Polishing disc device for synchronously removing heterogeneous materials under assistance of ultraviolet lamp beads

Abstract

The invention provides an ultraviolet lamp bead assisted heterogeneous material synchronous removal polishing disk device, which relates to the technical field of polishing, and comprises a polishing pad, a polishing disk, a partition plate, an ultraviolet lamp bead module, a cooling module and a support frame, the partition plate is arranged on the supporting frame, the polishing disc is arranged on the partition plate, and the polishing pad is arranged on the polishing disc. A plurality of first through holes are formed in the polishing pad, and a plurality of second through holes are formed in the polishing disc; light guide lamp posts are arranged in the first through holes and the second through holes; the first through holes and the second through holes are arranged according to a set rule; the ultraviolet lamp bead module and the cooling module are arranged in the support frame; the ultraviolet lamp bead module is arranged on the cooling module; the ultraviolet lamp bead module comprises a plurality of ultraviolet lamp beads; the number of the ultraviolet lamp beads is the same as that of the second through holes; and the ultraviolet lamp beads are arranged according to a set rule and are arranged corresponding to the second through holes. According to the invention, uniform irradiation of ultraviolet light is realized, and uniform removal of materials is promoted.

Description

Technical Field

[0001] The invention relates to the technical field of polishing, and in particular to a polishing disc device for synchronously removing heterogeneous materials with the assistance of ultraviolet lamp beads. Background Art

[0002] With the continuous development of semiconductor manufacturing and ultra-precision processing technology, the requirements for surface finish and material removal uniformity are increasing. Although traditional chemical mechanical polishing (CMP) technology is widely used in precision surface processing, it has obvious limitations in pursuing sub-nanometer precision and controlling material removal rate, especially in the processing of complex heterogeneous material surfaces. In order to solve these problems, the industry has gradually introduced external energy field auxiliary technology, such as ultraviolet light source, to improve polishing efficiency and processing accuracy.

[0003] However, existing polishing devices based on ultraviolet light sources still have some performance problems. First, due to the use of a single light source for irradiation, the light distribution is often uneven, which affects the uniformity of the photocatalytic reaction and the consistency of material removal. Secondly, many devices use ultraviolet light with a wavelength of 365nm. This lower energy photon is difficult to fully stimulate the photochemical reaction of the material to be processed, resulting in unsatisfactory polishing efficiency and accuracy. In addition, some devices use quartz glass as a polishing disk that directly contacts the workpiece, which can easily cause scratches or damage to the processed surface. Furthermore, although some technologies use ultraviolet light to assist, the light source does not directly act on the surface to be processed. Long-term exposure of ultraviolet light to the polishing pad will cause it to age and affect the polishing effect. Summary of the invention

[0004] The purpose of the present invention is to provide a polishing disk device for synchronously removing heterogeneous materials assisted by ultraviolet lamp beads. By combining an ultraviolet light source array with a bionic phyllotaxy arrangement and a light guide column, uniform irradiation of ultraviolet light can be achieved, and the removal rate of heterogeneous materials can be improved and the surface roughness can be reduced under the synergistic effect of light, machinery and chemical. At the same time, the amount of oxidant used in traditional chemical mechanical polishing can be reduced through the ultraviolet light chemical coupling effect, and under the premise of ensuring the controllability of the material removal selectivity, the dual optimization of reagent cost reduction and environmental pollution risk can be achieved.

[0005] A device for synchronously removing heterogeneous materials with the aid of ultraviolet lamp beads and a polishing disc, comprising: a polishing pad, a polishing disc, a partition, an ultraviolet lamp bead module, a cooling module and a support frame;

[0006] The support frame is a hollow frame, the partition is arranged on the support frame, the polishing disc is arranged on the partition, and the polishing pad is arranged on the polishing disc;

[0007] The polishing pad is provided with a plurality of first through holes, and the polishing plate is provided with a plurality of second through holes; the number of the first through holes is the same as the number of the second through holes and they are arranged correspondingly; each of the first through holes and each of the second through holes is provided with a light guide lamp post;

[0008] The first through holes are arranged in a set pattern on the polishing pad, and the second through holes are arranged in a set pattern on the polishing plate;

[0009] The ultraviolet lamp bead module and the cooling module are both arranged in the supporting frame; the ultraviolet lamp bead module is arranged on the cooling module; the cooling module is used to dissipate heat for the ultraviolet lamp bead module;

[0010] The ultraviolet lamp bead module includes a plurality of ultraviolet LED lamp beads; the number of the ultraviolet LED lamp beads is the same as the number of the second through holes;

[0011] The ultraviolet LED lamp beads are arranged in a set pattern and are arranged corresponding to the second through holes.

