Cooling device for circuit board processing

Abstract

The invention relates to the technical field of circuit board processing, in particular to a cooling device for circuit board processing, which comprises a reflow soldering machine and further comprises a conveying mechanism, the conveying mechanism is arranged in the reflow soldering machine, and the conveying mechanism is used for conveying a circuit board. When reflow soldering processing work is carried out on circuit boards of the same batch and model, self-adaptive adjustment can be carried out through the weighing positioning mechanism to clamp and fix the circuit boards, so that the positions of the circuit boards can be guaranteed, the stability is improved, and after the fixing work of the circuit boards is completed, the circuit boards can be moved down and weighed according to the weight of the circuit boards; through the power adjusting mechanism, the resistance value in the power adjusting mechanism can be adjusted in time according to the height position change of the weighing structure in the weighing positioning mechanism.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board processing, in particular to a cooling device for circuit board processing. Background Art

[0002] During soldering processes such as reflow soldering, the circuit board will generate a lot of heat, which may affect the electrical performance. Therefore, the cooling process is crucial to the quality of the solder joints. The appropriate cooling rate can ensure that the solder joints are well formed and avoid poor soldering and unstable quality. When the existing circuit is undergoing reflow soldering, a reflow soldering machine is used for welding cooling processing, which mainly involves placing the circuit board on the Type B mesh belt of the reflow soldering machine for conveying and moving, passing through the preheating zone, insulation zone, welding zone and cooling zone of the reflow soldering machine, and then heating the solder to melt through a heat source, and transferring the heat to the circuit board and components through gas circulation, thereby achieving welding, and finally completing the cooling work when passing through the cooling zone. During this conveying process, the circuit boards are directly placed on the Type B mesh belt, which cannot guarantee the stability of the position of the circuit boards, and the types of circuit boards are diverse. When the Type B mesh belt conveys circuit boards of different sizes, different inertial forces will be generated due to the different weights of the circuit boards and the influence of the conveying speed, which will affect the position of the solder on the circuit board, and thus affect the quality of welding. For this reason, we propose a cooling device for circuit board processing. Summary of the invention

[0003] The object of the present invention is to provide a cooling device for circuit board processing, so as to solve the problem that the circuit boards proposed in the above background technology are all placed directly on the Type B mesh belt. This placement method cannot ensure the stability of the position of the circuit boards, and the types of circuit boards are various. When the Type B mesh belt conveys circuit boards of different sizes, different inertial forces will be generated due to the different weights of the circuit boards and the influence of the conveying speed, which will affect the position of the solder on the circuit board, thereby affecting the quality of welding.

[0004] To achieve the above object, the present invention provides the following technical solution: a cooling device for circuit board processing, comprising: a reflow soldering machine, It also includes: a conveying mechanism, which is arranged in the reflow soldering machine and is used to convey the circuit board; A weighing and positioning mechanism is arranged on the conveying mechanism, and the weighing and positioning mechanism is arranged in multiple numbers, and is used to clamp and weigh circuit boards of different models and sizes; The power regulating mechanism is arranged inside the reflow soldering machine, and the power regulating mechanism adjusts the conveying power of the conveying mechanism according to the weight weighed by the weighing and positioning mechanism.

[0005] Among them, the conveying mechanism includes two conveying rollers rotatably connected to the inside of the reflow soldering machine, and a type B mesh belt is arranged on the outside of the two conveying rollers. A motor is fixedly connected to the inside of the reflow soldering machine, and the output end of the motor is fixedly connected to one end of one of the conveying rollers.

[0006] Among them, the weighing and positioning mechanism includes multiple load-bearing plates fixedly connected to the outer side of the type B mesh belt, each load-bearing plate is slidably connected to a weighing plate inside, and a first spring is fixedly connected to the bottom of the weighing plate and located inside the load-bearing plate.

[0007] Among them, one side of the weighing plate is slidably connected with a plurality of placement boxes, one side of each placement box is rotatably connected with a rotating pull plate, and one side of the placement box is fixedly connected with a buckle.

