Through-wall edge exposure unit and gluing and developing equipment

Abstract

The invention provides a through-wall type edge exposure unit and gluing and developing equipment, the through-wall type edge exposure unit is applied to the gluing and developing equipment, and the through-wall type edge exposure unit comprises a conveying finger, a telescopic arm, a lifting assembly, a multi-axis linkage platform, an edge exposure assembly and a main control system; the conveying fingers are used for loading wafers, and the telescopic arm is used for driving the conveying fingers for loading the wafers to move towards the lifting assembly; the lifting assembly is used for loading and supporting the wafer to descend, so that the wafer is loaded to the multi-axis linkage platform; the multi-axis linkage platform is used for driving a wafer to move to the edge exposure assembly until the edge exposure process is finished; the edge exposure assembly is used for carrying out exposure treatment on the edge of the wafer; the telescopic arm, the lifting assembly, the multi-axis linkage platform and the edge exposure assembly are electrically connected with the main control system. The method is used for saving the time of the wafer edge exposure process so as to improve the productivity.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and particularly to a through-wall edge exposure unit and a spin coating and developing device. Background Art

[0002] During the spin coating process of photoresist, under the action of centrifugal force, the photoresist spreads on the surface of the wafer, so as to be uniformly coated on the entire surface of the wafer. However, since the edge portion of the wafer cannot be used for pattern processing, the edge portion of the wafer will not be exposed in the lithography machine. In this case, if a positive photoresist is selected, after the developing process, the photoresist will still remain on the wafer edge. During the wafer transfer process, if the photoresist peels off, it will contaminate the wafer surface and reduce the yield. To prevent such adverse situations, an edge exposure device is provided in the spin coating and developing machine to expose the edge position of the wafer, and then develop it to remove the unnecessary photoresist on the edge portion.

[0003] In recent years, on the one hand, as the production capacity of the spin coating and developing equipment has been continuously climbing and the number of process units has been increasing, the robot with more operation steps has led to a production capacity bottleneck, restricting the production capacity of the spin coating and developing equipment. On the other hand, the transfer of wafers between different process modules takes a long time. Therefore, there is an urgent need for a new type of through-wall edge exposure unit and spin coating and developing equipment to improve the above problems. Summary of the Invention

[0004] The purpose of the present invention is to provide a through-wall edge exposure unit and a spin coating and developing device, which are used to save the time of the wafer edge exposure process to improve the production capacity.

[0005] In a first aspect, the present invention provides a through-wall edge exposure unit applied to a spin coating and developing device, including: a transfer finger, a telescopic arm, a lifting component, a multi-axis linkage platform, an edge exposure component, and a main control system; the transfer finger is used to load the wafer, the telescopic arm is used to drive the transfer finger loaded with the wafer to move towards the lifting component; the lifting component is used to load and support the wafer to descend so that the wafer is loaded onto the multi-axis linkage platform; the multi-axis linkage platform is used to drive the wafer to move to the edge exposure component until the edge exposure process ends; the edge exposure component is used to perform exposure processing on the edge of the wafer; the telescopic arm, the lifting component, the multi-axis linkage platform, and the edge exposure component are all electrically connected to the main control system.

[0006] The beneficial effects of the method of the present invention are as follows: By providing the lifting assembly for loading and supporting the wafer to descend, so that the wafer is loaded onto the multi-axis linkage platform, the descending process of the wafer can be buffered to avoid damage to the wafer caused by dropping; The multi-axis linkage platform drives the wafer to move to the edge exposure assembly until the edge exposure process is completed. The wafer is driven by the multi-axis linkage platform before and after the edge exposure process, which can save the time for the wafer to be transferred by the robot arm and is beneficial to improving the production capacity of the coating and developing equipment.

[0007] Optionally, it further includes an acquisition system, and the acquisition system is arranged on the side of the lifting assembly away from the telescopic arm; The acquisition system is used to acquire the edge information of the wafer to determine the position of the wafer.

[0008] Optionally, the acquisition system includes a transmitter and a receiver, and the transmitter is used to emit infrared light to the receiver; When the wafer is loaded on the lifting assembly or the multi-axis linkage platform, the edge of the wafer is located between the transmitter and the receiver.

