Heat source simulation device for maintaining thermal contact resistance of jet flow micro-channel heat exchanger

Abstract

The invention discloses a heat source simulation device for maintaining thermal contact resistance of a jet flow micro-channel heat exchanger, which comprises a base, a heater is arranged on the base, a heating rod is arranged in the heater, the top end of the heater is connected with a heat collection column, the top end of the heat collection column is connected with the jet flow micro-channel heat exchanger, and the jet flow micro-channel heat exchanger is connected with the base. And a heat exchanger packaging piece is mounted at the top end of the jet flow micro-channel heat exchanger. The device can accurately simulate heat flow density distribution under actual working conditions, provides a stable heat source, has the capacity of quick response and accurate control, adapts to different experimental conditions, is simple in structure, is easy to integrate with an existing experimental system, and facilitates measurement and analysis of contact thermal resistance.

Description

Technical Field

[0001] The invention relates to the technical field of jet microchannel heat exchanger experiments, in particular to a heat source simulation device for maintaining the contact thermal resistance of a jet microchannel heat exchanger. Background Art

[0002] In modern industry and scientific research, the research and application of heat dissipation technology has received increasing attention. Especially with the continuous development of aerospace, electronic cooling and new energy technologies, the power of electronic equipment has continued to increase with the improvement of performance, and the heat generated per unit area has also increased. Therefore, the heat dissipation problem of high heat flux density has become more and more important. Heat transfer heat dissipation methods such as air cooling, wind cooling, liquid cooling, and heat pipes have been difficult to meet the needs of electronic equipment with higher and higher power.

[0003] The jet microchannel heat exchanger has become one of the important solutions in the heat dissipation technology of high-power electronic equipment with its efficient thermal conductivity, compact size and lightweight design. In order to meet the increasingly high heat dissipation requirements of high-power electronic equipment in the future, the heat transfer performance of the jet microchannel heat exchanger is verified. People need to do a lot of heat dissipation experiments on the heat exchanger, judge whether the junction temperature of the high-power electronic equipment meets the requirements based on the experimental results, and make further structural optimization to improve the heat transfer performance of the jet microchannel heat exchanger. This requires a very accurate experimental result, and the accuracy of the experimental result depends largely on the design of the heat source simulation device that meets the different heat flux densities of the experimental system.

[0004] When simulating actual heat flux density conditions, existing heat source simulation devices will have a large contact thermal resistance due to the surface flatness, surface roughness, and fastening pressure between the heater and the heat exchanger of the experimental system. Although interface materials such as thermal grease can be used to reduce the thermal resistance between the contact surfaces, experiments generally need to simulate the heat transfer performance of the heat exchanger under different heat flux densities. The heater will expand and contract due to different heat flux densities. The thermal expansion and contraction of the heater will cause large fluctuations in the contact thermal resistance between the contact surface of the heater and the jet microchannel heat exchanger, making it difficult for the experimental system to accurately simulate and control the distribution of heat flux density, resulting in large experimental errors during the experiment. Summary of the invention

[0005] Therefore, the purpose of the present invention is to provide a heat source simulation device for maintaining the contact thermal resistance of a jet microchannel heat exchanger, which can accurately simulate the heat flux density distribution under actual working conditions, provide a stable heat source, have the ability of rapid response and precise control, adapt to different experimental conditions, have a simple structure, and is easy to integrate with existing experimental systems, facilitating the measurement and analysis of contact thermal resistance.

[0006] To solve the above technical problems, according to one aspect of the present invention, the present invention provides the following technical solution: a heat source simulation device for maintaining the contact thermal resistance of a jet microchannel heat exchanger, comprising a base, a heater is provided on the base, and a heating rod is installed inside the heater, the top of the heater is connected to a heat collecting column, the top of the heat collecting column is connected to a jet microchannel heat exchanger, and a heat exchanger package is installed at the top of the jet microchannel heat exchanger.

[0007] As a preferred solution of the heat source simulation device for maintaining the contact thermal resistance of the jet microchannel heat exchanger described in the present invention, bolts are passed through between the base and the heat exchanger package, and nuts are connected to the ends of the bolts.

[0008] As a preferred solution of the heat source simulation device for maintaining the contact thermal resistance of the jet microchannel heat exchanger described in the present invention, a spring is sleeved between the heat exchanger package and the end face of the bolt.

