Optical module

Abstract

The optical module provided by the invention comprises an optical fiber adapter, an optical accommodating component and a light emitting component. The light emitting component comprises a second shell, and a first laser assembly, a second laser assembly, a third laser assembly, a first adapter plate and a second adapter plate which are arranged in the second shell, and the first laser assembly, the second laser assembly and the third laser assembly are arranged in the second shell in a non-side-by-side manner; and a first high-frequency pin and a second high-frequency pin are arranged on the side wall of the second shell. A first high-frequency transmission line is arranged on the first adapter plate, a second high-frequency transmission line is arranged on the second adapter plate, the first high-frequency transmission line is connected with the first laser assembly and the first high-frequency pin, and the second high-frequency transmission line is connected with the second laser assembly and the second high-frequency pin. Impedance matching of the first laser assembly is realized through the first adapter plate, and impedance matching of the second laser assembly is realized through the second adapter plate. According to the optical module provided by the invention, the packaging volume of the light emitting component is reduced, and the multi-transmission-channel requirement of the optical module is met.

Description

Technical Field

[0001] The present disclosure relates to the field of optical fiber communication technologies, and particularly to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technologies have become increasingly important. In optical communication technologies, an optical module is a tool for realizing the mutual conversion between optical and electrical signals, and is one of the key components in optical communication devices. Moreover, with the development needs of optical communication technologies, the transmission rate of optical modules is continuously increasing.

[0003] Currently, to improve the transmission rate of an optical module, multiple transmission channels are provided in the optical module, that is, the transmission capacity is improved through a multi-channel design in the optical module. However, when the number of transmission channels in the optical module increases, the number of components involved will also increase, posing higher requirements for the packaging of the optical module. Summary of the Invention

[0004] Embodiments of the present disclosure provide an optical module, which is convenient for controlling the volume of the optical module and adapting to the requirements of multiple transmission channels of the optical module.

[0005] An optical module provided by the present disclosure includes: an optical fiber adapter, one end of which is used to connect to an external optical fiber;

[0006] an optical accommodation component, one end of which is connected to the other end of the optical fiber adapter, and the optical accommodation component is used to receive fourth-wavelength optical signals, fifth-wavelength optical signals, and sixth-wavelength optical signals input through the optical fiber adapter;

[0007] an optical emission component, one end of which is connected to the other end of the optical accommodation component, and the optical emission component inputs first-wavelength optical signals, second-wavelength optical signals, and third-wavelength optical signals to the optical accommodation component and transmits them to the optical fiber adapter through the optical accommodation component;

[0008] Wherein, the optical emission component includes a second housing and a first laser component, a second laser component, a third laser component, a first adapter board, and a second adapter board arranged in the second housing; multiple rows of pins are arranged on a third side wall of the second housing, and a first high-frequency pin and a second high-frequency pin are included among the pins in the bottom row on the third side wall, and one end of the first high-frequency pin and one end of the second high-frequency pin pass through the third side wall and extend into the second housing; the first laser component generates first-wavelength optical signals, the second laser component generates second-wavelength optical signals, and the third laser component generates third-wavelength optical signals;

[0009] The first adapter board and the second adapter board are disposed on the side of the third sidewall. The first laser assembly is located on the side of the first adapter board. The second laser assembly is located on the side of the second adapter board. The third laser assembly is located on the side of the second laser assembly. And the first laser assembly, the second laser assembly, and the third laser assembly are distributed on the sides of two connected sidewalls of the second housing.

[0010] The first adapter board is provided with a first high-frequency transmission line, and the second adapter board is provided with a second high-frequency transmission line. The first laser assembly and the first high-frequency pin are electrically connected to the first high-frequency transmission line respectively, and the second laser assembly and the second high-frequency pin are electrically connected to the second high-frequency transmission line respectively.

[0011] In the optical module provided by the present disclosure, the optical emission component includes a second housing and a first laser assembly, a second laser assembly, a third laser assembly, a first adapter board, and a second adapter board disposed in the second housing. The first laser assembly, the second laser assembly, and the third laser assembly are non-parallelly disposed in the second housing. A first high-frequency pin and a second high-frequency pin are disposed on the sidewall of the second housing. The first adapter board is provided with a first high-frequency transmission line, and the second adapter board is provided with a second high-frequency transmission line. The first high-frequency transmission line connects the first laser assembly and the first high-frequency pin, and the second high-frequency transmission line connects the second laser assembly and the second high-frequency pin, so as to achieve impedance matching of the first laser assembly through the first adapter board and impedance matching of the second laser assembly through the second adapter board. Therefore, the optical module provided by the present disclosure facilitates reducing the packaging volume of the optical emission component and adapting to the multi-transmission channel requirements of the optical module. Description of the Drawings

[0012] In order to more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings in the following description are only the drawings of some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can also be obtained according to these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams and are not limitations on the actual sizes of the products, the actual processes of the methods, the actual timings of the signals, etc. involved in the embodiments of the present disclosure.

[0013] Figure 1 It is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0014] Figure 2 It is a partial structure diagram of a host computer provided according to some embodiments of the present disclosure;

[0015] Figure 3 It is a schematic structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0016] Figure 4 Exploded view of an optical module provided according to some embodiments of the present disclosure;

[0017] Figure 5 Schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure Figure 1 ;

[0018] Figure 6 Schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure Figure 2 ;

[0019] Figure 7 Exploded view of the internal structure of an optical module provided according to some embodiments of the present disclosure;

[0020] Figure 8 Exploded view of an optical fiber adapter and a first housing provided according to some embodiments of the present disclosure;

[0021] Figure 9 Cross-sectional view of the internal structure of an optical module provided according to some embodiments of the present disclosure;

[0022] Figure 10 Schematic diagram of the structure of a first housing provided according to some embodiments of the present disclosure Figure 1 ;

[0023] Figure 11 Exploded view of a first housing provided according to some embodiments of the present disclosure;

[0024] Figure 12 Schematic diagram of the structure of a first housing provided according to some embodiments of the present disclosure Figure 2 ;

[0025] Figure 13 Usage state of a first housing provided according to some embodiments of the present disclosure Figure 1 ;

[0026] Figure 14 Usage state of a first housing provided according to some embodiments of the present disclosure Figure 2 ;

[0027] Figure 15 Cross-sectional view of an optical accommodation component provided according to some embodiments of the present disclosure;

[0028] Figure 16 Schematic diagram of the structure of an optical emission component provided according to some embodiments of the present disclosure Figure 1 ;

[0029] Figure 17 Schematic diagram of the structure of an optical emission component provided according to some embodiments of the present disclosureFigure 2 ;

[0030] Figure 18 Exploded view of an optical emission component provided according to some embodiments of the present disclosure;

[0031] Figure 19 Partial structure schematic of an optical emission component provided according to some embodiments of the present disclosure Figure 1 ;

[0032] Figure 20 Partial structure schematic of an optical emission component provided according to some embodiments of the present disclosure Figure 2 ;

[0033] Figure 21 Partial structure schematic of an optical emission component provided according to some embodiments of the present disclosure Figure 3 ;

[0034] Figure 22 Cross-section of an optical emission component provided according to some embodiments of the present disclosure Figure 1 ;

[0035] Figure 23 Cross-section of an optical emission component provided according to some embodiments of the present disclosure Figure 2 ;

[0036] Figure 24 Cross-section of an optical emission component provided according to some embodiments of the present disclosure Figure 3 ;

[0037] Figure 25 Transmission optical path diagram of an optical emission signal provided according to some embodiments of the present disclosure;

[0038] Figure 26 Structure schematic of a mounting bracket provided according to some embodiments of the present disclosure Figure 1 ;

[0039] Figure 27 Structure schematic of a mounting bracket provided according to some embodiments of the present disclosure Figure 2 ;

[0040] Figure 28 Usage state diagram of a mounting bracket provided according to some embodiments of the present disclosure. Specific embodiments

[0041] The following will clearly and detailedly describe some embodiments of the present disclosure in conjunction with the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided by the present disclosure fall within the scope of protection of the present disclosure.

[0042] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is construed in an open, inclusive sense, i.e., "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or an upper limit on quantity; the term "a plurality" means two or more; the term "connected" should be understood in a broad sense. For example, "connected" may be a fixed connection, a detachable connection, or integrated, may be directly connected, or may be indirectly connected through an intermediate medium; the use of the term "adapted to" or "configured to" implies open and inclusive language and does not exclude a device adapted to or configured to perform additional tasks or steps; descriptions such as "parallel", "perpendicular", "identical", "consistent", "flush", etc. are not limited to absolute mathematical relationships, but also include an acceptable error range that occurs in practice, and also include differences formed due to manufacturing reasons based on the same design concept.