[0009] Optionally, the acquisition system is used to acquire the projection image of the edge of the wafer; The main control system is used to calculate the center point coordinates of the wafer according to the coordinates of N edge points of the wafer in the projection image; Calculate the motion compensation parameters of the multi-axis linkage platform according to the center point coordinates of the wafer, and control the multi-axis linkage platform to drive the wafer to move according to the motion compensation parameters.

[0010] Optionally, the multi-axis linkage platform includes two translation assemblies in different directions and a rotation assembly; The rotation assembly is used to load the wafer, and the translation directions of the two translation assemblies in different directions are both perpendicular to the rotation axis of the rotation assembly; When the wafer moves to the edge exposure assembly, the main control system is used to control the translation assembly and the rotation assembly to run synchronously according to the motion compensation parameters, so that the wafer rotates along the axis where the center of the wafer is located.

[0011] Optionally, the edge exposure assembly includes a light source, an optical waveguide, an exposure lens and a mask; The optical axis of the exposure lens faces the edge of the wafer and is used to focus the light output by the optical waveguide into an original light spot; The mask is arranged outside the exposure lens and is used to shape the original light spot to obtain a target light spot with a specific shape required for the edge exposure process.

[0012] Optionally, the lifting assembly includes a lifting motor, a mounting plate and at least 3 ejector pins, and the bottom ends of the ejector pins are connected to the mounting plate; The tops of the at least 3 ejector pins are at the same height and are used to support the bottom surface of the same wafer; The lifting motor is used to drive the mounting plate and all the ejector pins to rise or fall.

[0013] Optionally, the transfer finger is provided with a vacuum channel and a vacuum chuck for adsorbing the wafer and driving the wafer to move.

[0014] Optionally, the telescopic arm is internally provided with a motor and a transmission belt for driving the transfer finger to reciprocate.

[0015] In a second aspect, the present invention provides a coating and developing apparatus, including a first process module, a second process module, and the through-wall edge exposure unit according to any one of the first aspect; the through-wall edge exposure unit is disposed between the first process module and the second process module for moving the wafer from the first process module to the second process module and simultaneously performing an edge exposure process. Description of the Drawings

[0016] Figure 1 It is a schematic structural diagram of a through-wall edge exposure unit provided by the present invention;

[0017] Figure 2 It is a schematic structural diagram of a transfer finger in an initial position provided by the present invention;

[0018] Figure 3 It is a schematic structural diagram of a transfer finger located on a lifting assembly provided by the present invention;

[0019] Figure 4 It is a schematic structural diagram of a multi-axis linkage platform loading a wafer provided by the present invention;

[0020] Figure 5 It is a schematic structural diagram of a collection system provided by the present invention;

[0021] Figure 6 It is a schematic structural diagram of a multi-axis linkage platform provided by the present invention;

[0022] Figure 7 It is a schematic structural diagram of an edge exposure assembly provided by the present invention;

[0023] Figure 8 It is a schematic structural diagram of a coating and developing apparatus provided by the present invention.

[0024] Reference numerals in the drawings:

[0025] 1. Main control system; 2. Telescopic arm; 3. Transfer finger; 31. Vacuum chuck; 4. Acquisition system; 41. Mounting bracket; 42. Transmitter; 43. Receiver; 5. Edge exposure component; 51. Light source; 52. Light guide; 53. Exposure lens; 54. Mask; 6. Multi-axis linkage platform; 61. First translation component; 611. First guide rail; 612. First carrier plate; 62. Second translation component; 621. Second guide rail; 622. Second carrier plate; 63. Rotation component; 631. Rotation motor; 632. Loading chuck; 7. Lifting component; 71. Ejector pin; 72. Mounting plate; 73. Lifting motor;

[0026] 80. Glue coating and developing equipment; 81. First process module; 82. Second process module; 83. Through-wall edge exposure unit. Detailed implementation manners

[0027] To make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the present invention. Apparently, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without making creative efforts shall fall within the protection scope of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings understood by those of ordinary skill in the art in the field to which the present invention belongs. The words such as "including" used herein are intended to mean that the elements or items appearing before this word cover the elements or items listed after this word and their equivalents, without excluding other elements or items.

