Stage lamp self-adaptive heat dissipation system based on vapor chamber

Abstract

The stage lamp self-adaptive cooling system comprises a lamp panel, a vapor chamber body, a semiconductor cooler body, a cooling fin body, a copper pipe and a fan body, the vapor chamber body is fixedly connected to the upper surface of the lamp panel, and the semiconductor cooler body is fixedly connected to the upper surface of the vapor chamber body; the semiconductor cooler body is additionally arranged for auxiliary heat dissipation, the heat saturation phenomenon of a heat dissipation system can be avoided, the comprehensive control sub-module generates a comprehensive control instruction based on the power and temperature of a lamp panel, and the PWM control technology is combined, so that high-precision and fast-response control over the semiconductor cooler body and the fan body is achieved; the heat dissipation performance evaluation sub-module is used for regularly evaluating the heat dissipation performance of the system, the stability of system operation is improved, and the element performance evaluation sub-module is used for analyzing the cause of poor heat dissipation when the heat dissipation is poor, so that effective suggestions are provided for system maintenance, and the energy consumption of the system is prevented from being increased due to poor heat dissipation.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation systems, and in particular to an adaptive heat dissipation system for stage lights based on a temperature homogenizing plate. Background Art

[0002] Stage lights are lighting equipment used in stage performances, theaters, concerts and other occasions. Their main function is to provide specific lighting effects for the stage to enhance the visual impact and artistic appeal of the performance. Stage lights generate a lot of heat when working, so a heat dissipation system is generally designed inside the stage lights. The heat dissipation system integrates forced heat dissipation by fans and natural heat dissipation by heat sinks. This type of stage light heat dissipation system has the following defects when in use: First, when the lamp is in high power for a long time, the temperature of the heat sink will gradually increase. When the temperature difference between the heat sink and the surrounding environment decreases, the speed of heat transfer will gradually decrease, and eventually reach a thermal saturation state. Therefore, heat dissipation only through fans and heat sinks cannot guarantee the heat dissipation effect; second, the control of the heat dissipation fan is generally detected by a temperature sensor to detect the temperature of the lamp, and then the speed of the heat dissipation fan is controlled by a controller. This control method has a slow response speed and low accuracy; third, after a long period of use, the heat dissipation system of the lamp will cause the heat dissipation effect and stability of the heat dissipation system to decrease due to dust accumulation on the heat sink and aging of components. However, the existing heat dissipation system cannot evaluate the heat dissipation performance of the heat dissipation system, so it is impossible to provide suggestions for the maintenance of the heat dissipation system, which ultimately leads to increased energy consumption of the heat dissipation system. Summary of the invention

[0003] The object of the present invention is to provide an adaptive heat dissipation system for stage lights based on a temperature vapor chamber to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an adaptive heat dissipation system for stage lights based on a temperature equalizing plate, comprising a light board, a temperature equalizing plate body, a semiconductor refrigerator body, a heat sink body, a copper tube and a fan body, wherein the upper surface of the light board is fixedly connected with the temperature equalizing plate body, the upper surface of the temperature equalizing plate body is fixedly connected with the semiconductor refrigerator body, the upper surface of the temperature equalizing plate body is fixedly connected with the copper tube, the copper tube is fixedly connected with the heat sink body, a fan body is arranged on the top of the semiconductor refrigerator body, and the fan body and the semiconductor refrigerator body are both electrically connected to the light board.

[0005] Preferably, the lamp board is electrically connected to a data processing module, the data processing module is electrically connected to a data acquisition module, a PWM signal generating module, a communication module, a power supply module and a data storage module, the PWM signal generating module is electrically connected to a driving module, and the driving module respectively establishes electrical connections with the fan body and the semiconductor refrigerator body, the data acquisition module is used to collect data, the data processing module is used to analyze and process data and issue control instructions, the PWM signal generating module is used to generate PWM signals, the communication module is used to establish a data connection with an external device, the power supply module is used to power the system, and the data storage module is used to store the collected data and system data.

[0006] Preferably, the data acquisition module includes a temperature data acquisition unit, an air flow rate data acquisition unit, a fan speed data acquisition unit and a power data acquisition unit.

