A chip packaging device and a packaging method thereof

Abstract

The application relates to the technical field of semiconductor chip packaging, and discloses a chip packaging device and a packaging method thereof, which is used for packaging a chip shell, the chip shell is provided with a glue injection hole and an air extraction hole, and the chip packaging device comprises a rack and a conveying structure; a packaging support is installed on the conveying structure and used for placing a chip to be packaged; when the chip shell is moved to a specific position on the packaging support, an extension push rod drives a positioning block to position the chip shell; when the positioning block is moved to a proper position, a connecting seat drives a glue injection pipe and an air extraction pipe to arrive at a specified position; simultaneous operation of glue injection and air extraction is started until the glue completely fills the chip shell. Through mechanical positioning, elastic triggering and multi-point cooperative technology, high precision, high uniformity and full automatic control of chip packaging are realized; the positioning deviation, uneven filling and glue overflow problems in the traditional process are effectively solved; and the application is suitable for complex packaging requirements.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor chip packaging, in particular to a chip packaging device and a packaging method thereof. BACKGROUND

[0002] The chip packaging process includes a surrounding fence packaging method, which forms a surrounding dam on the outer periphery of the chip by using a packaging glue, then fills the packaging glue in the surrounding dam, and thus completes the packaging of the semiconductor. Although this packaging method improves the yield of semiconductor devices, the amount of glue supplied is unstable during packaging, especially during the surrounding dam forming operation, which causes partial collapse, thus affecting the packaging effect and leading to incomplete packaging appearance.

[0003] The prior art provides a chip packaging device and a chip packaging method, application number CN202410631642.5, which is a method or device specifically suitable for manufacturing semiconductor devices. The chip packaging device includes a base plate, one end of the base plate is provided with a positioning mechanism, the other end of the base plate is provided with a placing table, a transfer mechanism is arranged between the positioning mechanism and the placing table, and a packaging mechanism is arranged on the base plate. The positioning mechanism can position the packaging substrate. The chip packaging method uses the chip packaging device to package the chip. The device and method can efficiently complete the packaging operation, and can ensure the connection effect between the packaging shell and the packaging substrate after packaging. However, the prior art, especially the above-mentioned scheme, still has the following problems: positioning deviation, uneven filling, and glue overflow may occur when the device actually connects the chip for glue injection. Therefore, we provide a chip packaging device and a packaging method thereof. SUMMARY

[0004] The purpose of the present application is to provide a technical solution that realizes high precision, high uniformity, and full automation control of chip packaging through mechanical positioning, elastic triggering, and multi-point coordination technology, in order to solve the problems in the prior art mentioned in the background.

[0005] To achieve the above-mentioned purpose, the present application adopts the following technical solutions:

[0006] A chip packaging device for packaging a chip shell, the chip shell being provided with a glue injection hole and an air extraction hole, comprising:

[0007] A rack and a conveying structure, the conveying structure being provided with a packaging support for placing a chip to be packaged, the rack being provided with a connecting seat capable of moving in three dimensions, the connecting seat being provided with a plurality of groups of glue injection pipes and air extraction pipes, the conveying structure being provided with a conveying track for conveying movement of the chip, the packaging support being provided with telescopic push rods on both sides of the conveying track, the telescopic ends of the telescopic push rods being provided with positioning blocks for clamping the chip shell, and the positioning blocks being provided with air extraction nozzles.

[0008] When the chip shell moves to a specific position on the packaging support, the telescopic push rod drives the positioning block to position the chip shell, when the positioning block moves to the appropriate position, the connecting seat drives the glue injection pipe and the air extraction pipe to the specified position, and the glue injection and air extraction operations are started at the same time, until the glue completely fills the chip shell.

[0009] Preferably, the chip shell is provided with grooves on both sides, and the chip shell is provided with heat-conducting pads on both sides and the bottom; the chip shell is provided with glue injection holes on the top, and the chip shell is provided with a plurality of air extraction holes on the top and the sides.

[0010] Preferably, the positioning block is provided in a shape matching the grooves on the chip shell, and the positioning block is provided with positioning grooves for matching the heat-conducting pads, one end of the positioning block close to the chip shell is provided in a protruding structure, and the two sides of the protruding structure are provided in arc-shaped parts, when the telescopic push rod pushes the positioning block to move, the arc-shaped parts contact the grooves of the chip shell to make the chip horizontally move, so as to achieve accurate positioning.

