A spectrometer

Abstract

The present application discloses a spectrometer, which includes a light source module, a spectrum modulation module, a probe module and a circuit module. The light source module, the spectrum modulation module and the probe module are all connected to the circuit module through electrical connecting lines. The light source module is connected to the spectrum modulation module through a first single-mode optical fiber, and the spectrum modulation module is connected to the probe module through a second single-mode optical fiber. The light source module is used to provide an input light signal to the spectrum modulation module through the first single-mode optical fiber under the drive of an electrical signal from the circuit module. The spectrum modulation module is used to phase-modulate the input light signal to obtain a modulated light signal under the drive of the electrical signal from the circuit module, and provide the modulated light signal to the probe module through the second single-mode optical fiber. The probe module is used to detect an object to be measured based on the modulated light signal to obtain an electrical signal and feed the electrical signal back to the circuit module through the electrical connecting line. The circuit module is used to process the electrical signal provided by the probe module to obtain spectrum detection information.

Description

Technical Field

[0001] The present application relates to the technical field of spectrometers, and in particular, to a spectrometer. Background Art

[0002] Near-infrared spectroscopy is an important means of analyzing material composition and is widely used in fields such as rapid detection of material composition and online monitoring of industrial production. In addition, non-invasive detection of human biological information content such as blood lactate concentration and blood glucose concentration based on near-infrared spectroscopy is also an emerging detection technology with large-scale application needs.

[0003] With the continuous advancement of spectral analysis technology, spectrometers are gradually developing towards miniaturization and increasing their integration. Computational reconstruction spectrometers based on planar optical waveguide chips are a high-resolution, small-sized miniature spectrometer solution that can be widely used in various portable and wearable applications.

[0004] For example, a spectral sensing module solution currently uses micro-assembly to integrate and package a light source chip, a spectral chip, and a detector chip. This allows the module to be packaged in millimeter-scale dimensions, making it suitable for use in smart wearable applications. However, this spectral sensing module solution suffers from significant drawbacks, including poor performance and complex packaging, testing, and manufacturing processes.

[0005] Therefore, there is an urgent need for a miniature spectrometer with better performance and simpler packaging / testing / manufacturing process. Summary of the Invention

[0006] The present application aims to solve one of the technical problems in the related art to a certain extent. To this end, the present application provides a spectrometer.

[0007] As a first aspect of the present application, a spectrometer is provided, comprising a light source module, a spectrum modulation module, a probe module, and a circuit module, wherein the light source module, the spectrum modulation module, and the probe module are all connected to the circuit module via electrical connecting wires, the light source module is connected to the spectrum modulation module via a first single-mode optical fiber, and the spectrum modulation module is connected to the probe module via a second single-mode optical fiber;

[0008] The light source module is configured to provide an input optical signal to the spectrum modulation module through the first single-mode optical fiber under the drive of the electrical signal of the circuit module;

[0009] The spectrum modulation module is used to, under the drive of the electrical signal of the circuit module, perform phase modulation on the input optical signal to obtain a modulated optical signal, and provide the modulated optical signal to the probe module through the second single-mode optical fiber;

[0010] The probe module is used to detect the object to be measured according to the modulated optical signal to obtain an electrical signal, and feed the electrical signal back to the circuit module through the electrical connection line;

[0011] The circuit module is used to drive the light source module and the spectrum modulation module with electrical signals through the electrical connection lines, and to obtain spectrum detection information by processing the electrical signals provided by the probe module.

[0012] Optionally, the light source module, the spectrum modulation module and the probe module are respectively arranged on different electrical adapter boards, and the light source module, the spectrum modulation module and the probe module are electrically connected to the corresponding electrical adapter boards through their respective electrical signal pins, and each electrical adapter board is connected to the circuit module through the electrical connecting line.

[0013] Optionally, at least one of the light source module, the spectrum modulation module and the probe module is packaged together with the circuit module.

[0014] Optionally, the spectrometer also includes a multi-core fiber fan-in module, the light source module includes a single light source chip, the light source module and the spectrum modulation module each include multiple, each light source module and each spectrum modulation module are connected one-to-one through each first single-mode optical fiber, each spectrum modulation module is connected to the input end of the multi-core fiber fan-in module through each second single-mode optical fiber, and the output end of the multi-core fiber fan-in module is connected to the probe module through the second single-mode optical fiber.

[0015] Optionally, the light source module includes a plurality of light source chips packaged together.

