Electrified cylinder-entering electroplating device and process

Abstract

The invention discloses an electrified cylinder-entering electroplating device and process. The electrified cylinder-entering electroplating device comprises a frame, the symmetrically-arranged supporting frames are arranged at the positions, away from the middle, in the frame. The copper groove is connected in the support frame; an oil cylinder is arranged at the position, corresponding to the position between the two supporting frames, in the frame, a movable platform is arranged at the position, corresponding to the position above the oil cylinder, in the frame, a chain is arranged between the movable platform and the oil cylinder, and suspension arms are arranged above the two sides of the movable platform. Before electroplating of the circuit board is started, the electric cylinder pushes the combined hanging tool to advance, so that the conductive contact head is separated from the hanging tool conductive contact head, and after the conductive contact head is separated from the hanging tool conductive contact head, an open circuit is formed, the combined hanging tool and the circuit board do not have current any more, and when the circuit board needs to be protected, the circuit board has weak current. When the circuit board moves, the circuit board does not have weak current any more, and compared with a mode that the circuit board is electrified all the time in a copper groove, more cost can be saved.

Description

Technical Field

[0001] The invention belongs to the technical field of electroplating, and in particular relates to a live-in-cylinder electroplating device and process. Background Art

[0002] Circuit board is an indispensable part of electronic equipment, also known as printed circuit board or printed circuit board. It is composed of integrated circuits, quartz oscillators, fine-tuning capacitors and other electronic components. Through specific layout and connection, it realizes the function of the circuit and provides mechanical support for electronic components.

[0003] PCB electroplating refers to the process of depositing a layer of metal film on the surface or internal hole wall of the PCB by electrochemical method. Its main purpose is to enhance the conductivity of the PCB, improve the corrosion resistance and wear resistance, thereby improving the overall performance and reliability of the PCB.

[0004] The current mainstream method of electroplating circuit boards is mainly based on direct current electroplating technology, the core of which is to continuously apply a constant current to the electroplating tank through an external power supply, so that the metal ions in the electrolyte are evenly deposited on the surface of the circuit board serving as the cathode to form a conductive layer.

[0005] Although the above-mentioned method of electroplating a circuit board can electroplate the circuit board, in the specific operation process, when electroplating the circuit board, it is necessary to energize the plating solution in the copper tank, and after the electroplating of the circuit board is completed, during the process of taking out the electroplated circuit board and placing the unplated circuit board into the copper tank, the electrolyte in the copper tank is still energized. Although continuous energization of the electrolyte does not affect the electroplating of the circuit board, it will increase the cost of the circuit board during the electroplating process. Summary of the invention

[0006] The purpose of the present invention is to solve the problem of high cost of electroplating circuit boards in the prior art, and to provide a live-in-cylinder electroplating device and process.

[0007] The purpose of the present invention can be achieved through the following technical solutions: A live-cylinder electroplating device comprises a frame; symmetrically arranged support frames are arranged at a position away from the middle of the frame; a copper trough is connected to the support frame; it is characterized in that: an oil cylinder is arranged at a position corresponding to the position between the two support frames in the frame, a movable platform is arranged at a position corresponding to the position above the oil cylinder in the frame, a chain is arranged between the movable platform and the oil cylinder, a suspension arm is arranged above both sides of the movable platform, a combined hanger is suspended below the end of the suspension arm away from the column, a hanger support square tube is connected above the combined hanger, a hanger conductive contact head is connected to the upper surface of the hanger support square tube near the frame, and a support is connected to the position of the hanger conductive contact head on the frame; a symmetrically arranged guide wheel is rotatably connected in the support, a steel wire rope is slidably connected to the upper inner side of the two guide wheels, a first slider is connected to the end of the steel wire rope near the hanger conductive contact head, a belt conductive contact head is connected to the position of the first slider near the hanger conductive contact head, a second slider is connected to the end of the steel wire rope away from the hanger conductive contact head, and a counterweight is connected to the side of the second slider away from the frame; a rectifier is arranged above the corresponding slide rail of the frame.