[0007] Preferably, the temperature data acquisition unit is used to collect temperature data at the monitoring location, the air flow rate data acquisition unit is used to collect air flow rate data at the monitoring location, the fan speed data acquisition unit is used to collect fan speed data, and the power data acquisition unit is used to collect actual power data of the component.

[0008] Preferably, the data processing module includes a comprehensive control submodule, a heat dissipation performance evaluation submodule, a component performance evaluation submodule and an evaluation report generation submodule. The comprehensive control submodule is used to generate comprehensive control instructions. The heat dissipation performance evaluation submodule is used to evaluate the heat dissipation performance of the system. The component performance evaluation submodule is used to perform performance evaluation on the heat dissipation component when the heat dissipation performance of the system is poor. The evaluation report generation submodule is used to integrate the evaluation results of the component performance evaluation submodule to generate an evaluation report.

[0009] Preferably, the integrated control submodule establishes electrical connections with the data acquisition module, the fan body and the semiconductor refrigerator body respectively, the heat dissipation performance evaluation submodule establishes electrical connections with the data storage module and the component performance evaluation submodule respectively, the component performance evaluation submodule establishes electrical connections with the evaluation report generation submodule, and the evaluation report generation submodule establishes electrical connections with the communication module.

[0010] Preferably, the integrated control submodule includes a fan control unit and a semiconductor refrigerator control unit, the fan control unit is used to generate fan control instructions, and the semiconductor refrigerator control unit is used to generate semiconductor refrigerator control instructions.

[0011] Preferably, the comprehensive control submodule adopts the following algorithm formula:

[0012] C total =ω T ×C T +ω P ×CP

[0013] Among them, C total is the comprehensive control quantity, C T is the control quantity obtained based on temperature, C P is the control quantity based on power acquisition, ω T is the weight of the control quantity obtained based on temperature, ω P is the weight of the control quantity based on power acquisition; and ω T +ω P =1;

[0014] C T =k T ×ΔT

[0015] C P =k P ×ΔP

[0016] Among them, k T is the temperature control coefficient, k P is the power control coefficient, ΔT is the deviation between the actual temperature and the ideal temperature, and ΔP is the deviation between the actual power and the ideal power.

[0017] Preferably, the heat dissipation performance evaluation submodule includes a data acquisition unit, a calculation unit and a judgment unit. The data acquisition unit is used to acquire historical data of the heat dissipation system. The calculation unit is used to calculate the energy consumption of the heat dissipation system and the corresponding temperature changes. The judgment unit is used to evaluate the heat dissipation performance of the heat dissipation system according to the calculation results of the calculation unit.

[0018] Preferably, the component performance evaluation submodule includes a temperature equalizing plate performance evaluation unit, a semiconductor refrigerator performance evaluation unit, a heat sink performance evaluation unit, a fan performance evaluation unit and an air duct patency evaluation unit. The temperature equalizing plate performance evaluation unit is used to evaluate the thermal conduction efficiency of the temperature equalizing plate, the semiconductor refrigerator performance evaluation unit is used to evaluate the cooling effect, the heat sink performance evaluation unit is used to evaluate the thermal conduction efficiency of the heat sink, the fan performance evaluation unit is used to evaluate the fan performance, and the air duct patency evaluation unit is used to evaluate whether the air duct is blocked.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention adds a semiconductor refrigerator body for auxiliary heat dissipation, which can avoid thermal saturation in the heat dissipation system. The comprehensive control submodule of the present invention generates comprehensive control instructions based on the power and temperature of the lamp board, combined with PWM control technology, to achieve high-precision and fast-response control of the semiconductor refrigerator body and the fan body; the present invention uses a heat dissipation performance evaluation submodule to regularly evaluate the heat dissipation performance of the system to improve the stability of the system operation, and uses a component performance evaluation submodule to analyze the cause of poor heat dissipation, thereby providing effective suggestions for system maintenance to avoid increased system energy consumption due to poor heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall front view cutaway structure of the present invention;

[0021] Figure 2 is a system module block diagram of the present invention;

[0022] Figure 3 It is a structural block diagram of the data acquisition module of the present invention;

[0023] Figure 4 It is a structural block diagram of the data processing module of the present invention;

[0024] Figure 5 It is a structural block diagram of the comprehensive control submodule of the present invention;

[0025] Figure 6 This is a structural block diagram of the heat dissipation performance evaluation submodule of the present invention;

[0026] Figure 7 It is a structural block diagram of the component performance evaluation submodule of the present invention;

[0027] Figure 8 This is a forced heat dissipation control flow chart of the present invention;

[0028] Fig. 9 It is a flow chart of heat dissipation performance evaluation of the present invention.

