Substrate processing apparatus and substrate processing method

Abstract

The present invention relates to a substrate processing apparatus and a substrate processing method, comprising: a container replacement device for replacing a saturated recovery container in which an object to be recovered generated in a semiconductor production process is loaded to a reference value or more with an empty recovery container; and a container transfer device that receives at least one of the saturated recovery containers from the container replacement device and transfers the same to a disposal position at which the object to be recovered can be discarded or a temporary standby position.

Description

Technical Field

[0001] The present invention relates to a substrate processing device and a substrate processing method, and more particularly to a substrate processing device and a substrate processing method that can automatically replace a recovery container if recovery objects such as materials or defective products generated during a semiconductor production process are loaded into a recovery container above a baseline value. Background Art

[0002] Generally, semiconductor elements can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The semiconductor elements formed as above can be manufactured into semiconductor strips composed of multiple semiconductor packages through a cutting process, a chip bonding process and a molding process.

[0003] The semiconductor strip manufactured as above can be individualized into a plurality of semiconductor packages through a sawing and sorting process, and then classified according to good or defective determination. For example, the device for performing the sawing and sorting process can individualize the semiconductor strip into a plurality of semiconductor packages using a sawing knife after loading the semiconductor strip on a vacuum chuck, and can inspect the individualized semiconductor packages using a vision module after cleaning and drying.

[0004] In addition, the semiconductor package cutting and sorting can classify the semiconductor packages into good products and defective products (defective products) according to the inspection results of the visual module. For example, the semiconductor package cutting and sorting device can classify the semiconductor packages into good product trays and store them according to the inspection results, or collect defective products in bulk into separate collection containers such as bulk boxes. Summary of the invention

[0005] However, in the conventional technology, the replacement work of the collection container for cutting and sorting semiconductor packages or the disposal work of the collection objects contained in the saturated collection container is performed by the operator's manual work.

[0006] Therefore, in the prior art, the operator confirms the status of the recycling container with the naked eye. If the recycling object fills the recycling container, there is the trouble of manually replacing the saturated recycling container with a new recycling container and then directly discarding the recycling object contained in the saturated recycling container by hand.

[0007] The present invention is used to solve various problems including the above-mentioned problems, and aims to provide a substrate processing device and a substrate processing method that can automatically replace or automatically discard a recycling container when recycling objects such as materials or defective products generated in a semiconductor production process are loaded to a recycling container exceeding a reference value. However, such a subject is exemplary, and the scope of the present invention is not limited thereto.

[0008] It can be that the substrate processing device according to the concept of the present invention for solving the above-mentioned problem includes: a container replacement device, which replaces a saturated recovery container loaded with recovery objects generated in the semiconductor production process to a value above a benchmark value with an empty recovery container; and a container transfer device, which receives at least one of the saturated recovery containers from the container replacement device and transfers it to a disposal position or a temporary standby position where the recovery objects can be discarded.

[0009] Furthermore, according to the present invention, the recycling object may be a material or a defective product that has failed to pass an acceptance process in a semiconductor package cutting and sorting device.

[0010] In addition, according to the present invention, the container replacement device may include: a carrier for placing a plurality of the recovery containers; and an actuator for moving the carrier or the recovery container so that the saturated recovery container located at the loading position can be moved to the transfer position.

[0011] According to the present invention, the stage may be an XY stage in which a plurality of the recovery containers are arranged in M ​​rows and N columns and provided so as to be movable in the first direction and the second direction.

[0012] Furthermore, according to the present invention, the actuator may include: a first actuator that moves the stage in a first direction; and a second actuator that moves the stage in a second direction.

[0013] Furthermore, according to the present invention, the container transfer device may be a transfer robot arm that picks up and transfers the saturated recovery container located at the transfer position.

[0014] In addition, according to the present invention, a distance sensing sensor for grasping the position of the recovery container and avoiding interference objects may be formed on one side of the transfer robot arm.

[0015] In addition, according to the present invention, the substrate processing apparatus may further include: a temporary storage device for temporarily storing at least one of the saturated recovery containers transferred to the temporary standby position by the container transfer device.

[0016] In addition, according to the present invention, the temporary storage device may be a shelf or a conveying device capable of temporarily storing or transporting a plurality of the saturated recovery containers.

[0017] Furthermore, according to the present invention, the temporary storage device may include a weight measuring device for measuring the weight of the saturated recovery container to confirm a saturated state.

[0018] In addition, according to the present invention, the weight measuring device may include: a load measuring rod, which is pressed by the load of the saturated recovery container to overcome the elastic restoring force of the elastic component; and a light sensor, which cuts off the light path formed from the light emitting part to the light receiving part through a baffle formed on the load measuring rod.

