Integrated sensor packaging structure

Abstract

The invention discloses an integrated sensor packaging structure. The integrated sensor package structure includes a substrate, a plurality of sensor modules disposed on the substrate, and a plurality of optical modules disposed on the substrate. Each sensor module comprises a sensing chip, a frame body surrounding the sensing chip and a light-transmitting piece arranged on the frame body. The light-transmitting piece, the frame body and the substrate jointly form a closed space in a surrounding mode, and the sensing chip is arranged in the closed space. Each of the optical modules includes a frame surrounding one of the sensor modules and at least one lens mounted on the frame. The thickness of the sensing chip of at least one sensor module is different from the thickness of the sensing chip of the other sensor module.

Description

Technical Field

[0001] The invention relates to a sensor packaging structure, in particular to an integrated sensor packaging structure. Background Art

[0002] Generally speaking, in the existing sensor packaging structure, a plurality of different sensor modules are usually packaged individually and then the packaged plurality of different sensor modules are combined. However, such an approach results in the problem that the existing sensor packaging structure is not simple enough. Summary of the invention

[0003] The invention discloses an integrated sensor packaging structure, which is mainly used to improve the problem of insufficient structural simplicity of the existing sensor packaging structure.

[0004] One embodiment of the present invention discloses an integrated sensor packaging structure, which includes: a substrate; a plurality of sensor modules; wherein each sensor module includes: a sensor chip disposed on the substrate; a frame body disposed on the substrate and surrounding the sensor chip; and

[0005] A light-transmitting member is disposed in the frame; wherein the light-transmitting member, the frame and the substrate together surround a closed space, and the sensing chip is disposed in the closed space; and

[0006] A plurality of optical modules; wherein each optical module comprises: a frame surrounding a corresponding one of the sensor modules; and

[0007] At least one lens is mounted on the frame; wherein the thickness of the sensing chip of at least one of the sensor modules is different from the thickness of the sensing chip of another sensor module.

[0008] Optionally, in each sensor module, a notch is formed on a top surface of the frame body, so that the top surface of the frame body has a stepped structure.

[0009] Optionally, each sensor module further includes an adhesive layer, and the adhesive layer is seamlessly joined between the notch of the frame and the light-transmitting member.

[0010] Optionally, the frame of each sensor module has a flange portion, which is annular and protrudes from the top end surface of the frame, and the flange portion surrounds a ring side surface of the light-transmitting member.

[0011] Optionally, in each optical module, the frame includes a supporting portion and a holding portion, the supporting portion is disposed on the substrate and surrounds a corresponding one of the sensor modules, and the holding portion can hold at least one lens.

[0012] Optionally, in each sensor module, the thickness of the sensing chip is positively correlated with the height of the frame of a corresponding one of the optical modules.

[0013] One embodiment of the present invention discloses an integrated sensor packaging structure, which includes: a substrate; a plurality of sensor modules; wherein each sensor module includes: a sensor chip disposed on the substrate; a frame body disposed on the substrate and surrounding the sensor chip; and

[0014] A light-transmitting member is disposed in the frame; wherein the light-transmitting member, the frame and the substrate together surround a closed space, and the sensing chip is disposed in the closed space; and

[0015] An optical module; wherein the optical module comprises: a frame; wherein the frame is disposed on the substrate and surrounds the outer periphery of each sensor module, and the frame is integrally formed; and

[0016] At least one lens is mounted on the frame; wherein the thickness of the sensing chip of at least one of the sensor modules is different from the thickness of the sensing chip of another sensor module.

[0017] Optionally, in each sensor module, a notch is formed on a top surface of the frame body, so that the top surface of the frame body has a stepped structure.

[0018] Optionally, each sensor module further includes an adhesive layer, and the adhesive layer is seamlessly joined between the notch of the frame and the light-transmitting member.

[0019] Optionally, the frame of each sensor module has a flange portion, which is annular and protrudes from the top end surface of the frame, and the flange portion surrounds a ring side surface of the light-transmitting member.

[0020] Optionally, in the optical module, the frame includes a plurality of supporting portions and a plurality of holding portions, each supporting portion is disposed on the substrate and surrounds a corresponding one of the sensor modules, each holding portion can hold at least one lens, and the plurality of supporting portions and the plurality of holding portions are integrally formed.

[0021] Optionally, in each sensor module, the thickness of the sensing chip is positively correlated with the height of a corresponding one of the fixing portions of the frame.