[0008] Among them, the interior of the placement box is rotatably connected to a first rotating shaft, the outer side of the first rotating shaft is fixedly connected to a winding wheel, a steel wire is fixedly connected between the winding wheel and the rotating pull plate, a torsion spring is fixedly connected between one side of the winding wheel and the inner side of the placement box, and a limiting sleeve is fixedly connected to the inner side of the placement box and located on the outer side of the steel wire.

[0009] Among them, two first gears are fixedly connected to the outer side of the first rotating shaft, and the first racks are meshed and connected on both sides of the two first gears. A clamping limit plate is fixedly connected to one side of the first rack, and a second spring is fixedly connected to one side of the clamping limit plate. The side of the second spring away from the clamping limit plate is fixedly connected to the placement box.

[0010] Among them, two first limit hollow plates are slidably connected inside the weighing plate, one side of the two first limit hollow plates is fixedly connected with a first limit telescopic rod, one side of the first limit telescopic rod is fixedly connected with a contact plate, a third spring is sleeved on the outside of the first limit telescopic rod and located between the contact plate and the first limit hollow plate, two fixed blocks are fixedly connected inside the weighing plate, a second gear is rotatably connected between the two fixed blocks, a second rack is meshingly connected to the bottom of the second gear, second limit telescopic rods are fixedly connected between the two sides of the second rack and the inner side of the weighing plate, a third rack is fixedly connected to the bottom of the placement box, and the third rack is meshed with the first The two gears are meshingly connected, and fourth springs are fixedly connected to both sides of the third rack. One side of the two fourth springs away from the third rack is fixedly connected to a limiting block, one side of the limiting block is rotatably connected to a rotating plate, and the end of the rotating plate away from the limiting block is rotatably connected to a second limiting hollow plate. The second limiting hollow plate is slidably connected to the weighing plate, and the interior of the placement box is rotatably connected to a second rotating shaft, and pulleys are fixedly connected to the bottom of one of the first gears and the outer side of the second rotating shaft, and belts are arranged on the outer sides of the two pulleys, and one end of the second rotating shaft is fixedly connected to a fixed disk, and a driving column is fixedly connected to one side of the fixed disk and located in the second limiting hollow plate.

[0011] Among them, two sliding grooves are arranged inside the first rotating shaft, and the inner walls of the two sliding grooves are slidably connected with one-way angle blocks, and one side of the one-way angle block is fixedly connected with a fifth spring.

[0012] Among them, one side of several placement boxes is fixedly connected with an adjustment plate, the top and bottom of several adjustment plates are fixedly connected with L-shaped fixing plates, a fixing rod is fixedly connected between the two L-shaped fixing plates, the outer sides of the two fixing rods are slidably connected with a limiting tail plate, the outer side of the fixing rod and located at the top and bottom of the limiting tail plate are sleeved with a sixth spring, and a plurality of weight distance plates are fixedly connected to the inner side of the reflow soldering machine.

[0013] Among them, the power adjustment mechanism includes an accommodation groove opened inside the reflow soldering machine, a sliding rheostat is fixedly connected to the inner wall of the accommodation groove, a limiting connection block is fixedly connected to one side of the sliding piece in the sliding rheostat, the limiting connection block is slidingly connected to the reflow soldering machine, and a track block is fixedly connected to the side of the limiting connection block away from the sliding rheostat.