[0019] In addition, according to the present invention, the substrate processing apparatus may further include: a load amount sensing device capable of sensing the load amount of the saturated recovery container.

[0020] In addition, according to the present invention, the load amount sensing device may include at least an optical sensor for sensing the recycling object recovered in the saturated recycling container, a weight sensing sensor for measuring the weight of the saturated recycling container or the recycling object, a counting sensor for sensing the number of the recycling objects that fall, a timer for sensing the recycling time of the recycling object, and any one or more of their combinations.

[0021] According to the present invention, the substrate processing apparatus may further include a discarding device that discards the recovery object accommodated in the saturated recovery container temporarily accommodated in the temporary accommodation device into a discard tank.

[0022] In addition, according to the present invention, the waste device may include: a container fixing device, which fixes the saturated recovery container received from the temporary storage device; and a flipping device, which flips the container fixing device so that the recycling object contained in the saturated recovery container can fall into the waste tank.

[0023] In addition, according to the present invention, the reversing device may reverse the container fixing device again so that the empty collection container after the collection object has fallen can face upward and be transferred to the container replacement device by the container transfer device.

[0024] According to the present invention, the recovery container may be in the shape of a cylinder with an upper side open as a whole, and a buffer member for preventing impact may be formed on at least a part of a side surface.

[0025] Furthermore, according to the present invention, the substrate processing apparatus may further include: a guide member having a funnel shape as a whole, for guiding the recovery object dropped from the pickup head to a loading position of the recovery container.

[0026] On the other hand, the substrate processing method according to the concept of the present invention for solving the above-mentioned problem may include: (a) if the recycling object generated in the semiconductor production process falls from the pickup head, the step of guiding the fallen recycling object to the loading position of the recycling container; (b) the step of replacing the saturated recycling container loaded with the recycling object to a level above the reference value with an empty recycling container; (c) the step of receiving the saturated recycling container and transferring it to a temporary standby position where the recycling object can be discarded; (d) the step of temporarily accommodating at least one of the saturated recycling containers transferred to the temporary standby position; (e) the step of discarding the recycling object accommodated in the temporarily accommodated saturated recycling container into a waste tank; and (f) the step of transferring the empty recycling container after the recycling object falls to a container replacement device.

[0027] On the other hand, it may be that the substrate processing device according to the concept of the present invention for solving the above-mentioned problem includes: a container replacement device, which replaces a saturated recovery container loaded with recovery objects generated in the semiconductor production process to a value above a reference value with an empty recovery container; and a container transfer device, which receives at least one of the saturated recovery containers from the container replacement device and transfers it to a disposal position or a temporary standby position where the recovery objects can be discarded, wherein the recovery objects are materials or defective products that have not passed the acceptance process in the semiconductor package cutting and sorting device, and the container replacement device includes: a carrier, on which a plurality of the recovery containers are placed; and an actuator, which moves the carrier or the recovery container so that the saturated recovery container located at the loading position can be transferred to the transfer position, and the carrier is A plurality of the recovery containers are arranged in M ​​rows and N columns and are set to be an XY stage capable of moving in a first direction and a second direction, the actuator includes: a first actuator, which moves the stage in the first direction; and a second actuator, which moves the stage in the second direction, the container transfer device is a transfer robot arm that picks up and transfers the saturated recovery container located at the transfer position, the substrate processing device also includes: a temporary accommodating device, which temporarily accommodates at least one of the saturated recovery containers transferred to the temporary standby position by the container transfer device, the temporary accommodating device is formed with a weight measuring device for measuring the weight of the saturated recovery container and confirming the saturation state, and the substrate processing device also includes: a load sensing device, which can sense the load of the saturated recovery container.

[0028] According to various embodiments of the present invention constructed as above, if the recycling objects such as materials or defective products generated in the semiconductor production process are loaded into the recycling container above the reference value, the recycling container can be automatically replaced, automatically transferred or automatically discarded, thereby greatly reducing the number of operators and operation time and greatly improving productivity, automatically confirming the internal loading amount of the recycling objects recycled in the recycling container, loading the recycling container while avoiding interference from the surroundings, and using a buffer component to alleviate the impact of the recycling container. Of course, the scope of the present invention is not limited by these effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 FIG. 1 is a plan view conceptually showing a semiconductor package cutting and sorting apparatus according to some embodiments of the present invention.

[0030] Figures 2 to 12 It is a cross-sectional view showing step by step the operation process of the substrate processing apparatus according to some embodiments of the present invention.

[0031] Fig.13 It is shown Figure 2 A rear perspective view of an example of an actuator of a substrate processing apparatus.

[0032] Fig.14 It is shown Fig.13 A front view of an actuator of a substrate processing apparatus.