[0043] In optical communication technology, in order to establish information transmission between information processing devices, it is necessary to load information onto light and utilize the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When the optical signal is transmitted in an information transmission device, the loss of optical power can be reduced, so high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing devices can recognize and process are electrical signals. Information processing devices generally include an Optical Network Unit (ONU), a gateway, a router, a switch, a mobile phone, a computer, a server, a tablet computer, a television, etc., and information transmission devices generally include optical fibers and optical waveguides, etc.

[0044] An optical module can realize the mutual conversion between optical signals and electrical signals between an information processing device and an information transmission device. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since information can be transmitted between multiple information processing devices through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all information processing devices being directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the host computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0045] Figure 1 Partial structural diagram of an optical communication system according to some embodiments. As Figure 1 shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0046] One end of the optical fiber 101 extends in the direction of the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance and low-power-loss information transmission.

[0047] The optical communication system may include one or more optical fibers 101, and the optical fiber 101 is detachably or fixedly connected to the optical module 200. The host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor or control the working state of the optical module 200.

[0048] The host computer 100 includes a housing substantially in the shape of a cuboid, and an optical module interface 102 provided on the housing. The optical module interface 102 is configured to access the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0049] The host computer 100 further includes an external power interface, which can access an electrical signal network. For example, the external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103, so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, a third electrical signal sent by the local information processing device 2000 is transmitted into the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote server device 1000. For example, a first optical signal from the remote information processing device 1000 propagates through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal according to the first electrical signal and transmits the fourth electrical signal into the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. In the above conversion process of optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information may change.

[0050] In addition to including an optical network terminal, the host computer 100 further includes an Optical Line Terminal (OLT), an Optical Network Terminal (ONT), or a data center server, etc.

[0051] Figure 2 It is a partial structure diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 only the structure of the host computer 100 related to the optical module 200 is shown. As Figure 2 shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a radiator 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the radiator 107 has raised structures such as fins for increasing the heat dissipation area.

[0052] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 fixes the optical module 200, and the heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the radiator 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so as to establish a two-way electrical signal connection between the optical module 200 and the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so as to establish a two-way optical signal connection between the optical module 200 and the optical fiber 101.

[0053] Figure 3 It is a structural diagram of an optical module provided according to some embodiments of the present disclosure. Figure 4 It is an exploded schematic view of an optical module provided according to some embodiments of the present disclosure. As Figure 3 and Figure 4 shown, the optical module 200 includes a shell, a circuit board 300, an optical transmitting component 400 and an optical accommodating component 500 arranged in the shell. At least one optical receiving component is arranged on the optical accommodating component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the optical transmitting component 400 and the optical accommodating component 500.

[0054] The shell includes an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202 to form the above-mentioned shell with two openings; the outer contour of the shell generally presents a rectangular body.

[0055] In some embodiments of the present disclosure, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0056] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to realize the upper shell 201 covering the lower shell 202.

[0057] The direction where the connection line of the two openings 203 and 204 is located may be consistent with the length direction of the optical module 200 or may not be consistent with the length direction of the optical module 200. For example, the opening 203 is located at the end of the optical module 200 ( Figure 3 the right end), and the opening 204 is also located at the end of the optical module 200 ( Figure 3left end). Alternatively, the opening 203 is located at the end of the optical module 200, while the opening 204 is located at the side of the optical module 200. The opening 203 is an electrical port, and the gold fingers of the circuit board 300 extend from the electrical port and are inserted into the host computer (for example, the optical network terminal 100); the opening 204 is an optical port and is configured to access the optical fiber 101 so that the optical fiber 101 connects the optical transmitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0058] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of components such as the circuit board 300, the optical transmitting component 400, and the optical receiving component 500 into the housing, and the upper housing 201 and the lower housing 202 form a package protection for these devices. In addition, when assembling components such as the circuit board 300, the optical transmitting component 400, and the optical receiving component 500, it is convenient for the deployment of the positioning components, heat dissipation components, and electromagnetic shielding components of these devices, which is conducive to the automated implementation of production.

[0059] In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is conducive to achieving electromagnetic shielding and heat dissipation.

[0060] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0061] Exemplarily, the unlocking component 600 is located outside the two lower side plates 2022 of the lower housing 202 and includes an engaging component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the engaging component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the engaging component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the engaging component and the host computer to release the fixation of the optical module 200 to the host computer, so that the optical module 200 can be withdrawn from the cage 106.

[0062] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected together according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. The electronic components include, for example, capacitors, resistors, transistors, and Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs). The chips include, for example, Microcontroller Units (MCUs), laser driver chips, Limiting Amplifiers (LAs), Clock and Data Recovery (CDR) chips, power management chips, and Digital Signal Processing (DSP) chips.

[0063] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also play a bearing role. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage.

[0064] The circuit board 300 further includes a gold finger 310 formed on its end surface. The gold finger 310 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 310 is conductively connected to the electrical connector in the cage 106. The gold finger 310 can be provided only on the surface of one side of the circuit board 300 (for example Figure 4 the upper surface shown), or can be provided on the upper and lower surfaces of the circuit board 300 to adapt to the occasion with a large demand for the number of pins. The gold finger 310 is configured to establish an electrical connection with the upper computer to achieve functions such as power supply, grounding, I2C signal transmission, and data signal transmission. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in cooperation with rigid circuit boards as a supplement to the rigid circuit boards.

[0065] In some embodiments, the optical emission component 400 and the optical accommodation component 500 are physically separated from the circuit board 300 respectively, and then are electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors respectively.

[0066] Figure 5 Schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure Figure 1 , Figure 6 Schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure Figure 2 . As Figure 5 and Figure 6As shown, one end of the optical housing component 500 is connected to the fiber optic adapter 700, and the other end of the optical housing component 500 is connected to the optical transmitting component 400. The optical signal generated by the optical transmitting component 400 is first transmitted into the optical housing component 500, then transmitted through the optical housing component 500 to the fiber optic adapter 700, and finally output through the fiber optic adapter 700; the externally input optical signal is input into the optical housing component 500 through the fiber optic adapter 700, so that the optical housing component 500 and the optical transmitting component 400 share the fiber optic adapter 700, and further the upstream optical signal and the downstream optical signal of the optical module share the optical fiber 101.

[0067] In some embodiments, the optical transmitting component 400 generates optical emission signals of multiple wavelengths and can combine the optical emission signals of multiple wavelengths into one optical emission signal; multiple optical receiving components are provided on the optical housing component 500, so that the optical housing component 500 can receive optical receiving signals including multiple wavelengths. Exemplarily, the optical transmitting component 400 generates optical emission signals of three wavelengths, and the rates of the optical emission signals of the three wavelengths are different, such as the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal with different rates; the optical housing component 500 receives optical receiving signals of three wavelengths, and the rates of the optical receiving signals of the three wavelengths are different, such as the fourth wavelength optical signal, the fifth wavelength optical signal, and the sixth wavelength optical signal with different rates.

[0068] In some embodiments, the wavelength range of the first wavelength optical signal is 1340 - 1344 nm, such as the wavelength of the first wavelength optical signal is 1342 nm; the wavelength range of the second wavelength optical signal is 1575 - 1580 nm, such as the wavelength of the second wavelength optical signal is 1577 nm; the wavelength range of the third wavelength optical signal is 1480 - 1500 nm, such as the wavelength of the third wavelength optical signal is 1490 nm; the wavelength range of the fourth wavelength optical signal is 1260 - 1280 nm, such as the wavelength of the fourth wavelength optical signal is 1270 nm; the wavelength range of the fifth wavelength optical signal is 1284 - 1288 nm, such as the wavelength of the fifth wavelength optical signal is 1286 nm; the wavelength range of the sixth wavelength optical signal is 1290 - 1330 nm, such as the wavelength of the sixth wavelength optical signal is 1310 nm.

[0069] In some embodiments, the receiving rates of the photodetectors in the first optical receiving component 530, the second optical receiving component 540, and the third optical receiving component 550 are different. Exemplarily, the receiving rate of the photodetector in the second optical receiving component 540 is greater than that of the photodetector in the first optical receiving component 530, and the receiving rate of the photodetector in the second optical receiving component 540 is greater than that of the photodetector in the third optical receiving component 550, such that the optical transmission path of the fifth wavelength optical signal with the maximum transmission rate from the output of the wavelength division multiplexer 564 to the photodetector is relatively the shortest and the optical path is the simplest, so as to facilitate the photodetector in the second optical receiving component 540 to receive the optical signal with a high coupling efficiency. For example, the receiving rate of the photodetector in the first optical receiving component 530 is 10G, the receiving rate of the photodetector in the second optical receiving component 540 is 50G, and the receiving rate of the photodetector in the third optical receiving component 550 is 2.5G.

