Resin molding device and method for manufacturing resin molded article

Abstract

The resin molding apparatus includes a first module, a second module, a third module, and a conveyance mechanism. The first module supplies a release film. The second module places the liquid resin on the release film. The third module performs resin molding by clamping the molding die in a state where the release film on which the liquid resin is placed is disposed in the molding die. The second module includes a first platform and a second platform. The transfer mechanism starts to transfer the release film from the first module to the second stage at least during a process of supplying the liquid resin to the release film temporarily disposed on the first stage.

Description

Technical Field

[0001] The present invention relates to a resin molding device and a method for manufacturing a resin molded product. Background Art

[0002] Japanese Patent Publication No. 2022-61238 (Patent Document 1) discloses a resin sealing device. In the resin sealing device, resin is supplied to a film, and the film on which the resin is carried is transported to a mold. One side of a workpiece is sealed with resin by using a mold provided with a film on which the resin is carried (see Patent Document 1).

[0003] Patent Document 1: Japanese Patent Application Publication No. 2022-61238

[0004] Generally speaking, the process of supplying liquid resin to the release film and placing the liquid resin on the release film takes a long time. Therefore, when the liquid resin is used for resin molding, there is a tendency that the time required for manufacturing each resin molded product becomes longer. In the above-mentioned patent document 1, no means for solving this problem is disclosed. Summary of the invention

[0005] The present invention has been made to solve such a problem, and an object of the present invention is to provide a resin molding apparatus and a method for manufacturing a resin molded product, which can manufacture a resin molded product by using a liquid resin and can reduce the time required for manufacturing each resin molded product.

[0006] According to one aspect of the present invention, a resin forming device comprises a first module, a second module, a third module and a conveying mechanism. The first module supplies a release film. The second module places the liquid resin on the release film by supplying liquid resin to the release film. The third module comprises a forming mold, and resin forming is performed by closing the forming mold in a state where the release film carrying the liquid resin is arranged on the forming mold. The second module comprises a first platform and a second platform. The release film can be arranged on the first platform and the second platform, respectively. The conveying mechanism starts to convey the release film from the first module to the second platform at least during the process of supplying liquid resin to the release film temporarily arranged on the first platform.

[0007] According to another aspect of the present invention, a method for manufacturing a resin molded product is a method for manufacturing a resin molded product using the above-mentioned resin molding device. The method for manufacturing a resin molded product includes: a step of supplying a mold release film; a step of placing the liquid resin on the mold release film by supplying the liquid resin to the mold release film; a step of closing the mold in a state where the mold release film carrying the liquid resin is arranged on the mold release film; and a step of starting to transport the mold release film from the first module to the second platform at least during the process of supplying the liquid resin to the mold release film temporarily arranged on the first platform.

[0008] Effects of the Invention

[0009] According to the present invention, it is possible to provide a resin molding apparatus and a method for manufacturing a resin molded product by using a liquid resin and capable of reducing the time required for manufacturing each resin molded product. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a top view schematically showing the resin molding apparatus according to the first embodiment.

[0011] Figure 2 This is a partial cross-sectional view schematically showing a part of the first transport mechanism from the side.

[0012] Figure 3 It is a figure which shows schematically the front side of the release film arrangement|positioning part.

[0013] Figure 4 It is a figure which shows schematically the plane of the release film arrangement|positioning part.

[0014] Figure 5 It is a diagram schematically showing a dispenser and a holding mechanism.

[0015] Figure 6 It is a diagram schematically showing a cross section of a resin molded portion before mold clamping.

[0016] Figure 7 It is a diagram schematically showing a cross section of a resin molded portion during mold clamping.

[0017] Fig. 8A This is a flowchart showing the first half of the procedure for conveying a release film in a resin molding apparatus.

[0018] Figure 8B This is a flowchart showing the second half of the procedure for conveying a release film in a resin molding apparatus.

[0019] Fig. 9 This is a flowchart showing the procedure of supplying liquid resin to the release film in the second module.

[0020] Fig.10 This is a diagram for explaining the arrangement of a release film on a stage on which no release film is arranged.

[0021] Fig.11 This is a diagram for explaining the holding of a release film on which a liquid resin is placed.

[0022] Fig.12 This is a diagram for explaining the exchange of the positions of the tables.

[0023] Fig.13 It is a diagram schematically showing the state of each stage when the liquid resin is ejected onto the release film.

[0024] Fig.14 This is a diagram schematically showing a state in which a stage on which a release film on which a liquid resin is placed is raised.

[0025] Fig.15 This is a diagram for explaining how the cycle time for manufacturing a resin molded product changes depending on the conveyance timing of the release film.

[0026] Fig.16 It is a top view schematically showing the resin molding apparatus according to the second embodiment.

[0027] Fig.17 This is a partial cross-sectional view schematically showing a part of the first transport mechanism in the second embodiment from the side.

[0028] Fig.18 A diagram schematically showing a cross section of a resin molded portion before mold clamping in Embodiment 2

[0029] Fig.19 This is a diagram schematically showing a cross section of a resin molded portion during mold clamping in the second embodiment.

[0030] Fig. 20 This is a diagram schematically showing the positional relationship of each part when a release film held by one holding part is placed on a stage of one release film placement part.

[0031] Fig.21 It is a figure which shows typically the positional relationship of each part when the release film held by the other holding part is arranged on the stage of the other release film arrangement part.

[0032] Description of Reference Numerals

[0033] 1 resin molding device, 10 first module, 20 second module, 30 third module, 40 fourth module, 50 first conveying mechanism, 60 second conveying mechanism, 70 control unit, 100 release film supply unit, 200 release film placement unit, 210, 220 exchange mechanism, 211, 221, 510, 520A support unit, 212, 222 platform, 213, 223 plate, 214, 224, 500 moving unit, 215, 225 rail, 230 meter, 250 dispenser, 251 dispenser body, 260 holding mechanism, 300 resin molding unit, 301 Outer frame parts, 305, 355A forming mold, 310 fixed pressure plate, 320, 360A upper mold, 330 movable pressure plate, 340, 370A lower mold, 341, 371A bottom surface parts, 342, 372A side parts, 343, 373A springs, 344, 374A bottom plate, 350A middle plate, 410 substrate supply part, 420 substrate storage part, 430 substrate loading part, 511, 521A holding part, C1 material box, F1 release film, H1, H2, H3, H4 through holes, N1 nozzle, P1 substrate, R1 liquid resin, TC1 tray cover. DETAILED DESCRIPTION

[0034] Hereinafter, an embodiment of one aspect of the present invention (hereinafter also referred to as "the present embodiment") will be described in detail with reference to the accompanying drawings. In addition, the same figure marks are marked on the same or corresponding parts in the figures, and their descriptions are not repeated. In addition, for ease of understanding, the various drawings appropriately omit or exaggerate the schematic depiction of the objects. In addition, in the following description, two directions orthogonal to each other on the horizontal plane are defined as the front-to-back direction and the left-to-right direction, and the vertical direction is defined as the up-down direction. In addition, in this specification, the term "liquid" in the liquid resin means that it is liquid at room temperature and has fluidity.

[0035] [1. Implementation Method 1]

[0036] <1-1. Structure of resin molding device>

[0037] Figure 1 1 is a top view schematically showing a resin molding device 1 according to the first embodiment. The resin molding device 1 is configured to perform resin sealing on a substrate on which electronic components such as semiconductor chips are mounted, thereby manufacturing a resin molded product. In the resin molding device 1, the component mounting surface on which the electronic components are mounted in the substrate is sealed with resin.

[0038] As an example of a substrate, there can be cited semiconductor substrates such as silicon wafers, lead frames, printed wiring substrates, metal substrates, resin substrates, glass substrates, and ceramic substrates. The substrate can also be a carrier for FOWLP (Fan Out Wafer Level Packaging) and FOPLP (Fan Out Panel Level Packaging). The substrate may or may not have wiring applied.

