Inkjet wafer structure

Abstract

In order to improve the printing performance in the known ink-jet printing technology, the invention provides an ink-jet wafer structure which comprises a wafer substrate, a thermal barrier layer, a heating resistance layer, a conductive layer, a protective layer, a barrier layer and a spray orifice sheet which are sequentially stacked to form a stacked framework. Wherein an ink chamber is arranged between the protective layer and the barrier layer. The ink jet wafer structure further comprises a plurality of jet holes which are formed in the top end of the ink cavity. Wherein the spray holes are selected from a spray hole double-row parallel structure, a spray hole double-row staggered structure or a spray hole single-row structure on the surface of the ink-jet wafer structure.

Description

Technical Field

[0001] The present invention relates to an inkjet chip structure, and more particularly, to an inkjet chip structure which improves the existing printing quality by optimizing the nozzle arrangement thereon. Background Art

[0002] Inkjet printing technology, commonly known as "Inkjet Printing", is a widely used printing technology. Its history can be traced back to the 1950s when the British company Hewlett-Packard invented inkjet printing technology. Since then, inkjet printing technology has developed rapidly, making inkjet printers the mainstream technology for home and commercial printing. Inkjet printers have many advantages, including: low cost, especially economic advantages for home and small business use; high printing quality, which can provide high-resolution and high-quality images, especially in photos or pictures; convenient to use, inkjet printers are easy to install, and most inkjet printers can print through computers or mobile devices. When combined with the recent rise of multi-in-one functions (including fax, photocopying, scanning) of business machines, it can quickly expand the flexibility of paperwork in the office.

[0003] See also Figure 1 , which describes the matching and control method between the ink cartridge 10 and the printer in the prior art. Figure 1 In the figure, it can be seen that the ink cartridge 10 includes a flexible circuit board 100, on which an inkjet chip 100A is provided, on which an ink supply hole and several circuit board contacts corresponding to the inkjet chip 100A and used to transmit printer control signals are provided. The inkjet chip 100A stores information such as the ink cartridge serial number, ink type, and matching information between the inkjet head and the printer, and simultaneously controls the ejection of ink droplets for printing.

[0004] However, as mentioned above, although the current inkjet printing technology can meet various output needs in schools, office documents, 3D printing, and industry, the current consumer market has increasingly stringent requirements for various printing performances in inkjet printing, such as color, resolution, printing range, and printing speed. The general industry still continues to pursue the above-mentioned inkjet printing performance to maintain the competitiveness of industrial utilization. Therefore, based on the current market situation, it is still urgent to continuously improve and optimize the performance such as printing speed and printing range. In view of this, the above-mentioned demand has become a topic that needs to be explored in the present invention. Summary of the invention

[0005] The main purpose of the present invention is to provide an inkjet chip structure, which improves the printing performance of the aforementioned color, resolution, printing range, and printing speed by optimizing the arrangement of the nozzles in the inkjet chip structure. The detailed technical solution will be described below.

[0006] One of the broad implementations of the present invention is to provide an inkjet chip structure, comprising: a chip substrate, a thermal barrier layer, a heating resistor layer, a conductive layer, a protective layer, a barrier layer, and a nozzle plate stacked in sequence to form a stacked structure, wherein an ink chamber is provided between the protective layer and the barrier layer; a plurality of nozzles are formed at the top of the ink chamber; wherein the plurality of nozzles form a nozzle double-row parallel structure on the surface of the inkjet chip structure; wherein, according to an embodiment of the present invention, in the nozzle double-row parallel structure, a vertical distance between two longitudinally adjacent nozzles in a single row is 80 μm-90 μm.

[0007] According to an embodiment of the present invention, in the double-row parallel structure of the nozzle holes, the lateral distance (width) of the ink supply holes is greater than 80 μm.

[0008] According to an embodiment of the present invention, in the double-row parallel structure of the nozzle holes, the distance between the nozzle holes in the longitudinal direction is between 23900 μm and 27000 μm.

[0009] According to an embodiment of the present invention, in the double-row parallel structure of the spray holes, the plurality of spray holes are arranged vertically, and the number of spray holes in a single row is more than 300, that is, in the double-row parallel structure of the spray holes, the number of spray holes in the double row is more than 600.