[0011] Preferably, the bottom of the connecting seat is connected with a movable column, the mounting plate is movably sleeved on the movable column, and the elastic member is sleeved on the movable column and supported between the connecting seat and the mounting plate.

[0012] Preferably, the coaxial end of the elastic member is provided with a pressure sensor, and a controller connected with the pressure sensor is further included, a pressure threshold value is set through the pressure sensor, and the glue injection structure and the air extraction structure are controlled through the real-time feedback of the pressure sensor.

[0013] Preferably, the air extraction holes include first air extraction holes and second air extraction holes, the top of the chip shell is provided with two groups of glue injection holes and first air extraction holes, and the sides of the chip shell are provided with second air extraction holes; the mounting plate is provided with two groups of glue injection pipes and two groups of air extraction pipes, the two groups of air extraction pipes are distributed on the two sides of the glue injection pipes, and the air extraction nozzles on the positioning block are also provided with two groups.

[0014] Preferably, the mounting plate is movably mounted on the connecting seat, and an elastic member is arranged between the connecting seat and the mounting plate, when the elastic member is compressed to a specified pressure threshold value, the glue injection pipe, the air extraction pipe and the air extraction nozzle start to work.

[0015] Preferably, the top of the rack is provided with an XY-axis transfer structure and a Z-axis transfer structure, the XY-axis transfer structure and the Z-axis transfer structure are arranged at the bottom of the packaging support, the connecting seat is movably mounted on the rack in three dimensions, and the connecting seat is movably achieved in three dimensions through the XY-axis transfer structure and the Z-axis transfer structure.

[0016] Preferably, the bottom of the Z-axis transfer structure is provided with a third driver, the rotating end of the third driver is provided with a rotating adjusting plate, the rotating adjusting plate is provided with a connecting column which is rotatably connected to the first driver, and a connecting seat is connected to the third driver through the connecting column and the rotating adjusting plate.

[0017] The application further provides a packaging method of the chip packaging device, comprising the following steps: S1, chip positioning and conveying; S2, accurate positioning and clamping; S3, alignment of the glue injection and air extraction structure; S4, downward movement and triggering operation; S5, glue liquid filling monitoring and control; S6, residual glue cleaning and resetting.

[0018] The technical effects and advantages of the application are as follows:

[0019] The chip packaging device and the packaging method thereof have the following advantages compared with the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 Fig. 1 is a schematic diagram of the overall structure of the chip packaging device of the application;

[0021] Figure 2 Fig. 2 is a schematic diagram of part of the structure of the chip packaging device of the application;

[0022] Figure 3 Fig. 3 is a schematic diagram of another part of the structure of the chip packaging device of the application;

[0023] Figure 4 Fig. 4 is a schematic diagram of the three-axis transfer structure in the chip packaging device of the application;

[0024] Figure 5 Fig. 5 is a schematic diagram of the connecting seat and the rotating adjusting plate in the application;

[0025] Figure 6 Fig. 6 is a schematic diagram of the packaging support, the positioning block and the connecting seat in the application;

[0026] Figure 7 Fig. 7 is a schematic diagram of the connecting seat and the rotating adjusting plate in the application; Figure 6 Fig. 8 is an enlarged structural schematic diagram of position A in Fig. 7;

[0027] Figure 8 Fig. 9 is a schematic diagram of the clamping of the positioning block to the packaging shell in the application.