[0028] Regarding the problems existing in the prior art, as Figure 1 shown, the first embodiment provides a through-wall edge exposure unit, which is applied to glue coating and developing equipment and includes: a transfer finger 3, a telescopic arm 2, a lifting component 7, a multi-axis linkage platform 6, an edge exposure component 5 and a main control system 1; the transfer finger 3 is used for loading wafers, the telescopic arm 2 is used for driving the transfer finger 3 loaded with wafers to move towards the lifting component 7; the lifting component 7 is used for loading and supporting the wafer to descend so that the wafer is loaded onto the multi-axis linkage platform 6; the multi-axis linkage platform 6 is used for driving the wafer to move to the edge exposure component 5 until the edge exposure process ends; the edge exposure component 5 is used for performing edge exposure processing on the edge of the wafer; the telescopic arm 2, the lifting component 7, the multi-axis linkage platform 6 and the edge exposure component 5 are all electrically connected to the main control system 1.

[0029] It should be noted that in this embodiment, the lifting assembly 7 is provided to load and support the wafer to descend, so that the wafer is loaded onto the multi-axis linkage platform 6, which can buffer the descending process of the wafer and avoid damage to the wafer caused by dropping; the multi-axis linkage platform 6 drives the wafer to move to the edge exposure assembly 5 until the edge exposure process is completed. The wafer is driven by the multi-axis linkage platform 6 before and after the edge exposure process, which can save the time for the wafer to be transferred in the robot arm and is beneficial to improving the production capacity of the spin coating and developing equipment.

[0030] As Figure 2 and Figure 3 shown, in some embodiments, the transfer finger 3 is provided with a vacuum channel and a vacuum chuck 31 for adsorbing the wafer and driving the wafer to move. Specifically, the vacuum chuck 31 is communicated with the vacuum channel. The vacuum channel is connected to a vacuum machine. When the vacuum chuck 31 contacts the wafer, the vacuum machine is in a working state, providing a vacuum adsorption force for the vacuum chuck 31 and the vacuum channel, so that the wafer is adsorbed on the transfer finger 3. Exemplarily, the opening of the vacuum chuck 31 faces upward and adsorbs on the bottom surface of the wafer. In another example, the opening of the vacuum chuck 31 faces downward and adsorbs on the top surface of the wafer.

[0031] In some embodiments, the telescopic arm 2 is internally provided with a motor and a transmission belt for driving the transfer finger 3 to reciprocate. Specifically, the main shaft of the motor is connected to the transmission belt. After it is confirmed that the wafer is adsorbed on the transfer finger 3, the motor starts to rotate forward, and the transmission belt drives the transfer finger 3 and the wafer to move along the x direction until the wafer is located on the top side of the lifting assembly 7. When it is confirmed that the wafer is unloaded onto the lifting assembly 7, the motor starts to rotate reversely, and the transmission belt drives the transfer finger 3 to return to the initial position along the reverse x direction to wait for loading the next wafer.

[0032] In some embodiments, the lifting assembly 7 includes a lifting motor 73, a mounting plate 72 and at least 3 ejector pins 71. The bottom ends of the ejector pins 71 are connected to the mounting plate 72; the top ends of the at least 3 ejector pins 71 are located at the same height for supporting the bottom surface of the same wafer; the lifting motor 73 is used to drive the mounting plate 72 and all the ejector pins 71 to rise or fall.

[0033] Exemplarily, the mounting plate 72 is arranged in an F shape and is detachably connected with 3 ejector pins 71. The axes of the 3 ejector pins 71 pass through the 3 vertices of a triangle on the xy plane. In other examples, the mounting plate 72 is arranged in a Y shape and is fixedly connected with 4 ejector pins 71. The axes of the 4 ejector pins 71 pass through the 4 vertices of a quadrilateral on the xy plane.

[0034] It should be noted that the mounting plate 72 is arranged in any shape, and the ejector pins 71 can be connected to the mounting plate 72 in any manner, as long as the tops of at least 3 highest ejector pins 71 are located at the same height and the axial direction faces the bottom surface of the wafer. This embodiment can ensure that the wafer stably lands on the tops of the ejector pins 71, avoiding damage to the wafer due to dropping.