[0010] Another broad implementation of the present invention is to provide an inkjet chip structure, comprising: a chip substrate, a thermal barrier layer, a heating resistor layer, a conductive layer, a protective layer, a barrier layer, and a nozzle plate stacked in sequence to form a stacked structure, wherein an ink chamber is provided between the protective layer and the barrier layer; a plurality of nozzles are formed at the top of the ink chamber; wherein the plurality of nozzles form a double-row staggered structure of nozzles on the surface of the inkjet chip structure; wherein, according to an embodiment of the present invention, in the double-row staggered structure, a vertical distance between two laterally staggered adjacent nozzles is 40 μm-45 μm.

[0011] According to an embodiment of the present invention, in the double-row staggered structure, the lateral distance (width) of the ink supply holes is greater than 80 μm.

[0012] According to an embodiment of the present invention, in the double-row staggered structure, the distance between the plurality of nozzle holes arranged in the longitudinal direction is between 23900 μm and 27000 μm.

[0013] According to an embodiment of the present invention, in the double-row staggered structure, the plurality of nozzle holes are arranged longitudinally, and the number of nozzle holes in a single row is more than 300, that is, in the double-row staggered structure, the number of nozzle holes in a double row is more than 600.

[0014] Another broad implementation of the present invention is to provide an inkjet chip structure, comprising: a chip substrate, a thermal barrier layer, a heating resistor layer, a conductive layer, a protective layer, a barrier layer, and a nozzle plate stacked in sequence to form a stacked structure, wherein an ink chamber is provided between the protective layer and the barrier layer; a plurality of nozzles are formed at the top of the ink chamber; wherein the plurality of nozzles form a single-row nozzle structure on the surface of the inkjet chip structure; wherein, according to an embodiment of the present invention, in the single-row nozzle structure, the vertical distance between two longitudinally adjacent nozzles in the single row is 40 μm-45 μm.

[0015] According to an embodiment of the present invention, in the single-row nozzle structure, the lateral distance (width) of the ink supply holes is greater than 80 μm.

[0016] According to an embodiment of the present invention, in the single-row nozzle structure, the distance between the nozzles in the longitudinal direction is between 23900 μm and 27000 μm.

[0017] According to an embodiment of the present invention, in the single-row structure of the spray holes, the number of the spray holes arranged in the longitudinal direction is more than 600. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The detailed description of the present invention and the schematic diagram of the embodiments described below should enable a more complete understanding of the present invention; however, it should be understood that this is only a reference for understanding the application of the present invention, rather than limiting the present invention to a specific embodiment.

[0019] Figure 1 Describes the configuration of the inkjet chip structure in a known ink cartridge.

[0020] Figure 2A The detailed structure of the inkjet wafer structure in one embodiment of the present invention is described.

[0021] Figure 2B The detailed structure of the inkjet wafer structure is further enlarged in one embodiment of the present invention.

[0022] Figure 2C The detailed structure of the inkjet wafer structure in another embodiment of the present invention is described.

[0023] Figure 2D The detailed structure of the inkjet wafer structure is further enlarged in another embodiment of the present invention.

[0024] Figure 2E The detailed structure of the inkjet wafer structure in another embodiment of the present invention is described.

[0025] Figure 2F The detailed structure of the inkjet chip structure is further enlarged in another embodiment of the present invention.

[0026] Figure 3 This is the stacked structure of the inkjet chip structure seen from a three-dimensional perspective.

[0027] Figure 4 To express Figure 3 The cross section in the figure illustrates the stacking form of the inkjet wafer structure viewed from the side.

[0028]