[0008] Preferably, a cathode carbon brush is connected to the position above the support frame corresponding to the rectifier, an anode titanium mesh is arranged below the corresponding cathode carbon brush in the copper groove, the rectifier cathode is connected to the first slider and the second slider, and the rectifier anode is connected to the anode titanium mesh.

[0009] Preferably, a side of the boom close to the movable platform is rotatably connected to a second roller, a position of the movable platform corresponding to the first roller is connected to a symmetrically arranged L-shaped plate, and the second roller is in contact with the L-shaped plate.

[0010] Preferably, symmetrically arranged columns are connected to positions of the frame corresponding to the booms close to the movable platform, and the booms are slidably connected to the columns.

[0011] Preferably, a symmetrically arranged clamping plate is connected to one end of the boom close to the movable platform, corresponding to a position of the column close to the boom, and the clamping plate is slidably connected to the column.

[0012] Preferably, a side of the boom close to the column is rotatably connected to a symmetrically arranged first roller, the first roller fits against the inner wall of the column, and the column is provided with symmetrically arranged limiting grooves at positions corresponding to both ends of the first roller, and the ends of the first rollers are slidably connected in the limiting grooves.

[0013] Preferably, the conductive contact head of the belt is located directly below the conductive contact head of the hanger.

[0014] Preferably, a bearing is connected to the outer side of the conductive contact head.

[0015] Preferably, the frame is connected with a slide rail at positions corresponding to the first slide block and the second slide block, and the first slide block and the second slide block are both slidably connected in the slide rail.

[0016] The present invention also provides a live-entry electroplating process, comprising the following steps: S1: Start the oil cylinder, and with the cooperation of the chain, the movable platform descends, and the descending of the movable platform drives the combined hanger and the conductive contact head of the hanger to descend.

[0017] S2: The conductive contact head of the hanger will contact with the conductive contact head of the belt during the descending process. After the conductive contact head of the hanger contacts with the conductive contact head of the belt, a closed circuit will be formed, so that a weak current will be carried by the combined hanger and the circuit board.

[0018] S3: After the conductive contact head of the hanger contacts with the conductive contact head of the belt, the hanging arm and the conductive contact head of the hanger will continue to descend. During the descent, the conductive contact head of the hanger will drive the conductive contact head of the belt to descend synchronously. The descent of the conductive contact head of the belt will drive the first slider to descend. With the cooperation of the wire rope and the guide wheel, the second slider and the counterweight will rise. When the hanging arm drives the combined hanger to descend into the copper tank and is at the lowest point, the circuit board will contact the electroplating liquid in the copper tank.

[0019] S4: Before the electroplating of the circuit board begins, the electric cylinder will push the combined hanger forward to separate the conductive contact head with the conductive contact head of the hanger. After the conductive contact head with the conductive contact head of the hanger is separated, a short circuit will be formed, so that there is no current on the combined hanger and the circuit board.

[0020] S5: With the cooperation of the counterweight, the guide wheel and the wire rope, the counterweight will drive the second slider to descend, and the wire rope will pull the first slider and the conductive contact head up to the initial position.

[0021] Beneficial effects of the present invention: By starting the oil cylinder, the movable platform is lowered with the cooperation of the chain, and the lowering of the movable platform drives the combined hanger and the conductive contact head of the hanger to descend. The conductive contact head of the hanger will contact the conductive contact head with the belt during the descending process. After the conductive contact head of the hanger contacts the conductive contact head with the belt, a closed circuit will be formed, so that the combined hanger and the circuit board will carry a weak current, so that the circuit board will have a current protection layer when entering the copper tank, preventing the electroplating liquid in the copper tank from attacking the chemical copper layer on the circuit board, causing the circuit board hole to be broken, resulting in poor quality of the circuit board, and the current protection layer can protect the circuit board, thereby ensuring the quality of the circuit board.