[0029] In the figure: 1. lamp board; 11. temperature plate body; 12. semiconductor refrigerator body; 13. heat sink body; 14. copper tube; 15. fan body; 2. data acquisition module; 21. temperature data acquisition unit; 22. air velocity data acquisition unit; 23. fan speed data acquisition unit; 24. power data acquisition unit; 3. data processing module; 31. integrated control submodule; 311. fan control unit; 312. semiconductor refrigerator control unit; 32. heat dissipation performance evaluation submodule; 321. data acquisition unit; 322. calculation unit; 323. judgment unit; 33. component performance evaluation submodule; 331. temperature plate performance evaluation unit; 332. semiconductor refrigerator performance evaluation unit; 333. heat sink performance evaluation unit; 334. fan performance evaluation unit; 335. air duct patency evaluation unit; 34. evaluation report generation submodule; 4. PWM signal generation module; 5. drive module; 6. communication module; 7. power module; 8. data storage module. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] Please see attached Figure 1 -Attached Fig. 9The present invention provides an embodiment: an adaptive heat dissipation system for stage lights based on a temperature averaging board, comprising a light board 1, a temperature averaging board body 11, a semiconductor refrigerator body 12, a heat sink body 13, a copper tube 14 and a fan body 15. The temperature averaging board body 11 is fixedly connected to the upper surface of the light board 1, the semiconductor refrigerator body 12 is fixedly connected to the upper surface of the temperature averaging board body 11, the copper tube 14 is fixedly connected to the upper surface of the temperature averaging board body 11, the heat sink body 13 is fixedly connected to the copper tube 14, the top of the semiconductor refrigerator body 12 is provided with a fan body 15, and the fan body 15 and the semiconductor refrigerator body 12 are both electrically connected to the light board 1, the temperature averaging board body 11 is used to transfer the heat of the light board 1 to the copper tube 14 and the semiconductor refrigerator body 12, through The copper tube 14 and the heat sink body 13 realize natural heat dissipation, and the semiconductor refrigerator body 12 and the fan body 15 realize forced heat dissipation; the light board 1 is electrically connected with a data processing module 3, the data processing module 3 is electrically connected with a data acquisition module 2, a PWM signal generating module 4, a communication module 6, a power module 7 and a data storage module 8, the PWM signal generating module 4 is electrically connected with a driving module 5, and the driving module 5 is electrically connected with the fan body 15 and the semiconductor refrigerator body 12 respectively, the data acquisition module 2 is used to collect data, the data processing module 3 is used to analyze and process data, and issue control instructions, the PWM signal generating module 4 is used to generate a PWM signal, the communication module 6 is used to establish a data connection with an external device, and the power module 7 is used to generate a PWM signal. Used to power the system, the data storage module 8 is used to store the collected data and system data; the data acquisition module 2 includes a temperature data acquisition unit 21, an air flow rate data acquisition unit 22, a fan speed data acquisition unit 23 and a power data acquisition unit 24; the temperature data acquisition unit 21 is used to collect temperature data at the monitoring position, the air flow rate data acquisition unit 22 is used to collect air flow rate data at the monitoring position, the fan speed data acquisition unit 23 is used to collect fan speed data, and the power data acquisition unit 24 is used to collect actual power data of the component; the data processing module 3 includes a comprehensive control submodule 31, a heat dissipation performance evaluation submodule 32, a component performance evaluation submodule 33 and an evaluation report generation submodule 34, the comprehensive control submodule 31 is used to generate comprehensive control instructions, the heat dissipation performance evaluation submodule 32 is used to evaluate the heat dissipation performance of the system, the component performance evaluation submodule 33 is used to evaluate the performance of the heat dissipation component when the heat dissipation performance of the system is poor, and the evaluation report generation submodule 34 is used to integrate the evaluation results of the component performance evaluation submodule 33 to generate an evaluation report; the comprehensive control submodule 31 is electrically connected to the data acquisition module 2, the fan body 15 and the semiconductor refrigerator body 12 respectively, the heat dissipation performance evaluation submodule 32 is electrically connected to the data storage module 8 and the component performance evaluation submodule 33 respectively, the component performance evaluation submodule 33 is electrically connected to the evaluation report generation submodule 34, and the evaluation report generation submodule 34 is electrically connected to the communication module 6;The integrated control submodule 31 includes a fan control unit 311 and a semiconductor refrigerator control unit 312. The fan control unit 311 is used to generate a fan control instruction, and the semiconductor refrigerator control unit 312 is used to generate a semiconductor refrigerator control instruction. The algorithm formula used by the integrated control submodule 31 is as follows:

[0032] C total =ω T ×C T +ω P ×C P

[0033] Among them, C total is the comprehensive control quantity, C T is the control quantity obtained based on temperature, C P is the control quantity based on power acquisition, ω T is the weight of the control quantity obtained based on temperature, ω P is the weight of the control quantity based on power acquisition; and ω T +ω P =1;

[0034] C T =k T ×ΔT

[0035] C P =k P ×ΔP

[0036] Among them, k T is the temperature control coefficient, k P is the power control coefficient, ΔT is the deviation between the actual temperature and the ideal temperature, and ΔP is the deviation between the actual power and the ideal power; the heat dissipation performance evaluation submodule 32 includes a data acquisition unit 321, a calculation unit 322 and a judgment unit 323, the data acquisition unit 321 is used to obtain historical data of the heat dissipation system, the calculation unit 322 is used to calculate the energy consumption of the heat dissipation system and the corresponding temperature change, and the judgment unit 323 is used to evaluate the heat dissipation performance of the heat dissipation system according to the calculation result of the calculation unit 322; the component performance evaluation submodule 33 includes a temperature equalizing plate performance evaluation unit 331, a semiconductor refrigerator performance evaluation unit 332, a heat sink performance evaluation unit 333, a fan performance evaluation unit 334 and an air duct patency evaluation unit 335, the temperature equalizing plate performance evaluation unit 331 is used to evaluate the heat conduction efficiency of the temperature equalizing plate, the semiconductor refrigerator performance evaluation unit 332 is used to evaluate the cooling effect, the heat sink performance evaluation unit 333 is used to evaluate the heat conduction efficiency of the heat sink, the fan performance evaluation unit 334 is used to evaluate the fan performance, and the air duct patency evaluation unit 335 is used to evaluate whether the air duct is blocked.