[0012] Optionally, the polishing disc device further comprises a base;

[0013] The support frame is arranged on the base; holes are provided on the lower end of the support frame and the base, and the holes are used for heat dissipation and connecting power lines.

[0014] Optionally, the ultraviolet lamp bead module further includes a PCB board;

[0015] Each of the ultraviolet LED lamp beads is disposed on the PCB board and arranged in a set regular pattern.

[0016] Optionally, the set rule is one or more of phyllotaxy arrangement, spiral arrangement, close-packed arrangement, fractal arrangement and probability density arrangement.

[0017] Optionally, the set rule is a phyllotaxy arrangement, and the phyllotaxy angle of the phyllotaxy arrangement is 137.51°.

[0018] Optionally, the apertures of the first through hole and the second through hole are both in the range of 1-10 mm.

[0019] Optionally, the diameters of the first through hole and the second through hole are both 5 mm.

[0020] Optionally, the wavelength of the ultraviolet light emitted by each of the ultraviolet LED lamp beads is 200-400nm.

[0021] Optionally, the wavelength of the ultraviolet light emitted by each of the ultraviolet LED lamp beads is 255nm.

[0022] Optionally, the number of each of the first through holes, the number of each of the second through holes, and the number of each of the ultraviolet LED lamp beads are the same, and are all 250.

[0023] The effects of the present invention are as follows:

[0024] The UV lamp bead-assisted heterogeneous material synchronous removal polishing disc device of the present invention can realize uniform irradiation of ultraviolet light by adopting a leaf-sequence distributed through-hole design and precisely arranged UV LED lamp beads, thereby promoting uniform removal of materials during the polishing process. Especially in high-precision semiconductor manufacturing and surface treatment of complex heterogeneous materials, the uniform distribution of light energy effectively reduces the surface unevenness, greatly improves the polishing accuracy, and ensures sub-nanometer surface finish.

[0025] The ultraviolet lamp beads of the present invention assist the synchronous removal of heterogeneous materials from the polishing disk device. The ultraviolet LED lamp beads emit ultraviolet light with a wavelength of 255nm, which can trigger a photochemical reaction on the surface of the material, promote the chemical activity of the polishing liquid, and further increase the material removal rate. Compared with the traditional chemical mechanical polishing technology, the present invention combines ultraviolet light catalysis while more accurately controlling the thickness of the removal layer, achieving self-limiting removal, improving the controllability of the polishing effect, and avoiding the risk of pollution caused by excessive oxidants in traditional processes.

[0026] The ultraviolet lamp bead assisted heterogeneous material synchronous removal polishing disk device of the present invention solves the heat problem generated by the high-intensity ultraviolet light source through the cooling module, ensuring that the ultraviolet LED lamp bead can still maintain a stable light output power when working for a long time, and preventing the polishing performance from being reduced or the equipment from being damaged due to overheating. The efficient operation of the cooling module not only prolongs the service life of the ultraviolet lamp bead module, but also ensures the stability of the entire polishing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural diagram of the polishing disc device for synchronously removing heterogeneous materials assisted by ultraviolet lamp beads of the present invention;

[0028] Figure 2 It is a top view of the polishing disc device for synchronously removing heterogeneous materials with the assistance of ultraviolet lamp beads of the present invention;

[0029] Figure 3 It is a structural diagram of the ultraviolet lamp bead module of the present invention.

[0030] In the figure: 1. polishing pad; 2. polishing disc; 3. light guide lamp column; 4. partition; 5. UV lamp bead module; 6. cooling module; 7. support frame; 8. bottom plate; 501. UV LED lamp bead; 502. PCB board. DETAILED DESCRIPTION

[0031] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0032] Figure 1 It is a structural diagram of the polishing disc device for synchronously removing heterogeneous materials assisted by ultraviolet lamp beads of the present invention; Figure 2 1 is a top view of the polishing disc device for synchronously removing heterogeneous materials with the assistance of ultraviolet lamp beads according to the present invention. Figure 1 and Figure 2 As shown, the present invention provides a UV lamp bead assisted polishing disk device for synchronously removing heterogeneous materials, which includes: a polishing pad 1, a polishing disk 2, a partition 4, an UV lamp bead module 5, a cooling module 6, a support frame 7 and a base.

