Automatic swaying tray material taking and placing device for semiconductor chip processing

Abstract

The invention discloses an automatic swaying tray material taking and placing device for semiconductor chip processing, and relates to the technical field of semiconductor chip processing, the automatic swaying tray material taking and placing device comprises a chassis and a dust removal assembly, a tray is arranged above the chassis, and the dust removal assembly is arranged on the inner side of the tray; and the dust removal assembly comprises a through groove, a vent hole, a vent groove, a collection box, a rotary disc, an annular groove, a material containing groove, a vent hole, a flow dividing groove, an air extraction opening, a filter frame, an air pump and an air outlet pipe, and the through groove is formed in one side of the lower surface of the tray. During use, when materials are taken and placed, the materials can be adsorbed and fixed and detected in the transferring process, dust can be removed and collected through airflow in the material transferring process, dust adhesion is avoided, the materials can be automatically positioned in the material placing process, material deviation is avoided, and after detection is completed, the materials can be automatically separated from the material placing device. And limitation on the materials can be removed, so that unqualified materials are screened out in the transferring process, and automatic sorting of the materials is completed.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor chip processing, in particular to an automatic rocking plate loading and unloading device for semiconductor chip processing. Background Art

[0002] Semiconductor chips are semiconductor devices that can achieve certain functions by etching and wiring on semiconductor sheets. Not only silicon chips, but also common semiconductor materials such as gallium arsenide and germanium. During the processing of semiconductor chips, it is necessary to pick and place materials, so the pick and place device will be used to move the fixed chip materials to the bottom of the mounting equipment to complete the mounting.

[0003] In the prior art, when taking and placing materials, the materials may be contaminated due to the adhesion of dust during the process of taking and placing materials, and after the taking and placing of materials is completed, they need to be inspected and then sorted.

[0004] Therefore, in view of this, the existing structure and defects are studied and improved, and an automatic rocking tray loading and unloading device for semiconductor chip processing is proposed. Summary of the invention

[0005] The object of the present invention is to provide an automatic rocking plate loading and unloading device for semiconductor chip processing to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an automatic rocking tray material loading and unloading device for semiconductor chip processing, comprising a chassis and a dust removal component, a tray is arranged above the chassis, the dust removal component is arranged on the inner side of the tray, the dust removal component comprises a through groove, a vent, a vent groove, a collection box, a turntable, an annular groove, a material placement groove, a vent, a diverter groove, an air suction port, a filter frame, an air pump and an air outlet pipe, a through groove is arranged on one side of the lower surface of the tray, and a vent is arranged on the other side of the lower surface of the tray, a vent groove is arranged on one side of the vent, and a collection box is arranged on the other side of the vent, a turntable is arranged on the inner side of the tray, and an annular groove is opened on the side wall of the turntable, the material placement groove is symmetrically opened on the surface of the turntable, and a vent is opened on the lower wall of the material placement groove, a diverter groove is arranged on one side of the vent, and an air suction port is arranged on one side of the diverter groove, a filter frame is slidably connected in the collection box, and an air pump is connected to the other side of the collection box through a pipeline, and an air outlet pipe is connected to one side of the air pump.

[0007] Furthermore, the turntable is connected to the tray through an annular groove, the ventilation groove is connected to the collection box through a vent, the diversion groove is connected to the through groove and the ventilation groove through an air suction port, and the ventilation holes are distributed about the material trough array.

[0008] Furthermore, the collection box and the air pump are both fixed on the lower surface of the tray, the air outlet pipe is a three-way pipe, and the end of the air outlet pipe away from the air pump is close to the turntable.

[0009] Furthermore, a rotating groove is opened in the middle of the tray, and a rotating plate is rotatably connected in the rotating groove, a support rod is connected to one side of the rotating plate, and a transmission wheel is connected to the lower part of the support rod.

[0010] Furthermore, a driving wheel is meshedly provided on one side of the transmission wheel, and a driving motor is connected to one side of the driving wheel. A synchronous wheel is meshedly provided on the other side of the transmission wheel, and a feeding belt is connected to one side of the synchronous wheel through a belt and a pulley.

