Wafer thickness detection and automatic sorting apparatus

Abstract

The application discloses a wafer thickness detection automatic sorting device, which comprises a first conveying belt, the two sides of one end of the first conveying belt are respectively connected with a second conveying belt and a third conveying belt in a transmission mode, a sorting device is arranged between the second conveying belt and the third conveying belt close to one end of the first conveying belt, a thickness scanning device is arranged at one end of the first conveying belt, the first conveying belt comprises two transmission rollers arranged in a symmetrical mode, the outer rings of the two ends of each transmission roller are respectively connected with a transmission belt in a transmission mode, the two ends of one transmission roller are respectively connected with the second conveying belt and the third conveying belt in a transmission mode, and a centering device is arranged between the two transmission belts. The wafer thickness detection automatic sorting device has the advantages that comprehensive detection and sorting can be realized by cooperating with an automatic conveying device, the fragile silicon wafer cannot be damaged, the detection efficiency is improved, the labor cost is reduced, the centering can be realized for silicon wafers with different sizes, and the fault tolerance of the whole device is improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of semiconductor wafers, and particularly relates to a wafer thickness detection automatic sorting device. BACKGROUND

[0002] Patent No. CN116659441A discloses a detection device for detecting the thickness of a semiconductor wafer, and the application relates to the technical field of semiconductor wafers, and comprises a workbench, the bottom of the workbench is provided with support feet of a hollow structure, the lower end of the support feet is provided with a base of a hollow structure, the upper four side walls of the support feet are all connected with L-shaped channel plates in communication with the interiors thereof, the ends of the L-shaped channel plates away from the support feet are all connected with the lower part of the workbench, and the upper part of the workbench is provided with four limiting shells corresponding to the positions of the L-shaped channel plates, and the limiting shells are in communication with the interiors of the L-shaped channel plates. The detection device for detecting the thickness of a semiconductor wafer can simultaneously clamp and position the semiconductor wafer in four directions through the compression of gas, the positioning speed is fast, and the semiconductor wafer can be prevented from deviating, so that the accuracy of the thickness detection of the semiconductor wafer is ensured.

[0003] In the above patent technology, the four directions of the semiconductor wafer can be clamped and positioned simultaneously through the compression of gas, but the wafer cannot be aligned and centered according to the scanning position of the scanning equipment, and the silicon wafer can be mass-produced at present, the silicon wafer itself is relatively fragile, and special care needs to be taken during manufacturing and transportation to avoid damage, so that the wafer is basically placed and detected by manual operation to determine whether the wafer is qualified or unqualified and then sorted, and the wafer cannot be automatically detected and sorted in cooperation with a conveying device.

[0004] Therefore, a wafer thickness detection automatic sorting device needs to be provided to solve the above problems. SUMMARY

[0005] The application aims to provide a wafer thickness detection automatic sorting device to solve the problems in the background art.

[0006] To achieve the above-mentioned purpose, the application provides the following technical scheme: a wafer thickness detection automatic sorting device, comprising a first conveying belt, the two sides of one end of the first conveying belt are respectively connected in transmission with a second conveying belt and a third conveying belt, a sorting device is arranged between the second conveying belt and the third conveying belt close to one end of the first conveying belt, and a thickness scanning device is arranged at one end of the first conveying belt.

[0007] The first conveying belt comprises two transmission rollers arranged symmetrically, the outer rings at the two ends of each transmission roller are respectively connected in transmission with a transmission belt, one end of each transmission roller is connected in transmission with the second conveying belt and the third conveying belt, and a centering device is arranged between the two transmission belts.

[0008] The thickness scanning device comprises a reciprocating screw structure connected with a visual detector, one end of the reciprocating screw structure is in transmission connection with a second servo motor, the other end of the reciprocating screw structure is in transmission connection with a first belt pulley, the first belt pulley is in transmission connection with a differential belt, the differential belt is in transmission connection with a second belt pulley, one end of the second belt pulley is in transmission connection with a gear rod, the other end of the gear rod is in transmission connection with a first bevel gear, the first bevel gear is in transmission connection with a second bevel gear, the inner ring of the second bevel gear is connected with the outer ring of a rotating column, the lower end of the rotating column is connected with a connecting column, and the connecting column is connected with a centering device.