[0033] The support frame 7 is a hollow frame, the partition 4 is arranged on the support frame 7, the polishing disc 2 is arranged on the partition 4, and the polishing pad 1 is arranged on the polishing disc 2. The support frame 7 is arranged on the base; the lower end of the support frame 7 and the base are both provided with holes, and the holes are used for heat dissipation and connecting the power line.

[0034] The polishing pad 1 is provided with a plurality of first through holes, and the polishing plate 2 is provided with a plurality of second through holes; the number of the first through holes is the same as the number of the second through holes and they are arranged correspondingly; each first through hole and each second through hole is provided with a light guide lamp post 3. Preferably, the aperture range of the first through hole and the second through hole is 1-10 mm, preferably 5 mm.

[0035] Preferably, the polishing pad 1 is made of a polymer material, preferably a polyurethane material in this embodiment, which has excellent elasticity, wear resistance and chemical stability. The polishing pad 1 is bonded to the polishing disc 2, and during bonding, it is necessary to ensure that the first through hole on the polishing pad 1 corresponds to the second through hole on the polishing disc 2 to maximize the light energy transmission effect.

[0036] The polishing disc 2 is machined from a metal material and is mounted on a support frame 7 by bolts to ensure the stability of the overall structure and avoid any shaking during the polishing process.

[0037] The light guide lamp post 3 is made of highly UV-transmissive quartz glass, which has a transmittance of more than 85% for UV light with a wavelength of about 250nm. This high transmittance ensures that the light emitted from the UV LED lamp bead 501 can be transmitted to the maximum extent, greatly improving the utilization rate of the UV light. There is a UV LED lamp bead 501 corresponding to the bottom of each light guide lamp bead. The design of the light guide lamp post 3 maximizes the utilization of light energy, thereby significantly improving the material removal efficiency and surface quality.

[0038] The partition 4 is also made of highly UV-transmissive quartz glass. The partition 4 is placed on the annular stepped groove of the support frame 7 and bonded to the support frame 7 by a sealant. It can not only support the light guide lamp column 3, but also prevent the polishing liquid from leaking into the UV lamp bead module 5, protecting it from chemical corrosion and moisture, and ensuring long-term stable operation.

[0039] The support frame 7 is made of metal material and is a hollow cylinder structure as a whole, providing good strength and stability. The support frame 7 is connected to the bottom plate 8 by bolts. The upper part is used to fix the polishing disc 2, and a stepped groove is provided inside to facilitate the stable installation of the partition plate 4. This design ensures the structural stability and seismic resistance of the entire device, and can withstand a high-intensity working environment.

[0040] The bottom plate 8 is made of metal material, providing a solid foundation for the entire device. The bottom plate 8 is designed with holes to facilitate the arrangement of the water-cooling pipes and power supply wires, ensuring the neatness of the device and the effectiveness of its functions.

[0041] The first through holes are arranged on the polishing pad 1 in a set pattern, and the second through holes are arranged on the polishing disc 2 in a set pattern. Specifically, the set pattern is one or more of phyllotaxis arrangement, spiral arrangement, close packing arrangement, fractal arrangement, and probability density arrangement, preferably phyllotaxis arrangement, and the phyllotaxis angle of the phyllotaxis distribution is 137.51°.

[0042] The ultraviolet lamp bead module 5 and the cooling module 6 are both arranged inside the support frame 7; the ultraviolet lamp bead module 5 is arranged on the cooling module 6; the cooling module 6 is used to dissipate heat from the ultraviolet lamp bead module 5.

[0043] The cooling module 6 adopts a water-cooling method and includes a water-cooling unit and a water-cooling pump. The water-cooling unit is installed on the bottom plate 8, and the circulating cooling water pipe is led out from the hole of the bottom plate 8 and connected to the water-cooling pump. The water-cooling unit is directly installed under the PCB board 502, used for the efficient heat dissipation of the ultraviolet lamp bead module 5, extending the service life of the ultraviolet lamp bead module 5, ensuring that the ultraviolet lamp bead module 5 can continuously and stably provide a high-intensity ultraviolet light source during operation, preventing overheating from affecting the polishing effect, and ensuring stability under high-load working conditions.

[0044] As Figure 3 shown, the ultraviolet lamp bead module 5 includes a PCB board 502 and a plurality of ultraviolet LED lamp beads 501; the number of the ultraviolet LED lamp beads 501 is the same as the number of the second through holes.

[0045] Each ultraviolet LED lamp bead 501 is arranged on the PCB board 502 and is in phyllotaxis distribution, and the ultraviolet LED lamp bead 501 is arranged corresponding to the second through hole. Preferably, the wavelength of the ultraviolet light emitted by each ultraviolet LED lamp bead 501 is 200 - 400 nm, preferably 255 nm.

