Semiconductor device plastic packaging device

Abstract

The present disclosure relates to the technical field of plastic encapsulation devices. The present disclosure provides a semiconductor device plastic encapsulation device, which includes a molding plate arranged between an upper mold and a lower mold, the molding plate having a molding hole and a flow channel hole, the upper mold and the lower mold being configured to correspond and seal the top and bottom of the molding hole one by one to form a molding space for molding the product to be plastic encapsulated, and the flow channel hole is connected to the molding space; the flow channel plate is arranged in the flow channel hole for lifting and lowering, and is used to guide the molten plastic encapsulation material to the molding space; the pusher is arranged on the lower mold for movement, and the pusher is configured to push the flow channel plate up after movement, so that the top surface of the flow channel plate is coplanar with the top surface of the molding plate, and the plastic encapsulation material originally remaining in the corner will be exposed on a relatively flat surface and can be directly scraped off. Through the above technical solution, the technical problem of using sheet-like objects to clean the plastic encapsulation material remaining in the corner of the groove flow channel during the cleaning process of the plastic encapsulation device after molding and unloading in the related art is solved, which leads to cumbersome operation and easy cleaning.

Description

Technical Field

[0001] The embodiments of the present disclosure relate to the technical field of plastic packaging devices, and in particular, to a plastic packaging device for a semiconductor device. Background Art

[0002] The semiconductor device manufacturing process is divided into front-end and back-end processes. Among them, the plastic encapsulation process is mainly completed in the back-end process of semiconductor manufacturing. This process is to extrude the hot melted plastic encapsulation material into the mold cavity, so that the molten plastic encapsulation material wraps the product to be encapsulated to produce the plastic encapsulation body.

[0003] At present, for special types of plastic-sealed bodies, such as several identical plastic-sealed bodies connected together in a row, the large-scale automated equipment on the market used for mass production is not suitable for the plastic-sealing process. This is because a lot of cost is spent on the mold structure, and such special types of plastic-sealed bodies are usually produced in small batches, while large-scale automated equipment is generally suitable for mass production of plastic-sealed bodies with uniform specifications.

[0004] The products to be encapsulated in a continuous plastic encapsulation body are generally the base plate and the chips and bonding wires welded thereon. Due to the particularity of its continuous shape, in order to ensure that the molten plastic encapsulation material can completely wrap the products to be encapsulated, a runner plate will be added between the upper and lower molds. The molten plastic encapsulation material will then flow into the mold cavity along the wider groove flow channel between the runner plate, the upper mold and the lower mold, so that the molten plastic encapsulation material can synchronously and evenly wrap one side of the continuous plastic encapsulation product, rather than just flowing in from a single small flow port in the mold cavity, so as to avoid the bonding wires on the products to be encapsulated being affected and damaged by the molten plastic encapsulation fluid.

[0005] Specifically, the plastic sealing device adapted to the above-mentioned continuous plastic sealing body undergoes the following steps during operation:

[0006] 1. First place the product to be plastic-sealed into the cavity of the lower mold, and then place the plastic sealing material into the barrel of the upper mold;

[0007] 2. The upper die is driven by external force to drop vertically and fit tightly with the lower die;

[0008] 3. The plastic sealing material is melted by high temperature and becomes molten plastic sealing material. Under the action of its own gravity, it flows to the runner of the runner plate and eventually fills the mold cavity. It cools and solidifies into a continuous plastic sealing body.

[0009] However, the above-mentioned plastic sealing device has the following disadvantages during operation:

[0010] After the plastic sealing is completed, there will be residual plastic sealing material on the runner plate, that is, in the wider groove runner between the runner plate, the upper mold and the lower mold. If it is not cleaned in time, it will affect the quality of the subsequent plastic sealing body. The residual position is usually in the corner of the groove runner, so the residual plastic sealing material in the corner is currently scraped off with sheet-like objects. However, this method is difficult to clean thoroughly and will make the operation cumbersome, time-consuming and labor-intensive. Summary of the Invention

[0011] To overcome the above-mentioned defects, an embodiment of the present disclosure provides a semiconductor device molding device, which solves the technical problem in the related art that during the cleaning process of the molding device after molding and blanking, sheet-like objects are used to clean the molding material remaining in the corners of the groove flow channel, resulting in cumbersome operation and easy to be not cleaned thoroughly.

[0012] According to one aspect, at least one embodiment of the present disclosure provides a semiconductor device plastic packaging device, comprising:

[0013] Upper and lower dies;

[0014] a forming plate, the forming plate being disposed between the upper mold and the lower mold, the forming plate having a forming hole and a flow channel hole, the upper mold and the lower mold being used to seal the top and bottom of the forming hole to form a forming space for forming the product to be plastic-sealed, the flow channel hole being connected to the forming space;

[0015] A flow channel plate, the flow channel plate is arranged in a lifting manner in the flow channel hole, and is used to guide the molten plastic sealing material from the flow channel hole to the molding space;

[0016] A pusher is movably arranged on the upper mold or the lower mold, and the pusher is configured to push the flow channel plate upward after moving so that the top surface of the flow channel plate is coplanar with the top surface of the forming plate.