[0009] The centering device comprises a base, the base is connected with a cylinder at the middle position of the top, the output end of the cylinder is connected with a lifting disc, the lifting disc is connected with symmetrically arranged lifting rods, the lifting rods are connected with a top ring plate, the top ring plate is connected with one end of four connecting rods, the other end of the four connecting rods is in rotary connection with a sliding block, the sliding block is in sliding connection with the upper end of a right-angle rod, and the lower end of the right-angle rod is connected with the base.

[0010] Further, the sorting device comprises a sorting seat, the sorting seat is provided with a hollow chute, the chute is in sliding connection with a sorting rod, the lower end of the sorting rod is connected with a first tooth block, the first tooth block is in meshing connection with a first servo motor, the output end of the first servo motor is in meshing connection with a second tooth block, the second tooth block is connected with a middle position of an extrusion rod, the two ends of the extrusion rod are in contact with the bottom of a U-shaped supporting block, the U-shaped supporting block is in sliding connection with the top of a supporting rod, and the supporting rod is connected with the thickness scanning device.

[0011] Further, the two ends of the inner wall of the U-shaped supporting block are in rotary connection with first rotary rollers, and the first rotary rollers are in contact with the transmission belt of the first conveying belt.

[0012] Further, a suction disc is arranged at the upper end of the rotating column, a vacuum pump is arranged in the suction disc, and the top outer ring of the suction disc is a horizontal downward inclined surface.

[0013] Further, the top of the sliding block is in rotary connection with a rotary rod, and the rotary rod is in contact with the outer ring of the silicon wafer.

[0014] Further, the top of the vacuum pump is higher than the top of the first conveying belt, the lower end of the horizontal downward inclined surface of the vacuum suction disc is lower than the first conveying belt, and the upper end of the horizontal downward inclined surface of the vacuum suction disc is higher than the top of the vacuum pump.

[0015] Compared with the prior art, the wafer thickness detection and automatic sorting device has the following advantages:

[0016] (1) The silicon wafer is sent into the thickness detection and sorting device by the first conveying belt, and then the centering device centers the silicon wafer at the middle position of the thickness scanning device, the thickness scanning device is adsorbed and rotated, and the middle line position of the silicon wafer is scanned transversely on the surface of the silicon wafer, after the qualified and unqualified silicon wafers are detected, the silicon wafer is offset by the sorting device, and the silicon wafer is conveyed by the first conveying belt again, the silicon wafer is moved by the contact and offset of the sorting device, so that the silicon wafer is transferred to the second conveying belt and the third conveying belt for the distinction of qualified and unqualified, the overall detection and sorting of the silicon wafer are realized by the cooperation of the first conveying belt, the second conveying belt and the third conveying belt, the fragile silicon wafer is ensured not to be damaged, the detection efficiency is improved, the labor cost is reduced, and the overall fault tolerance of the equipment is improved.

[0017] (2) The reciprocating screw rod structure is driven by the second servo motor to move the visual detector to scan the silicon wafer, and the reciprocating screw rod structure drives the first pulley, the second pulley, the differential belt, the gear rod and the rotating column, so that the reciprocating screw rod structure drives the visual detector to move while driving the silicon wafer to rotate, so as to more comprehensively scan the thickness and surface defect of the silicon wafer, and the first pulley, the second pulley and the differential belt form a differential speed, so that the silicon wafer rotates more, and the upper visual detector moves slower, so that the comprehensiveness of scanning is further improved.

[0018] (3) The lifting of the output end of the air cylinder can drive the lifting disc, the lifting rod and the one end of the connecting rod to lift, and the other end of the connecting rod can drive the sliding block to slide along the right-angle rod, so as to clamp and center the silicon wafer inwardly or outwardly, so as to facilitate the transverse movement of the visual detector along the middle line of the silicon wafer for scanning, so as to more comprehensively scan the thickness, and the device can center different sizes of silicon wafers to improve the fault tolerance of the device.

[0019] (4) Since the self-rotation of the silicon wafer is scanned more comprehensively, but the contact of the sliding block can cause wear of the silicon wafer, therefore the top of the sliding block is rotationally connected with the rotating rod, and the outer circle of the silicon wafer is in contact with the rotating rod, so as to avoid the wear of the outer circle of the silicon wafer. SHEET DESCRIPTION

[0020] Figure 1 It is a schematic diagram of the overall structure of the present application;

[0021] Figure 2 It is a schematic diagram of the structure of the sorting device in the present application;

[0022] Figure 3 It is a schematic diagram of part of the structure of the sorting device in the present application;

[0023] Figure 4 It is Figure 2Enlarged view of point A in the middle;

[0024] Figure 5 Schematic diagram of the structure of the centering device of the present invention;

[0025] Figure 6 Schematic diagram of the thickness scanning device of the present invention;

[0026] Figure 7 It is a schematic diagram of the cross-sectional structure of the present invention;

[0027] Figure 8 It is a partial structural schematic diagram of the centering device in the present invention.

