Exposure apparatus, method for manufacturing article, and exposure method

Abstract

The invention relates to an exposure apparatus, an article manufacturing method, and an exposure method. Provided is an exposure apparatus capable of exposing a substrate so as to reduce defective regions. The exposure apparatus projects an image of an original pattern onto a substrate, exposes the substrate, and is provided with a projection optical system that projects the image onto a substrate surface of the substrate by guiding exposure light that has passed through the original to the substrate; an original plate mounting table that performs scanning movement in a first direction parallel to the substrate surface while holding the original plate when a predetermined imaging region on the substrate surface is exposed; a substrate mounting table for holding the substrate to scan and move in the first direction while exposing the predetermined imaging region; a light-shielding part which shields a part of the exposure light guided to the substrate; and a control unit that performs a restart step in which, when the exposure of the predetermined imaging region is interrupted, the exposure of the predetermined imaging region is restarted while the light shielding unit is controlled so that the exposure light is not guided to a normal exposure region in the predetermined imaging region.

Description

Technical Field

[0001] The present invention relates to an exposure device, a method for manufacturing an article, and an exposure method. Background Art

[0002] Conventionally, when an exposure device performs an exposure process on a predetermined shot region on a substrate so as to transfer a pattern formed on an original plate to the predetermined shot region, the exposure process may be interrupted due to the occurrence of a predetermined abnormality.

[0003] Patent document 1 discloses an exposure device that, when exposure processing is interrupted due to an abnormality in driving an original plate stage holding an original plate or a substrate stage holding a substrate, moves each position to a position before the abnormality occurred and restarts the exposure processing.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 11-274062 Summary of the invention

[0007] Problem that the invention aims to solve

[0008] In the exposure device disclosed in Patent Document 1, when the exposure processing of a predetermined shooting area is interrupted due to a predetermined abnormality, the exposure processing is restarted after the positions of the original plate mounting table and the substrate mounting table are returned to the positions before the predetermined abnormality occurred.

[0009] In this case, by restarting the exposure process on the predetermined imaging area, the area exposed between the previous time and the time when the abnormality occurred is exposed again, and the area becomes a defective area for double exposure.

[0010] Therefore, an object of the present invention is to provide an exposure apparatus capable of performing an exposure process on a substrate in a manner that reduces defective areas.

[0011] Solutions for solving problems

[0012] The exposure device of the present invention projects an image of a pattern of an original plate onto a substrate to expose the substrate, and is characterized in that the exposure device comprises: a projection optical system for projecting an image onto a substrate surface of the substrate by guiding exposure light that has passed through the original plate toward the substrate; an original plate mounting table for scanning and moving in a first direction parallel to the substrate surface while holding the original plate when exposing a predetermined shooting area on the substrate surface; a substrate mounting table for scanning and moving along the first direction while holding the substrate when exposing the predetermined shooting area; a shading portion for shading a portion of the exposure light guided to the substrate; and a control portion for performing a restart process, in which, when exposure of the predetermined shooting area is interrupted, the shading portion is controlled in a manner such that the exposure light is not guided to a normal exposure area in the predetermined shooting area, and exposure of the predetermined shooting area is restarted.

[0013] Effects of the Invention

[0014] According to the present invention, there is provided an exposure apparatus capable of performing an exposure process on a substrate in a manner that reduces defective regions. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic XZ cross-sectional internal projection diagram and a schematic YZ cross-sectional internal projection diagram of the exposure apparatus of this embodiment.

[0016] Figure 2 This is a flowchart showing an exposure process for a substrate in the exposure apparatus of this embodiment.

[0017] Figure 3 It is a schematic plan view of an original plate and a substrate used in the exposure apparatus of this embodiment.

[0018] Figure 4 It is a partial schematic plan view of the exposure device of this embodiment when the scanning exposure is interrupted.

[0019] Figure 5 It is a partial schematic plan view when the scanning exposure of the exposure apparatus of this embodiment is restarted. Description of Reference Numerals

[0020] 5. Original plate; 6. Original plate mounting table; 8a. Y shading plate (shading portion); 8b. X shading plate (shading portion); 9. Projection optical system; 11. Substrate; 12. Substrate mounting table; 13. Control unit; 20a, 20b, 20c, 20d, Shooting area; 34. Exposure light; 50. Exposure device. DETAILED DESCRIPTION

[0021] Hereinafter, the exposure apparatus of the present embodiment will be described in detail based on the accompanying drawings. It should be noted that the drawings shown below are sometimes depicted at scales different from the actual ones for the purpose of facilitating understanding of the present embodiment.

[0022] In addition, the direction parallel to the optical axis of the projection optical system 9 (the direction perpendicular to the substrate surface of the substrate 11) is defined as the Z direction.

[0023] In addition, the direction in which the substrate 11 is scanned in a plane parallel to the substrate surface of the substrate 11 is defined as the Y direction (the first direction), and the non-scanning direction perpendicular to the Z direction and the Y direction is defined as the X direction (the second direction).

[0024] In addition, the rotational directions around the Z direction, the X direction, and the Y direction are defined as the θ direction, the pitch direction, and the roll direction, respectively.

[0025] Conventionally, when manufacturing a flat panel display (FPD), a semiconductor device, etc., in an exposure apparatus, an exposure process is performed in which a pattern formed on a reticle and a substrate are scanned and moved synchronously with each other, and the pattern is transferred onto the substrate.

