Integrated sensor packaging structure

Abstract

The invention discloses an integrated sensor packaging structure. The integrated sensor packaging structure comprises a substrate, a plurality of sensor packaging units and a packaging layer. The substrate is provided with a first plate surface and a second plate surface. The plurality of sensor packaging units are arranged on the first plate surface. Each sensor packaging unit comprises a sensing chip arranged on the first plate face, a light-transmitting piece arranged above the sensing chip and an optical module arranged on the surface of the light-transmitting piece. The optical module includes a frame disposed on the sensing chip and a lens mounted in the frame. And the packaging layer is arranged around the periphery of each sensor packaging unit. The thickness of the sensing chip of at least one sensor packaging unit is different from the thickness of the sensing chip of the other sensor packaging unit.

Description

Technical Field

[0001] The invention relates to a sensor packaging structure, in particular to an integrated sensor packaging structure. Background Art

[0002] Generally speaking, in the existing sensor packaging structure, a plurality of different sensor packaging units are usually packaged individually and then the packaged plurality of different sensor packaging units are combined. However, such an approach results in the existing sensor packaging structure having a problem of insufficient structural simplicity. Summary of the invention

[0003] The invention discloses an integrated sensor packaging structure, which is mainly used to improve the problem of insufficient structural simplicity of the existing sensor packaging structure.

[0004] One embodiment of the present invention discloses an integrated sensor packaging structure, which includes: a substrate having a first board surface and a second board surface opposite to each other; a plurality of sensor packaging units disposed on the first board surface; wherein each sensor packaging unit includes: a sensor chip disposed on the first board surface; a light-transmitting member disposed above the sensor chip; and

[0005] An optical module is disposed on a surface of the light-transmitting element away from the sensing chip; wherein the optical module comprises: a frame disposed on the sensing chip; and

[0006] at least one lens mounted in the frame; and

[0007] A packaging layer surrounds the sensing chip and the light-transmitting member of each sensor packaging unit; wherein the thickness of the sensing chip of at least one of the sensor packaging units is different from the thickness of the sensing chip of another sensor packaging unit; wherein the thickness of the light-transmitting member of at least one of the sensor packaging units is different from the thickness of the light-transmitting member of another sensor packaging unit.

[0008] Optionally, the packaging layer is formed by liquid packaging glue.

[0009] Optionally, in each sensor packaging unit, the thickness of the sensing chip is inversely related to the thickness of the light-transmitting element.

[0010] Optionally, in each sensor packaging unit, the sum of the thickness of the sensing chip and the thickness of the light-transmitting member is less than 2 mm.

[0011] Optionally, the distance between the light-transmitting member and the substrate of any one sensor packaging unit is the same as the distance between the light-transmitting member and the substrate of another sensor packaging unit.

[0012] Optionally, each sensor packaging unit includes a supporting adhesive layer, which is annular and located between the sensing chip and the light-transmitting member, and the supporting adhesive layer, the sensing chip and the light-transmitting member can together form a closed space.

[0013] Optionally, each sensor packaging unit includes a plurality of leads, one end of each lead is connected to the first board surface, and the other end of each lead is connected to the sensing chip and is located in the supporting glue layer.

[0014] One embodiment of the present invention discloses an integrated sensor packaging structure, which includes: a substrate having a first board surface and a second board surface opposite to each other; a plurality of sensor packaging units disposed on the first board surface; wherein each sensor packaging unit includes: a sensor chip disposed on the first board surface; a light-transmitting member disposed above the sensor chip; and

[0015] An optical module is disposed on a surface of the light-transmitting element away from the sensing chip; wherein the optical module comprises: a frame disposed on the sensing chip; and

[0016] at least one lens mounted in the frame; and

[0017] A packaging layer surrounds the sensing chip of each sensor packaging unit and the light-transmitting member; wherein the thickness of the sensing chip of at least one of the sensor packaging units is different from the thickness of the sensing chip of another sensor packaging unit.

[0018] Optionally, the packaging layer is formed by liquid packaging glue.