[0033] Fig.15 It is shown Fig.13 A side view of a load capacity sensing device for a substrate processing device.

[0034] Fig.16 It is shown Fig.13 A perspective view of a recovery container of a substrate processing apparatus.

[0035] Fig.17 It is shown Figure 2 A side view of a temporary accommodation device for a substrate processing device.

[0036] Fig.18 It is shown Figure 2 A three-dimensional view of a weight measuring device of a substrate processing device.

[0037] Fig.19 FIG. 1 is a sequence diagram showing a substrate processing method according to some embodiments of the present invention.

[0038] (Explanation of Reference Numerals)

[0039] 1: Recycling objects

[0040] B: Recycling container

[0041] Ba: Buffer component

[0042] B1: Empty recycling container

[0043] B2: Saturated recovery container

[0044] 10: Container replacement device

[0045] 11: Carrier

[0046] 12: Actuator

[0047] 121: First actuator

[0048] 122: Second actuator

[0049] 20: Container transfer device

[0050] 21: Transporting Robot Arm

[0051] 22: Distance sensing sensor

[0052] 30: Temporary accommodation device

[0053] 31: Weight measuring device

[0054] 311: Load measuring rod

[0055] E: Elastic components

[0056] 312: Light sensor

[0057] 312a: Light emitting part

[0058] 312b: Light receiving part

[0059] 313: Baffle

[0060] 40: Device quantity sensing device

[0061] 50: Abandoned Device

[0062] 501: Container Fixing Device

[0063] 502: Flipper

[0064] 51: Abandoned cans

[0065] H: Pickup head

[0066] G: Guide component

[0067] 60: Control Department

[0068] 100: Substrate processing device

[0069] 1000: Semiconductor package cutting and sorting equipment DETAILED DESCRIPTION

[0070] Hereinafter, various preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0071] The embodiments of the present invention are provided to more completely explain the present invention to those with common knowledge in the corresponding technical field. The following embodiments may be modified in various forms, and the scope of the present invention is not limited to the following embodiments. Instead, these embodiments are provided to make the present disclosure more substantial and complete, and to fully convey the concept of the present invention to those skilled in the art. In addition, the thickness or size of each layer in the drawings is exaggerated for the convenience and clarity of the description.

[0072] The terms used in this specification are used to describe specific embodiments and are not intended to limit the present invention. As used in this specification, the singular form may include the plural form unless the context clearly indicates otherwise. In addition, in the case of use in this specification, "comprise" and / or "comprising" refers to the existence of the specifically mentioned shapes, numbers, steps, operations, components, elements and / or combinations thereof, and does not exclude the existence or addition of one or more other shapes, numbers, operations, components, elements and / or combinations.

[0073] Embodiments of the present invention are described below with reference to the accompanying drawings that schematically illustrate ideal embodiments of the present invention. In the accompanying drawings, for example, variations in the shapes shown may be expected, depending on manufacturing techniques and / or tolerances. Therefore, embodiments of the present invention are not to be construed as being limited to the specific shapes of the regions shown in this specification, and, for example, variations in shapes resulting from manufacturing should be included.

[0074] Figure 1 FIG. 1 is a plan view conceptually showing a semiconductor package cutting and sorting apparatus 1000 according to a partial embodiment of the present invention.

[0075] First, if Figure 1 As shown, the semiconductor package cutting and sorting device 1000 according to some embodiments of the present invention can be used to perform cutting and sorting processes for manufacturing semiconductor elements. Specifically, the semiconductor package cutting and sorting device 1000 can be used to cut a semiconductor strip S and individualize it into a plurality of semiconductor packages C and inspect and sort the semiconductor packages C.

[0076] The semiconductor package cutting and sorting device 1000 may include a cutting module 2000 for cutting a semiconductor strip S to individualize a plurality of semiconductor packages C, an inspection module 3000 for inspecting the semiconductor packages C, and a semiconductor package transfer module 4000 for classifying and transferring the semiconductor packages C based on the inspection results of the inspection module 3000 .

[0077] For example, a box 300 for accommodating a plurality of semiconductor strips S may be disposed on one side of the cutting module 2000 . In addition, a gripper (not shown) for taking out the semiconductor strips S from the box 300 may be provided, and the semiconductor strips S taken out from the box 300 may be guided by the guide rail 320 .

[0078] The cutting module 2000 may include a strip picker 2100 for picking up and transferring the semiconductor strip S, a strip picker driving unit 2120 for moving the strip picker 2100 in vertical and horizontal directions, and a vacuum chuck 2200 for placing the semiconductor strip S. The strip picker 2100 may be rotatably configured by the strip picker driving unit 2120 in order to adjust the arrangement direction of the semiconductor strip S.