[0039] like Figure 1 As shown, the resin molding device 1 includes a first module 10, a second module 20, a third module 30, a fourth module 40 and a control unit 70. The control unit 70 includes, for example, a CPU (Central Processing Unit), a RAM (Random Access Memory), and a ROM (Read Only Memory). For example, the control unit 70 is configured to control each of the first module 10, the second module 20, the third module 30, and the fourth module 40 according to a control program.

[0040] Each of the first module 10, the second module 20, the third module 30 and the fourth module 40 is detachable from the other modules and replaceable. In the resin molding device 1, the first module 10, the second module 20, the third module 30 and the fourth module 40 can be increased or decreased.

[0041] The first module 10 includes a release film supply unit 100 and a first conveying mechanism 50. The first module 10 is configured to supply a release film. As a material for the release film, a resin material having properties such as heat resistance, release properties, flexibility, and ductility can be used, for example, PTFE (polytetrafluoroethylene), ETFE (ethylene-tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), polypropylene, polystyrene, polyvinylidene chloride, etc. can be used.

[0042] The release film supply unit 100 includes, for example, a roll of release film, a film mounting table, a film clamp, and a cutter (none of which are shown in the figure). A long strip of release film is drawn out from the roll of release film by the film clamp, and the drawn-out release film is placed on the film mounting table. The release film placed on the film mounting table is cut into a desired shape (e.g., a rectangle or a circle) by the cutter, thereby preparing a release film F1 ( Figure 2 The tray cover TC1 (described later) is placed on the prepared release film F1 . The release film F1 and the tray cover TC1 prepared in the release film supply unit 100 are conveyed to the second module 20 by the first conveying mechanism 50 .

[0043] Figure 2 2 is a partial cross-sectional view schematically showing a portion of the first conveying mechanism 50 from the side. Figure 2 As shown, the first conveying mechanism 50 includes a moving part 500, a supporting part 510 and a holding part 511. The moving part 500 has, for example, a columnar shape extending in the up-down direction. The moving part 500 is configured to move along a track laid across the first module 10, the second module 20 and the third module 30. In addition, the moving part 500 is configured to move in the front-back direction in the second module 20. The movement of the moving part 500 is achieved, for example, by a servo motor not shown in the figure.

[0044] The support part 510 has a plate shape, for example. The support part 510 is mounted on the moving part 500 and extends forward from the moving part 500. The support part 510 is configured to move in the vertical direction relative to the moving part 500, for example. The vertical movement of the support part 510 is achieved by, for example, an air cylinder or a servo motor (not shown).

[0045] The holding portion 511 is fixed below the front end of the support portion 510, and holds the tray cover TC1 and the release film F1 at the lower end. The holding portion 511 mechanically holds the tray cover TC1 by using a tray cover chuck (not shown). In addition, the holding portion 511 holds the release film F1 by adsorbing the release film F1 via the tray cover TC1 using a vacuum pump (not shown), and mechanically pressing the release film F1 from the bottom to the top by using a release film chuck (not shown). For example, in the second module 20, as the moving portion 500 moves in the front-to-back direction, the holding portion 511 moves in the front-to-back direction. In addition, the tray cover TC1 is a frame-shaped component, and the size of the release film F1 is larger than the size of the space surrounded by the frame of the tray cover TC1. The shape of the space when viewed from above is, for example, a rectangle.

[0046] Refer again Figure 1 The second module 20 includes a release film placement unit 200, a dispenser 250, and a holding mechanism 260. The second module 20 is configured to place the liquid resin on the release film F1 by supplying the liquid resin to the release film F1.

[0047] Figure 3 It is a figure which shows schematically the front side of the release film arrangement|positioning part 200. As shown in FIG. Figure 4 2 is a diagram schematically showing a plan view of the release film configuration unit 200. Figure 3 and Figure 4 As shown, the release film placement unit 200 includes a meter 230, exchange mechanisms 210, 220, platforms 212, 222, plates 213, 223, and rails 215, 225. The meter 230 is configured to measure the weight of the liquid resin placed on the release film F1.

[0048] The exchange mechanism 210 includes a moving part 214 and a supporting part 211. The moving part 214 is, for example, a block-shaped component that is rectangular in a plan view. The moving part 214 is arranged on a rail 215 extending in the front-rear direction and can move on the rail 215. The movement of the moving part 214 is achieved, for example, by a cylinder. The supporting part 211 is a plate-shaped component that extends upward from the moving part 214. The supporting part 211 moves together with the moving part 214 as the moving part 214 moves.

[0049] The platform 212 is a plate-like component that is rectangular when viewed from above. The platform 212 is mounted on the support portion 211 and extends to the right from the support portion 211. The platform 212 can move in the up-down direction relative to the support portion 211. The movement of the platform 212 is achieved, for example, by a servo motor. A through hole H1 is formed on the platform 212 that passes through in the up-down direction. The shape of the through hole H1 when viewed from above is, for example, a rectangle. The through hole H1 is covered by a plate 213 that is rectangular when viewed from above. That is, the length of each side of the plate 213 is longer than the length of each side of the through hole H1. A release film F1 and a tray cover TC1 are arranged on the plate 213. In addition, the plate 213 is only placed on the platform 212 and is not fixed on the platform 212.

[0050] The platform 212 moves to the top of the meter 230, and the meter 230 passes through the through hole H1 as the platform 212 descends. As a result, the plate 213 is supported by the meter 230, and the plate 213 floats from the platform 212. In a state where the plate 213 is supported by the meter 230, the liquid resin is supplied to the release film F1 on the plate 213 by the dispenser 250. The weight of the liquid resin placed on the release film F1 is measured by the meter 230, and an appropriate amount of the liquid resin is supplied to the release film F1.

[0051] The exchange mechanism 220 includes a moving part 224 and a support part 221. The moving part 224 is, for example, a block-shaped component that is rectangular in a plan view. The moving part 224 is arranged on a rail 225 extending in the front-rear direction and can move on the rail 225. The movement of the moving part 224 is achieved, for example, by a cylinder. The support part 221 is a plate-shaped component that extends upward from the moving part 224. The support part 221 moves together with the moving part 224 as the moving part 224 moves.

[0052] The platform 222 is a plate-like component that is rectangular when viewed from above. The platform 222 is mounted on the support portion 221 and extends to the left from the support portion 221. The platform 222 can move in the up-down direction relative to the support portion 221. The movement of the platform 222 is achieved, for example, by a servo motor. A through hole H2 is formed on the platform 222 that passes through in the up-down direction. The shape of the through hole H2 when viewed from above is, for example, a rectangle. The through hole H2 is covered by a plate 223 that is rectangular when viewed from above. That is, the length of each side of the plate 223 is longer than the length of each side of the through hole H2. A release film F1 and a tray cover TC1 are arranged on the plate 223. In addition, the plate 223 is only placed on the platform 222 and is not fixed on the platform 222.

[0053] The platform 222 moves to the top of the meter 230, and the meter 230 passes through the through hole H2 as the platform 222 descends. As a result, the plate 223 is supported by the meter 230, and the plate 223 floats from the platform 222. In a state where the plate 223 is supported by the meter 230, the liquid resin is supplied to the release film F1 on the plate 223 by the dispenser 250. The weight of the liquid resin placed on the release film F1 is measured by the meter 230, and an appropriate amount of liquid resin is supplied to the release film F1.

[0054] Thus, in the release film placement unit 200, the plate (plate 213 or plate 223) placed on the meter 230 is changed by controlling the switching mechanisms 210 and 220. Thus, liquid resin can be supplied to the release film F1 placed on the plate 213 and the release film F1 placed on the plate 223 in sequence.

[0055] Figure 5 2 is a diagram schematically showing the distributor 250 and the holding mechanism 260. Figure 5 As shown, the dispenser 250 includes a dispenser body 251 and a cartridge C1. The cartridge C1 stores liquid resin. The dispenser body 251 includes a plunger (not shown). The liquid resin stored in the cartridge C1 is pressed from the upper side by the plunger, and the liquid resin is ejected from the nozzle N1 of the cartridge C1. In the dispenser 250, the cartridge C1 is replaceably mounted on the dispenser body 251 in a manner that the length direction of the cartridge C1 is along the up-down direction.