[0022] One embodiment of the present invention discloses an integrated sensor packaging structure, which includes: a substrate; a plurality of sensor chips disposed on the substrate; and

[0023] A light-transmitting member is disposed above the plurality of sensing chips; and

[0024] An optical module comprises: a frame; wherein the frame comprises: a supporting portion disposed on a substrate and surrounding a plurality of sensing chips and a light-transmitting member; and

[0025] A plurality of holding portions; wherein each holding portion is disposed on a side of the support portion away from the substrate; and

[0026] A plurality of lenses are mounted on a plurality of holding parts of the frame; wherein the thickness of at least one of the sensing chips is different from the thickness of another sensing chip.

[0027] According to the integrated sensor packaging structure of claim 13, it further comprises a frame body, which is disposed on the substrate and surrounds the plurality of sensing chips; wherein the light-transmitting member is disposed on the frame body.

[0028] Optionally, a notch is formed on a top surface of the frame body, so that the top surface of the frame body has a stepped structure.

[0029] Optionally, an adhesive layer is further included, and the adhesive layer is seamlessly connected between the notch of the frame and the light-transmitting element.

[0030] Optionally, the frame has a flange portion, which is annular and protrudes from the top end surface of the frame, and surrounds a ring side surface of the light-transmitting member.

[0031] Optionally, the thickness of each sensing chip is positively correlated with the height of a corresponding one of the retaining portions of the frame.

[0032] Optionally, in the optical module, the bottom surface of each holding portion of the frame is directly disposed on the light-transmitting element.

[0033] In summary, the integrated sensor packaging structure of the present invention can improve the problem of insufficient structural simplicity of the existing sensor packaging structure through the technical solutions of "multiple sensing chips are arranged on a substrate" and "the thickness of at least one of the sensing chips is different from the thickness of another sensing chip".

[0034] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 FIG. 1 is a three-dimensional schematic diagram of an integrated sensor packaging structure according to a first embodiment of the present invention.

[0036] Figure 2 An exploded schematic diagram of the integrated sensor packaging structure according to the first embodiment of the present invention.

[0037] Figure 3 for Figure 1 Schematic cross-sectional view along section line III-III.

[0038] Figure 4 for Figure 3 Schematic enlargement of region IV.

[0039] Figure 5 FIG. 4 is a perspective schematic diagram of an integrated sensor packaging structure according to a second embodiment of the present invention.

[0040] Figure 6 An exploded schematic diagram of an integrated sensor packaging structure according to a second embodiment of the present invention.

[0041] Figure 7 for Figure 5 Schematic cross-sectional view along section line VII-VII.

[0042] Figure 8 A schematic diagram of an integrated sensor packaging structure according to a third embodiment of the present invention. DETAILED DESCRIPTION

[0043] The following is an explanation of the implementation of the "integrated sensor packaging structure" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0044] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0045] [First embodiment]

[0046] See also Figures 1 to 3 As shown, Figure 1 is a three-dimensional schematic diagram of an integrated sensor packaging structure according to a first embodiment of the present invention, Figure 2 An exploded schematic diagram of the integrated sensor packaging structure of the first embodiment of the present invention, and Figure 3 for Figure 1Schematic cross-sectional view along section line III-III. A first embodiment of the present invention provides an integrated sensor packaging structure 100. The integrated sensor packaging structure 100 comprises a substrate 1, a plurality of sensor modules 2 disposed on the substrate 1, and a plurality of optical modules 3 disposed on the substrate. Each of the sensor modules 2 may correspond to one of the optical modules 3 in position.

[0047] In this embodiment, the substrate 1 may be, for example, a ceramic substrate or a printed circuit board, but the present invention does not limit the material of the substrate 1. The substrate 1 may also be further provided with an electrical connector 11 so that the sensor module 2 can be electrically connected to an electronic component (not shown in the figure).

[0048] In this embodiment, the number of the plurality of sensor modules 2 is three, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the number of the plurality of sensor modules 2 may be two or more than three. In addition, the plurality of sensor modules 2 may be multi-package BGA (Multi-Package Ball Grid Array, mPBGA) or plastic leaded chip carrier (Plastic Leaded Chip Carrier, PLCC), but the present invention is not limited thereto.