[0079] For example, the strip picker 2100 may rotate the semiconductor strip S after picking up the semiconductor strip S taken out from the cassette 300 , and then may transfer the rotated semiconductor strip S to the vacuum chuck 2200 .

[0080] The vacuum chuck 2200 may be supported by a chuck stage 2220, and the chuck stage 2220 may move the semiconductor strip S to the cutting unit 2300. The cutting unit 2300 may include a blade for cutting the semiconductor strip S, and the chuck stage 2220 may be moved by a separate driving portion so that the semiconductor strip S is located below the cutting unit 2300.

[0081] The semiconductor package C individualized by the cutting unit 2300 may be picked up and transferred by the package picker 2400. The cutting module 2000 may include a cleaning unit 2500 for cleaning the individualized semiconductor package C. The package picker 2400 may be configured to be movable in the vertical and horizontal directions by the package picker driving unit 2420. For example, the package picker driving unit 2420 may move the package picker 2400 to the top of the cleaning unit 2500 after the semiconductor package C is picked up by the package picker 2400, and the cleaning unit 2500 may remove foreign matter from the semiconductor package C using a brush and a cleaning liquid. In addition, the cleaning unit 2500 may dry the semiconductor package C by spraying air to the semiconductor package C.

[0082] After cleaning and drying the semiconductor package C, the package picker 2400 may transfer the semiconductor package C to the semiconductor package transfer module 4000. For example, the semiconductor package transfer module 4000 may include a tray stage 4100 for supporting the semiconductor package C, and the package picker 2400 may transfer the semiconductor package C to the tray stage 4100.

[0083] The semiconductor package transfer module 4000 may include a stage transfer part 4120 for moving the tray stage 4100 in a first horizontal direction, such as the Y-axis direction. The inspection module 3000 may include a first vision unit 3100 disposed above a moving path of the tray stage 4100 and for inspecting the semiconductor package C on the tray stage 4100 .

[0084] The semiconductor package transfer module 4000 may include a first tray 4200 and a second tray 4220 for accommodating semiconductor packages C. For example, the semiconductor package transfer module 4000 may include a plurality of pickers 4300 for picking up semiconductor packages C from the tray stage 4100 and transferring them to the first tray 4200 or the second tray 4220. At this time, the inspection module 3000 may include a second visual unit 3200 for inspecting the semiconductor package C picked up by the picker 4300. As an example, as shown in the figure, the inspection module 3000 may include a second visual unit 3200 disposed under the moving path of the picker 4300 and for inspecting the semiconductor package C picked up by the picker 4300. The first tray 4200 and the second tray 4220 may be provided with pockets for accommodating semiconductor packages C, respectively.

[0085] The first tray 4200 and the second tray 4220 may be disposed under the moving path of the picker 4300, and the picker 4300 may be configured to be movable in a second horizontal direction, such as the X-axis direction, by the picker driving unit 4320. In addition, the semiconductor package transfer module 4000 may include a tray transfer unit 4240 for moving the first tray 4200 and the second tray 4220 in the first horizontal direction.

[0086] The stage transfer unit 4120 and the tray transfer unit 4240 may move the tray stage 4100 and the first and second trays 4200 and 4220 to a classification area, for example, under a moving path of the picker 4300. In addition, the semiconductor package transfer module 4000 may include a tray supply unit 4400 for supplying the first and second trays 4200 and 4220 and a container 4420 for collecting defective semiconductor packages C.

[0087] exist Figure 2 The substrate processing apparatus 100 according to some embodiments of the present invention described below may be applicable to Figure 1 In addition to the container 4420, all of them can be used for recycling containers that can recycle various recycling objects, such as containers for recycling various unnecessary parts cut from the cutting module 2000 or separated and dropped from the cleaning unit 2500.

[0088] Figure 2 is a cross-sectional view showing a substrate processing apparatus 100 according to a partial embodiment of the present invention.

[0089] like Figure 2 As shown, a substrate processing apparatus 100 according to some embodiments of the present invention may generally include a container replacing apparatus 10 , a container transferring apparatus 20 , a temporary accommodation apparatus 30 , and a discarding apparatus 50 .

[0090] The container replacement device 10 may be, for example, a device that replaces a saturated recovery container B2 loaded with the recovery objects 1 generated in the semiconductor production process to a level exceeding a reference value with an empty recovery container B1.

[0091] Here, the recycling object 1 may be, for example, a material that has failed to pass the acceptance process in the semiconductor package cutting and sorting apparatus 1000 or a defective product (defective product).

[0092] However, the collection target object 1 can also be applied to all kinds of foreign matter that falls from cutting of various cutting modules or falls from separation of cleaning modules.

