 when the heat sink is installed, the outer diameter of the cylindrical structure and the hole diameter of the avoidance hole are both greater than the hole diameter of the mounting hole 301, and the cylindrical structure is used to provide local support on the outer periphery of the mounting hole 301. The top end of the cylindrical structure is made of elastic material (such as rubber or silica gel), or the whole material of the cylindrical structure is elastic material, so as to increase the protection of the printed circuit board 300 and prevent scratching or bruising. Exemplarily, Figure 6 The structure diagram of the second support provided by an embodiment of the present application is shown in FIG. 1, and the second support is a single cylindrical structure, the cylindrical structure is provided with an avoidance hole, so as to ensure that the heat sink will not interfere with the fixing pin 200 when the heat sink is installed, the outer diameter of the cylindrical structure and the hole diameter of the avoidance hole are both greater than the hole diameter of the mounting hole 301, and the cylindrical structure is used to provide local support on the outer periphery of the mounting hole 301. The top end of the cylindrical structure is made of elastic material (such as rubber or silica gel), or the whole material of the cylindrical structure is elastic material, so as to increase the protection of the printed circuit board 300 and prevent scratching or bruising. Exemplarily, Figure 6As shown in FIG. 1, the support 15 is a second support, and since the printed circuit board 300 is provided with four mounting holes 301, four second supports are correspondingly configured. It can be seen that the shape of the second support is annular, and of course, the number and shape of the second support can be adjusted according to actual conditions in other embodiments. Optionally, the inner diameter size of the second support (i.e. the hole diameter of the avoiding hole) is set to be 0.5 mm larger than the hole diameter of the mounting hole 301, so as to ensure that the fixing pin 200 will not be hindered from passing through the mounting hole 301. The outer diameter size of the second support is selected to be three times the hole diameter of the mounting hole 301, so as to ensure that the bottom of the printed circuit board 300 can be safely supported. Optionally, the second support can also be composed of multiple small support cylinders with smaller sizes, for example, the diameter of each small support cylinder is 0.5 mm, and the annular large cylinder structure composed of multiple small support cylinders is used to support the circumferential side of the mounting hole 301, which can also achieve the support of the printed circuit board 300.

[0068] Specifically, the support 15 provided by the present application can adapt to the mounting requirements of printed circuit boards 300 and heat sinks of different sizes and shapes.

[0069] Figure 7 The schematic diagram of the clamping assembly provided by an embodiment of the present application for clamping a heat sink is shown in FIG. 1, which is an optional embodiment based on any one of the above embodiments, and the clamping assembly 12 includes: Figure 4 Figure 5 Figure 7 The clamping assembly 12 includes:

[0070] The movable assembly 121 and two spaced apart clamping arms 122, both of which are connected to the movable assembly 121 and are configured to approach or move away from each other to clamp or release the heat sink; the movable assembly 121 is configured to drive the two clamping arms 122 to move to place the heat sink on the printed circuit board 300; the controller 14, when controlling the clamping assembly 12 to clamp the heat sink and place it on the printed circuit board 300, is specifically configured to: obtain the length value and the width value of the heat sink; control the two clamping arms 122 to move away from each other, so that the distance between the two clamping arms 122 is at the maximum distance position; control the movable assembly 121 to drive the two clamping arms 122 to move to the heat sink clamping position, and at the heat sink clamping position, the two clamping arms 122 are respectively located on both sides of the heat sink; in response to the two clamping arms 122 moving to the heat sink clamping position, control the two clamping arms 122 to approach each other; in response to the distance between the two clamping arms 122 being less than or equal to a preset distance, control the two clamping arms 122 to stop moving, so that the two clamping arms 122 clamp the heat sink; wherein the preset distance is one of the length value and the width value of the heat sink; control the movable assembly 121 to move to drive the heat sink to move onto the printed circuit board 300. ​​

[0071] The movable assembly 121 is used to move the two grabbing arms 122 to the printed circuit board 300 after the two grabbing arms 122 grab the heat sink.