Explanation of symbols

[0029] 10: Ink cartridge

[0030] 100: Flexible circuit board

[0031] 100A: Inkjet chip

[0032] 200: Inkjet chip structure

[0033] 200A: ink supply hole

[0034] 210: Spray hole

[0035] 220: Ink chamber

[0036] 230: Spray hole

[0037] 240: Protective layer

[0038] 240A: First protective layer

[0039] 240B: Second protection layer

[0040] 240C: The third protective layer

[0041] 250: Conductive layer

[0042] 260: Heating resistor layer

[0043] 270: Thermal barrier layer

[0044] 280: Wafer substrate

[0045] 290: Barrier layer DETAILED DESCRIPTION

[0046] The present invention will be described in detail with preferred embodiments and viewpoints so that the reader can thoroughly understand the implementation of these embodiments. However, those skilled in the art in this field should understand that the present invention can also be implemented without these details. In addition, the present invention can also be used and implemented by other specific embodiments. The details described in this specification can also be applied based on different needs, and various modifications or changes can be made without deviating from the spirit of the present invention. Therefore, the present invention will be described with preferred embodiments and viewpoints. Such descriptions are to explain the structure of the present invention and are only used to illustrate rather than to limit the scope of the patent application of the present invention. The terms used in the following description will be interpreted in the broadest reasonable way so that they can be used together with the detailed description of a specific embodiment of the present invention. In addition, when the present invention describes a direction, such as longitudinal or transverse, unless otherwise defined in this specification, the relative direction of the longitudinal or transverse direction can be understood by describing the current and matching diagrams and contexts, so that those skilled in the art can adjust the structure of the present invention according to the manufacturing or application requirements to meet the needs of the actual industry, and thus it is described in advance.

[0047] See also Figure 2A , Figure 2B and Figure 3 In one embodiment of the present invention, in order to achieve the aforementioned purpose of improving the printing performance of the present invention, the present invention proposes an inkjet chip structure 200, including: a chip substrate 280, a thermal barrier layer 270, a heating resistor layer 260, a conductive layer 250, a protective layer 240, a barrier layer 290, and a nozzle plate 230 are stacked in sequence to form a stacked structure. The chip substrate 280 is used to carry the components of the inkjet chip structure 200, the heating resistor layer 260 is used to heat the ink, and the conductive layer 250 is used to supply the heating resistor layer 260 with the energy required to heat the ink. An ink chamber 220 is provided between the protective layer 240 and the barrier layer 290; a plurality of nozzles 210 are formed at the top of the ink chamber 220 and pass through the nozzle plate 230. When the heating resistor layer 260 is heated, bubbles are generated in the ink chamber 220, thereby squeezing the ink so that the ink is ejected from the nozzles 210; wherein the plurality of nozzles 210 form a structure on the surface of the inkjet chip structure 200 as shown in FIG. Figure 2B The nozzle double-row parallel structure shown in the figure, wherein the plurality of nozzles 210 form a nozzle double-row parallel structure on the surface of the inkjet wafer structure 200; wherein, according to an embodiment of the present invention, in the nozzle double-row parallel structure, the vertical distance between two longitudinally adjacent nozzles 210 in a single row is 80μm-90μm. It should also be noted that, according to one viewpoint of the present invention, and Figure 2BAs described in the description, since the nozzles 210 on the surface of the inkjet chip structure 200 are a double-row parallel structure, for the horizontal axis direction of the inkjet chip structure 200, it is equivalent to that a printing point on the paper can be printed twice by double holes (two nozzles 210) simultaneously or intermittently, so that the color of the printing can be brighter, and the ink required for printing can be more finely adjusted by the double-hole printing method, which can also increase the performance of the printing invisibly.

[0048] According to an embodiment of the present invention, in the above-mentioned double-row staggered structure of nozzle holes, the lateral distance (width) of the ink supply holes 200A is greater than 80 μm.

[0049] According to an embodiment of the present invention, in the double-row parallel structure of the nozzles, the distance between the plurality of nozzles 210 arranged in the longitudinal direction is between 23900 μm and 27000 μm. Since the distance between the nozzles 210 is wider, the printable range of the inkjet chip structure 200 is also between 23900 μm and 27000 μm, thereby effectively improving the printable range.

[0050] According to one embodiment of the present invention, in the double-row parallel structure of the nozzle holes, the plurality of nozzle holes 210 are arranged vertically, and the number of the nozzle holes 210 in a single row is more than 300, that is, in the double-row parallel structure of the nozzle holes, the total number of the double-row nozzle holes 210 is more than 600. It should be noted that the number of the nozzle holes 210, the lateral distance of the ink supply holes 200A, and the printable range are only examples here, and those skilled in the art can arbitrarily replace or modify them according to the needs of the application after reading the specification of the present invention.