[0093] More specifically, for example Figure 2 As shown, the container replacement device 10 may include a carrier 11 for placing multiple recovery containers B in a row and an actuator 12 for moving the carrier 11 or the recovery container B to move the saturated recovery container B2 located at the loading position to a transfer position along a first direction.

[0094] However, this container replacement device 10 is not limited to Figure 2 The one-way transfer method shown here is only in the first direction, but all container replacement devices 10 of various forms and types that can transfer in two or more directions are applicable.

[0095] Here, the substrate processing apparatus 100 according to some embodiments of the present invention may further include a guide member G having a generally funnel shape for guiding the recovery object 1 dropped from the pickup head H to a loading position of the recovery container B.

[0096] Such a guide member G can be formed in a variety of forms such as a hopper or a pipe shape that is open at the top and the bottom, so as to guide the recycling objects 1 to a certain loading position.

[0097] Therefore, if this container replacement device 10 is used, the empty recovery container B1 will be guided by the guide component G and drop to a certain loading position for a first recovery of the recovery object 1. If the empty recovery container B1 recovers the recovery object 1 above the reference value and becomes a saturated recovery container B2, the saturated recovery container B2 is moved to the transfer position while the new empty recovery container B1 on standby is moved to the loading position to continuously recover the recovery object 1 for a second time.

[0098] The container transfer device 20 may be, for example, a device that receives at least one saturated recovery container B2 from the container replacement device 10 and transfers it to a disposal position or a temporary standby position where the recovery object 1 can be disposed of.

[0099] like Figure 2 As shown, the container transfer device 20 can be more specifically, for example, a transfer robot 21 that picks up and transfers the saturated recovery container B2 located at the transfer position.

[0100] A distance sensing sensor 22 for grasping the position of the recovery container B and avoiding interference objects can be formed on one side of such a transfer robot 21, and an X-axis moving device, a Y-axis moving device, a Z-axis moving device, a θ-axis transfer device or a multi-joint device can be provided for moving the transfer robot 21 on the X-axis, Y-axis, Z-axis, θ-axis, etc.

[0101] However, the container transfer device 20 is not limited to the transfer robot arm 21, and can be applied to various pick-up transfer devices, OHT (Overhead Hoist Transfer; overhead unmanned transport vehicle), transfer carts and other various logistics transfer devices.

[0102] Therefore, when such a container transfer device 20 is used, at least one saturated recovery container B2 is received from the container replacement device 10 and the recovery object 1 is transferred to a disposal position or a temporary standby position where it can be disposed of.

[0103] The temporary storage device 30 may be, for example, a device that temporarily stores at least one saturated recovery container B2 transferred to the temporary standby position by the container transfer device 20 .

[0104] The temporary accommodation device 30 may be more specifically, for example, a shelf or a conveying device that can temporarily accommodate or transport a plurality of saturated recovery containers B2.

[0105] The temporary storage device 30 may be formed with a weight measuring device 31 for measuring the weight of the saturated recovery container B2 to confirm the saturated state, for example.

[0106] Therefore, if a temporary storage device 30 is used, multiple saturated recovery containers B2 can be temporarily stored. For example, after the semiconductor packaging production process is completed or during the device's rest time, the recycling objects 1 stored in the saturated recovery containers B2 can be disposed of simultaneously or sequentially.

[0107] The discarding device 50 may be a device that discards the collection object 1 stored in the saturated collection container B2 temporarily stored in the temporary storage device 30 into the discarding tank 51 , for example.

[0108] The waste device 50 may more specifically include, for example, a container fixing device 501 for fixing the saturated recovery container B2 received from the temporary storage device 30 and a flipping device 502 for flipping the container fixing device 501 so that the recycling object 1 contained in the saturated recovery container B2 can fall into the waste tank 51.

[0109] Here, the container fixing device 501 can be used for all kinds of fixing devices such as vacuum chuck, permanent magnet, electromagnet, transfer robot arm, clamp, retainer, forced bite device, Velcro, etc. to fix the saturated recovery container B2. The flipping device 502 can flip the container fixing device 501 around the rotation axis and only drop the recycling object 1 into the waste tank 51 when the empty recovery container B1 is fixed.

[0110] This overturning device 502 can overturn the container fixing device 501 again so that the empty recovery container B1 after the recovery object 1 falls can face upward and be transferred to the container replacement device 10 through the container transfer device 20.

[0111] However, such a discarding device 50 is not necessarily limited to that shown in the drawings, and it is also possible that the discarding device 50 is omitted and the operator manually discards the recovery object 1 contained in the saturated recovery container B2.

[0112] Figures 2 to 12 FIG. 1 is a cross-sectional view showing step-by-step the operation process of the substrate processing apparatus 100 according to some embodiments of the present invention.

