Substrate processing apparatus and method of processing substrate

Abstract

A substrate processing apparatus according to one or more embodiments may include: a base; a lifting unit connected to the base to be freely lifted; an arm rotatably connected to the lifting unit; the disc-shaped piece is arranged on the arm; and a hand rotatably connected to the arm, in which the disk is disposed below the substrate extracted by the hand in a case where the hand is disposed at a position overlapping the arm.

Description

Background Art

[0001] The present invention relates to a semiconductor manufacturing apparatus, and in particular, to a substrate processing apparatus and a substrate processing method for processing substrates including semiconductor wafers and liquid crystal substrates.

[0002] When manufacturing semiconductor devices and liquid crystal devices, a plurality of manufacturing devices including devices for performing process processing such as forming devices on substrates and substrate inspection devices are used. Substrate processing equipment is used to transfer semiconductor wafers and liquid crystal substrates between these manufacturing devices. Substrate processing equipment includes industrial robots, and in particular, industrial robots used in clean rooms where semiconductor manufacturing devices are installed are called clean robots. The clean robot takes out a substrate from a front opening unified pod (FOUP) on which a plurality of substrates are mounted, and transfers the substrate to a predetermined position in a substrate storage device included in a manufacturing device in the next process. During this transfer, in order to identify the position and orientation of the substrate, the substrate can be photographed by an imaging device such as a camera. The substrate processing device adjusts the position and orientation of the substrate based on the image of the imaging device, and transfers the substrate to the semiconductor manufacturing device in the next process.

[0003] Japanese published unexamined patent application JP-H10-329064 (Iwata) discloses a technology that transfers a liquid crystal glass substrate by an industrial robot and uses a corresponding plurality of cameras to identify the position of the liquid crystal glass substrate by a non-contact method. In the above document, Iwata discloses an industrial robot that transfers a liquid crystal glass substrate and places the liquid crystal glass substrate at a position of a substrate holder, the industrial robot comprising: an upper illuminator and a plurality of fixed substrate holder cameras that are set at a position above the substrate holder at a mark recognition position to identify a positioning mark set on the substrate holder; a plurality of fixed liquid crystal glass substrate cameras that are set at a position above the liquid crystal glass substrate at a position recognition position to identify the position of the liquid crystal glass substrate and a lower illuminator set below the liquid crystal glass substrate; and a control unit that commands gripping position recognition of the liquid crystal glass substrate when the industrial robot grips the liquid crystal glass substrate, and commands the industrial robot to take action to correct the difference between the gripping position recognition result and the recognition position of the positioning mark of the substrate holder. Summary of the invention

[0004] According to one or more embodiments, a substrate processing apparatus may include: a base; a lifting unit connected to the base to be freely lifted and lowered; a hand unit movably connected to the lifting unit and acquiring a substrate; and a disk disposed at a position where the hand can move the substrate.

[0005] A substrate processing method may include: extracting a substrate; transferring the extracted substrate to a disk; capturing an image of the substrate using a camera; calculating a position of the substrate based on the captured image; and positioning the substrate based on a calculated correction amount. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 is a perspective view illustrating a substrate processing apparatus according to one or more embodiments;

[0007] Figure 2A is a diagram illustrating a top view of a disc according to one or more embodiments; and Figure 2B It is a diagram, for example Figure 2A A diagram of an AA cross-sectional view of the disk-shaped member illustrated in FIG.

[0008] Figure 3A is a diagram illustrating a top view of a disc according to one or more embodiments, and Figure 3B It is a diagram, for example Figure 3A A diagram of a BB cross-sectional view of the disc-shaped member illustrated in FIG;

[0009] Figure 4 is a diagram illustrating a flow chart of an operation of a substrate processing apparatus according to one or more embodiments;

[0010] Figure 5 is a diagram illustrating a perspective view of a substrate processing apparatus according to one or more embodiments;

[0011] Figure 6 is a perspective view illustrating a state in which an extracted substrate is transferred on a tray provided in a substrate processing apparatus;

[0012] Figure 7 is a diagram illustrating a top view of a state in which an extracted substrate is transferred on a tray provided in a substrate processing apparatus;

[0013] Figure 8 is a diagram illustrating a perspective view of a substrate processing apparatus according to one or more embodiments;

[0014] Fig. 9 is a diagram illustrating a perspective view of a substrate processing apparatus according to one or more embodiments;

[0015] Fig.10 is a diagram illustrating a perspective view of a substrate processing apparatus according to one or more embodiments; and

[0016] Fig.11 is a diagram illustrating a perspective view of a substrate processing apparatus according to one or more embodiments. DETAILED DESCRIPTION

[0017] The substrate processing device according to one or more embodiments is explained in detail with reference to the accompanying drawings. In the description of the accompanying drawings, the same or similar parts may be indicated by the same or similar reference numerals. The description in the accompanying drawings is schematic, and the relationship between thickness and size and the ratio of the length, thickness, etc. of each part are examples, and do not limit the technical concept of the present invention. The relationship between the sizes and the ratio of the sizes may be different between the drawings. In the following description, "above", "below", "right side", "left side", etc. are used as appropriate when describing the positional relationship of each component based on the orientation of the drawings to be referenced, but these indications do not limit the technical concept of the present invention. Even if the various parts are not in contact, expressions such as "top", "bottom", "right side", "left side", etc. may be used. "X-axis", "Y-axis" and "Z-axis" may be used in the specification or the drawings to describe the direction, and "XY surface", "YZ surface" and "ZX surface" may be used in the specification or the drawings to describe the surface corresponding to the "X-axis, Y-axis and Z-axis" in the drawings. "Longitudinal direction" may refer to the direction of the long side in the main surface of the component, and may also refer to the X direction in the drawings or the opposite direction of the X direction. The “width direction” may refer to the direction of the short side in the main surface of the member, and may also refer to the Y direction in the drawings or the opposite direction of the Y direction. The “height direction” and “vertical direction” may refer to the Z direction in the drawings or the opposite direction of the Z direction.

[0018] Figure 1 is a diagram illustrating a perspective view of a substrate processing apparatus 100 according to one or more embodiments. Figure 1 The substrate processing equipment 100 in the figure particularly illustrates a horizontally articulated clean robot. The substrate processing equipment 100 includes a base 101 and a hand unit, which includes an arm 120 and a hand 130. The base 101 supports a lifting unit 111. The base 101 is controlled to be lifted and lowered by a controller 200 that controls the substrate processing equipment 100. The base 101 can be fixed to a floor surface on which the substrate processing equipment 100 is installed, or can be fixed to other semiconductor manufacturing equipment. The lifting unit 111 lifts and lowers the arm 120 along the Z-axis direction. The arm 120 is rotatably mounted to the lifting unit 111. The lifting unit 111 can be cylindrical or rectangular.