[0019] Optionally, in each sensor packaging unit, the thickness of the sensing chip is positively correlated with the distance between the light-transmitting element and the substrate.

[0020] Optionally, the light-transmitting member of at least one of the sensor packaging units forms an annular retaining wall on a surface away from the sensing chip.

[0021] Optionally, the distance between the light-transmitting member and the substrate of at least one of the sensor packaging units is smaller than the distance between the light-transmitting member and the substrate of another sensor packaging unit.

[0022] Optionally, each sensor packaging unit includes a supporting adhesive layer, which is annular and located between the sensing chip and the light-transmitting member, and the supporting adhesive layer, the sensing chip and the light-transmitting member can together form a closed space.

[0023] Optionally, each sensor packaging unit includes a plurality of leads, one end of each lead is connected to the first board surface, and the other end of each lead is connected to the sensing chip and is located in the supporting glue layer.

[0024] In summary, the integrated sensor packaging structure of the present invention can improve the problem of insufficient structural simplification of the existing sensor packaging structure through the technical solutions of "multiple sensor packaging units are arranged on the first board surface of the substrate" and "the thickness of the sensing chip of at least one of the sensor packaging units is different from the thickness of the sensing chip of another sensor packaging unit".

[0025] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 FIG. 1 is a three-dimensional schematic diagram of an integrated sensor packaging structure according to a first embodiment of the present invention.

[0027] Figure 2 It is a schematic diagram of an exploded view of the integrated sensor packaging structure of the first embodiment of the present invention.

[0028] Figure 3 for Figure 1 Schematic cross-sectional view along section line III-III.

[0029] Figure 4 This is a schematic diagram showing that the packaging layer of the integrated sensor packaging structure of the first embodiment is formed by liquid packaging glue.

[0030] Figure 5 FIG. 4 is a schematic diagram of an integrated sensor packaging structure according to a second embodiment of the present invention.

[0031] Figure 6 for Figure 5 Schematic enlargement of region VI. DETAILED DESCRIPTION

[0032] The following is an explanation of the implementation of the "integrated sensor packaging structure" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0033] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0034] [First embodiment]

[0035] See also Figure 1 and Figure 2 As shown, Figure 1 is a three-dimensional schematic diagram of an integrated sensor packaging structure according to a first embodiment of the present invention, and Figure 2 1 is an exploded schematic diagram of an integrated sensor packaging structure according to a first embodiment of the present invention. The first embodiment of the present invention provides an integrated sensor packaging structure 100. The integrated sensor packaging structure 100 comprises a substrate 1, a plurality of sensor packaging units 2 and a packaging layer 3. The substrate 1 has a first board surface 11 and a second board surface 12 opposite to each other. The substrate 1 may be, for example, a ceramic substrate or a printed circuit board.

[0036] See also Figure 3 and Figure 4 As shown, Figure 3 for Figure 1 A schematic cross-sectional view along section line III-III, and Figure 4 FIG. 1 is a schematic diagram of the packaging layer of the integrated sensor packaging structure of the first embodiment being composed of liquid packaging glue. A plurality of the sensor packaging units 2 are disposed on the first board surface 11 of the substrate 1. Each of the sensor packaging units 2 can be, for example, a ball grid array (BGA) package unit. Each of the sensor packaging units 2 includes a sensing chip 21, a light-transmitting member 22, and an optical module 23.

[0037] In addition, each of the sensor packaging units 2 may further include a plurality of leads W. One end of each of the leads W is connected to the first board surface 11 of the substrate 1 and the other end of each of the leads W is connected to the sensing chip 21. The packaging layer 3 surrounds the sensing chip 21 of each of the sensor packaging units 2 and the light-transmitting member 22. Optionally, as Figure 4 As shown, the packaging layer 3 may be formed by liquid packaging glue, but the present invention is not limited thereto.

