Grinding and polishing equipment for refining surface of semiconductor wafer

Abstract

Grinding and polishing equipment for semiconductor wafer surface refining treatment relates to the technical field of semiconductor wafer surface polishing and grinding treatment and comprises a polishing and grinding machining box, and a conveying and transferring assembly, a rough grinding and fine polishing assembly, an adsorption clamping assembly and a turnover surface changing assembly are arranged in the polishing and grinding machining box; the coarse grinding and fine polishing assembly comprises two fixing bases, the lower surface of each fixing base is fixedly connected with a rotating driving motor, the tail end of an output shaft of each rotating driving motor is fixedly connected with a transmission vertical shaft, and the upper ends of the two transmission vertical shafts are fixedly connected with a coarse grinding wheel and a fine polishing pad respectively; a first side box and a second side box are fixedly connected to the two sides of the polishing and grinding machining box correspondingly, a thickness detection assembly is arranged in the first side box, and a drying assembly is arranged in the second side box. The problems that when polishing and grinding equipment in the prior art is used for surface treatment of semiconductor wafers, function integration is insufficient, polishing and grinding parts are limited, surface changing operation is inconvenient, the real-time polishing and grinding thickness cannot be detected, and grinding liquid is inconvenient to recycle are solved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor wafer surface polishing, and in particular to a grinding and polishing device for semiconductor wafer surface refinement. Background Art

[0002] As the core substrate for integrated circuit manufacturing, semiconductor wafers are usually made of high-purity single-crystal silicon or third-generation semiconductor materials (such as SiC and GaN). Its production process covers key processes such as crystal growth, slicing, and polishing. The quality of the wafer directly determines the performance and yield of the chip. With the application of advanced processes (3nm and below) and wide-bandgap semiconductor materials, wafer technology is continuously evolving towards large size, low defects, and new materials.

[0003] Polishing is a key step in wafer manufacturing, which aims to achieve ultra-high flatness (nanoscale), low roughness and no damage layer on the wafer surface to meet the stringent requirements of subsequent processes such as photolithography and thin film deposition. The process mainly includes two stages: grinding (rough grinding) and polishing (fine polishing), among which polishing is further divided into mechanical polishing (MP) and chemical mechanical polishing (CMP).

[0004] At present, semiconductor wafer polishing equipment still has significant defects in process adaptability and functionality, mainly reflected in: 1. Poor flexibility in process switching: It is difficult for the equipment to switch efficiently between grinding and polishing modes, affecting production efficiency.

[0005] 2. Insufficient processing coverage: The single polishing method leads to substandard processing results in local areas, affecting the overall uniformity.

[0006] 3. Low efficiency of double-sided processing: The front and back sides of the wafer need to be frequently changed when polishing, which is cumbersome and easy to introduce contamination.

[0007] 4. Lack of real-time monitoring: Lack of online thickness detection function makes it difficult to dynamically adjust process parameters.

[0008] 5. Defects in grinding fluid management: Improper design of the supply system leads to waste of grinding fluid, difficulty in recycling, and increased costs.

[0009] In summary, the prior art obviously has inconveniences and defects in practical use, so it is necessary to improve it. Summary of the invention

[0010] In view of the defects in the prior art, the present invention provides a grinding and polishing device for surface refinement of semiconductor wafers, so as to solve the problems of insufficient functional integration, limited polishing area, inconvenient surface changing operation, inability to detect real-time polishing thickness, and inconvenient grinding liquid recovery in the polishing equipment in the traditional technology when used for surface treatment of semiconductor wafers.

[0011] To achieve the above object, the present invention provides the following technical solutions: The grinding and polishing equipment used for surface refinement of semiconductor wafers comprises a grinding and polishing processing box, wherein a conveying and transferring component, a rough grinding and fine polishing component, an adsorption clamping component and a turning and changing surface component are respectively arranged in the grinding and polishing processing box.

[0012] As an optimized solution, the adsorption and clamping assembly includes a transverse moving top seat slidably arranged on the top surface of the polishing and grinding processing box, and a transmission box is lifted and lowered below the transverse moving top seat. The transmission box is respectively provided with a first mounting frame and a second mounting frame that can rotate and revolve. A first adsorption plate is fixedly arranged in the first mounting frame, and a second adsorption plate is fixedly arranged in the second mounting frame.

[0013] As an optimized solution, the reversing assembly includes a reversing operation box fixed on the bottom surface of the polishing and grinding processing box, and a first reversing seat and a second reversing seat are rotatably provided near the upper end opening in the reversing operation box, and a reversing limit mechanism is respectively provided in the first reversing seat and the second reversing seat.

[0014] As an optimized solution, the rough grinding and fine polishing assembly includes two fixed bases symmetrically arranged on both sides of the surface changing operation box, and a rotating drive motor is fixedly connected to the center of the lower surface of each fixed base. The output shaft end of the rotating drive motor passes upward through the fixed base and is fixedly connected to a transmission vertical shaft, wherein the upper end of one of the transmission vertical shafts is fixedly connected to a horizontal rough grinding wheel, and the upper end of the other transmission vertical shaft is fixedly connected to a fine polishing pad.