[0022] After the conductive contact head of the hanger contacts with the conductive contact head with belt, the hanging arm and the conductive contact head of the hanger will continue to descend. During the descent, the conductive contact head of the hanger will drive the conductive contact head with belt to descend synchronously. The descent of the conductive contact head with belt will drive the first slider to descend. With the cooperation of the wire rope and the guide wheel, the second slider and the counterweight will rise. When the hanging arm drives the combined hanger to descend into the copper tank and is at the lowest point, the circuit board will contact the electroplating liquid in the copper tank. Before the electroplating of the circuit board begins, the electric cylinder will push the combined hanger forward to separate the conductive contact head with belt from the conductive contact head of the hanger. After the conductive contact head with belt is separated from the conductive contact head of the hanger, a short circuit will be formed, so that the combined hanger and the circuit board will no longer carry current. When the circuit board needs protection, a weak current will be carried on the circuit board. When the circuit board is moved, the circuit board will no longer carry a weak current. Compared with the method of keeping power on in the copper tank, more costs can be saved.

[0023] Because the second slider is connected to a counterweight, with the cooperation of the counterweight, guide wheel and wire rope, the counterweight will drive the second slider to descend, and the wire rope will pull the first slider and the conductive contact head up to the initial position, thereby preparing for the protection of the next group of circuit boards and continuously electroplating the circuit boards without affecting the electroplating efficiency of the circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be further described below in conjunction with the accompanying drawings.

[0025] Figure 1 is a side cross-sectional view of the present invention; Figure 2 yes Figure 1 A partial enlarged view of the middle A; Figure 3 yes Figure 1 A partial enlarged view of point B in the middle; Figure 4 yes Figure 1 A partial enlarged view of point C in the middle; Figure 5 is a side cross-sectional view of the copper groove in the present invention; Figure 6 It is a three-dimensional diagram of the conductive contact head of the hanger in the present invention; Figure 7 It is a schematic diagram of the slide rail in the present invention; Figure 8 It is a schematic diagram of the rectifier in the present invention.

[0026] In the figure: 1. frame; 2. second roller; 3. combination hanger; 4. conductive contact head of hanger; 5. rectifier; 6. cathode carbon brush; 11. Support frame; 12. Copper trough; 13. Oil cylinder; 14. Movable platform; 15. Chain; 16. Hanging arm; 17. Column; 18. Clamping plate; 19. First roller; 191. Limiting groove; 21. L-shaped plate; 31. Hanger supports square tube; 41. Support; 42. Guide wheel; 43. Steel wire rope; 44. First slider; 45. Second slider; 46. Conductive contact head; 47. Bearing; 48. Counterweight; 49. Slide rail; 61. Anode titanium mesh; 62. Anode support rod. DETAILED DESCRIPTION

[0027] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] See also Figure 1 As shown, a live-in-cylinder electroplating device comprises a frame 1, in which a symmetrically arranged support frame 11 is provided at a position away from the middle of the frame 1, and the support frame 11 is used to fix the position of a copper groove 12.

[0029] A copper groove 12 is connected inside the support frame 11 and is used for auxiliary electroplating of the circuit board.

[0030] An oil cylinder 13 is provided at a position corresponding to between the two support frames 11 in the frame 1 , and the oil cylinder 13 is used to drive the chain 15 to rotate.

[0031] A movable platform 14 is provided in the frame 1 at a position corresponding to the top of the oil cylinder 13 , and the movable platform 14 is used to drive the boom 16 to rise and fall.

[0032] A chain 15 is provided between the movable platform 14 and the oil cylinder 13 , and the oil cylinder 13 cooperates with the chain 15 to make the movable platform 14 rise and fall.

[0033] Suspension arms 16 are provided above both sides of the movable platform 14 , and the suspension arms 16 are used to lift the combined hanger 3 .

[0034] See also Figure 3 As shown, a side of the boom 16 close to the movable platform 14 is rotatably connected to a second roller 2 , and the second roller 2 is used to assist the movement of the boom 16 and reduce the friction between the boom 16 and the movable platform 14 .