[0019] The arm 120 is movably mounted in a vertical direction by the lifting unit 111. The arm 120 is rotatably mounted to the lifting unit 111. The arm 120 may be a horizontally articulated arm. The arm 120 includes a first arm 121 and a second arm 122.

[0020] The first arm 121 is installed between the lifting unit 111 and the second arm 122. The first end of the first arm 121 is arranged to be able to be lifted and lowered in the Z direction by the lifting unit 111. The first arm 121 is rotatably installed around the lifting unit 111 in the XY surface illustrated in the figure. At the second end of the first arm 121, the second arm 122 is rotatably installed. The rotation axis of the arm 120 can be set around the center of the cross section of the XY surface of the lifting unit 111.

[0021] The second arm 122 is installed between the first arm 121 and the hand 130. The first end of the second arm 122 is rotatably mounted to the first arm 121 in the XY plane illustrated in the figure. At the second end of the second arm 112, the hand 130 is rotatably mounted.

[0022] The hand 130 includes a wrist 131 and a fork 132, and is rotatably mounted to the second arm 122 via the wrist 131. The wrist 131 is rotatably mounted to the second end of the second arm 122 in the XY plane. The hand 130 extracts a substrate W from a front opening unified pod (FOUP) on which a plurality of wafers and the like are mounted using the fork 132. Then, the hand 130 transfers the extracted substrate W to a predetermined position in a substrate storage included in the manufacturing apparatus.

[0023] Figure 1 The hand 130 shown in FIG. 1 is a vacuum hand type, and a fork 132 of the hand 130 has a branched structure and has a suction unit at its tip. The fork 132 suctions the surface of the substrate W under negative pressure and transfers the substrate W. The suction type hand includes, for example, a Bernoulli chuck.

[0024] The hand 130 is not limited to the vacuum hand type and may be a passive grip type or an edge grip type. The passive grip type hand is a grip that does not fix the substrate placed on the hand and may not have a pressing member. The edge grip type has an edge guide at each fork split end. The pressing member is provided near the wrist. The pressing member may slide along the surface of the hand by an actuator including a pneumatic cylinder. By sliding the pressing member while the substrate is placed on the fork, the substrate is held between the edge guide and the pressing member. In any configuration, the hand 130 has a configuration that supports the substrate W and conveys the substrate W.

[0025] Each of the lifting unit 111, the first arm 121, the second arm 122 and the hand 130 can be driven by the controller 200. Each of the lifting unit 111, the first arm 121, the second arm 122 and the hand 130 can be driven by an actuator not shown in the figure. The actuator not shown in the figure can include, for example, an electric motor. At the arm joint between the lifting unit 111 and the first arm 121, between the first arm 121 and the second arm 122, and between the second arm 22 and the hand 130, an encoder (not shown in the figure) can be installed to detect the rotation position of each of the first arm 121, the second arm 112 and the hand 130. In addition, in the substrate processing device 100, an encoder (not shown in the figure) can be set to detect the position change of the first arm 121 in the height direction, such as the lifting amount of the first arm 121 of the lifting unit 111. In this way, each joint of the arm 120 and the hand 130 is controlled to transfer the substrate W.

[0026] The controller 200 is connected to the base 101 and performs various controls including the arm position control of the substrate processing device 100. The controller 200 controls the operation of the actuator, and the actuator drives each of the lifting unit 111, the first arm 121, the second arm 122 and the hand 130. The control of these actuators can be performed based on position information including the rotation position or height position of the first arm 121, the second arm 122 or the hand 130 detected by the encoder (not shown in the figure). Although the controller 200 is a housing separated from the base 101, the controller 200 and the base 101 can be located in one housing. In addition, the controller 200 only needs to be able to perform various controls of the substrate processing device 100, and can be connected to the substrate processing device 100 by means of a wired connection or a wireless connection to perform the control. The controller 200 does not need to be located near the substrate processing device 100, and can be connected to perform various controls of the substrate processing device 100, for example, via the Internet.

[0027] The controller 200 may be, for example, a computer including a CPU (central processing unit), and the computer reads a computer program stored in a storage medium and performs various controls of the substrate processing device 100. The storage medium may be a non-transient computer-readable storage medium, such as a ROM (read-only memory), etc., and a tape, a disk, a card, a semiconductor memory, a programmable logic circuit, etc. may be used. In addition, the computer may also be provided with a RAM (random access memory) or the like to expand the above-mentioned program. In addition, the above-mentioned program may be supplied to the above-mentioned computer via an optional transmission medium (communication network, broadcast wave, etc.) capable of transmitting the program. In addition, the above-mentioned program may be implemented in the form of a data signal embedded in a carrier wave, wherein the above-mentioned program is implemented by electronic transmission.

[0028] The substrate processing apparatus 100 includes a disk 140. The disk 140 is disposed above the first end of the second arm 122. Considering the operation of the hand 130, the disk 140 may be disposed at a predetermined interval from the rotation axis of the hand 130 (not shown in the figure). The hand 130 takes out the substrate W and moves the substrate W to the upper side of the disk 140. After taking out the substrate W, the hand 130 rotates and moves in the XY surface illustrated in the figure, and moves substantially parallel to the second arm 122. When the substrate W moves to the first end of the second arm 122, the disk 140 is positioned substantially below the substrate W in the Z-axis direction of the figure. Figure 1 The shape of the disk 140 illustrated in the figure is circular, but is not limited to this, and can also be realized. The shape and size of the disk 140 can be determined in consideration of the shape and size of the substrate W to be transferred and the environment in which the substrate processing equipment 100 is installed. For example, the shape and size of the disk 140 can be almost the same as the shape and size of the substrate W to be transferred. When the shape of the substrate W is basically circular, the disk 140 can be basically circular. In terms of the size of the disk, the diameter can be greater than 50 mm and less than 500 mm, and can also be greater than 200 mm and less than 400 mm. In addition, depending on the size of the substrate, more than 500 mm can be achieved. For example, when the substrate W is, for example, 300 mm, the disk can be greater than 300 mm. In addition, Figure 1 The substrate processing device 100 includes a double-link arm having two arms, but is not limited thereto, and the number of arms may be one, three, four or more. A disk-shaped member may be provided at an end of the arm to which a hand is not connected. In the case of a plurality of arms, the arm is connected to the hand, and the disk-shaped member may be provided at an end opposite to the end connected to the hand in the longitudinal direction of the arm. In other words, in the case of a plurality of arms, the arm is connected to the hand, and the disk-shaped member may be provided at an end not connected to the hand. In addition, the disk-shaped member may be provided on an arm to which a hand is not connected. For example, in Figure 1 In the substrate processing apparatus 100 illustrated in FIG. 1 , the disk 140 may be disposed on the first arm 121. For example, the disk 140 may be disposed near the first end portion of the first arm 121.