[0017] For example, in a semiconductor device molding device provided by at least one embodiment of the present disclosure, the lower mold has a diverter protrusion, the runner plate has a avoidance hole, the diverter protrusion passes through the avoidance hole, and the diverter protrusion is used to divert the molten molding material on the runner plate to the molding space.

[0018] For example, in a semiconductor device molding device provided by at least one embodiment of the present disclosure, there are multiple diverter protrusions and multiple avoidance holes, and the multiple diverter protrusions pass through the multiple avoidance holes in a one-to-one correspondence, and the multiple diverter protrusions are configured to be arranged at intervals along the length direction of the product to be molded.

[0019] For example, in a semiconductor device molding device provided by at least one embodiment of the present disclosure, the flow channel plate also has a material receiving position for receiving solid molding material, and a plurality of diverter protrusions are arranged around the material receiving position, and the plurality of diverter protrusions and the hole walls of the flow channel holes are used to abut against the outer wall of the solid molding material to limit the position of the solid molding material.

[0020] For example, in a semiconductor device plastic packaging device provided by at least one embodiment of the present disclosure, the upper mold has a vertical feeding channel, and the semiconductor device plastic packaging device further includes:

[0021] A piston member is arranged in the feeding channel for lifting, and the piston member is configured to squeeze the solid plastic packaging material at the receiving position after descending.

[0022] For example, in a semiconductor device molding device provided by at least one embodiment of the present disclosure, there are two pushers, and the two pushers are symmetrically arranged on both sides of the flow channel plate. Each of the pushers is arranged on the lower mold along the horizontal movement, and each of the pushers has a pushing inclined surface, and the pushing inclined surface is configured to push the flow channel plate up after following the movement of the pusher.

[0023] For example, in at least one embodiment of the present disclosure, a semiconductor device plastic packaging device is provided, wherein the semiconductor device plastic packaging device further includes:

[0024] The stripping lift piece is lifted and arranged on the lower mold and is located below the molding space. The stripping lift piece is frame-shaped, and the cross-sectional area of the stripping lift piece is configured to be smaller than the cross-sectional area of the product to be plastic-sealed. The stripping lift piece is configured to lift the product to be plastic-sealed after rising.

[0025] For example, in at least one embodiment of the present disclosure, a semiconductor device plastic packaging device is provided, wherein the semiconductor device plastic packaging device further includes:

[0026] an upper shell and a lower shell, wherein the upper shell is arranged to be lifted relative to the lower shell, and the upper shell is configured to abut against the lower shell after being lowered to form a closed cavity, and the upper mold and the lower mold are both arranged in the closed cavity;

[0027] A protective gas tank is connected to the closed cavity and is used to transport protective gas to the closed cavity.

[0028] For example, in a semiconductor device molding device provided by at least one embodiment of the present disclosure, the upper mold and the lower mold both have heating channels that are connected in sequence, and the semiconductor device molding device further includes:

[0029] a limiting portion, the limiting portion being arranged on the top of the inner wall of the heating channel of the upper mold;

[0030] a heating rod, wherein the heating rod is slidably disposed in the heating channel, and one end of the heating rod is disposed on the top wall of the upper shell;

[0031] A limit block is provided at the bottom of the heating rod, and the limit block is configured to follow the rising heating rod to lift the limit portion so that the upper mold is away from the lower mold.

[0032] For example, in at least one embodiment of the present disclosure, a semiconductor device plastic packaging device is provided, wherein the semiconductor device plastic packaging device further includes:

[0033] A heating element and a temperature sensor are provided in both the upper mold and the lower mold.

[0034] The beneficial effects of the embodiments of the present disclosure are:

[0035] 1. Effectively clean residual plastic sealing material: In the plastic sealing device suitable for the production of continuous plastic sealing bodies, in order to avoid the difficulty in cleaning the plastic sealing material in the corners of the groove flow channel, this device is provided with a liftable flow channel plate and a movable pusher. After the plastic sealing is completed, the pusher moves to push the flow channel plate up so that the top surface of the flow channel plate is coplanar with the top surface of the molding plate. In this way, the plastic sealing material originally remaining in the corner will be exposed on a relatively flat surface and can be directly scraped off. Compared with the traditional method of scraping the corners, it is more convenient to clean and easier to clean thoroughly. It does not affect the normal flow of the molten plastic sealing material into the cavity along the flow channel plate, and is synchronously and evenly wrapped from the side of the continuous plastic sealing product to be plastic sealed, avoiding the situation where the bonding wire is damaged by the molten plastic sealing material fluid due to flowing into the cavity from only a single small flow port, which meets the production requirements of continuous plastic sealing bodies.