[0056] The holding mechanism 260 is configured to hold the used cartridge C1 and the unused cartridge C1. In this example, the unused cartridge C1 is held in the through hole H3. For example, the used cartridge C1 included in the dispenser 250 is inserted into the through hole H4 and held by the holding mechanism 260. Then, the used cartridge C1 is automatically removed from the dispenser body 251. After that, for example, the unused cartridge C1 held in the through hole H3 is automatically connected to the dispenser body 251. Thus, the cartridge C1 is automatically replaced. According to the second module 20, since the used cartridge C1 and the unused cartridge C1 are held by the holding mechanism 260, the cartridge C1 in the dispenser 250 can be easily replaced.

[0057] Refer again Figure 1 The fourth module 40 includes a substrate supply unit 410, a substrate storage unit 420, a substrate loading unit 430, and a second conveying mechanism 60. The substrate supply unit 410 is configured to supply a substrate before resin sealing to the substrate loading unit 430. The substrate storage unit 420 is configured to store a substrate (resin molded product) that has been resin sealed. The substrate loading unit 430 moves in the front-to-back direction between a position corresponding to the substrate supply unit 410 and a position corresponding to the substrate storage unit 420. The second conveying mechanism 60 is configured to move in the left-right direction and the front-to-back direction in the fourth module 40 and the third module 30. The second conveying mechanism 60, for example, holds the substrate before resin sealing arranged in the substrate loading unit 430 and transports it to the third module 30, and transports the substrate that has been resin sealed from the third module 30 to the fourth module 40.

[0058] The third module 30 includes a resin molding unit 300. In the resin molding unit 300, resin sealing (resin molding) of the component mounting surface of the substrate is performed by using a release film F1 on which a liquid resin is placed.

[0059] Figure 6 It is a diagram schematically showing a cross section of the resin molded portion 300 before mold clamping. Figure 7 Schematically shows a cross section of the resin molded portion 300 in mold clamping. Figure 6 and Figure 7 As shown, the resin molded part 300 includes an outer frame member 301, a fixed platen 310, a movable platen 330, and a molding die 305. An example of the molding die 305 is a die.

[0060] The outer frame member 301 is composed of a connecting rod (column) or a retaining frame (plate member). When the outer frame member 301 is composed of connecting rods, the outer frame member 301 is composed of four connecting rods arranged at four corners. The four connecting rods extend in the up-down direction respectively. When the outer frame member 301 is composed of retaining frames, the outer frame member 301 is composed of two retaining frames arranged on the left and right. The wide surface of one of the two retaining frames faces the wide surface of the other of the two retaining frames in the left-right direction.

[0061] The fixed platen 310 is a plate-shaped member that is rectangular in a top view. The fixed platen 310 is fixed to the upper portion of the outer frame member 301. The movable platen 330 is arranged on the inner side of the outer frame member 301 below the fixed platen 310. The movable platen 330 is configured to move in the up-down direction. The movement of the movable platen 330 is achieved, for example, by a mold clamping mechanism that is not shown. The mold clamping mechanism is achieved, for example, by a combination of a servo motor and a ball screw, a combination of a hydraulic cylinder and a connecting rod mechanism, and the like.

[0062] The forming mold 305 includes an upper mold 320 and a lower mold 340. The forming mold 305 is arranged between the fixed platen 310 and the movable platen 330 on the inner side of the outer frame member 301. More specifically, the upper mold 320 is fixed to the lower surface of the fixed platen 310, and the lower mold 340 is fixed to the upper surface of the movable platen 330. As the movable platen 330 moves in the up-down direction, the lower mold 340 also moves in the up-down direction together with the movable platen 330. As the movable platen 330 rises, the forming mold 305 is closed.

[0063] The lower mold 340 includes a bottom plate 344, a bottom surface component 341, a spring 343, and a side component 342. The bottom plate 344 is a plate-shaped component that is rectangular when viewed from above. The bottom plate 344 is fixed to the upper surface of the movable platen 330. The bottom surface component 341 is a block-shaped component that is rectangular when viewed from above. The bottom surface component 341 is fixed to the upper surface of the bottom plate 344 and is located in the approximate center of the bottom plate 344. The side component 342 is a frame-shaped component that surrounds the bottom surface component 341. The side component 342 is fixed to the bottom surface component 341 via a plurality of springs 343.

[0064] The upper surface of the side member 342 is located above the upper surface of the bottom member 341, and a recess (cavity) is formed on the upper surface of the lower mold 340. A release film F1 carrying a liquid resin R1 is arranged in the recess. A substrate P1 is arranged on the lower surface of the upper mold 320. The mold 305 is closed in a state where the release film F1 carrying a liquid resin R1 is arranged in the recess of the lower mold 340 and the substrate P1 is arranged on the lower surface of the upper mold 320, thereby sealing the component mounting surface of the substrate with resin.

[0065] <1-2. Release film conveying operation and liquid resin supply operation>

[0066] Fig. 8A This is a flowchart showing the first half of the conveyance procedure of the release film F1 in the resin molding apparatus 1 . Figure 8B This is a flowchart showing the second half of the conveyance procedure of the release film F1 in the resin molding apparatus 1 . Fig. 8A and Figure 8B The processing shown in the flowchart is repeatedly executed by the control unit 70 during the operation of the resin molding device 1. In addition, one cycle of the processing shown in the flowchart corresponds to the molding cycle of the resin molded product. Fig. 8A and Figure 8B In the example, “MD” stands for module.

[0067] Reference Fig. 8A , the control unit 70 determines whether the preparation of the release film F1 in the first module 10 is completed (step S100). That is, the control unit 70 determines whether the release film F1 is prepared by cutting a part of the roll release film, and whether the tray cover TC1 is arranged on the release film F1. If it is determined that the preparation of the release film F1 is not completed ("No" in step S100), the control unit 70 waits until the preparation of the release film F1 is completed.

[0068] On the other hand, if it is determined that the preparation of the release film F1 is completed ("Yes" in step S100), the control unit 70 controls the first conveying mechanism 50 to hold the release film F1 and the tray cover TC1 prepared in the first module 10 (step S110). The control unit 70 controls the first conveying mechanism 50 to start conveying the release film F1 and the tray cover TC1 from the first module 10 to the second module 20 (step S120). That is, the movement of the holding unit 511 included in the first conveying mechanism 50 starts.

[0069] Although the details will be described later, in the first embodiment, for example, the conveyance of the release film F1 from the first module 10 to the second module 20 in the molding cycle of the second and subsequent resin molded products is started during the process of supplying the liquid resin R1 to the release film F1 in the molding cycle of the previous resin molded product. Thus, compared with the case where the conveyance of the new release film F1 from the first module 10 to the second module 20 is started after the supply of the liquid resin R1 to the release film in the molding cycle of the previous resin molded product is completed, the time required for manufacturing each resin molded product can be shortened.

[0070] After that, the control unit 70 determines whether the movement of the holding unit 511 to the upper side of the platform 212 or 222 where the release film F1 is not arranged is completed, and determines whether the supply of the liquid resin R1 to the release film F1 is completed when the release film F1 is arranged on the other platform (step S130). If it is determined that the condition in step S130 is not satisfied, the control unit 70 waits until the condition in step S130 is satisfied.

[0071] On the other hand, if it is determined that the condition in step S130 is satisfied, the control unit 70 arranges the release film F1 on the platform (platform 212 or platform 222) located below the first conveying mechanism 50 (holding unit 511) (step S140). More specifically, the holding unit 511 of the first conveying mechanism 50 is lowered, and the release film F1 is in contact with the plate (platform 212 or plate 213) on the platform. The adsorption and mechanical holding of the release film F1 are released, and the release film F1 is arranged on the plate. In addition, the tray cover TC1 is arranged on the release film F1.