[0015] As an optimized solution, a support sleeve is respectively sleeved on the outside of each of the vertical transmission shafts, and the lower ends of the support sleeves are respectively fixed to the upper surface of the fixed base. A collection box is respectively slidably sleeved on the outer peripheral wall of each of the support sleeves, and a number of centrally symmetrical grinding liquid nozzles are respectively fixed to the circumferential inner wall of each of the collection boxes.

[0016] As an optimized solution, a first side box and a second side box are fixedly connected to both sides of the polishing box, respectively. A thickness detection component is provided in the first side box, and a drying component is provided in the second side box.

[0017] As an optimized solution, the thickness detection assembly includes two symmetrically arranged steering mounting arms, which are respectively rotatably mounted on the inner top surface of the first side box. Two symmetrical steering drive motors are fixedly connected to the upper surface of the first side box. The output shaft end of the steering drive motor passes downward through the first side box wall and is fixedly connected to the center of the upper surface of the steering mounting arm.

[0018] As an optimized solution, the lower surface of each steering mounting arm is provided with a detection probe which is telescopic in the horizontal direction.

[0019] As an optimized solution, the drying component includes a fan box fixedly connected to the longitudinal outer wall of the second side box, a rotating fan is provided in the fan box, a three-way air inlet pipe is fixedly connected to the longitudinal inner wall of the second side box, and an air inlet check valve is provided in the three-way air inlet pipe.

[0020] As an optimized solution, a heating diverter box is fixedly connected to each transverse inner wall of the second side box, each heating diverter box is provided with a heating wire, and a plurality of air flow nozzles are fixedly connected to the longitudinal outer wall of the heating diverter box.

[0021] As an optimized solution, the three ports of the three-way air inlet pipe are respectively fixedly connected to the fan box and the two heating diverter boxes.

[0022] As an optimized solution, a control panel is fixedly connected to the lateral side wall of the polishing and grinding processing box.

[0023] As an optimized solution, a conveying connection port is respectively opened on each longitudinal outer wall of the polishing and grinding processing box, and the conveying and transfer assembly includes two parallel conveying clamps, and the two conveying clamps pass through the two conveying connection ports and are fixed to the polishing and grinding processing box.

[0024] As an optimized solution, a first conveying roller and a second conveying roller are rotatably provided at both ends of the two conveying clamping plates, and a conveying belt is sleeved between the first conveying roller and the second conveying roller.

[0025] As an optimized solution, a first conveying motor is fixedly connected to the longitudinal outer wall of the first side box, and the end of the output shaft of the first conveying motor passes through the conveying clamp and is fixedly connected to the first conveying roller. A second conveying motor is fixedly connected to the longitudinal outer wall of the second side box, and the end of the output shaft of the second conveying motor passes through the conveying clamp and is fixedly connected to the second conveying roller.

[0026] As an optimized solution, the transverse moving top seat is a horizontally arranged square seat, and two guide rails are fixedly connected to the longitudinal sides of the transverse moving top seat respectively. The guide rails are transversely opened U-shaped rails, and the upper ends of the guide rails are fixedly connected to the inner top surface of the polishing and grinding processing box.

[0027] As an optimized solution, a guide wheel is rotatably provided on each longitudinal side end face of the transverse displacement top seat, and the end of the guide wheel is rotatably clamped in the corresponding guide rail.

[0028] As an optimized solution, a displacement drive motor is fixedly connected to one side of the inner top surface of the polishing and grinding processing box, and a drive threaded rod is fixedly connected to the end of the output shaft of the displacement drive motor. The drive threaded rod passes horizontally and is threadedly connected to the transverse top seat.

[0029] As an optimized solution, the transmission box is a cylindrical box with an opening at the lower end, and four centrally symmetrical lifting and telescopic cylinders are fixedly connected to the lower surface of the transverse displacement top seat, and the lower telescopic ends of the lifting and telescopic cylinders are fixedly connected to the upper surface of the transmission box.

[0030] As an optimized solution, a transmission drive motor is fixedly connected to the center of the upper surface of the transmission box, the output shaft end of the transmission drive motor passes downward through the transmission box and is fixedly connected to a vertical rotating shaft, and a sun gear is rotatably provided at the lower end of the vertical rotating shaft.

[0031] As an optimized solution, a planetary carrier is fixedly connected to the outer circumferential wall of the vertical rotating shaft, a limiting gear ring is fixedly connected to the circumferential inner wall of the transmission box, and the first planetary gear and the second planetary gear are rotatably installed on both sides of the lower surface of the planetary carrier, the first planetary gear and the second planetary gear have the same size, and the first planetary gear and the second planetary gear are both clamped and meshed between the sun gear and the limiting gear ring.

[0032] As an optimized solution, the first mounting frame is fixedly connected to the center of the lower surface of the first planetary wheel, and the second mounting frame is fixedly connected to the center of the lower surface of the second planetary wheel.

[0033] As an optimized solution, a vacuum generator is connected between the first adsorption plate and the first mounting frame, and between the second adsorption plate and the second mounting frame, and the size of the first adsorption plate is larger than that of the second adsorption plate.

[0034] As an optimized solution, a liquid storage box is fixedly connected to the middle of the inner bottom surface of the polishing and grinding processing box, and the liquid storage box is a horizontally arranged square box.

[0035] As an optimized solution, a fixed column is fixedly connected to the middle of the upper surface of the liquid storage box, and the upper end of the fixed column is fixedly connected to the center of the lower end surface of the surface changing operation box.

