Circuit module and heat dissipation structure thereof

Abstract

A circuit module and a heat dissipation structure thereof are provided, the heat dissipation structure is used for bearing an electronic component, and the heat dissipation structure comprises a body, a plurality of heat dissipation fins and at least one through hole penetrating through the body along a first direction. The electronic component is disposed on a surface of the body, and the surface is parallel to the first direction. The heat dissipation fins are connected with the body, and heat generated by the electronic component is conducted to the heat dissipation fins through the body.

Description

Technical Field

[0001] The present invention relates to a heat dissipation structure. More specifically, the present invention particularly relates to a heat dissipation structure with perforations. Background Art

[0002] On a circuit board inside a general electronic device, electronic components such as transistors (e.g., MOSFETs) or integrated circuits (ICs) are usually provided. However, with the continuous reduction in the volume of electronic devices and the continuous improvement in system performance, how to overcome the heat dissipation problem has become an important challenge for researchers in this technical field. Summary of the Invention

[0003] The object of the present invention is to provide a circuit module and its heat dissipation structure to solve at least one of the above problems.

[0004] In view of the foregoing known problems, an embodiment of the present invention provides a heat dissipation structure for carrying an electronic component, including a body, a plurality of heat dissipation fins, and at least one perforation. The foregoing body extends in a first direction, wherein the foregoing electronic component is disposed on a surface of the foregoing body, and the foregoing surface is parallel to the foregoing first direction. The foregoing heat dissipation fins are connected to the foregoing body, wherein the heat generated by the foregoing electronic component is conducted to the foregoing heat dissipation fins through the foregoing body, and the foregoing perforation penetrates the foregoing body along the foregoing first direction.

[0005] An embodiment of the present invention further provides a circuit module, including a circuit board, the foregoing heat dissipation structure, and a fan, wherein the foregoing heat dissipation structure is fixed on the foregoing circuit board, and the foregoing electronic component and the foregoing circuit board are electrically connected to each other. The foregoing fan is disposed on one side of the foregoing heat dissipation structure and generates an air flow passing through the foregoing perforation along the foregoing first direction to discharge heat from the foregoing circuit module.

[0006] In an embodiment, the foregoing perforation has a cross-section in the shape of a polygon, a circle, an ellipse, or an irregular shape.

[0007] In an embodiment, the foregoing perforation has a cross-section in the shape of a triangle, a quadrilateral, or a hexagon.

[0008] In an embodiment, the foregoing heat dissipation structure further includes a plurality of perforations penetrating the foregoing body, and the foregoing perforations are arranged in a second direction, wherein the foregoing second direction is perpendicular to the foregoing first direction.

[0009] In an embodiment, the foregoing heat dissipation fins are located on a top side of the foregoing body and perpendicular to the foregoing second direction. Brief Description of the Drawings

[0010] Figure 1 A perspective view showing a heat dissipation structure according to an embodiment of the present invention.

[0011] Figure 2 Indicates Figure 1 Another perspective three-dimensional view of the heat dissipation structure shown

[0012] Figure 3 Indicates a cross-sectional view along Figure 1 the line X1-X2 in

[0013] Figure 4 Indicates a cross-sectional view along Figure 2 the line X3-X4 in

[0014] Figure 5 Schematic diagram showing that multiple electronic components are fixed on the surface of the body of the heat dissipation structure by means of fasteners passing through components such as nuts, bushings, and thermally conductive insulating sheets

[0015] Figure 6 Indicates an exploded view of multiple circuit units as shown in Figure 5 before being combined with a circuit board, a fan, and a bottom plate

[0016] Figure 7 Indicates Figure 6 a three-dimensional view of a circuit module formed after combining the circuit units, circuit board, fan, and bottom plate in

[0017] Figure 8 Indicates Figure 7 a top view of the circuit module in

[0018] Figure 9 A three-dimensional view of the heat dissipation structure according to another embodiment of the present invention

[0019] Figure 10 A three-dimensional view showing that a square perforation is formed on the body of the heat dissipation structure

[0020] Figure 11 A three-dimensional view showing that a hexagonal perforation is formed on the body of the heat dissipation structure