[0029] Figure 2A and Figure 2B 1 and 2 are diagrams respectively illustrating a disk-shaped member according to one or more embodiments. Figure 2A In the disk 141 shown in FIG. 1 , a plurality of lamps 143 are provided inside the disk 141. The plurality of lamps 143 are provided on the surface of the disk 141. The plurality of lamps 143 may be luminous, such as LEDs (light emitting diodes) or fluorescent lamps. Figure 2B141 is a diagram illustrating an AA cross-sectional view of a disk 141. In the disk 141, a plurality of lamps 143 are installed in a disk body 145. A cover 147 is provided to cover the plurality of lamps 143. The cover 147 is a transparent or translucent member, and transmits or partially transmits light from the lamps 143. This allows light from the plurality of lamps 143 to be emitted to the outside of the disk 141. Figure 2A In the embodiment of the present invention, the plurality of lamps 143 are relatively small compared to the disc 141, but are not limited thereto, and lamps of substantially the same size as the disc 141 may be provided inside the disc body 145. This allows uniform light intensity to be obtained. In addition, although the disc 141 is provided with a transparent or translucent cover 147, this is not limited thereto, and for example, the light may be exposed to the outside without a cover.

[0030] Figure 3A and Figure 3B 1 and 2 are diagrams respectively illustrating a disk 142 according to one or more embodiments. Figure 3A In the disk 142 shown in FIG. 1 , a plurality of lamps 143 are provided inside the disk 142. The plurality of lamps 143 are provided on the surface of the disk 142 and are arranged along the periphery of the disk 142. The plurality of lamps 143 may be luminous, such as LEDs (light emitting diodes) or fluorescent lamps. Figure 3B 14 is a diagram illustrating a BB cross-sectional view of a disk-shaped member 142. In the disk-shaped member 142, a plurality of lamps 143 are provided on the periphery of a disk-shaped member body 148. A cover 149 is provided to cover the plurality of lamps 143. The cover 149 is a transparent or translucent member, and transmits or partially transmits light from the lamps 143. This allows light from the plurality of lamps 143 to be emitted to the outside of the disk-shaped member 142. Figure 3A In the embodiment of the present invention, the plurality of lamps 143 are relatively small compared to the disk 142, but are not limited thereto, and lamps of substantially the same size as the disk 142 may be provided on the outer periphery inside the disk body 148. This allows the outer periphery of the disk 142 to have a uniform amount of light. In addition, although the disk 142 is provided with a transparent or translucent cover 149, this is not limited thereto, and for example, the light may be exposed to the outside without a cover.

[0031] Here, the turning on and off of the lamp 143 can be controlled. That is, the lamp 143 can be turned on only when the substrate W moves onto the disc 140 and is imaged by the camera (not shown in the figure), and the lamp 143 can be turned off when the camera completes image capture. By doing so, not only low power consumption can be achieved, but also possible degradation of the substrate due to the lamp 143 can be alleviated. In addition, the light intensity of the lamp 143 can be changed. This allows the camera to obtain a clear image without being affected by the environment of the substrate processing equipment 100. In addition, the color temperature of the lamp 143 can be about 2600K to 7100K. Amber, bulb color, warm white, white, daytime white, daylight color, etc. can be selected according to the environment of the substrate processing equipment and the characteristics of the substrate used.

[0032] Next, the operation of the substrate processing apparatus 100 is described with reference to the drawings. Figure 4 1 is a diagram illustrating a flow chart of the operation of the substrate processing device 100 according to one or more embodiments. The substrate processing device 100 first takes out a substrate from a FOUP or the like (step S101). The substrate W is taken out using the fork 132 provided on the hand 130 of the substrate processing device 100. Next, the removed substrate W is transferred to the disk 140 provided in the substrate processing device 100 (step S102). The disk 140 is provided on the arm 120 of the substrate processing device 100. The hand 130 that has taken out the substrate W is rotated, and the substrate W is moved to the disk 140 provided on the arm 120 in the substrate processing device 100. Next, the substrate W is imaged by a camera (not shown in the figure) (step S105). During the imaging, the lamp (not shown in the figure) provided on the disk 140 is turned on to illuminate the substrate W. This allows a clearer image to be obtained. The lamp (not shown in the figure) can be turned on only when imaging the substrate W, and turned off at other times. This can reduce power consumption and extend the life of the lamp (not shown in the figure). In addition, possible degradation of the substrate W that may be caused by the lamp can be reduced. The imaging of the camera (not shown in the figure) can be a still image or a moving image. Here, the detection targets performed by the camera (not shown in the figure) include the position of the substrate W, the orientation of the substrate W, the detection of defective substrates W, and the identification of the type of substrate W. Next, the position of the substrate W is calculated based on the captured image (step S107). In order to calculate the position of the substrate W, for example, the position of the notch and the orientation plane of the substrate W are obtained from the captured image, and the correction amount of the position of the substrate W is calculated based on the position and orientation of the substrate W relative to the fork 132. The measurement and correction of the misalignment of the substrate W refers to the support of U.S. Patent Publication 2021 / 0257242. Next, the substrate W is placed on a manufacturing device for the next process based on the calculated correction amount (step S109).

[0033] Therefore, according to the substrate processing apparatus 100 of one or more embodiments, when obtaining an image of a substrate for correcting the position of the substrate, the substrate is transferred to a tray having a lamp that illuminates the substrate. Since the tray is provided on the arm of the substrate processing apparatus, the moving distance of the tray can be shortened, and the moving time of the tray can be reduced. In addition, since the imaging position is on the upper part of the arm, the detection of the position and orientation of the substrate is improved.

[0034] Figure 5 is a diagram illustrating a perspective view of a substrate processing apparatus 300 according to one or more embodiments. Figure 5 The substrate processing device 300 particularly illustrates a horizontal articulated clean robot. The substrate processing device 300 includes a base 301 and a hand unit, and the hand unit includes an arm 320 and a hand 330. The substrate processing device 300 may have a lifting unit. The arm 320 may be connected so as to be able to be lifted and lowered in the Z-axis direction shown in the figure by the lifting unit. The base 301 may be connected to a controller (not shown in the figure) that controls the substrate processing device 300. The base 301 may be fixed to a floor surface on which the substrate processing device 300 is installed, or may be fixed to other semiconductor manufacturing equipment. The lifting unit (not shown in the figure) lifts and lowers the arm 320 so that the arm 320 moves in the Z-axis direction. The arm 320 is rotatably mounted on the lifting unit (not shown in the figure). Here, when the substrate W does not need to move in the Z-axis direction shown in the figure, the lifting unit (not shown in the figure) is not required.

[0035] The arm 320 is attached so as to be movable in the vertical direction by a lifting unit (not shown in the figure). The arm 320 is rotatably mounted in the XY surface shown in the figure by a lifting unit (not shown in the figure). The arm 320 may be a horizontally articulated arm. The arm 320 includes a first arm 321 and a second arm 322.