[0016] Optionally, the probe module includes a beam converter and a photodetector, the beam converter is used to convert the modulated light signal into an output light signal, and the photodetector is used to receive the reflected light signal generated when the output light signal is irradiated on the object to be measured, and obtain the electrical signal based on the reflected light signal.

[0017] Optionally, the beam converter includes an optical fiber and a fiber collimator, and the type of the lens in the fiber collimator includes a collimating lens or a self-focusing lens.

[0018] Optionally, the spectrum modulation module includes a spectrum modulation chip, the spectrum modulation chip includes a plurality of cascaded active tunable spectrum units, and the plurality of active tunable spectrum units include any one of the following or a combination thereof: a microring resonator, a Mach-Zehnder interferometer (MZI).

[0019] Optionally, the spectrum modulation chip further includes a phase modulation structure respectively provided on each of the active tunable spectrum units;

[0020] The circuit module is further configured to perform electrical signal control on each of the phase modulation structures via the electrical connection line;

[0021] The phase modulation structure is used to perform phase modulation on the input optical signal passing through the corresponding active tunable spectrum unit under the control of the electrical signal of the circuit module.

[0022] Optionally, the light source module includes a super luminescent diode (SLED).

[0023] The spectrometer provided by the present application, by using a single-mode optical fiber to construct an optical interface, independently encapsulates a light source module, a spectrum modulation module and a probe module, and electrically connects the light source module, the spectrum modulation module and the probe module to the circuit module. At the same time, a first single-mode optical fiber is used to connect the light source module and the spectrum modulation module, and a second single-mode optical fiber is used to connect the spectrum modulation module and the probe module. In this way, the light source module, the spectrum modulation module and the probe module can be driven and controlled by the circuit module. Through the single-mode optical fiber, the optical signal is transmitted and the electrical signal is fed back through the electrical connection line to complete the spectrum detection of the object to be measured. In addition, the distance between each module is no longer restricted, so that it can be further freely assembled, making the overall packaging form of the spectrometer more free, which can improve the packaging freedom of the spectrometer, make the spectrometer suitable for various application scenarios with different sizes of spectrometer miniaturization requirements, and reduce the complexity of the packaging / testing / manufacturing process. In application scenarios with smaller miniaturization requirements such as portable spectrometers, it can also avoid the problem of mutual interference in the packaging process and the problem of thermal crosstalk during use, which is conducive to heat dissipation and thus improves the performance of the spectrometer. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present application will be further described below with reference to the accompanying drawings:

[0025] Figure 1 Schematic diagram of an embodiment of the spectrometer provided in the examples of the present application;

[0026] Figure 2 Schematic diagram of another embodiment of the spectrometer provided in the embodiment of the present application;

[0027] Figure 3 This is a schematic diagram of an implementation method of one-to-one connection of multiple light source modules and multiple spectrum modulation modules provided in an embodiment of the present application;

[0028] Figure 4 is a schematic diagram of an implementation of a probe module provided in an embodiment of the present application;

[0029] Figure 5is a schematic diagram of another embodiment of the probe module provided in the embodiment of the present application;

[0030] Figure 6 Schematic diagram of the architecture of the spectrum modulation chip provided in an embodiment of the present application;

[0031] Figure 7 Schematic diagram of an embodiment of the spectrum modulation chip provided in the examples of the present application;

[0032] Figure 8 Schematic diagram of another embodiment of the spectrum modulation chip provided in the embodiment of the present application;

[0033] Figure 9 This is a schematic diagram of another embodiment of the spectral modulation chip provided in the examples of the present application. DETAILED DESCRIPTION

[0034] The embodiments of the present application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described in the embodiments are intended to be used to explain the present application and are not to be construed as limiting the present application.

[0035] In the description of this application, it should be understood that the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0036] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0037] In the description of the present invention, unless otherwise specified, “a plurality of” means two or more, and “a number of” means one or more.

[0038] References in this specification to "one embodiment," "an example," or "an example" mean that a particular feature, structure, or characteristic described in connection with the embodiment itself can be included in at least one embodiment disclosed herein. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment.

[0039] Near-infrared spectroscopy is an important means of analyzing material composition and is widely used in fields such as rapid detection of material composition and online monitoring of industrial production. In addition, non-invasive detection of human biological information content such as blood lactate concentration and blood glucose concentration based on near-infrared spectroscopy is also an emerging detection technology with large-scale application needs.