[0035] The movable platform 14 is connected with symmetrically arranged L-shaped plates 21 at the position corresponding to the first roller 19. The second roller 2 is in contact with the L-shaped plates 21. The L-shaped plates 21 are used to support the second roller 2. With the cooperation of the L-shaped plates 21, the second roller 2 and the movable platform 14, the boom 16 can be driven to lift and lower.

[0036] Corresponding to the position where the boom 16 is close to the movable platform 14 inside the frame 1, symmetrically arranged columns 17 are connected. The boom 16 is slidably connected inside the columns 17. Through the cooperation of the columns 17, the position of the boom 16 can be preliminarily limited.

[0037] At one end of the boom 16 close to the movable platform 14, symmetrically arranged engaging plates 18 are connected corresponding to the position where the columns 17 are close to the boom 16. The engaging plates 18 are slidably connected with the columns 17. Through the cooperation of the engaging plates 18, the position of the boom 16 can be limited, so that the boom 16 can only move vertically.

[0038] On one side of the boom 16 close to the columns 17, symmetrically arranged first rollers 19 are rotatably connected. The first rollers 19 are in contact with the inner walls of the columns 17. The first rollers 19 are used to reduce the friction between the boom 16 and the columns 17, so that the boom 16 can lift and lower more smoothly.

[0039] At the positions corresponding to both ends of the first roller 19 on the columns 17, symmetrically arranged limiting grooves 191 are provided. The ends of the first rollers 19 are slidably connected in the limiting grooves 191. Through the cooperation of the first rollers 19 and the limiting grooves 191, the position of the boom 16 can be limited, so that the boom 16 can only move vertically.

[0040] Please refer to Figure 1 - Figure 3 and Figure 6 - Figure 8 As shown, a combined hanger 3 is suspended below one end of the boom 16 far from the columns 17. The combined hanger 3 is used to clamp and fix the circuit board so that the circuit board can be electroplated.

[0041] Above the combined hanger 3, a hanger support square tube 31 is connected. The hanger support square tube 31 is used to support the combined hanger 3 and at the same time assist the hanger conductive contact head 4 to contact with the belt conductive contact head 46, so that the combined hanger 3 has a weak current.

[0042] On the upper surface of the hanger support square tube 31 close to the frame 1, a hanger conductive contact head 4 is connected. The hanger conductive contact head 4 is used to assist the combined hanger 3 to have a weak current.

[0043] Corresponding to the position of the hanger conductive contact head 4 on the frame 1, a support 41 is connected. Inside the support 41, symmetrically arranged guide wheels 42 are rotatably connected. The guide wheels 42 are used to guide the movement of the steel wire rope 43.

[0044] A steel wire rope 43 is slidably connected to the upper inner side of the two guide wheels 42 , and the steel wire rope 43 is used to connect the first slider 44 and the second slider 45 .

[0045] One end of the steel wire rope 43 close to the hanger conductive contact head 4 is connected to a first slider 44, and the first slider 44 close to the hanger conductive contact head 4 is connected to a conductive contact head 46. By lowering the hanger conductive contact head 4 to contact the conductive contact head 46, a weak current can be passed through the circuit board, thereby protecting the circuit board.

[0046] The belt conductive contact head 46 is located directly below the hanger conductive contact head 4. With this arrangement, after the hanger conductive contact head 4 is lowered, it can be ensured that the hanger conductive contact head 4 is in contact with the belt conductive contact head 46.

[0047] A bearing 47 is connected to the outer side of the conductive contact head 46, and the bearing 47 is used to reduce the friction between the conductive contact head 46 and the conductive contact head 4 of the hanger. When the electric cylinder pushes the combined hanger 3 to move the combined hanger 3 horizontally, it can reduce the resistance and make the combined hanger 3 move more smoothly.

[0048] The end of the wire rope 43 away from the conductive contact head 4 of the hanger is connected to the second slider 45, and the side of the second slider 45 away from the frame 1 is connected to a counterweight 48, which is used to lower the second slider 45 and raise the first slider 44 and the conductive contact head 46.