[0036] As an optimized solution, both the first flip seat and the second flip seat are square seats, and the size of the first flip seat is larger than that of the second flip seat.

[0037] As an optimized solution, the flip limiting mechanism includes eight flip pallets, which are divided into two layers, the flip pallets are centrally symmetrically arranged and telescopically installed on the first flip seat respectively, and the flip pallets are driven by telescopic cylinders.

[0038] As an optimized solution, a vertical supporting square column is fixedly connected to the middle part of the inner bottom surface of the face changing operation box, and connecting shafts are respectively fixedly connected to the two lateral side end surfaces of the first flip seat, one of the connecting shafts is rotatably installed on the lateral inner wall of the face changing operation box, and the other connecting shaft is rotatably installed on the side end surface of the supporting square column.

[0039] As an optimized solution, a flipping drive motor is fixedly connected to the horizontal outer wall near the lower end of the face changing operation box, the output shaft end of the flipping drive motor extends into the face changing operation box and is fixedly connected to a transmission gear, and a driven gear meshing with the transmission gear is fixedly connected to the connecting shaft.

[0040] As an optimized solution, the second flip seat is rotatably arranged on the other side of the supporting square column, and adopts the same flip driving method as the first flip seat.

[0041] As an optimized solution, the two fixed bases are arranged on the two lateral sides of the liquid storage box and are fixedly connected to the inner bottom surface of the polishing box. The fixed bases are C-shaped seats with their openings facing downward.

[0042] As an optimized solution, the collecting box is a cylindrical box with an open upper end, and the inner ring size of the collecting box is slightly larger than the outer ring size of the transmission box.

[0043] As an optimized solution, a plurality of centrally symmetrical hydraulic telescopic cylinders are fixedly connected to the upper surface of the fixed base, and the upper telescopic end of each of the hydraulic telescopic cylinders is respectively fixedly connected to the lower surface of the collection box.

[0044] As an optimized solution, the upper end of one of the support sleeves is rotationally opposed to the lower surface of the rough grinding wheel, and the upper end of the other support sleeve is rotationally opposed to the lower surface of the fine polishing pad.

[0045] As an optimized solution, a plurality of centrally symmetrical water inlets are provided on the outer peripheral wall of the support sleeve near the upper end, and a return pipe is externally connected to the outer peripheral wall of the support sleeve near the lower end, and the end of the return pipe is fixedly connected to the liquid storage tank.

[0046] As an optimized solution, a horizontal waste separation net is provided in the inner middle section of the liquid storage tank.

[0047] As an optimized solution, an annular diverter pipe is fixedly connected to the outer wall of each collecting box, the annular diverter pipe and several grinding liquid nozzles are at the same horizontal height, and the grinding liquid nozzle and the annular diverter pipe are fixedly connected through a water inlet pipe.

[0048] As an optimized solution, each lateral side end face of the liquid storage tank is respectively connected to a booster water supply pump, the upper part of the booster water supply pump is externally connected to a water supply spiral pipe, and the upper end of the water supply spiral pipe is fixedly connected to the annular diverter pipe.

[0049] Compared with the prior art, the present invention has the following beneficial effects: The present invention provides a multifunctional integrated semiconductor wafer polishing equipment. Through innovative modular design, it integrates six functional units: conveying and loading, rough grinding and fine polishing, clamping and positioning, flipping and changing surfaces, thickness detection and drying. It significantly improves processing efficiency and surface treatment quality, while solving technical pain points such as the inconvenience of process switching and waste of grinding fluid in traditional equipment.

[0050] The conveying and transfer component provided in the present invention adopts a two-way logistics design, which can realize the automatic loading of wafers and unloading of finished products, seamlessly connect the polishing and grinding process, and reduce manual intervention.

[0051] The rough grinding and fine polishing components provided in the present invention adopt a dual-mode processing integrated design: a variety of surface treatments are completed through rough grinding wheels (rough grinding) and fine polishing pads (fine polishing), adapting to different process requirements. Furthermore, in terms of grinding liquid management: the collection box is built with multiple grinding liquid nozzles to accurately control the injection position; during polishing, the transmission box and the collection box are docked to form a closed space to effectively suppress splashing; the waste liquid is automatically recovered to the liquid storage tank, and recycled after separation to reduce the cost of consumables.

[0052] The adsorption clamping assembly provided in the present invention has the adaptability of clamping: it adopts a floating structure of a transverse top seat + a transmission box, which is compatible with the clamping limit of wafers of different sizes; the transmission box has a built-in planetary gear transmission mechanism (sun gear / planetary gear / limit gear ring) to drive the wafer to rotate + revolve synchronously, thereby improving the uniformity of polishing.

[0053] The flipping and facing assembly provided in the present invention can realize fully automatic facing operation: a dual-specification flip seat (first / second flip seat) is adopted to match different wafer sizes, and 8 retractable flip pallets are built in to ensure stable limiting of the flipping process; both flip seats are driven by a flip drive motor to rotate 180°, avoiding the risk of contamination caused by traditional disassembly and assembly.

[0054] The thickness detection assembly provided in the present invention has the function of online real-time monitoring. Specifically, the detection probe is driven to turn and retract by the steering mounting arm, and the thickness is measured immediately after rough grinding and fine polishing, and the data is fed back to calibrate the process parameters to ensure the material removal accuracy.