[0036] 2. Simplified structure: The working process of this device is relatively simple. After normal plastic packaging and demolding, the cleaning of residual plastic packaging material can be completed by simply cooperating with the pusher and the runner plate, reducing the complexity and time cost of manual operation. The structure of this device does not require complex and expensive large-scale automated equipment mold structure, which effectively reduces the production cost for small-batch production of special models of continuous plastic packaging bodies. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] To more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following briefly describes the drawings required for use in describing the embodiments of the present disclosure. Obviously, the drawings described below are merely some exemplary embodiments of the present disclosure. Those skilled in the art can, without inventive effort, derive other drawings based on the content of the exemplary embodiments of the present disclosure and these drawings.

[0038] Figure 1This is an exploded view of a semiconductor device plastic packaging device according to an embodiment of the present disclosure;

[0039] Figure 2 for Figure 1 The lower mold and the forming plate match the embodiment;

[0040] Figure 3 for Figure 1 Exploded view of the lower die and the forming plate in the embodiment;

[0041] Figure 4 for Figure 1 FIG. 1 is a diagram showing a flow channel plate rising state in an embodiment of the present invention;

[0042] Figure 5 for Figure 1 The forming plate and the runner plate in the embodiment of the invention are matched;

[0043] Figure 6 for Figure 1 A schematic structural diagram of the flow channel plate in an embodiment of the present invention;

[0044] Figure 7 for Figure 1 A schematic structural diagram of a forming plate in an embodiment of the present invention;

[0045] Figure 8 for Figure 1 A schematic structural diagram of a piston member in an embodiment of the present invention;

[0046] Figure 9 for Figure 1 The upper shell and the lower shell match the embodiment of the diagram;

[0047] Figure 10 for Figure 1 A schematic structural diagram of the lower housing in an embodiment of the present invention;

[0048] Figure 11 This is a schematic structural diagram of a heating rod in another embodiment of the present disclosure;

[0049] Figure 12 for Figure 11 FIG. 1 is a diagram showing a heating rod rising state in an embodiment of the present invention;

[0050] Figure 13 for Figure 10 Enlarged view of middle part B;

[0051] Figure 14 for Figure 11 A schematic structural diagram of a stripping top member in an embodiment of the present invention;

[0052] Figure 15 for Figure 5 Enlarged view of part A in the middle.

[0053] In the figure: 1. Product to be plastic-sealed, 2. Solid plastic-sealing material, 3. Upper mold, 301. Feeding channel, 302. Heating channel, 4. Lower mold, 401. Diverter protrusion, 5. Molding plate, 501. Molding hole, 502. Flow channel hole, 6. Molding space, 7. Flow channel plate, 701. Avoidance hole, 702. Material receiving position, 8. Pusher, 801. Pushing slope, 9. Piston, 10. Upper shell, 11. Lower shell, 12. Sealed cavity, 13. Protective gas tank, 14. Limiting part, 15. Heating rod, 16. Limiting block, 17. Heating element, 18. Temperature sensor, 19. Stripping top piece, 20. Avoidance groove, 21. Positioning protrusion, 22. Pusher, 23. Slant, 24. Controller, 25. Wiring hole. DETAILED DESCRIPTION

[0054] The present disclosure will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present disclosure, rather than to limit the present disclosure.

[0055] To simplify the drawings, only the parts relevant to the disclosure are schematically shown in each figure; they do not represent the actual structure of the product. Furthermore, to simplify the drawings and facilitate understanding, in some figures, only one of the components with the same structure or function is schematically shown or labeled. In this document, "one" not only means "only one" but also "more than one," and "several" includes "two" and "more than two."

[0056] It should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this disclosure based on the specific circumstances.

[0057] In the present disclosure, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0058] In the description of this embodiment, the terms "up", "down", "left", "right", etc., and the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present disclosure.

[0059] In addition, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0060] like Figures 1 to 4 As shown, it shows a semiconductor device molding device in an embodiment of the present disclosure, including: an upper mold 3 and a lower mold 4; a molding plate 5 is arranged between the upper mold 3 and the lower mold 4, the molding plate 5 has a molding hole 501 and a flow channel hole 502, the upper mold 3 and the lower mold 4 are used to seal the top and bottom of the molding hole 501 to form a molding space 6 for molding the product 1 to be molded, and the flow channel hole 502 is connected to the molding space 6; the flow channel plate 7 is arranged in the flow channel hole 502 for guiding the molten molding material from the flow channel hole 502 to the molding space 6; the pusher 8 is movably arranged on the upper mold 3 or the lower mold 4, and the pusher 8 is configured to push the flow channel plate 7 up after moving, so that the top surface of the flow channel plate 7 is coplanar with the top surface of the molding plate 5.

[0061] By using the liftable flow channel plate 7 and the movable pusher 8, the residual plastic sealing material in the groove flow channel of the flow channel plate 7 is transferred to the flat surface, making the cleaning action more convenient and efficient. The entire plane can be directly scraped off with a sheet, and there is no need to scrape off the residual plastic sealing material in the corners bit by bit. In addition, the molding structure (flow channel plate 7, etc.) for the continuous plastic sealing body is not changed. The guiding function of the flow channel plate 7 can still be used to achieve uniform wrapping of the molten plastic sealing material on the product to be plastic sealed, thereby avoiding damage to the bonding wire.