[0049] Each of the sensor modules 2 includes a sensing chip 21, a frame 22, and a light-transmitting member 23. The sensing chip 21 is disposed on the substrate 1, the frame 22 is disposed on the substrate 1 and surrounds the sensing chip 21, and the light-transmitting member 23 is disposed on the frame 22. Specifically, the light-transmitting member 23, the frame 22, and the substrate 1 together surround a closed space SP, and the sensing chip 21 is disposed in the closed space SP.

[0050] The sensing chip 21 may be an image sensing chip, but the present invention is not limited thereto. In addition, each of the sensor modules 2 may further include a plurality of leads W, one end of each of the leads W being connected to the substrate 1 , and the other end of each of the leads W being connected to the sensing chip 21 .

[0051] It is worth mentioning that the thickness of the sensing chip 21 of at least one of the sensor modules 2 is different from the thickness of the sensing chip 21 of another sensor module 2. In this embodiment, the sensing chips 21 of each sensor module 2 have different thicknesses, but the present invention is not limited thereto.

[0052] In other words, in the integrated sensor packaging structure 100 of the present invention, multiple different sensor modules 2 are integrated on the substrate 1 to simplify the overall structure, and multiple sensor modules 2 include multiple sensing chips 21 of different thicknesses so that the integrated sensor packaging structure 100 can adapt to different focusing distances.

[0053] See also Figures 1 to 3 And with Figure 4 As shown, Figure 4 for Figure 3 Schematic diagram of enlarged area IV in the middle. In each of the sensor modules 2, the frame 22 is annular, and a notch 222 is formed on a top surface 221 of the frame 22, so that the top surface 221 of the frame has a stepped structure S. Specifically, the notch 222 may be annular, and the notch 222 may be formed on a side of the top surface 221 of the frame 22 adjacent to the sensing chip 21 (such as the inner edge of the top surface 221). In addition, in each of the sensor modules 2, the frame 22 may be, for example, a molding compound, but the present invention is not limited thereto.

[0054] The light-transmitting member 23 may be, for example, transparent glass, but the present invention is not limited thereto. The light-transmitting member 23 may be disposed on the top surface 221 of the frame 22 , and a gap (not numbered in the figure) may be formed between the light-transmitting member 23 and the notch 222 of the frame 22 .

[0055] In addition, each of the sensor modules 2 may further include an adhesive layer 24, and the adhesive layer 24 may be seamlessly bonded between the notch 222 of the frame 22 and the light-transmitting member 23. The adhesive layer 24 may be located in the gap between the light-transmitting member 23 and the notch 222 of the frame 22, so that the light-transmitting member 23 may be adhered to the frame 22 through the adhesive layer 24. In addition, the frame 22 of each of the sensor modules 2 may have a flange portion 223, the flange portion 223 is annular and protrudes from the top end surface 221 of the frame 22, and the flange portion 223 surrounds a ring side surface 231 of the light-transmitting member 23, but the present invention is not limited thereto.

[0056] Each of the optical modules 3 includes a frame 31 surrounding a corresponding one of the sensor modules 2 and at least one lens 32 mounted on the frame 31. In addition, in this embodiment, each of the optical modules 3 includes three lenses 32, but the present invention is not limited thereto. In other embodiments not shown in the present invention, the number of lenses 32 included in each of the optical modules 3 may be one, two, or more than three. In addition, the frame 31 may be, for example, made of solder mask material, ceramic material, or molded colloid, but the present invention is not limited thereto.

[0057] In each of the optical modules 3, the frame 31 includes a supporting portion 311 and a holding portion 312, wherein the supporting portion 311 is disposed on the substrate 1 and surrounds a corresponding one of the sensor modules 2, and the holding portion 312 is located at an end of the supporting portion 311 away from the substrate 1, and the holding portion 312 can hold at least one of the lenses 32. In addition, each of the optical modules 3 may further include a lens barrel 33, wherein the lens barrel 33 is disposed on the holding portion 312, so that the holding portion 312 can hold the lens 32 through the lens barrel 33.

[0058] It is worth mentioning that, in each of the sensor modules 2, the thickness of the sensing chip 21 may be positively correlated with the height of the frame 31 of the corresponding one of the optical modules 3 (such as the distance between the end of the frame 31 away from the substrate 1 and the substrate 1), but the present invention is not limited thereto. In other words, in each of the sensor modules 2, the greater the thickness of the sensing chip 21, the greater the height of the frame 31 of the corresponding optical module 3. Therefore, the greater the thickness of the sensing chip 21, the greater the distance between the lens 32 installed in the corresponding frame 31 and the sensing chip 21. In other embodiments, the height of the frame 31 may also vary according to actual needs, and the present invention is not limited thereto.