[0051] See also Figure 2C , Figure 2D and Figure 3 In another embodiment of the present invention, in order to achieve the aforementioned purpose of improving the printing performance of the present invention, the present invention proposes an inkjet chip structure 200, including: a chip substrate 280, a thermal barrier layer 270, a heating resistor layer 260, a conductive layer 250, a protective layer 240, a barrier layer 290, and a nozzle plate 230 are stacked in sequence to form a stacked structure. The chip substrate 280 is used to carry the components of the inkjet chip structure 200, the heating resistor layer 260 is used to heat the ink, and the conductive layer 250 supplies the heating resistor layer 260 with the energy required to heat the ink. An ink chamber 220 is provided between the protective layer 240 and the barrier layer 290; a plurality of nozzles 210 are formed at the top of the ink chamber 220 and pass through the nozzle plate 230. When the heating resistor layer 260 is heated, bubbles are generated in the ink chamber 220, thereby squeezing the ink so that the ink is ejected from the nozzles 210; wherein the plurality of nozzles 210 form a structure on the surface of the inkjet chip structure 200 as shown in FIG. Figure 2DThe double-row staggered structure of the nozzles shown. According to one embodiment of the present invention, in the double-row staggered structure, the vertical distance between two adjacent nozzles 210 staggered in the horizontal direction is 40 μm-45 μm. According to one aspect of the present invention, and Figure 2D As described in the figure, since the nozzles 210 on the surface of the inkjet chip structure 200 are in a double-row staggered structure, that is, the two nozzles 210 in the lateral direction will not be arranged on the same horizontal axis, this can not only make the colors during printing more vivid and detailed, but also make the printed pattern present a more layered visual effect according to the needs of the industry.

[0052] According to an embodiment of the present invention, in the above-mentioned double-row staggered structure of nozzle holes, the lateral distance (width) of the ink supply holes 200A is greater than 80 μm.

[0053] According to one embodiment of the present invention, in the double-row staggered structure of nozzles, the distance between the plurality of nozzles 210 arranged in the longitudinal direction is between 23900 μm and 27000 μm. Since the distance between the nozzles 210 is wider, the printable range of the inkjet chip structure 200 is also between 23900 μm and 27000 μm, thereby effectively improving the printable range.

[0054] According to one embodiment of the present invention, in the double-row staggered structure, the plurality of nozzle holes 210 are arranged longitudinally, and the number of nozzle holes in a single row is more than 300, that is, in the double-row staggered structure, the number of nozzle holes in a double row is more than 600. It should be noted that the number of nozzle holes 210, the lateral distance of the ink supply hole 200A, and the printable range are only examples here, and those skilled in the art can arbitrarily replace or modify them according to the needs of the application after reading the specification of the present invention.

[0055] See also Figure 2E , Figure 2F and Figure 3 Another broad embodiment of the present invention is to provide an inkjet chip structure 200, comprising: a chip substrate 280, a thermal barrier layer 270, a heating resistor layer 260, a conductive layer 250, a protective layer 240, a barrier layer 290, and a nozzle plate 230 are stacked in sequence to form a stacked structure, wherein an ink chamber 220 is provided between the protective layer 240 and the barrier layer 290; a plurality of nozzles 210 are formed at the top of the ink chamber 220; wherein the plurality of nozzles 210 form a nozzle single-row structure on the surface of the inkjet chip structure 200; wherein, according to an embodiment of the present invention, in the nozzle single-row structure, the vertical distance between any two longitudinally adjacent nozzles 210 in the single row is 40 μm-45 μm, wherein the nozzle single-row structure can be arranged on the left or right side of the ink supply hole 200A according to the needs of the application.

[0056] According to an embodiment of the present invention, in the single-row nozzle structure, the lateral distance (width) of the ink supply holes 200A is greater than 80 μm.

[0057] According to an embodiment of the present invention, in the single-row nozzle structure, the distance between the nozzles 210 arranged in the longitudinal direction is between 23900 μm and 27000 μm.

[0058] According to one embodiment of the present invention, in the single-row nozzle structure, the plurality of nozzles 210 are arranged vertically, and the number of the nozzles 210 is more than 600. It should be noted that the number of the nozzles 210, the lateral distance of the ink supply holes 200A, and the printable range are only examples. Those skilled in the art can make any replacement or modification according to the needs of the application after reading the specification of the present invention.

[0059] Please continue reading Figure 3 and Figure 4 , Figure 3 For the general Figure 4 Schematic diagram of the three-dimensional perspective formed after a slight rotation. Figure 4 Is for Figure 3 The ink is supplied from the side of the ink chamber 220 to reduce the flow path of the ink during supply and increase the speed of the ink during supply. According to the embodiment of the present invention, the inkjet chip structure 200 can correspond to a resolution DPI (Dots Per Inch, the number of dots per inch) ranging from 150 to 48000 DPI.