[0014] The present invention has at least the following beneficial effects: By setting up a conveying mechanism and a weighing and positioning mechanism, when the circuit boards of the same batch model are subjected to reflow soldering processing, the circuit boards can be clamped and fixed by adaptively adjusting the weighing and positioning mechanism, so that the position of the circuit board can be guaranteed and the stability can be improved. After the circuit board is fixed, the weighing can be moved down according to the weight of the circuit board to obtain the weight data of the circuit board. Through the power adjustment mechanism, the resistance value in the power adjustment mechanism can be adjusted in time according to the height position change of the weighing structure in the weighing and positioning mechanism. The conveying power of the conveying mechanism can be adjusted to a value corresponding to the weight of the weighed circuit board in the weighing and positioning mechanism through the power adjustment mechanism. In this way, when the circuit boards of different models and processed in the same batch are subjected to reflow soldering processing, the conveying speed can be adjusted according to the actual weight of the circuit board, so that the stability of the solder position on the circuit board can be guaranteed, thereby ensuring the quality of welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the overall structure of the present invention after it is opened; Figure 3 It is a schematic diagram of the internal front view structure of the conveying mechanism of the present invention; Figure 4 It is a schematic diagram of the internal rear view structure of the conveying mechanism of the present invention; Figure 5 For the present invention Figure 4 A is an enlarged structural diagram; Figure 6 It is a structural schematic diagram of the weighing and positioning mechanism of the present invention; Figure 7 For the present invention Figure 6 The enlarged structural diagram at B in FIG. Figure 8 It is a schematic diagram of the internal structure of the load-bearing plate and the placement box of the present invention; Fig. 9 It is a structural schematic diagram of the weighing and positioning mechanism of the present invention; Fig.10 It is a schematic diagram of the upper structure of the weighing and positioning mechanism of the present invention; Fig.11 It is a schematic diagram of the lower structure of the weighing and positioning mechanism of the present invention; Fig.12 It is a schematic diagram of the internal structure of the first rotating shaft of the present invention; Fig.13 It is a schematic structural diagram of the position-limiting connecting block and the track block of the present invention.

[0016] In the figure: 1, reflow soldering machine; 2, conveying mechanism; 21, motor; 22, conveying roller; 23, type B mesh belt; 3, weighing and positioning mechanism; 31, load-bearing plate; 32, weighing plate; 33, first spring; 34, placement box; 35, first rotating shaft; 36, torsion spring; 37, winding wheel; 38, steel wire; 39, limiting sleeve; 310, first gear; 311, first rack; 312, clamping limiting plate; 313, second spring; 314, first limiting hollow plate; 315, first limiting telescopic rod; 316, contact plate; 317, third spring; 318, fixing block; 319, second gear; 320, second rack; 321, second Limit telescopic rod; 322, third rack; 323, fourth spring; 324, limit block; 325, second limit hollow plate; 326, rotating plate; 327, second rotating shaft; 328, pulley; 329, fixed plate; 330, driving column; 331, slide groove; 332, one-way angle block; 333, fifth spring; 334, buckle; 335, rotating pull plate; 336, adjusting plate; 337, L-shaped fixed plate; 338, fixed rod; 339, limit tail plate; 340, sixth spring; 341, weight distance plate; 4, power adjustment mechanism; 41, placement groove; 42, sliding rheostat; 43, limit connecting block; 44, track block. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] Embodiment 1 See also Figures 1 to 13 The present invention provides a technical solution: a cooling device for circuit board processing, comprising: a reflow soldering machine 1, It also includes: a conveying mechanism 2, which is arranged in the reflow soldering machine 1 and is used to convey the circuit board; A weighing and positioning mechanism 3 is arranged on the conveying mechanism 2, and the weighing and positioning mechanism 3 is arranged in multiple numbers, and is used to clamp and weigh circuit boards of different models and sizes; The power regulating mechanism 4 is disposed inside the reflow soldering machine 1 , and the power regulating mechanism 4 regulates the conveying power of the conveying mechanism 2 according to the weight weighed by the weighing and positioning mechanism 3 .

[0019] By setting the conveying mechanism 2 and the weighing and positioning mechanism 3 as mentioned above, when the circuit boards of the same batch model are subjected to reflow soldering processing, the circuit boards can be clamped and fixed by adaptively adjusting the weighing and positioning mechanism 3, so as to ensure that the position of the circuit board is improved in stability. After the fixing work of the circuit board is completed, the weighing can be moved down according to the weight of the circuit board, and then the weight data of the circuit board is obtained. By setting the power adjustment mechanism 4, the resistance value in the power adjustment mechanism 4 can be adjusted in time according to the height position change of the weighing structure in the weighing and positioning mechanism 3. The conveying power of the conveying mechanism 2 can be adjusted to a value corresponding to the weight of the weighed circuit board in the weighing and positioning mechanism 3 through the power adjustment mechanism 4. In this way, when the circuit boards of different models and processed in the same batch are subjected to reflow soldering processing, the conveying speed can be adjusted according to the actual weight of the circuit board, so as to ensure the stability of the solder position on the circuit board, and then ensure the quality of welding.