[0055] The drying assembly provided in the present invention integrates a hot air drying unit to quickly remove residual droplets on the surface and avoid water stain pollution. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for the specific embodiments or the description of the prior art. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn according to the actual scale.

[0057] Figure 1 It is a schematic cross-sectional view of the internal structure of each component in the present invention in the main viewing direction; Figure 2 It is a schematic cross-sectional view of the internal structure of each component in the present invention in a top view direction; Figure 3 It is a schematic cross-sectional view of the internal structure of each component in the present invention in the side view direction; Figure 4 It is a bottom view schematic diagram of the adsorption clamping assembly in the present invention; Figure 5 for Figure 1 A local enlarged schematic diagram of the middle A; Figure 6 It is an external overall schematic diagram of the present invention in the main viewing direction; Figure 7 It is a schematic diagram of the overall exterior of the present invention in a top view; Figure 8 It is an external overall schematic diagram of the present invention in a side view direction.

[0058] In the figure: 1-polishing processing box, 2-first side box, 3-second side box, 4-conveying connection port, 5-conveying splint, 6-first conveying roller, 7-second conveying roller, 8-conveying belt, 9-first conveying motor, 10-second conveying motor, 11-transverse top seat, 12-guide rail, 13-guide wheel, 14-displacement drive motor, 15-driving threaded rod, 16-transmission box, 17-lifting and telescopic cylinder, 18-transmission drive motor, 19-vertical shaft, 20-sun gear, 21-planet carrier, 22-limiting gear ring, 23-first planetary gear, 24-second planetary gear, 25-first mounting frame, 26-first adsorption disk, 27-second mounting frame, 28-second adsorption disk, 29-vacuum generator, 30-liquid storage tank, 31-face-changing operation box, 32-fixed column, 33-first flip seat, 34-first Two flip seats, 35-flip tray, 36-support square column, 37-connecting shaft, 38-flip drive motor, 39-transmission gear, 40-driven gear, 41-fixed base, 42-rotation drive motor, 43-transmission vertical shaft, 44-rough grinding wheel, 45-fine polishing pad, 46-support sleeve, 47-collection box, 48-grinding liquid nozzle, 49-hydraulic telescopic cylinder, 50-water inlet, 51-return pipe, 52-waste separation net, 53-annular diverter pipe, 54-water inlet pipe, 55-boosting water supply pump, 56-water supply spiral pipe, 57-steering mounting arm, 58-steering drive motor, 59-detection probe, 60-fan box, 61-rotating fan, 62-three-way air inlet pipe, 63-air inlet check valve, 64-heating diverter box, 65-heating wire, 66-air flow nozzle, 67-control panel. DETAILED DESCRIPTION

[0059] The following embodiments of the technical solution of the present invention are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and are therefore only used as examples, and cannot be used to limit the protection scope of the present invention.

[0060] like Figures 1 to 8 As shown, the grinding and polishing equipment for surface refinement of semiconductor wafers includes a grinding and polishing box 1, which is a horizontally arranged square box. The grinding and polishing box 1 is respectively provided with a conveying and transferring component, a rough grinding and fine polishing component, an adsorption and clamping component and a turning and conversion component.

[0061] A first side box 2 and a second side box 3 are respectively fixedly connected to two longitudinal outer walls of the polishing and grinding processing box 1. A thickness detection component is arranged in the first side box 2, and a drying component is arranged in the second side box 3.

[0062] A conveying connection port 4 is respectively formed on each longitudinal outer wall of the polishing and grinding processing box 1 , and the conveying and transfer assembly comprises two parallel conveying clamping plates 5 , which pass through the two conveying connection ports 4 and are fixedly connected to the polishing and grinding processing box 1 .

[0063] A first conveying roller 6 and a second conveying roller 7 are rotatably disposed at both ends of the two conveying clamping plates 5 , and a conveying belt 8 is sleeved between the first conveying roller 6 and the second conveying roller 7 .

[0064] A first conveying motor 9 is fixedly connected to the longitudinal outer wall of the first side box 2, and the end of the output shaft of the first conveying motor 9 passes through the conveying clamping plate 5 and is fixedly connected to the first conveying roller 6. A second conveying motor 10 is fixedly connected to the longitudinal outer wall of the second side box 3, and the end of the output shaft of the second conveying motor 10 passes through the conveying clamping plate 5 and is fixedly connected to the second conveying roller 7.

[0065] The adsorption clamping assembly includes a transverse moving top seat 11, which is a horizontally arranged square seat. Two guide rails 12 are fixedly connected to the longitudinal sides of the transverse moving top seat 11 respectively. The guide rails 12 are transversely opened U-shaped rails. The upper ends of the guide rails 12 are fixedly connected to the inner top surface of the polishing and grinding processing box 1.

[0066] A guide wheel 13 is rotatably provided on each longitudinal side end face of the transverse displacement top seat 11 , and the end of the guide wheel 13 is rotatably clamped in the corresponding guide rail 12 .

[0067] A displacement driving motor 14 is also fixedly connected to one side of the inner top surface of the polishing and grinding processing box 1 . A driving threaded rod 15 is fixedly connected to the end of the output shaft of the displacement driving motor 14 . The driving threaded rod 15 passes horizontally through and is threadedly connected to the transverse top seat 11 .