[0059] [Second embodiment]

[0060] See also Figures 5 to 7 As shown, Figure 5 is a three-dimensional schematic diagram of an integrated sensor packaging structure according to a second embodiment of the present invention, Figure 6 An exploded schematic diagram of an integrated sensor packaging structure according to a second embodiment of the present invention, and Figure 7 for Figure 5 The second embodiment of the present invention is similar to the first embodiment of the present invention, and the similarities between the two embodiments are not repeated here, while the differences between the two embodiments are described as follows.

[0061] In this embodiment, the integrated sensor packaging structure 100 may include only one optical module 3. The frame 31 is disposed on the substrate 1 and surrounds the outer periphery of each sensor module 2, and the frame 31 may be integrally formed.

[0062] Specifically, in the optical module 3, the frame 31 includes a plurality of the supporting portions 311 and a plurality of the holding portions 312, each of the supporting portions 311 is disposed on the substrate 1 and surrounds a corresponding one of the sensor modules 2, each of the holding portions 312 can hold the lens 32, and the plurality of the supporting portions 311 and the plurality of the holding portions 312 are integrally formed.

[0063] In each of the sensor modules 2, the thickness of the sensing chip 21 is positively correlated with the height of a corresponding one of the retaining portions 312 of the frame 31 (e.g., the distance between the end of the retaining portion 312 away from the substrate 1 and the substrate 1). Therefore, the greater the thickness of the sensing chip 21, the greater the distance between the lens 32 mounted on the corresponding retaining portion 312 and the sensing chip 21.

[0064] [Third embodiment]

[0065] See also Figure 8 As shown, Figure 8 Schematic diagram of an integrated sensor packaging structure according to a third embodiment of the present invention. The third embodiment of the present invention is similar to the second embodiment of the present invention, and the similarities between the two embodiments are not repeated here, while the differences between the two embodiments are described as follows.

[0066] In this embodiment, the frame 31 includes one supporting portion 311 and one frame body 22 . The supporting portion 311 surrounds the plurality of sensing chips 21 , the light-transmitting member 23 and the frame body 22 , and the frame body 22 surrounds the plurality of sensing chips 21 .

[0067] In addition, in this embodiment, the number of the light-transmitting member 23 is one, and the light-transmitting member 23 is disposed above the plurality of the sensing chips 21. In other words, the projection area formed by the positive projection of each of the sensing chips 21 onto the light-transmitting member 23 may be located on the bottom surface of the light-transmitting member 23, and the plurality of the sensing chips 21 are disposed in the closed space SP. In addition, each of the retaining portions 312 is disposed on a side of the supporting portion 311 away from the substrate 1, and the bottom surface of each of the retaining portions 312 of the frame 31 may be directly disposed on the light-transmitting member 23, but the present invention is not limited thereto.

[0068] [Beneficial Effects of Embodiments]

[0069] The integrated sensor packaging structure of the present invention can improve the problem of insufficient structural simplicity of the existing sensor packaging structure through the technical solutions of "multiple sensor chips are arranged on a substrate" and "the thickness of at least one of the sensor chips is different from the thickness of another sensor chip".

[0070] The above description is only a preferred feasible embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the present invention.

Claims

1. An integrated sensor packaging structure, characterized in that: The integrated sensor packaging structure comprises: a substrate; A plurality of sensor modules; wherein each of the sensor modules comprises: A sensing chip, disposed on the substrate; a frame body, disposed on the substrate and surrounding the sensing chip; and a light-transmitting member disposed in the frame; wherein the light-transmitting member, the frame and the substrate together surround a closed space, and the sensing chip is disposed in the closed space; and A plurality of optical modules; wherein each of the optical modules comprises: a frame surrounding a corresponding one of the sensor modules; and at least one lens mounted on the frame; Wherein, the thickness of the sensing chip of at least one of the sensor modules is different from the thickness of the sensing chip of another sensor module.

2. The integrated sensor packaging structure according to claim 1, characterized in that: In each of the sensor modules, a notch is formed on a top surface of the frame body, so that the top surface of the frame body has a stepped structure.

3. The integrated sensor packaging structure according to claim 2, characterized in that: Each of the sensor modules further includes an adhesive layer, and the adhesive layer is seamlessly bonded between the notch of the frame and the light-transmitting member.