[0021] Figure 12 A three-dimensional view showing that a rhombic perforation is formed on the body of the heat dissipation structure

[0022] The reference numerals are as follows:

[0023] 10: Heat dissipation structure

[0024] 11: Body

[0025] 110: Surface

[0026] 12: Heat dissipation fins

[0027] 13: Perforation

[0028] 14: Through hole

[0029] 15: Perforation

[0030] 16: Perforation

[0031] 17: Perforation

[0032] 18: Perforation

[0033] 20: Circuit unit

[0034] 30: Circuit module

[0035] B: Base plate

[0036] C: Circuit board

[0037] D1: First direction

[0038] D2: Second direction

[0039] E: Electronic component

[0040] F: Fan

[0041] N: Nut

[0042] P: Plug

[0043] S: Fastener

[0044] T: Thermal insulation sheet

[0045] W: Bushing Detailed implementation manners

[0046] The following describes the circuit module and its heat dissipation structure according to the embodiments of the present invention. However, it can be easily understood that the embodiments of the present invention provide many suitable inventive concepts that can be implemented in a wide variety of specific backgrounds. The specific embodiments disclosed are only used to illustrate the use of the present invention in a specific manner and are not intended to limit the scope of the present invention.

[0047] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this disclosure belongs. It can be understood that these terms, such as those defined in a commonly used dictionary, should be interpreted as having a meaning consistent with the relevant technology and the background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined herein.

[0048] The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used in the embodiments are for illustration and not for limiting the present invention.

[0049] First, please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 simultaneously, where Figure 1 shows a perspective view of the heat dissipation structure 10 of an embodiment of the present invention, Figure 2 shows Figure 1 another perspective view of the heat dissipation structure 10 shown in Figure 3 shows a cross-sectional view along the line X1-X2 in Figure 1 , Figure 4 shows a cross-sectional view along the line X3-X4 in Figure 2 .

[0050] As shown in Figure 1 , Figure 2 , Figure 3 and Figure 4 , the heat dissipation structure 10 of an embodiment of the present invention can be fixed to a circuit board inside an electronic device by a pin P located on its bottom side, and it can help quickly discharge the heat generated by the electronic components disposed on the heat dissipation structure 10, thereby avoiding the circuit system from crashing or being damaged due to overheating of the electronic components.

[0051] Specifically, the aforementioned heat dissipation structure 10 may be made of a metal material, which mainly includes a long strip-shaped body 11 and a plurality of heat dissipation fins 12 extending outward from the body 11. The aforementioned body 11 extends in the first direction D1 (X-axis direction), and a plurality of through holes 13 having a circular cross-section are formed on the body 11.

[0052] In this embodiment, the aforementioned through holes 13 penetrate the body 11 in the first direction (X-axis direction). In addition, the aforementioned through holes 13 are arranged along the second direction D2 (Z-axis direction), where the aforementioned second direction D2 (Z-axis direction) is perpendicular to the aforementioned first direction D1 (X-axis direction).

[0053] It should be understood that the aforementioned heat dissipation fins 12 are located on the top side of the body 11 and are parallel to each other, where the aforementioned heat dissipation fins 12 are in a flat plate shape and perpendicular to the aforementioned second direction D2 (Z-axis direction).

[0054] In addition, as can also be seen from Figure 1 , Figure 2 , Figure 3 and Figure 4 , at least one through hole 14 is further formed on the body 11. The aforementioned through hole 14 penetrates the body 11 along the Y-axis direction, and its height position in the Z-axis direction is between two adjacent long strip-shaped through holes 13.

[0055] Next, please refer to Figure 5 , where Figure 5Schematic diagram showing that a plurality of electronic components E are fixed on the surface 110 of the body 11 of the heat dissipation structure 10 by a fastening member S passing through components such as a nut N, a bushing W, and a thermally conductive insulating sheet T.