[0028] In the figure: 1-first conveyor belt, 2-second conveyor belt, 3-third conveyor belt, 4-sorting device, 41-sorting seat, 42-sorting rod, 43-first gear block, 44-first private service motor, 45-second gear block, 46-squeezing rod, 47-U-shaped support block, 48-support rod, 471-first rotating roller, 5-centering device, 51-base, 52-cylinder, 53-lifting plate, 54-lifting rod, 55-top ring plate, 56- Connecting rod, 57-slider, 571-rotating rod, 58-right-angle rod, 6-thickness scanning device, 611-reciprocating screw structure, 612-second private service motor, 613-first pulley, 614-differential belt, 615-second pulley, 616-gear rod, 617-first bevel gear, 618-second bevel gear, 619-rotating column, 620-connecting column, 62-visual inspection instrument, 63-suction cup, 64-vacuum pump. DETAILED DESCRIPTION

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] See also Figures 1-8The application provides a wafer thickness detection automatic sorting device, which comprises a first conveying belt 1, two sides of one end of the first conveying belt 1 are respectively connected with a second conveying belt 2 and a third conveying belt 3 in a transmission mode, a sorting device 4 is arranged between the second conveying belt 2 and the third conveying belt 3 close to the one end of the first conveying belt 1, a thickness scanning device 6 is arranged at the one end of the first conveying belt 1, the first conveying belt 1 comprises two transmission rollers arranged in a symmetrical mode, outer rings at two ends of one of the transmission rollers are respectively connected with a transmission belt in a transmission mode, the two transmission belts are connected with the second conveying belt 2 and the third conveying belt 3 in a transmission mode, and a centering device 5 is arranged between the two transmission belts, silicon wafers are sent into the thickness detection sorting device 4 by the first conveying belt 1, then the centering device 5 centers the silicon wafers at a middle position of the thickness scanning device 6, the thickness scanning device 6 adsorbs and rotates the silicon wafers, and the silicon wafers are scanned on the surface in a transverse mode from the middle line position of the silicon wafers, after qualified and unqualified silicon wafers are detected, the silicon wafers are offset by the sorting device 4, the silicon wafers are conveyed by the first conveying belt 1 again, the silicon wafers are moved by being offset by the sorting device 4, and then the silicon wafers are transferred to the second conveying belt 2 and the third conveying belt 3 to be distinguished from each other, so that the silicon wafers are comprehensively detected and sorted by the first conveying belt 1, the second conveying belt 2 and the third conveying belt 3 in an automatic mode, the fragile silicon wafers are prevented from being damaged, the detection efficiency is improved, the labor cost is reduced, and the centering of silicon wafers of different sizes is realized, and the fault tolerance of the whole device is improved.

[0031] The sorting device 4 comprises a sorting seat 41, the sorting seat 41 is provided with a hollow chute, the hollow chute is connected with a sorting rod 42 in a sliding mode, the lower end of the sorting rod 42 is connected with a first tooth block 43, the first tooth block 43 is engaged with a first servo motor 44, the output end of the first servo motor 44 is engaged with a second tooth block 45, the second tooth block 45 is connected with an extrusion rod 46 at a middle position, the two ends of the extrusion rod 46 are in contact with the bottom of a U-shaped supporting block 47, the U-shaped supporting block 47 is connected with a supporting rod 48 at the top in a sliding mode, the supporting rod 48 is connected with the thickness scanning device 6, qualified and unqualified silicon wafers are detected by the thickness scanning device 6, then the first servo motor 44 is positively rotated or reversely rotated, so that the sorting rod 42 is moved, the extrusion rod 46 drives the U-shaped supporting block 47 to be lifted at the same time by the second tooth block 45, the first rotating roller 471 lifts the transmission belt of the first conveying belt 1, the transmission belt lifts the silicon wafers to the sorting rod 42, the silicon wafers are moved to the second conveying belt 2 or the third conveying belt 3 by being offset by the contact of the silicon wafers and the sorting rod 42, and the silicon wafers are sorted.