[0049] The frame 1 is connected with a slide rail 49 at the position corresponding to the first slider 44 and the second slider 45. The first slider 44 and the second slider 45 are both slidably connected in the slide rail 49. Through the cooperation of the slide rail 49, the position of the first slider 44 and the second slider 45 can be limited so that the first slider 44 and the second slider 45 can only move vertically, thereby preventing the first slider 44 and the second slider 45 from offset.

[0050] A rectifier 5 is disposed above the frame 1 corresponding to the slide rail 49 , and the rectifier 5 is used to provide current during the electroplating process.

[0051] See also Figure 5 As shown, a cathode carbon brush 6 is connected to the position above the support frame 11 corresponding to the rectifier 5. The cathode carbon brush 6 is used to conduct current to the circuit board during the electroplating process of the circuit board to ensure uniform current distribution.

[0052] An anode titanium mesh 61 is arranged below the cathode carbon brush 6 in the copper groove 12 . The anode titanium mesh 61 is used for conducting electricity, electrolyzing copper powder to generate copper ions, and maintaining uniform current distribution.

[0053] It is worth noting here that the anode titanium mesh 61 is used in the copper tank 12 because the anode titanium mesh 61 will not react with the electroplating solution in the copper tank 12, can remain stable during use, and will not contaminate the electroplating solution, thereby reducing the replacement frequency of the anode titanium mesh 61 during use and reducing the cost of electroplating; during the use of the anode titanium mesh 61, no metal ions and impurities will be precipitated, thereby avoiding contamination of the electroplating solution.

[0054] The cathode of the rectifier 5 is connected to the first slider 44 and the second slider 45 , and the anode of the rectifier 5 is connected to the anode titanium mesh 61 . This arrangement ensures that the circuit board can be protected before entering the copper tank 12 .

[0055] An anode support rod 62 is connected to the position of the copper tank 12 corresponding to the anode titanium mesh 61 . The anode titanium mesh 61 is connected to the anode support rod 62 . The anode support rod 62 is used to fix the position of the anode titanium mesh 61 .

[0056] Working principle: By starting the oil cylinder 13, the movable platform 14 is lowered with the cooperation of the chain 15. The lowering of the movable platform 14 drives the combined hanger 3 and the conductive contact head 4 of the hanger to descend. The conductive contact head 4 of the hanger will contact the conductive contact head 46 with the belt during the descending process. After the conductive contact head 4 of the hanger contacts the conductive contact head 46 with the belt, a closed circuit is formed, so that the combined hanger 3 and the circuit board are charged with a weak current, so that the circuit board will have a current protection layer when entering the copper tank 12, preventing the electroplating liquid in the copper tank 12 from attacking the chemical copper layer on the circuit board, causing the circuit board hole to break, resulting in poor quality of the circuit board. The current protection layer can protect the circuit board, thereby ensuring the quality of the circuit board; After the conductive contact head 4 of the hanger contacts with the conductive contact head 46, the arm 16 and the conductive contact head 4 of the hanger will continue to descend. The conductive contact head 4 of the hanger will drive the conductive contact head 46 to descend synchronously during the descent process. The descent of the conductive contact head 46 will drive the first slider 44 to descend. Under the cooperation of the wire rope 43 and the guide wheel 42, the second slider 45 and the counterweight 48 will be driven to rise. When the arm 16 drives the combined hanger 3 to descend into the copper tank 12 and is at the lowest point, the circuit board will contact the electroplating liquid in the copper tank 12. Before the electroplating of the circuit board begins, the electric cylinder will push the combined hanger 3 forward to separate the conductive contact head 46 from the conductive contact head 4 of the hanger. After the conductive contact head 46 is separated from the conductive contact head 4 of the hanger, a short circuit will be formed, so that the combined hanger 3 and the circuit board will no longer carry current. When the circuit board needs protection, a weak current will be carried on the circuit board. When the circuit board is moved, the circuit board will no longer carry a weak current. Compared with the method of always powering on in the copper tank 12, more costs can be saved. Because the second slider 45 is connected with a counterweight 48, with the cooperation of the counterweight 48, the guide wheel 42 and the wire rope 43, the counterweight 48 will drive the second slider 45 to descend, and the wire rope 43 will pull the first slider 44 and the conductive contact head 46 up to the initial position, thereby preparing for the protection of the next group of circuit boards and continuously electroplating the circuit boards without affecting the electroplating efficiency of the circuit boards.