[0056] As Figure 5 shown, the heat dissipation structure 10 of this embodiment can be used to carry at least one electronic component E (such as a MOSFET). During assembly, the fastening member S (such as a screw) can be sequentially passed through the nut N, the bushing W, the electronic component E, and the thermally conductive insulating sheet T, and embedded in the through hole 14 on the body 11, thereby fixing the electronic component E on the surface 110 of the body 11 of the heat dissipation structure 10, where the aforementioned surface 110 is parallel to the aforementioned first direction D1 (X-axis direction).

[0057] It should be particularly noted that the aforementioned heat dissipation structure 10 can jointly form a circuit unit 20 with the electronic component E, the fastening member S, the nut N, the bushing W, and the thermally conductive insulating sheet T. The pin P at the bottom side of the heat dissipation structure 10 and the pin at the bottom side of the electronic component E can be inserted into a circuit board, and the electronic component E can be electrically connected to the circuit board through its pins. In this embodiment, the heat generated by the electronic component E can be sequentially conducted to the heat dissipation fins 12 through the thermally conductive insulating sheet T and the body 11.

[0058] Please also refer to Figure 6 、 Figure 7 and Figure 8 , where Figure 6 shows an exploded view of a plurality of circuit units 20 as Figure 5 shown before being combined with a circuit board C, a fan F, and a bottom plate B. Figure 7 shows Figure 6 the three-dimensional view of the circuit module 30 formed after combining the circuit unit 20, the circuit board C, the fan F, and the bottom plate B in Figure 8 shows Figure 7 the top view of the circuit module 30 in

[0059] As Figure 6 、 Figure 7 and Figure 8 shown, one or more of the aforementioned circuit units 20 can be arranged on a circuit board C, and the electronic component E fixed on the heat dissipation structure 10 and the circuit board C are electrically connected to each other. One end of the aforementioned circuit board C is provided with a fan F, and the aforementioned fan F is located on one side of the heat dissipation structure 10 and faces the through hole 13 on the heat dissipation structure 10. In addition, a bottom plate B is provided below the aforementioned circuit board C, which can be used to support the circuit board C, the fan F, and the circuit unit 20.

[0060] It should be understood that the foregoing circuit unit 20 can jointly form a circuit module 30 with the circuit board C, the fan F, and the base plate B. Among them, the foregoing fan F can generate an air flow along the first direction D1 (X-axis direction), and at this time, the air flow will pass through the through holes 13 on the heat dissipation structure 10, so as to quickly discharge the heat generated by the electronic component E from the circuit module 30 (as Figure 8 shown by the arrow direction in

[0061] Next, please refer to Figure 9 , in which Figure 9 shows a perspective view of the heat dissipation structure 10 according to another embodiment of the present invention.

[0062] As Figure 9 shown, the main difference between the heat dissipation structure 10 of this embodiment and Figure 1 is that the body 11 of the heat dissipation structure 10 extends in the first direction D1 (X-axis direction), and a plurality of triangular through holes 15 are formed on the foregoing body 11.

[0063] It should be understood that the heat dissipation structure 10 of this embodiment can also be jointly composed of the electronic component E, the fastener S, the nut N, the bushing W, and the thermally conductive insulating sheet T to form the circuit unit 20 as Figure 5 shown, and the foregoing circuit unit 20 can jointly form the circuit modules 30 as Figure 6 , Figure 7 and Figure 8 shown with the circuit board C, the fan F, and the base plate B. When the foregoing fan F generates an air flow along the first direction D1 (X-axis direction), the air flow will pass through the through holes 15 on the heat dissipation structure 10, so as to quickly discharge the heat generated by the electronic component E from the circuit module 30.

[0064] Please also refer to Figure 10 , Figure 11 and Figure 12 , in which Figure 10 shows a perspective view in which square through holes 16 are formed on the body 11 of the heat dissipation structure 10, Figure 11 shows a perspective view in which hexagonal through holes 17 are formed on the body 11 of the heat dissipation structure 10, Figure 12 shows a perspective view in which diamond-shaped through holes 18 are formed on the body 11 of the heat dissipation structure 10.

[0065] As Figure 10 shown, the main difference between the heat dissipation structure 10 of another embodiment of the present invention and Figure 1 is that the body 11 of the heat dissipation structure 10 extends in the first direction D1 (X-axis direction), and a plurality of square through holes 16 are formed on the foregoing body 11.