[0072] Reference Figure 8B If the release film F1 is disposed on the platform, the control unit 70 determines whether the current molding cycle is the molding cycle of the second and subsequent resin molded products (step S150). If it is determined to be the molding cycle of the first resin molded product ("No" in step S150), the process of step S100 is executed again.

[0073] On the other hand, when it is determined that it is the molding cycle of the second or later resin molded product ("Yes" in step S150), the control unit 70 controls the first conveying mechanism 50 to start moving above the platform different from the platform on which the release film F1 is placed in step S140, among the platforms 212 and 222 (step S155). That is, the movement of the holding unit 511 included in the first conveying mechanism 50 starts.

[0074] The control unit 70 determines whether the movement of the holding unit 511 to the upper side of the platform 212, 222 different from the platform on which the release film F1 is placed in step S140 is completed (step S160). If it is determined that the movement of the holding unit 511 is not completed ("No" in step S160), the control unit 70 waits until the movement of the holding unit 511 is completed.

[0075] On the other hand, if it is determined that the movement of the holding portion 511 is completed ("Yes" in step S160), the control portion 70 determines whether the resin molding portion 300 of the third module 30 is in the resin molding process (step S170). If it is determined that the resin molding portion 300 is in the resin molding process ("Yes" in step S170), the control portion 70 waits until the resin molding of the resin molding portion 300 is completed.

[0076] On the other hand, if it is determined that resin molding is not performed in the resin molding unit 300 ("No" in step S170), the control unit 70 controls the first conveying mechanism 50 to hold the release film F1 disposed on a different platform from the platform on which the release film F1 is disposed in step S140, among the platforms 212 and 222 (step S180). In step S180, liquid resin R1 is placed on the release film F1 held by the first conveying mechanism 50.

[0077] The control unit 70 controls the first conveying mechanism 50 to convey the release film F1 from the second module 20 to the third module 30 (step S190 ). The release film F1 conveyed from the second module 20 to the third module 30 is disposed on the lower mold 340 of the resin molding unit 300 .

[0078] Fig. 9 1 is a flowchart showing a procedure for supplying the liquid resin R1 to the release film F1 in the second module 20. The process shown in this flowchart is repeatedly executed by the control unit 70 during the operation of the resin molding apparatus 1.

[0079] Reference Fig. 9 The control unit 70 determines whether the release film F1 is disposed on the platform 212 or 222 that is not disposed with the release film F1, and determines whether the release film F1 is held by the first conveying mechanism 50 when the release film F1 is disposed on the other platform (step S200). If it is determined that the condition in step S200 is not satisfied, the control unit 70 waits until the condition in step S200 is satisfied.

[0080] Fig.10 2 is a diagram for explaining the configuration of a release film F1 on a platform that is not configured with the release film F1. In this example, the release film F1 is not configured on the platform 222, and the release film F1 is configured on the platform 212. In addition, the length of the support portion 510 in the front-to-back direction is longer than the length from the rear end portion of the platform 222 to the front end portion of the platform 212. By the moving portion 500 ( Figure 2 ) moves in the front-to-back direction, and the holding portion 511 moves between above the platform 222 and above the platform 212.

[0081] Reference Fig.10 The holding portion 511 of the first conveying mechanism 50 holding the release film F1 without the liquid resin R1 is moved to the top of the platform 222. In this state, the holding portion 511 is lowered, and the release film F1 and the tray cover TC1 are arranged on the platform 222 via the plate 223. Fig. 9 In step S200, it is determined that the placement of the release film F1 on the stage where the release film F1 is not placed has been completed.

[0082] Fig.11This is a diagram for explaining the holding of the release film F1 on which the liquid resin R1 is placed. Fig.11 After the release film F1 and the tray cover TC1 are placed on the platform 222, the holding part 511 of the first conveying mechanism 50 moves to the top of the platform 212. In this state, the holding part 511 descends to hold the release film F1 and the tray cover TC1 placed on the platform 212. Then, the holding part 511 rises. Fig. 9 In step S200 , it is determined that the release film F1 is held by the first conveying mechanism 50 . In addition, the release film F1 held by the holding unit 511 is conveyed from the second module 20 to the third module 30 .

[0083] In the second module 20, the release film F1 without the liquid resin R1 is placed on one platform and the release film F1 with the liquid resin R1 is transported from the other platform to the third module 30 in a series of operations. This can shorten the time required for manufacturing each resin molded product.

[0084] Reference again Fig. 9 If it is determined that the condition in step S200 is satisfied, the control unit 70 controls the respective exchange mechanisms 210, 220 to exchange the position of the platform 222 with the position of the platform 212 (step S210).

[0085] Fig.12 This is a diagram for explaining the exchange of platform positions. Fig.12 In this example, the release film F1 disposed on the platform 212 has been transported to the third module 30. Immediately after the transport, the platform 212 is located above the meter 230. If the positions of the platforms are exchanged by the exchange mechanisms 210 and 220, the platform 222 is located above the meter 230. That is, the platform 222 on which the release film F1 not carrying the liquid resin R1 is disposed is located above the meter 230. In the second module 20, since the positions of the platforms are exchanged by the exchange mechanism, the liquid resin R1 can be supplied to the release film F1 even if the movable range of the dispenser 250 is not large.

[0086] Refer again Fig. 9 , the control unit 70 controls the exchange mechanism 210 or the exchange mechanism 220 to lower the platform 212 or 222 on which the release film F1 without the liquid resin R1 is placed and which is located above the meter 230 (step S220). As a result, the plate (plate 223 or plate 213) placed on the lowered platform is supported by the meter 230. In a state where the plate is supported by the meter 230, the control unit 70 controls the dispenser 250 to move to above the release film F1 placed on the plate supported by the meter 230, and controls the dispenser 250 to spray the liquid resin R1 onto the release film F1 (step S230).

[0087] Fig.13 A diagram schematically showing the state of each platform when a liquid resin is sprayed onto a release film. Fig.13 As shown, when the liquid resin R1 is ejected onto the release film F1 disposed on the platform 212, the platform 212 descends, the meter 230 passes through the through hole H1 of the platform 212, and the plate 213 disposed on the platform 212 is supported by the meter 230. In this state, the liquid resin R1 is supplied to the release film F1 by the dispenser 250. The liquid resin R1 is supplied to the release film F1 disposed on the plate supported by the meter 230, and since the weight measured by the meter 230 is not affected by the movement of the platform 212, the weight of the liquid resin R1 supplied to the release film F1 is measured relatively accurately.

[0088] Refer again Fig. 9 When the supply of the liquid resin R1 to the release film F1 is completed, the control unit 70 controls the exchange mechanism 210 or the exchange mechanism 220 to raise the platform on which the release film F1 carrying the liquid resin R1 is arranged (step S240).

[0089] Fig.14 Schematically shows a state in which a platform on which a release film F1 carrying a liquid resin R1 is arranged is raised. Fig.14 As shown, the stage 212 on which the release film F1 on which the liquid resin R1 is placed is raised, and the plate 213 is placed on the stage 212 again.

[0090] Thus, in the resin molding apparatus 1 of the first embodiment, the second module 20 includes the platforms 212 and 222. Assuming that the second module 20 has only one platform, in the process of supplying the liquid resin R1 to the release film F1 arranged on the platform, the new release film F1 cannot be conveyed from the first module 10 to the second module 20. This is because the first conveying mechanism 50 holding the new release film F1 cannot hold the release film F1 arranged on the platform, and also cannot arrange the new release film F1 on the platform.

[0091] In the resin molding apparatus 1 of the first embodiment, since the second module 20 includes the platforms 212 and 222, for example, during the supply of liquid resin R1 to the release film F1 disposed on one of the platforms 212 and 222, it is possible to start conveying a new release film F1 from the first module 10 to the second module 20. As a result, according to the resin molding apparatus 1, the time required for manufacturing each resin molded product can be shortened compared to the case where conveying the release film F1 from the first module 10 to the second module 20 is started after the supply of liquid resin to the release film disposed on the platform is completed.