[0035] Specifically, when the wafer moves to the top side of the lifting assembly 7, the vacuum machine pauses operation to release the vacuum in the vacuum channels and the vacuum chuck 31. The lifting motor 73 rotates forward to drive the mounting plate 72 and the ejector pins 71 to rise, so that the ejector pins 71 support the bottom surface of the wafer.

[0036] As Figure 4 shown, by way of example, when the wafer is placed on the top of the transfer finger 3, after the vacuum machine stops working, the ejector pins 71 lift the wafer to the first height. In another example, when the wafer is placed at the bottom of the transfer finger 3, the top of the ejector pin 71 rises to the second height, and after the vacuum machine stops working, the wafer falls onto the top of the ejector pin 71. In yet another example, when the wafer is placed on the top or bottom of the transfer finger 3, after the top of the ejector pin 71 rises to the third height and contacts the bottom surface of the wafer, the vacuum machine stops working. The first height is higher than the third height at the top, and the third height is higher than the second height.

[0037] As Figure 5 shown, in some embodiments, a collection system 4 is further included. The collection system 4 is arranged on the side of the lifting assembly 7 away from the telescopic arm 2; the collection system 4 is used to collect the edge information of the wafer to determine the position of the wafer. Specifically, the collection system 4 includes a transmitter 42 and a receiver 43. The transmitter 42 is used to emit infrared light to the receiver 43; when the wafer is loaded on the lifting assembly 7 or the multi-axis linkage platform 6, the edge of the wafer is located between the transmitter 42 and the receiver 43.

[0038] In another specific embodiment, the collection system 4 is used to collect the projection image of the edge of the wafer; the main control system 1 is used to calculate the center point coordinates of the wafer according to the coordinates of N edge points of the wafer in the projection image; calculate the motion compensation parameters of the multi-axis linkage platform 6 according to the center point coordinates of the wafer, and control the multi-axis linkage platform 6 to drive the wafer to move according to the motion compensation parameters.

[0039] Exemplarily, when it is confirmed that the multi-axis linkage platform 6 loads the wafer, the emitter 42 vertically emits infrared light towards the receiver 43, and the bottom surface of the wafer is parallel to the xy plane. When the wafer moves horizontally in the x direction, the edge of the wafer blocks part of the infrared light, and the receiver 43 is used to obtain an infrared projection image. The center point coordinates of the wafer are calculated based on the coordinates of three edge points on the wafer projection in the infrared image. The motion compensation parameter of the rotation axis of the current multi-axis linkage platform 6 relative to the center point coordinates is calculated based on the center point coordinates of the wafer. The motion compensation parameter is used to control the multi-axis linkage platform 6 to drive the wafer to rotate around the center point of the wafer.

[0040] In another example, when the bottom surface of the wafer is not parallel to the xy plane, the wafer projection in the infrared image is elliptical, and the center point coordinates of the wafer are calculated based on the coordinates of five edge points on the wafer projection in the infrared image. This example can detect whether the wafer is tilted, which is beneficial to ensuring the safe progress of the edge exposure process. In yet another example, it further includes a mounting bracket 41, and both the emitter 42 and the receiver 43 are connected to the mounting bracket 41. The receiver 43 is set as a precision linear array photosensitive element sensor (Charge Coupled Device, CCD).

[0041] It should be noted that the tilt angle of the current wafer can be calculated based on the five edge point coordinates. If the tilt angle is within the tilt threshold, it is confirmed that it does not affect the edge exposure, and the tilt angle of the wafer is recalibrated when the wafer is taken after the edge exposure process. If the tilt angle is outside the tilt threshold, it is confirmed that it affects the edge exposure, and the process is paused and an alarm signal is generated for maintenance.

[0042] As Figure 6 shown, in some embodiments, the multi-axis linkage platform 6 includes two translation components in different directions and a rotation component 63; the rotation component 63 is used to load the wafer, and the translation directions of the two translation components in different directions are both perpendicular to the rotation axis of the rotation component 63; when the wafer moves to the edge exposure component 5, the main control system 1 is used to control the translation component and the rotation component 63 to run synchronously according to the motion compensation parameter, so that the wafer rotates around the axis where the wafer center is located.