[0038] The substrate 1 may also be further provided with an electrical connector 13 (such as Figure 1 and 2As shown in the figure, the second board surface 12 of the substrate 1 may be formed with a plurality of solder balls 14, and the plurality of solder balls 14 can be soldered to an electronic component (not shown in the figure) so that the sensor packaging unit 2 can be electrically connected to the electronic component. In addition, the number of the plurality of sensor packaging units 2 in this embodiment is three, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the number of the plurality of sensor packaging units 2 may be two or more than three.

[0039] In each of the sensor packaging units 2, the sensing chip 21 is disposed on the first board surface 11 of the substrate 1. The sensing chip 21 may be an image sensing chip, and the light-transmitting member 22 may be, for example, transparent glass, but the present invention is not limited thereto. The light-transmitting member 22 is disposed above the sensing chip 21, and the optical module 23 is disposed on a surface of the light-transmitting member 22 away from the sensing chip 21.

[0040] The thickness of the sensing chip 21 of at least one of the sensor packaging units 2 is different from the thickness of the sensing chip 21 of another sensor packaging unit 2. In this embodiment, the sensing chips 21 of each of the sensor packaging units 2 have different thicknesses, but the present invention is not limited thereto.

[0041] In other words, in the integrated sensor packaging structure 100 of the present invention, a plurality of different sensor packaging units 2 are integrated on the substrate 1 to simplify the overall structure, and a plurality of the sensor packaging units 2 include a plurality of sensing chips 21 of different thicknesses so that the integrated sensor packaging structure 100 can adapt to different focusing distances.

[0042] In the integrated sensor packaging structure 100 of this embodiment, the thickness of the light-transmitting member 22 of at least one of the sensor packaging units 2 is different from the thickness of the light-transmitting member 22 of another sensor packaging unit 2. In this embodiment, the light-transmitting member 22 of each of the sensor packaging units 2 may have different thicknesses, but the present invention is not limited thereto.

[0043] In addition, in each of the sensor packaging units 2 of this embodiment, the thickness of the sensing chip 21 is inversely related to the thickness of the light-transmitting member 22, but the present invention is not limited thereto. In other words, in each of the sensor packaging units 2, the greater the thickness of the sensing chip 21, the smaller the thickness of the light-transmitting member 22. Optionally, in each of the sensor packaging units 2, the sum of the thickness of the sensing chip 21 and the thickness of the light-transmitting member 22 is less than 2 mm, but the present invention is not limited thereto.

[0044] In addition, in each of the sensor packaging units 2, a supporting glue layer 24 may be formed between the sensing chip 21 and the light-transmitting member 22. The supporting glue layer 24 is annular and is located between the sensing chip 21 and the light-transmitting member 22, and the supporting glue layer 24, the sensing chip 21 and the light-transmitting member 22 may together form a closed space SP. In addition, one end of each of the leads W may be connected to the sensing chip 21 and located in the supporting glue layer 24, but the present invention is not limited thereto. In other embodiments not shown in the present invention, one end of each of the leads W may not be located in the supporting glue layer 24, but the present invention is not limited thereto.

[0045] The optical module 23 of each of the sensor packaging units 2 includes a frame 231 disposed on the sensing chip 21 and at least one lens 232 installed in the frame 231. It is worth mentioning that the optical module can be directly disposed on the surface of the light-transmitting member 22 away from the sensing chip 21 through the bottom edge of the frame 231. In other words, other optical modules that are not directly disposed on the sensing chip are not suitable for comparison with the optical module 23 in this embodiment. In addition, the projection area formed by the positive projection of the optical module 23 of each of the sensor packaging units 2 onto the sensing chip 21 can be only located on the surface of the sensing chip 21, but the present invention is not limited thereto.

[0046] In addition, in this embodiment, the optical module 23 of each sensor packaging unit 2 includes three lenses 232, but the present invention is not limited thereto. In other embodiments, the optical module 23 of each sensor packaging unit 2 may include one or more lenses 232.

[0047] In this embodiment, the optical modules 23 included in each of the sensor packaging units 2 may be substantially located at the same height, but the present invention is not limited thereto. In other embodiments, the optical modules 23 included in each of the sensor packaging units 2 may have different heights, but the present invention is not limited thereto.