[0092] <1-3. Cycle Time in Manufacturing of Resin Molded Products>

[0093] Fig.15 This is a diagram for explaining how the cycle time for manufacturing a resin molded product changes according to the conveying timing of the release film F1. In addition, the cycle time refers to the approximate time required for manufacturing each product. Fig.15 , the horizontal axis represents time. Each of (1) to (7) in the figure represents the time required for the following process.

[0094] (1) Prepare release film F1 by cutting the roll release film

[0095] (2) Place tray cover TC1 on release film F1

[0096] (3) Conveying the release film F1 from the first module 10 to the second module 20

[0097] (4) Liquid resin R1 is sprayed onto the release film F1 in the second module 20

[0098] (5) The release film F1 carrying the liquid resin R1 is placed on the lower mold 340.

[0099] (6) Resin molding (molding)

[0100] (7) The resin-molded substrate is taken out from the molding die 305 and the substrate before resin molding is set in the upper die 320

[0101] In this example, the time required for (4) is longer than the time required for (6). In addition, the total time required for (5), (6), and (7) is longer than the time required for (4). In addition, the total time required for (5), (6), and (7) is shorter than the total time required for (3), (4), and (5).

[0102] exist Fig.15 In FIG. 1 , the first row indicates the molding cycle of the first resin molded product. The first row is common to both the hypothetical system (described later) and the first embodiment.

[0103] The second row represents the molding cycle of the second resin molded product in the assumed method. In the assumed method, in the process of supplying liquid resin R1 to the release film F1 arranged on one platform, the conveyance of new release film F1 from the first module 10 to the second module 20 does not start. In the assumed method, the conveyance of new release film F1 from the first module 10 to the second module 20 is started only after the supply of liquid resin R1 to the release film F1 arranged on one platform is completed. Therefore, in the assumed method, after (5) in the first molding cycle is completed at time t3, (3) in the second molding cycle is performed. At this time, the cycle time for manufacturing the resin molded product is the sum of the time required for (3), (4), and (5).

[0104] The third row represents the second molding cycle of the resin molded product in the present embodiment 1. As described above, in the present embodiment 1, the new mold release film F1 is transported from the first module 10 to the second module 20 during the process of supplying the liquid resin R1 to the mold release film F1 arranged on one platform. Therefore, at time t2, before the end of (4) in the first molding cycle, (3) in the second molding cycle is performed. Then, in response to the end of (4) in the first molding cycle at time t2, (4) in the second molding cycle is started. At this time, the cycle time for manufacturing the resin molded product is the sum of the time required for each of (5)(6)(7). In addition, in this example, the period from the start time of (6) (for example, time t3) to the start time of (6) of the next cycle (for example, time t5) is the cycle time.

[0105] Thus, in the resin molding apparatus 1 of the first embodiment, the time required for (4) is longer than the time required for (6), but the supply of the liquid resin R1 to the release film F1 in the second module 20 does not become a time bottleneck. Therefore, according to the resin molding apparatus 1, even if it takes some time to supply the liquid resin R1 to the release film F1, the influence on the time required for manufacturing each resin molded product can be suppressed.

[0106] In addition, in the resin molding device 1 of this embodiment 1, since the cycle time for manufacturing the resin molded product depends on the time required for (6), even if it takes some time to supply the liquid resin R1 to the release film F1, the impact on the time required for manufacturing each resin molded product can be suppressed.

[0107] <1-4. Features>

[0108] As described above, in the resin molding apparatus 1 of the first embodiment, the conveyance of the release film F1 from the first module 10 to the other platform is started at least during the process of supplying the liquid resin R1 to the release film F1 temporarily arranged on one platform. Therefore, according to the resin molding apparatus 1, compared with the case where the conveyance of the release film F1 from the first module 10 to the other platform is started only after the supply of the liquid resin R1 to the release film F1 temporarily arranged on one platform is completed, the time required for manufacturing each resin molded product can be shortened.

[0109] In addition, the release film F1 is an example of the "release film" in the present invention. The first module 10 is an example of the "first module" in the present invention. The liquid resin R1 is an example of the "liquid resin" in the present invention. The second module 20 is an example of the "second module" in the present invention. The forming mold 305 is an example of the "forming mold" in the present invention. The third module 30 is an example of the "third module" in the present invention. The platforms 212 and 222 are examples of the "first platform" and the "second platform" in the present invention, respectively. The first conveying mechanism 50 is an example of the "conveying mechanism" in the present invention.

[0110] The structure implemented by the exchange mechanism 210, 220 is an example of the "exchange mechanism" in the present invention. The distributor 250 is an example of the "distributor" in the present invention. The material box C1 is an example of the "material box" in the present invention. The holding mechanism 260 is an example of the "holding mechanism" in the present invention. The meter 230 is an example of the "meter" in the present invention. The through holes H1, H2 are each an example of the "through hole" in the present invention. Each of the plates 213, 223 is an example of the "plate" in the present invention.

[0111] [2. Implementation Method 2]

[0112] In the first embodiment, in one molding cycle, one release film F1 is supplied to the first module 10, liquid resin R1 is supplied to the release film F1 in the second module 20, and resin molding using one release film F1 is performed in the third module 30. However, in one molding cycle, the number of release films F1 processed simultaneously in each module is not limited thereto. For example, in one molding cycle, two or more release films F1 may be processed simultaneously in each module.

[0113] In the resin molding device 1A of the second embodiment, two release films F1 are processed simultaneously in each module. Due to such a characteristic, the resin molding device 1 of the first embodiment and the resin molding device 1A of the second embodiment have a difference in structure. However, in the parts not related to such a characteristic, the resin molding device 1 of the first embodiment and the resin molding device 1A of the second embodiment have substantially the same structure. In addition, the following description will focus on the parts different from the first embodiment, and the parts substantially the same as the first embodiment will not be repeated.

[0114] <2-1. Structure of resin molding device>

[0115] Fig.16 1 is a top view schematically showing a resin molding device 1A according to Embodiment 2. The resin molding device 1A is configured to perform resin sealing on a substrate on which electronic components such as semiconductor chips are mounted, thereby manufacturing a resin molded product. In the resin molding device 1A, the component mounting surface on which the electronic components are mounted in the substrate is sealed with resin.

[0116] like Fig.16 As shown, the resin molding device 1A includes a first module 10A, a second module 20A, a third module 30A, a fourth module 40A, and a control unit 70A. The control unit 70A includes, for example, a CPU, a RAM, and a ROM. For example, the control unit 70A is configured to control each of the first module 10A, the second module 20A, the third module 30A, and the fourth module 40A according to a control program.

[0117] Each of the first module 10A, the second module 20A, the third module 30A and the fourth module 40A is detachable from the other modules and replaceable. In the resin molding apparatus 1A, the first module 10A, the second module 20A, the third module 30A and the fourth module 40A can be increased or decreased.

[0118] The first module 10A includes two release film supply units 100A and a first conveying mechanism 50A. The two release film supply units 100A each have substantially the same structure as the release film supply unit 100 in the first embodiment. The two release film supply units 100A are arranged, for example, in a vertical direction. Two release films F1 are supplied simultaneously by the two release film supply units 100A.

[0119] Fig.17 2 is a partial cross-sectional view schematically showing a portion of the first conveying mechanism 50A from the side. Fig.17As shown, the first conveying mechanism 50A includes a moving part 500A, supporting parts 510A, 520A, and holding parts 511A, 521A. The moving part 500A, the supporting part 510A, and the holding part 511A have substantially the same structures as the moving part 500, the supporting part 510, and the holding part 511 in the above-mentioned embodiment 1, respectively. The first conveying mechanism 50A is different from the first conveying mechanism 50 in the above-mentioned embodiment 1 in that it includes a supporting part 520A and a holding part 521A.