[0026] When performing such an exposure process in an exposure apparatus, for example, the exposure process may be interrupted due to a predetermined abnormality such as an abnormality regarding focusing, an abnormality in the drive mechanism of the reticle stage for holding the reticle, and the substrate stage for holding the substrate.

[0027] And for a substrate whose exposure process is interrupted in the exposure apparatus, for example, it is not necessary to process the substrate as a defective substrate by performing rework.

[0028] On the other hand, depending on the product manufactured by the exposure process, there are cases where the exposure process is performed on a layer that cannot be reworked on the substrate.

[0029] And conventionally, a method of restarting the exposure process when the exposure process for a layer that cannot be reworked on the substrate is interrupted has been known.

[0030] For example, a method is known in which each of a plurality of substrates stored in a cassette is identified as a substrate on which the exposure process has been performed and a substrate on which the exposure process has not been performed, and only the identified substrates on which the exposure process has not been performed are sequentially subjected to the exposure process.

[0031] On the other hand, when a predetermined abnormality occurs during the exposure process for a plurality of shooting areas on a substrate and the exposure process is interrupted, if the process proceeds to the next process without performing rework on the plurality of shooting areas, problems may sometimes occur.

[0032] That is, there arises a problem that a shot region that has been exposed in a state where a predetermined abnormality has occurred and a shot region that has not been exposed among a plurality of shot regions are processed as defective shot regions.

[0033] Therefore, there is conventionally known a method of restarting the exposure process for a plurality of shot regions on a substrate by continuing to measure the focus when the exposure process is interrupted due to a focus abnormality.

[0034] However, in such a method, there arises a problem that an already exposed imaging region is exposed again, that is, double exposure is performed.

[0035] Furthermore, in this method, when the exposure process for a plurality of imaging areas is interrupted due to the occurrence of a predetermined abnormality other than a focus abnormality, it is difficult to restart the exposure process.

[0036] In addition, the following method is conventionally known: in an exposure process for transferring a pattern formed on an original plate to a substrate, when the exposure process is interrupted due to an abnormality in the driving of an original plate mounting table holding the original plate and a substrate mounting table holding the substrate, the exposure process of the substrate is restarted.

[0037] Specifically, in this method, the positions of the original plate stage and the substrate stage when the abnormality occurred and data indicating the time change of the positions of the original plate stage and the substrate stage are referred to.

[0038] Then, when the exposure process is restarted, the positions of the original plate stage and the substrate stage are moved to the positions arranged before the abnormality occurred.

[0039] However, in such a method, there arises a problem that an already exposed imaging region is exposed again, that is, double exposure is performed.

[0040] As described above, in conventional exposure devices, when exposure processing of a substrate is restarted after being interrupted due to a predetermined abnormality, a problem of double exposure occurs in which the already exposed shot area is exposed again.

[0041] Therefore, an object of the present embodiment is to provide an exposure apparatus capable of performing an exposure process on a substrate so as to reduce defective regions including regions subjected to double exposure and regions not subjected to exposure.

[0042] Figure 1 (a) and (b) respectively show a schematic XZ cross-sectional projection view and a schematic YZ cross-sectional projection view of the exposure device 50 according to the present embodiment.

[0043] The exposure device 50 of the present embodiment is a photolithography device used in a photolithography process when manufacturing a flat panel display (FPD), a semiconductor device, or the like.

[0044] That is, in the exposure device 50 of the present embodiment, it is configured to project an image of the pattern of the original plate 5 onto the substrate 11 and expose the substrate 11 .

[0045] Specifically, the exposure device 50 of the present embodiment includes an illumination optical system 1 , an alignment measurement unit 4 , an original plate mounting table 6 , laser interferometers 7 a and 7 b , a Y shielding plate 8 a (shielding unit), and an X shielding plate 8 b (shielding unit).

[0046] Furthermore, the exposure apparatus 50 of the present embodiment includes a projection optical system 9 , a focus measurement unit 10 , a substrate stage 12 , and a control unit 13 .

[0047] The illumination optical system 1 includes an exposure light source (light source) such as a mercury lamp or an LED lamp (neither of which are shown), a wavelength selection filter and a lens group, an exposure shutter 2 (shutter member), and a slit 3 .

[0048] Furthermore, the illumination optical system 1 is configured to emit exposure light having a wavelength suitable for exposure of the substrate 11 toward the original plate 5 .

[0049] Specifically, in the illumination optical system 1 , the exposure shutter 2 is opened to allow exposure light emitted from the exposure light source to pass therethrough, so that the exposure light is irradiated toward the original plate 5 .

[0050] In the exposure device 50 of the present embodiment, by shielding exposure light emitted from the exposure light source using the exposure shutter 2 provided in the illumination optical system 1, exposure to the substrate 11 can be interrupted without turning off the exposure light source.

[0051] Then, the exposure light emitted from the exposure light source in the illumination optical system 1 is cut out by the slit 3 and shaped, and then irradiated onto the original plate 5 .

[0052] The alignment measurement unit 4 includes a focus adjustment mechanism and is configured to measure the positions of marks formed on the original plate surface of the original plate 5 and the substrate surface of the substrate 11 , respectively, in the XY plane.

[0053] Specifically, the alignment measurement unit 4 is driven in the XY plane by a driving mechanism (not shown) and can measure the positions of the marks of the original plate 5 and the substrate 11 in the XY plane in combination with the drive control of the original plate stage 6 and the substrate stage 12 .