[0036] The hand 330 is rotatably attached to the second arm 322 via the wrist 331. The wrist 331 is rotatably attached to the second end of the second arm 322 in the XY surface illustrated in the figure. The hand 330 takes out a substrate W, such as a wafer, from a front-opening wafer transfer box (FOUP) on which a plurality of substrates are mounted, and transfers the substrate W to a predetermined position in a substrate storage included in a manufacturing device. The hand 330 includes a suction unit 333A and a suction unit 333B for sucking the substrate W, the substrate W is sucked onto the fork 332 by the suction unit, and the hand 330 includes a vacuum hand for moving the substrate. The vacuum hand can reduce light blocking from the disk 340 more than the edge gripping hand. In order to reduce light blocking, the fork 332 of the hand 330 may be equipped with a lamp (not shown in the figure). When the disk 340 is used as a backlight to illuminate the substrate W, the fork blocks the light. The lamp 333 is disposed on the fork 332, and the lamp irradiates light onto the substrate. This allows the light from the lamp to compensate for the light from the disc 340, even if the fork blocks the light.

[0037] The disk 340 is disposed on an upper portion of the first end portion of the second arm 322. The disk 340 may be used, for example Figure 2A , Figure 2B , Figure 3A and Figure 3B The disc-shaped piece shown in FIG.

[0038] Next, the operation of the substrate processing apparatus 300 will be described in detail with reference to the accompanying drawings. Figure 5 As shown in FIG. 1 , the substrate processing apparatus 300 first extracts a substrate W from a FOUP (not shown in the figure) or the like. When extracting the substrate W, the substrate processing apparatus 300 performs position control of the hand 330 and moves the hand 330 to a predetermined position of the FOUP (not shown in the figure) to extract the substrate. Next, the extracted substrate W is transferred to a tray 340 provided in the substrate processing apparatus 300.

[0039] Figure 63 is a diagram illustrating a stereoscopic view of a state in which an extracted substrate W is transferred on a disk 340 provided in a substrate processing device 300. The hand 330 rotates in an XY surface and moves the substrate W onto the disk 340. As illustrated in the figure, the substrate W is substantially placed above the disk 340. Next, the substrate W is imaged using a camera 350. During the imaging, a lamp (not shown in the figure) provided on the disk 340 is turned on to illuminate the substrate. This allows a clearer image to be obtained. The lamp can be turned on only when imaging the substrate and turned off at other times. This can reduce power consumption and extend the life of the lamp (not shown in the figure). The camera 350 can capture a still image or a video. Here, the detection targets of the camera 350 include the position of the substrate, the orientation of the substrate, the detection of defective substrates, and the identification of the type of substrate. Next, the position of the substrate is calculated based on the captured image. In order to calculate the position of the substrate, for example, the position of the notch or orientation plane of the substrate is obtained from the captured image, and the correction amount of the substrate position is calculated based on the position and orientation of the substrate relative to the position and orientation of the fork. Next, in the next process, the substrate is placed in the substrate storage of the manufacturing device based on the calculated correction amount. In addition, the position of the camera 350 can be any position where the substrate W can be imaged. The camera 350 can be set above the motion range of the disk 340. By doing so, the motion of the disk can be minimized. Therefore, since the time for moving the disk can be minimized, the throughput of substrate transfer can be increased.

[0040] Figure 7 3 is a diagram illustrating a top view of a state in which the extracted substrate W is transferred on a tray 340 provided in the substrate processing apparatus 300 . Figure 6 The example of 340 illustrates an example in which the hand 330 and the second arm 322 overlap and the substrate W is moved to the upper surface of the tray 340 . Figure 7 The example illustrates an example in which the hand 330, the second arm 322, and the first arm 321 overlap and the substrate W is moved to the upper surface of the disk 340. For example, the hand 330 rotates in the XY plane and moves the substrate W onto the disk 340. Then, the second arm 322 moves onto the first arm 321. As illustrated in the figure, the substrate W is basically placed above the disk 340. When the first arm 321 is in the same position, the light (not shown in the figure) of the disk 340 is turned on, and an image of the substrate W is captured by a camera (not shown in the figure). According to Figure 6 The position of the disk 340 and Figure 7 The position of the disk 340 illustrated in FIG. 3 is in the same position. Therefore, the degree of freedom of camera arrangement is increased, and further, the camera can be set near the substrate processing apparatus 300. This can increase the degree of freedom of plane planning.

[0041] According to the substrate processing equipment of one or more embodiments, by placing the camera 350 at a predetermined position on the upper part of the disc 340 to identify the position and orientation of the substrate W, for example, the process of moving the substrate W to a workstation where the camera is installed becomes unnecessary. This reduces the time required to place the substrate W on the hand, identify the position and orientation, and move the substrate W to the designated device, thereby maintaining a high production volume. In addition, there is no need to set up a workstation where the camera is installed, which helps save space. In addition, since there is no need to install a workstation, the clean room environment can be improved. In addition, by installing a disc including a lamp on the arm, the degree of freedom of design is improved, and the camera can be placed close to the substrate processing equipment.

[0042] Figure 8 is a diagram illustrating a perspective view of a substrate processing apparatus 400 according to one or more embodiments. Figure 8 The substrate processing device 400 illustrates a horizontally articulated clean robot, and particularly illustrates a part of a clean robot whose lifting axis is a column type. The substrate processing device 400 includes a lifting column 401, a lifting unit 411, and a hand unit including an arm 420 and a hand 430. The lifting column 401 supports the lifting unit 411 so that it can be lifted and lowered. The lifting unit 411 is controlled to be lifted and lowered by a controller (not shown in the figure) that controls the substrate processing device 400. The lifting column 401 can be fixed to the floor surface for installing the substrate processing device 400, or can be fixed to other semiconductor manufacturing equipment (not shown in the figure). The lifting unit 411 lifts and lowers the arm 420 along the vertical direction (Z-axis direction) along the groove provided in the lifting column 401. The arm 420 is attached to the lifting unit 411 in a rotatable manner. Considering the rotation of the arm 420, the rotation axis (not shown in the figure) of the arm 420 and the lifting column 401 have a predetermined distance. Figure 8 The lifting column 401 has a structure having a groove for the lifting unit 411 to move in the rectangular body, but is not limited thereto. For example, the structure may have a cylindrical groove for the lifting unit 411 to move.

[0043] The lifting unit 411 is lifted to move in the vertical direction (Z-axis direction), and the arm 420 is installed in a movable manner in the vertical direction. The arm 420 is attached to the lifting unit 411 in a rotatable manner. The arm 420 may be a horizontally articulated arm. The arm 420 includes a first arm 421 and a second arm 422. The rotation axis of the arm 420 may be set at the approximate center of the arm 420. This avoids contact with the lifting column 401 due to the rotational movement of the arm 420, and the distance between the arm 420 and the lifting column 401 can be minimized.

[0044] The first arm 421 is installed between the lifting unit 411 and the second arm 422. The first end of the first arm 421 is arranged to be able to be lifted and lowered in the Z direction shown in the figure by the lifting unit 411. The first arm 421 is rotatably installed in the XY surface shown in the figure. At the second end of the first arm 421, the second arm 422 is attached.