[0028] Fig. 1 is a schematic diagram of a chip packaging device according to an embodiment of the present application;

[0029] 11, frame; 12, conveying structure; 13, packaging support; 14, displacement slot; 15, telescopic member; 16, positioning block; 17, suction driving member; 18, second suction nozzle;

[0030] 21, XY-axis conveying structure; 22, Z-axis moving structure; 23, connecting seat; 24, rotating adjustment plate; 25, glue supply pipe; 26, glue injection pipe; 27, suction pipe; 28, driver one; 29, driver two; 210, driver three; 211, connecting column; 212, elastic member; 213, mounting plate; 214, movable column;

[0031] 31, chip housing; 32, recess; 33, glue injection hole; 34, first suction hole; 35, second suction hole; 36, heat-conducting pad. DETAILED DESCRIPTION

[0032] The subject matter described herein will now be discussed with reference to example implementations. It should be understood that discussions of these implementations are merely provided to enable those skilled in the art to better understand so as to be able to implement the subject matter described herein, and variations in the functions and arrangements of elements discussed can be made without departing from the scope of the content of this specification. Various examples can omit, substitute, or add various procedures or components as appropriate, or in appropriate combination. Also, features described with respect to some examples can be combined in other examples.

[0033] Embodiment One: The present application provides a chip packaging device for packaging a chip housing 31, wherein the chip housing 31 is provided with a glue injection hole 33 and a suction hole, and the chip packaging device comprises: Figures 1 to 8

[0034] A frame 11 and a conveying structure 12, wherein the conveying structure 12 is provided with a packaging support 13 for placing a chip to be packaged, and the frame 11 is provided with a connecting seat 23 capable of moving in three dimensions, and the connecting seat 23 is provided with a plurality of sets of glue injection pipes 26 and suction pipes 27; the conveying structure 12 is provided with a conveying track for chip conveying movement, and the packaging support 13 is provided with telescopic push rods 15 on both sides of the conveying track, and the telescopic ends of the telescopic push rods 15 are provided with positioning blocks 16 for clamping the chip housing 31, and the positioning blocks 16 are provided with suction nozzles 18;

[0035] When the chip housing 31 moves to a specific position on the packaging support 13, the telescopic push rods 15 drive the positioning blocks 16 to position the chip housing 31, and when the positioning blocks 16 move to the appropriate position, the connecting seat 23 drives the glue injection pipes 26 and the suction pipes 27 to the designated position, and the operations of glue injection and suction are simultaneously started, until the glue completely fills the chip housing 31.

[0036] ​Working principle: telescopic push rod 15 drives the arc surface part 110 of the positioning block 16 to embed the chip shell 31 groove 32, after horizontal fine adjustment alignment, the positioning groove 19 clamps the heat conduction pad 36 to complete the fixation and realize the positioning clamping; Three-dimensional dynamic positioning, connecting seat 23 moves three-dimensionally through rack 11, drives glue injection pipe 26 and air extraction pipe 27 to accurately butt joint glue injection hole 33 and air extraction hole; Synchronous glue injection and air extraction, glue injection pipe 26 and air extraction pipe 27, air extraction nozzle 18 are started synchronously, and the glue solution is uniformly filled in the chip shell 31 under the action of negative pressure. High-precision positioning, arc surface part 110 combined with positioning groove 19 realizes horizontal and vertical double positioning, eliminates deviation, and ensures accurate butt joint of glue injection and air extraction holes; Uniform and efficient filling, synchronous operation of glue injection and air extraction, using negative pressure to drive glue flow, avoiding bubble residue, and improving packaging density; Automatic adaptation, three-dimensional moving connecting seat 23 flexibly adjusts the position of glue injection / air extraction assembly, and adapts to the layout of glue injection hole 33 and air extraction hole of different chip shells 31. Process integration, positioning, glue injection and air extraction are completed integrally, reducing manual intervention, and significantly improving packaging efficiency and yield.

[0037] As shown in Figure 7 and Figure 8 , since the chip packaging device of the present application is not for all types of chips, here the corresponding chip shell 31 is introduced, the two sides of the chip shell 31 are provided with grooves 32, and the two sides and the bottom of the chip shell 31 are provided with heat conduction pads 36; The top of the chip shell 31 is provided with a glue injection hole 33, and the top and side of the chip shell 31 are provided with a plurality of air extraction holes.

[0038] As shown in Figure 7 and Figure 8 , the positioning block 16 is arranged to match the shape of the groove 32 on the chip shell 31, and the positioning groove 19 is arranged on the positioning block 16 to cooperate with the heat conduction pad 36. In actual use, the positioning groove 19 clamps the heat conduction pad 36 of the chip to strictly position the chip.