[0072] The two grabbing arms 122 are spaced apart and connected to the movable assembly 121, and the main function is to clamp and release the heat sink. The two grabbing arms 122 can move closer to or farther away from each other to adapt to heat sinks of different sizes.

[0073] In this embodiment, the movable assembly 121 is a multi-axis robot. One end of the multi-axis robot is fixed with two electric telescopic cylinders. The two telescopic ends of the two electric telescopic cylinders are respectively fixed with two clamping plates. The two electric telescopic cylinders can drive the two clamping plates to move closer to or farther away from each other, so that the two electric telescopic cylinders and the two clamping plates form the two grabbing arms 122. The multi-axis robot and the two electric telescopic cylinders are in communication connection with the controller 14. When working, the controller 14 controls the multi-axis robot to move the two clamping plates to the side of the heat sink, and then controls the telescopic ends of the two electric telescopic cylinders to extend, so that the clamping plates clamp the heat sink.

[0074] Specifically, the specific steps of clamping the heat sink by the controller 14 are as follows:

[0075] First, the length and width values of the heat sink are obtained. This setting is to ensure that the grabbing arms 122 can accurately clamp the heat sink and avoid deforming the heat sink. The length and width values of the heat sink are input by the user according to the actual size of the heat sink through the input device.

[0076] Second, the controller 14 controls the two grabbing arms 122 to move away from each other, so that the distance between them reaches the maximum. In this way, it is ensured that there is enough space for the two grabbing arms 122 to adapt to the size of the heat sink. Then, the controller 14 controls the movable assembly 121 to move the two grabbing arms 122 to the clamping position of the heat sink. After moving to the clamping position of the heat sink, the two grabbing arms 122 are respectively located on both sides of the heat sink. Further, as shown in Figure 1 Since the heat sink body 100 of the heat sink is spaced apart along the length direction of the heat sink body 100, in order to avoid the situation that the clamping assembly 12 causes the heat dissipation fins to deform when clamping the heat sink, when the two grabbing arms 122 are located at the clamping position of the heat sink, the two grabbing arms 122 are spaced apart along the width direction of the heat sink body 100 and located on both sides of the heat sink body 100, so that the width value of the heat sink is the distance value between the two grabbing arms 122 when clamping the heat sink.

[0077] Again, when the grabbing arms 122 reach the grabbing position, the controller 14 controls the two grabbing arms 122 to move close to each other. When the distance between the two grabbing arms 122 is less than or equal to the preset distance, the controller 14 controls the two grabbing arms 122 to stop moving. At this time, it is considered that the two grabbing arms 122 have clamped the heat sink. Specifically, in the embodiment, the preset distance value is the width value of the heat sink. Alternatively, in order to further avoid that the grabbing arms 122 scratch or bruise the heat sink, a rubber shock pad is arranged at the end of the grabbing arms 122 in contact with the heat sink. Finally, the controller 14 controls the moving assembly 121 to move, so as to drive the heat sink to move to the printed circuit board 300. Thus, the process of grabbing the heat sink is completed.

[0078] Specifically, the clamping assembly 12 provided in the embodiment can adapt to heat sinks of different sizes by controlling the distance between the two grabbing arms 122, and can ensure that the heat sink can be correctly clamped and placed by accurately controlling the movement of the moving assembly to drive the two grabbing arms 122, so as to ensure the grabbing efficiency and accuracy of the heat sink.