[0054] The original plate mounting table 6 is configured to be movable in the Y direction while holding the original plate 5 so that the irradiation position of the original plate surface of the original plate 5 with the exposure light from the illumination optical system 1 can be adjusted by a driving mechanism (not shown).

[0055] Furthermore, the original plate mounting table 6 is provided with a reflection surface, and the measurement light emitted from the laser interferometer 7 a is reflected by the reflection surface. The laser interferometer 7 a receives the reflected measurement light, thereby always monitoring the position of the original plate mounting table 6 .

[0056] The Y shielding plate 8 a is formed of two shielding plates separated and opposed to each other in the Y direction, and shields a part of the exposure light passing through the original plate mounting table 6 so as to adjust the illumination range in the Y direction on the substrate surface of the substrate 11 .

[0057] Specifically, the Y light shielding plate 8 a has a driving mechanism, and is moved in the Y direction by the driving mechanism to adjust the projection range of the image of the pattern of the original plate 5 on the substrate surface of the substrate 11 in the Y direction.

[0058] It should be noted that, in the exposure device 50 of the present embodiment, the Y light shielding plate 8 a is disposed between the original plate mounting table 6 and the projection optical system 9 in the Z direction.

[0059] The projection optical system 9 includes a lens including a magnification correction unit, a reflective mirror, etc. The projection optical system 9 is configured to guide the exposure light that has passed through the original plate 5 held by the original plate stage 6 to the substrate 11 held by the substrate stage 12, thereby projecting the image of the pattern formed on the original plate 5 onto the substrate surface of the substrate 11.

[0060] Furthermore, by moving the lens and the reflection mirror provided in the projection optical system 9 in the Z direction, the pitch direction, and the roll direction using a driving mechanism (not shown), the image of the pattern can be projected onto the substrate surface of the substrate 11 while producing arbitrary magnification, shift, and focus.

[0061] It should be noted that the projection optical system 9 provided in the exposure device 50 of the present embodiment is an equal-magnification imaging optical system that projects an image of a pattern formed on the original plate 5 onto the substrate surface of the substrate 11 at equal magnification.

[0062] However, the invention is not limited thereto, and a magnification imaging optical system that magnifies and projects the image of the pattern onto the substrate surface of the substrate 11 or a reduction imaging optical system that reduces and projects the image of the pattern onto the substrate surface of the substrate 11 may be used.

[0063] The projection optical system 9 may be a mirror projection system using a giant reflecting mirror or a multi-lens system using a plurality of lenses.

[0064] The X shielding plate 8 b is formed of two shielding plates separated and opposed to each other in the X direction, and shields a part of the exposure light passing through the projection optical system 9 so as to adjust the illumination range in the X direction on the substrate surface of the substrate 11 .

[0065] Specifically, the X shielding plate 8 b has a driving mechanism, and is moved in the X direction by the driving mechanism to adjust the projection range of the image of the pattern of the original plate 5 on the substrate surface of the substrate 11 in the X direction.

[0066] In addition, in the exposure device 50 of this embodiment, the X shielding plate 8b is arrange|positioned between the projection optical system 9 and the substrate mounting table 12 in Z direction.

[0067] The focus measurement unit 10 measures the positions of the substrate surface of the substrate 11 in the Z direction, the pitch direction, and the roll direction by using a plurality of units that emit measurement light toward the substrate surface of the substrate 11 and receive reflected light from the substrate surface.

[0068] The substrate stage 12 is configured to be movable in the X direction, Y direction, Z direction, θ direction, pitch direction, and roll direction while holding the substrate 11 so that the irradiation position of the exposure light on the substrate surface of the substrate 11 can be adjusted by a driving mechanism (not shown).

[0069] Furthermore, the substrate stage 12 is provided with a reflection surface, and the measurement light emitted from the laser interferometer 7 b is reflected by the reflection surface. The laser interferometer 7 b receives the reflected measurement light, thereby always monitoring the position of the substrate stage 12 .

[0070] The control unit 13 is configured to control each driving mechanism provided in the exposure device 50 of the present embodiment.

[0071] For example, the control unit 13 performs alignment between the original plate 5 and the substrate 11 based on the measurement result of the positions of the marks formed on the original plate surface of the original plate 5 and the substrate surface of the substrate 11 by the alignment measurement unit 4 .

[0072] Then, the control unit 13 controls the driving of each of the original plate mounting table 6 and the substrate mounting table 12 based on the result of the alignment, thereby being able to accurately control the synchronous driving between the two.

[0073] In the exposure device 50 of the present embodiment, the original plate 5 held by the original plate stage 6 and the substrate 11 held by the substrate stage 12 are arranged at positions optically conjugate with respect to the projection optical system 9 .

[0074] Then, while the original plate stage 6 and the substrate stage 12 are scanning-moved in synchronization with each other, an image of the pattern formed on the original plate surface of the original plate 5 is projected onto the substrate surface of the substrate 11 via the projection optical system 9 .

[0075] The pattern formed on the original plate surface of the original plate 5 used in the exposure apparatus 50 of the present embodiment corresponds to a pattern formed on a single layer in a laminated structure when manufacturing an FPD, a semiconductor device, or the like by a photolithography process.

[0076] Specifically, by projecting the image of the pattern onto the substrate surface of the substrate 11 coated with a photosensitive agent in the exposure device 50 of the present embodiment, a latent image of the pattern of the original plate 5 is formed on the substrate surface.