[0057] A live-in-tank electroplating process comprises the following steps: S1: Start the oil cylinder 13, and with the cooperation of the chain 15, the movable platform 14 is lowered, and the lowering of the movable platform 14 drives the combined hanger 3 and the hanger conductive contact head 4 to descend.

[0058] S2: The conductive contact head 4 of the hanger will contact the conductive contact head 46 during the descent process. After the conductive contact head 4 of the hanger contacts the conductive contact head 46, a closed circuit will be formed, so that a weak current will be carried by the combined hanger 3 and the circuit board.

[0059] S3: After the conductive contact head 4 of the hanger contacts with the conductive contact head 46, the arm 16 and the conductive contact head 4 of the hanger will continue to descend. During the descent, the conductive contact head 4 of the hanger will drive the conductive contact head 46 to descend synchronously. The descent of the conductive contact head 46 will drive the first slider 44 to descend. With the cooperation of the wire rope 43 and the guide wheel 42, the second slider 45 and the counterweight 48 will be driven to rise. When the arm 16 drives the combined hanger 3 to descend into the copper tank 12 and is at the lowest point, the circuit board will contact the electroplating liquid in the copper tank 12.

[0060] S4: Before the electroplating of the circuit board begins, the electric cylinder will push the combined hanger 3 forward to separate the conductive contact head 46 from the hanger conductive contact head 4. After the conductive contact head 46 is separated from the hanger conductive contact head 4, a short circuit will be formed, so that there is no current on the combined hanger 3 and the circuit board.

[0061] S5: With the cooperation of the counterweight 48, the guide wheel 42 and the wire rope 43, the counterweight 48 will drive the second slider 45 to descend, and the wire rope 43 will pull the first slider 44 and the conductive contact head 46 up to the initial position.

[0062] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0063] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A live-in-cylinder electroplating device, comprising a frame (1); a symmetrically arranged support frame (11) disposed at a position away from the middle of the frame (1); a copper groove (12) connected to the support frame (11); characterized in that: A cylinder (13) is provided in the frame (1) at a position corresponding to between the two support frames (11); a movable platform (14) is provided in the frame (1) at a position corresponding to above the cylinder (13); a chain (15) is provided between the movable platform (14) and the cylinder (13); a suspension arm (16) is provided above both sides of the movable platform (14); a combined hanger (3) is suspended below one end of the suspension arm (16) away from the column (17); a hanger support square tube (31) is connected above the combined hanger (3); a hanger conductive contact head (4) is connected to the upper surface of the hanger support square tube (31) at a position close to the frame (1); and a support (41) is connected to the frame (1) at a position corresponding to the hanger conductive contact head (4); The support (41) is rotatably connected to guide wheels (42) that are symmetrically arranged; steel wire ropes (43) are slidably connected to the upper inner sides of the two guide wheels (42); one end of the steel wire rope (43) close to the conductive contact head (4) of the hanger is connected to a first slider (44); a position of the first slider (44) close to the conductive contact head (4) of the hanger is connected to a conductive contact head (46); one end of the steel wire rope (43) away from the conductive contact head (4) of the hanger is connected to a second slider (45); and a side of the second slider (45) away from the frame (1) is connected to a counterweight (48); A rectifier (5) is arranged above the frame (1) corresponding to the slide rail (49).