[0045] The second arm 422 is installed between the first arm 421 and the hand 430. The first end of the second arm 422 is rotatably attached to the first arm 421 in the XY surface illustrated in the figure. At the second end of the second arm 420, the hand 430 is attached.

[0046] The hand 430 includes a wrist and a fork, and is rotatably attached to the second arm 422 in the XY surface illustrated in the figure via the wrist. The wrist is rotatably attached to the second end of the second arm 424 in the XY surface illustrated in the figure. The hand 430 uses the fork to obtain a substrate W from a FOUP (Front Opening Pod) on which a plurality of wafers, etc. are mounted. Then, the hand 430 transfers the extracted substrate W to a predetermined position in a substrate storage included in the manufacturing apparatus.

[0047] Figure 8 The fork of the hand 430 shown in FIG. 4 may, for example, have a Figure 5 The hand 430 is not limited to the edge gripping type of the branch structure shown in FIG. In addition, the hand 430 is not limited to the edge gripping type, but may be a passive gripping type or a suction type. The hand 430 supports the substrate W and transfers the substrate W.

[0048] Each of the lifting unit 411, the first arm 421, the second arm 422 and the hand 430 is controlled by a controller (not shown in the figure). Each of the lifting unit 411, the first arm 421, the second arm 422 and the hand 430 can be driven by an actuator (not shown in the figure). The actuator (not shown in the figure) may include, for example, an electric motor. An encoder (not shown in the figure) may be installed at the arm joint between the lifting unit 411 and the first arm 421, between the first arm 421 and the second arm 422, and between the second arm 422 and the hand 430 to detect the rotation position of each of the first arm 421, the second arm 424 and the hand 430. In addition, in the substrate processing device 400, an encoder (not shown in the figure) may be set to detect the position change of the first arm 421 in the height direction, such as the lifting amount of the first arm 421 of the lifting unit 411. In this way, each joint unit of the arm 420 and the hand 430 is controlled to transfer the substrate.

[0049] The substrate processing device 400 includes a disk 440. The disk 440 is disposed above the first end of the first arm 421. Considering the operation of the arm 420 and the hand 430, the disk 440 may be disposed at a predetermined interval from the rotation axis of the second arm (not shown in the figure). After taking out the substrate W, the hand 430 rotates and moves around the rotation axis of the second end of the second arm 422 in the XY surface shown in the figure, and the first arm 421 rotates in the XY surface shown in the figure to place the substrate W substantially above the disk 440 in the Z-axis direction shown in the figure. Figure 8 The shape of the disk-shaped member 440 shown in the figure is circular, but is not limited thereto and may be implemented. The shape and size of the disk-shaped member 440 may be the same as in the above-mentioned embodiment. In addition, Figure 8 The substrate processing device 400 includes a double-link arm having two arms, but is not limited thereto, and the number of arms may be one, three, four or more. The disc may be provided at the end of the arm to which the hand is not connected. In the case of multiple arms, the disc may be provided on the arm connected to the hand, and opposite to the end connected to the hand in the longitudinal direction of the arm. In other words, in the case of multiple arms, the disc may be provided on the arm connected to the hand, and provided at the end not connected to the hand. In addition, the disc may be provided in the lifting unit.

[0050] Next, the operation of the substrate processing apparatus 400 is described. The substrate processing apparatus 400 may be as follows. Figure 4The operation is performed as illustrated in the flowchart of . That is, the substrate processing device 400 first takes out the substrate W from the FOUP or the like (step S101). The substrate W is extracted using the fork provided in the hand 430 of the substrate processing device 400. Next, the extracted substrate W is transferred to the disk 440 provided in the substrate processing device 400 (step S102). The disk 440 is provided on the first arm 421 of the substrate processing device 400. The hand 430 from which the substrate W is extracted rotates in the XY surface illustrated in the figure, and moves the substrate W to the disk 440 provided on the first arm 421. Next, the substrate W is imaged by a camera (not shown in the figure) (step S105). During the imaging, the lamp (not shown in the figure) provided on the disk 440 can be turned on to illuminate the substrate W. The lamp and the camera provided on the disk 44 can be the same as those in the above-mentioned embodiment. Next, the position of the substrate W is calculated based on the captured image (step S107). In order to calculate the position of the substrate W, for example, the position of the notch and the orientation plane of the substrate W is obtained from the captured image, and the correction amount of the substrate position is calculated based on the position and orientation of the substrate W relative to the position and orientation of the fork. For the measurement and correction of the position misalignment of the substrate W, refer to U.S. Patent Publication 2021 / 0257242. Next, the substrate is placed on a manufacturing device for the next process based on the calculated correction amount (step S109).

[0051] Therefore, according to the substrate processing apparatus 400 of one or more embodiments, when obtaining an image of a substrate for position correction of the substrate W, the substrate is transferred to a tray having a lamp that illuminates the tray. Since the tray is provided on the arm of the substrate processing apparatus, the moving distance of the tray can be shortened, and the moving time of the tray can be reduced. In addition, since the imaging position is on the upper portion of the arm, the detection of the position and orientation of the substrate is improved.

[0052] Fig. 9 is a diagram illustrating a perspective view of a substrate processing apparatus 500 according to one or more embodiments. Fig. 9The substrate processing equipment 500 illustrates a horizontally articulated clean robot, and particularly illustrates a part of the clean robot whose lifting axis is a column type. The substrate processing equipment 500 includes a lifting column 501, a lifting unit 511, and a hand unit including an arm 520 and a hand 530. The lifting column 501 supports the lifting unit 511 so that it can be lifted and lowered in the Z-axis direction shown in the figure. The lifting unit 511 is controlled to lift and lower by a controller (not shown in the figure) for the substrate processing equipment 500. The lifting column 501 can be fixed to the floor surface on which the substrate processing equipment 500 is installed, or it can be fixed to other semiconductor manufacturing equipment (not shown in the figure). The lifting unit 511 lifts and lowers the arm 520 along the Z-axis direction shown in the figure along the groove provided in the lifting column 501. The arm 520 is attached to the lifting unit 511 in a rotatable manner. Fig. 9 The lifting column 501 has a structure in which the rectangular body has a groove for the lifting unit 511 to move, but is not limited thereto. For example, the structure may have a cylindrical groove for the lifting unit 511 to move.

[0053] The lifting unit 511 is lifted to move in the vertical direction, and the arm 520 is installed in a movable manner in the vertical direction. The arm 520 is attached to the lifting unit 511 in a rotatable manner. The arm 520 may be a horizontally articulated arm. The arm 520 includes a first arm 521 and a second arm 522.

[0054] The first arm 521 is installed between the lifting unit 511 and the second arm 522. The first end of the first arm 521 is rotatably attached to the lifting unit 511 in the XY surface illustrated in the figure. The second end of the first arm 521 is attached to the second arm 522.