[0043] Specifically, the multi-axis linkage platform 6 is set as a three-axis linkage platform, including a first translation component 61, a second translation component 62, and a rotation component 63. The first translation component 61 includes a first guide rail 611 arranged along the y direction, a first carrier plate 612, and a first linear motor. The first linear motor is used to drive the first carrier plate 612 to translate along the first guide rail 611 in the y direction or the reverse y direction. The second translation component 62 includes a second guide rail 621 arranged along the x direction, a second carrier plate 622, and a second linear motor. The second linear motor is used to drive the second carrier plate 622 to translate along the second guide rail 621 in the x direction or the reverse x direction. The first guide rail 611 is connected to the second carrier plate 622. The rotation component 63 includes a rotation motor 631 and a bearing suction cup 632. The bearing suction cup 632 is used to load the wafer. The rotation motor 631 is connected to the first carrier plate 612.

[0044] In another embodiment, when the rotation motor 631 rotates, it drives the bearing suction cup 632 and the wafer to rotate together. When the axis of the rotation motor 631 does not coincide with the center of the wafer, the first linear motor and the second linear motor operate according to the rotation speed of the rotation motor 631 and the motion compensation parameters, so that the wafer rotates around the center of the wafer. In yet another embodiment, after the edge exposure process of the wafer is completed, the bearing suction cup 632 releases the vacuum to wait for the manipulator to pick up the wafer from the bearing suction cup 632.

[0045] As Figure 7 shown, in some embodiments, the edge exposure component 5 includes a light source 51, an optical waveguide 52, an exposure lens 53, and a reticle 54. The optical axis of the exposure lens 53 faces the edge of the wafer and is used to focus the light output by the optical waveguide 52 into an original light spot. The light source 51 is connected to the optical waveguide 52. The output end of the optical waveguide 52 faces the exposure lens 53. The reticle 54 is arranged outside the exposure lens 53 and is used to shape the original light spot to obtain a target light spot with a specific shape required for the edge exposure process.

[0046] Specifically, the light source 51 is a visible light source. When the wafer moves to the lower side of the reticle 54, the main control system 1 sends a turn-on command to the light source 51, and the visible light source starts to work according to the turn-on command and inputs visible light into the optical waveguide 52. The included angle between the light input direction and the light output direction of the optical waveguide 52 is not 0. The target light spot is rectangular. In this embodiment, by setting the optical waveguide 52, the light source 51 can be flexibly positioned, which is beneficial to reducing the occupied space of the through-wall edge exposure unit. The exposure lens 53 is used to focus the light output by the optical waveguide 52 on the edge of the wafer. When the edge exposure process of the wafer is completed, the main control system 1 sends a turn-off command to the light source 51, and the visible light source stops working according to the turn-off command and stops inputting visible light into the optical waveguide 52.

[0047] In another specific embodiment, the photomask 54 is movably connected to the exposure lens 53, and the position of the exposure lens 53 relative to the wafer can be adjusted to limit the position where the light is projected onto the edge of the wafer. In yet another specific embodiment, the photomask 54 is provided with an adjustable aperture to limit the size of the light spot projected onto the edge of the wafer.

[0048] In yet another specific embodiment, the main control system 1 is provided as a processor. It should be noted that the processor in this embodiment can be an image processing chip or an integrated circuit chip, having the ability to process image signals. In the implementation process, the steps of the above method embodiments can be completed by the integrated logic circuit in hardware or the instructions in software form in the processor. The above-mentioned processor can be a general-purpose processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components.

[0049] As Figure 8 shown, the second embodiment provides a spin coating and developing apparatus 80, including a first process module 81, a second process module 82, and the through-wall edge exposure unit 83 described in any one of the above embodiments; the through-wall edge exposure unit 83 is disposed between the first process module 81 and the second process module 82 for moving the wafer from the first process module 81 to the second process module 82 while performing the edge exposure process.

[0050] Specifically, the first process module 81 is provided as an in-layer process module for performing heat treatment and liquid treatment on the wafer. The second process module 82 is provided as a cassette module for storing wafers. The through-wall edge exposure unit 83 is disposed between the in-layer process module and the cassette module.