[0040] With the continuous advancement of spectral analysis technology, spectrometers are gradually developing towards miniaturization and increasing their integration. Computational reconstruction spectrometers based on planar optical waveguide chips are a high-resolution, small-sized miniature spectrometer solution that can be widely used in various portable and wearable applications.

[0041] For example, a spectral sensing module solution currently uses micro-assembly to integrate and package a light source chip, a spectral chip, and a detector chip. This allows the module to be packaged in millimeter-scale dimensions, making it suitable for use in smart wearable applications. However, this spectral sensing module solution suffers from significant drawbacks, including poor performance and complex packaging, testing, and manufacturing processes.

[0042] After conducting in-depth and detailed research on the aforementioned spectral sensing module solution, the applicant of this application discovered that although it can achieve a millimeter-scale package volume for the spectral sensing module by co-packaging the light source chip, spectral chip, and detector chip, it suffers from serious drawbacks such as poor performance and a complex packaging / testing / manufacturing process, which are precisely caused by this packaging method. On the one hand, the spectral sensing module is extremely small, so only a small-sized heat sink can be used, which is not conducive to heat dissipation and, in turn, is not conducive to increasing optical power. On the other hand, the chips are very close to each other, resulting in thermal crosstalk between them, making it difficult to independently and accurately control the temperature of each chip, thereby reducing the signal-to-noise ratio of the sensor. On the other hand, this packaging method inevitably places higher process requirements, making the packaging / testing / manufacturing process more complex, which in turn reduces the manufacturing yield.

[0043] Based on the above key findings, the applicant of this application has innovatively proposed that, compared with wearable application scenarios, most portable application scenarios do not have such extreme requirements for the miniaturization of spectrometers. If the packaging freedom between the light source chip, the spectrum chip, and the detector chip can be improved, the spectrometer can be suitable for various application scenarios with different sizes of spectrometer miniaturization requirements, and the complexity of the packaging / testing / manufacturing process can be reduced. In application scenarios with smaller miniaturization requirements for spectrometers such as portable ones, it can also avoid mutual interference problems in the packaging process and thermal crosstalk problems during use, which is conducive to heat dissipation and thus improves the performance of the spectrometer.

[0044] The applicant of this application further proposed that a single-mode optical fiber can be used to construct an optical interface, independently encapsulate the light source module, spectrum modulation module and probe module, and electrically connect the light source module, spectrum modulation module and probe module to the circuit module. At the same time, a first single-mode optical fiber is used to connect the light source module and the spectrum modulation module, and a second single-mode optical fiber is used to connect the spectrum modulation module and the probe module. Each module transmits optical signals through a single-mode optical fiber under the control of the circuit module, which can make the overall packaging form of the spectrometer more flexible.

[0045] As a first aspect of the embodiment of the present application, Figure 1 As shown, a spectrometer is provided, which includes a light source module, a spectrum modulation module, a probe module and a circuit module, wherein the light source module, the spectrum modulation module and the probe module are all connected to the circuit module through electrical connecting lines, the light source module is connected to the spectrum modulation module through a first single-mode optical fiber, and the spectrum modulation module is connected to the probe module through a second single-mode optical fiber;

[0046] The light source module is configured to provide an input optical signal to the spectrum modulation module through the first single-mode optical fiber under the drive of the electrical signal of the circuit module;

[0047] The spectrum modulation module is used to, under the drive of the electrical signal of the circuit module, perform phase modulation on the input optical signal to obtain a modulated optical signal, and provide the modulated optical signal to the probe module through the second single-mode optical fiber;

[0048] The probe module is used to detect the object to be measured according to the modulated optical signal to obtain an electrical signal, and feed the electrical signal back to the circuit module through the electrical connection line;

[0049] The circuit module is used to drive the light source module and the spectrum modulation module with electrical signals through the electrical connection lines, and to obtain spectrum detection information by processing the electrical signals provided by the probe module.

[0050] It should be understood that the terms "first" and "second" are merely used to distinguish between the single-mode optical fiber connecting the light source module and the spectrum modulation module and the single-mode optical fiber connecting the spectrum modulation module and the probe module. The present embodiment of the present application does not impose any specific restrictions on whether the specifications and parameters of the first single-mode optical fiber and the second single-mode optical fiber are the same or different.

[0051] It can be understood that the light source module, spectrum modulation module and probe module are packaging modules of the light source chip, spectrum modulation chip and detector chip respectively, and the spectrum modulation chip can be a planar single-mode optical waveguide chip.