[0055] The second arm 522 is installed between the first arm 521 and the hand 530. The first end of the second arm 522 is rotatably attached to the second end of the first arm 521 in the XY surface illustrated in the figure. The hand 530 is attached to the second end of the second arm 522.

[0056] The hand 530 includes a wrist and a fork. The hand 530 is rotatably attached to the second end of the second arm 522 via the wrist in the XY surface illustrated in the figure. The hand 530 uses the fork to obtain a substrate W from a FOUP (Front Opening Pod) on which a plurality of wafers or the like are mounted. The hand 530 transfers the obtained substrate W to a predetermined position in a substrate storage included in the manufacturing apparatus.

[0057] For example, Fig. 9 The fork of the hand 530 shown in FIG. 5 may be a fork having a Figure 5The hand 530 is not limited to the edge gripping type of the branch structure shown in FIG. In addition, the hand 530 is not limited to the edge gripping type, but may be a passive gripping type or a suction type. The hand 530 supports the substrate W and transfers the substrate W.

[0058] Each of the lifting unit 511, the first arm 521, the second arm 522 and the hand 530 is controlled by a controller (not shown in the figure) in operation. Each of the lifting unit 511, the first arm 521, the second arm 522 and the hand 530 can be driven by an actuator (not shown in the figure). The actuator (not shown in the figure) may include, for example, an electric motor. An encoder (not shown in the figure) may be attached to the arm joint between the lifting unit 511 and the first arm 521, between the first arm 521 and the second arm 522, and between the second arm 522 and the hand 530 to detect the rotation position of each of the first arm 521, the second arm 522 and the hand 530. In addition, the substrate processing device 500 may be provided with an encoder (not shown in the figure) to detect the position change of the first arm 521 in the height direction, such as the lifting amount of the first arm 521 of the lifting unit 511. In this way, each joint of the arm 520 and the hand 530 is controlled to transfer the substrate.

[0059] The substrate processing apparatus 500 includes a disk 540. The disk 540 is disposed above the lifting unit 511. Considering the operation of the arm 520 and the hand 530, the disk 540 may be disposed at a predetermined interval from the rotation axis of the arm 520. The hand 530 takes out the substrate W and moves the substrate W to the upper portion of the disk 540. For example, after taking out the substrate W, the hand 530 rotates and moves in the XY surface illustrated in the figure, and moves substantially parallel to the top of the second arm 522. The second arm 522 rotates and moves in the XY surface illustrated in the figure, and moves substantially parallel to the top of the first arm 521. The first arm 521 rotates and moves in the XY surface illustrated in the figure, and moves substantially parallel to the top of the lifting unit 511. When the substrate W moves onto the lifting unit 511, the disk 540 is arranged so that the disk 540 is substantially located below the substrate W in the Z-axis direction illustrated in the figure. Fig. 9 The shape of the disk 540 shown in the figure is circular, but is not limited thereto and may also be implemented. The shape and size of the disk 540 may be the same as in the above-mentioned embodiment. In addition, Fig. 9The substrate processing device 500 includes a double-link arm having two arms, but is not limited thereto, and the number of arms may be one, three, four or more. The disc 540 is disposed on the lifting unit 511, but is not limited thereto. The disc may be disposed on the end of the arm to which the hand is not connected. In the case of multiple arms, the disc may be disposed on the end of the arm connected to the hand and opposite to the end connected to the hand in the longitudinal direction of the arm. In other words, in the case of multiple arms, the disc may be disposed on the arm connected to the hand and on the end not connected to the hand.

[0060] Next, the operation of the substrate processing apparatus 500 is described. The substrate processing apparatus 500 may be as follows. Figure 4 The process of the present invention is performed as illustrated in the flowchart of . That is, the substrate processing device 500 first extracts the substrate W from the FOUP or the like (step S101). The substrate W is extracted using the fork provided in the hand 530 of the substrate processing device 500. Next, the extracted substrate W is transferred to the disk 540 provided in the substrate processing device 500 (step S102). The disk 540 is provided in the lifting unit 511. The hand 530 from which the substrate W is extracted rotates, and the substrate W moves to the disk 540 provided in the lifting unit 511 of the substrate processing device 500. Next, the substrate W is imaged by a camera (not shown in the figure) (step S105). During the imaging, the lamp (not shown in the figure) provided on the disk 540 can be turned on to illuminate the substrate W. The lamp and the camera provided on the disk 520 can be the same as those in the above-mentioned embodiment. Next, the position of the substrate W is calculated based on the captured image (step S107). In order to calculate the position of the substrate W, for example, the position of the notch and the orientation plane of the substrate W is obtained from the captured image, and the correction amount of the substrate position is calculated based on the position and orientation of the substrate W relative to the position and orientation of the fork. In order to measure and correct the misalignment of the substrate W, U.S. Patent Publication 2021 / 0257242 is incorporated herein by reference. Next, the substrate is placed on a manufacturing device for the next process based on the calculated correction amount (step S109).

[0061] Therefore, according to the substrate processing apparatus 500 of one or more embodiments, when an image of a substrate for correcting the position of the substrate W is obtained, the substrate is transferred to a tray having a lamp that illuminates the substrate. Since the tray is provided on the arm of the substrate processing apparatus, the moving distance of the tray can be shortened, and the moving time of the tray can be reduced. In addition, since the imaging position is on the upper part of the arm, the detection of the position and orientation of the substrate is improved. In addition, by providing the tray 540 on the lifting unit 511, an unexpected effect is obtained, that is, the amount of light observed from the substrate W is stable.

[0062] Fig.10 is a diagram illustrating a perspective view of a substrate processing apparatus 600 according to one or more embodiments. Fig.10 The substrate processing device 600 illustrates a horizontal articulated clean robot, and in particular illustrates that the lifting column 601 is column-shaped and is a part of the clean robot in which the hand 630 is directly connected to the lifting unit 611. The substrate processing device 600 includes a lifting column 601, a lifting unit 611 and a hand 630. The lifting column 601 supports the lifting unit 611. The lifting unit 611 is controlled to lift by a controller (not shown in the figure) that controls the substrate processing device 600. The lifting column 601 can be fixed to the floor surface for installing the substrate processing device 600, or can be fixed to other semiconductor manufacturing equipment (not shown in the figure). The lifting unit 611 lifts the hand 630 in the vertical direction (Z-axis direction) along the groove provided in the lifting column 601. The hand 630 is rotatably attached to the lifting unit 611 in the XY surface illustrated in the figure. Fig.10 The lifting column 601 has a rectangular structure having a groove for the lifting unit 611 to move, but is not limited thereto. For example, the structure may be a structure having a cylindrical groove for the lifting unit 611 to move.

[0063] The lifting unit 611 is lifted and lowered to move in the vertical direction, and the hand 630 is installed to be vertically movable. The hand 630 is attached to the lifting unit 611 in a rotatable manner in the XY surface illustrated in the figure.