[0079] As an optional implementation, on the basis of any one of the above embodiments, with reference to the description in Figure 2 、 Figure 4 and Figure 5 , the fixed pin 200 comprises:

[0080] a main rod part 201 and an umbrella-shaped structure 202 integrally connected with the main rod part 201; the umbrella-shaped structure 202 can be contracted and expanded; in the expanded state of the umbrella-shaped structure 202, the outer diameter of the umbrella-shaped structure 202 is greater than the diameter of the mounting hole 301, and in the maximum contracted state of the umbrella-shaped structure 202, the outer diameter of the umbrella-shaped structure 202 is less than or equal to the diameter of the mounting hole 301;

[0081] the controller 14, when the pressing assembly 13 presses the fixed pin 200 of the heat sink away from the end of the mounting hole 301 so that the end of the fixed pin 200 passes through the mounting hole 301, is specifically configured to: obtain the height value of the umbrella-shaped structure 202 and the thickness value of the printed circuit board 300; control the pressing assembly 13 to press the end of the main rod part 201; in response to the pressing distance of the pressing assembly 13 being greater than the sum of the height value of the umbrella-shaped structure 202 and the thickness value of the printed circuit board 300, determine that the umbrella-shaped structure 202 passes through the mounting hole 301.

[0082] The main rod part 201 is the main part of the fixing pin 200, and the umbrella structure 202 is used to abut the main body of the printed circuit board 300 after passing through the mounting hole 301. The umbrella structure 202 can be contracted and expanded. In the expanded state, the outer diameter of the umbrella structure 202 is greater than the diameter of the mounting hole 301, so that the heat sink can be firmly fixed on the printed circuit board 300. In the maximum contracted state, the outer diameter of the umbrella structure 202 is less than or equal to the diameter of the mounting hole 301, so that the fixing pin 200 can smoothly pass through the mounting hole 301. Optionally, the material of the umbrella structure 202 is soft plastic, which has a certain elasticity and can be deformed under external force and restored to the initial state after the external force is removed.

[0083] More specifically, the fixing pin 200 further comprises a compression spring, the compression spring is sleeved on the main rod part 201, one end of the compression spring abuts the main body of the heat sink, and the other end abuts one end of the main rod part 201, so that the umbrella structure 202 abuts the peripheral side of the mounting hole 301 of the printed circuit board 300 by the elastic restoring force of the compression spring.

[0084] Specifically, the specific steps of the control pressing assembly 13 pressing the fixing pin 200 of the heat sink away from one end of the mounting hole 301 so that one end of the fixing pin 200 passes through the mounting hole 301 are as follows:

[0085] Firstly, the height value of the umbrella structure 202 and the thickness value of the printed circuit board 300 are obtained. The above two parameters are the key to determine the pressing distance of the pressing assembly 13. Optionally, the height value of the umbrella structure 202 and the thickness value of the printed circuit board 300 are input by the user according to the actual parameters through the input device.

[0086] Secondly, the controller 14 controls the pressing assembly 13 to press one end of the main rod part 201, so that one end of the fixing pin 200 gradually passes through the mounting hole 301. In this process, whether the umbrella structure 202 completely passes through the mounting hole 301 is judged by the pressing distance of the pressing assembly 13. Specifically, when the pressing distance is greater than the sum of the height value of the umbrella structure 202 and the thickness value of the printed circuit board 300, it can be determined that the umbrella structure 202 has passed through the mounting hole 301. After the umbrella structure 202 passes through the mounting hole 301, it will restore to the expanded state due to the absence of external force, at this time, the pressing assembly 13 removes the pressure on one end of the main rod part 201, and under the action of the elastic restoring force of the compression spring, the umbrella structure 202 abuts the peripheral side of the mounting hole 301, thereby realizing the purpose of fixing the heat sink on the printed circuit board 300.

[0087] Specifically, in the embodiment, by precisely controlling the pressing distance of the pressing assembly 13, it is ensured that the umbrella structure 202 can accurately pass through the mounting hole 301 and be unfolded. Thus, the purpose of automatically pressing and fixing the pin 200 to fix the heat sink on the printed circuit board 300 is achieved. The mounting efficiency of the heat sink is improved.