[0048] [Second embodiment]

[0049] See also Figure 5 and Figure 6 As shown, Figure 5 is a schematic diagram of an integrated sensor packaging structure according to a second embodiment of the present invention, and Figure 6 for Figure 5 The second embodiment of the present invention is similar to the first embodiment of the present invention, and the similarities between the two embodiments are not repeated here, while the differences between the two embodiments are described as follows.

[0050] In each of the sensor packaging units 2 of this embodiment, the thickness of the sensing chip 21 and the thickness of the light-transmitting member 22 may not be in an inverse relationship, and the light-transmitting member 22 of each of the sensor packaging units 2 may have substantially the same thickness.

[0051] In addition, in each of the sensor packaging units 2 of this embodiment, the thickness of the sensing chip 21 and the distance between the light-transmitting member 22 and the substrate 1 may be in a positive relationship, but the present invention is not limited thereto. In other words, in each of the sensor packaging units 2, the greater the thickness of the sensing chip 21, the greater the distance between the light-transmitting member 22 and the substrate 1.

[0052] In this embodiment, the light-transmitting member 22 of at least one of the sensor packaging units 2 is formed with an annular retaining wall 25 on a surface away from the sensing chip 21, and the distance between the light-transmitting member 22 of at least one of the sensor packaging units 2 and the substrate 1 is smaller than the distance between the light-transmitting member 22 of another sensor packaging unit 2 and the substrate 1. The annular retaining wall 25 may be around one end of the optical module 23 adjacent to the sensing chip 21. The annular retaining wall 25 may be formed, for example, by curing glue, but the present invention is not limited thereto. In addition, the ratio between the height of the annular retaining wall 25 and the thickness of the light-transmitting member 22 may be between 1 / 2 and 1 / 3, or the height of the annular retaining wall 25 may be between 100 micrometers and 300 micrometers, but the present invention is not limited thereto.

[0053] It should be noted that, since the distance between the sensing chip 21 and the substrate 1 of each sensor packaging unit 2 may be different, by forming the annular retaining wall 25 on the surface of the light-transmitting member 22 having a smaller distance from the substrate 1, it can be ensured that the liquid packaging glue will not flood the surface of the light-transmitting member 22.

[0054] It is worth mentioning that, in the first embodiment, the distance between the light-transmitting member 22 of any sensor packaging unit 2 and the substrate 1 may be substantially the same as the distance between the light-transmitting member 22 of another sensor packaging unit 2 and the substrate 1. In other words, the light-transmitting members 22 of each sensor packaging unit 2 may be arranged at the same level, and the surface of the light-transmitting member 22 of each sensor packaging unit 2 may not be formed with the annular retaining wall 25.

[0055] In addition, in this embodiment, the height of the optical module 23 (such as the distance between one end of the optical module 23 away from the sensing chip 21 and the sensing chip 21) can vary according to the thickness of the sensing chip 21 or actual needs, but the present invention is not limited thereto.

[0056] In this embodiment, the height of the optical module 23 in any one of the sensor packaging units 2 is different from the height of the optical module 23 in another sensor packaging unit 2, but the present invention is not limited thereto. In other embodiments, the optical modules 23 in each of the sensor packaging units 2 may have substantially the same height. In addition, the size of the optical module 23 in the horizontal direction may also vary according to demand, and the optical modules 23 of each of the sensor packaging units 2 may have substantially the same or different sizes in the horizontal direction.

[0057] [Beneficial Effects of Embodiments]

[0058] The integrated sensor packaging structure of the present invention can improve the problem of insufficient structural simplicity in the existing sensor packaging structure through the technical solutions of "multiple sensor packaging units are arranged on the first board surface of the substrate" and "the thickness of the sensing chip of at least one of the sensor packaging units is different from the thickness of the sensing chip of another sensor packaging unit".

[0059] The above description is only a preferred feasible embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the present invention.