[0011] Furthermore, a magnetic ring is connected to one side of the tray, and the turntable has sliding cavities symmetrically opened on both sides of the material loading trough, a sliding groove is opened in the middle of the sliding cavity, and a return spring is connected in the sliding cavity, and the other end of the return spring is connected to a pad.

[0012] Furthermore, a telescopic spring is connected in the slide groove, and a pressing plate is connected to the other end of the telescopic spring. A clamping block is connected to the middle of the pressing plate, and a limiting plate is connected to one end of the pressing plate away from the telescopic spring.

[0013] Furthermore, the pressure plate is connected to the backing plate by a clamping block, and the pressure plate is slidably connected to the turntable by a sliding groove. The backing plate and the pressure plate are elastically connected to the sliding cavity and the sliding groove by a return spring and a telescopic spring respectively, and a slope is provided on the side of the pressure plate close to the telescopic spring.

[0014] Furthermore, one end of the limit plate is connected to an adsorption spring, and the other end of the adsorption spring is connected to the adsorption plate. Limiting grooves are symmetrically provided on both sides of the adsorption plate, and the adsorption plate is slidably connected to the limit plate through the limiting grooves.

[0015] Furthermore, the side of the adsorption plate close to the material trough and the side of the pad close to the pad are symmetrically connected with a sleeve, a clamping spring is connected to the inner side of the sleeve, and the other end of the clamping spring is connected to a sliding rod, the other end of the sliding rod is connected to a splint, and the sliding rod is slidably connected to the sleeve, and an inclined surface is provided on the upper end of the splint.

[0016] The present invention provides an automatic rocking plate material picking and placing device for semiconductor chip processing, which has the following beneficial effects: when in use, the material can be adsorbed and fixed when picking and placing the material, and it can be detected during the transfer process; when transferring the material, the dust can be removed and collected by airflow to avoid dust adhesion; when placing the material, the material can be automatically positioned to avoid material deviation; after the detection is completed, the restriction on the material can also be lifted, so that unqualified materials can be screened out during the transfer process, and the automatic sorting of the material can be completed.

[0017] 1. When the present invention is in use, after the material is placed in the material trough by the robot arm, as the air pump is running, the air in the diversion trough can enter the ventilation trough from the air suction port, and then be pumped out from the ventilation port through the collection box by the air pump, thereby forming a negative pressure in the ventilation hole covered by the material, firmly adsorbing the material in the material trough, completing the fixation of the material, and then the driving motor can drive the turntable to rotate, thereby transporting the material. During the transportation process of the material, the air pump can send the extracted air out from the air outlet pipe. When the turntable carries the material and passes under the air outlet pipe, the airflow ejected from the air outlet pipe can blow the material, thereby removing the dust adhering to the surface of the material. Dust blowing: when the material loading trough after unloading passes under the air outlet pipe, the airflow ejected from the air outlet pipe can also blow the material loading trough, thereby blowing away the dust adhering to the material loading trough. The blown dust can enter the diverter trough from the vent as the air pump runs, and then be drawn into the collection box with the airflow. The filter frame filters the airflow, and the dust can be trapped in the filter frame to prevent the dust from entering the air pump and being blown onto the material or the material loading trough again, thereby ensuring the cleanliness of the material and the material loading trough and avoiding the adhesion of dust. In summary, during use, the material can be adsorbed and fixed, and the material and the material loading trough can be dusted by the airflow to avoid dust adhesion.