[0088] Figure 8 The pressing schematic diagram of the mounting device of the printed circuit board heat sink provided in another embodiment of the application is provided as an optional implementation manner, which is based on any one of the above embodiments and shown in Figure 4 and Figure 8 The pressing assembly 13 comprises:

[0089] a vertical pressing component 131 for pressing one end of the main body rod portion 201 to make the umbrella structure 202 pass through the mounting hole 301, and a horizontal pressing component 132 for extruding the outer periphery of the umbrella structure 202 to make the umbrella structure 202 shrink; the controller 14 is further configured to: obtain the maximum shrinkage distance value of the umbrella structure 202 before controlling the pressing assembly 13 to press one end of the main body rod portion 201; control the horizontal pressing component 132 to extrude the outer periphery of the umbrella structure 202 to make the umbrella structure 202 shrink; and the controller 14 is configured to: in response to determining that the extrusion distance of the horizontal pressing component 132 is equal to the maximum shrinkage distance value of the umbrella structure 202, control the vertical pressing component 131 to press one end of the main body rod portion 201 when controlling the pressing assembly 13 to press one end of the main body rod portion 201.

[0090] Specifically, in the embodiment, the pressing assembly 13 comprises the vertical pressing component 131 and the horizontal pressing component 132. The main function of the vertical pressing component 131 is to press one end of the main body rod portion 201, thereby pushing the umbrella structure 202 to pass through the mounting hole 301. The main function of the horizontal pressing component 132 is to extrude the outer periphery of the umbrella structure 202 to make it shrink. Since the outer diameter of the umbrella structure 202 in the unfolded state is greater than the hole diameter of the mounting hole 301, the umbrella structure 202 will inevitably interact with the peripheral wall of the mounting hole 301 during the process of passing through the mounting hole 301, which may cause the risk of scratching the printed circuit board 300. Therefore, between the pressing of the vertical pressing component 131 to the pin 200, the umbrella structure 202 is first extruded by the horizontal pressing component 132 to change from the fully unfolded state to the maximum shrinkage state, and then one end of the main body rod portion 201 is pressed by the vertical pressing component 131, so that the umbrella structure 202 can easily pass through the mounting hole 301, and the risk of scratching the printed circuit board 300 can be reduced.

[0091] Optionally, the vertical pressing component 131 can be implemented by a linear driving device such as a pneumatic cylinder, a hydraulic cylinder or an electric push rod, which provides stable and controllable vertical downward pressure to ensure that the one end of the main rod part 201 is pressed accurately and smoothly, thereby pushing the umbrella-shaped structure 202 through the mounting hole 301. The horizontal pressing component 132 can be implemented by a pneumatic cylinder, a servo motor cooperating with a screw nut mechanism, or a linear module, which can accurately control the force and distance of pressing the periphery of the umbrella-shaped structure 202.

[0092] Specifically, before the control pressing assembly 13 presses the one end of the main rod part 201, the maximum contraction distance value of the umbrella-shaped structure 202 is first obtained, which is used to determine the degree of pressing the umbrella-shaped structure 202 by the horizontal pressing component 132. Optionally, the maximum contraction distance value of the umbrella-shaped structure 202 is determined by the user according to the factory parameter table of the fixed pin and input through the input device. Then, the controller 14 controls the horizontal pressing component 132 to press the periphery of the umbrella-shaped structure 202 until the pressing distance is equal to the maximum contraction distance value of the umbrella-shaped structure 202. At this time, the umbrella-shaped structure 202 is in the maximum contraction state and can smoothly pass through the mounting hole 301.

[0093] Specifically, when it is determined that the pressing distance of the horizontal pressing component 132 reaches the maximum contraction distance value of the umbrella-shaped structure 202, the controller 14 controls the vertical pressing component 131 to press the one end of the main rod part 201. Until the pressing action of the vertical pressing component 131 pushes the fixed pin 200 through the mounting hole 301.