Claims

1. An integrated sensor packaging structure, characterized in that: The integrated sensor packaging structure comprises: A substrate having a first surface and a second surface opposite to each other; A plurality of sensor packaging units are arranged on the first board surface; wherein each of the sensor packaging units comprises: A sensing chip, disposed on the first board surface; a light-transmitting member, disposed above the sensing chip; and An optical module is disposed on a surface of the light-transmitting element away from the sensing chip; wherein the optical module comprises: a frame, disposed on the sensing chip; and at least one lens mounted in the frame; and a packaging layer, surrounding the sensing chip of each sensor packaging unit and the light-transmitting member; Wherein, the thickness of the sensing chip of at least one of the sensor packaging units is different from the thickness of the sensing chip of another sensor packaging unit; Wherein, the thickness of the light-transmitting member of at least one of the sensor packaging units is different from the thickness of the light-transmitting member of another of the sensor packaging units.

2. The integrated sensor packaging structure according to claim 1, characterized in that: The packaging layer is formed by liquid packaging glue.

3. The integrated sensor packaging structure according to claim 1, characterized in that: In each of the sensor packaging units, the thickness of the sensing chip is inversely related to the thickness of the light-transmitting element.

4. The integrated sensor packaging structure according to claim 3, characterized in that: In each of the sensor packaging units, the sum of the thickness of the sensing chip and the thickness of the light-transmitting element is less than 2 mm.

5. The integrated sensor packaging structure according to claim 1, characterized in that: A distance between the light-transmitting member and the substrate of any one of the sensor packaging units is the same as a distance between the light-transmitting member and the substrate of another of the sensor packaging units.

6. The integrated sensor packaging structure according to claim 1, characterized in that: Each of the sensor packaging units includes a supporting adhesive layer, which is annular and located between the sensing chip and the light-transmitting component. The supporting adhesive layer, the sensing chip and the light-transmitting component can together form a closed space.

7. The integrated sensor packaging structure according to claim 6, characterized in that: Each of the sensor packaging units includes a plurality of leads, one end of each of the leads is connected to the first board surface, and the other end of each of the leads is connected to the sensing chip and is located in the supporting glue layer.

8. An integrated sensor packaging structure, characterized in that: The integrated sensor packaging structure comprises: A substrate having a first surface and a second surface opposite to each other; A plurality of sensor packaging units are arranged on the first board surface; wherein each of the sensor packaging units comprises: A sensing chip, disposed on the first board surface; a light-transmitting member, disposed above the sensing chip; and An optical module is disposed on a surface of the light-transmitting element away from the sensing chip; wherein the optical module comprises: a frame, disposed on the sensing chip; and at least one lens mounted in the frame; and a packaging layer, surrounding the sensing chip of each sensor packaging unit and the light-transmitting member; Wherein, the thickness of the sensing chip of at least one of the sensor packaging units is different from the thickness of the sensing chip of another of the sensor packaging units.

9. The integrated sensor packaging structure according to claim 8, characterized in that: The packaging layer is formed by liquid packaging glue.

10. The integrated sensor packaging structure according to claim 8, characterized in that: In each of the sensor packaging units, the thickness of the sensing chip is positively correlated with the distance between the light-transmitting element and the substrate.

11. The integrated sensor packaging structure according to claim 8, characterized in that: The light-transmitting element of at least one of the sensor packaging units forms an annular retaining wall on a surface away from the sensing chip.

12. The integrated sensor packaging structure according to claim 11, characterized in that: A distance between the light-transmitting member and the substrate of at least one of the sensor packaging units is smaller than a distance between the light-transmitting member and the substrate of another of the sensor packaging units.

13. The integrated sensor packaging structure according to claim 8, characterized in that: Each of the sensor packaging units includes a supporting adhesive layer, which is annular and located between the sensing chip and the light-transmitting component. The supporting adhesive layer, the sensing chip and the light-transmitting component can together form a closed space.

14. The integrated sensor packaging structure according to claim 13, characterized in that: Each of the sensor packaging units includes a plurality of leads, one end of each of the leads is connected to the first board surface, and the other end of each of the leads is connected to the sensing chip and is located in the supporting glue layer.

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