[0051] In another specific embodiment, the first process module 81 is provided as an inter-layer process module for performing wafer alignment processing on the wafer. The second process module 82 is provided as an in-layer process module for performing liquid treatment on the wafer. The through-wall edge exposure unit 83 is disposed between the inter-layer process module and the in-layer process module.

[0052] Although the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are all within the scope and spirit of the present invention as described in the claims. Moreover, the present invention as described herein can have other embodiments and can be implemented or realized in various ways.

Claims

1. A through-the-wall edge exposure unit, applied to a glue coating and developing device, characterized in that: include: Transfer fingers, telescopic arms, lifting components, multi-axis linkage platforms, edge exposure components and main control systems; The conveying finger is used to load the wafer, and the telescopic arm is used to drive the conveying finger loaded with the wafer to move toward the lifting assembly; The lifting assembly is used to load and support the wafer to descend, so that the wafer can be loaded onto the multi-axis linkage platform; The multi-axis linkage platform is used to drive the wafer to move to the edge exposure assembly until the edge exposure process is completed; The edge exposure assembly is used to perform exposure processing on the edge of the wafer; The telescopic arm, lifting assembly, multi-axis linkage platform and edge exposure assembly are all electrically connected to the main control system.

2. The unit according to claim 1, characterized in that It also includes a collection system, which is arranged on a side of the lifting component away from the telescopic arm; the collection system is used to collect edge information of the wafer to determine the position of the wafer.

3. The unit according to claim 2, characterized in that The acquisition system includes a transmitter and a receiver, wherein the transmitter is used to transmit infrared light to the receiver; when the wafer is loaded on the lifting assembly or the multi-axis linkage platform, the edge of the wafer is located between the transmitter and the receiver.

4. The unit according to claim 2, characterized in that The acquisition system is used to acquire a projection image of the edge of the wafer; The main control system is used to calculate the center point coordinates of the wafer according to the N edge point coordinates of the wafer in the projection image; calculate the motion compensation parameters of the multi-axis linkage platform according to the center point coordinates of the wafer, and control the multi-axis linkage platform to drive the wafer to move according to the motion compensation parameters.

5. The unit according to claim 4, characterized in that The multi-axis linkage platform includes two translation components in different directions and a rotation component; the rotation component is used to load wafers, and the translation directions of the two translation components in different directions are perpendicular to the rotation axis of the rotation component; When the wafer moves to the edge exposure assembly, the main control system is used to control the translation assembly and the rotation assembly to operate synchronously according to the motion compensation parameters so that the wafer rotates along the axis where the center of the wafer is located.

6. The unit according to claim 1 or 2, characterized in that The edge exposure assembly includes a light source, a light guide, an exposure lens and a photomask; The light source is connected to the light guide; the output end of the light guide faces the exposure lens; The optical axis of the exposure lens is toward the edge of the wafer, and is used to focus the light output by the light guide into an original light spot; The light mask is arranged outside the exposure lens and is used to shape the original light spot to obtain a target light spot of a specific shape required for the edge exposure process.

7. The unit according to claim 1 or 2, characterized in that The lifting assembly includes a lifting motor, a mounting plate and at least three ejector pins, and the bottom ends of the ejector pins are connected to the mounting plate; The top ends of the at least three ejector pins are located at the same height, and are used to support the bottom surface of the same wafer; The lifting motor is used to drive the mounting plate and all ejectors to rise or fall.

8. The unit according to claim 1 or 2, characterized in that The conveying finger is provided with a vacuum channel and a vacuum suction cup, which are used to absorb the wafer and drive the wafer to move.

9. The unit according to claim 1 or 2, characterized in that The telescopic arm is equipped with a motor and a transmission belt for driving the conveying finger to move back and forth.

10. A coating and developing device, characterized in that: comprising a first process module, a second process module and a through-the-wall edge exposure unit as claimed in any one of claims 1 to 9; The through-the-wall edge exposure unit is disposed between the first process module and the second process module, and is used to move the wafer from the first process module to the second process module and perform the edge exposure process simultaneously.

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