[0062] Working process:

[0063] First, the mold is opened and the material is loaded: the upper mold 3 is connected to a driving device such as a press to provide vertical downward pressure, so that the upper mold 3 can be accurately lowered to fit the lower mold 4 to complete the mold closing action, and the upper mold 3 can be pulled up and reset after the plastic sealing is completed; after lifting the upper mold 3, the corresponding molding plate 5 of the continuous plastic sealing body model is installed on the lower mold 4, and the product 1 to be plastic sealed is placed in the molding hole 501, and then the solid plastic sealing material 2 is placed in the barrel of the upper mold 3. At this time, the pusher 8 is in the initial position on the lower mold 4 and does not push the runner plate 7.

[0064] Mold closing and plastic sealing: The upper mold 3 is driven by an external force (usually powered by a driving device such as a press) to descend vertically and fit tightly with the lower mold 4. During this process, the upper mold 3 and the lower mold 4 are respectively blocked on the top plane and the bottom plane of the molding hole 501, thereby forming a molding space 6 for molding the product 1 to be plastic-sealed; then the heating device such as the spiral electric heating element 17 that cooperates with the barrel of the upper mold 3 is energized to heat the plastic sealing material in the barrel, so that it melts into molten plastic sealing material, and flows to the flow channel plate 7 under the action of its own gravity. At this time, the top surface of the static flow channel plate 7 is not coplanar with the top surface of the molding plate 5, forming a groove for the molten plastic sealing material to flow along the groove to the molding space 6, and synchronously and evenly wrap the row-shaped product 1 to be plastic-sealed. Finally, after cooling for a certain period of time, the molten plastic sealing material cools and solidifies in the molding space 6, fully wrapping the product 1 to be plastic-sealed, completing the molding of the row-shaped plastic sealing body.

[0065] Demolding and cleaning: The upper mold 3 rises and resets under the action of external force, exposing the row-shaped plastic packaging body between the forming plate 5 and the lower mold 4, which is taken out manually or sucked out using a suction cup; then the pusher 8 starts to move, pushing the flow channel plate 7 up until the top surface of the flow channel plate 7 is coplanar with the top surface of the forming plate 5, exposing the plastic packaging material remaining in the corner to a relatively flat surface. Finally, the sheet is scraped off the plane manually or by a robotic arm configured with a suction cup to complete the cleaning action.

[0066] Specifically, the pushing structure of the push piece 8 can be in the form of a nut screw or cylinder drive, and is arranged at a position directly below the runner plate 7 on the lower mold 4, and can be achieved by directly moving and lifting the runner plate 7. However, in actual arrangement, it is found that arranging such a power source structure in the lower mold 4 will still lead to a complex structure and a large volume, which is difficult to arrange inside and may even affect the strength of the lower mold 4; therefore, the push piece 8 can also adopt the inclined surface of the wedge block, utilize the guiding effect, convert the horizontal movement into the lifting movement, and additionally arrange a resettable spring.

[0067] What is more worth considering is that Figures 5 to 7 As shown, if the push piece 8 is arranged on the top surface of the lower mold 4 in a horizontally movable manner, an avoidance groove 20 needs to be opened at the corresponding position on the bottom surface of the forming plate 5 to avoid the position of the push piece 8. While ensuring that the forming plate 5 is stably installed on the lower mold 4, the push piece 8 can also move in the avoidance groove 20. Since the avoidance groove 20 is connected to the flow channel hole 502, it can contact the flow channel plate 7 and push it up.

[0068] like Figures 1 to 7 As shown, in some examples, the lower mold 4 has a diverter protrusion 401, the runner plate 7 has an avoidance hole 701, the diverter protrusion 401 passes through the avoidance hole 701, and the diverter protrusion 401 is used to divert the molten plastic packaging material on the runner plate 7 to the molding space 6.

[0069] Due to the special structure of the product 1 to be plastic-sealed in the continuous plastic-sealed body, in order to further improve the uniformity of synchronous and comprehensive wrapping from one side, the form of the wider groove flow channel directly flowing into the molding space 6 is changed to a form in which several groups of diversion ports are evenly arranged from one side to flow into the molding space 6. This can effectively avoid the situation in which excessive plastic-sealing material accumulates in some areas and insufficient filling in some areas, thereby improving the uniformity of the material distribution.

[0070] Moreover, for delicate components such as bonding wires on the continuous-row plastic-encapsulated product 1, the form in which several groups of diversion ports flow into the molding space 6 can achieve a more uniform flow of the plastic encapsulating material, and can reduce the risk of damage to the bonding wires due to excessive impact force of the local plastic encapsulating material fluid, thereby avoiding the problem of direct impact on the bonding wires in the traditional way.