[0020] The conveying mechanism 2 includes two conveying rollers 22 rotatably connected to the inside of the reflow soldering machine 1, and a type B mesh belt 23 is arranged outside the two conveying rollers 22. A motor 21 is fixedly connected to the inside of the reflow soldering machine 1, and the output end of the motor 21 is fixedly connected to one end of one of the conveying rollers 22; When in use, the motor 21 is controlled to rotate one of the conveying rollers 22, and one of the rotating conveying rollers 22 can drive the other conveying roller 22 through the type B mesh belt 23. When the operating power of the motor 21 is adjusted, the circuit boards processed in the same batch can be adjusted to the corresponding output power.

[0021] The weighing and positioning mechanism 3 includes a plurality of bearing plates 31 fixedly connected to the outer side of the type B mesh belt 23, each bearing plate 31 is slidably connected to a weighing plate 32, and a first spring 33 is fixedly connected to the bottom of the weighing plate 32 and located inside the bearing plate 31; During use, when the circuit board is placed on the weighing plate 32 , the height position of the weighing plate 32 begins to move downward due to the change in weight, so that the weighing plate 32 slides downward in the bearing plate 31 to compress the first spring 33 .

[0022] A plurality of placement boxes 34 are slidably connected to one side of the weighing plate 32, a rotational pull plate 335 is rotationally connected to one side of each placement box 34, and a buckle 334 is fixedly connected to one side of the placement box 34; During use, when the circuit board needs to be clamped and fixed, pull the rotating pull plate 335 so that the rotating pull plate 335 disengages from the buckle 334, thereby moving the position of the clamping mechanism, and then placing the circuit board in the clamping mechanism. After that, the rotating pull plate 335 is reset to complete the clamping and fixing of the circuit board, and the position of the rotating pull plate 335 can be clamped by the buckle 334.

[0023] The first rotating shaft 35 is rotatably connected inside the placement box 34, a winding wheel 37 is fixedly connected to the outside of the first rotating shaft 35, a steel wire 38 is fixedly connected between the winding wheel 37 and the rotating pull plate 335, a torsion spring 36 is fixedly connected between one side of the winding wheel 37 and the inside of the placement box 34, and a limiting sleeve 39 is fixedly connected to the inside of the placement box 34 and outside the steel wire 38; When in use, when the rotating pull plate 335 pulls the steel wire 38, the outer side of the winding wheel 37 that winds up the steel wire 38 is driven, and the rotating winding wheel 37 twists the torsion spring 36. When the rotating pull plate 335 is reset, the torsion spring 36 drives the winding wheel 37 to wind up the steel wire 38.

[0024] Two first gears 310 are fixedly connected to the outer side of the first rotating shaft 35, and first racks 311 are meshedly connected to both sides of the two first gears 310. A clamping limit plate 312 is fixedly connected to one side of the first rack 311, and a second spring 313 is fixedly connected to one side of the clamping limit plate 312. The second spring 313 is fixedly connected to the placement box 34 at a side away from the clamping limit plate 312. During use, when the winding wheel 37 is pulled, it drives the first rotating shaft 35 to rotate, so that the first rotating shaft 35 drives the two first gears 310 to rotate, and the two first gears 310 both drive the two first racks 311 corresponding to the two sides. The clamping limit plate 312 can be driven to separate through the first rack 311. Under the spring force of the second spring 313, the circuit can be conveniently clamped and fixed. When the winding wheel 37 rotates in the opposite direction to reset, it can drive the clamping limit plate 312 to clamp and fix the circuit board.