[0039] As shown in Figure 7 and Figure 8 , the end of the positioning block 16 close to the chip shell 31 is provided as a protruding structure, and the two sides of the protruding structure are provided as arc surface parts 110. When the telescopic push rod 15 pushes the positioning block 16 to move, the arc surface part 110 contacts the groove 32 of the chip shell 31 to make the chip move horizontally, so as to realize accurate positioning and ensure the butt joint of the subsequent glue injection structure and air extraction structure.

[0040] As shown in Figure 6 , the packaging platform 13 is provided with a clearance slot 14 for conveying track installation, and the conveying track is arranged as a belt conveyor with a positioning structure. The clearance slot 14 reserves the installation position for the conveying track. Since the conveying track can be arranged in various forms in actual use, the specific embodiments of the conveying track are not shown in the drawings,

[0041] Specifically, as shown in Figure 7 , the air extraction holes include first air extraction holes 34 and second air extraction holes 35, the top of the chip shell 31 is provided with two groups of glue injection holes 33 and the first air extraction holes 34, and the side of the chip shell 31 is provided with the second air extraction holes 35. For the chip in the drawing, the packaging glue is injected from the top of the chip shell 31, and the air extraction is performed by the air extraction pipe 27 on the top and the air extraction nozzle 18 on the side to make the glue fully fill the inside of the chip shell 31.

[0042] As shown in Figure 6 and Figure 7 , specifically, regarding the setting mode of the glue injection pipe 26 and the air extraction pipe 27 and the corresponding glue injection hole 33 and air extraction hole in actual work, two groups of glue injection pipes 26 and two groups of air extraction pipes 27 are arranged on the mounting plate 213, and the two groups of air extraction pipes 27 are distributed on the two sides of the glue injection pipe 26. The air extraction nozzle 18 on the positioning block 16 is also provided with two groups, and the specific glue injection and air extraction form is that the glue is injected from multiple points on the top, and the air is extracted from multiple points on the top and the side, so that the packaging glue uniformly and fully fills the inside of the chip shell 31.

[0043] As shown in Figure 6 and Figure 7 , regarding the foregoing when the chip shell 31 moves to a specific position on the packaging support 13, the specific position here is set by the operator, and in an embodiment, the specific position refers to when the glue injection pipe 26 on the connecting seat 23 is in complete contact with the glue injection hole 33 of the chip shell 31.

[0044] Specifically, in order to ensure that the glue injection pipe 26 is in complete contact with the glue injection hole 33 and the air extraction pipe 27 is in complete contact with the air extraction hole, the mounting plate 213 is movably mounted on the connecting seat 23, and the elastic member 212 is arranged between the connecting seat 23 and the mounting plate 213. When the elastic member 212 is compressed to a specified pressure threshold, the glue injection pipe 26, the air extraction pipe 27 and the air extraction nozzle 18 start to work, and here, the start to work refers to that the glue injection pipe 26 starts to inject glue, and the air extraction pipe 27 and the air extraction nozzle 18 start to extract air.

[0045] As shown in Figure 6 , regarding that the mounting plate 213 is movably mounted on the connecting seat 23, the bottom of the connecting seat 23 is connected with a movable column 214, the mounting plate 213 is movably sleeved on the movable column 214, and the elastic member 212 is sleeved on the movable column 214 and supported between the connecting seat 23 and the mounting plate 213, and these structures realize the foregoing functions. More specifically, the coaxial end of the elastic member 212 is provided with a pressure sensor, and a controller connected with the pressure sensor is further provided. The pressure threshold is set through the pressure sensor, and the control of the glue injection structure and the air extraction structure is performed through the real-time feedback of the pressure sensor.

[0046] Specifically, regarding the driving of the suction nozzle 18 and the suction pipe 27, the positioning block 16 is provided with a suction driving part 17 for driving the suction nozzle 18 to suck, and the mounting plate 213 is also provided with a similar suction assembly, which is actually a suction pump or the like structure. More specifically, the suction nozzle 18 and the inlet of the suction pipe 27 are provided with anti-blocking structures and contact identification structures. The anti-blocking structures are used to place the filled glue to block the suction nozzle 18 and the suction pipe 27, and the contact identification structures are used to contact the overflowed glue after the chip shell 31 is filled. After the overflow, the glue contacts the suction nozzle 18 and the suction pipe 27, that is, feedback is obtained to stop the glue injection and suction operation. The contact identification structure is specifically realized by a contact sensor, which is not described here. In addition, the suction driving part 17 and the suction assembly can continue to perform the suction operation to discharge the excess glue blocked in the suction nozzle 18 and the suction pipe 27, so as to avoid affecting the suction operation of the chip in the next cycle process.