[0113] like Figures 2 to 12 As shown, the working process of the substrate processing device 100 according to some embodiments of the present invention is described step by step. First, as shown in FIG. Figure 2 As shown, if the recycling object 1 generated in the semiconductor production process drops from the pickup head H using the guide component G, it can be guided to the loading position of the recycling container B, and the recycling object 1 can be recovered in the saturated recycling container B2 at a value above the baseline value.

[0114] At this time, the empty recovery container B1 may be placed on the stage 11 together with the saturated recovery container B2 and wait.

[0115] Then, if Figure 3 As shown, the stage 11 is moved by the actuator 12 to replace the saturated recovery container B2 loaded with the recovery objects 1 to a level exceeding the reference value with the empty recovery container B1 on standby.

[0116] Then, it can be, Figure 4 As shown, the container transfer device 20 picks up the saturated recovery container B2, as shown in FIG. Figure 5 As shown, the recycling object 1 is transferred to a temporary standby position where it can be discarded.

[0117] Then, if Figure 6 As shown, the temporary storage device 30 can temporarily store at least one saturated recovery container B2 transferred to the temporary standby position.

[0118] Then, if Figure 7 As shown, the temporary storage device 30 can transfer the temporarily stored saturated recovery container B2 to the waste device 50, such as Figure 8 As shown, the waste device 50 can receive the recycling object 1 contained in the saturated recovery container B2.

[0119] Then, if Fig. 9 As shown, the reversing device 502 can reverse the container fixing device 501 around the rotation axis to drop only the collection object 1 into the waste tank 51 while the empty collection container B1 is fixed.

[0120] Then, if Fig.10 As shown, the flipping device 502 can flip the container fixing device 501 again so that the empty recycling container B1 after the recycling object 1 falls can face upward and be transferred to the container replacement device 10 through the container transfer device 20.

[0121] Then, if Fig.11 As shown, the container transfer device 20 can transfer the empty recovery container B1 where the recovery object 1 falls to the container replacement device 10 again, during which the saturated recovery container B2 where all the recovery object 1 is recovered can be transferred to the opposite side again and the above process is repeated.

[0122] Therefore, according to the present invention, if the recycling object 1 such as materials or defective products generated in the semiconductor production process is loaded into the recycling container B above the benchmark value, the recycling container B can be automatically replaced, automatically transferred or automatically discarded, thereby greatly saving the operation time and operators and greatly improving productivity.

[0123] Fig.13 It is shown Figure 2 A rear perspective view of an example of the actuator 12 of the substrate processing apparatus 100, Fig.14 It is shown Fig.13 FIG. 1 is a front view of the actuator 12 of the substrate processing apparatus 100 .

[0124] like Fig.13 and Fig.14 As shown, the stage 11 of the substrate processing apparatus 100 according to some embodiments of the present invention may be, for example, an XY stage (two-way movable stage) in which a plurality of recovery containers B are arranged in M ​​rows and N columns and is configured to be movable in a first direction and a second direction.

[0125] Such a stage 11 may be formed with guide rails or guide members in two or more directions so as to be freely movable in two or more directions.

[0126] The actuator 12 may include, for example, a first actuator 121 that moves the stage 11 in a first direction (X-axis direction or Y-axis direction) and a second actuator 122 that moves the stage 11 in a second direction (Y-axis direction or X-axis direction).

[0127] However, the actuator 12 is not limited to the attached drawings. Various motors, electric motors, and cylinder devices can be applicable. A very diverse form of power transmission devices such as gear combinations, screw and nut component combinations, belt and pulley combinations, wire rope and pulley combinations, chains and sprocket combinations, etc. can all be applicable.

[0128] Therefore, if the actuator 12 moves the stage 11 in the first direction or the second direction, the plurality of recovery containers B accommodated in the stage 11 can be transferred in the first direction or the second direction through the stage 11 .

[0129] Fig.15 It is shown Fig.13 1 is a side view of the load amount sensing device 40 of the substrate processing apparatus 100.

[0130] like Fig.15 As shown, the substrate processing apparatus 100 according to some embodiments of the present invention may further include a load amount sensing device 40 that can sense the load amount of the saturated recovery container B2.

[0131] This load sensing device 40 may include at least a light sensor for sensing the recycling object 1 recovered in the saturated recycling container B2, a weight sensing sensor for measuring the weight of the saturated recycling container B2 or the recycling object 1, a counting sensor for sensing the number of fallen recycling objects 1, a timer for sensing the recycling time of the recycling object 1, and any one or more of their combinations.

[0132] Here, the recycling container B can be a very diverse form of container, including multiple unit recycling containers and a comprehensive recycling container that can recycle multiple unit recycling containers again. The recycling container B is made of metal material, or is made of translucent material so that the load amount sensing device 40 can easily sense the recycling object 1, etc.