[0071] Therefore, in order to realize several groups of diversion ports, additional diversion protrusions 401 are provided on the lower mold 4 to provide stable support for the diversion protrusions 401 instead of being suspended on other components. In order to ensure the smooth progress of the molding process and avoid interference between the runner plate 7 and the diversion protrusions 401, and to play a diversion role at the same time, avoidance holes 701 that are adapted to the shape of the diversion protrusions 401 and correspond one to one are provided on the runner plate 7. After the molding plate 5 is installed on the lower mold 4, the diversion protrusions 401 just pass through the avoidance holes 701, and the top surface is coplanar with the top surface of the molding plate 5, so that after the runner plate 7 rises, its top surface is coplanar with the top surface of the molding plate 5. Preferably, the top surface of the diversion protrusions 401 should be coplanar with the top surface of the molding plate 5, so as to jointly form a relatively flat surface that is convenient for cleaning residual plastic sealing material. When the diversion protrusions 401 work, they directly divert the molten plastic sealing material on the runner plate 7 into several streams into the molding space 6.

[0072] like Figures 1 to 6 As shown, in some examples, there are multiple diverter protrusions 401 and avoidance holes 701, and the multiple diverter protrusions 401 correspond one to one to pass through the multiple avoidance holes 701, and the multiple diverter protrusions 401 are configured to be arranged at intervals along the length direction of the product 1 to be plastic-sealed.

[0073] Since the product 1 to be plastic-sealed in the row-shaped plastic-sealed body is in the shape of an elongated strip and has a certain length, and a number of diversion protrusions 401 and corresponding avoidance holes 701 are arranged at intervals along its length direction, the molten plastic-sealing material can be reasonably diverted over the entire length range according to the elongated structural characteristics of the product. If only a single one is set, uneven distribution may occur in the distal area. The above improvement can effectively avoid this problem and ensure that the entire row of products to be plastic-sealed 1 can be evenly plastic-sealed.

[0074] In simple terms, the spaced-apart diversion protrusions 401 act like a plurality of small “diversion stations” to disperse the molten plastic material. Compared with the diversion method of concentrating the molten plastic material in one place, the distribution uniformity of the plastic material in the molding space 6 can be significantly improved.

[0075] Moreover, the increase in quantity will enable the plastic encapsulation material to approach and wrap delicate components such as bonding wires in a more gentle and uniform manner during the flow process, thereby ensuring product quality.

[0076] In addition, it is worth considering that Figure 15 As shown, the forming hole 501 of the forming plate 5 is absolutely impossible to have exactly the same size specifications as the product 1 to be plastic-sealed. Some gaps will remain, and the plastic-sealing operation itself is a step requiring high precision. If the gap difference is large, it may affect the product quality. Therefore, it is necessary to add a positioning structure. The positioning structure currently used is usually completed by other equipment, with a complex structure and relatively complex operation. In order to avoid the above situation, the bottom plate is used to quickly complete the positioning. Therefore, the inner wall of the forming hole 501 and the side wall of the flow channel plate 7 are integrally formed or welded with positioning protrusions 21, and then the overall position of the product 1 to be plastic-sealed can be quickly fixed from all sides of the bottom plate, thereby meeting the position accuracy requirements.

[0077] like Figures 1 to 8 As shown, in some examples, the flow channel plate 7 also has a material receiving position 702 for receiving the solid plastic encapsulation material 2, and a plurality of diverter protrusions 401 are arranged around the material receiving position 702, and the hole walls of the plurality of diverter protrusions 401 and the flow channel hole 502 are used to abut the outer wall of the solid plastic encapsulation material 2 to limit the position of the solid plastic encapsulation material 2.

[0078] A material receiving position 702 is provided on the runner plate 7, which is connected to the barrel of the upper mold 3. The solid plastic encapsulating material 2 received can be directly guided by the runner plate 7 after melting, so as to avoid the two being disconnected. It is also necessary to arrange additional components to control the opening and closing of the connecting port. In addition, in order to ensure that the solid plastic encapsulating material 2 is stably positioned at the material receiving position 702, a plurality of diverter protrusions 401 are arranged around the material receiving position 702 at intervals along the length direction of the product 1 to be encapsulated. The solid plastic encapsulating material 2 on the material receiving position 702 can just abut the side wall of the diverter protrusion 401 and the inner wall of the runner hole 502, and the fitting surface is generally arc-shaped, so that the position of the solid plastic encapsulating material 2 can be limited from all sides, and after it becomes a molten plastic encapsulating material under the action of the heating device of the upper mold 3, it flows directly along the diverter channel between each diverter protrusion 401, or between the diverter protrusion 401 and the inner wall of the runner hole 502 to the molding space 6.

[0079] Specifically, such as Figure 4 、 6 As shown, the material receiving position 702 can be set in the middle position of several diversion protrusions 401 arranged at intervals along the length direction of the product 1 to be plastic-sealed, so as to ensure more uniform diversion. The shape of the overall flow channel plate 7 should be adapted to the flow channel hole 502. The material receiving position 702 can similarly be a circular plane, and some anti-slip textures can be designed on it as needed to increase friction with the bottom of the solid plastic sealing material 2 to prevent it from sliding in the material receiving position 702.

[0080] like Figures 8 to 10 As shown, in some examples, the upper mold 3 has a vertical feeding channel 301, and a semiconductor device molding device further includes: a piston member 9 is raised and lowered in the feeding channel 301, and the piston member 9 is configured to squeeze the solid molding material 2 at the receiving position 702 after descending.