[0077] Then, the latent image formed on the substrate surface of the substrate 11 is converted into a physical resist pattern by performing a development process.

[0078] Next, specific control of the exposure process on the substrate 11 in the exposure device 50 of the present embodiment will be described.

[0079] Figure 2 1 is a flowchart showing an exposure process for the substrate 11 in the exposure device 50 of the present embodiment.

[0080] It should be noted that each step in the flowchart is controlled by the control unit 13 .

[0081] In the exposure device 50 of this embodiment, the following is used: Figure 3 (a) and (b) show the original plate 5 and the substrate 11.

[0082] Specifically, Figure 3 (a) is a schematic plan view of the original plate 5 , and on the original plate surface of the original plate 5 , 16 panels 21 are provided in a plurality, specifically, in a 4×4 grid pattern, and each panel has a pattern formed thereon.

[0083] That is, in the original plate 5 , four panels 21 are arranged along the Y direction, and four panels 21 are arranged along the X direction.

[0084] It should be noted that the plurality of panels 21 can be defined as regions in which the same patterns are formed within a photographing region, for example.

[0085] In addition, the present invention is not limited to this, and the plurality of panels 21 may be determined based on, for example, panel layout information input by a user.

[0086] in addition, Figure 3 (b) is a schematic plan view of the substrate 11 , and the imaging regions 20 a , 20 b , 20 c , and 20 d are provided in a plurality, specifically, in a 2×2 grid pattern, on the substrate surface of the substrate 11 .

[0087] Then, 16 panels 21 formed on the original plate surface of the original plate 5 are transferred to the respective shot areas 20 a , 20 b , 20 c , and 20 d .

[0088] It should be noted that the number and layout of the panels 21 provided on the original plate surface of the original plate 5 and the number and layout of the imaging regions provided on the substrate surface of the substrate 11 are not limited to those described above.

[0089] The control in the exposure device 50 of the present embodiment is effective when performing an exposure process of transferring a plurality of panels 21 arranged in two or more directions in each shot region.

[0090] like Figure 2 As shown, when the exposure process is started in the exposure device 50 of the present embodiment, first, scanning exposure is started on a predetermined shot region (step S101 ).

[0091] Specifically, in step S101 , exposure light from an exposure light source in the illumination optical system 1 is cut out by the slit 3 , passes through the original plate 5 and the projection optical system 9 , and then irradiates the predetermined imaging region of the substrate 11 .

[0092] Then, based on the result of the alignment between the original plate 5 and the substrate 11 performed in advance, the original plate stage 6 and the substrate stage 12 are driven synchronously in the Y direction to perform scanning exposure on a predetermined shot region of the substrate 11 .

[0093] In addition, in step S101, by driving the Y light shielding plate 8a and the X light shielding plate 8b, a portion of the exposure light emitted from the illumination optical system 1 is shielded in such a manner that the exposure light does not irradiate an area other than a predetermined illumination area on the original plate surface of the original plate 5 and a predetermined shooting area on the substrate surface of the substrate 11.

[0094] Next, it is determined whether or not a predetermined abnormality has been detected in exposure device 50 of the present embodiment (step S102 , determination step).

[0095] It should be noted that the predetermined abnormalities mentioned here include, for example, errors in the scanning movement of at least one of the original plate stage 6 and the substrate stage 12, accidental extinction of the exposure light source provided in the illumination optical system 1, accidental closing of the exposure shutter 2 provided in the illumination optical system 1, etc.

[0096] If the predetermined abnormality is not detected in the exposure device 50 of the present embodiment (Yes in step S102 ), it is determined whether the scanning exposure of the predetermined shot region of the substrate 11 is completed (step S103 ).

[0097] If the scanning exposure of the predetermined shot region of the substrate 11 has not been completed (No in step S103 ), the process returns to step S102 to continue the scanning exposure of the predetermined shot region.

[0098] On the other hand, when scanning exposure of a predetermined shot region of the substrate 11 is completed (Yes in step S103 ), it is determined whether scanning exposure of all shot regions of the substrate 11 is completed (step S104 ).

[0099] When scanning exposure is completed for all the shot regions of the substrate 11 (Yes in step S104 ), the exposure process for the substrate 11 is terminated.

[0100] On the other hand, when scanning exposure has not been completed for all the shot regions of the substrate 11 (No in step S104 ), the original plate stage 6 and the substrate stage 12 are moved so as to perform scanning exposure on the next shot region that has not yet been subjected to scanning exposure.

[0101] Then, scanning exposure is started for the next shot area (step S105 ), and the process returns to step S102 .

[0102] It should be noted that in the exposure device 50 of this embodiment, when Figure 3 When the substrate 11 shown in (b) is subjected to exposure processing, for example, scanning exposure can be performed in the order of the shot regions 20 a , 20 b , 20 c , and 20 d .

[0103] However, the order of the shot regions for scanning exposure on the substrate 11 is not limited thereto, and can be arbitrarily set by the control unit 13 .

[0104] Furthermore, the control unit 13 can arbitrarily set the scanning direction when performing scanning exposure on each of the shot regions 20 a to 20 d on the substrate 11 , that is, scanning in the positive direction of the Y direction or scanning in the negative direction of the Y direction.

[0105] In the exposure device 50 of the present embodiment, scanning exposure is performed on each shot region in the Y direction, but the invention is not limited thereto, and scanning exposure may be performed in the X direction.