[0032] The inner walls of the U-shaped supporting block 47 are connected with the first rotating roller 471 in a rotating mode, the first rotating roller 471 is in contact with the transmission belt of the first conveying belt 1, the first rotating roller 471 can avoid the contact between the U-shaped supporting block 47 and the transmission belt of the first conveying belt 1 to cause abrasion, and the service life of the transmission belt is improved.

[0033] The thickness scanning device 6 comprises a reciprocating wire rod structure 611 connected with the visual detector 62, one end of the reciprocating wire rod structure 611 is in transmission connection with the second servo motor 612, the other end of the reciprocating wire rod structure 611 is in transmission connection with the first belt pulley 613, the first belt pulley 613 is in transmission connection with the differential belt 614, the differential belt 614 is in transmission connection with the second belt pulley 615, the second belt pulley 615 is in transmission connection with one end of the gear rod 616, the other end of the gear rod 616 is in transmission connection with the first bevel gear 617, the first bevel gear 617 is in transmission connection with the second bevel gear 618, the inner ring of the second bevel gear 618 is connected with the outer ring of the rotating column 619, the lower end of the rotating column 619 is connected with the connecting column 620, the connecting column 620 is connected with the centering device 5, the reciprocating wire rod structure 611 is driven by the second servo motor 612, the visual detector 62 is moved by the reciprocating wire rod structure 611 to scan the silicon wafer, at the same time, the reciprocating wire rod structure 611 drives the first belt pulley 613, the second belt pulley 615, the differential belt 614, the gear rod 616 and the rotating column 619, so that the reciprocating wire rod structure drives the visual detector 62 to move while also driving the silicon wafer to rotate, so as to more comprehensively scan the thickness and surface defect of the silicon wafer, and the first belt pulley 613, the second belt pulley 615 and the differential belt 614 form a differential speed, so that the number of rotations of the silicon wafer is large and the upper visual detector 62 moves slowly, so that the comprehensiveness of scanning is further improved.

[0034] The upper end of the rotating column 619 is provided with a suction cup 63, a vacuum pump 64 is arranged in the suction cup 63, the outer ring of the top of the suction cup 63 is a horizontal downward inclined surface with an inclination of 10 degrees, the horizontal downward inclined surface with an inclination of 10 degrees of the outer ring of the top of the suction cup 63 facilitates the movement of the silicon wafer to the upper end of the suction cup 63, and then the vacuum pump 64 is started to be fixed to the upper end of the vacuum pump 64, so as to ensure the stability of the silicon wafer during rotation.

[0035] The centering device 5 comprises a base 51, the middle position of the top of the base 51 is connected with a pneumatic cylinder 52, the output end of the pneumatic cylinder 52 is connected with a lifting disc 53, the lifting disc 53 is connected with symmetrically arranged lifting rods 54, the lifting rods 54 are connected with a top ring plate 55, the top ring plate 55 is connected with one end of four connecting rods 56, the other end of the four connecting rods 56 is in rotary connection with a sliding block 57, the sliding block 57 is in sliding connection with the upper end of a right-angle rod 58, the lower end of the right-angle rod 58 is connected with the base 51, through the lifting of the output end of the pneumatic cylinder 52, the lifting disc 53, the lifting rods 54 and one end of the connecting rods 56 can be lifted, and the other end of the connecting rods 56 drives the sliding block 57 to slide along the right-angle rod 58, so as to clamp and take the silicon wafer inward or outward for centering, which facilitates the horizontal movement and scanning of the visual detector 62 along the center line of the silicon wafer, so as to more comprehensively scan the side thickness, and the centering of the silicon wafer of different sizes can be realized, so as to improve the fault tolerance of the equipment in centering silicon wafers of different sizes.

[0036] Since the silicon wafer is scanned more completely by self-rotation, but the contact of the slider 5757 can cause the wear of the silicon wafer, the top of the slider 57 is rotationally connected with the rotating rod 571, and the outer circle of the silicon wafer is in contact with the rotating rod 571, so that the wear of the outer circle of the silicon wafer can be avoided.

[0037] The top of the vacuum pump 64 is higher than the top of the first conveying belt 1, the lower end of the horizontal and downward 10-degree inclined surface of the vacuum chuck 63 is lower than the first conveying belt 1, and the upper end of the horizontal and downward 10-degree inclined surface of the vacuum chuck 63 is higher than the top of the vacuum pump 64, so that the bottom of the silicon wafer is prevented from being in contact with the surface of the first conveying belt 1 during the self-rotation of the silicon wafer, and the wear of the bottom of the silicon wafer is avoided.