[0052] The wavelength band of the light source provided by the light source module may be determined according to the actual application scenario or the type of the object to be measured, and the embodiments of the present application do not impose any special limitation on this.

[0053] The circuit module may include a driver submodule and a signal processing submodule. The driver submodule specifically implements the electrical signal driving of the light source module and the spectrum modulation module via electrical connection lines, and the signal processing submodule specifically implements the processing of the electrical signal provided by the probe module to obtain spectral detection information. Furthermore, the functions of the circuit module in the embodiments of the present application are not limited to these functions. The circuit module may also include other submodules for implementing functions such as temperature control, data transmission, and power management.

[0054] The spectrometer provided in the embodiment of the present application uses a single-mode optical fiber to construct an optical interface, independently encapsulates a light source module, a spectrum modulation module, and a probe module, and electrically connects the light source module, the spectrum modulation module, and the probe module to the circuit module. At the same time, a first single-mode optical fiber is used to connect the light source module and the spectrum modulation module, and a second single-mode optical fiber is used to connect the spectrum modulation module and the probe module. In this way, the light source module, the spectrum modulation module, and the probe module can be driven and controlled by the circuit module to transmit optical signals through the single-mode optical fiber and feedback electrical signals through the electrical connection line to complete the spectrum detection of the object to be measured. In addition, the distance between each module is no longer restricted, so that it can be further freely assembled, making the overall packaging form of the spectrometer more free, which can improve the packaging freedom of the spectrometer and make the spectrometer suitable for various application scenarios with different sizes of spectrometer miniaturization requirements, and reduce the complexity of the packaging / testing / manufacturing process. In application scenarios with less miniaturization requirements for spectrometers such as portable spectrometers, it can also avoid the problem of mutual interference in the packaging process and the problem of thermal crosstalk during use, which is conducive to heat dissipation and thus improves the performance of the spectrometer.

[0055] The applicant of this application further proposes that for application scenarios with low miniaturization requirements for spectrometers, the light source module, spectrum modulation module, probe module and circuit module do not need to be assembled together. In this case, the light source module, spectrum modulation module and probe module can be respectively set on different electrical adapter boards and electrically connected to the circuit module through the electrical adapter boards. Accordingly, in some embodiments, such as Figure 2 As shown, the light source module, the spectrum modulation module and the probe module are respectively arranged on different electrical adapter boards, and the light source module, the spectrum modulation module and the probe module are electrically connected to the corresponding electrical adapter boards through their respective electrical signal pins, and each electrical adapter board is connected to the circuit module through the electrical connecting line.

[0056] The spectrometer provided in the embodiment of the present application arranges the light source module, the spectrum modulation module and the probe module on different electrical adapter boards respectively, electrically connects the light source module, the spectrum modulation module and the probe module to the corresponding electrical adapter boards through their respective electrical signal pins, and connects each electrical adapter board to the circuit module through electrical connecting lines, so that the spectrometer can be suitable for application scenarios with low requirements for miniaturization of the spectrometer, reduces the complexity of the packaging / testing / manufacturing process, avoids mutual interference problems during the packaging process and thermal crosstalk problems during use, is conducive to heat dissipation, and thus improves the performance of the spectrometer.

[0057] The applicant of this application further proposes that for applications requiring high miniaturization of the spectrometer, some or all of the light source module, spectrum modulation module, and probe module can be directly packaged together with the circuit module. Accordingly, in some embodiments, at least one of the light source module, spectrum modulation module, and probe module is packaged together with the circuit module.

[0058] Among them, for the modules in the light source module, spectral modulation module and probe module that are not packaged together with the circuit module, they can be set on the electrical adapter board, their electrical signal pins can be electrically connected to the electrical adapter board, and the electrical adapter board can be connected to the circuit module through electrical connecting lines.

[0059] The spectrometer provided in the embodiment of the present application, by packaging at least one of the light source module, the spectral modulation module and the probe module together with the circuit module, makes the spectrometer suitable for application scenarios with high requirements for spectrometer miniaturization, and can take into account the requirements for miniaturization of the spectrometer, reduce the complexity of the packaging / testing / manufacturing process, and improve the performance of the spectrometer.