[0094] Specifically, in the embodiment, the pressing assembly 13 includes the vertical pressing component 131 and the horizontal pressing component 132, and through the cooperation of the vertical pressing component 131 and the horizontal pressing assembly 13, it is ensured that the umbrella-shaped structure 202 of the fixed pin 200 can easily pass through the mounting hole 301 without damaging the printed circuit board 300. By accurately controlling the pressing distance of the horizontal pressing component 132 and the pressing timing of the vertical pressing component 131, the accuracy and reliability of the entire installation process are ensured.

[0095] As an optional implementation, on the basis of any one of the above embodiments, with reference to Figure 4 and Figure 8 , the controller 14, after controlling the vertical pressing component 131 to press the one end of the main rod part 201, is further configured to:

[0096] in response to determining that the distance between the horizontal pressing component 132 and the end surface of the printed circuit board 300 is less than or equal to the preset safety distance, controlling the horizontal pressing component 132 to release the umbrella-shaped structure 202 and move away from the printed circuit board 300.

[0097] Specifically, after the vertical press-fitting component 131 presses one end of the main body rod portion 201, the controller 14 detects the distance between the horizontal press-fitting component 132 and the end surface of the printed circuit board 300, so as to avoid the collision between the horizontal press-fitting component 132 and the end surface of the printed circuit board 300, and damage to the printed circuit board 300.

[0098] Optionally, the distance between the horizontal press-fitting component 132 and the end surface of the printed circuit board 300 can be detected by setting an infrared sensor in communication with the controller 14. When the controller 14 determines that the distance value is less than the preset installation distance based on the signal generated by the infrared sensor, it means that the horizontal press-fitting component 132 can be in a dangerous position and can cause damage to the printed circuit board 300. At this time, the controller controls the horizontal press-fitting component 132 to release the umbrella-shaped structure 202 and move away from the printed circuit board 300, so as to avoid the collision between the horizontal press-fitting component 132 and the printed circuit board 300.

[0099] Optionally, the preset safety distance is input by a user through an input device according to actual conditions.

[0100] Specifically, in the embodiment, the preset safety distance is used to determine the timing of releasing the umbrella-shaped structure 202 by the horizontal press-fitting component 132, so as to avoid the collision between the horizontal press-fitting component 132 and the printed circuit board 300 during the press-fitting process, thereby preventing damage to the printed circuit board 300 and improving the reliability and safety of the press-fitting assembly 13.

[0101] Figure 9 The flowchart of the installation method of the printed circuit board heat sink provided by an embodiment of the present application, and the execution subject of the embodiment is an installation device of the printed circuit board heat sink. The installation device of the printed circuit board heat sink can be realized by a computer program. It can also be realized by a medium storing a related computer program, such as a U disk and / or a CD, or it can also be realized by an entity device integrated or installed with a related computer program, such as a chip or an electronic device. The electronic device can be a computer or a server, etc., as shown in the figure. Figure 9 The installation method of the printed circuit board heat sink specifically includes the following steps:

[0102] In step S401, after the printed circuit board is transported to the installation position, the lifting assembly drives the support to move to the installation position to support the printed circuit board from below. The printed circuit board is provided with an installation hole, and the support is provided with an avoiding hole, and the installation hole corresponds to the avoiding hole.

[0103] In step S402, the clamping assembly is controlled to clamp the heat sink and place the heat sink on the printed circuit board; and after the heat sink is placed in position, one end of the fixing pin of the heat sink corresponds to the mounting hole.

[0104] In step S403, the pressing assembly is controlled to press the fixing pin of the heat sink away from the one end of the mounting hole, so that the one end of the fixing pin passes through the mounting hole, and the fixing pin is used to clasp the heat sink on the printed circuit board.

[0105] It should be noted that the installation method of the printed circuit board heat sink provided in the embodiment is used to implement the above-mentioned installation device of the printed circuit board heat sink, and the specific implementation principle and technical effect are similar, which will not be described here.