[0081] The piston member 9 is designed to actively descend in the feeding channel 301 (barrel), abut against the solid plastic packaging material 2 on the receiving position 702 and extrude it. During the entire extrusion process, the piston member 9 is in close contact with the molten plastic packaging material, and the gas on the surface of the product is discharged from the mold, thereby improving product quality.

[0082] Specifically, the upper mold 3 provides space for the installation and movement of the piston member 9. The size and shape of the feeding channel 301 must be precisely adapted to the cylindrical piston member 9 to ensure that the piston member 9 can be smoothly raised and lowered therein. At the same time, the sealing of the channel must be ensured. The vertical feeding channel 301 is located directly above the material receiving position 702 to ensure that the extrusion effect works normally; and the driving device is the power source for the movement of the piston member 9.

[0083] In addition, after the plastic packaging is completed, the piston member 9 is controlled to rise and the feeding channel 301 can be pulled out, and the solid plastic packaging material 2 can be directly put into the receiving position 702 from the feeding channel 301, or the solid plastic packaging material 2 can be directly placed on the receiving position 702 after demolding.

[0084] like Figures 1 to 4 As shown, in some examples, there are two pushers 8, and the two pushers 8 are symmetrically arranged on both sides of the flow channel plate 7. Each pusher 8 is arranged on the lower mold 4 along the horizontal movement, and each pusher 8 has a pushing inclined surface 801. The pushing inclined surface 801 is configured to push the flow channel plate 7 up after following the movement of the pusher 8.

[0085] The two pushers 8 are symmetrically arranged on both sides of the flow channel plate 7. When pushing the flow channel plate 7 to rise, balanced thrust can be provided from both sides, so that the flow channel plate 7 can rise stably. Compared with the push by a single pusher 8, it can effectively prevent the flow channel plate 7 from tilting, getting stuck or even getting stuck due to uneven force during the rising process.

[0086] Specifically, such as Figure 3 As shown, the push piece 8 may have a push inclined surface 801 on one side close to the flow channel plate 7 and on all sides, and the push inclined surface 801 on the side close to the flow channel plate 7 is preferably adapted to the shape of the flow channel plate 7. In addition, the reciprocating movement of the push piece 8 can be completed by the spring built into the lower mold 4, that is, the external force squeezes the two push pieces 8 close to the lifting flow channel plate 7, and then the two push pieces 8 are moved away from each other under the action of the spring.

[0087] like Figure 14As shown, in some examples, a semiconductor device molding device further includes: a stripping top piece 19 is lifted and lowered on the lower mold 4 and is located below the molding space 6. The stripping top piece 19 is frame-shaped, and the cross-sectional area of the stripping top piece 19 is configured to be smaller than the cross-sectional area of the product to be molded 1. The stripping top piece 19 is configured to lift the product to be molded 1 after rising.

[0088] In order to improve the efficiency of demoulding, a demoulding top piece is set on the lower mold 4 for lifting and lowering. After rising, the formed plastic-sealed body can be ejected. In particular, its frame-shaped design with a cross-sectional area smaller than the product to be plastic-sealed can act evenly on the bottom periphery of the product, avoiding damage to the product due to local uneven force, stabilizing the demoulding, and avoiding damage to sensitive and easily damaged parts such as the bonding wires around it.

[0089] The specific lifting structure is the same as that of the push piece 8, which avoids the structural complexity and other problems caused by the power source. There are push blocks 22 on both sides of the stripping top piece 19 that can move horizontally. The push blocks 22 have inclined surfaces 23 close to the side of the stripping top piece 19 and the bottom of the stripping top piece 19. An additional spring is also arranged to connect the push blocks 22 and the lower mold 4. After the external force squeezes the two push blocks 22 together, the inclined surface 23 is used to lift the stripping top piece 19, and then the two push blocks 22 are moved away from each other under the action of the spring, and the stripping top piece 19 then drops synchronously.

[0090] like Figures 8 to 10 As shown, in some examples, a semiconductor device molding device further includes: an upper shell 10 is arranged to be raised and lowered relative to a lower shell 11, and the upper shell 10 is configured to abut the lower shell 11 after being lowered to form a closed cavity 12, and the upper mold 3 and the lower mold 4 are both arranged in the closed cavity 12; a protective gas tank 13 is connected to the closed cavity 12 and is used to deliver protective gas to the closed cavity 12.

[0091] Plastic sealing under a protective gas atmosphere can effectively reduce the generation of bubbles in the plastic sealing material and avoid affecting the processing quality of the product. Therefore, before plastic sealing, the upper shell 10 and the lower shell 11 are first merged, the other opening of the closed cavity 12 is opened, and a protective gas (such as nitrogen) is filled into it. When the nitrogen fills the closed cavity 12, the opening and the pipeline valve of the protective gas tank 13 are sealed, and then the plastic sealing body is heated and extruded, thereby enhancing the reliability and stability of the product.