[0106] Returning to step S102 , when a predetermined abnormality is detected in exposure device 50 of the present embodiment (No in step S102 ), the scanning exposure currently being performed is interrupted (step S106 ).

[0107] Figure 4 A partial schematic plan view of exposure device 50 according to the present embodiment when scanning exposure is interrupted at a predetermined timing in step S106 is shown.

[0108] like Figure 4 As shown, when scanning exposure of a predetermined shot region is started in step S101 or step S105, scanning exposure is performed, for example, from the negative end of the predetermined shot region in the Y direction toward the positive end of the predetermined shot region in the Y direction.

[0109] At this time, the Y light shielding plate 8a is arranged along the negative end portion in the Y direction and the positive end portion in the Y direction of the predetermined irradiation region.

[0110] Then, 16 panels 21 formed on the original plate surface of the original plate 5 are transferred to the predetermined shot area.

[0111] Here, if Figure 4 As shown, for the 16 panels 21 transferred to the predetermined shot region, divided exposure regions 30a, 30b, 30c, and 30d are formed in order from the negative side in the Y direction toward the positive side in the Y direction.

[0112] That is, each of the plurality of divided exposure regions 30 a , 30 b , 30 c , and 30 d arranged along the Y direction has four panels 21 along the X direction.

[0113] It should be noted that the divided exposure areas 30 a , 30 b , 30 c , and 30 d can be determined by the control unit 13 based on the layout of the plurality of panels 21 on the original plate surface of the original plate 5 input by the user.

[0114] In addition, if Figure 4 As shown in FIG. 1 , the negative end portion in the Y direction of the divided exposure region 30 a , that is, the position where scanning exposure of a predetermined shot region starts is indicated as 33 a .

[0115] In other words, the position 33a can also be referred to as the scanning start side end of the predetermined imaging region.

[0116] In addition, the positive end of the divided exposure region 30d in the Y direction, that is, the position where the scanning exposure of the predetermined shot region ends is indicated by 33e.

[0117] Furthermore, the position of the center between the divided exposure region 30a and the divided exposure region 30b in the Y direction is represented by 33b, and the position of the center between the divided exposure region 30b and the divided exposure region 30c in the Y direction is represented by 33c.

[0118] In addition, the position of the center between the divided exposure region 30c and the divided exposure region 30d in the Y direction is represented by 33d.

[0119] It should be noted that the positions 33a, 33b, 33c, and 33d can also be referred to as start positions of scanning exposure for the divided exposure regions 30a, 30b, 30c, and 30d, respectively.

[0120] like Figure 4 As shown, for example, when it is determined in step S102 that a predetermined abnormality in exposure device 50 of the present embodiment is detected, scanning exposure is performed on a predetermined position 31 in divided exposure region 30 b in the Y direction.

[0121] It should be noted that, specifically, Figure 4 As shown, the position 31 is determined as the position of the negative end portion in the Y direction of the irradiation area 34 of the exposure light on the predetermined shot area when it is determined in step S102 that a predetermined abnormality in the exposure device 50 of the present embodiment is detected.

[0122] In addition, when the scanning exposure to the predetermined shot region is interrupted in step S106, it is assumed that the scanning exposure is performed to the predetermined position 32 in the divided exposure region 30b in the Y direction.

[0123] It should be noted that, specifically, Figure 4 As shown, the position 32 is determined as the position of the positive end portion in the Y direction of the irradiation area 34 of the exposure light on the predetermined shot area when the scanning exposure on the predetermined shot area is interrupted in step S106.

[0124] Predetermined abnormalities in the exposure device 50 of the present embodiment detected in step S102 include, for example, abnormalities related to focus during scanning exposure and abnormalities in a driving mechanism for driving the original plate stage 6 and the substrate stage 12 .

[0125] The predetermined abnormality includes an abnormality in the illumination optical system 1 during scanning exposure, and an abnormality that requires interruption of scanning exposure of a predetermined shot area in the exposure device 50 of the present embodiment.

[0126] Then, the control unit 13 determines in step S102 that such an abnormality has been detected, and stops driving the original plate stage 6 and the substrate stage 12 in step S106 , and closes the exposure shutter 2 in the illumination optical system 1 to interrupt the scanning exposure.

[0127] It should be noted that, in step S106 , instead of closing the exposure shutter 2 in the illumination optical system 1 , the exposure light source may be turned off by controlling the voltage applied to the exposure light source.

[0128] Even if the control unit 13 determines that an abnormality is detected in step S102 , it cannot immediately stop the driving of the original plate stage 6 and the substrate stage 12 or immediately close the exposure shutter 2 in step S106 .

[0129] Therefore, as described above, the position 31 when abnormality is detected in step S102 (hereinafter referred to as abnormality occurrence position 31 ) and the position 32 when scanning exposure is interrupted in step S106 (hereinafter referred to as exposure interruption position 32 ) are offset from each other.

[0130] Next, the abnormality occurrence position 31 and the exposure interruption position 32 on the shot region where scanning exposure is performed are determined (step S107 ).

[0131] Specifically, in step S107 , the positions of the original plate stage 6 and the substrate stage 12 in the XY plane measured by the laser interferometers 7 a and 7 b respectively recorded by the control unit 13 when the abnormality occurrence position 31 is subjected to scanning exposure are referred to.

[0132] Next, the illumination range in the Y direction on the shot region for scanning exposure is calculated based on the width of the exposure light in the Y direction determined by the slit 3 at the respective positions of the reference original plate stage 6 and substrate stage 12 in the XY plane.