[0018] 2. When the present invention transfers materials, as the driving motor drives the driving wheel to rotate intermittently, the transmission wheel can drive the turntable to rotate intermittently on the inner side of the tray through the support rod, and each time it rotates 90 degrees, the annular groove can limit the turntable through the tray to prevent the turntable from deflecting during rotation. The material can be detected by an external detection device in the rotation gap of the turntable. When the material moves to the front side of the tray, the material can be sorted according to the detection result. If the detection passes, the robot arm processes the material and takes it out from the material trough. If the detection fails, the material is not operated, so that the material With the next rotation of the turntable, the air suction port is connected with the through slot, and the air enters the diverter slot from the through slot through the air suction port. The negative pressure in the vent hole is released, and the adsorption of the material can be released, so that the material can be thrown out of the material trough by centrifugal force, and the unqualified products are screened out. When the driving wheel drives the turntable to rotate through the support rod, it can also drive the feeding belt to operate intermittently through the synchronous wheel, thereby ensuring the synchronous operation of the feeding belt and the turntable, ensuring the synchronization of material taking and discharging, and avoiding material falling. In summary, during the transfer process, the material can be inspected and sorted according to the detection mechanism.

[0019] 3. When placing materials, the present invention can press the clamping plate to move, thereby driving the sliding rod to slide in the sleeve and compressing the release spring, so that the clamping spring can evenly apply force to the material through the clamping plate, thereby positioning the material in the center position of the material placement trough and auxiliary fixation to avoid material deflection. When the material placement trough is close to the magnetic ring, the adsorption plate is attracted by the magnetic ring and approaches the magnetic ring, which can drive the pressing plate to move in the slide groove and stretch the telescopic spring. When the pressing plate moves, it can first drive the card block to release the restriction on the pad, and then press the pad to move in the slide cavity and compress the reset spring, so that the adsorption plate and the pad are driven to move by the sleeve, the clamping spring, and the sliding rod to release the restriction on the material. When the material placement trough moves to the front side of the tray, the adsorption plate can completely pull the clamping plate connected thereto out of the material placement trough. At the same time, the adsorption plate will move downward along the limit plate under the adsorption of the magnetic ring and stretch the adsorption spring , thereby pulling the clamping plate to below the lower wall of the material loading trough, avoiding the clamping plate from hindering the escape of materials during unloading. When processing and unloading qualified products, because the air pump can maintain the adsorption of materials through the ventilation groove, the materials can remain in the same position in the material loading trough to avoid material deviation. When unloading unqualified materials, as the adsorption of the materials is released, the clamping spring in the sleeve connected to the inner wall of the material loading trough can, under the action of the rebound force, drive the clamping plate to push the materials to the outside of the material loading trough through the sliding rod, thereby accelerating the escape of unqualified products. When the material loading trough is away from the magnetic ring, the adsorption plate, the pressing plate, and the pad can be reset in turn under the action of the adsorption spring, the telescopic spring, and the reset spring, respectively, to facilitate the restriction and clamping of the materials next time. In summary, the materials can be automatically positioned when placed to avoid material deviation. After the detection is completed, the restriction on the materials can also be released to facilitate sorting. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall three-dimensional structure of an automatic rocking plate loading and unloading device for semiconductor chip processing according to the present invention;

[0021] Figure 2 It is a schematic diagram of a sectional exploded structure of a dust removal component of an automatic rocking tray loading and unloading device for semiconductor chip processing according to the present invention;

[0022] Figure 3 It is a schematic diagram of a three-dimensional exploded structure of a chassis of an automatic rocking plate loading and unloading device for semiconductor chip processing according to the present invention;

[0023] Figure 4 It is a schematic diagram of the overall cross-sectional three-dimensional structure of an automatic rocking plate loading and unloading device for semiconductor chip processing according to the present invention;

[0024] Figure 5 It is a schematic diagram of the overall top view of the structure of an automatic rocking plate loading and unloading device for semiconductor chip processing according to the present invention;

[0025] Figure 6 The present invention is a schematic diagram of a three-dimensional exploded structure of a turntable of an automatic rocking plate loading and unloading device for semiconductor chip processing.