[0106] Optionally, when the lifting assembly is controlled to move the support to the mounting position to support the printed circuit board, it comprises:

[0107] The hole diameter value of the mounting hole, the length value and the width value of the printed circuit board are obtained; in response to determining that the ratio of the hole diameter value of the mounting hole to the length value or the width value of the printed circuit board is greater than a preset ratio, the lifting assembly is controlled to raise the first support to support the printed circuit board; in response to determining that the ratio of the hole diameter value of the mounting hole to the length value or the width value of the printed circuit board is less than or equal to the preset ratio, the lifting assembly is controlled to raise the second support to support the printed circuit board.

[0108] Optionally, when the clamping assembly is controlled to clamp the heat sink and place it on the printed circuit board, it comprises:

[0109] The length value and the width value of the heat sink are obtained; the two grabbing arms are controlled to move away from each other, so that the distance between the two grabbing arms is in the maximum distance position; the movable assembly is controlled to move the two grabbing arms to the heat sink grabbing position, and in the heat sink grabbing position, the two grabbing arms are located on the two sides of the heat sink; in response to the movement of the two grabbing arms to the heat sink grabbing position, the two grabbing arms are controlled to move close to each other; in response to the distance between the two grabbing arms being less than or equal to a preset distance, the movement of the two grabbing arms is stopped, so that the two grabbing arms clamp the heat sink; wherein the preset distance is one of the length value and the width value of the heat sink; the movable assembly is controlled to move to move the heat sink to the printed circuit board.

[0110] Optionally, when the pressing assembly is controlled to press the fixing pin of the heat sink away from the one end of the mounting hole, so that the one end of the fixing pin passes through the mounting hole, it comprises:

[0111] The height value of the umbrella-shaped structure and the thickness value of the printed circuit board are obtained; the pressing assembly is controlled to press one end of the main rod part; in response to the pressing distance of the pressing assembly being greater than the sum of the height value of the umbrella-shaped structure and the thickness value of the printed circuit board, it is determined that the umbrella-shaped structure passes through the mounting hole.

[0112] Optionally, before the control pressure assembly presses one end of the main body rod, further comprising:

[0113] Obtaining a maximum shrinkage distance value of the umbrella structure; controlling the horizontal pressure assembly to extrude the outer periphery of the umbrella structure to make the umbrella structure shrink;

[0114] When the control pressure assembly presses one end of the main body rod, comprising:

[0115] In response to determining that the extrusion distance of the horizontal pressure assembly is equal to the maximum shrinkage distance value of the umbrella structure, the vertical pressure assembly is controlled to press one end of the main body rod.

[0116] Optionally, after the control vertical pressure assembly presses one end of the main body rod, further comprising:

[0117] In response to determining that the distance between the horizontal pressure assembly and the end surface of the printed circuit board is less than or equal to the preset safety distance, the horizontal pressure assembly is controlled to release the umbrella structure and move away from the printed circuit board.

[0118] Figure 10 The structural schematic diagram of the electronic device provided by an embodiment of the present application is shown in FIG. 1. Figure 10 As shown in FIG. 1, the electronic device 50 provided by the embodiment of the present application comprises a memory 51 and a processor 52.

[0119] The memory 51 stores a computer program, and the processor 52 is configured to run the computer program to execute the steps in any of the above-mentioned installation methods of the printed circuit board heat sink.

[0120] The embodiment of the present application further provides a computer readable storage medium, which stores a computer program, wherein the computer program is configured to execute the steps in any of the above-mentioned installation methods of the printed circuit board heat sink when running.

[0121] In an example embodiment, the above-mentioned computer readable storage medium can include but is not limited to: a U disk, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk or an optical disk, and various media that can store computer programs.