[0092] Specifically, the hydraulic components can be used to achieve precise control of the lifting motion of the upper housing 10, and can be combined with the driving device of the piston 9, such as Figure 9 、 10As shown, the lower shell 11 is installed on the workbench, the upper shell 10 is lifted and lowered on the workbench by hydraulic parts, and the piston part 9 is lifted and lowered by small hydraulic parts and is set on the connecting frame of the upper shell 10, and the upper mold 3 and the lower mold 4 can be combined by manually fixing bolts and locking, or the upper mold 3 and the upper shell 10 can be connected by bolts to achieve automatic mold closing, or the upper mold 3 can be further lifted and lowered by small hydraulic parts and is set on the connecting frame of the upper shell 10. It can be designed according to actual production conditions.

[0093] In addition, in the closed cavity 12, the temperature increase will cause the internal nitrogen to expand. In order to prevent the shell from being damaged due to the thermal expansion of the nitrogen, a buffer hole and a pressure relief hole connected to the outside world can be opened on the side wall of the lower shell 11. The area of the buffer hole should be larger than the area of the pressure relief hole, and several small pressure relief holes are arranged around the buffer hole.

[0094] The function of the pressure relief hole is that when the shell cavity is filled with nitrogen, the excess volume of nitrogen after expansion will be discharged from the pressure relief valve arranged in the pressure relief hole to balance the air pressure; if the gas expands too quickly, so that the excess volume of gas is not discharged from the pressure relief hole in time, the buffer hole will begin to play a role. Since there is a buffer pad made of elastic and high-temperature resistant material embedded in it, the excess volume of gas will squeeze the buffer pad toward the outside of the shell, and the buffer pad will bulge outward like a balloon, preventing the shell from being squeezed and damaged, increasing protective measures, and improving the service life of the equipment.

[0095] like Figure 11-12 As shown, in some examples, the upper mold 3 and the lower mold 4 both have heating channels 302 connected in sequence, and a semiconductor device molding device also includes: a limit portion 14 is arranged on the top of the inner wall of the heating channel 302 of the upper mold 3; the heating rod 15 is slidably arranged in the heating channel 302, and one end of the heating rod 15 is arranged on the inner top wall of the upper shell 10; the limit block 16 is arranged at the bottom of the heating rod 15, and the limit block 16 is configured to follow the rising heating rod 15 to lift the limit portion 14 to keep the upper mold 3 away from the lower mold 4.

[0096] The heating device is designed to have a heating channel 302 that can pass through the upper mold 3 and the lower mold 4, and is connected to the lifting upper shell 10, thereby improving the cooling and curing process. Instead of directly adding a fan in the traditional way, the rising upper shell 10 drives the heating rod 15 to be basically separated from the upper and lower molds 4, avoiding the heating rod 15 from cooling and curing in the upper and lower molds 4, which makes it difficult to disperse heat, thereby improving the cooling and curing effect.

[0097] And with the support of the limiting part 14 and the limiting block 16, the upper shell 10 continues to rise. When the heating rod 15 is about to separate from the upper and lower molds 4, the limiting block 16 abuts against the limiting part 14, and the limiting part 14 can be lifted to lift the upper mold 3 and complete the automatic separation from the lower mold 4, and an additional power source structure is eliminated.

[0098] During specific operation, the heating rod 15 is located at the bottom of the heating channel 302 of the lower mold 4, and the upper mold 3 and the lower mold 4 are in a closed state. At this time, the heating rod 15 is heated by the controller to heat the upper and lower molds 4 to melt the solid plastic sealing material 2; after cooling and solidification, the heating rod 15 has already turned off the heating state and begins to slide upward with the upper shell 10 until the limit block 16 at the bottom contacts the limit part 14. The heating rod 15 is basically separated from the upper mold 3 and the lower mold 4, stops rising, and quickly completes the natural cooling and solidification process, or a small fan is added to enhance the cooling effect; finally, it continues to rise, and under the lifting action of the limit block 16, the upper mold 3 and the lower mold 4 are separated, and demolding is convenient.

[0099] The heating channel 302 is vertical, and the axial direction of the heating channel 302 is colinear with the axial direction of the heating rod 15. The limiting portion 14 and the limiting block 16 are both annular. The diameter of the heating rod 15 is equal to the inner diameter of the limiting portion 14, and the outer diameter of the limiting block 16 is not larger than the outer diameter of the limiting portion 14, so as to ensure that the above-mentioned action is completed stably and facilitate early processing.

[0100] like Figure 8 、 Figure 13 As shown, in some examples, a semiconductor device molding device further includes: a heating element 17 and a temperature sensor 18 are provided in both the upper mold 3 and the lower mold 4 .

[0101] In addition to the above-mentioned structural form of the heating rod 15, a fixed heating element 17 can also be respectively arranged in the upper mold 3 and the lower mold 4, and a corresponding temperature sensor 18 (in the form of a thermocouple, etc.) can be built in. The controller 24 can be used to accurately and independently control the temperature of the upper mold 3 and the lower mold 4, thereby improving the flexibility of temperature control. The controller 24 is electrically connected to the heating rod 15, and the wires of the temperature sensor 18 can be connected to the outside through the wiring hole 25 of the lower shell 11.