[0070] In some embodiments, the optical housing component 500 includes a first housing 510 and a first upper cover 520, and a first cavity is formed by the covering connection of the first housing 510 and the first upper cover 520. The first optical receiving component 530, the second optical receiving component 540, and the third optical receiving component 550 are disposed on the side wall of the first housing 510. An accommodation cavity is formed inside the first cavity, and this accommodation cavity is used to accommodate devices and realize the connection or communication between devices. Exemplarily, a displacement prism, a reflector, etc. are disposed in the accommodation cavity. In some embodiments, an inner cavity is provided on the first housing 510, such that the first upper cover 520 covers the first housing 510 to form the accommodation cavity; the first upper cover 520 is located on the side of the first housing 510 facing the cover plate 2011.

[0071] In some embodiments, one end of the first housing 510 is connected to the fiber optic adapter 700, the other end of the first housing 510 is connected to the optical transmitting component 400, and the first optical receiving component 530, the second optical receiving component 540, and the third optical receiving component 550 are disposed on one side of the first housing 510, so as to realize the encapsulation of the fiber optic adapter 700, the optical transmitting component 400, the first optical receiving component 530, the second optical receiving component 540, and the third optical receiving component 550 through the first housing 510, and to realize the optical connection between the fiber optic adapter 700, the optical transmitting component 400, the first optical receiving component 530, the second optical receiving component 540, and the third optical receiving component 550 and the first accommodation inner cavity respectively. The optical transmitting component 400, the first optical receiving component 530, the second optical receiving component 540, and the third optical receiving component 550 are electrically connected to the circuit board 300 through flexible circuit boards respectively.

[0072] In some embodiments, the optical emission component 400 includes a second housing 410 and a second upper cover 420. The second upper cover 420 is hermetically connected to the second housing 410 to form a second cavity. A plurality of pins 430 are provided on the side wall of the second housing 410, and devices for generating and transmitting an optical emission signal are provided inside the second housing 410. The pins 430 are connected to a flexible circuit board to be electrically connected to the circuit board 300 through the flexible circuit board. Exemplarily, one end of the second housing 410 is connected to the other end of the first housing 510; the second upper cover 420 is located on the side of the second housing 410 facing the bottom plate 2021.

[0073] In some embodiments, multiple rows of pins are respectively provided on two connected side walls of the second housing 410, and high-frequency pins are included among the bottom-row pins on the two connected side walls.

[0074] In some embodiments, an inclined surface 510a is provided at the bottom of the first housing 510. The inclined surface 510a inclines from the bottom surface of the first housing 510 towards the other end of the first housing 510 to facilitate the avoidance of tooling related to the assembly of the optical emission component 400. Exemplarily, when the second upper cover 420 is connected to the second housing 410 by roll welding, the inclined surface 510a avoids the roll welding machine.

[0075] In some embodiments, multiple flexible circuit boards are included inside the optical module. Exemplarily, the optical emission component 400 is electrically connected to the circuit board 300 through two flexible circuit boards, and the first optical receiving component 530, the second optical receiving component 540, and the third optical receiving component 550 are respectively electrically connected to the circuit board 300 through corresponding flexible circuit boards.

[0076] Figure 7 It is an exploded schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure. As Figure 7 shown, the first optical receiving component 530, the second optical receiving component 540, and the third optical receiving component 550 are coaxially packaged. Exemplarily, a first connection hole 511, a second connection hole 512, and a third connection hole 513 are provided on the side wall of the first housing 510. The first connection hole 511, the second connection hole 512, and the third connection hole 513 respectively communicate with the first accommodation cavity; the first optical receiving component 530 is embedded and connected to the first connection hole 511, the second optical receiving component 540 is embedded and connected to the second connection hole 512, and the third optical receiving component 550 is embedded and connected to the third connection hole 513.

[0077] At the other end of the first housing 510, a cut-off corner 510b is formed. The cut-off corner 510b is located on the side of the third connection hole 513. A connection seat 5101 is arranged in the cut-off corner 510b. One end of the connection seat 5101 is connected to the side wall of the first housing 510, and the other end of the connection seat 5101 is connected to the second housing 410. Exemplarily, the connection seat 5101 is integrally formed with the first housing 510. A fifth connection hole 5102 is arranged on the connection seat 5101, and the fifth connection hole 5102 communicates with the first housing 510 and the second housing 410.

[0078] Figure 8 FIG. is an exploded schematic view of an optical fiber adapter and a first housing provided according to some embodiments of the present disclosure. Figure 9 FIG. is a cross-sectional view of the internal structure of an optical module provided according to some embodiments of the present disclosure. Figure 9 shows the cross-sectional structure of the optical fiber adapter. As Figure 8 and Figure 9 shown, a fourth connection hole 514 is arranged on the side wall at one end of the first housing 510, and the fourth connection hole 514 communicates with the first accommodation cavity; a connection sleeve 515 is arranged at one end of the first housing 510. One end of the connection sleeve 515 is connected to the optical fiber adapter 700, and the other end of the connection sleeve 515 is connected to the outer side wall of the first housing 510; the connection sleeve 515 communicates with the fourth connection hole 514.

[0079] A first lens 516 is arranged in the fourth connection hole 514. The first lens 516 is used for converging the optical emission signal and collimating the optical reception signal. Exemplarily, the fourth connection hole 514 includes a lens mounting hole 5141. The lens mounting hole 5141 is a stepped hole formed on the fourth connection hole 514. A lens mounting seat 5161 is arranged on the first lens 516, and the lens mounting seat 5161 is embedded in the lens mounting hole 5141 to fixedly connect the first lens 516 and the first housing 510 through the lens mounting seat 5161. A step is formed on the outer side of one end of the lens mounting seat 5161, which is convenient for moving and clamping, and thus convenient for the assembly of the first lens 516.

[0080] Figure 10 FIG. is a schematic structure of a first housing provided according to some embodiments of the present disclosure Figure 1 , Figure 11 FIG. is an exploded schematic view of a first housing provided according to some embodiments of the present disclosure. Figure 12 FIG. is a schematic structure of a first housing provided according to some embodiments of the present disclosure. Figure 2 . As Figures 10 - 12 shown, an accommodation cavity 517 is formed inside the first housing 510, and the first connection hole 511, the second connection hole 512, the third connection hole 513, and the fourth connection hole 514 communicate with the accommodation cavity 517 respectively.

[0081] In some embodiments, a first displacement prism 561, a first mirror 562, a first filter 563, a wavelength division multiplexer 564, a second displacement prism 565, a third displacement prism 566, and a fourth displacement prism 567 are disposed in the accommodation cavity 517. A first mounting surface 518 is provided at the top of the first housing 510, and the first mounting surface 518 supports and connects to the first upper cover 520.

[0082] Figure 13 The use state of a first housing provided according to some embodiments of the present disclosure Figure 1 , Figure 14 The use state of a first housing provided according to some embodiments of the present disclosure Figure 2 . As Figures 10 - 14 shown, the accommodation cavity 517 includes a first accommodation cavity 5171, a second accommodation cavity 5172, and a third accommodation cavity 5173. A first side of the first accommodation cavity 5171 communicates with the fourth connection hole 514. The second accommodation cavity 5172 is disposed on a second side of the first accommodation cavity 5171. A first baffle 5174 is provided between the second accommodation cavity 5172 and the first accommodation cavity 5171, and a first through cavity 5175 is formed in the first baffle 5174. The first through cavity 5175 communicates the first accommodation cavity 5171 and the second accommodation cavity 5172; the top of the first baffle 5174 supports and connects to the first upper cover 520. A third accommodation cavity 5173 is disposed on a third side of the first accommodation cavity 5171. A second baffle 5176 is provided between the first accommodation cavity 5171 and the third accommodation cavity 5173, and a second through cavity 5177 is formed in the second baffle 5176. The second through cavity 5177 communicates the first accommodation cavity 5171 and the third accommodation cavity 5173. The second accommodation cavity 5172 extends from one end of the first housing 510 to the other end of the first housing 510, and the other end of the second accommodation cavity 5172 extends to the side of the cut corner 510b; the third accommodation cavity 5173 is located on the side of the fifth connection hole 5102, and the third accommodation cavity 5173 communicates with the fifth connection hole 5102.