[0120] The support part 520A and the holding part 521A have substantially the same structures as the support part 510 and the holding part 511 in the above-mentioned embodiment 1. The support part 520A is attached to the moving part 500A and is located below the support part 510A. The holding parts 511A and 521A hold the release films F1 respectively, and two release films F1 are conveyed simultaneously.

[0121] Refer again Fig.16 The second module 20 includes release film placement parts 200X and 200Y, two dispensers 250, and two holding mechanisms 260. The release film placement parts 200X and 200Y each have substantially the same structure as the release film placement part 200 in the above-mentioned embodiment 1. Each release film placement part 200X and 200Y is configured to place the liquid resin on the release film F1 by supplying the liquid resin to the release film F1.

[0122] The fourth module 40A includes a substrate supply unit 410A, a substrate storage unit 420A, two substrate loading units 430A, and a second conveying mechanism 60A. The substrate supply unit 410A is configured to supply two substrates before resin sealing to the substrate loading unit 430A at a time. The substrate storage unit 420A is configured to store two substrates (resin molded products) that have been resin-sealed at a time. Each substrate loading unit 430A is configured to move in the front-to-back direction between a position corresponding to the substrate supply unit 410A and a position corresponding to the substrate storage unit 420A. The second conveying mechanism 60A is configured to move in the left-right direction and the front-to-back direction in the fourth module 40A and the third module 30A. The second conveying mechanism 60A, for example, holds two substrates before resin sealing arranged in the two substrate loading units 430A and transports them to the third module 30A, and transports the two substrates that have been resin-sealed from the third module 30A to the fourth module 40A.

[0123] The third module 30A includes a resin molding unit 300A. In the resin molding unit 300A, resin sealing (resin molding) of the component mounting surfaces of the two substrates is performed using two release films F1 on which liquid resin is placed.

[0124] Fig.18 It is a diagram schematically showing a cross section of the resin molded portion 300A before mold clamping. Fig.193 is a diagram schematically showing a cross section of the resin molded portion 300A in mold clamping. Fig.18 and Fig.19 As shown, the resin molding part 300A includes an outer frame member 301A, a fixed platen 310A, a movable platen 330A, and molding dies 305A and 355A. The outer frame member 301A, the fixed platen 310A, and the movable platen 330A have substantially the same structures as the outer frame member 301, the fixed platen 310, and the movable platen 330 in the first embodiment.

[0125] The resin molded portion 300A in the second embodiment is different from the resin molded portion 300 in the first embodiment in that it includes two molding dies. The molding dies 305A and 355A are arranged between the fixed platen 310A and the movable platen 330A on the inner side of the outer frame member 301A. Each molding die 305A and 355A has substantially the same structure as the molding die 305 in the first embodiment.

[0126] More specifically, the mold 305A includes an upper mold 320A and a lower mold 340A, and the lower mold 340A includes a bottom surface member 341A, a side member 342A, a spring 343A, and a bottom plate 344A. The upper mold 320A and the lower mold 340A have substantially the same structures as the upper mold 320 and the lower mold 340 in the above-mentioned embodiment 1, respectively. In addition, the bottom surface member 341A, the side member 342A, the spring 343A, and the bottom plate 344A have substantially the same structures as the bottom surface member 341, the side member 342, the spring 343, and the bottom plate 344 in the above-mentioned embodiment 1, respectively.

[0127] In addition, the molding die 355A includes an upper die 360A and a lower die 370A, and the lower die 370A includes a bottom member 371A, a side member 372A, a spring 373A, and a bottom plate 374A. The upper die 360A and the lower die 370A have substantially the same structure as the upper die 320 and the lower die 340 in the first embodiment. In addition, the bottom member 371A, the side member 372A, the spring 373A, and the bottom plate 374A have substantially the same structure as the bottom member 341, the side member 342, the spring 343, and the bottom plate 344 in the first embodiment.

[0128] An intermediate plate 350A is disposed between the forming mold 305A and the forming mold 355A. The intermediate plate 350A is configured to move in the up-down direction. The movement of the intermediate plate 350A is performed, for example, in conjunction with the movement of the movable platen 330A. The intermediate plate 350A also rises in conjunction with the rise of the movable platen 330A. The rising speed of the intermediate plate 350A is, for example, 1 / 2 of the rising speed of the movable platen 330A. As the movable platen 330A rises, the intermediate plate 350A also rises, and the forming molds 305A and 355A are respectively closed.

[0129] <2-2. Operation of configuring release film on the platform>

[0130] The two release films F1 held by the first transport mechanism 50A are sequentially placed one each on a stage where no release film F1 is placed in the release film placement section 200X and a stage where no release film F1 is placed in the release film placement section 200Y.

[0131] Fig. 20 2 is a diagram schematically showing the positional relationship of each part when the release film F1 held by the holding part 511A is arranged on the platform 222X of the release film arrangement part 200X. Fig. 20 As shown, in this example, the platform 222X is located below the holding portion 511A, and the position of the platform 222X corresponds to the position of the holding portion 511A.

[0132] Fig.21 2 is a diagram schematically showing the positional relationship of each part when the release film F1 held by the holding part 521A is arranged on the platform 222Y of the other release film arrangement part 200Y. Fig.21 As shown, in this example, the platform 222Y is located below the holding portion 521A, and the position of the platform 222Y corresponds to the position of the holding portion 521A.

[0133] Thus, since the platform of one release film placement section corresponds to the holding section 511A and the platform of the other release film placement section corresponds to the holding section 521A, the release film F1 can be transferred relatively easily between the platforms and the holding sections.

[0134] In addition, the first conveying mechanism 50A sequentially holds the release film F1 to which the liquid resin R1 is supplied in the release film arrangement section 200X and the release film F1 to which the liquid resin R1 is supplied in the release film arrangement section 200Y, and conveys them to the third module 30A. The release film F1 held by the holding section 511A is arranged on the lower mold 340A, and the release film F1 held by the holding section 521A is arranged on the lower mold 370A.

[0135] <2-3. Features>

[0136] As described above, according to the resin molding apparatus 1A of the second embodiment, since two release films F1 are processed in parallel in each module, the manufacturing efficiency of the resin molded product can be improved.

[0137] In addition, the first module 10A is an example of the "first module" in the present invention. The release film supply part 100A is an example of the "first unit" in the present invention. The second module 20A is an example of the "second module" according to the present invention. The release film configuration parts 200X and 200Y are respectively examples of the "second unit" in the present invention. The third module 30A is an example of the "third module" in the present invention. The structure including the forming mold 305A and the intermediate plate 350A, and the structure including the forming mold 355A and the movable pressing plate 330A are respectively examples of the "third unit" in the present invention. The first conveying mechanism 50A is an example of the "conveying mechanism" in the present invention.

[0138] The holding portion 511 is an example of the "first holding portion" of the present invention. The holding portion 521 is an example of the "second holding portion" of the present invention. Each of the platforms 222X and 222Y is an example of the "first platform" of the present invention.

[0139] [3. Other embodiments]

[0140] The scheme of the above-mentioned embodiment is not limited to the above-mentioned embodiment. For example, at least a part of the structure of any one embodiment and at least a part of the structure of any other embodiment can be combined. Hereinafter, an example of another embodiment to which the scheme of the above-mentioned embodiment can be applied is described.

[0141] <3-1>

[0142] In the above-mentioned embodiments 1 and 2, the positions of the platforms included in the release film configuration section 200, 200X, and 200Y are configured to be interchangeable by an interchange mechanism. However, the positions of the platforms do not necessarily have to be interchangeable. For example, the positions of the platforms may be fixed. In this case, the dispenser 250 can be moved above each platform. In addition, in this case, two retaining portions 511, 511A, and 521A arranged in the front-to-back direction may be respectively provided on the support portions 510, 510A, and 520A of the first conveying mechanism 50 and 50A. Thus, for example, the release film F1 on which the liquid resin R1 is not placed can be configured and the release film F1 on which the liquid resin R1 is placed can be retained at the same time.