[0026] In the figure: 1, chassis; 2, tray; 3, dust removal component; 301, through slot; 302, vent; 303, vent slot; 304, collection box; 305, turntable; 306, ring slot; 307, material trough; 308, vent hole; 309, diverter slot; 310, air extraction port; 311, filter frame; 312, air pump; 313, air outlet pipe; 4, turntable; 5, turntable; 6, support rod; 7, transmission Moving wheel; 8. Driving wheel; 9. Driving motor; 10. Synchronous wheel; 11. Feeding belt; 12. Magnetic ring; 13. Sliding cavity; 14. Sliding groove; 15. Reset spring; 16. Pad; 17. Telescopic spring; 18. Pressing plate; 19. Block; 20. Limiting plate; 21. Adsorption spring; 22. Adsorption plate; 23. Limiting groove; 24. Sleeve; 25. Clamping spring; 26. Sliding rod; 27. Clamping plate. DETAILED DESCRIPTION

[0027] See also Figures 1 to 6 The present invention provides a technical solution: an automatic rocking tray loading and unloading device for semiconductor chip processing, comprising a chassis 1 and a dust removal component 3, a tray 2 is arranged above the chassis 1, and the dust removal component 3 is arranged inside the tray 2, and the dust removal component 3 includes a through groove 301, a vent 302, a vent groove 303, a collection box 304, a turntable 305, an annular groove 306, a material placement groove 307, a vent hole 308, a diversion groove 309, an air suction port 310, a filter frame 311, an air pump 312 and an air outlet pipe 313, a through groove 301 is arranged on one side of the lower surface of the tray 2, and a vent 302 is arranged on the other side of the lower surface of the tray 2, and a through groove 301 is arranged on one side of the lower surface of the tray 2. A ventilation groove 303 is provided on one side of the air port 302, and a collecting box 304 is provided on the other side of the air port 302, a turntable 305 is provided on the inner side of the tray 2, and a ring groove 306 is provided on the side wall of the turntable 305, material loading grooves 307 are symmetrically provided on the surface of the turntable 305, and a ventilation hole 308 is provided on the lower wall of the material loading groove 307, a diverter groove 309 is provided on one side of the ventilation hole 308, and an air suction port 310 is provided on one side of the diverter groove 309, a filter frame 311 is slidably connected in the collecting box 304, and the other side of the collecting box 304 is connected to an air pump 312 through a pipeline, and one side of the air pump 312 is connected to an outlet pipe 313.

[0028] See also Figures 1 to 6, the turntable 305 is connected with the tray 2 by the annular groove 306, the ventilation groove 303 is connected with the collection box 304 through the vent 302, the diverter groove 309 is connected with the through groove 301 and the ventilation groove 303 through the air extraction port 310, the vent holes 308 are arranged in an array with respect to the material placement groove 307, the collection box 304 and the air pump 312 are fixed on the lower surface of the tray 2, the air outlet pipe 313 is a three-way pipe, and the end of the air outlet pipe 313 away from the air pump 312 is close to the turntable 305, a rotating groove 4 is opened in the middle of the tray 2, and a rotating plate 5 is rotatably connected in the rotating groove 4, a support rod 6 is connected to one side of the rotating plate 5, and a transmission wheel 7 is connected to the lower part of the support rod 6, a driving wheel 8 is meshed with one side of the driving wheel 7, and a driving motor 9 is connected to one side of the driving wheel 8, a synchronous wheel 10 is meshed with the other side of the driving wheel 7, and a feeding belt 11 is connected to one side of the synchronous wheel 10 through a belt and a pulley;