[0047] As shown in Figures 1 to 4 , the top of the rack 11 is provided with an XY-axis transfer structure 21 and a Z-axis transfer structure 22, and the XY-axis transfer structure 21 and the Z-axis transfer structure 22 are arranged at the bottom of the packaging support 13. The connecting seat 23 can be three-dimensionally moved on the rack 11, and the connecting seat 23 is three-dimensionally moved by the XY-axis transfer structure 21 and the Z-axis transfer structure 22.

[0048] As shown in Figure 2 , Figure 4 , and Figure 5 , further, the bottom of the Z-axis transfer structure 22 is provided with a driver three 210, and the rotating end of the driver three 210 is provided with a rotating adjustment plate 24. The connecting column 211 is rotatably arranged on the rotating adjustment plate 24 by the driver one 28, and the connecting seat 23 is arranged on the driver three 210 by the connecting column 211 and the rotating adjustment plate 24. Under the cooperation and adjustment of the driver three 210 and the rotating adjustment plate 24, the connecting seat 23 can be radially adjusted along the axis of the connecting column 211. The driver three 210 is actually a rotating drive device with self-locking function, so that the rotating adjustment plate 24 can be rotationally adjusted at the rotating end of the driver three 210, but after adjustment, it is self-locked to maintain a certain angle, thereby facilitating the docking work of the subsequent glue injection structure and suction structure. Specifically, the connecting column 211 is provided with a glue supply pipeline 25 for supplying glue to the glue injection pipe 26. The specific glue supply method is not described in detail as it is common technical knowledge.

[0049] As shown in Figure 4As shown, the rotating adjustment plate 24 is provided with a motor seat for mounting the driver one 28, which can drive the connecting column 211 to rotate on the motor seat, i.e. drive the connecting seat 23 and the mounting plate 213 at the bottom of the connecting column 211 to rotate and adjust. Specifically, the XY-axis transfer structure 21 and the Z-axis transfer structure 22 are both provided with the driver two 29 for driving themselves, and the aforementioned drivers are all servo drivers to realize high-precision driving adjustment.

[0050] Embodiment two: a packaging method of a chip packaging device, comprising the following steps:

[0051] S1: chip positioning and conveying, placing the chip to be packaged on the packaging platform 13 of the conveying structure 12, and moving the chip shell 31 to the set position through the conveying track;

[0052] S2: precise positioning and clamping, starting the telescopic push rod 15 to push the positioning block 16, and adjusting the chip horizontally through the arc surface part 110 to contact the groove 32 until the positioning groove 19 is clamped with the heat-conducting pad 36 to complete the fixation of the chip;

[0053] S3: aligning the glue injection and air extraction structure, driving the connecting seat 23 to move three-dimensionally through the XY-axis transfer structure 21 and the Z-axis transfer structure 22, so that the glue injection pipe 26 and the air extraction pipe 27 correspond to the glue injection hole 33 and the air extraction hole respectively;

[0054] S4: triggering the operation by moving down, when the elastic member 212 is pressed to the set threshold, the pressure sensor feedback signal starts the glue injection of the glue injection pipe 26 and the synchronous air extraction of the air extraction pipe 27 and the air extraction nozzle 18;

[0055] S5: monitoring and controlling the glue liquid filling, detecting the glue liquid overflow signal of the air extraction port through the contact sensor to trigger the stop of glue injection and the closing of the air extraction assembly;

[0056] S6: cleaning and resetting the residual glue, intermittently operating the air extraction driving member 17 to discharge the residual glue, and then resetting the connecting seat 23 to the initial position and releasing the chip through the telescopic push rod 15 to complete the packaging.