[0133] Then, the position of the negative end portion in the Y direction of the calculated illumination range is determined as the abnormality occurrence position 31 .

[0134] In step S107 , the positions of the original plate stage 6 and the substrate stage 12 in the XY plane measured by the laser interferometers 7 a and 7 b respectively recorded by the control unit 13 when the scanning exposure is performed on the exposure interruption position 32 are referred to.

[0135] Next, the illumination range in the Y direction on the shot region for scanning exposure is calculated based on the width of the exposure light in the Y direction determined by the slit 3 at the respective positions of the reference original plate stage 6 and substrate stage 12 in the XY plane.

[0136] Then, the position of the positive end portion in the Y direction of the calculated illumination range is determined as the exposure interruption position 32 .

[0137] The region between the abnormality occurrence position 31 and the exposure interruption position 32 determined in this way can be referred to as an abnormal exposure region in which scanning exposure is performed in a state where a predetermined abnormality has occurred in the exposure device 50 of the present embodiment.

[0138] That is, the abnormal exposure region can be defined as a region between abnormality occurrence position 31 at the time when a predetermined abnormality is detected in exposure device 50 of the present embodiment and exposure interruption position 32 at the time when scanning exposure is interrupted.

[0139] It should be noted that in Figure 4 In FIG. 1 , a region in which scanning exposure was performed from the occurrence of a predetermined abnormality to the interruption of scanning exposure in exposure device 50 of the present embodiment, that is, a region between abnormality occurrence position 31 and exposure interruption position 32 is indicated in gray.

[0140] Next, it is determined in which of the divided exposure regions 30 a to 30 d each of the abnormality occurrence position 31 and the exposure interruption position 32 determined in step S107 are included (step S108 ).

[0141] Specifically, in step S108, the determined abnormality occurrence position 31 and exposure interruption position 32 are compared with the positions 33a, 33b, 33c, 33d, and 33e to determine in which of the divided exposure regions 30a to 30d each is included.

[0142] Next, an abnormal exposure region in which scanning exposure is performed in a state where a predetermined abnormality has occurred in exposure device 50 of the present embodiment is determined (step S109 , determination step).

[0143] As described above, the abnormal exposure region refers to the region between the abnormality occurrence position 31 and the exposure interruption position 32 .

[0144] Therefore, in step S109 , at least one divided exposure region between the divided exposure region including the abnormality occurrence position 31 and the divided exposure region including the exposure interruption position 32 in the Y direction is determined as an abnormal exposure region.

[0145] exist Figure 4 In the example shown, the abnormality occurrence position 31 and the exposure interruption position 32 are both included in the divided exposure region 30 b , and therefore the divided exposure region 30 b is determined as the abnormal exposure region.

[0146] Next, the user is notified that a defect may occur in the panel 21 included in the abnormal exposure region determined in step S109 (step S110 ).

[0147] Next, a normal exposure region in which a predetermined abnormality does not occur in the exposure device 50 of the present embodiment, that is, scanning exposure is performed in a normal state, is determined in the predetermined shot region (step S111 ).

[0148] Specifically, in step S111, it is determined that the exposure time (period) before the time when the predetermined abnormality occurs in the exposure device 50 of this embodiment during the scanning exposure of the predetermined shot area is within the exposure time (period). Figure 4 The area indicated in black.

[0149] Then, at least one divided exposure region in which all regions are scan-exposed in a normal state is determined as a normal exposure region among the divided exposure regions 30 a to 30 d .

[0150] In other words, at least one divided exposure region arranged on the negative side in the Y direction of the abnormal exposure region, that is, on the scanning start side, among the divided exposure regions 30 a to 30 d is determined as a normal exposure region.

[0151] exist Figure 4 In the example shown, the divided exposure region 30 b is determined as the abnormal exposure region, and therefore the divided exposure region 30 a arranged on the negative side in the Y direction of the divided exposure region 30 b is determined as the normal exposure region.

[0152] In addition, in step S111, an unexposed area in a predetermined shot area that has not been subjected to scanning exposure is determined.

[0153] That is, it is determined that an area in the predetermined shooting area that has not yet been subjected to scanning exposure, for example, Figure 4 The area indicated in white.

[0154] Then, at least one divided exposure region in which scanning exposure has not been performed on the entire region among the divided exposure regions 30 a to 30 d is determined as an unexposed region.

[0155] In other words, at least one of the divided exposure regions 30 a to 30 d , which is arranged on the positive side in the Y direction of the abnormal exposure region, is determined as an unexposed region.

[0156] exist Figure 4 In the example shown, the divided exposure regions 30c and 30d arranged on the positive side in the Y direction of the divided exposure region 30b are determined as unexposed regions.

[0157] Next, the Y light shielding plate 8 a is arranged so that the normal exposure region determined in step S111 and the abnormal exposure region determined in step S109 are not irradiated with exposure light (step S112 ).

[0158] This can prevent the already exposed divided exposure area including the normal exposure area and the abnormal exposure area from being exposed again, that is, double exposure.

[0159] Figure 5(a) is a partial schematic plan view of the exposure device 50 of the present embodiment when the Y light shielding plate 8a is arranged in step S112.

[0160] As mentioned above, in Figure 4 In the example shown, the divided exposure regions 30a and 30b are determined as the normal exposure region and the abnormal exposure region, respectively.