[0083] The first displacement prism 561, the first mirror 562, the first filter 563, and the wavelength division multiplexer 564 are disposed in the first accommodation cavity 5171, the second displacement prism 565 and the third displacement prism 566 are disposed in the second accommodation cavity 5172, and the fourth displacement prism 567 is disposed in the third accommodation cavity 5173. Exemplarily, the sides of the second displacement prism 565 and the third displacement prism 566 abut against the side wall of the first baffle 5174, and the first baffle 5174 fixedly supports the second displacement prism 565 and the third displacement prism 566; the first filter 563 is disposed on the second baffle 5176, and the second baffle 5176 fixedly supports the first filter 563.

[0084] In an embodiment of the present disclosure, the fourth displacement prism 567 is used to make the fifth connection hole 5102 closer to the midline of the first housing 510 to adapt to the optical emission component 400, and make the assembly of the optical emission component 400 and the optical accommodation component 500 more concentrated, so as to facilitate reducing the space occupied by the assembly of the optical emission component 400 and the optical accommodation component 500 in the optical module and meet the requirements of multiple transmission channels of the optical module.

[0085] In some embodiments, a mounting seat 568 is further disposed in the accommodation cavity 517. The bottom of the mounting seat 568 is connected to the bottom of the first accommodation cavity 5171, and the side of the mounting seat 568 fixedly supports the first reflector 562. Exemplarily, the first reflector 562 is first fixed on the mounting seat 568, and the first reflector 562 is set to a preset position through optical path coupling, and then the mounting seat 568 is fixed. The mounting seat 568 facilitates fixing the first reflector 562 in the first accommodation cavity 5171.

[0086] In some embodiments, an opening 519 is provided on the fourth side of the first accommodation cavity 5171. The opening 519 is located on the side of the mounting seat 568, and a sealing plate 5191 is disposed in the opening 519. The provision of the opening 519 on the fourth side of the first accommodation cavity 5171 facilitates the fixing and installation of the mounting seat 568, and further facilitates fixing the first reflector 562 in the first accommodation cavity 5171. Exemplarily, when the first reflector 562 is set to a preset position through optical path coupling, a light fixing device irradiates light for light fixing on the mounting seat 568 through the opening 519 to fix the mounting seat 568 on the bottom plate of the first accommodation cavity 5171; after the mounting seat 568 is light-fixed to the first accommodation cavity 5171, the sealing plate 5191 is fixed on the opening 519.

[0087] Figure 15 It is a cross-sectional view of an optical accommodation component provided according to some embodiments of the present disclosure. Figure 15Shown therein is an optical transmission path for an optical reception signal and an optical transmission signal in an optical accommodation component. The optical transmission signal output by the optical transmission component 400 is transmitted through the fifth connection hole 5102 to the incident surface of the fourth displacement prism 567, transmitted through the incident surface of the fourth displacement prism 567 to the first reflection surface of the fourth displacement prism 567, reflected by the first reflection surface of the fourth displacement prism 567 to the second reflection surface of the fourth displacement prism 567 and then transmitted to the light-emitting surface of the fourth displacement prism 567, transmitted through the light-emitting surface of the fourth displacement prism 567 to the first filter 563, transmitted through the first filter 563, transmitted to the first displacement prism 561 and output through the output optical path of the first displacement prism 561 to the fourth connection hole 514, and converged by the first lens 516 and transmitted to the fiber optic adapter 700. The optical reception signal is transmitted to the first lens 516 through the fiber optic adapter 700, collimated by the first lens 516 and transmitted to the incident surface of the first displacement prism 561, transmitted through the incident surface of the first displacement prism 561 to the first reflection surface of the first displacement prism 561, reflected by the first reflection surface of the first displacement prism 561 and transmitted to the second reflection surface of the first displacement prism 561, reflected by the second reflection surface of the first displacement prism 561 and transmitted to the light-emitting surface of the first displacement prism 561, transmitted through the light-emitting surface of the first displacement prism 561 to the first filter 563, reflected by the first filter 563 and transmitted to the first mirror 562, and reflected by the first mirror 562 and transmitted to the wavelength division multiplexer 564. If the optical reception signal includes a fourth-wavelength optical signal, the fourth-wavelength optical signal is transmitted by the wavelength division multiplexer 564 to the second displacement prism 565 and then transmitted to the first optical reception component 530; if the optical reception signal includes a fifth-wavelength optical signal, the fifth-wavelength optical signal is transmitted by the wavelength division multiplexer 564 to the second optical reception component 540. If the optical reception signal includes a sixth-wavelength optical signal, the sixth-wavelength optical signal is transmitted by the wavelength division multiplexer 564 to the third displacement prism 566 and then transmitted to the third optical reception component 550.

[0088] In some embodiments, a filter 541 is provided at the light-incident front end of the second optical reception component 540. The filter 541 is used to filter out the clutter in the optical signal to be incident on the second optical reception component 540, thereby improving the quality of the optical signal incident on the second optical reception component 540.

[0089] In some embodiments, an isolator 569 is provided in the fifth connection hole 5102. The isolator 569 is used to prevent the optical transmission signal reflected back by the fourth displacement prism 567 from re-entering the second housing 410, thereby reducing the influence of the reflected optical transmission signal on the optical transmission signal generated by the optical transmission component 400.

[0090] Figure 16 Schematic structure of an optical transmission component according to some embodiments of the present disclosureFigure 1 , Figure 17 Structural schematic of an optical emission component provided according to some embodiments of the present disclosure Figure 2 , Figure 18 Exploded schematic of an optical emission component provided according to some embodiments of the present disclosure. As Figures 16 - 18 shown, the optical emission component 400 includes a second housing 410 and a second upper cover 420. The second upper cover 420 is cover-connected to the second housing 410 to form a second cavity. The second housing 410 includes a bottom plate 411, a first side wall 412, a second side wall 413, a third side wall 414, and a fourth side wall 415. The first side wall 412, the second side wall 413, the third side wall 414, and the fourth side wall 415 are connected in sequence and their bottoms are respectively connected to the bottom plate 411 to form a second inner cavity. The tops of the first side wall 412, the second side wall 413, the third side wall 414, and the fourth side wall 415 support and connect the second upper cover 420; the bottom plate 411 is used to support the device. In some embodiments, the second housing 410 is a housing integrally formed of a metal material.

[0091] The first side wall 412 is located at one end of the second housing 410. A sixth connection hole 4121 is provided on the first side wall 412. The sixth connection hole 4121 communicates with the second inner cavity, and the sixth connection hole 4121 serves as the light outlet of the second cavity. The sixth connection hole 4121 is connected to the first housing 510, so that the second housing 410 communicates with the accommodation cavity 517 through the sixth connection hole 4121. Exemplarily, the other end of the connection seat 5101 is embedded and connected to the sixth connection hole 4121. In some embodiments, a boss 4122 is provided on the outer side of the first side wall 412. One end of the sixth connection hole 4121 penetrates through the boss 4122, and the end of the connection seat 5101 is embedded and connected to the boss 4122.

[0092] The second side wall 413 is located on the side of the first housing 510. The second side wall 413 is located within the cutout 510b and the second side wall 413 is close to the third optical receiving component 550. The third side wall 414 is located at the other end of the first housing 510. The third side wall 414 is close to the circuit board 300. The fourth side wall 415 is located on the side of the first housing 510. The second side wall 413 is located at the edge of the cutout 510b. Exemplarily, two rows of pins are respectively provided on the third side wall 414 and the fourth side wall 415. Each row of pins includes a plurality of pins 430. For the convenience of description, the row of pins on the third side wall 414 and the fourth side wall 415 close to the bottom plate 411 are the bottom row of pins on the third side wall 414 and the fourth side wall 415; the pins 430 on the third side wall 414 and the pins 430 on the fourth side wall 415 are respectively electrically connected to the circuit board 300 through corresponding flexible circuit boards.

[0093] A first laser component 440, a second laser component 450, and a third laser component 460 are disposed inside the second housing 410. In some embodiments, the first laser component 440 is located on the side of the second sidewall 413 and the third sidewall 414; the second laser component 450 and the third laser component 460 are located on the side of the fourth sidewall 415, and the third laser component 460 is located on the side away from the third sidewall 414 of the second laser component 450. The third laser component 460 is located on the side of the first sidewall 412, so that the first laser component 440, the second laser component 450, and the third laser component 460 are distributed on the sides of two connected sidewalls of the second housing 410. Furthermore, the first laser component 440, the second laser component 450, and the third laser component 460 are in a triangular distribution state, rather than arranged in a row, to reduce the packaging volume of the light emitting component 400. Exemplarily, the first laser component 440 generates a first wavelength optical signal, the second laser component 450 generates a second wavelength optical signal, and the third laser component 460 generates a third wavelength optical signal.