[0057] In summary, the application also has the following comprehensive effects: the positioning and clamping mechanism, the arc surface part 110 of the positioning block 16 driven by the telescopic push rod 15 contacts the chip shell 31 groove 32 to realize horizontal fine adjustment, and the positioning groove 19 is combined with the heat-conducting pad 36 to complete accurate positioning of the chip, ensuring that the glue injection pipe 26 and the air extraction pipe 27 are accurately connected with the glue injection hole 33 and the air extraction hole. The elastic pressure triggers the synchronous operation, the connecting seat 23 drives the glue injection pipe 26 and the air extraction pipe 27 to move downward, the pressure sensor signal is triggered by the elastic element 212 under pressure, the glue injection and air extraction are started synchronously, and the contact reliability and process synchronization are ensured. Multi-point glue injection and air extraction cooperation, the top two glue injection pipes 26 and the top / side two groups of air extraction pipes 27 and air extraction nozzles 18 form a multi-point glue injection-air extraction network, which is matched with the air extraction driving element 17 and the air extraction pump to make the glue evenly fill the inside of the chip shell 31 under negative pressure. Sensor linkage control, after the contact sensor detects the glue overflow signal of the air extraction port, the glue injection is automatically stopped and the air extraction is closed; the air extraction driving element 17 operates intermittently to remove the residual glue, avoid blockage, and realize closed-loop control. Three-dimensional dynamic adjustment and adaptation, the three-axis transfer structure and the driver three 210 adjust the three-dimensional position and angle of the connecting seat 23, adapt to the packaging needs of different types of chips, and ensure the flexible positioning of the glue injection structure.

[0058] High-precision positioning and filling uniformity, through the cooperation of the arc surface part 110 and the positioning groove 19, the position deviation of the chip is eliminated, and the glue is evenly filled through the multi-point glue injection-air extraction network to avoid bubbles or gaps and improve the packaging reliability. Elastic pressure trigger and automatic control, the elastic element 212 is linked with the pressure sensor to ensure that the glue injection / air extraction assembly is started after the contact pressure meets the standard, and contact failure is avoided; the contact sensor automatically terminates the operation, reduces manual intervention, and reduces the risk of glue overflow. Anti-clogging and long-term maintenance of equipment, the anti-clogging structure and intermittent air extraction design remove residual glue to prevent air extraction port from being blocked, ensuring the stability of continuous production; the servo driver ensures the movement precision and prolongs the service life of the equipment. Multi-dimensional adjustment enhances adaptability, the three-axis transfer structure and the rotating adjustment plate 24 support the three-dimensional movement and angle adjustment of the connecting seat 23, adapt to different sizes or hole distribution of the chip shell 31, and expand the application range of the device. Efficiency and process quality are improved, synchronous glue injection and air extraction shorten the filling time, sensor closed-loop control reduces process fluctuations, combined with high-precision positioning of the servo drive, significantly improves the packaging efficiency and yield. Through mechanical positioning, elastic trigger, multi-point cooperation and intelligent sensing technology, high precision, high uniformity and full automation control of chip packaging are realized, effectively solving the problems of positioning deviation, uneven filling and glue overflow in traditional processes, and adapting to complex packaging requirements.

[0059] The above describes the embodiments of the present application, but the present application is not limited to the above-described specific embodiments, and the above-described specific embodiments are only illustrative but not restrictive, and those skilled in the art can make many forms under the inspiration of the present application, which all belong to the protection of the present application.

Claims

1. A chip packaging device, characterized in that: A chip housing (31) is used for packaging, wherein the chip housing (31) is provided with a glue injection hole (33) and an air extraction hole, comprising: A frame (11) and a conveying structure (12), wherein a packaging support (13) is installed on the conveying structure (12), and the packaging support (13) is used to place the chip to be packaged, and a connecting seat (23) is installed on the frame (11) so as to be movable in three dimensions, and a plurality of groups of glue injection tubes (26) and air extraction tubes (27) are installed on the connecting seat (23); a conveying track for chip transmission movement is provided on the conveying structure (12), and telescopic push rods (15) are installed on both sides of the conveying track for the packaging support (13), and a positioning block (16) for clamping the chip shell (31) is installed at the telescopic end of the telescopic push rod (15), and an air extraction nozzle (18) is provided on the positioning block (16); When the chip housing (31) moves to a specific position on the packaging support (13), the telescopic push rod (15) drives the positioning block (16) to position the chip housing (31). When the positioning block (16) moves to a suitable position, the connecting seat (23) drives the glue injection tube (26) and the exhaust pipe (27) to the specified position, and starts the glue injection and exhaust operation simultaneously until the glue completely fills the chip housing (31).