[0025] Two first position-limiting hollow plates 314 are slidably connected inside the weighing plate 32, and a first position-limiting telescopic rod 315 is fixedly connected to one side of the two first position-limiting hollow plates 314, and a contact plate 316 is fixedly connected to one side of the first position-limiting telescopic rod 315. A third spring 317 is sleeved on the outer side of the first position-limiting telescopic rod 315 and between the contact plate 316 and the first position-limiting hollow plate 314. Two fixed blocks 318 are fixedly connected inside the weighing plate 32, and a second gear 319 is rotatably connected between the two fixed blocks 318. A second rack 320 is meshedly connected to the bottom of the second gear 319, and a second position-limiting telescopic rod 321 is fixedly connected between the two sides of the second rack 320 and the inner side of the weighing plate 32. A third rack 322 is fixedly connected to the bottom of the placement box 34, and the third rack 322 is rotatably connected to the second gear 319. The third rack 322 is meshedly connected, with fourth springs 323 fixedly connected to both sides of the third rack 322, and one side of the two fourth springs 323 away from the third rack 322 is fixedly connected to a limiting block 324, and one side of the limiting block 324 is rotatably connected to a rotating plate 326, and one end of the rotating plate 326 away from the limiting block 324 is rotatably connected to a second limiting hollow plate 325, and the second limiting hollow plate 325 is slidably connected to the weighing plate 32, and the interior of the placement box 34 is rotatably connected to a second rotating shaft 327, and the bottom of one of the first gears 310 and the outer side of the second rotating shaft 327 are fixedly connected to pulleys 328, and belts are arranged on the outer sides of the two pulleys 328, and one end of the second rotating shaft 327 is fixedly connected to a fixed disk 329, and a driving column 330 is fixedly connected to one side of the fixed disk 329 and located in the second limiting hollow plate 325; When in use, the driving rods arranged at the bottom of the two clamping limit plates 312 can move the first limit hollow plate 314 when clamping the circuit board, so that the first limit hollow plate 314 can be driven to the corresponding position according to the width clamping position of the circuit board, and the moved first limit hollow plate 314 squeezes the contact plate 316 through the third spring 317, and then the force of the contact plate 316 pressing against the second gear 319 can be adjusted according to the width of different types of circuit boards. When clamping the length of the circuit board, the two first gears 310 can adaptively adjust the rotation angle position through the pulley 328 fixedly connected to the bottom of the upper first gear 310, so that the fixed plate 329 at the bottom of the second rotating shaft 327 can be driven to the corresponding quarter circle angle range, so that one side of the fixed plate 329 The driving column 330 drives the second limiting hollow plate 325 to move, so that the moving second limiting hollow plate 325 pushes the limiting block 324 to move through the two rotating plates 326. The moving positions of the two limiting blocks 324 reflect the corresponding length of the circuit board, and then the fourth spring 323 is compressed by the moving limiting block 324. The reaction force applied to the third rack 322 by the compressed fourth spring 323 can adjust the third rack 322 to the corresponding inertial damping force when it is subjected to the inertial force according to different types of circuit boards. When the circuit board above the placement box 34 is moved, the inertial force generated will drive the third rack 322 to move, and the third rack 322 will drive the second gear 319. The corresponding resistance is applied by the fourth spring 323 and the third spring 317 to ensure the stability of the position of the circuit board.

[0026] Embodiment 2 Two slide grooves 331 are formed inside the first rotating shaft 35. One-way angle blocks 332 are slidably connected to the inner walls of the two slide grooves 331. A fifth spring 333 is fixedly connected to one side of the one-way angle block 332. During use, when the circuit board is clamped, the first rotating shaft 35 can be driven to rotate under the unidirectional driving action of the one-way angle block 332, so as to facilitate the clamping of circuit boards of different models. According to the length and width of the circuit board, the two first gears 310 can be adaptively rotated under the action of the one-way angle block 332 in another direction, and the corresponding clamping position can be adjusted according to the length and width of the circuit board, and a plurality of one-way angle grooves corresponding to the one-way angle block 332 are opened inside the first gear 310.