2. The electroplating device with live tank entry according to claim 1, characterized in that: A cathode carbon brush (6) is connected to a position above the support frame (11) corresponding to the rectifier (5); an anode titanium mesh (61) is arranged below the cathode carbon brush (6) in the copper groove (12); the cathode of the rectifier (5) is connected to the first slider (44) and the second slider (45); and the anode of the rectifier (5) is connected to the anode titanium mesh (61).

3. The electroplating device with live tank entry according to claim 2 is characterized in that: A second roller (2) is rotatably connected to one side of the suspension arm (16) close to the movable platform (14); a symmetrically arranged L-shaped plate (21) is connected to a position of the movable platform (14) corresponding to the first roller (19); and the second roller (2) is fitted to the L-shaped plate (21).

4. The electroplating device with live tank entry according to claim 3 is characterized in that: A position in the frame (1) corresponding to the boom (16) close to the movable platform (14) is connected with symmetrically arranged upright posts (17), and the boom (16) is slidably connected in the upright posts (17).

5. The electroplating device with live tank entry according to claim 4 is characterized in that: One end of the boom (16) close to the movable platform (14) is connected to a symmetrically arranged clamping plate (18) at a position corresponding to the column (17) close to the boom (16), and the clamping plate (18) is slidably connected to the column (17).

6. The electroplating device with live tank entry according to claim 5, characterized in that: A side of the boom (16) close to the column (17) is rotatably connected to a symmetrically arranged first roller (19), the first roller (19) being in contact with the inner wall of the column (17), and the column (17) is provided with symmetrically arranged limiting grooves (191) at positions corresponding to both ends of the first roller (19), and the ends of the first roller (19) are slidably connected in the limiting grooves (191).

7. The electroplating device with live tank entry according to claim 6 is characterized in that: The conductive contact head (46) is located directly below the conductive contact head (4) of the hanger.

8. The electroplating device with live tank entry according to claim 7 is characterized in that: A bearing (47) is connected to the outer side of the conductive contact head (46).

9. The electroplating device with live tank entry according to claim 8, characterized in that: The frame (1) is connected to a slide rail (49) at positions corresponding to the first slide block (44) and the second slide block (45), and the first slide block (44) and the second slide block (45) are both slidably connected in the slide rail (49).

10. A live-in-tank electroplating process, applicable to a live-in-tank electroplating device as claimed in any one of claims 1 to 9, characterized in that: The following steps are involved: S1: starting the oil cylinder (13), and lowering the movable platform (14) with the cooperation of the chain (15), and the lowering of the movable platform (14) drives the combined hanger (3) and the conductive contact head (4) of the hanger to lower; S2: The conductive contact head (4) of the hanger will come into contact with the conductive contact head (46) of the belt during the process of descending. After the conductive contact head (4) of the hanger comes into contact with the conductive contact head (46), a closed circuit is formed, so that a weak current is carried by the combined hanger (3) and the circuit board; S3: After the conductive contact head (4) of the hanger contacts the conductive contact head (46), the hanging arm (16) and the conductive contact head (4) of the hanger continue to descend. During the descent process, the conductive contact head (4) of the hanger drives the conductive contact head (46) to descend synchronously. The descent of the conductive contact head (46) drives the first slider (44) to descend. With the cooperation of the steel wire rope (43) and the guide wheel (42), the second slider (45) and the counterweight (48) are driven to rise. When the hanging arm (16) drives the combined hanger (3) to descend into the copper tank (12) and is at the lowest point, the circuit board contacts the electroplating solution in the copper tank (12); S4: Before the electroplating of the circuit board begins, the electric cylinder pushes the combined hanger (3) forward, so that the conductive contact head (46) is separated from the conductive contact head (4) of the hanger. After the conductive contact head (46) is separated from the conductive contact head (4) of the hanger, a circuit is formed, so that the combined hanger (3) and the circuit board no longer carry current; S5: With the cooperation of the counterweight (48), the guide wheel (42) and the steel wire rope (43), the counterweight (48) drives the second slider (45) to descend, and the steel wire rope (43) pulls the first slider (44) and the conductive contact head (46) to rise to the initial position.

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