2. The chip packaging device according to claim 1, wherein: Grooves (32) are provided on both sides of the chip housing (31), and thermal pads (36) are provided on both sides and the bottom of the chip housing (31); a glue injection hole (33) is provided on the top of the chip housing (31), and a plurality of air extraction holes are provided on the top and sides of the chip housing (31).

3. The chip packaging device according to claim 2, wherein: The positioning block (16) is configured to match the shape of the groove (32) on the chip housing (31), and a positioning groove (19) for matching the thermal pad (36) is provided on the positioning block (16). One end of the positioning block (16) close to the chip housing (31) is configured as a protruding structure, and both sides of the protruding structure are configured as arc-shaped portions (110). When the telescopic push rod (15) pushes the positioning block (16) to move, the arc-shaped portion (110) contacts the groove (32) of the chip housing (31), causing the chip to move horizontally, thereby achieving precise positioning.

4. The chip packaging device according to claim 1, wherein: The bottom of the connecting seat (23) is connected to a movable column (214), the mounting plate (213) is movably mounted on the movable column (214), and the elastic member (212) is mounted on the movable column (214) and supported between the connecting seat (23) and the mounting plate (213).

5. The chip packaging device according to claim 4, characterized in that: The coaxial end of the elastic member (212) is provided with a pressure sensor, and further comprises a controller connected to the pressure sensor, wherein a pressure threshold is set via the pressure sensor, and the glue injection structure and the air extraction structure are controlled via real-time feedback from the pressure sensor.

6. The chip packaging device according to claim 5, characterized in that: The exhaust holes include a first exhaust hole (34) and a second exhaust hole (35), two groups of glue injection holes (33) and the first exhaust hole (34) are provided on the top of the chip housing (31), and the second exhaust hole (35) is provided on the side of the chip housing (31); two groups of glue injection tubes (26) and two groups of exhaust pipes (27) are provided on the mounting plate (213), and the two groups of exhaust pipes (27) are distributed on both sides of the glue injection tube (26), and two groups of exhaust nozzles (18) are also provided on the positioning block (16).

7. The chip packaging device according to claim 6, characterized in that: The mounting plate (213) is movably mounted on the connecting seat (23), and an elastic member (212) is provided between the connecting seat (23) and the mounting plate (213). When the elastic member (212) is compressed to a specified pressure threshold, the glue injection tube (26), the air extraction tube (27) and the air extraction nozzle (18) start to work.

8. The chip packaging device according to any one of claims 1 to 7, characterized in that: An XY-axis transfer structure (21) and a Z-axis transfer structure (22) are installed on the top of the frame (11); the XY-axis transfer structure (21) and the Z-axis transfer structure (22) are arranged on the bottom of the packaging support (13); and the connecting seat (23) realizes three-dimensional movement through the XY-axis transfer structure (21) and the Z-axis transfer structure (22).

9. The chip packaging device according to claim 8, characterized in that: A driver three (210) is installed at the bottom of the Z-axis transfer structure (22), and a rotation adjustment plate (24) is installed at the rotating end of the driver three (210). A connecting column (211) is rotatably installed on the rotation adjustment plate (24) through the driver one (28). The connecting seat (23) is installed on the driver three (210) through the connecting column (211) and the rotation adjustment plate (24). Under the coordinated adjustment of the driver three (210) and the rotation adjustment plate (24), the connecting seat (23) can be rotated and adjusted radially along the axis of the connecting column (211); a motor seat for installing the driver one (28) is provided on the rotation adjustment plate (24), and the driver one (28) can drive the connecting column (211) to rotate on the motor seat.

10. The chip packaging method according to claim 1, wherein: The process includes the following steps: S1: chip positioning and transportation; S2: precise positioning and clamping; S3: alignment of the glue injection and air extraction structure; S4: downward movement triggering operation; S5: glue filling monitoring and control; S6: residual glue cleaning and resetting.

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