[0046] The wire of the ultraviolet lamp bead module 5 is led out from the middle of the PCB board 502, passes through the hole of the bottom plate 8, and is connected to an external power supply device. Each ultraviolet LED lamp bead 501 corresponds precisely to the upper light guide column 3 above, ensuring that the ultraviolet light can be effectively transmitted to the surface of the material to be processed.

[0047] Specifically, the number of each first through hole, each second through hole and each ultraviolet LED lamp bead 501 is 250.

[0048] The principle of the present invention is as follows:

[0049] Each UV LED lamp bead 501 precisely corresponds to the upper light guide lamp column 3 to ensure that the UV light can be effectively transmitted to the surface of the material to be processed. When the UV lamp bead module 5 is working, the UV light with a wavelength of 255nm is emitted by the UV LED lamp bead 501 and transmitted to the surface of the material to be processed through the partition 4 and the light guide lamp column 3.

[0050] The embodiments described above are only descriptions of the preferred implementation modes of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should all fall within the protection scope determined by the claims of the present invention.

Claims

1. A device for synchronously removing foreign materials from a polishing disc using ultraviolet lamp beads, characterized in that: It includes: Polishing pad, polishing disc, partition, UV lamp module, cooling module and support frame; The support frame is a hollow frame, the partition is arranged on the support frame, the polishing disc is arranged on the partition, and the polishing pad is arranged on the polishing disc; The polishing pad is provided with a plurality of first through holes, and the polishing plate is provided with a plurality of second through holes; the number of the first through holes is the same as the number of the second through holes and they are arranged correspondingly; each of the first through holes and each of the second through holes is provided with a light guide lamp post; The first through holes are arranged in a set pattern on the polishing pad, and the second through holes are arranged in a set pattern on the polishing plate; The ultraviolet lamp bead module and the cooling module are both arranged in the supporting frame; the ultraviolet lamp bead module is arranged on the cooling module; the cooling module is used to dissipate heat for the ultraviolet lamp bead module; The ultraviolet lamp bead module includes a plurality of ultraviolet LED lamp beads; the number of the ultraviolet LED lamp beads is the same as the number of the second through holes; The ultraviolet LED lamp beads are arranged in a set pattern and are arranged corresponding to the second through holes.

2. The ultraviolet lamp bead assisted polishing disc device for synchronously removing foreign materials according to claim 1 is characterized in that: The polishing disc device also includes a base; The support frame is arranged on the base; holes are provided on the lower end of the support frame and the base, and the holes are used for heat dissipation and connecting power lines.

3. The ultraviolet lamp bead assisted polishing disc device for synchronously removing foreign materials according to claim 1, characterized in that: The ultraviolet lamp bead module also includes a PCB board; Each of the ultraviolet LED lamp beads is disposed on the PCB board and arranged in a set regular pattern.

4. The ultraviolet lamp bead assisted polishing disc device for synchronously removing foreign materials according to claim 1, characterized in that: The set rule is one or more of phyllotaxy arrangement, spiral arrangement, close packing arrangement, fractal arrangement and probability density arrangement.

5. The ultraviolet lamp bead assisted polishing disc device for synchronously removing foreign materials according to claim 4 is characterized in that: The set rule is a leaf arrangement, and the leaf arrangement angle is 137.51°.

6. The ultraviolet lamp bead assisted polishing disc device for synchronously removing foreign materials according to claim 1, characterized in that: The apertures of the first through hole and the second through hole are both in the range of 1-10 mm.

7. The ultraviolet lamp bead assisted polishing disc device for synchronously removing foreign materials according to claim 6, characterized in that: The diameters of the first through hole and the second through hole are both 5 mm.

8. The ultraviolet lamp bead assisted polishing disc device for synchronously removing foreign materials according to claim 1, characterized in that: The wavelength of the ultraviolet light emitted by each ultraviolet LED lamp bead is 200-400nm.

9. The ultraviolet lamp bead assisted polishing disc device for synchronously removing foreign materials according to claim 8, characterized in that: The wavelength of the ultraviolet light emitted by each of the ultraviolet LED lamp beads is 255nm.

10. The ultraviolet lamp bead assisted polishing disc device for synchronously removing foreign materials according to claim 1, characterized in that: The number of each of the first through holes, each of the second through holes and each of the ultraviolet LED lamp beads is the same, and is 250.

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