[0122] The embodiment of the present application further provides another computer program product, which comprises a non-volatile computer readable storage medium, and the non-volatile computer readable storage medium stores a computer program, and the computer program is executed by a processor to implement the steps in any of the above-mentioned installation methods of the printed circuit board heat sink.

[0123] Those skilled in the art will further realize that the mere concepts, teachings, and embodiments described herein are merely meant to provide an enabling description of the claimed application. Accordingly, modifications and / or additions, other than those explicitly described herein, can be obvious to those skilled in the art in the light of this disclosure. The claimed application is intended to embrace all such modifications and / or additions.

[0124] The mounting device, method, electronic device, storage medium and program product of the printed circuit board heat spreader provided by the present application are described in detail above. The principles and implementation modes of the present application are described herein by applying specific examples, and the above description of the examples is only used to help understand the method of the present application and its core idea. It should be pointed out that, for those skilled in the art, without departing from the principles of the present application, some improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A mounting device for a printed circuit board heat sink, characterized in that, include: The system includes a support component, a lifting assembly, a clamping assembly, a pressing assembly, and a controller. The lifting assembly, the clamping assembly, and the pressing assembly are all communicatively connected to the controller. The lifting assembly is positioned below the printed circuit board transport path, and the support component is placed above the lifting assembly. The controller is used to control the lifting assembly to move the support member to the installation position to support the printed circuit board below it after the printed circuit board is transported to the installation position; the printed circuit board has mounting holes, the support member has clearance holes, and the mounting holes and clearance holes correspond to each other; The controller is also used to control the clamping assembly to clamp the heat sink and place the heat sink on the printed circuit board, and after the heat sink is placed in place, one end of the fixed pin of the heat sink corresponds to the mounting hole; The controller is also used to control the press-fit assembly to press the fixed pin of the heat sink away from the mounting hole, so that one end of the fixed pin passes through the mounting hole, and the fixed pin is used to snap the heat sink onto the printed circuit board; The support member includes: A first support member and a second support member, wherein the first support member is used to support the end face of the printed circuit board and the support area of ​​the first support member matches the area of ​​the printed circuit board, and the second support member is used to support the periphery of the mounting hole. The controller, when controlling the lifting assembly to move the support member to the installation position to support the printed circuit board below, is specifically configured to: acquire the hole diameter value of the mounting hole, the length value of the printed circuit board, and the width value of the printed circuit board; in response to determining that the ratio of the hole diameter value of the mounting hole to the length value or width value of the printed circuit board is greater than a preset ratio, control the lifting assembly to raise the first support member to support the printed circuit board below; in response to determining that the ratio of the hole diameter value of the mounting hole to the length value or width value of the printed circuit board is less than or equal to a preset ratio, control the lifting assembly to raise the second support member to support the printed circuit board below.

2. The apparatus according to claim 1, characterized in that, The first support member includes a plurality of first support cylinders, the outer diameter of the first support cylinders being smaller than the diameter of the mounting hole, the upper end face of the plurality of first support cylinders forming a support plane of the printed circuit board, the area of ​​the support plane matching the area of ​​the printed circuit board, and the plurality of first support cylinders also forming the clearance hole, and the diameter of the clearance hole being larger than the diameter of the mounting hole. The second support member is a second support cylinder, which has the clearance hole. The outer diameter of the second support cylinder and the diameter of the clearance hole are both larger than the diameter of the mounting hole. The second support cylinder is supported on the outer periphery of the mounting hole.