[0094] In some embodiments, the third sidewall 414 is disposed along the width direction of the second housing 410, and the fourth sidewall is disposed along the length direction of the second housing 410, so that the first laser component 440 is disposed in the width direction inside the second housing 410 to reduce the size in the width direction of the second housing 410. The second laser component 450 and the third laser component 460 are disposed in the length direction inside the second housing 410. Cooperating with the first laser component 440 disposed in the width direction inside the second housing 410, sufficient laser components can be disposed inside the second housing 410, and the overall size of the second housing 410 can be reduced, thereby reducing the size of the light emitting component 400.

[0095] In some embodiments, the first laser component 440, the second laser component 450, and the third laser component 460 have different transmission rates. Exemplarily, the transmission rate of the first laser component 440 is greater than that of the second laser component 450, and the transmission rate of the second laser component 450 is greater than that of the third laser component 460. For example, the transmission rate of the first laser component 440 is 50G, the transmission rate of the second laser component 450 is 10G, and the transmission rate of the third laser component 460 is 2.5G.

[0096] On the side of the light outlet in the second housing 410, a second filter 416 and a third filter 417 are further provided. The second filter 416 and the third filter 417 are arranged on the side of the sixth connection hole 4121 and are located on the output optical paths of the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460. The second filter 416 and the third filter 417 are arranged side by side. The second filter 416 and the third filter 417 are used to change the transmission optical paths of the first-wavelength optical signal, the second-wavelength optical signal, and the third-wavelength optical signal, so that the first-wavelength optical signal, the second-wavelength optical signal, and the third-wavelength optical signal can pass through the sixth connection hole 4121. Exemplarily, the third filter 417 and the second filter 416 transmit the first-wavelength optical signal, the third filter 417 reflects the second-wavelength optical signal, the second filter 416 transmits the second-wavelength optical signal, and the second filter 416 reflects the third-wavelength optical signal.

[0097] In some embodiments, the second filter 416 and the third filter 417 are arranged on the side at the connection of the first side wall 412 and the second side wall 413, so that the second filter 416, the third filter 417, and the first laser assembly 440 are arranged compactly, facilitating the control of the dimension in the length direction of the second housing 410.

[0098] In some embodiments, the second filter 416 is arranged at the junction of the output optical paths of the first laser assembly 440 and the third laser assembly 460, and the third filter 417 is arranged at the junction of the output optical paths of the first laser assembly 440 and the second laser assembly 450. The first laser assembly 440 is located on the transmission side of the third filter 417, the second laser assembly 450 is located on the reflection side of the third filter 417, and the third laser assembly 460 is located on the reflection side of the second filter 416. Exemplarily, the second filter 416 includes a first optical surface and a second optical surface, and the first optical surface and the second optical surface are the main optical surfaces of the second filter 416; the third filter 417 includes a third optical surface and a fourth optical surface, and the third optical surface and the fourth optical surface are the main optical surfaces of the third filter 417. The first optical surface faces the third laser assembly 460, the second optical surface faces the third filter 417, the third optical surface faces the second laser assembly 450, and the fourth optical surface faces the first laser assembly 440.

[0099] In some embodiments, a mounting bracket 470 is further provided in the second housing 410. The mounting bracket 470 is arranged on the side of the sixth connection hole 4121 and is fixed in the second housing 410. The mounting bracket 470 supports and connects the second filter 416 and the third filter 417. The second filter 416 and the third filter 417 are fixed in the second housing 410 through the mounting bracket 470, facilitating the fixing of the second filter 416 and the third filter 417 in the second housing 410.

[0100] In some embodiments, a lens 418 is further disposed in the second housing 410, and the lens 418 is disposed on the optical path from the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460 to the second filter 416 or the third filter 417. Exemplarily, a first lens 4181 is disposed on the transmission optical path from the first laser assembly 440 to the third filter 417, and the first lens 4181 collimates the first wavelength optical signal; a second lens 4182 is disposed on the transmission optical path from the second laser assembly 450 to the third filter 417, and the second lens 4182 collimates the second wavelength optical signal; a third lens 4183 is disposed on the transmission optical path from the third laser assembly 460 to the second filter 416, and the third lens 4183 collimates the third wavelength optical signal.

[0101] Figure 19 Schematic diagram of a partial structure of an optical emission component provided according to some embodiments of the present disclosure Figure 1 , Figure 20 Schematic diagram of a partial structure of an optical emission component provided according to some embodiments of the present disclosure Figure 2 , Figure 21 Schematic diagram of a partial structure of an optical emission component provided according to some embodiments of the present disclosure Figure 3 , Figure 22 Cross-section of an optical emission component provided according to some embodiments of the present disclosure Figure 1 , Figure 23 Cross-section of an optical emission component provided according to some embodiments of the present disclosure Figure 2 , Figure 24 Cross-section of an optical emission component provided according to some embodiments of the present disclosure Figure 3 ; Figures 19 - 24 The internal structure of the optical emission component in the embodiments of the present disclosure is shown.

[0102] In some embodiments, the first laser assembly 440 includes a first substrate 441 and a first laser chip 442. The first laser chip 442 is mounted on the first substrate 441, and the first laser chip 442 integrates an electro-absorption modulated laser and a semiconductor optical amplifier. A ground layer 4410, a first high-frequency pad 4411, a first LD pad 4412, and a first SOA pad 4413 are provided on the first substrate 441; the first laser chip 442 is mounted on the ground layer 4410, and the first high-frequency pad 4411, the first LD pad 4412, and the first SOA pad 4413 are located on the side of the first laser chip 442, and the first high-frequency pad 4411, the first LD pad 4412, and the first SOA pad 4413 are respectively wire-bonded to the first laser chip 442. A first high-frequency pin 4301, a first SOA pin 4302, and a first LD pin 4303 are provided on the third sidewall 414. The first high-frequency pin 4301, the first SOA pin 4302, and the first LD pin 4303 are embedded in the third sidewall 414 and the end portions thereof respectively extend into the inner cavity of the second housing 410. The first high-frequency pin 4301, the first SOA pin 4302, and the first LD pin 4303 are respectively insulated from the third sidewall 414 through an insulating layer, and the first high-frequency pin 4301 is located among the pins at the bottom row on the third sidewall 414. The first high-frequency pin 4301 is electrically connected to the first high-frequency pad 4411, the first SOA pin 4302 is electrically connected to the first SOA pad 4413, and the first LD pin 4303 is electrically connected to the first LD pad 4412. In some embodiments, one end of the first high-frequency pin 4301 is wire-bonded to the first high-frequency pad 4411, one end of the first SOA pin 4302 is wire-bonded to the first SOA pad 4413, and one end of the first LD pin 4303 is wire-bonded to the first LD pad 4412.

[0103] In some embodiments, the height position of the first high-frequency pin 4301 on the third sidewall 414 is lower than the height positions of the first SOA pin 4302 and the first LD pin 4303 on the third sidewall 414, that is, the first high-frequency pin 4301 is closer to the bottom plate 411. A first ground pin 4304 is further provided on the third sidewall 414. The first ground pin 4304 is located on the side of the first high-frequency pin 4301 and the first ground pin 4304 is electrically connected to the third sidewall 414.

[0104] In some embodiments, a first adapter board 481 is further provided in the second housing 410. Circuit patterns are provided on the first adapter board 481 to realize the electrical connection between the first high-frequency pin 4301 and the first laser assembly 440 through the first adapter board 481, and the first adapter board 481 can also be used to impedance-match the first laser chip 442 to ensure the impedance continuity of the high-frequency transmission link.

[0105] In some embodiments, a first high-frequency transmission line 4811 is disposed on the front surface of the first adapter board 481. A first ground layer 4812 is disposed on one side of the first high-frequency transmission line 4811, and a second ground layer 4813 is disposed on the other side of the first high-frequency transmission line 4811. One end of the first high-frequency transmission line 4811 is electrically connected to the first high-frequency pad 4411, and the other end of the first high-frequency transmission line 4811 is electrically connected to the first high-frequency pin 4301. Exemplarily, one end of the first high-frequency transmission line 4811 is wire-bonded to the first high-frequency pad 4411, and the other end of the first high-frequency transmission line 4811 is soldered to the first high-frequency pin 4301; the ground layer 4110 is wire-bonded to the first ground layer 4812 and the second ground layer 4813.