[0060] The applicant of this application further proposes that, in order to improve the spectrum modulation effect, the light source module and the spectrum modulation module may include multiple, and each light source module and each spectrum modulation module are connected one-to-one through each first single-mode optical fiber. Accordingly, in some embodiments, the spectrometer further includes a multi-core optical fiber fan-in module, the light source module includes a single light source chip, and the light source module and the spectrum modulation module both include multiple, such as Figure 3 As shown, each light source module and each spectral modulation module are connected one-to-one through each first single-mode optical fiber, each spectral modulation module is connected to the input end of the multi-core fiber fan-in module through each second single-mode optical fiber, and the output end of the multi-core fiber fan-in module is connected to the probe module through the second single-mode optical fiber.

[0061] The applicant of this application also proposes that, in addition to packaging a single light source chip into a light source module and employing multiple light source modules and multiple spectrum modulation modules, the spectrum modulation effect can also be improved by collectively packaging multiple light source chips into a single light source module and providing an input optical signal to the single spectrum modulation module via a single first single-mode optical fiber. Accordingly, in some embodiments, the light source module includes multiple light source chips packaged together.

[0062] The applicant of this application further proposes that, in addition to including a photodetector, the probe module can also use a beam converter to change the spatial distribution of the light beam to adapt to various application scenarios requiring beam directionality. Accordingly, in some embodiments, the probe module includes a beam converter and a photodetector. The beam converter is used to convert the modulated light signal into an output light signal, and the photodetector is used to receive the reflected light signal generated by the output light signal irradiating the object to be measured, and convert the reflected light signal into the electrical signal.

[0063] In the embodiment of the present application, for application scenarios with low requirements on the directionality of the light beam, optical fiber can be used for direct illumination, that is, the optical fiber can be directly used as a light beam converter.

[0064] For applications requiring higher beam directionality, such as those requiring collimation and beam expansion, a fiber collimator can also be used. The lens type in the fiber collimator can include a collimating lens or a grinlens. Accordingly, in some embodiments, the beam converter includes an optical fiber and a fiber collimator. The lens type in the fiber collimator can include a collimating lens or a grinlens.

[0065] like Figure 4The figure shows a schematic diagram of an embodiment of the probe module provided in the embodiment of the present application, wherein the probe module includes a beam converter and a photodetector, the beam converter includes an optical fiber and a fiber collimator, and the type of lens in the fiber collimator includes a collimating lens. The modulated light signal enters the fiber collimator through the optical fiber, is collimated by the collimating lens, and is output and irradiated onto the surface of the object to be measured to generate a reflected light signal. The photodetector receives the reflected light signal and converts it into an electrical signal.

[0066] like Figure 5 The figure shows another embodiment of the probe module provided in the embodiment of the present application, wherein the probe module includes a beam converter and a photodetector. The beam converter includes an optical fiber and a fiber collimator. The type of lens in the fiber collimator includes a self-focusing lens. The modulated light signal enters the fiber collimator through the optical fiber, is refracted by the self-focusing lens, and is output to the surface of the object to be measured to generate a reflected light signal. The photodetector receives the reflected light signal and converts it into an electrical signal.

[0067] It should be noted that Figure 4 、 Figure 5 What is shown is only an exemplary description. The embodiment of the present application is not limited to the number of photoelectric detectors in the probe module being 2, and the specific setting can be made according to the actual application scenario.

[0068] like Figure 6 As shown, in some embodiments, the spectral modulation module includes a spectral modulation chip, and the spectral modulation chip includes a plurality of cascaded active tunable spectral units, and the plurality of active tunable spectral units include any one of the following or a combination thereof: a microring resonator, a Mach-Zehnder interferometer MZI.

[0069] In some embodiments, the spectrum modulation chip also includes a phase modulation structure respectively arranged on each of the active tunable spectrum units; the circuit module is also used to perform electrical signal control on each of the phase modulation structures through the electrical connection line; the phase modulation structure is used to phase modulate the input optical signal passing through the corresponding active tunable spectrum unit under the electrical signal control of the circuit module.

[0070] like Figure 7 , which is a schematic diagram of an implementation of a spectral modulation chip provided in an embodiment of the present application, wherein four Mach-Zehnder interferometers MZI are cascaded in the spectral modulation chip, and two phase modulation structures are arranged on each Mach-Zehnder interferometer MZI.

[0071] like Figure 8As shown, it is a schematic diagram of another embodiment of the spectral modulation chip provided in an embodiment of the present application, wherein three Mach-Zehnder interferometers MZI and one microring resonator are cascaded in the spectral modulation chip, and two phase modulation structures are arranged on each Mach-Zehnder interferometer MZI, and one phase modulation structure is arranged on each microring resonator.