[0064] The hand 630 includes a wrist and a fork, and is rotatably mounted to the lifting unit 611 via the wrist in the XY surface illustrated in the figure. The hand 630 uses the fork to obtain a substrate W from a FOUP (Front Opening Pod) on which a plurality of wafers, etc. are mounted. Then, the hand 630 transfers the obtained substrate W to a predetermined position in a substrate storage included in the manufacturing apparatus.

[0065] For example, Fig.10 The fork of the hand 630 shown in FIG. 6 may be a fork having a Figure 5 The hand 630 is not limited to the edge gripping type of the branch structure shown in FIG. In addition, the hand 630 is not limited to the edge gripping type, but may be a passive gripping type or a suction type. The hand 630 supports the substrate W and transfers the substrate W.

[0066] Each of the lifting unit 611 and the hand 630 is controlled by a controller in operation. In addition, each of the lifting unit 611 and the hand 630 can be driven by an actuator (not shown in the figure). The actuator (not shown in the figure) may include, for example, an electric motor. At the arm joint between the lifting unit 611 and the hand 630, an encoder may be installed to detect each rotation position of the hand 630. In addition, in the substrate processing device 600, an encoder (not shown in the figure) may be provided to detect a change in the position of the hand 630 in the height direction, such as the lifting amount of the hand 630 of the lifting unit 611. In this way, the joint of the hand 630 is controlled to transfer the substrate.

[0067] The substrate processing apparatus 600 includes a disk 640. The disk 640 is disposed on the upper portion of the lifting unit 611. Considering the operation of the hand 630, the disk 640 may be disposed at a predetermined interval from the hand rotation axis (not shown in the figure). The hand 630 takes out the substrate W and moves the substrate W to the upper portion of the disk 640. For example, after taking out the substrate W, the hand 630 rotates and moves in the XY surface illustrated in the figure, and moves substantially parallel to the top of the lifting unit 611. When the substrate W is moved onto the lifting unit 611, the disk 640 is positioned substantially below the substrate W in the Z-axis direction illustrated in the figure. Fig.10 The shape of the disk 640 illustrated in FIG. 6 is circular, but is not limited thereto and may be implemented. The shape and size of the disk 640 may be the same as those in the above-described embodiment.

[0068] Next, the operation of the substrate processing apparatus 600 is described. The substrate processing apparatus 600 may be as follows. Figure 4The operation is performed as illustrated in the flowchart of . That is, the substrate processing device 600 first extracts the substrate W from the FOUP or the like (step S101). The substrate W is extracted using the fork provided in the hand 630 of the substrate processing device 600. Next, the extracted substrate W is transferred to the disk 640 provided in the substrate processing device 600 (step S102). The disk 640 is provided on the lifting unit 611. The hand 630 from which the substrate W is extracted rotates, and transfers the substrate W to the disk 640 provided on the lifting unit 611 of the substrate processing device 600. Next, the substrate W is imaged by a camera (not shown in the figure) (step S105). During the imaging, the lamp (not shown in the figure) provided on the disk 640 can be turned on to illuminate the substrate W. The lamp and the camera provided on the disk 640 can be the same as those in the above-mentioned embodiment. Next, the position of the substrate W is calculated based on the captured image (step S107). In order to calculate the position of the substrate W, for example, the position of the notch and the orientation plane of the substrate W is obtained from the captured image, and the correction amount of the substrate position is calculated based on the position and orientation of the substrate W relative to the position and orientation of the fork. In order to measure and correct the misalignment of the substrate W, reference is made to U.S. Patent Publication 2021 / 0257242 and support is given. Next, the substrate is placed on a manufacturing device for the next process based on the calculated correction amount (step S109).

[0069] Therefore, according to the substrate processing apparatus 600 of one or more embodiments, when an image of a substrate for correcting the position of the substrate W is obtained, the substrate is transferred to a tray having a lamp that illuminates the substrate. Since the tray is provided on the substrate processing apparatus 600, the moving distance of the tray can be shortened, and the moving time of the tray can be reduced. In addition, since the imaging position is on the upper portion of the arm, the detection of the position and orientation of the substrate is improved. Furthermore, by providing the tray 640 on the lifting unit 611, an unexpected effect is obtained in that the amount of light observed from the substrate W is stable. For Fig.10 Examples of the structure and operation of the embodiments illustrated in US Pat. Nos. US8746631 and US10083851 are incorporated herein by reference.

[0070] Fig.11 is a diagram illustrating a perspective view of a substrate processing apparatus 700 according to one or more embodiments. Fig.11 The substrate processing apparatus 700 of FIG. 1 illustrates a horizontally articulated clean robot, and in particular illustrates a part of the clean robot, wherein the lifting column 701 is a column type, and the hand 730 is directly connected to the first lifting unit 711. The substrate processing apparatus 700 is similar to Fig.10; however, the difference of the substrate processing apparatus 700 is that the disk 740 is held in the disk holder 712. The disk holder 712 is connected to the groove provided in the lifting column 701, and the disk 740 is provided at a predetermined interval from the lifting column 701. The disk holder 712 is provided at a position lower than the first lifting unit 711, but is not limited thereto, and the disk holder 714 may be provided at a position higher than the first lifting unit 711. In addition, the disk holder 712 is provided near the first lifting unit 711. When the first lifting unit 711 moves, the disk holder 712 may be lifted and lowered in the Z-axis direction illustrated in the figure.

[0071] Each of the first lifting unit 711 and the hand 730 is controlled by a controller (not shown in the figure) in operation. In addition, each of the first lifting unit 711 and the hand 730 can be driven by an actuator (not shown in the figure). The actuator (not shown in the figure) may include, for example, an electric motor. At the arm joint between the lifting unit 711 and the hand 730, an encoder may be attached to detect each rotation position of the hand 730. In addition, in the substrate processing device 700, an encoder may be provided to detect the position change of the hand 730 in the height direction, such as the lifting amount of the hand 730 of the lifting unit 711. In this way, the joint of the hand 730 is controlled to transfer the substrate. In addition, the disc holder 712 may be fixed to the lifting column 701 and may be controlled by a controller (not shown in the figure) in operation. In addition, the disc holder 712 may be driven by an actuator (not shown in the figure). In addition, in the substrate processing apparatus 700 , an encoder may be provided to detect a position change of the disk holder 712 in the height direction, such as a lifting amount of the disk 740 of the disk holder 712 .

[0072] The substrate processing apparatus 700 includes a disk 740. The disk 740 is disposed on the disk holder 712. The disk 740 may be disposed in consideration of the position of the substrate W held by the hand 730. The hand 730 takes out the substrate W and moves the substrate W to the upper portion of the disk 740. For example, after extracting the substrate W, the hand 730 rotates and moves in the XY surface illustrated in the figure, and moves the substrate W to the upper portion of the disk 740 along the Z axis. The lifting unit 711 moves in the Z axis direction illustrated in the figure, for example, moves downward, and moves the substrate W to approximately directly above the disk 740. Thus, the disk 740 is positioned so that the disk 740 is substantially located below the substrate W. Fig.11 The shape of the disk-shaped member 740 illustrated in FIG. 7 is circular, but is not limited thereto and may be implemented. The shape and size of the disk-shaped member 740 may be the same as those in the above-described embodiment.