[0060] According to the present invention, the thermal barrier layer 270 is an insulating material formed on a chip substrate 280. The material of the chip substrate 280 is a silicon wafer, and the insulating material can be selected from one of field oxide (FOX), silicon dioxide (SiO2), silicon nitride (Si3N4) and phosphosilicate glass (PSG).

[0061] According to the present invention, the heating resistor layer 260 is a resistor material formed on the thermal barrier layer 270, and the resistor material can be one of polysilicon (Poly silicon), tantalum aluminide (TaAl), tantalum (Ta), tantalum nitride (TaN), tantalum disilicide (Si2Ta), carbon (C), silicon carbide (SiC), indium tin oxide (ITO), zinc oxide (ZnO), cadmium sulfide (CdS), hafnium diboride (HfB2), titanium tungsten alloy (TiW), and titanium nitride (TiN).

[0062] According to the present invention, the conductive layer 250 is a conductive material, and the conductive material is one of aluminum (Al), aluminum-copper alloy (AlCu), aluminum-silicon alloy (AlSi), gold (Au), palladium (Pd), palladium-silver alloy (PdAg), platinum (Pt), aluminum-silicon-copper alloy (AlSiCu), niobium (Nb), vanadium (V), hafnium (Hf), titanium (Ti), zirconium (Zr), and yttrium (Y).

[0063] According to the contents of the present invention, a portion of the protective layer 240 is formed on the heating resistor layer 260, and the other portion of the protective layer 240 is formed on the conductive layer 250. At the same time, the protective layer 240 is composed of a second protective layer 240B stacked on a first protective layer 240A, and a third protective layer 240C on the second protective layer 240B (that is, the stacking order from bottom to top is the first protective layer 240A, the second protective layer 240B, and the third protective layer 240C). Among them, the first protective layer 240A is a silicon nitride (Si3N4) material; the second protective layer 240B is a passivation material, and the passivation material is selected from one of silicon nitride (Si3N4), silicon dioxide (SiO2), titanium dioxide (TiO2), hafnium dioxide (HfO2), zirconium dioxide (ZrO2), tantalum pentoxide (Ta2O5), rhenium heptoxide (Re2O7), niobium pentoxide (Nb2O5), uranium pentoxide (U2O5), tungsten trioxide (WO3), silicon oxynitride (Si4O5N3), and silicon carbide (SiC); the third protective layer 240C is a metal material, and the metal material is one of tantalum (Ta), tantalum nitride (TaN), titanium nitride (TiN), and tungsten nitride (TiW). Among them, the number of the above-mentioned protective layers 240 and the selected materials can be appropriately adjusted and modified according to the degree of corrosion of the ink on each material, the thermal stress on the entire inkjet chip structure 200 caused by the temperature change during the operation of the heating resistor layer 260, and the product life cycle required by the inkjet chip structure 200. Similarly, the first protective layer 240A, the second protective layer 240B, and the third protective layer 240C described in the present invention are only for illustration and are not used to limit the scope of rights of the present invention, which is hereby stated.

[0064] The barrier layer 290 is a polymer material formed on the protective layer 240. The polymer material is polyimide

[0065] The ink chamber 220 and the nozzle 210 are integrally formed in the barrier layer 290 , and the bottom of the ink chamber 220 is connected to the protection layer 240 , and the top of the ink chamber 220 has the nozzle 210 .

[0066] According to an embodiment of the present invention, the ink supply holes 200A in the inkjet wafer structure 200 may be 1-6 colors. Figure 3 and Figure 4 The ink supply hole 200A shown is one of them, and can provide single-color ink, and this single-color ink can be cyan (C: Cyan), magenta (M: Megenta), yellow (Y: Yellow), and black (K: Black) ink. In other embodiments of the present invention, the ink supply hole 200A can be 6 colors, respectively providing black (K: Black), cyan (C: Cyan), magenta (M: Megenta), yellow (Y: Yellow), light cyan (LC: Light Cyan) and light magenta (LM: Light Megenta) ink. Of course, in other embodiments, the ink supply hole 200A can also be 4 colors, respectively providing cyan (C: Cyan), magenta (M: Megenta), yellow (Y: Yellow), and black (K: Black) ink. The number of the ink supply holes 200A or the colors provided can be replaced or modified according to the actual application requirements.