[0068] A transmission box 16 is provided below the transverse moving top seat 11 for lifting. The transmission box 16 is a cylindrical box with an opening at the lower end. Four centrally symmetrical lifting and telescopic cylinders 17 are fixedly connected to the lower surface of the transverse moving top seat 11. The lower telescopic ends of the lifting and telescopic cylinders 17 are fixedly connected to the upper surface of the transmission box 16.

[0069] A transmission drive motor 18 is fixedly connected to the center of the upper surface of the transmission box 16. The end of the output shaft of the transmission drive motor 18 passes downward through the transmission box 16 and is fixedly connected to a vertical shaft 19. A sun gear 20 is rotatably provided at the lower end of the vertical shaft 19.

[0070] A planet carrier 21 is fixedly connected to the outer peripheral wall of the vertical rotating shaft 19, and a limit gear ring 22 is fixedly connected to the circumferential inner wall of the transmission box 16. The first planetary gear 23 and the second planetary gear 24 are rotatably mounted on both sides of the lower surface of the planet carrier 21. The first planetary gear 23 and the second planetary gear 24 have the same size, and the first planetary gear 23 and the second planetary gear 24 are both clamped and engaged between the sun gear 20 and the limit gear ring 22.

[0071] A first mounting frame 25 is fixedly connected to the center of the lower surface of the first planetary gear 23, and a first adsorption plate 26 is fixedly provided inside the first mounting frame 25. A second mounting frame 27 is fixedly connected to the center of the lower surface of the second planetary gear 24, and a second adsorption plate 28 is fixedly provided inside the second mounting frame 27. The size of the first adsorption plate 26 is larger than that of the second adsorption plate 28.

[0072] A vacuum generator 29 is connected between the first suction plate 26 and the first mounting frame 25 , and between the second suction plate 28 and the second mounting frame 27 .

[0073] A liquid storage box 30 is fixedly connected to the middle of the inner bottom surface of the polishing and grinding processing box 1. The liquid storage box 30 is a horizontally arranged square box.

[0074] The flip-over assembly includes a face-changing operation box 31, which is a square box with an open upper end. A fixed column 32 is fixedly connected to the middle of the upper surface of the liquid storage tank 30, and the upper end of the fixed column 32 is fixedly connected to the center of the lower end surface of the face-changing operation box 31.

[0075] A first flip seat 33 and a second flip seat 34 are rotatably provided near the upper opening in the face-changing operation box 31 . The first flip seat 33 and the second flip seat 34 are both square seats, and the size of the first flip seat 33 is larger than that of the second flip seat 34 .

[0076] A turning limit mechanism is provided in the first turning seat 33, and the turning limit mechanism includes eight turning pallets 35, which are divided into two layers, the turning pallets 35 are centrally symmetrically arranged and telescopically mounted on the first turning seat 33, respectively, and the turning pallets 35 are driven by telescopic cylinders.

[0077] The second flip seat 34 is also provided with the flip limiting mechanism.

[0078] A vertical supporting square column 36 is fixedly connected to the middle of the inner bottom surface of the face changing operation box 31, and connecting shafts 37 are respectively fixedly connected to the two lateral side end surfaces of the first flip seat 33, one of the connecting shafts 37 is rotatably installed on the lateral inner wall of the face changing operation box 31, and the other connecting shaft 37 is rotatably installed on the side end surface of the supporting square column 36.

[0079] A flipping drive motor 38 is fixedly connected to the horizontal outer wall near the lower end of the face changing operation box 31. The end of the output shaft of the flipping drive motor 38 extends into the face changing operation box 31 and is fixedly connected to a transmission gear 39. A driven gear 40 meshing with the transmission gear 39 is fixedly connected to the connecting shaft 37.

[0080] The second flip seat 34 is rotatably disposed on the other side of the supporting square column 36 , and adopts the same flip driving method as the first flip seat 33 .

[0081] The rough grinding and fine polishing assembly includes two symmetrically arranged fixed bases 41, which are arranged on the two lateral sides of the liquid storage tank 30 and fixedly connected to the inner bottom surface of the polishing and grinding processing box 1. The fixed base 41 is a C-shaped seat with an opening facing downward, and a rotating drive motor 42 is fixedly connected to the center of the lower surface of each fixed base 41.

[0082] The output shaft end of the rotary drive motor 42 passes upward through the fixed base 41 and is fixedly connected to a transmission vertical shaft 43 , wherein a horizontal rough grinding wheel 44 is fixedly connected to the upper end of one transmission vertical shaft 43 , and a fine polishing pad 45 is fixedly connected to the upper end of the other transmission vertical shaft 43 .

[0083] A supporting sleeve 46 is sleeved on the outside of each transmission vertical shaft 43. The lower ends of the two supporting sleeves 46 are fixedly connected to the upper surfaces of the two fixed bases 41. The upper end of one of the supporting sleeves 46 is rotatably opposed to the lower surface of the rough grinding wheel 44, and the upper end of the other supporting sleeve 46 is rotatably opposed to the lower surface of the fine polishing pad 45.

[0084] A collecting box 47 is slidably sleeved on the outer peripheral wall of each supporting sleeve 46 . The collecting box 47 is a cylindrical box with an open upper end. The inner ring size of the collecting box 47 is slightly larger than the outer ring size of the transmission box 16 .