[0161] Therefore, in this case, if Figure 5 As shown in (a) of FIG. 1 , in step S112 , the Y light shielding plate 8 a is arranged so that the divided exposure regions 30 a and 30 b are not irradiated with exposure light.

[0162] Next, after the predetermined abnormality occurring in exposure device 50 of the present embodiment is resolved, scanning exposure is restarted (step S113 , restart process), and the process returns to step S102 .

[0163] It should be noted that, in step S113, the scanning exposure position of the predetermined shooting area may also be started. Figure 4 At the position 33a in the example shown, scanning exposure of the predetermined imaging area is started again.

[0164] In addition, without limitation to this, in step S113, scanning exposure of the predetermined shot area may be restarted from a position closest to the negative side of the Y direction of the unexposed area among the center positions between adjacent divided exposure areas.

[0165] That is, in Figure 4 In the example shown, scanning exposure of a predetermined shot region may be restarted from position 33c closest to the unexposed region on the negative side in the Y direction among positions 33b to 33d that are the centers between adjacent divided exposure regions.

[0166] As described above, in the exposure device 50 of the present embodiment, when the exposure of a predetermined shooting area of ​​the substrate 11 is interrupted, the control unit 13 controls the Y light shielding plate 8a in such a manner that the exposure light is not guided to the normal exposure area in the predetermined shooting area, and starts the exposure of the predetermined shooting area again.

[0167] Thus, even if an abnormality occurs in the exposure device 50 when exposing a predetermined shot region including a plurality of panels 21 and the exposure is interrupted, the number of defective panels 21 in the predetermined shot region can be reduced.

[0168] It should be noted that, in the exposure device 50 of the present embodiment, the Y light shielding plate 8a is arranged in step S112 so that the normal exposure area and the abnormal exposure area are not irradiated with exposure light.

[0169] However, the present invention is not limited thereto, and it is also possible to use only the normal exposure area. Figure 5 In the example of the partial schematic plan view of the exposure device 50 of the present embodiment shown in (b), the Y light shielding plate 8a is arranged only in the divided exposure region 30a so as not to irradiate the exposure light.

[0170] In this case, the predetermined shot region can be subjected to scanning exposure so that no region that is completely unexposed is formed.

[0171] In the exposure device 50 of the present embodiment, the Y light shielding plate 8a is arranged in step S112 so that the normal exposure region and the abnormal exposure region are not irradiated with exposure light.

[0172] However, the invention is not limited to this, and the Y shading plate 8a may not be moved, that is, the timing of irradiation of exposure light from the illumination optical system 1 may be adjusted while maintaining the configuration of the Y shading plate 8a along the negative end and the positive end of the Y direction of the predetermined shooting area.

[0173] Then, when scanning exposure of the predetermined shooting area is started again in step S113, the exposure shutter 2 is closed when scanning the normal exposure area and the abnormal exposure area, and the exposure shutter 2 is opened when scanning the unexposed area.

[0174] Specifically, in Figure 4 In the example shown, the exposure shutter 2 is closed when scanning the divided exposure areas 30a and 30b. Then, the exposure shutter 2 may be opened when scanning the position 33c, which is the start position of the scanning exposure for the divided exposure area 30c, i.e., the end of the divided exposure area 30c on the scanning start side.

[0175] In this case, instead of closing or opening the exposure shutter 2 , the exposure light source provided in the illumination optical system 1 may be turned off or on by controlling the voltage applied to the exposure light source.

[0176] In addition, the scanning start position when re-starting exposure of the predetermined imaging region may be changed while maintaining the arrangement of the Y light shielding plates 8a along the Y direction negative end and the Y direction positive end of the predetermined imaging region.

[0177] That is, in this case, step S112 is not performed, and in step S113, scanning exposure of the predetermined shot area may be restarted from the position where scanning exposure of the unexposed area was started, that is, the end of the unexposed area on the scanning start side.

[0178] Specifically, in Figure 4In the example shown, scanning exposure may be restarted from position 33c which is the start position of scanning exposure for divided exposure region 30c.

[0179] In the above description, the divided exposure regions included in each of the normal exposure region, the abnormal exposure region, and the unexposed region among the plurality of divided exposure regions provided in the imaging region are determined, but the present invention is not limited thereto.

[0180] That is, in the exposure device 50 of this embodiment, the shooting area can also be defined as a single continuous exposure area, and the partial areas included in the normal exposure area, the abnormal exposure area, and the unexposed area in the single exposure area are determined.

[0181] [Production method]

[0182] The method for manufacturing an article according to the present embodiment includes a step of exposing a substrate such as a wafer or a glass substrate coated with a photosensitizer using the exposure device 50 according to the present embodiment.

[0183] It should be noted that the items include semiconductor integrated circuit (IC) components, liquid crystal display components, micro-electromechanical systems (MEMS), etc.

[0184] The method for manufacturing the article according to the present embodiment includes a step of developing the exposed substrate (photosensitive agent) and other known steps of treating the developed substrate.

[0185] It should be noted that the other well-known processes include etching, photosensitive agent stripping, cutting, bonding, packaging, etc.

[0186] According to the method for manufacturing an article of this embodiment, it is possible to manufacture an article of higher quality than before.

[0187] As mentioned above, although the preferred embodiments have been described, the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the gist thereof.