4. The integrated sensor packaging structure according to claim 2, characterized in that: The frame of each sensor module has a flange portion, which is annular and protrudes from the top end surface of the frame, and surrounds a ring side surface of the light-transmitting member.

5. The integrated sensor packaging structure according to claim 1, characterized in that: In each of the optical modules, the frame includes a supporting portion and a holding portion, the supporting portion is disposed on the substrate and surrounds a corresponding one of the sensor modules, and the holding portion can hold at least one of the lenses.

6. The integrated sensor packaging structure according to claim 1, characterized in that: In each of the sensor modules, the thickness of the sensing chip is positively correlated with the height of the frame of a corresponding one of the optical modules.

7. An integrated sensor packaging structure, characterized in that: The integrated sensor packaging structure comprises: a substrate; A plurality of sensor modules; wherein each of the sensor modules comprises: A sensing chip, disposed on the substrate; a frame body, disposed on the substrate and surrounding the sensing chip; and a light-transmitting member disposed in the frame; wherein the light-transmitting member, the frame and the substrate together surround a closed space, and the sensing chip is disposed in the closed space; and An optical module; wherein the optical module comprises: a frame, wherein the frame is disposed on the substrate and surrounds the outer periphery of each of the sensor modules, and the frame is integrally formed; and at least one lens mounted on the frame; Wherein, the thickness of the sensing chip of at least one of the sensor modules is different from the thickness of the sensing chip of another sensor module.

8. The integrated sensor packaging structure according to claim 7, characterized in that: In each of the sensor modules, a notch is formed on a top surface of the frame body, so that the top surface of the frame body has a stepped structure.

9. The integrated sensor packaging structure according to claim 8, characterized in that: Each of the sensor modules further includes an adhesive layer, and the adhesive layer is seamlessly bonded between the notch of the frame and the light-transmitting member.

10. The integrated sensor packaging structure according to claim 8, characterized in that: The frame of each sensor module has a flange portion, which is annular and protrudes from the top end surface of the frame, and surrounds a ring side surface of the light-transmitting member.

11. The integrated sensor packaging structure according to claim 7, characterized in that: In the optical module, the frame includes a plurality of supporting portions and a plurality of holding portions, each of the supporting portions is disposed on the substrate and surrounds a corresponding one of the sensor modules, each of the holding portions can hold at least one of the lenses, and the plurality of supporting portions and the plurality of holding portions are integrally formed.

12. The integrated sensor packaging structure according to claim 11, characterized in that: In each of the sensor modules, the thickness of the sensing chip is positively correlated with the height of a corresponding one of the fixing portions of the frame.

13. An integrated sensor packaging structure, characterized in that: The integrated sensor packaging structure comprises: a substrate; A plurality of sensing chips are disposed on the substrate; and a light-transmitting member, disposed above the plurality of sensing chips; and An optical module, comprising: A framework; wherein the framework comprises: a supporting portion, disposed on the substrate and surrounding the plurality of sensing chips and the light-transmitting element; and A plurality of holding portions; wherein each of the holding portions is disposed on a side of the support portion away from the substrate; and A plurality of lenses mounted on the plurality of holding portions of the frame; Wherein, the thickness of at least one of the sensing chips is different from the thickness of another of the sensing chips.

14. The integrated sensor packaging structure according to claim 13, characterized in that: The integrated sensor packaging structure further includes a frame body, which is disposed on the substrate and surrounds the plurality of sensing chips; wherein the light-transmitting element is disposed on the frame body.

15. The integrated sensor packaging structure according to claim 14, characterized in that: A notch is formed on a top surface of the frame body so that the top surface of the frame body has a stepped structure.

16. The integrated sensor packaging structure according to claim 15, characterized in that: The integrated sensor packaging structure further includes an adhesive layer, and the adhesive layer is seamlessly bonded between the notch of the frame and the light-transmitting element.

17. The integrated sensor packaging structure according to claim 15, characterized in that: The frame body has a flange portion, which is annular and protrudes from the top end surface of the frame body, and surrounds a ring side surface of the light-transmitting element.

18. The integrated sensor packaging structure according to claim 13, characterized in that: The thickness of each of the sensing chips is positively correlated with the height of a corresponding one of the holding portions of the frame.

19. The integrated sensor packaging structure according to claim 13, characterized in that: In the optical module, the bottom surface of each of the holding portions of the frame is directly disposed on the light-transmitting element.

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