[0027] One side of several placement boxes 34 is fixedly connected with an adjustment plate 336, and the top and bottom of several adjustment plates 336 are fixedly connected with an L-shaped fixing plate 337, a fixing rod 338 is fixedly connected between two L-shaped fixing plates 337, and the outer sides of the two fixing rods 338 are slidably connected with a limit tail plate 339, and the outer sides of the fixing rods 338 and the top and bottom of the limit tail plate 339 are sleeved with a sixth spring 340, and the inner side of the reflow soldering machine 1 is fixedly connected with a plurality of weight distance plates 341; When in use, after the circuit board is placed on top of the placement box 34, the placement box 34 is moved down, and the adjustment plate 336 arranged on one side of the placement box 34 is not provided with a limit tail plate 339, while the adjustment plate 336 arranged on the other side of the placement box 34 is provided with a limit tail plate 339. In this way, the adjustment plate 336 without the limit tail plate 339 enters the weight distance plate 341 at the corresponding height position after the height change occurs. The entrance of the weight distance plate 341 is specially set to an oblique entrance, which can ensure that when the height position of the weight distance plate 341 has a certain range of error, it can be ensured to enter the weight distance plate 341 smoothly. In this way, the height position can be fixed when the weighing plate 32 is moved, and the limit tail plate 339 in the front weighing plate 32 is about to fall off the track. When the track block 44 is moved up or down, the limiting tail plate 339 in the front is driven, and the limiting tail plate 339 slides on the outside of the fixing rod 338, thereby compressing the sixth spring 340. Under the action of the sixth spring 340, the movement and reset of the limiting tail plate 339 can be facilitated. The above work is used for the working situation of processing the same batch of models. When processing circuit boards of other batches of models, another batch of circuit boards is conveyed after the circuit boards being processed are completed, so as to prevent circuit boards of different models from being conveyed at the same time, resulting in differences in conveying speed and affecting the processing quality.

[0028] The power regulating mechanism 4 comprises a placement groove 41 provided inside the reflow soldering machine 1, a sliding rheostat 42 is fixedly connected to the inner wall of the placement groove 41, a limited connection block 43 is fixedly connected to one side of the sliding piece in the sliding rheostat 42, the limited connection block 43 is slidably connected to the reflow soldering machine 1, and a track block 44 is fixedly connected to one side of the limited connection block 43 away from the sliding rheostat 42; During use, when the track block 44 is driven, the limit connection block 43 can be driven to slide in the reflow soldering machine 1, so that the moving limit connection block 43 can adjust the slider in the sliding rheostat 42 to a resistance value position corresponding to the weight of the circuit board, and the sliding rheostat 42 is connected to the motor 21 through a wire.

[0029] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cooling device for circuit board processing, comprising: Reflow Oven (1) It is characterized in that it also comprises: a conveying mechanism (2), the conveying mechanism (2) is arranged in the reflow soldering machine (1), and the conveying mechanism (2) is used to convey the circuit board; A weighing and positioning mechanism (3), wherein the weighing and positioning mechanism (3) is arranged on the conveying mechanism (2), and the weighing and positioning mechanism (3) is arranged in a plurality, and is used to clamp and weigh circuit boards of different models and sizes; A power regulating mechanism (4) is arranged inside the reflow soldering machine (1), and the power regulating mechanism (4) regulates the conveying power of the conveying mechanism (2) according to the weight weighed by the weighing and positioning mechanism (3).

2. The circuit board processing cooling device according to claim 1, characterized in that: The conveying mechanism (2) comprises two conveying rollers (22) rotatably connected to the inside of the reflow soldering machine (1), and a type B mesh belt (23) is arranged outside the two conveying rollers (22). The inside of the reflow soldering machine (1) is fixedly connected to a motor (21), and the output end of the motor (21) is fixedly connected to one end of one of the conveying rollers (22).

3. The circuit board processing cooling device according to claim 2, characterized in that: The weighing and positioning mechanism (3) comprises a plurality of bearing plates (31) fixedly connected to the outer side of the type B mesh belt (23), each bearing plate (31) having a weighing plate (32) slidably connected thereto, and a first spring (33) fixedly connected to the bottom of the weighing plate (32) and located inside the bearing plate (31).

4. The circuit board processing cooling device according to claim 3, characterized in that: A plurality of placement boxes (34) are slidably connected to one side of the weighing plate (32), a rotational pull plate (335) is rotationally connected to one side of each placement box (34), and a buckle (334) is fixedly connected to one side of the placement box (34).