[0143] <3-2>

[0144] In the above-mentioned first and second embodiments, the liquid resin R1 is supplied to the release film F1 in a state where the release film F1 is supported by the meter 230. However, the supply of the liquid resin R1 to the release film F1 may not necessarily be performed in a state where the release film F1 is supported by the meter 230. For example, the liquid resin R1 may be supplied to each release film F1 in a state where the release film F1 is arranged on each stage. In this case, for example, a through hole may not be formed on each stage, and a plate may not be arranged on each stage.

[0145] <3-3>

[0146] In the above-mentioned embodiments 1 and 2, the two platforms respectively included in the release film placement parts 200, 200X, and 200Y are arranged in a manner arranged in the front-to-back direction. However, the two platforms do not necessarily have to be arranged in the front-to-back direction. For example, the two platforms may be arranged in the left-to-right direction.

[0147] <3-4>

[0148] In the second embodiment, the two release film supply units 100A, the holding units 511A and 521A in the first conveying mechanism 50A, and the molding molds 305A and 355A in the resin molding unit 300A are arranged in a vertical direction. However, these do not necessarily need to be arranged in the vertical direction, and may be arranged in a horizontal direction, for example.

[0149] <3-5>

[0150] In the above-mentioned Embodiments 1 and 2, each module included in the resin molding apparatus 1 and 1A is controlled by the control unit 70 and 70A. The control unit 70 and 70A may be realized by a plurality of computers, and each module may be controlled by a different computer.

[0151] <3-6>

[0152] exist Figure 8B In the flowchart shown, the processing of step S170 and the processing of step S180 may be performed in the opposite order. That is, the first conveying mechanism 50 may hold the release film F1 carrying the liquid resin R1 first, regardless of whether the resin molding unit 300 is in the process of molding the resin.

[0153] <3-7>

[0154] about Fig. 8A In step S130 of the flowchart shown, when the release film F1 is disposed on the other platform, the release film F1 held by the first transport mechanism 50 may be disposed on the platform where no release film F1 is disposed before supply of the liquid resin R1 to the release film F1 is completed.

[0155] <3-8>

[0156] In the above-mentioned embodiment 2, two release films F1 are processed simultaneously in one forming cycle. However, the number of release films F1 processed in one forming cycle may be more than three. In this case, for example, the first module 10A may include more than three release film supply parts 100A, and the first conveying mechanism 50A may include more than three holding parts for holding the release films F1. In addition, the second module 20A may include more than three release film configuration parts 200, and the resin forming part 300 may include more than three forming molds. In addition, the substrate mounting part 430A may also be a structure capable of holding more than three substrates, and the second conveying mechanism 60A may also be a structure capable of holding more than three substrates.

[0157] The above is an illustrative description of the embodiments of the present invention. That is, for the purpose of illustrative description, the detailed description and the drawings are disclosed. Therefore, the components recorded in the detailed description and the drawings sometimes include components that are not essential for solving the problem. Therefore, although these non-essential components are described in the detailed description and the drawings, it should not be immediately determined that these non-essential components are essential.

[0158] In addition, the above-mentioned embodiment is only an example of the present invention in all aspects. The above-mentioned embodiment can be variously improved or changed within the scope of the present invention. That is, when implementing the present invention, a specific structure can be appropriately adopted corresponding to the embodiment.

[0159] [4. Note]

[0160] In this specification, multiple technical solutions including at least the following technologies are disclosed.

[0161] <Technology 1>

[0162] (constitute)

[0163] A resin molding device comprising:

[0164] The first module supplies a release film;

[0165] a second module for placing the liquid resin on the release film by supplying the liquid resin to the release film; and

[0166] The third module includes a forming mold, and the resin is formed by clamping the forming mold in a state where the mold release film carrying the liquid resin is arranged on the forming mold.

[0167] The second module includes a first platform and a second platform,

[0168] The release film can be arranged on the first platform and the second platform respectively.

[0169] The resin molding apparatus further includes a conveying mechanism that starts conveying the release film from the first module to the second stage at least during a process of supplying the liquid resin to the release film temporarily disposed on the first stage.

[0170] (Effects, etc.)

[0171] In the resin molding device, the mold release film is conveyed from the first module to the second platform at least during the process of supplying the liquid resin to the mold release film temporarily arranged on the first platform. Therefore, according to the resin molding device, the time required for manufacturing each resin molded product can be shortened compared with the case where the mold release film is conveyed from the first module to the second platform only after the liquid resin is supplied to the mold release film temporarily arranged on the first platform.

[0172] <Technology 2>

[0173] (constitute)

[0174] The resin molding device according to technology 1, wherein

[0175] The transport mechanism transports the release film on which the liquid resin is not placed from the first stage to the third module after arranging the release film on which the liquid resin is not placed on the second stage.

[0176] (Effects, etc.)

[0177] According to the resin molding device, since the configuration of the release film without liquid resin on the second platform and the conveyance of the release film with liquid resin from the first platform to the third module are performed through a series of actions, the time required for the manufacture of each resin molded product can be further shortened.

[0178] <Technology 3>

[0179] (constitute)

[0180] The resin molding device according to technology 1 or 2, wherein

[0181] The supply time required for supplying the liquid resin to the release film in the second module is longer than the molding time required for molding the resin in the third module.

[0182] In the production of the resin molded product through the processes of the first module, the second module, and the third module, supplying the liquid resin to the release film in the second module does not become a time bottleneck.

[0183] (Effects, etc.)

[0184] In the resin molding device, although the supply time is longer than the molding time, the supply of liquid resin to the release film in the second module does not become a time bottleneck. Therefore, according to the resin molding device, even if it takes some time to supply the liquid resin to the release film, the influence on the time required for manufacturing each resin molded product can be suppressed.

[0185] <Technique 4>

[0186] (constitute)

[0187] The resin molding device according to any one of Techniques 1 to 3, wherein:

[0188] The cycle time for manufacturing the resin molded product through the processes of the first module, the second module, and the third module depends on the molding time required for molding the resin in the third module.

[0189] (Effects, etc.)

[0190] According to this resin molding apparatus, since the cycle time for manufacturing the resin molded product is determined by the molding time, even if it takes some time to supply the liquid resin to the release film, the influence on the time required for manufacturing each resin molded product can be suppressed.

[0191] <Technique 5>

[0192] (constitute)

[0193] The resin molding device according to any one of Techniques 1 to 4, wherein:

[0194] The second module also includes a switching mechanism and a distributor,

[0195] The exchange mechanism exchanges the position of the first platform and the position of the second platform after the release film without the liquid resin is arranged on the second platform and the release film with the liquid resin is transported from the first platform to the third module.

[0196] The dispenser discharges the liquid resin toward the release film on which the liquid resin is not placed after being exchanged by the exchange mechanism.

[0197] (Effects, etc.)

[0198] According to this resin molding apparatus, since the position of the first stage and the position of the second stage are exchanged by the exchange mechanism, the liquid resin can be supplied to the release film even if the movable range of the dispenser is not large.

[0199] <Technique 6>

[0200] (constitute)

[0201] The resin molding device according to technology 5, wherein

[0202] The dispenser includes a material box storing the liquid resin.

[0203] In the dispenser, the cartridge is replaceably mounted in such a manner that the length direction of the cartridge is along the up-down direction.

[0204] The second module further includes a holding mechanism for respectively holding the used cartridges and the unused cartridges.

[0205] (Effects, etc.)

[0206] According to this resin molding apparatus, since the used cartridge and the unused cartridge are held by the holding mechanism, the cartridge in the dispenser can be easily replaced.

[0207] <Technique 7>

[0208] (constitute)

[0209] The resin molding device according to any one of Techniques 1 to 6, wherein:

[0210] The second module also includes a meter,

[0211] A through hole is formed on each of the first platform and the second platform.

[0212] The through holes of the first platform and the second platform are covered by a plate,

[0213] The release film is arranged on the plate,

[0214] In a state where the meter passes through the through hole, the meter supports a plate disposed on a platform corresponding to the through hole through which the meter passes, of the first platform and the second platform.