[0009] As a preferred solution of the heat source simulation device for maintaining the contact thermal resistance of the jet microchannel heat exchanger described in the present invention, a heater thermocouple reserved hole is opened on the surface of the heat collecting column; The heater thermocouple reserved holes are provided with a plurality of holes.

[0010] As a preferred solution of the heat source simulation device for maintaining the contact thermal resistance of a jet microchannel heat exchanger described in the present invention, a heat exchanger thermocouple pre-hole is opened on the surface of the jet microchannel heat exchanger, and a plurality of the heat exchanger thermocouple pre-holes are arranged.

[0011] As a preferred solution of the heat source simulation device for maintaining the contact thermal resistance of the jet microchannel heat exchanger described in the present invention, there is a contact surface between the heater and the jet microchannel heat exchanger.

[0012] As a preferred solution of the heat source simulation device for maintaining the contact thermal resistance of the jet microchannel heat exchanger described in the present invention, the heater is externally wrapped with thermal insulation cotton.

[0013] As a preferred solution of a heat source simulation device for maintaining the contact thermal resistance of a jet microchannel heat exchanger described in the present invention, thermocouples are adhered to the thermocouple reserved holes of the heater and the thermocouple reserved holes of the heat exchanger, and the thermocouples and the reserved holes of the jet microchannel heat exchanger are connected using high-temperature resistant glue. The thermocouples passing through can detect the temperatures of different areas at the bottom of the jet microchannel heat exchanger, thereby detecting the uniformity of the temperature of the heating surface of the jet microchannel heat exchanger.

[0014] Compared with the prior art, the advantages of the present invention are: It can accurately simulate the heat flux density distribution under actual working conditions, provide a stable heat source, have the ability of rapid response and precise control, adapt to different experimental conditions, have a simple structure, and is easy to integrate with the existing experimental system, facilitating the measurement and analysis of contact thermal resistance. DETAILED DESCRIPTION

[0015] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0016] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0017] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional diagram showing the device structure will not be partially enlarged according to the general scale, and the schematic diagram is only an example, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional space dimensions of length, width and depth should be included.

[0018] In order to make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0019] The present invention provides a heat source simulation device for maintaining the contact thermal resistance of a jet microchannel heat exchanger, which can accurately simulate the heat flux density distribution under actual working conditions, provide a stable heat source, have the ability of rapid response and precise control, adapt to different experimental conditions, have a simple structure, and is easy to integrate with existing experimental systems, so as to facilitate the measurement and analysis of the contact thermal resistance.

[0020] Figure 1-5 The figure shows the overall structure of a heat source simulation device for maintaining the contact thermal resistance of a jet microchannel heat exchanger according to an embodiment of the present invention. Figure 1-5 The main structure of this embodiment includes a base 1, a heater 3 is arranged on the base 1, and a heating rod 4 is installed inside the heater 3, a heat collecting column 5 is connected to the top of the heater 3, a jet microchannel heat exchanger 8 is connected to the top of the heat collecting column 5, and a heat exchanger package 9 is installed on the top of the jet microchannel heat exchanger 8; A bolt 2 is passed through between the base 1 and the heat exchanger package 9, and a nut is connected to the end of the bolt 2; A spring 10 is sleeved between the heat exchanger package 9 and the end surface of the bolt 2; The surface of the heat collecting column 5 is provided with a heater thermocouple reserved hole 6; a plurality of heater thermocouple reserved holes 6 are provided; The surface of the jet microchannel heat exchanger 8 is provided with heat exchanger thermocouple reserved holes 7, and a plurality of heat exchanger thermocouple reserved holes 7 are provided, and the distributed heat exchanger thermocouple reserved holes 7 are numbered as follows: 7-1, 7-2, 7-3, 7-4, 7-5.

[0021] There is a contact surface 11 between the heater 3 and the jet microchannel heat exchanger 8; The heating rod 4 is responsible for generating a controllable heat flux density. The heater 3 is used to concentrate the heat of the heating rod 4 on a surface and transfer the heat to the bottom surface of the jet microchannel heat exchanger 8. The thermocouple calculates the contact thermal resistance of the contact surface by measuring the temperature gradient between the heating component and the jet microchannel heat exchanger 8. The thermal insulation cotton is wrapped on the heater 3 to ensure that the heater 3 is relatively insulated from the external environment. The structural design of the spring 10 ensures a constant contact pressure between the heating component and the jet microchannel heat exchanger 8 through the preset tension of the spring 10. The spring member is composed of a bolt 2 and a spring 10. Its design allows the preload to be adjusted according to the expected heat flux density and contact surface characteristics to ensure a stable contact pressure between the heater 3 and the jet microchannel heat exchanger 8 under different working conditions. Therefore, when the experimenter conducts different thermal power experiments on the jet microchannel heat exchanger 8, the contact thermal resistance between the heater 3 and the bottom surface of the jet microchannel heat exchanger 8 can be greatly stabilized.