[0066] As Figure 11 shown, the heat dissipation structure 10 of another embodiment of the present invention andFigure 1 The main difference is that the body 11 of the heat dissipation structure 10 extends in the first direction D1 (X-axis direction), and a plurality of hexagonal perforations 17 are formed on the body 11.

[0067] As Figure 12 shown, the main difference between the heat dissipation structure 10 of another embodiment of the present invention and Figure 1 is that the body 11 of the heat dissipation structure 10 extends in the first direction D1 (X-axis direction), and a plurality of diamond-shaped perforations 18 are formed on the body 11.

[0068] Specifically, perforations with circular, elliptical, polygonal (such as quadrilateral or hexagonal) or various other irregular cross-sections can be formed on the body 11 of the heat dissipation structure 10, and the perforations penetrate the body 11 of the heat dissipation structure 10 in the first direction D1 (X-axis direction). In this way, when the fan F generates an air flow in the first direction D1 (X-axis direction), the air flow can pass through the perforations on the heat dissipation structure 10, thereby quickly discharging the heat generated by the electronic component E from the circuit module 30, and thus significantly improving its heat dissipation efficiency.

[0069] Although the embodiments of the present invention and their advantages have been disclosed as above, it should be understood that those skilled in the art can make changes, substitutions and modifications without departing from the spirit and scope of the present invention. In addition, the protection scope of the present invention is not limited to the processes, machines, manufactures, compositions of matter, devices, methods and steps in the specific embodiments described in the specification. Any person skilled in the art can understand the processes, machines, manufactures, compositions of matter, devices, methods and steps developed currently or in the future from the disclosed content of the present invention. As long as they can perform substantially the same functions or obtain substantially the same results in the embodiments described herein, they can be used according to the present invention. Therefore, the protection scope of the present invention includes the above-mentioned processes, machines, manufactures, compositions of matter, devices, methods and steps. In addition, each claim constitutes an individual embodiment, and the protection scope of the present invention also includes the combination of each claim and embodiment.

[0070] Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Those skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to that defined by the appended claims.

Claims

1. A heat dissipation structure for supporting an electronic component, comprising: A body extending in a first direction, wherein the electronic component is disposed on a surface of the body, and the surface is parallel to the first direction; A plurality of heat dissipation fins connected to the body, wherein the heat generated by the electronic component is conducted to the plurality of heat dissipation fins via the body; and At least one through hole penetrates the body along the first direction. 2 . The heat dissipation structure as claimed in claim 1 , wherein the through hole has a polygonal, circular, elliptical or irregular cross-section. 3 . The heat dissipation structure as claimed in claim 1 , wherein the through hole has a triangular, quadrilateral or hexagonal cross section. 4 . The heat dissipation structure as claimed in claim 1 , wherein the heat dissipation structure further comprises a plurality of through holes penetrating the body, and the plurality of through holes are arranged along a second direction, wherein the second direction is perpendicular to the first direction. 5 . The heat dissipation structure as claimed in claim 4 , wherein the plurality of heat dissipation fins are located on a top side of the body and are perpendicular to the second direction.

6. A circuit module, comprising: a circuit board; A heat dissipation structure as claimed in claim 1, fixed on the circuit board, wherein the electronic component and the circuit board are electrically connected to each other; as well as A fan is arranged on one side of the heat dissipation structure and generates an airflow passing through the through hole along the first direction to discharge heat out of the circuit module. 7 . The circuit module as claimed in claim 6 , wherein the through hole has a polygonal, circular, elliptical or irregular cross-section. 8 . The circuit module as claimed in claim 6 , wherein the through hole has a triangular, quadrilateral or hexagonal cross section. 9 . The circuit module as claimed in claim 6 , wherein the heat dissipation structure further comprises a plurality of through holes penetrating the body, and the plurality of through holes are arranged along a second direction, wherein the second direction is perpendicular to the first direction. 10 . The circuit module as claimed in claim 9 , wherein the plurality of heat dissipation fins are located on a top side of the body and are perpendicular to the second direction.

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