[0085] A plurality of centrally symmetrical grinding liquid nozzles 48 are fixedly connected to the circumferential inner wall of each collecting box 47 .

[0086] A plurality of centrally symmetrical hydraulic telescopic cylinders 49 are fixedly connected to the upper surface of the fixed base 41 , and the upper telescopic end of each hydraulic telescopic cylinder 49 is fixedly connected to the lower surface of the collection box 47 .

[0087] A plurality of centrally symmetrical water inlets 50 are provided on the outer peripheral wall of the support sleeve 46 near the upper end, and a return pipe 51 is externally connected to the outer peripheral wall of the support sleeve 46 near the lower end. The end of the return pipe 51 is fixedly connected to the liquid storage tank 30 .

[0088] A horizontal waste separation net 52 is provided in the middle section of the liquid storage box 30 .

[0089] An annular diverter pipe 53 is fixedly connected to the outer peripheral wall of each collecting box 47 . The annular diverter pipe 53 and the plurality of grinding liquid nozzles 48 are at the same level. The grinding liquid nozzles 48 and the annular diverter pipe 53 are fixedly connected via a water inlet pipe 54 .

[0090] A booster water supply pump 55 is externally connected to each lateral side end face of the liquid storage tank 30 . A water supply spiral pipe 56 is externally connected to the upper part of the booster water supply pump 55 . The upper end of the water supply spiral pipe 56 is fixedly connected to the annular diverter pipe 53 .

[0091] The thickness detection component includes two symmetrically arranged steering mounting arms 57, which are rotatably mounted on the inner top surface of the first side box 2 respectively. Two symmetrical steering drive motors 58 are fixedly connected to the upper surface of the first side box 2. The output shaft end of the steering drive motor 58 passes downward through the wall of the first side box 2 and is fixedly connected to the center of the upper surface of the steering mounting arm 57.

[0092] The lower surface of each steering mounting arm 57 is provided with a detection probe 59 which can be extended and retracted in the horizontal direction.

[0093] The drying assembly includes a fan box 60 fixedly connected to the longitudinal outer wall of the second side box 3, a rotating fan 61 is arranged in the fan box 60, a three-way air inlet pipe 62 is fixedly connected to the longitudinal inner wall of the second side box 3, and an air inlet check valve 63 is arranged in the three-way air inlet pipe 62.

[0094] A heating diverter box 64 is fixedly connected to each transverse inner wall of the second side box 3 , and a heating wire 65 is provided in each heating diverter box 64 . A plurality of air flow nozzles 66 are fixedly connected to the longitudinal outer wall of the heating diverter box 64 .

[0095] The three ports of the three-way air inlet pipe 62 are respectively fixedly connected to the fan box 60 and the two heating diverter boxes 64.

[0096] A control panel 67 is fixedly connected to the lateral side wall of the polishing and grinding processing box 1 , and the control panel 67 is electrically connected to each driving motor and the detection probe 59 .

[0097] When used in the present invention: First, the wafers are automatically loaded; the first conveying motor 9 and the second conveying motor 10 are started to drive the first conveying roller 6 and the second conveying roller 7 respectively, so that the conveyor belt 8 circulates; the wafers to be processed are placed on the conveyor belt 8 in sequence and transported to the inside of the polishing processing box 1.

[0098] Then, the wafer is intelligently clamped and positioned: the displacement drive motor 14 is started, and the transverse top seat 11 is adjusted to move transversely along the guide rail 12 to just above the conveyor belt 8 by driving the threaded rod 15; the vacuum generator 29 is turned on, and the first suction plate 26 is selected to adsorb large-sized wafers and the second suction plate 28 to adsorb small-sized wafers according to the size of the wafers.

[0099] The wafer is then rough ground and cooled: the lateral top seat 11 is driven to move above the rough grinding wheel 44; the lifting and telescopic cylinder 17 is controlled to extend, driving the collection box 47 to move up and seal with the transmission box 16; the transmission drive motor 18 is started to drive the wafer to rotate and revolve through the sun gear 20, the first planetary gear 23, the second planetary gear 24 and the limit gear ring 22; the lifting and telescopic cylinder 17 controls the wafer to press down and contact the rough grinding wheel 44 to complete the surface rough grinding.

[0100] Then cooling and waste liquid recovery are carried out: the booster water supply pump 55 draws the grinding liquid in the liquid storage tank 30, and sprays it through the water supply spiral pipe 56 → annular diversion pipe 53 → grinding liquid nozzle 48 for cooling; the waste liquid returns to the liquid storage tank 30 through the collection box 47 → water inlet 50 → reflux pipe 51 for separation and recovery.

[0101] Then, drying and thickness detection are carried out: the rotating fan 61 is started, and the air flow is heated by the heating wire 65 and then ejected from the air flow nozzle 66 to quickly dry the surface; the steering drive motor 58 adjusts the detection probe 59 to a longitudinal vertical position, and controls the detection probe 59 to extend so that it faces the wafer, measures the thickness in real time, and feeds back data.

[0102] Then, fine polishing and secondary inspection are performed: the above operations are repeated, and the wafer is transferred to the fine polishing pad 45 to complete fine polishing, and then dried and inspected again.