[0038] It is apparent for a person skilled in the art that the present application is not limited to the details of the above-described exemplary embodiments, but can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all respects as illustrative and not restrictive, the scope of the present application being defined by the appended claims rather than the above description, and it is intended to embrace all changes and modifications that fall within the meaning and scope of the equivalent elements of the claims. Any reference signs in the claims should not be construed as limiting the claims to which they belong.

Claims

1. A wafer thickness detection and automatic sorting device, comprising a first conveyor belt (1), characterized in that: The two sides of one end of the first conveyor belt (1) are respectively connected to the second conveyor belt (2) and the third conveyor belt (3); a sorting device (4) is provided between the second conveyor belt (2) and the third conveyor belt (3) near one end of the first conveyor belt (1); and a thickness scanning device (6) is provided at one end of the first conveyor belt (1); The first conveyor comprises two symmetrically arranged transmission rollers, the outer rings at both ends of the transmission rollers are respectively connected to a transmission belt, the two ends of one of the transmission rollers are respectively connected to the second conveyor belt (2) and the third conveyor belt (3), and a centering device (5) is provided between the two transmission belts; The thickness scanning device (6) includes a reciprocating screw rod structure (611), the reciprocating screw rod structure (611) is connected to the visual detector (62), one end of the reciprocating screw rod structure (611) is connected to the second servo motor (612), the other end of the reciprocating screw rod structure (611) is connected to the first pulley (613), the first pulley (613) is connected to the differential belt (614), the differential belt (614) is connected to the second pulley (615), and the second pulley (615) is connected to the second pulley (615). ) is connected in transmission, the second pulley (615) is connected in transmission with one end of the gear rod (616), the other end of the gear rod (616) is connected in transmission with the first bevel gear (617), the first bevel gear (617) is connected in transmission with the second bevel gear (618), the inner ring of the second bevel gear (618) is connected to the outer ring of the rotating column (619), the lower end of the rotating column (619) is connected to the connecting column (620), and the connecting column (620) is connected to the centering device (5); The centering device (5) includes a base (51), the base (51) is connected to a cylinder (52) at the middle position of the top, the output end of the cylinder (52) is connected to a lifting plate (53), the lifting plate (53) is connected to symmetrically arranged lifting rods (54), the lifting rods (54) are connected to a top ring plate (55), the top ring plate (55) is connected to one end of four connecting rods (56), the other ends of the four connecting rods (56) are rotatably connected to a slider (57), the slider (57) is slidably connected to the upper end of a right-angle rod (58), and the lower end of the right-angle rod (58) is connected to the base (51).

2. The wafer thickness detection and automatic sorting device according to claim 1, characterized in that: The sorting device (4) includes a sorting seat (41), the sorting seat (41) is provided with a hollow chute, the hollow chute is slidably connected to the sorting rod (42), the lower end of the sorting rod (42) is connected to the first tooth block (43), the first tooth block (43) is engaged with the first private service motor (44), the output end of the first private service motor (44) is engaged with the second tooth block (45), the second tooth block (45) is connected to the middle position of the extrusion rod (46), the two ends of the extrusion rod (46) are in contact with the bottom of the U-shaped support block (47), the U-shaped support block (47) is slidably connected to the top of the support rod (48), and the support rod (48) is connected to the thickness scanning device (6).

3. The wafer thickness detection and automatic sorting device according to claim 2, characterized in that: The two ends of the inner wall of the U-shaped support block (47) are rotatably connected to the first rotating roller (471), and the first rotating roller (471) is in contact with the transmission belt of the first conveyor belt (1).

4. The wafer thickness detection and automatic sorting device according to claim 1, characterized in that: A suction cup (63) is provided at the upper end of the rotating column (619), a vacuum pump (64) is provided inside the suction cup (63), and the outer ring of the top of the suction cup (63) is a horizontally inclined surface with a downward angle of 10 degrees.

5. The wafer thickness detection and automatic sorting device according to claim 1, characterized in that: The top of the slider (57) is rotatably connected to a rotating rod (571), and the rotating rod (571) is in contact with the outer ring of the silicon wafer.

6. The wafer thickness detection and automatic sorting device according to claim 4, characterized in that: The top of the vacuum pump (64) is higher than the top of the first conveyor belt (1), the lower end of the horizontally inclined surface of the vacuum suction cup (63) at a downward angle of 10 degrees is lower than the first conveyor belt (1), and the upper end of the horizontally inclined surface of the vacuum suction cup (63) at a downward angle of 10 degrees is higher than the top of the vacuum pump (64).

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