[0106] In some embodiments, a ground layer is disposed on the back surface of the first adapter board 481. Vias are respectively disposed on the first ground layer 4812 and the second ground layer 4813, and the first ground layer 4812 and the second ground layer 4813 are respectively connected to the ground layer on the back surface of the first adapter board 481 through the vias.

[0107] In some embodiments, the second laser assembly 450 includes a second substrate 451 and a second laser chip 452. The second laser chip 452 is mounted on the second substrate 451, and the second laser chip 452 integrates an electro-absorption modulated laser and a semiconductor optical amplifier. A ground layer 4510, a second high-frequency pad 4511, a second LD pad 4512, and a second SOA pad 4513 are disposed on the second substrate 451. The second high-frequency pad 4511, the second LD pad 4512, and the second SOA pad 4513 are located on the side of the second laser chip 452; the second laser chip 452 is mounted on the ground layer 4510, and the second high-frequency pad 4511, the second LD pad 4512, and the second SOA pad 4513 are respectively wire-bonded to the second laser chip 452.

[0108] The pins 430 further include a second high-frequency pin 4305, a second SOA pin 4306, and a second LD pin 4307. The second high-frequency pin 4305 is located among the pins in the bottom row on the third side wall 414. The second high-frequency pin 4305 is electrically connected to the second high-frequency pad 4511, the second SOA pin 4306 is electrically connected to the second SOA pad 4513, and the second LD pin 4307 is electrically connected to the second LD pad 4512.

[0109] In some embodiments, a second adapter board 482 is further disposed in the second housing 410. A circuit board pattern is disposed on the second adapter board 482. The second adapter board 482 is used to implement the electrical connection between the second high-frequency pin 4305 and the second laser assembly 450, and the second adapter board 482 can also be used to impedance-match the second laser chip 452 to ensure the impedance continuity of the high-frequency transmission link.

[0110] In some embodiments, the second high-frequency pin 4305 is embedded and connected to the third sidewall 414. The second high-frequency pin 4305 is insulated from the third sidewall 414 through an insulating layer. The second adapter board 482 is disposed on the side of the third sidewall 414; the second SOA pin 4306 and the second LD pin 4307 are embedded and connected to the fourth sidewall 415 and are insulated from the fourth sidewall 415 through an insulating layer respectively; the second SOA pin 4306 is wire-bonded to the second SOA pad 4513, and the second LD pin 4307 is wire-bonded to the second LD pad 4512. A second ground pin 4308 is further disposed on the third sidewall 414. The second ground pin 4308 is located on the side of the second high-frequency pin 4305, and the second ground pin 4308 is electrically connected to the third sidewall 414. Exemplarily, the second ground pin 4308 is located on the side of the second high-frequency pin 4305 close to the first high-frequency pin 4301. The second adapter board 482 and the first adapter board 481 are located on the same sidewall side of the second housing 410, which facilitates the assembly of the second adapter board 482 and helps to increase the assembly density of the components in the second housing 410, thereby contributing to reducing the size of the second housing 410. In some embodiments, a second high-frequency transmission line 4821 is disposed on the front surface of the second adapter board 482. A third ground layer 4822 is disposed on one side of the second high-frequency transmission line 4821, and a fourth ground layer 4823 is disposed on the other side of the second high-frequency transmission line 4821. One end of the second high-frequency transmission line 4821 is used for electrically connecting to the second high-frequency pad 4511, and the other end of the second high-frequency transmission line 4821 is used for electrically connecting to the second high-frequency pin 4305. Exemplarily, one end of the second high-frequency transmission line 4821 is wire-bonded to the second high-frequency pad 4511, and the other end of the second high-frequency transmission line 4821 is soldered to the second high-frequency pin 4305; the ground layer 4510 is electrically connected to the third ground layer 4822 and the fourth ground layer 4823.

[0111] In some embodiments, a ground layer is provided on the back surface of the second adapter board 482, vias are respectively provided on the third ground layer 4822 and the fourth ground layer 4823, and the third ground layer 4822 and the fourth ground layer 4823 are respectively connected to the ground layer on the back surface of the second adapter board 482 through the vias. In some embodiments, a third adapter board 483 is further provided in the second housing 410, a circuit pattern is provided on the third adapter board 483, the third adapter board 483 is provided between the second laser assembly 450 and the second adapter board 482, and the side of the third adapter board 483 is close to the first laser assembly 440. The third adapter board 483 is used to realize the electrical connection between the second laser assembly 450 and the second adapter board 482, and the third adapter board 483 can also be used for impedance matching of the second laser chip 452 to ensure the impedance continuity of the high-frequency transmission link. The third adapter board 483 helps to reduce the wire bonding length between the second laser assembly 450 and the second adapter board 482, so as to reduce the parasitic inductance and ensure the high-frequency signal transmission quality. In some embodiments, a third high-frequency transmission line 4831 is provided on the front surface of the third adapter board 483, a fifth ground layer 4832 is provided on one side of the third high-frequency transmission line 4831, and a sixth ground layer 4833 is provided on the other side of the third high-frequency transmission line 4831. One end of the third high-frequency transmission line 4831 is used for electrical connection with the second high-frequency pad 4511, and the other end of the third high-frequency transmission line 4831 is used for electrical connection with the second high-frequency transmission line 4821. Exemplarily, one end of the second high-frequency transmission line 4821 is wire-bonded to the second high-frequency pad 4511, and the other end of the third high-frequency transmission line 4831 is wire-bonded to one end of the second high-frequency transmission line 4821; the fifth ground layer 4832 is wire-bonded to the third ground layer 4822, the sixth ground layer 4833 is wire-bonded to the fourth ground layer 4823, and the fifth ground layer 4832 and the sixth ground layer 4833 are respectively wire-bonded to the ground layer 4510.

[0112] In some embodiments, the front surface of the third adapter board 483 is further provided with a third LD pad 4834 and a third SOA pad 4835, and the third LD pad 4834 and the third SOA pad 4835 are close to the first laser assembly 440. The first LD pad 4412 and the first LD pin 4303 are electrically connected to the third LD pad 4834 respectively, and the first SOA pad 4413 and the first SOA pin 4302 are electrically connected to the third SOA pad 4835 respectively, so as to electrically connect the first laser assembly 440, the first LD pin 4303 and the first SOA pin 4302 through the third adapter board 483, facilitating the control of the wire bonding arc height and thus facilitating wire bonding. In some embodiments, capacitors are respectively mounted on the third LD pad 4834 and the third SOA pad 4835, the capacitors provided on the third LD pad 4834 are respectively arranged between the first LD pad 4412 and the first LD pin 4303, and the capacitors provided on the third SOA pad 4835 are respectively wire-bonded to the first SOA pad 4413 and the first SOA pin 4302. The third adapter board 483 is arranged on the side at the joint of the third side wall 414 and the fourth side wall 415, so that the third adapter board 483 can serve both the first laser assembly 440 and the second laser assembly 450, facilitating the coordinated use of the space in the second housing 410.

[0113] In some embodiments, the third laser assembly 460 includes a third substrate 461 and a third laser chip 462. A negative pad 4611 and a positive pad 4612 are arranged on the third substrate. The third laser chip 462 is mounted on the negative pad 4611, and the third laser chip 462 is wire-bonded to the positive pad 4612. The pin 430 further includes a third LD pin 4309 and a fourth LD pin 4310. The third LD pin 4309 is wire-bonded to the positive pad 4612, and the fourth LD pin 4310 is wire-bonded to the negative pad 4611. Exemplarily, the third LD pin 4309 and the fourth LD pin 4310 are embedded in the fourth side wall 415, and the end portions respectively extend into the inner cavity of the second housing 410 and are insulated from the fourth side wall 415 through an insulating layer.

[0114] In some embodiments, the third laser assembly 460 further includes a backlight detector 463. The backlight detector 463 is arranged on the third substrate 461 and on the backlight side of the third laser chip 462. The backlight detector 463 is used to receive the backlight of the third laser chip 462 for monitoring the third-wavelength optical signal. The pin 430 further includes an MPD pin 4311. The MPD pin 4311 is wire-bonded to the backlight detector 463. Exemplarily, the MPD pin 4311 is embedded in the fourth side wall 415, the end portion of the MPD pin 4311 extends into the inner cavity of the second housing 410, and the MPD pin 4311 is insulated from the fourth side wall 415 through an insulating layer.