[0102] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure and are not limiting. Although the present disclosure has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present disclosure may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present disclosure, and all of these should be included in the scope of the claims of the present disclosure.

Claims

1. A semiconductor device plastic packaging device, characterized in that: include: an upper die (3) and a lower die (4); a molding plate (5), the molding plate (5) being arranged between the upper mold (3) and the lower mold (4), the molding plate (5) having a molding hole (501) and a flow channel hole (502), the upper mold (3) and the lower mold (4) being used to seal the top and bottom of the molding hole (501) to form a molding space (6) for molding the product (1) to be plastic-sealed, the flow channel hole (502) being connected to the molding space (6); A flow channel plate (7), the flow channel plate (7) being arranged in a lifting manner in the flow channel hole (502) and used for guiding the molten plastic sealing material from the flow channel hole (502) to the molding space (6); A pusher (8), the pusher (8) being movably arranged on the upper mold (3) or the lower mold (4), the pusher (8) being configured to push the flow channel plate (7) upward after moving so that the top surface of the flow channel plate (7) is coplanar with the top surface of the molding plate (5); The lower mold (4) has a diversion protrusion (401), the runner plate (7) has a avoidance hole (701), the diversion protrusion (401) passes through the avoidance hole (701), and the diversion protrusion (401) is used to divert the molten plastic sealing material on the runner plate (7) to the molding space (6); There are two pushers (8), which are symmetrically arranged on both sides of the flow channel plate (7). Each pusher (8) is arranged on the lower mold (4) along the horizontal movement, and the pusher (8) has a pushing inclined surface (801). The pushing inclined surface (801) is configured to push the flow channel plate (7) upward after following the movement of the pusher (8).

2. The semiconductor device plastic packaging device according to claim 1, characterized in that: There are a plurality of the diverter protrusions (401) and the avoidance holes (701), and the plurality of the diverter protrusions (401) are passed through the plurality of the avoidance holes (701) in a one-to-one correspondence, and the plurality of the diverter protrusions (401) are configured to be spaced apart along the length direction of the product to be plastic-sealed (1).

3. The semiconductor device plastic packaging device according to claim 2, characterized in that: The flow channel plate (7) further comprises a receiving position (702) for receiving the solid plastic encapsulation material (2), and a plurality of diversion protrusions (401) are arranged around the receiving position (702), and the plurality of diversion protrusions (401) and the hole wall of the flow channel hole (502) are used to abut against the outer wall of the solid plastic encapsulation material (2) to limit the position of the solid plastic encapsulation material (2).

4. The semiconductor device plastic packaging device according to claim 3, characterized in that: The upper mold (3) has a vertical feeding channel (301), and the semiconductor device plastic packaging device further includes: A piston member (9) is provided in the feeding channel (301) for lifting, and the piston member (9) is configured to squeeze the solid plastic packaging material (2) at the receiving position (702) after descending.

5. The semiconductor device plastic packaging device according to claim 1, characterized in that: The semiconductor device plastic packaging device further includes: A stripping top piece (19) is arranged on the lower mold (4) and is located below the molding space (6). The stripping top piece (19) is frame-shaped, and the cross-sectional area of the stripping top piece (19) is configured to be smaller than the cross-sectional area of the product to be plastic-sealed (1). The stripping top piece (19) is configured to lift the product to be plastic-sealed (1) after rising.

6. A semiconductor device plastic packaging device according to any one of claims 1 to 5, characterized in that: The semiconductor device plastic packaging device further includes: an upper shell (10) and a lower shell (11), wherein the upper shell (10) is arranged to be lifted relative to the lower shell (11), and the upper shell (10) is configured to abut against the lower shell (11) after being lowered to form a closed cavity (12), and the upper mold (3) and the lower mold (4) are both arranged in the closed cavity (12); A protective gas tank (13), the protective gas tank (13) is connected to the closed cavity (12) and is used to deliver protective gas to the closed cavity (12).

7. The semiconductor device plastic packaging device according to claim 6, characterized in that: The upper mold (3) and the lower mold (4) both have heating channels (302) that are connected in sequence. The semiconductor device plastic packaging device further includes: a limiting portion (14), the limiting portion (14) being arranged on the top of the inner wall of the heating channel (302) of the upper mold (3); A heating rod (15), wherein the heating rod (15) is slidably disposed in the heating channel (302), and one end of the heating rod (15) is disposed on the inner top wall of the upper shell (10); A limit block (16) is provided at the bottom of the heating rod (15), and the limit block (16) is configured to follow the rising heating rod (15) to lift the limit portion (14) so as to move the upper mold (3) away from the lower mold (4).

8. The semiconductor device plastic packaging device according to claim 7, characterized in that: The semiconductor device plastic packaging device further includes: A heating element (17) and a temperature sensor (18) are provided in the upper mold (3) and the lower mold (4).

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