[0029] The specific operation is as follows. When in use, after the material is placed in the material trough 307 by the robot arm, as the air pump 312 runs, the air in the diverter trough 309 can enter the ventilation trough 303 from the air suction port 310, and then be pumped out from the ventilation port 302 through the collecting box 304 by the air pump 312, thereby forming a negative pressure in the ventilation hole 308 covered by the material, and the material is firmly adsorbed in the material trough 307, completing the fixation of the material, and then the driving motor 9 can drive the turntable 305 to rotate, thereby transporting the material. During the transportation of the material, the air pump 312 can send the extracted air out from the outlet pipe 313. When the turntable 305 carries the material and passes under the outlet pipe 313, the airflow ejected from the outlet pipe 313 can The material is blown away, thereby blowing away the dust adhered to the surface of the material. When the material loading trough 307 after unloading passes under the air outlet pipe 313, the airflow ejected from the air outlet pipe 313 can also blow the material loading trough 307, thereby blowing away the dust adhered to the material loading trough 307. The blown dust can enter the diverter trough 309 from the air vent 308 as the air pump 312 runs, and then is drawn into the collecting box 304 with the air flow. The filter frame 311 filters the air flow, and the dust can be trapped in the filter frame 311 to prevent the dust from entering the air pump 312 and being blown onto the material or the material loading trough 307 again, thereby ensuring the cleanliness of the material and the material loading trough 307 and avoiding the adhesion of dust. In summary, when in use, the material can be adsorbed The material and the material storage trough 307 are fixed and dust is removed by airflow to prevent dust from adhering. When transferring materials, as the driving motor 9 drives the driving wheel 8 to rotate intermittently, the transmission wheel 7 can drive the turntable 305 to rotate intermittently on the inner side of the tray 2 through the support rod 6, and each time it rotates 90°, the annular groove 306 can limit the turntable 305 through the tray 2 to prevent the turntable 305 from deflecting during rotation. The material can be detected by an external detection device in the rotation gap of the turntable 305. When the material moves to the front side of the tray 2, the material can be sorted according to the detection result. If the detection passes, the robot arm processes the material and takes it out from the material storage trough 307. If the detection fails, the material is not processed. Operation, with the next rotation of the turntable 305, the air outlet 310 is connected with the through slot 301, and the air enters the diverter slot 309 from the through slot 301 through the air outlet 310. The negative pressure in the vent hole 308 is released, and the adsorption of the material can be released, so that the material can be thrown out of the material trough 307 by centrifugal force, and the unqualified products are screened out. When the driving wheel 7 drives the turntable 305 to rotate through the support rod 6, it can also drive the feeding belt 11 to operate intermittently through the synchronous wheel 10, so as to ensure the synchronous operation of the feeding belt 11 and the turntable 305, ensure the synchronization of material taking and discharging, and avoid material falling. In summary, during the transfer process, the material can be detected, and the material can be sorted according to the detection mechanism.

[0030] See also Figures 4 to 6A magnetic ring 12 is connected to one side of the tray 2, and the turntable 305 is symmetrically provided with sliding cavities 13 on both sides of the material trough 307. A sliding groove 14 is provided in the middle of the sliding cavity 13, and a return spring 15 is connected in the sliding cavity 13, and a backing plate 16 is connected to the other end of the return spring 15. A telescopic spring 17 is connected in the sliding groove 14, and a pressing plate 18 is connected to the other end of the telescopic spring 17. A clamping block 19 is connected in the middle of the pressing plate 18, and one end of the pressing plate 18 away from the telescopic spring 17 is connected to the limiting plate 20, and the pressing plate 18 is engaged with the backing plate 16 through the clamping block 19, and the pressing plate 18 is slidably connected to the turntable 305 through the sliding groove 14, and the backing plate 16 and the pressing plate 18 are respectively connected to the backing plate 16 and the telescopic spring 17 through the reset spring 15 and the telescopic spring 17. The sliding cavity 13 and the sliding groove 14 are elastically connected, and a slope is provided on the side of the pressing plate 18 close to the telescopic spring 17. One end of the limit plate 20 is connected to the adsorption spring 21, and the other end of the adsorption spring 21 is connected to the adsorption plate 22. The limit grooves 23 are symmetrically provided on both sides of the adsorption plate 22, and the adsorption plate 22 is slidably connected with the limit plate 20 through the limit grooves 23. The side of the adsorption plate 22 close to the material placement groove 307 and the side close to the pad 16 are symmetrically connected with the sleeve 24. The inner side of the sleeve 24 is connected to the clamping spring 25, and the other end of the clamping spring 25 is connected to the sliding rod 26. The other end of the sliding rod 26 is connected to the clamping plate 27, and the sliding rod 26 is slidably connected to the sleeve 24, and the upper end of the clamping plate 27 is provided with a slope.