[0215] The liquid resin is supplied to the release film disposed on the plate supported by the meter.

[0216] (Effects, etc.)

[0217] In the resin molding device, the plate disposed on the platform corresponding to the through hole through which the meter passes among the first platform and the second platform is supported by the meter, and the liquid resin is supplied to the release film disposed on the plate supported by the meter. Therefore, according to the resin molding device, since the liquid resin is supplied to the release film disposed on the plate supported by the meter, the weight of the liquid resin supplied to the release film can be measured relatively accurately.

[0218] <Technology 8>

[0219] (constitute)

[0220] The resin molding device according to any one of Techniques 1 to 7, wherein:

[0221] The first module includes two first units that respectively supply the release film.

[0222] The second module includes two second units that place the liquid resin on the release film by supplying the liquid resin to the release film, respectively.

[0223] The two second units include the first platform and the second platform respectively,

[0224] The third module includes two third units.

[0225] The two third units each include the molding die, and resin molding is performed by clamping the molding die in a state where the mold release film carrying the liquid resin is arranged on the molding die.

[0226] The conveying mechanism holds two release films.

[0227] The conveying mechanism places one of the two release films not loaded with the liquid resin obtained from the two first units on the first platform of one of the two second units, and places the other of the two release films not loaded with the liquid resin obtained from the two first units on the first platform of the other of the two second units.

[0228] The forming mold is configured in one of the two third units and one of the two release films carrying the liquid resin is obtained from the first platforms of the two second units; and the forming mold is configured in the other of the two third units and the other of the two release films carrying the liquid resin is obtained from the first platforms of the two second units.

[0229] (Effects, etc.)

[0230] According to this resin molding apparatus, since the two units included in each module perform processing in parallel, the manufacturing efficiency of the resin molded product can be further improved.

[0231] <Technique 9>

[0232] (constitute)

[0233] The resin molding device according to technology 8, wherein

[0234] The conveying mechanism includes a first holding portion and a second holding portion that respectively hold the release film.

[0235] When the release film held by the first holding portion and not carrying the liquid resin is arranged on the first stage of one of the two second units, the position of the first stage of one of the two second units corresponds to the position of the first holding portion.

[0236] When the release film on which the liquid resin is not placed and which is held by the second holding portion is disposed on the first stage of the other of the two second units, the position of the first stage of the other of the two second units corresponds to the position of the second holding portion.

[0237] (Effects, etc.)

[0238] According to the resin molding device, since the position of the platform of one of the two second units corresponds to the position of the first holding part, and the position of the platform of the other of the two second units corresponds to the position of the second holding part, the demolding film can be handed over between each platform and the holding part relatively easily.

[0239] <Technique 10>

[0240] (constitute)

[0241] A method for manufacturing a resin molded product, using a resin molding device according to any one of Techniques 1 to 9,

[0242] The method for manufacturing the resin molded product comprises:

[0243] a step of supplying the release film;

[0244] A step of placing the liquid resin on the release film by supplying the liquid resin to the release film;

[0245] A step of clamping the molding die in a state where the mold release film carrying the liquid resin is disposed on the molding die; and

[0246] The step of conveying the release film from the first module to the second stage is started at least during the process of supplying the liquid resin to the release film temporarily arranged on the first stage.

[0247] (Effects, etc.)

[0248] In the method for manufacturing a resin molded product, the mold release film is conveyed from the first module to the second platform at least during the process of supplying the liquid resin to the mold release film temporarily disposed on the first platform. Therefore, according to the method for manufacturing a resin molded product, the time required for manufacturing each resin molded product can be shortened compared to a case where the mold release film is conveyed from the first module to the second platform only after the liquid resin is supplied to the mold release film temporarily disposed on the first platform.

Claims

1. A resin molding device comprising: The first module supplies a release film; a second module for placing the liquid resin on the release film by supplying the liquid resin to the release film; and The third module includes a forming mold, and the resin is formed by clamping the forming mold in a state where the mold release film carrying the liquid resin is arranged on the forming mold. The second module includes a first platform and a second platform, The release film can be arranged on the first platform and the second platform respectively. The resin molding apparatus further includes a conveying mechanism that starts conveying the release film from the first module to the second stage at least during a process of supplying the liquid resin to the release film temporarily disposed on the first stage.

2. The resin molding device according to claim 1, wherein: The transport mechanism transports the release film on which the liquid resin is not placed from the first stage to the third module after arranging the release film on which the liquid resin is not placed on the second stage.

3. The resin molding device according to claim 1 or 2, wherein: The supply time required for supplying the liquid resin to the release film in the second module is longer than the molding time required for molding the resin in the third module. In the production of the resin molded product through the processes of the first module, the second module, and the third module, supplying the liquid resin to the release film in the second module does not become a time bottleneck.

4. The resin molding device according to any one of claims 1 to 3, wherein: The cycle time for manufacturing the resin molded product through the processes of the first module, the second module, and the third module depends on the molding time required for molding the resin in the third module.

5. The resin molding device according to any one of claims 1 to 4, wherein: The second module also includes a switching mechanism and a distributor, The exchange mechanism exchanges the position of the first platform and the position of the second platform after the release film without the liquid resin is arranged on the second platform and the release film with the liquid resin is transported from the first platform to the third module. The dispenser discharges the liquid resin toward the release film on which the liquid resin is not placed after being exchanged by the exchange mechanism.

6. The resin molding device according to claim 5, wherein: The dispenser includes a material box storing the liquid resin. In the dispenser, the cartridge is replaceably mounted in such a manner that the length direction of the cartridge is along the up-down direction. The second module further includes a holding mechanism for respectively holding the used cartridges and the unused cartridges.

7. The resin molding device according to any one of claims 1 to 6, wherein: The second module also includes a meter, A through hole is formed on each of the first platform and the second platform. The through holes of the first platform and the second platform are covered by a plate, The release film is arranged on the plate, In a state where the meter passes through the through hole, the meter supports a plate disposed on a platform corresponding to the through hole through which the meter passes, of the first platform and the second platform. The liquid resin is supplied to the release film disposed on the plate supported by the meter.

8. The resin molding device according to any one of claims 1 to 7, wherein: The first module includes two first units that respectively supply the release film. The second module includes two second units that place the liquid resin on the release film by supplying the liquid resin to the release film, respectively. The two second units include the first platform and the second platform respectively, The third module includes two third units. The two third units each include the molding die, and resin molding is performed by clamping the molding die in a state where the mold release film carrying the liquid resin is arranged on the molding die. The conveying mechanism holds two release films. The conveying mechanism places one of the two release films not loaded with the liquid resin obtained from the two first units on the first platform of one of the two second units, and places the other of the two release films not loaded with the liquid resin obtained from the two first units on the first platform of the other of the two second units. The forming mold is configured in one of the two third units and one of the two release films carrying the liquid resin is obtained from the first platforms of the two second units; and the forming mold is configured in the other of the two third units and the other of the two release films carrying the liquid resin is obtained from the first platforms of the two second units.

9. The resin molding device according to claim 8, wherein: The conveying mechanism includes a first holding portion and a second holding portion that respectively hold the release film. When the release film held by the first holding portion and not carrying the liquid resin is arranged on the first platform of one of the two second units, the position of the first platform of one of the two second units corresponds to the position of the first holding portion. When the release film on which the liquid resin is not placed and which is held by the second holding portion is disposed on the first stage of the other of the two second units, the position of the first stage of the other of the two second units corresponds to the position of the second holding portion.

10. A method for manufacturing a resin molded product, using the resin molding device according to any one of claims 1 to 9, The method for manufacturing the resin molded product comprises: a step of supplying the release film; A step of placing the liquid resin on the release film by supplying the liquid resin to the release film; A step of clamping the molding die in a state where the mold release film carrying the liquid resin is arranged on the molding die; and The step of conveying the release film from the first module to the second stage is started at least during the process of supplying the liquid resin to the release film temporarily arranged on the first stage.

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