[0067] In summary, the main purpose of the present invention is to provide an inkjet chip structure, by optimizing the arrangement of nozzles on the inkjet chip structure, optimizing the distance between adjacent nozzles, and the distance between several nozzles in the longitudinal arrangement, so that the overall performance of printing color, resolution, printing range, printing speed, etc. can be further improved to meet the increasingly stringent market demands and meet the needs of industrial utilization.

Claims

1. An inkjet wafer structure, comprising: A wafer substrate, carrying components; a heating resistor layer for heating the ink; A conductive layer, supplying the heating resistor layer with energy required to heat the ink; A protective layer; a barrier layer, and A spray hole plate; The chip substrate, the heating resistor layer, the conductive layer, the protective layer, the barrier layer, and the orifice sheet form a stacked structure; an ink chamber formed between the protective layer and the barrier layer; A plurality of nozzles are arranged at the top of the ink chamber and penetrate the nozzle plate; Wherein, the plurality of nozzles are arranged in a double row parallel structure on the surface of the inkjet wafer structure; Wherein, in the double-row parallel structure of the nozzle holes, the vertical distance between two longitudinally adjacent nozzle holes in a single row is 80 μm-90 μm; In the double-row parallel structure of the nozzle holes, the distance between the plurality of nozzle holes in the longitudinal arrangement ranges from 23900 μm to 27000 μm.

2. The inkjet chip structure as claimed in claim 1, wherein in the double-row parallel structure of the nozzle holes, a lateral distance of an ink supply hole is greater than 80 μm. 3 . The inkjet chip structure as claimed in claim 1 , wherein in the double-row parallel structure of nozzles, the number of the plurality of nozzles in a single row is more than 300. 4 . The inkjet wafer structure as claimed in claim 3 , wherein in the double-row parallel structure of the nozzles, the total number of the plurality of nozzles in the double rows is more than 600.

5. An inkjet wafer structure comprising: A wafer substrate, carrying components; a heating resistor layer for heating the ink; A conductive layer, supplying the heating resistor layer with energy required to heat the ink; A protective layer; a barrier layer, and A spray hole plate; The chip substrate, the heating resistor layer, the conductive layer, the protective layer, the barrier layer, and the orifice sheet form a stacked structure; an ink chamber formed between the protective layer and the barrier layer; A plurality of nozzles are arranged at the top of the ink chamber and penetrate the nozzle plate; Wherein, the plurality of nozzles are in a double-row staggered structure on the surface of the inkjet wafer structure; Wherein, in the double-row staggered structure, the vertical distance between two adjacent transversely staggered nozzles is 40 μm-45 μm; In the double-row staggered structure, the distance between the plurality of nozzle holes in the longitudinal arrangement ranges from 23900 μm to 27000 μm. 6 . The inkjet chip structure as claimed in claim 5 , wherein in the double-row staggered structure, a lateral distance of an ink supply hole is greater than 80 μm. 7 . The inkjet wafer structure as claimed in claim 5 , wherein in the double-row staggered structure, the number of the plurality of nozzles in a single row is more than 300. 8 . The inkjet wafer structure as claimed in claim 7 , wherein in the double-row staggered structure, the total number of the plurality of nozzles in the double rows is more than 600.

9. An inkjet wafer structure, comprising: A wafer substrate, carrying components; a heating resistor layer for heating the ink; A conductive layer, supplying the heating resistor layer with energy required to heat the ink; A protective layer; a barrier layer, and A spray hole plate; The chip substrate, the heating resistor layer, the conductive layer, the protective layer, the barrier layer, and the orifice sheet form a stacked structure; an ink chamber formed between the protective layer and the barrier layer; A plurality of nozzles are arranged at the top of the ink chamber and penetrate the nozzle plate; MJ24A-1317N_248089 1TWCN_Simplified Chinese Version wherein the plurality of nozzles are in a single-row structure on the surface of the inkjet wafer structure; Among them, in the single-row structure of the nozzle holes, the vertical distance between two longitudinally adjacent nozzle holes is 40 μm-45 μm; The nozzle holes have a single-row structure, and the distance between the nozzle holes in the longitudinal direction ranges from 23900 μm to 27000 μm. 10 . The inkjet chip structure as claimed in claim 9 , wherein in the single-row nozzle structure, a lateral distance of an ink supply hole is greater than 80 μm. 11 . The inkjet wafer structure as claimed in claim 9 , wherein in the single-row nozzle structure, the total number of the plurality of nozzles is greater than 600.

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