[0115] In some embodiments, a thermoelectric cooler (TEC) 490 is further disposed in the second housing 410. The bottom of the TEC 490 is connected to the bottom plate 411, and the top of the TEC 490 supports the first laser assembly 440, the second laser assembly 450, the third laser assembly 460, etc. The sides of the TEC 490 include a first TEC pad 491 and a second TEC pad 492, and the first TEC pad 491 and the second TEC pad 492 are located on the side of the second sidewall 413. The pin 430 further includes a first TEC pin 4312 and a second TEC pin 4313. The first TEC pin 4312 is electrically connected to the first TEC pad 491, and the second TEC pin 4313 is electrically connected to the second TEC pad 492. Exemplarily, the first TEC pin 4312 and the second TEC pin 4313 are embedded in the third sidewall 414, and the end portions extend into the inner cavity of the second housing 410 and are insulated from the third sidewall 414 through an insulating layer respectively.

[0116] In some embodiments, a support plate 419 is further disposed in the second housing 410. The support plate 419 is disposed on the top of the TEC 490. The bottom of the support plate 419 is connected to the top of the TEC 490, and the top of the support plate 419 supports and connects the first laser assembly 440, the second laser assembly 450, the third laser assembly 460, etc. In some embodiments, the support plate 419 is electrically connected to the ground layer on the front side of the third adapter board 483.

[0117] In some embodiments, a fourth adapter board 484 is further disposed in the second housing 410. The fourth adapter board 484 is disposed on the support plate 419. Circuit patterns are provided on the fourth adapter board 484, and the fourth adapter board 484 is used to connect the TEC pads and the TEC pins. Exemplarily, the fourth adapter board 484 includes a fourth substrate 4841. A first metal layer 4842 and a second metal layer 4843 are provided on the fourth substrate 4841, and the first metal layer 4842 and the second metal layer 4843 extend along the length direction of the fourth substrate 4841 respectively. The fourth adapter board 484 is disposed on the side of the second sidewall 413 and is located on the side of the first laser assembly 440. One end of the first metal layer 4842 is wire-bonded to the first TEC pad 491, and the other end of the first metal layer 4842 is wire-bonded to the first TEC pin 4312. One end of the second metal layer 4843 is wire-bonded to the second TEC pad 492, and the other end of the second metal layer 4843 is wire-bonded to the second TEC pin 4313.

[0118] In some embodiments, a temperature sensor 4836 is further disposed on the third adapter board 483; exemplarily, the temperature sensor 4836 is a thermistor. The pin 430 further includes an RTH pin 4314, and the RTH pin 4314 is embedded in the third side wall 414. One end of the RTH pin 4314 extends into the inner cavity of the second housing 410, and the RTH pin 4314 is insulated from the third side wall 414 through an insulating layer; one end of the RTH pin 4314 is electrically connected to the temperature sensor 4836.

[0119] In some embodiments, an adapter pad 4837 is further disposed on the third adapter board 483. The adapter pad 4837 is disposed on the side of the temperature sensor 4836. The adapter pad 4837 is wire-bonded to the temperature sensor 4836 and the RTH pin 4314 respectively. The adapter pad 4837 realizes the connection between the temperature sensor 4836 and the RTH pin 4314, so as to reduce the heat transfer from the temperature sensor 4836 to the RTH pin 4314 through wire bonding when the temperature sensor 4836 is directly wire-bonded to the RTH pin 4314, resulting in inaccurate detection of the temperature in the second cavity by the temperature sensor 4836.

[0120] In some embodiments, the inner side of the third side wall 414 includes a first side surface 4141, a second side surface 4142, a first step surface 4143, and a second step surface 4144. The first side surface 4141 is connected to the first step surface 4143. One end of the second step surface 4144 is connected to the first side surface 4141, and the other end of the second step surface 4144 is connected to the second side surface 4142. The first step surface 4143 is closer to the bottom plate 411 than the second step surface 4144, that is, the height position of the first step surface 4143 in the second housing 410 is lower than the height position of the second step surface 4144 in the second housing 410.

[0121] The first step surface 4143 supports and connects the first adapter board 481 and the second adapter board 482. One end of the first high-frequency pin 4301 and one end of the second high-frequency pin 4305 respectively pass through the first side surface 4141. One end of the first high-frequency pin 4301 extends above the first adapter board 481, and one end of the second high-frequency pin 4305 extends to the second adapter board 482. One end of the RTH pin 4314 passes through the first side surface 4141. One end of the first SOA pin 4302, one end of the first LD pin 4303, one end of the first TEC pin 4312, and one end of the second TEC pin 4313 respectively pass through the second side surface 4142. The second ground pin 4308 is located between the first high-frequency pin 4301 and the second high-frequency pin 4305, and the first ground pin 4304 is located on the side of the first high-frequency pin 4301 away from the second high-frequency pin 4305.

[0122] In some embodiments, the pins passing through the first side surface 4141 form a first row of pins 430a, and the pins passing through the second side surface 4142 form a second row of pins 430b, that is, the pins provided on the third side wall 414 are arranged in two rows. The pins in the first row of pins 430a and the pins in the second row of pins 430b are arranged staggeredly, which is convenient for wire bonding of the pins and adapting to the flexible circuit board, and reduces the risk of air leakage caused by deformation of the insulating layer for pin fixing.

[0123] In some embodiments, the MPD pin 4311 and the second SOA pin 4306 are located in one row, and the second LD pin 4307, the third LD 4309 pin and the fourth LD pin 4310 are located in one row.

[0124] In some embodiments, the sixth connection hole 4121 is a stepped through hole, which gradually becomes smaller from one side of the boss 4122 to the inside of the second housing 410. A sealing window 4123 is provided in the sixth connection hole 4121 at the boss 4122, and the sealing window 4123 seals the sixth connection hole 4121.

[0125] Figure 25 It is a transmission optical path diagram of an optical emission signal provided according to some embodiments of the present disclosure. Figure 25 The transmission optical path of the optical emission signal is shown therein. As Figure 25 shown, the first wavelength optical signal generated by the first laser assembly 440 is transmitted to the first lens 4181, collimated by the first lens 4181 and then transmitted to the third filter 417, transmitted through the third filter 417 and then transmitted to the second filter 416, and transmitted through the second filter 416 to the sixth connection hole 4121; the second wavelength optical signal generated by the second laser assembly 450 is transmitted to the second lens 4182, collimated by the second lens 4182 and then transmitted to the third filter 417, reflected by the third filter 417 and then transmitted to the second filter 416, and transmitted through the second filter 416 to the sixth connection hole 4121; the third wavelength optical signal generated by the third laser assembly 460 is transmitted to the third lens 4183, collimated by the third lens 4183 and then transmitted to the second filter 416, reflected by the second filter 416 and then transmitted to the sixth connection hole 4121. The second filter 416 and the third filter 417 make the first wavelength optical signal, the second wavelength optical signal and the third wavelength optical signal share the optical path when outputting from the second housing 410.

[0126] Figure 26 It is a schematic structural diagram of a mounting bracket provided according to some embodiments of the present disclosure Figure 1 , Figure 27 It is a schematic structural diagram of a mounting bracket provided according to some embodiments of the present disclosure Figure 2 , Figure 28 It is a usage state diagram of a mounting bracket provided according to some embodiments of the present disclosure. As Figures 26 - 28As shown, the mounting bracket 470 includes a bracket body 471, and a first support 472 and a second support 473 are provided on the side of the bracket body 471. The bottom of the bracket body 471 is used to connect to the support plate 419; one end of the first support 472 is connected to the bracket body 471, and the other end of the first support 472 extends away from the bracket body 471; one end of the second support 473 is connected to the bracket body 471, and the other end of the second support 473 extends away from the bracket body 471; a gap 474 is formed between the first support 472 and the second support 473. The gap 474 is used to transmit the first wavelength optical signal and the third wavelength optical signal.

[0127] In some embodiments, a first support surface 4721 is provided on one side of the first support 472, a second support surface 4722 is provided on the other side of the first support 472, a third support surface 4731 is provided on one side of the second support 473, and a fourth support surface 4732 is provided on the other side of the second support 473; the first support surface 4721 and the third support surface 4731 are inclined at a first preset angle, and the second support surface 4722 and the fourth support surface 4732 are inclined at a second preset angle. The first support surface 4721 and the third support surface 4731 support and connect the second filter 416, and the second support surface 4722 and the fourth support surface 4732 support and connect the third filter 417, which facilitates the fixation of the second filter 416 and the third filter 417.