5. The circuit board processing cooling device according to claim 4, characterized in that: The interior of the placement box (34) is rotatably connected to a first rotating shaft (35); the outer side of the first rotating shaft (35) is fixedly connected to a winding wheel (37); a steel wire (38) is fixedly connected between the winding wheel (37) and the rotating pull plate (335); a torsion spring (36) is fixedly connected between one side of the winding wheel (37) and the inner side of the placement box (34); and a limiting sleeve (39) is fixedly connected to the inner side of the placement box (34) and located on the outer side of the steel wire (38).

6. The circuit board processing cooling device according to claim 5, characterized in that: Two first gears (310) are fixedly connected to the outer side of the first rotating shaft (35); both sides of the two first gears (310) are meshedly connected with first racks (311); one side of the first rack (311) is fixedly connected with a clamping limit plate (312); one side of the clamping limit plate (312) is fixedly connected with a second spring (313); and a side of the second spring (313) away from the clamping limit plate (312) is fixedly connected to the placement box (34).

7. The cooling device for circuit board processing according to claim 6, characterized in that: The weighing plate (32) is internally slidably connected to two first position-limiting hollow plates (314); one side of the two first position-limiting hollow plates (314) is fixedly connected to a first position-limiting telescopic rod (315); one side of the first position-limiting telescopic rod (315) is fixedly connected to a contact plate (316); a third spring (317) is sleeved on the outside of the first position-limiting telescopic rod (315) and located between the contact plate (316) and the first position-limiting hollow plates (314); The first and second racks (320) are meshed with each other at the bottom of the second gear (319); second limit telescopic rods (321) are fixedly connected between the two sides of the second rack (320) and the inner side of the weighing plate (32); a third rack (322) is fixedly connected to the bottom of the placement box (34); and the third rack (322) is rotatably connected to the second gear (319). The third rack (322) is meshedly connected, with fourth springs (323) fixedly connected to both sides of the third rack (322), with the sides of the two fourth springs (323) away from the third rack (322) fixedly connected to a limit block (324), with one side of the limit block (324) rotatably connected to a rotating plate (326), with one end of the rotating plate (326) away from the limit block (324) rotatably connected to a second limit hollow plate (325), and the second limit hollow plate (325) slides with the weighing plate (32) The placement box (34) is rotatably connected to a second rotating shaft (327) inside, a bottom of one of the first gears (310) and an outer side of the second rotating shaft (327) are fixedly connected to pulleys (328), and belts are arranged on the outer sides of the two pulleys (328), one end of the second rotating shaft (327) is fixedly connected to a fixed disk (329), and a driving column (330) is fixedly connected to one side of the fixed disk (329) and located inside the second limiting hollow plate (325).

8. The circuit board processing cooling device according to claim 7, characterized in that: Two sliding grooves (331) are provided inside the first rotating shaft (35), and the inner walls of the two sliding grooves (331) are slidably connected to one-way corner blocks (332), and one side of the one-way corner block (332) is fixedly connected to a fifth spring (333).

9. The circuit board processing cooling device according to claim 5, characterized in that: One side of several of the placement boxes (34) is fixedly connected to an adjustment plate (336), the tops and bottoms of several of the adjustment plates (336) are fixedly connected to an L-shaped fixing plate (337), a fixing rod (338) is fixedly connected between two of the L-shaped fixing plates (337), the outer sides of the two fixing rods (338) are slidably connected to a limiting tail plate (339), the outer sides of the fixing rods (338) and located at the top and bottom of the limiting tail plate (339) are sleeved with a sixth spring (340), and the inner side of the reflow soldering machine (1) is fixedly connected to a plurality of weight distance plates (341).

10. The cooling device for circuit board processing according to claim 1, characterized in that: The power adjustment mechanism (4) comprises a placement groove (41) provided inside the reflow soldering machine (1), a sliding rheostat (42) being fixedly connected to the inner wall of the placement groove (41), a limit connection block (43) being fixedly connected to one side of a sliding piece inside the sliding rheostat (42), the limit connection block (43) being slidably connected to the reflow soldering machine (1), and a track block (44) being fixedly connected to one side of the limit connection block (43) away from the sliding rheostat (42).

Images