[0133] Therefore, if the load quantity sensing device 40 is used, the loading status of the recycling object 1 contained in the saturated recovery container B2 can be confirmed, and the control unit 60 can receive the application of the saturation status signal from the load quantity sensing device 40 and apply the control signal to the above-mentioned container replacement device 10, container transfer device 20, temporary storage device 30 and disposal device 50, etc.

[0134] Fig.16 It is shown Fig.13 A perspective view of a recovery container B of the substrate processing apparatus 100 .

[0135] like Fig.16 As shown, the recovery container B of the substrate processing apparatus 100 according to some embodiments of the present invention may be in the shape of a cylinder with an open top as a whole, and a buffer member Ba for preventing impact is formed on at least a portion of the side surface.

[0136] Therefore, the impact caused by the collision or interference between the collection containers B can be mitigated by the buffer member Ba, thereby significantly improving the durability and rigidity of the attachment.

[0137] Fig.17 It is shown Figure 2 A side view of the temporary storage device 30 of the substrate processing device 100, Fig.18 It is shown Figure 2 A three-dimensional view of the weight measuring device 31 of the substrate processing apparatus 100.

[0138] like Fig.17 as well as Fig.18 As shown, the weight measuring device 31 of the substrate processing device 100 according to some embodiments of the present invention may include a load measuring rod 311 pressed by the load of the saturated recovery container B2 that overcomes the elastic restoring force of the elastic component E, and a light sensor 312 that cuts off the light path formed from the light emitting part 312a to the light receiving part 312b through a baffle 313 formed on the load measuring rod 311.

[0139] Therefore, it is possible that, if the weight measuring device 31 is used, if the saturated recovery container B2 contained in the temporary storage device 30 is transferred to the load measuring rod 311, the load measuring rod 311 overcomes the elastic restoring force of the elastic component E due to the weight of the saturated recovery container B2 and descends, and if the light path formed from the light emitting part 312a to the light receiving part 312b is cut off by the baffle 313, it is sensed and the loading status of the saturated recovery container B2 is accurately confirmed again.

[0140] Therefore, according to the present invention, the internal loading amount of the recycling objects to be recycled in the recycling container B can be automatically confirmed, the recycling container can be loaded while avoiding interference from the surroundings, and the impact of the recycling container can be alleviated by using a buffer component.

[0141] Fig.19 FIG. 1 is a sequence diagram showing a substrate processing method according to some embodiments of the present invention.

[0142] like Figures 1 to 19As shown, a substrate processing method according to some embodiments of the present invention may include (a) a step of guiding a recycling object 1 generated during a semiconductor production process to a loading position of a recycling container B if the recycling object 1 falls from a pickup head H, (b) a step of replacing a saturated recycling container B2 loaded with recycling objects 1 to a level above a reference value with an empty recycling container B1, (c) a step of receiving a saturated recycling container B2 and transferring it to a temporary standby position where the recycling object 1 can be discarded, (d) a step of temporarily accommodating at least one saturated recycling container B2 transferred to the temporary standby position, (e) a step of discarding the recycling object 1 accommodated in the temporarily accommodated saturated recycling container B2 into a waste tank 51, and (f) a step of transferring the empty recycling container B1 where the recycling object 1 falls to a container replacement device 10.

[0143] The present invention is described with reference to the embodiments shown in the accompanying drawings, but this is only exemplary, and those with ordinary knowledge in the art will understand that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention shall be determined by the technical concept of the attached claims.

Claims

1. A substrate processing device, comprising: A container replacement device for replacing a saturated recovery container loaded with recovery objects generated in a semiconductor production process to a level exceeding a reference value with an empty recovery container; as well as The container transfer device receives at least one of the saturated recovery containers from the container replacement device and transfers the container to a disposal position or a temporary standby position where the recovery object can be disposed of.

2. The substrate processing apparatus according to claim 1, wherein: The recycling objects are materials or defective products that have failed to pass the acceptance process in the semiconductor package cutting and sorting equipment.

3. The substrate processing apparatus according to claim 1, wherein: The container replacement device comprises: A carrier for placing a plurality of the recycling containers; and An actuator moves the stage or the recovery container so that the saturated recovery container located at the loading position can be moved to a transfer position.

4. The substrate processing apparatus according to claim 3, wherein: The stage is an XY stage in which a plurality of the recovery containers are arranged in M ​​rows and N columns and is provided to be movable in a first direction and a second direction.

5. The substrate processing apparatus according to claim 3, wherein: The actuator comprises: A first actuator moves the stage in a first direction; and The second actuator moves the stage in a second direction.

6. The substrate processing apparatus according to claim 1, wherein: The container transfer device is a transfer robot arm that picks up and transfers the saturated recovery container located at a transfer position.