3. The apparatus according to claim 1, characterized in that, The clamping component includes: The device includes a movable component and two spaced-apart gripping arms, both of which are connected to the movable component. The two gripping arms are configured to move closer to or further away from each other to grip or release the heat sink. The movable component is configured to move the two gripping arms to place the heat sink onto a printed circuit board. The controller, when controlling the gripping assembly to grip the heat sink and place it on the printed circuit board, specifically performs the following functions: acquiring the length and width values ​​of the heat sink; controlling the two gripping arms to move away from each other so that the distance between the two gripping arms is at its maximum; controlling the movable assembly to move the two gripping arms to the heat sink gripping position, where the two gripping arms are respectively located on both sides of the heat sink; responding to the two gripping arms moving to the heat sink gripping position, controlling the two gripping arms to move closer to each other; responding to the distance between the two gripping arms being less than or equal to a preset distance, controlling the two gripping arms to stop moving so that the two gripping arms clamp the heat sink; wherein, the preset distance is one of the length and width values ​​of the heat sink; and controlling the movable assembly to move to move the heat sink onto the printed circuit board.

4. The apparatus according to any one of claims 1-3, characterized in that, The fixed pin includes: The main body and an umbrella-shaped structure integrally connected to the main body; the umbrella-shaped structure is capable of retracting and unfolding; in the unfolded state of the umbrella-shaped structure, the outer diameter of the umbrella-shaped structure is larger than the diameter of the mounting hole, and in the fully retracted state of the umbrella-shaped structure, the outer diameter of the umbrella-shaped structure is less than or equal to the diameter of the mounting hole; The controller, when controlling the pressing assembly to press the fixed pin of the heat sink away from the mounting hole so that one end of the fixed pin passes through the mounting hole, is specifically configured to: obtain the height value of the umbrella-shaped structure and the thickness value of the printed circuit board; control the pressing assembly to press one end of the main body rod; and, in response to the pressing distance of the pressing assembly being greater than the sum of the height value of the umbrella-shaped structure and the thickness value of the printed circuit board, determine that the umbrella-shaped structure passes through the mounting hole.

5. The apparatus according to claim 4, characterized in that, The press-fit assembly includes: The vertical pressing component and the horizontal pressing component are used to press one end of the main body rod to allow the umbrella-shaped structure to pass through the mounting hole, and the horizontal pressing component is used to squeeze the outer periphery of the umbrella-shaped structure to cause the umbrella-shaped structure to shrink. Before controlling the pressing assembly to press one end of the main body rod, the controller is further configured to: obtain the maximum shrinkage distance value of the umbrella-shaped structure; and control the horizontal pressing component to squeeze the outer periphery of the umbrella-shaped structure to cause the umbrella-shaped structure to shrink. The controller, when controlling the pressing assembly to press one end of the main body rod, is specifically configured to: in response to determining that the pressing distance of the horizontal pressing component is equal to the maximum shrinkage distance value of the umbrella-shaped structure, control the vertical pressing component to press one end of the main body rod.

6. The apparatus according to claim 5, characterized in that, The controller, after controlling the vertical pressing component to press one end of the main body rod, is further configured to: In response to determining that the distance between the horizontal pressing component and the end face of the printed circuit board is less than or equal to a preset safety distance, the horizontal pressing component is controlled to release the umbrella-shaped structure and move away from the printed circuit board.

7. A method for installing a heat sink on a printed circuit board, the method being applied to the apparatus as described in any one of claims 1-6, characterized in that, include: After the printed circuit board is transported to the installation position, the control lifting assembly moves the support member to the installation position to support the printed circuit board below; the printed circuit board has mounting holes, the support member has clearance holes, and the mounting holes and clearance holes correspond to each other; The control clamping assembly clamps the heat sink and places it on the printed circuit board; and after the heat sink is placed in place, one end of the fixed pin of the heat sink corresponds to the mounting hole; The control press assembly presses one end of the heat sink's fixing pin away from the mounting hole, so that one end of the fixing pin passes through the mounting hole. The fixing pin is used to snap the heat sink onto the printed circuit board.

8. An electronic device, characterized in that, include: Memory, used to store computer programs; A processor, configured to execute the computer program to implement the steps of the method for mounting a printed circuit board heat sink as described in claim 7.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, wherein the computer program, when executed by a processor, implements the steps of the method for installing a printed circuit board heat sink as described in claim 7.

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