[0037] Working principle: When the present invention is used for adaptive heat dissipation of stage lights, the heat of the light board 1 is transferred to the copper tube 14 by the temperature plate body 11, and the copper tube 14 transfers the heat to the heat sink body 13, and the fan body 15 is used to force the heat dissipation of the heat sink body 13 and the semiconductor refrigerator body 12, and the semiconductor refrigerator body 12 is used to force the heat dissipation of the temperature plate body 11; in this process, the data acquisition module 2 collects data, specifically: the temperature data acquisition unit 21 is used to collect the temperature data of the monitoring point, the air flow rate data acquisition unit 22 is used to monitor the air flow rate of the air duct, and the fan speed data is used to collect the temperature data of the monitoring point. The data acquisition unit 23 monitors the rotation speed of the fan body 15, and the power data acquisition unit 24 is used to monitor the actual power of the lamp board 1; the data collected by the data acquisition module 2 is transmitted to the data processing module 3, and the comprehensive control submodule 31 of the data processing module 3 generates a comprehensive control instruction based on the actual power and actual temperature of the lamp board 1 by a weighted method. The weight of the power and temperature can be determined by analyzing the performance of the lamp at different temperatures and powers, as well as previous maintenance experience. The comprehensive control instruction is transmitted to the PWM signal generation module 4, and the PWM signal generation module 4 generates a PWM signal to control the drive module 5 actions, specifically: generate a comprehensive fan control command through the fan control unit 311 to control the power of the fan body 15, generate a comprehensive semiconductor refrigerator control command through the semiconductor refrigerator control unit 312 to control the power of the semiconductor refrigerator body 12, so that when the temperature or power of the lamp board 1 changes greatly, the semiconductor refrigerator body 12 is used to assist in heat dissipation, and the power of the fan body 15 is increased accordingly to prevent the temperature from rising rapidly. When the temperature or power of the lamp board 1 changes slightly, only the fan body 15 is used for heat dissipation. When the temperature or power of the lamp board 1 is small, only natural heat dissipation is used. Heat, so as to reduce the energy consumption of the system. When the temperature of the lamp board 1 is too high and the fan body 15 is running at full power, the semiconductor refrigerator body 12 is started for auxiliary heat dissipation to avoid long-term high temperature damage to the equipment; the heat dissipation performance evaluation submodule 32 evaluates the heat dissipation performance of the system according to the set time, specifically: the data acquisition unit 321 obtains the system's most recent historical data, the calculation unit 322 calculates the energy consumption of the fan body 15 and the semiconductor refrigerator body 12, and the corresponding temperature change of the lamp board 1, and the judgment unit 323 evaluates whether the energy consumption and temperature change conform to the ideal curve, so as to evaluate the heat dissipation performance of the system;When the evaluation result of the judgment unit 323 is poor heat dissipation, the performance evaluation unit 331 of the temperature equalizing plate, the semiconductor refrigerator performance evaluation unit 332, the heat sink performance evaluation unit 333, the fan performance evaluation unit 334 and the air duct patency evaluation unit 335 in the component performance evaluation submodule 33 are used to evaluate the performance of each component, and the evaluation report generation submodule 34 integrates the evaluation results to generate an evaluation report, which is finally sent to the external device through the communication module 6 to implement an alarm reminder. For example, when the temperature equalizing plate performance evaluation unit 331 evaluates the temperature equalizing plate body 11, by analyzing the temperature difference between the cold end and the hot end of the temperature equalizing plate body 11, the thermal conductivity of the temperature equalizing plate body 11 can be determined, and the semiconductor refrigerator performance When evaluating the semiconductor refrigerator body 12, the evaluation unit 332 can determine the performance of the semiconductor refrigerator body 12 by analyzing the energy consumption and cooling effect of the semiconductor refrigerator body 12. The heat sink performance evaluation unit 333 can determine the thermal conductivity by analyzing the temperature difference between the heat sink body 13 and the cold end of the temperature equalizing plate body 11. The fan performance evaluation unit 334 can determine the performance of the fan body 15 by analyzing the energy consumption and rotation speed of the fan body 15. The air duct patency evaluation unit 335 can determine the patency of the air duct by analyzing the rotation speed of the fan body 15 and the air flow rate of the air duct. Among them, the power module 7 is used to power the system, and the data storage module 8 is used to store system data and collected data. ;

[0038] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. An adaptive heat dissipation system for stage lights based on a temperature equalizing plate, comprising a light board (1), a temperature equalizing plate body (11), a semiconductor refrigerator body (12), a heat sink body (13), a copper tube (14) and a fan body (15), characterized in that: The upper surface of the lamp board (1) is fixedly connected to a temperature equalizing plate body (11), the upper surface of the temperature equalizing plate body (11) is fixedly connected to a semiconductor refrigerator body (12), the upper surface of the temperature equalizing plate body (11) is fixedly connected to a copper tube (14), the copper tube (14) is fixedly connected to a heat sink body (13), a fan body (15) is arranged at the top of the semiconductor refrigerator body (12), and the fan body (15) and the semiconductor refrigerator body (12) are both electrically connected to the lamp board (1).

2. The stage light adaptive heat dissipation system based on a temperature vapor chamber according to claim 1, characterized in that: The lamp board (1) is electrically connected to a data processing module (3), the data processing module (3) is electrically connected to a data acquisition module (2), a PWM signal generation module (4), a communication module (6), a power module (7) and a data storage module (8), the PWM signal generation module (4) is electrically connected to a drive module (5), and the drive module (5) is electrically connected to a fan body (15) and a semiconductor refrigerator body (12), respectively; the data acquisition module (2) is used to collect data, the data processing module (3) is used to analyze and process data and issue control instructions, the PWM signal generation module (4) is used to generate a PWM signal, the communication module (6) is used to establish a data connection with an external device, the power module (7) is used to supply power to the system, and the data storage module (8) is used to store collected data and system data.

3. The stage light adaptive heat dissipation system based on a temperature vapor chamber according to claim 2, characterized in that: The data acquisition module (2) comprises a temperature data acquisition unit (21), an air flow rate data acquisition unit (22), a fan speed data acquisition unit (23) and a power data acquisition unit (24).