[0128] In some embodiments, a first limiting surface 4711 and a second limiting surface 4712 are further provided on the bracket body 471, and the first limiting surface 4711 and the second limiting surface 4712 are respectively located on the side of the bracket body 471. The first limiting surface 4711 is located at one end of the first support surface 4721, and the second limiting surface 4712 is located at one end of the second support surface 4722. Exemplarily, one end of the first limiting surface 4711 and one end of the second limiting surface 4712 respectively extend to the top of the bracket body 471, and the other end of the first limiting surface 4711 and the other end of the second limiting surface 4712 respectively extend to the bottom of the bracket body 471. The first limiting surface 4711 limits and connects the second filter 416, and the second limiting surface 4712 limits and connects the third filter 417. The first limiting surface 4711 and the second limiting surface 4712 facilitate the precise assembly of the second filter 416 and the third filter 417.

[0129] In some embodiments, a first driving chip 320, a second driving chip 330, a third driving chip 340, and an MCU 350 are provided on a circuit board 300. The first driving chip 320 is electrically connected to a first laser component 440 and a second light receiving component 540. The first driving chip 320 is configured to drive the first laser component 440 to generate a first-wavelength optical signal and receive and process the electrical signal output by the second light receiving component 540 when receiving a fifth-wavelength optical signal; the second driving chip 330 is electrically connected to a second laser component 450 and a first light receiving component 530. The second driving chip 330 is configured to drive the second laser component 450 to generate a second-wavelength optical signal and receive and process the electrical signal output by the first light receiving component 530 when receiving a fourth-wavelength optical signal; the third driving chip 340 is electrically connected to a third laser component 460 and a third light receiving component 550. The third driving chip 340 is configured to drive the second laser component 450 to generate a third-wavelength optical signal and receive and process the electrical signal output by the third light receiving component 550 when receiving a sixth-wavelength optical signal. The MCU 350 is connected to a gold finger 310 and controls the connection to the first driving chip 320, the second driving chip 330, and the third driving chip 340.

[0130] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, and are not intended to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, characterized in that: include: Fiber optic adapter, one end of which is used to connect to an external optical fiber; an optical accommodating component, one end of which is connected to the other end of the optical fiber adapter, and the optical accommodating component is used to receive the fourth wavelength optical signal, the fifth wavelength optical signal and the sixth wavelength optical signal input through the optical fiber adapter; A light emitting component, one end of which is connected to the other end of the optical receiving component, the light emitting component inputs a first wavelength optical signal, a second wavelength optical signal and a third wavelength optical signal to the optical receiving component and transmits the first wavelength optical signal, the second wavelength optical signal and the third wavelength optical signal to the optical fiber adapter via the optical receiving component; The optical emitting component includes a second shell and a first laser assembly, a second laser assembly, a third laser assembly, a first adapter board, and a second adapter board arranged in the second shell; a plurality of rows of pins are arranged on the third side wall of the second shell, and the pins in the bottom row on the third side wall include a first high-frequency pin and a second high-frequency pin, and one end of the first high-frequency pin and one end of the second high-frequency pin pass through the third side wall and extend into the second shell; the first laser assembly generates a first wavelength optical signal, the second laser assembly generates a second wavelength optical signal, and the third laser assembly generates a third wavelength optical signal; The first adapter plate and the second adapter plate are arranged on the side of the third side wall, the first laser assembly is located on the side of the first adapter plate, the second laser assembly is located on the side of the second adapter plate, the third laser assembly is located on the side of the second laser assembly, and the first laser assembly, the second laser assembly and the third laser assembly are distributed on the sides of two connected side walls of the second housing; A first high-frequency transmission line is arranged on the first adapter board, and a second high-frequency transmission line is arranged on the second adapter board; the first laser component and the first high-frequency pin are electrically connected to the first high-frequency transmission line respectively, and the second laser component and the second high-frequency pin are electrically connected to the second high-frequency transmission line respectively.

2. The optical module according to claim 1, characterized in that: A plurality of rows of pins are arranged on the fourth side wall of the second housing, and the second laser assembly and the third laser assembly are arranged on the side of the fourth side wall; A third adapter plate is also provided in the second shell, and the third adapter plate is provided between the second laser assembly and the second adapter plate and is located at the edge of the connection between two connected side walls of the second shell; a third high-frequency transmission line is provided on the third adapter plate, and one end of the third high-frequency transmission line is connected to the second laser assembly by bonding, and the other end of the third high-frequency transmission line is connected to the second high-frequency transmission line by bonding.

3. The optical module according to claim 1, characterized in that: The third side wall is provided with a first step surface and a first side surface, the bottom of the first side surface is connected to the first step surface; the first adapter board and the second adapter board are provided on the first step surface, one end of the first high-frequency pin passes through the first side surface and extends to the top of the first adapter board, and one end of the second high-frequency pin passes through the first side surface and extends to the top of the second adapter board; The first high-frequency pin is connected to the first high-frequency transmission line by soldering, and the second high-frequency pin is connected to the second high-frequency transmission line by soldering.

4. The optical module according to claim 3, characterized in that: A first ground layer and a second ground layer are arranged on the front side of the first adapter board, and a ground layer is arranged on the back side of the first adapter board; the first ground layer is arranged on one side of the first high-frequency transmission line, and the second ground layer is arranged on the other side of the first high-frequency transmission line; the first ground layer and the second ground layer are respectively connected to the ground layers through vias, and the ground layers are electrically connected to the first step surface.

5. The optical module according to claim 3, characterized in that: A TEC, a support plate and a fourth adapter plate are also arranged in the second housing, the bottom of the TEC is connected to the bottom plate of the second housing, the top of the TEC is provided with the support plate, and the support plate supports the first laser assembly, the second laser assembly, the third laser assembly and the fourth adapter plate; A first TEC pad and a second TEC pad are disposed on the TEC, and the first TEC pad and the second TEC pad are disposed on the side of the second side wall of the second housing; The first metal layer and the second metal layer are arranged on the fourth adapter board, and the first TEC pin and the second TEC pin are also arranged on the third side wall. The first metal layer is respectively connected with the first TEC pad and the first TEC pin by wires, and the second metal layer is respectively connected with the second TEC pad and the second TEC pin by wires.

6. The optical module according to claim 1, characterized in that: The first laser assembly includes a first substrate and a first laser chip, and the first laser chip is mounted on the first substrate; a first high-frequency pad, a first LD pad, and a first SOA pad are also provided on the first substrate; the first high-frequency pad, the first LD pad, and the first SOA pad are respectively connected to the first laser chip by wire bonding, and the first high-frequency pad is also connected to the first high-frequency transmission line by wire bonding; A first LD pin and a first SOA pin are also disposed on the third side wall. The first LD pin is electrically connected to the first LD pad, and the first SOA pin is electrically connected to the first SOA pad.

7. The optical module according to claim 2, characterized in that: A third ground layer and a fourth ground layer are arranged on the front side of the second adapter plate, the third ground layer is arranged on one side of the second high-frequency transmission line, and the fourth ground layer is arranged on the other side of the second high-frequency transmission line; The third adapter board is further provided with a fifth ground layer and a sixth ground layer, the fifth ground layer is provided on one side of the third high-frequency transmission line, and the sixth ground layer is provided on the other side of the third high-frequency transmission line; The third formation bonding wire is connected to the fifth formation, and the fourth formation bonding wire is connected to the sixth formation.

8. The optical module according to claim 7, characterized in that: The second laser assembly includes a second substrate and a second laser chip, and the second laser chip is mounted on the second substrate; a second high-frequency pad, a second LD pad, and a second SOA pad are provided on the second substrate; the second high-frequency pad, the second LD pad, and the second SOA pad are respectively connected to the second laser chip by wire bonding, and the second high-frequency pad is also connected to the third high-frequency transmission line by wire bonding; The fourth side wall is provided with a second SOA pin and a second LD pin, the second LD pin is wired to the second LD pad, and the second SOA pin is wired to the second SOA pad.

9. The optical module according to claim 2, characterized in that: The third laser assembly includes a third substrate and a third laser chip, the third substrate is provided with a negative electrode pad and a positive electrode pad, and the third laser chip is mounted on the negative electrode pad; The fourth side wall is also provided with a third LD pin and a fourth LD pin. The third LD pin is connected to the positive electrode pad by wire bonding, and the fourth LD pin is connected to the negative electrode pad by wire bonding.

10. The optical module according to claim 5, characterized in that: The third side wall is provided with a second step surface and a second side surface, one end of the second step surface is connected to the first side surface, and the other end of the second step surface is connected to the bottom of the second side surface; Ends of the first TEC pad and the first TEC pin pass through the second side surface.

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