[0103] Then, the wafer is automatically flipped over: the adsorption assembly moves the wafer to the top of the flipping operation box 31; Select the first flip seat 33 or the second flip seat 34 according to the size: based on the selected flip seat, control the four flip pallets 35 at the bottom to extend to receive the wafer, and at the same time close the vacuum adsorption, and control the four flip pallets 35 at the top to extend to fix the wafer; the flip drive motor 38 drives the flip seat to rotate 180°.

[0104] Finally, secondary processing is carried out: the adsorption component re-clamps the wafer and performs rough grinding and fine polishing on the back side.

[0105] After the wafers are processed, they are transported out via the conveyor belt 8 .

[0106] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be included in the scope of the claims and specification of the present invention.

Claims

1. Grinding and polishing equipment for surface refinement of semiconductor wafers, characterized in that: It comprises a polishing and grinding processing box, in which a conveying and transferring component, a rough grinding and fine polishing component, an adsorption and clamping component and a turning and changing surface component are respectively arranged; The adsorption clamping assembly comprises a transverse top seat slidably arranged on the top surface of the polishing and grinding processing box, a transmission box is lifted and lowered below the transverse top seat, a first mounting frame and a second mounting frame which can rotate and revolve respectively are respectively arranged in the transmission box, a first adsorption plate is fixedly arranged in the first mounting frame, and a second adsorption plate is fixedly arranged in the second mounting frame; The reversing assembly comprises a reversing operation box fixedly arranged on the inner bottom surface of the polishing and grinding processing box, wherein a first reversing seat and a second reversing seat are rotatably arranged near the upper end opening of the reversing operation box, and a reversing limit mechanism is arranged in the first reversing seat and the second reversing seat respectively; The rough grinding and fine polishing assembly comprises two fixed bases symmetrically arranged on both sides of the face changing operation box, a rotary drive motor is fixedly connected to the center of the lower surface of each fixed base, the output shaft end of the rotary drive motor passes through the fixed base upward and is fixedly connected to a transmission vertical shaft, a horizontal rough grinding wheel is fixedly connected to the upper end of one of the transmission vertical shafts, and a horizontal fine polishing pad is fixedly connected to the upper end of the other transmission vertical shaft; A supporting sleeve is sleeved on the outside of each of the vertical transmission shafts, and the lower end of the supporting sleeve is fixedly connected to the upper surface of the fixed base. A collecting box is slidably sleeved on the outer peripheral wall of each of the supporting sleeves, and a plurality of centrally symmetrical grinding liquid nozzles are fixedly connected to the circumferential inner wall of each of the collecting boxes.

2. The grinding and polishing equipment for semiconductor wafer surface refinement according to claim 1, characterized in that: A first side box and a second side box are respectively fixedly connected to both sides of the polishing and grinding processing box, a thickness detection component is arranged in the first side box, and a drying component is arranged in the second side box; The thickness detection assembly includes two symmetrically arranged steering mounting arms, which are rotatably mounted on the inner top surface of the first side box respectively, and the upper surface of the first side box is fixedly connected with two symmetrical steering drive motors, and the output shaft ends of the steering drive motors pass downward through the first side box wall and are fixedly connected to the center of the upper surface of the steering mounting arms; The lower surface of each of the steering mounting arms is provided with a detection probe that is telescopic in the horizontal direction; The drying assembly comprises a fan box fixedly connected to the longitudinal outer wall of the second side box, a rotating fan is arranged in the fan box, a three-way air inlet pipe is fixedly connected to the longitudinal inner wall of the second side box, and an air inlet check valve is arranged in the three-way air inlet pipe; A heating shunt box is fixedly connected to each transverse inner wall of the second side box, each of the heating shunt boxes is provided with a heating wire, and a plurality of air flow nozzles are fixedly connected to the longitudinal outer wall of the heating shunt box; The three ports of the three-way air inlet pipe are respectively fixedly connected to the fan box and the two heating shunt boxes; A control panel is fixedly connected to the transverse side wall of the polishing and grinding processing box.

3. The grinding and polishing equipment for semiconductor wafer surface refinement according to claim 2, characterized in that: A conveying connection port is respectively provided on each longitudinal outer wall of the polishing and grinding processing box, and the conveying and transferring assembly comprises two parallel conveying clamping plates, the two conveying clamping plates pass through the two conveying connection ports and are fixedly connected to the polishing and grinding processing box; The two ends of the two conveying clamps are rotatably provided with a first conveying roller and a second conveying roller, and a conveying belt is sleeved between the first conveying roller and the second conveying roller; A first conveying motor is fixedly connected to the longitudinal outer wall of the first side box, and a terminal end of an output shaft of the first conveying motor passes through the conveying clamp and is fixedly connected to the first conveying roller. A second conveying motor is fixedly connected to the longitudinal outer wall of the second side box, and a terminal end of an output shaft of the second conveying motor passes through the conveying clamp and is fixedly connected to the second conveying roller.