[0073] Next, the operation of the substrate processing apparatus 700 is described. The substrate processing apparatus 700 may be Figure 4 The operation is performed as illustrated in the flowchart of . That is, the substrate processing apparatus 700 first removes the substrate W from a FOUP or the like (step S101). The substrate W is removed using a fork provided in the hand 730 of the substrate processing apparatus 700. Next, the removed substrate W is transferred to a disk 740 provided in the substrate processing apparatus 700 (step S102). The disk 740 is provided in a disk holder 712. The hand 730 from which the substrate W is removed is moved, and the substrate W is moved to the disk 740 provided in the disk holder 712 of the substrate processing apparatus 700. Here, when the removed substrate W is transferred to the disk 740 provided in the substrate processing apparatus 700, the lifting unit 711 can move the substrate W above the disk holder 712, and the disk holder 714 can move the disk 740 below the substrate W. Next, the substrate W is imaged by a camera (not shown in the figure) (step S105). During imaging, a lamp (not shown in the figure) provided on the disk 740 can be turned on to illuminate the substrate W. The lamp and camera provided on the disk 740 can be the same as those in the above-mentioned embodiment. Next, the position of the substrate W is calculated based on the captured image (step S107). In order to calculate the position of the substrate W, for example, the position of the notch and the orientation plane of the substrate W are obtained from the captured image, and the correction amount of the substrate position is calculated based on the position and orientation of the substrate W relative to the position and orientation of the fork. The measurement and correction of the misalignment of the substrate W is disclosed in U.S. Patent Publication 2021 / 0257242, the entire contents of which are incorporated herein by reference. Next, the substrate is placed on a manufacturing device for the next process based on the calculated correction amount (step S109).

[0074] Therefore, according to the substrate processing apparatus 700 of one or more embodiments, when an image of a substrate for correcting the position of the substrate W is obtained, the substrate is transferred to the tray 740 having a lamp that illuminates the substrate. Since the tray 740 is provided in the substrate processing apparatus 700, the moving distance of the tray can be shortened, and the moving time of the tray can be shortened. Examples of the structure and operation of this embodiment are described in U.S. Pat. No. US8,746,631 and U.S. Pat. No. US10,083,851. Fig.11 , the entire contents of which are incorporated herein by reference.

[0075] In the related art, the substrate is placed on the hand of the substrate processing equipment and is moved to the place where the substrate is imaged. In addition, it is necessary to place an aligner near the substrate processing equipment to adjust the orientation of the substrate, etc. Therefore, the moving distance of the disc increases, and the moving time of the disc increases, which affects the production volume. In addition, for example, when installing a dedicated workstation or aligner for imaging, additional equipment is required, resulting in restrictions on floor plan. In addition, the design of floor plan must take into account the movement of the arm of the substrate processing equipment.

[0076] According to the substrate processing apparatus of one or more embodiments, a disk is provided in the substrate processing apparatus, and the substrate is imaged on the disk. Therefore, the movement of the disk can be minimized. Therefore, since the movement time of the disk can be minimized, the throughput of substrate transfer can be improved. In addition, the disk has a light that illuminates the substrate during imaging. Here, the camera is provided above the substrate, and the disk is provided below the substrate. In other words, during imaging, the disk becomes a backlight, so that a clearer substrate image can be obtained.

[0077] In addition, according to the substrate processing apparatus of one or more embodiments, a correction amount related to the position and orientation of the substrate is calculated, and the substrate is placed on a semiconductor manufacturing device for the next process based on the correction amount. In this case, the substrate is placed at a predetermined position and orientation by a placement operation based on the correction amount. Therefore, since it is not necessary to place an aligner in the substrate processing apparatus as in the prior art, the degree of freedom of plane planning is improved.

[0078] Within the scope of the intended embodiment, one or more of the above embodiments herein may be combined with each other within a feasible range. The above embodiments should be considered to be exemplary in all respects, rather than restrictive. Without departing from the intended scope of the present invention, the illustrated and described embodiments may be extended to include other embodiments in addition to the specifically described embodiments. The scope of the present invention should be determined by the claims including equivalents in conjunction with the specification, rather than merely by the foregoing description. Therefore, it is intended that all configurations, including those included in the equivalent scope of the claims, are included in the present invention. Therefore, all configurations, including those included in the equivalent configurations of the claims, are intended to be included in the present invention.

Claims

1. A substrate processing device, comprising: base; a lifting unit connected to the base to freely move up and down; a hand unit, the hand unit being movably connected to the lifting unit and acquiring the substrate; as well as A disk-shaped member is positioned at a position where the hand unit moves the substrate.

2. The substrate processing apparatus according to claim 1, wherein: The hand unit comprises: an arm rotatably connected to the lifting unit; and a hand that is movably connected to the arm and acquires the substrate; 3. The substrate processing apparatus according to claim 2, wherein: The disk is positioned on the arm.

4. The substrate processing apparatus according to claim 1, wherein: The disk is positioned on the base.

5. The substrate processing apparatus according to claim 2, wherein: With the hand positioned overlapping the arm, the disk is positioned beneath the substrate captured by the hand.

6. The substrate processing apparatus according to claim 1, wherein: The disk includes lights that illuminate the substrate.

7. The substrate processing apparatus according to claim 1, wherein: The disk includes a plurality of lamps that illuminate the substrate.

8. The substrate processing apparatus according to claim 7, wherein: The plurality of lamps are arranged on the entire surface of the disk.

9. The substrate processing apparatus according to claim 7, wherein: The plurality of lamps are arranged on a periphery of the disk.

10. The substrate processing apparatus according to claim 6, wherein: With the disk being imaged, the light is turned on.

11. The substrate processing apparatus according to claim 2, wherein: The arm comprises: a first arm rotatably connected to the lifting unit; and A second arm is rotatably connected to the first arm, wherein the disk is disposed on the second arm.

12. The substrate processing apparatus according to claim 2, wherein: The hand includes a suction hand, and the suction hand includes a suction portion.

13. The substrate processing apparatus according to claim 2, wherein: The hand includes a light that illuminates the substrate.

14. A substrate processing method, comprising: extracting the substrate; conveying the extracted substrate onto a disc; imaging the substrate using a camera; calculating a position of the substrate based on the captured image; as well as The substrate is positioned based on the calculated correction amount.

15. The substrate processing method according to claim 14, wherein: In case the substrate is imaged, the substrate is illuminated.

16. The substrate processing method according to claim 15, wherein: After imaging of the substrate is complete, the substrate is not illuminated.

Images