7. The substrate processing apparatus according to claim 6, wherein: A distance sensing sensor for grasping the position of the recovery container and avoiding interference is formed on one side of the transfer robot arm.

8. The substrate processing apparatus according to claim 1, wherein: The substrate processing device further comprises: A temporary storage device temporarily stores at least one of the saturated recovery containers transferred to the temporary standby position by the container transfer device.

9. The substrate processing apparatus according to claim 8, wherein: The temporary storage device is a shelf or a conveying device capable of temporarily storing or transporting a plurality of the saturated recovery containers.

10. The substrate processing apparatus according to claim 8, wherein: The temporary storage device is formed with a weight measuring device for measuring the weight of the saturated recovery container to confirm the saturated state.

11. The substrate processing apparatus according to claim 10, wherein: The weight measuring device comprises: a load measuring rod pressed by the load of the saturated recovery container overcoming the elastic restoring force of the elastic member; and The optical sensor blocks a light path formed from the light emitting portion to the light receiving portion by a baffle formed on the load measuring rod.

12. The substrate processing apparatus according to claim 1, wherein: The substrate processing device further comprises: The loading amount sensing device can sense the loading amount of the saturated recovery container.

13. The substrate processing apparatus according to claim 12, wherein: The load amount sensing device includes at least an optical sensor for sensing the recycling objects recovered in the saturated recycling container, a weight sensing sensor for measuring the weight of the saturated recycling container or the recycling objects, a counting sensor for sensing the number of the recycling objects that fall, a timer for sensing the recycling time of the recycling objects, and any one or more of their combinations.

14. The substrate processing apparatus according to claim 8, wherein: The substrate processing device further comprises: The disposal device disposes the recovery object accommodated in the saturated recovery container temporarily accommodated in the temporary accommodation device into a disposal tank.

15. The substrate processing apparatus according to claim 14, wherein: The waste device comprises: a container fixing device for fixing the saturated recovery container received from the temporary accommodation device; and The overturning device overturns the container fixing device so that the recycling object contained in the saturated recovery container can fall into the waste tank.

16. The substrate processing apparatus according to claim 15, wherein: The reversing device reverses the container fixing device again so that the empty recovery container after the recovery object has fallen can face upward and be transferred to the container replacement device by the container transfer device.

17. The substrate processing apparatus according to claim 1, wherein: The recovery container is generally in the shape of a cylinder with an open top, and a buffer member for preventing impact is formed on at least a portion of a side surface.

18. The substrate processing apparatus according to claim 1, wherein: The substrate processing device further comprises: The guide member, which is generally funnel-shaped, guides the recovery object dropped from the pickup head to the loading position of the recovery container.

19. A substrate processing method, comprising: (a) if the recycling object generated in the semiconductor production process falls from the pickup head, the step of guiding the falling recycling object to the loading position of the recycling container; (b) replacing a saturated recovery container loaded with the recovery object to a value exceeding a reference value with an empty recovery container; (c) receiving the saturated recovery container and moving it to a temporary standby position where the recovery object can be discarded; (d) temporarily accommodating at least one of the saturated recovery containers moved to the temporary standby position; (e) a step of discarding the recovery object contained in the temporarily contained saturated recovery container into a waste tank; and (f) A step of transferring the empty recovery container after the recovery object has fallen to a container replacement device.

20. A substrate processing device, comprising: A container replacement device for replacing a saturated recovery container loaded with recovery objects generated in a semiconductor production process to a level exceeding a reference value with an empty recovery container; as well as a container transfer device that receives at least one of the saturated recovery containers from the container replacement device and transfers the container to a disposal position or a temporary standby position where the recovery object can be disposed of, The recycling objects are materials or defective products that have not passed the acceptance process in the semiconductor package cutting and sorting equipment. The container replacement device comprises: A carrier for placing a plurality of the recycling containers; and an actuator, which moves the carrier or the recovery container so that the saturated recovery container located at the loading position can be moved to the transfer position, The stage is an XY stage that is configured to have a plurality of the recovery containers arranged in M ​​rows and N columns and is movable in the first direction and the second direction. The actuator comprises: A first actuator moves the stage in a first direction; and a second actuator, causing the stage to move in a second direction, The container transfer device is a transfer robot arm that picks up and transfers the saturated recovery container located at the transfer position. The substrate processing device further comprises: a temporary storage device for temporarily storing at least one of the saturated recovery containers transferred to the temporary standby position by the container transfer device, The temporary storage device is formed with a weight measuring device for measuring the weight of the saturated recovery container to confirm the saturated state. The substrate processing device further comprises: The loading amount sensing device can sense the loading amount of the saturated recovery container.

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