[0072] like Figure 9 , which is a schematic diagram of another embodiment of the spectral modulation chip provided in an embodiment of the present application, wherein four microring resonators are cascaded in the spectral modulation chip, and a phase modulation structure is arranged on each microring resonator.

[0073] It can be seen that the embodiment of the present application does not impose any special limitation on the number of phase modulation structures provided on each active tunable spectrum unit, and can be either one or two.

[0074] It should be noted that Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 What is shown is only an exemplary description. The embodiment of the present application is not limited to the number of multiple active tunable spectral units cascaded in the spectral modulation chip being 3 or 4, and can be specifically set according to the modulation principle actually required by the spectrometer.

[0075] In some embodiments, the light source module includes a superluminescent diode (SLED).

[0076] The above are only specific embodiments of the present application, but the scope of protection of the present application is not limited thereto. Those skilled in the art should understand that the present application includes but is not limited to the contents described in the drawings and the above specific embodiments. Any modifications that do not deviate from the functional and structural principles of the present application are included within the scope of the claims.

Claims

1. A spectrometer, comprising a light source module, a spectrum modulation module, a probe module and a circuit module, characterized in that: The light source module, the spectrum modulation module and the probe module are all connected to the circuit module via electrical connection lines, the light source module is connected to the spectrum modulation module via a first single-mode optical fiber, and the spectrum modulation module is connected to the probe module via a second single-mode optical fiber; The light source module is configured to provide an input optical signal to the spectrum modulation module through the first single-mode optical fiber under the drive of the electrical signal of the circuit module; The spectrum modulation module is used to, under the drive of the electrical signal of the circuit module, perform phase modulation on the input optical signal to obtain a modulated optical signal, and provide the modulated optical signal to the probe module through the second single-mode optical fiber; The probe module is used to detect the object to be measured according to the modulated optical signal to obtain an electrical signal, and feed the electrical signal back to the circuit module through the electrical connection line; The circuit module is used to drive the light source module and the spectrum modulation module with electrical signals through the electrical connection line, and to process the electrical signals provided by the probe module to obtain spectrum detection information. The light source module, the spectrum modulation module and the probe module are respectively arranged on different electrical adapter boards. The light source module, the spectrum modulation module and the probe module are electrically connected to the corresponding electrical adapter boards through their respective electrical signal pins, and each electrical adapter board is connected to the circuit module through the electrical connecting line.

2. The spectrometer according to claim 1, wherein At least one of the light source module, the spectrum modulation module and the probe module is packaged together with the circuit module.

3. The spectrometer according to claim 1, wherein The spectrometer also includes a multi-core fiber fan-in module, the light source module includes a single light source chip, and the light source module and the spectrum modulation module both include multiple ones. Each of the light source modules and the spectrum modulation modules are connected one-to-one through each of the first single-mode optical fibers. Each of the spectrum modulation modules is connected to the input end of the multi-core fiber fan-in module through each of the second single-mode optical fibers, and the output end of the multi-core fiber fan-in module is connected to the probe module through the second single-mode optical fiber.

4. The spectrometer according to claim 1, wherein The light source module includes a plurality of light source chips packaged together.

5. The spectrometer according to any one of claims 1 to 4, characterized in that The probe module includes a beam converter and a photodetector. The beam converter is used to convert the modulated light signal into an output light signal. The photodetector is used to receive the reflected light signal generated when the output light signal is irradiated on the object to be measured, and obtain the electrical signal based on the reflected light signal.

6. The spectrometer according to claim 5, characterized in that The beam converter includes an optical fiber and an optical fiber collimator. The type of lens in the optical fiber collimator includes a collimating lens or a self-focusing lens.

7. The spectrometer according to any one of claims 1 to 4, characterized in that The spectrum modulation module includes a spectrum modulation chip, which includes a plurality of cascaded active tunable spectrum units. The plurality of active tunable spectrum units include any one of the following or a combination thereof: a microring resonator and a Mach-Zehnder interferometer (MZI).

8. The spectrometer according to claim 7, characterized in that The spectrum modulation chip further includes a phase modulation structure respectively provided on each of the active tunable spectrum units; The circuit module is further configured to perform electrical signal control on each of the phase modulation structures via the electrical connection line; The phase modulation structure is used to perform phase modulation on the input optical signal passing through the corresponding active tunable spectrum unit under the control of the electrical signal of the circuit module.

9. The spectrometer according to any one of claims 1 to 4, characterized in that The light source module includes a superluminescent diode (SLED).

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