4. The stage light adaptive heat dissipation system based on a temperature vapor chamber according to claim 3, characterized in that: The temperature data acquisition unit (21) is used to acquire temperature data at the monitoring location, the air flow rate data acquisition unit (22) is used to acquire air flow rate data at the monitoring location, the fan speed data acquisition unit (23) is used to acquire fan speed data, and the power data acquisition unit (24) is used to acquire actual power data of the component.

5. The stage light adaptive heat dissipation system based on a temperature vapor chamber according to claim 2, characterized in that: The data processing module (3) comprises a comprehensive control submodule (31), a heat dissipation performance evaluation submodule (32), a component performance evaluation submodule (33) and an evaluation report generation submodule (34), wherein the comprehensive control submodule (31) is used to generate a comprehensive control instruction, the heat dissipation performance evaluation submodule (32) is used to evaluate the heat dissipation performance of the system, the component performance evaluation submodule (33) is used to evaluate the performance of the heat dissipation component when the heat dissipation performance of the system is poor, and the evaluation report generation submodule (34) is used to generate an evaluation report based on the evaluation results of the component performance evaluation submodule (33).

6. The stage light adaptive heat dissipation system based on a temperature vapor chamber according to claim 5, characterized in that: The integrated control submodule (31) is electrically connected to the data acquisition module (2), the fan body (15) and the semiconductor refrigerator body (12), respectively; the heat dissipation performance evaluation submodule (32) is electrically connected to the data storage module (8) and the component performance evaluation submodule (33), respectively; the component performance evaluation submodule (33) is electrically connected to the evaluation report generation submodule (34), and the evaluation report generation submodule (34) is electrically connected to the communication module (6).

7. The stage light adaptive heat dissipation system based on a temperature vapor chamber according to claim 6, characterized in that: The integrated control submodule (31) comprises a fan control unit (311) and a semiconductor refrigerator control unit (312), wherein the fan control unit (311) is used to generate a fan control instruction, and the semiconductor refrigerator control unit (312) is used to generate a semiconductor refrigerator control instruction.

8. The stage light adaptive heat dissipation system based on a temperature vapor chamber according to claim 7, characterized in that: The algorithm formula adopted by the comprehensive control submodule (31) is as follows: C total =ω T ×C T +oh P ×C P Among them, C total is the comprehensive control quantity, C T is the control quantity obtained based on temperature, C P is the control quantity based on power acquisition, ω T is the weight of the control quantity obtained based on temperature, ω P is the weight of the control quantity based on power acquisition; and ω T +ω P =1; C T =k T ×ΔT C P =k P ×ΔP Among them, k T is the temperature control coefficient, k P is the power control coefficient, ΔT is the deviation between the actual temperature and the ideal temperature, and ΔP is the deviation between the actual power and the ideal power.

9. The stage light adaptive heat dissipation system based on a temperature vapor chamber according to claim 6, characterized in that: The heat dissipation performance evaluation submodule (32) comprises a data acquisition unit (321), a calculation unit (322) and a judgment unit (323); the data acquisition unit (321) is used to acquire historical data of the heat dissipation system; the calculation unit (322) is used to calculate the energy consumption of the heat dissipation system and the corresponding temperature change; and the judgment unit (323) is used to evaluate the heat dissipation performance of the heat dissipation system according to the calculation result of the calculation unit (322).

10. The stage light adaptive heat dissipation system based on a temperature vapor chamber according to claim 6, characterized in that: The component performance evaluation submodule (33) includes a temperature equalizing plate performance evaluation unit (331), a semiconductor refrigerator performance evaluation unit (332), a heat sink performance evaluation unit (333), a fan performance evaluation unit (334) and an air duct patency evaluation unit (335), wherein the temperature equalizing plate performance evaluation unit (331) is used to evaluate the heat conduction efficiency of the temperature equalizing plate, the semiconductor refrigerator performance evaluation unit (332) is used to evaluate the cooling effect, the heat sink performance evaluation unit (333) is used to evaluate the heat conduction efficiency of the heat sink, the fan performance evaluation unit (334) is used to evaluate the fan performance, and the air duct patency evaluation unit (335) is used to evaluate whether the air duct is blocked.

Images