[0031] The specific operation is as follows: when placing the material, the mechanical arm can press the clamping plate 27 to move, thereby driving the slide bar 26 to slide in the sleeve 24 and compressing the release spring, so that the clamping spring 25 can evenly apply force to the material through the clamping plate 27, thereby positioning the material in the center of the material placement groove 307 and assisting in fixing it to avoid material deflection. When the material placement groove 307 is close to the magnetic ring 12, the adsorption plate 22 is attracted by the magnetic ring 12 and approaches the magnetic ring 12, which can drive the pressing plate 18 to move in the slide groove 14 and pull the telescopic spring 17. When the pressing plate 18 moves, the block 19 can be driven to release the restriction on the pad 16, and then the pad 16 can be pressed to move in the sliding cavity 13 and the return spring 15 can be compressed, so that the adsorption plate 22 and the pad 16 can be driven to move through the sleeve 24, the clamping spring 25, and the slide rod 26 to release the restriction on the material. When the material trough 307 moves to the front side of the tray 2, the adsorption plate 22 can completely pull the clamping plate 27 connected thereto out of the material trough 307, and at the same time, the adsorption plate 22 will move along the limit plate 2 under the adsorption of the magnetic ring 12. 0 moves downward and stretches the adsorption spring 21, thereby pulling the clamping plate to below the lower wall of the material storage groove 307, so as to prevent the clamping plate 27 from hindering the material from escaping during unloading. When processing and unloading qualified products, the air pump 312 can maintain the adsorption of the material through the ventilation groove 303, so that the material can be kept in the position of the material storage groove 307 unchanged, thereby preventing the material from shifting. When unqualified products are unloaded, as the adsorption of the material is released, the clamping spring 25 in the sleeve 24 connected to the inner wall of the material storage groove 307 can be released under the action of the rebound force. Under the use, the clamping plate 27 is driven by the sliding rod 26 to push the material to the outside of the material placing trough 307 to accelerate the escape of unqualified products. When the material placing trough 307 is away from the magnetic ring 12, the adsorption plate 22, the pressing plate 18, and the pad 16 can be reset in sequence under the action of the adsorption spring 21, the telescopic spring 17, and the reset spring 15, respectively, to facilitate the restriction and clamping of the material next time. In summary, the material can be automatically positioned when placing the material to avoid material deviation. After the detection is completed, the restriction on the material can also be lifted to facilitate its sorting.