Claims

1. An exposure device that projects an image of a pattern of an original plate onto a substrate and exposes the substrate, characterized in that: The exposure device has: a projection optical system for guiding the exposure light having passed through the original plate toward the substrate, thereby projecting the image onto a substrate surface of the substrate; an original plate mounting table, which scans and moves in a first direction parallel to the substrate surface while holding the original plate when exposing a predetermined shot area on the substrate surface; a substrate mounting table, which scans and moves along the first direction while holding the substrate when exposing the predetermined shot area; a light shielding portion that shields a portion of the exposure light guided to the substrate; and The control unit performs a restart process, in which, when the exposure of the predetermined shooting area is interrupted, the exposure of the predetermined shooting area is restarted while controlling the shading unit in a manner that prevents the exposure light from being guided to the normal exposure area in the predetermined shooting area.

2. The exposure device according to claim 1, characterized in that The restart process includes the following process: controlling the shading portion in such a manner that the exposure light is not guided to each of the normal exposure area and the abnormal exposure area in the predetermined shooting area, while restarting the exposure of the predetermined shooting area.

3. The exposure device according to claim 1, characterized in that The restarting step includes a determining step of determining an abnormal exposure region from a region exposed between a time when a predetermined abnormality occurs during the exposure of the predetermined imaging region and a time when the exposure of the predetermined imaging region is interrupted.

4. The exposure device according to claim 3, characterized in that The control unit performs a step of notifying that a defect may occur in the abnormal exposure region.

5. The exposure device according to claim 1, characterized in that The restarting step includes the step of determining the normal exposure area from an area exposed in a time period before a time when a predetermined abnormality occurs during the exposure of the predetermined imaging area.

6. The exposure device according to claim 1, characterized in that The restarting step includes a determining step of determining whether a predetermined abnormality has occurred during the exposure of the predetermined imaging area.

7. The exposure device according to claim 6, characterized in that When the control unit determines in the determination step that the predetermined abnormality has occurred, the control unit performs a step of interrupting the exposure of the predetermined imaging area.

8. The exposure device according to claim 3, characterized in that an illumination optical system including a light source for emitting the exposure light and a shutter member for allowing the exposure light from the light source to pass therethrough by being opened, the illumination optical system irradiating the exposure light to the original plate, The predetermined abnormality includes an error in the scanning movement of at least one of the original plate stage and the substrate stage, an unexpected extinguishing of the light source, and an unexpected closing of the shutter member.

9. The exposure device according to claim 1, characterized in that The predetermined shooting area has a plurality of divided exposure areas arranged along the first direction, The restarting step includes the step of determining an abnormal exposure region from at least one of the divided exposure regions including a region exposed between a time when a predetermined abnormality occurs during the exposure of the predetermined shooting region and a time when the exposure of the predetermined shooting region is interrupted.

10. The exposure device according to claim 9, characterized in that The restarting step includes the step of determining the normal exposure region from at least one of the divided exposure regions disposed on a scanning start side of the abnormal exposure region in the predetermined imaging region.

11. The exposure device according to claim 9, characterized in that The plurality of divided exposure regions are determined based on a plurality of panels arranged along the first direction in the original plate and having the same patterns formed thereon.

12. The exposure device according to claim 11, characterized in that The plurality of panels are arranged in a second direction perpendicular to the first direction within the substrate surface.

13. The exposure device according to claim 1, characterized in that The restarting step includes a step of restarting the exposure of the predetermined shot region from a scanning start side end portion of the predetermined shot region.

14. The exposure device according to claim 1, characterized in that: The restart process includes the following steps: a step of determining an unexposed area which is not exposed when the exposure of the predetermined imaging area is interrupted; and The step of restarting the exposure of the predetermined shot area from the scanning start side end of the unexposed area.

15. The exposure device according to claim 1, characterized in that An illumination optical system is provided, the illumination optical system having a shutter member which allows the exposure light to pass through when opened, the illumination optical system irradiating the exposure light to the original plate, The restarting step includes a step of opening the shutter member when scanning a scanning start side end portion of the predetermined imaging region.

16. The exposure device according to claim 1, characterized in that An illumination optical system is provided, the illumination optical system having a shutter member which allows the exposure light to pass through when opened, the illumination optical system irradiating the exposure light to the original plate, The restart process includes: a step of determining an unexposed area which is not exposed when the exposure of the predetermined imaging area is interrupted; and and opening the shutter member when scanning the scanning start side end portion of the unexposed region.

17. The exposure device according to claim 1, characterized in that The light shielding portion includes two light shielding plates, and the two light shielding plates are separated so as to face each other in the first direction and are respectively movable in the first direction.

18. A method for manufacturing an article, characterized in that: Including the following processes: A step of exposing a substrate by using the exposure apparatus according to any one of claims 1 to 17; and A step of developing the exposed substrate.

19. An exposure method, exposing a substrate by projecting an image onto the substrate using an exposure device, the exposure device comprising: a projection optical system, which projects the image of the pattern of the original plate onto the substrate surface of the substrate by guiding the exposure light that has passed through the original plate to the substrate; an original plate mounting table, which scans and moves along a first direction parallel to the substrate surface while holding the original plate when exposing a predetermined shooting area on the substrate surface; a substrate mounting table, which scans and moves along the first direction while holding the substrate when exposing the predetermined shooting area; and a light shielding unit, which shields a part of the exposure light guided to the substrate, wherein the exposure method comprises a restarting step, In the restart process, when the exposure of the predetermined shooting area is interrupted, the exposure of the predetermined shooting area is restarted while controlling the light shielding portion in a manner that prevents the exposure light from being guided to a normal exposure area in the predetermined shooting area.

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