4. The grinding and polishing equipment for semiconductor wafer surface refinement according to claim 1, characterized in that: The transverse top seat is a horizontally arranged square seat, and two guide rails are respectively fixedly connected to the longitudinal sides of the transverse top seat, and the guide rails are U-shaped rails with transverse openings, and the upper ends of the guide rails are fixedly connected to the inner top surface of the polishing and grinding processing box; A guide wheel is rotatably provided on each longitudinal side end surface of the transverse top seat, and the end of the guide wheel is rotatably clamped in the corresponding guide rail; A displacement driving motor is also fixedly connected to one side of the inner top surface of the polishing and grinding processing box, and a driving threaded rod is fixedly connected to the end of the output shaft of the displacement driving motor. The driving threaded rod passes horizontally and is threadedly connected to the transverse top seat.

5. The grinding and polishing equipment for semiconductor wafer surface refinement according to claim 1, characterized in that: The transmission box is a cylindrical box with an opening at the lower end, and four centrally symmetrical lifting and telescopic cylinders are fixedly connected to the lower surface of the transverse displacement top seat, and the lower telescopic ends of the lifting and telescopic cylinders are fixedly connected to the upper surface of the transmission box; A transmission drive motor is fixedly connected at the center of the upper surface of the transmission box, the output shaft end of the transmission drive motor passes downward through the transmission box and is fixedly connected to a vertical rotating shaft, and a sun gear is rotatably provided at the lower end of the vertical rotating shaft; A planet carrier is fixedly connected to the outer peripheral wall of the vertical rotating shaft, a limit gear ring is fixedly connected to the circumferential inner wall of the transmission box, and a first planetary gear and a second planetary gear are rotatably mounted on both sides of the lower surface of the planet carrier, the first planetary gear and the second planetary gear have the same size, and the first planetary gear and the second planetary gear are both clamped and meshed between the sun gear and the limit gear ring; The first mounting frame is fixedly connected to the center of the lower surface of the first planetary gear, and the second mounting frame is fixedly connected to the center of the lower surface of the second planetary gear; A vacuum generator is connected between the first adsorption plate and the first mounting frame, and between the second adsorption plate and the second mounting frame. The size of the first adsorption plate is larger than that of the second adsorption plate.

6. The grinding and polishing equipment for semiconductor wafer surface refinement according to claim 1, characterized in that: A liquid storage tank is fixedly connected to the middle of the inner bottom surface of the polishing and grinding processing box, and the liquid storage tank is a horizontally arranged square box; A fixed column is fixedly connected to the middle of the upper surface of the liquid storage box, and the upper end of the fixed column is fixedly connected to the center of the lower end surface of the face-changing operation box; The first flip seat and the second flip seat are both square seats, and the size of the first flip seat is larger than that of the second flip seat; The flip limiting mechanism comprises eight flip pallets, which are divided into two layers, the flip pallets are centrally symmetrically arranged and telescopically mounted on the first flip seat respectively, and the flip pallets are driven by telescopic cylinders.

7. The grinding and polishing equipment for semiconductor wafer surface refinement according to claim 6, characterized in that: A vertical supporting square column is fixedly connected to the middle of the inner bottom surface of the face-changing operation box, and connecting shafts are respectively fixedly connected to the two lateral side end surfaces of the first flip seat, one of which is rotatably mounted on the lateral inner wall of the face-changing operation box, and the other is rotatably mounted on the side end surface of the supporting square column; A flip driving motor is fixedly connected to the transverse outer wall of the face-changing operation box near the lower end, the output shaft end of the flip driving motor extends into the face-changing operation box and is fixedly connected to a transmission gear, and a driven gear meshing with the transmission gear is fixedly connected to the connecting shaft; The second flip seat is rotatably arranged on the other side of the supporting square column, and adopts the same flip driving method as the first flip seat.

8. The grinding and polishing equipment for semiconductor wafer surface refinement according to claim 6, characterized in that: The two fixed bases are respectively arranged on the lateral sides of the liquid storage box and fixedly connected to the inner bottom surface of the polishing and grinding processing box, and the fixed bases are C-shaped bases with openings facing downwards; The collecting box is a cylindrical box with an opening at the upper end, and the inner ring size of the collecting box is slightly larger than the outer ring size of the transmission box; A plurality of centrally symmetrical hydraulic telescopic cylinders are fixedly connected to the upper surface of the fixed base, and the upper telescopic end of each hydraulic telescopic cylinder is respectively fixedly connected to the lower surface of the collection box.

9. The grinding and polishing equipment for semiconductor wafer surface refinement according to claim 8, characterized in that: The upper end of one of the support sleeves is rotatably opposed to the lower surface of the rough grinding wheel, and the upper end of the other support sleeve is rotatably opposed to the lower surface of the fine polishing pad; A plurality of centrally symmetrical water inlets are provided on the outer peripheral wall of the support sleeve near the upper end, and a return pipe is externally connected to the outer peripheral wall of the support sleeve near the lower end, and the end of the return pipe is fixedly connected to the liquid storage tank; A horizontal waste separation net is provided in the middle section of the liquid storage tank; An annular shunt pipe is fixedly connected to the outer peripheral wall of each collecting box, the annular shunt pipe is at the same level as the plurality of grinding liquid spray heads, and the grinding liquid spray heads and the annular shunt pipe are fixedly connected via a water inlet pipe; A booster water supply pump is externally connected to each lateral side end face of the liquid storage tank, and a water supply spiral pipe is externally connected to the upper part of the booster water supply pump. The upper end of the water supply spiral pipe is fixedly connected to the annular diverter pipe.

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