[0022] The contact surface of the heater 3 is made of a high thermal conductivity material, such as copper or aluminum, and is precisely machined to achieve a flatness and smoothness that matches the surface characteristics of the heat exchanger 3 .

[0023] The heater 3 is connected to a plurality of heating rods 4 with controllable power, and these heating rods 4 can adjust the output heat flux density according to the experimental requirements. The temperature of the heater 3 is monitored in real time by a high-precision thermocouple to ensure the precise control and stability of the heat flux density.

[0024] In order to ensure that heat energy is effectively transferred to the heat exchanger 3 and minimize heat loss, the heating component and the base 1 are wrapped with thermal insulation cotton, which can effectively reduce thermal interference from the external environment and maintain the thermal stability of the experimental system.

[0025] Before the experiment, the heating rod 4 was fixed to the heater 3 using a high temperature resistant sealant, and the target heat flux density was set through the data acquisition and control system. Then the power was turned on, the heater 3 started to heat, and the heat was transferred to the bottom of the jet microchannel heat exchanger 8 through the heat collecting column 5. At the same time, the insulation cotton reduced the heat exchange between the experimental system and the external environment to maintain the accuracy of the experiment.

[0026] During the experiment, the spring 10 expands and contracts spontaneously under different heat flux density conditions due to the thermal expansion and contraction of the heater 3, thereby ensuring close contact between the heater 3 and the jet microchannel heat exchanger and reducing the change in contact thermal resistance caused by thermal expansion and contraction.

[0027] After the experiment is completed, turn off the power and wait for the system to cool down to a safe temperature. Then, disassemble the device for inspection and necessary maintenance, and analyze the experimental data to optimize the design of the jet microchannel heat exchanger.

Claims

1. A heat source simulation device for maintaining the contact thermal resistance of a jet microchannel heat exchanger, comprising a base (1), characterized in that: A heater (3) is provided on the base (1), and a heating rod (4) is installed inside the heater (3); the top end of the heater (3) is connected to a heat collecting column (5), the top end of the heat collecting column (5) is connected to a jet microchannel heat exchanger (8), and a heat exchanger package (9) is installed at the top end of the jet microchannel heat exchanger (8).

2. A heat source simulation device for maintaining the contact thermal resistance of a jet microchannel heat exchanger according to claim 1, characterized in that: A bolt (2) passes through the base (1) and the heat exchanger package (9), and a nut is connected to the end of the bolt (2).

3. A heat source simulation device for maintaining the contact thermal resistance of a jet microchannel heat exchanger according to claim 2, characterized in that: A spring (10) is sleeved between the heat exchanger packaging component (9) and the end surface of the bolt (2).

4. A heat source simulation device for maintaining the contact thermal resistance of a jet microchannel heat exchanger according to claim 3, characterized in that: A heater thermocouple reserved hole (6) is provided on the surface of the heat collecting column (5); A plurality of heater thermocouple reserved holes (6) are provided.

5. A heat source simulation device for maintaining the contact thermal resistance of a jet microchannel heat exchanger according to claim 4, characterized in that: A heat exchanger thermocouple reserved hole (7) is provided on the surface of the jet microchannel heat exchanger (8), and a plurality of the heat exchanger thermocouple reserved holes (7) are provided.

6. A heat source simulation device for maintaining the contact thermal resistance of a jet microchannel heat exchanger according to claim 5, characterized in that: A contact surface (11) exists between the heater (3) and the jet microchannel heat exchanger (8).

7. A heat source simulation device for maintaining the contact thermal resistance of a jet microchannel heat exchanger according to claim 6, characterized in that: The heater (3) is externally wrapped with heat-insulating cotton.

8. A heat source simulation device for maintaining contact thermal resistance of a jet microchannel heat exchanger according to claim 7, characterized in that: Thermocouples are bonded inside the heater thermocouple reserved hole (6) and the heat exchanger thermocouple reserved hole (7).

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