[0032] In summary, when using the automatic rocking plate loading and unloading device for semiconductor chip processing, the materials are first placed on the feeding belt 11 in sequence, and then the air pump 312 and the driving motor 9 are started. After the materials are placed in the material storage trough 307 by the robot arm, as the air pump 312 is running, the air in the diverter trough 309 can enter the ventilation trough 303 from the air suction port 310, and then be pumped out from the ventilation port 302 through the collecting box 304 by the air pump 312, thereby forming a negative pressure in the ventilation hole 308 covered by the material, and the material is firmly adsorbed in the material storage trough 307 to complete the fixation of the material. When placing the material, the robot arm can press the clamping plate 27 to move, thereby driving the slide rod 26 to slide in the sleeve 24 and compress the release spring, so that the clamping spring 25 can be clamped. The plate 27 applies a balanced force to the material, thereby positioning the material at the center of the material placement trough 307 and assisting in fixing it to prevent the material from being skewed. As the drive motor 9 drives the drive wheel 8 to rotate intermittently, the transmission wheel 7 can drive the turntable 305 to rotate intermittently on the inner side of the tray 2 through the support rod 6, and each time it rotates 90°, thereby transferring the material. During the transportation of the material, the air pump 312 can send the extracted air out from the air outlet pipe 313. When the turntable 305 carries the material and passes under the air outlet pipe 313, the airflow ejected from the air outlet pipe 313 can blow on the material, thereby blowing off the dust adhering to the surface of the material. When the material placement trough 307 passes under the air outlet pipe 313 after unloading, the airflow ejected from the air outlet pipe 313 can also The material trough 307 can be blown to remove the dust adhering to the material trough 307. The blown dust can enter the diverter trough 309 from the vent hole 308 as the air pump 312 runs, and then is drawn into the collection box 304 with the air flow. The filter frame 311 filters the air flow, and the dust can be trapped in the filter frame 311 to prevent the dust from entering the air pump 312 and being blown onto the material or the material trough 307 again, thereby ensuring the cleanliness of the material and the material trough 307 and preventing the adhesion of dust. The annular groove 306 can limit the turntable 305 through the tray 2 to prevent the turntable 305 from deflecting when rotating. The material can be detected by an external detection device in the rotation gap of the turntable 305. When the material moves to the front side of the tray 2, The materials are sorted according to the detection results. If the detection is passed, the robot arm processes the materials and takes them out from the material trough 307. If the detection is not passed, the materials are not operated. When the material trough 307 is close to the magnetic ring 12, the adsorption plate 22 is attracted by the magnetic ring 12 and approaches the magnetic ring 12, which can drive the pressing plate 18 to move in the slide groove 14 and stretch the telescopic spring 17. When the pressing plate 18 moves, it can first drive the block 19 to release the restriction on the pad 16, and then press the pad 16 to move in the slide cavity 13 and compress the reset spring 15, so that the adsorption plate 22 and the pad 16 are driven by the sleeve 24, the clamping spring 25, and the slide rod 26 to move the pad 16 to release the restriction on the material. When the material trough 307 moves to the front side of the tray 2,The adsorption plate 22 can completely pull the clamping plate 27 connected thereto out of the feeding trough 307. At the same time, the adsorption plate 22 will move downward along the limit plate 20 under the adsorption of the magnetic ring 12 and stretch the adsorption spring 21, thereby pulling the clamping plate to below the lower wall of the feeding trough 307 to avoid the clamping plate 27 hindering the escape of the material during unloading. When processing and unloading qualified products, because the air pump 312 can maintain the adsorption of the material through the ventilation groove 303, the material can be kept in the position of the feeding trough 307 unchanged to avoid material deviation. When unloading unqualified products, as the adsorption of the material is released, the clamping spring 25 in the sleeve 24 connected to the inner wall of the feeding trough 307 can, under the action of the rebound force, drive the clamping plate 27 through the slide rod 26 to push the material to the outside of the feeding trough 307, thereby accelerating the escape of unqualified products and allowing the material to move along with the turntable. The next time 305 rotates, the air outlet 310 is connected with the through slot 301, and the air enters the diverter slot 309 from the through slot 301 through the air outlet 310. The negative pressure in the vent hole 308 is released, and the adsorption of the material can be released, so that the material can be thrown out of the material storage tank 307 by centrifugal force, and the unqualified products are screened out. When the driving wheel 7 drives the turntable 305 to rotate through the support rod 6, it can also drive the feeding belt 11 to operate intermittently through the synchronous wheel 10, thereby ensuring the synchronous operation of the feeding belt 11 and the turntable 305, ensuring the synchronization of material taking and discharging, and preventing the material from falling. When the material storage tank 307 is away from the magnetic ring 12, the adsorption plate 22, the pressing plate 18, and the pad 16 can be reset in sequence under the action of the adsorption spring 21, the telescopic spring 17, and the reset spring 15, respectively, to facilitate the next restriction and clamping of the material.

[0033] The embodiments of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. An automatic pan loading and unloading device for semiconductor chip processing, characterized in that: The invention comprises a chassis (1) and a dust removal component (3), wherein a tray (2) is arranged above the chassis (1), and the dust removal component (3) is arranged inside the tray (2), and the dust removal component (3) comprises a through groove (301), a vent (302), a vent groove (303), a collection box (304), a rotating disk (305), an annular groove (306), a material placement groove (307), a vent hole (308), a diversion groove (309), an air suction port (310), a filter frame (311), an air pump (312), and an air outlet pipe (313), wherein a through groove (301) is arranged on one side of the lower surface of the tray (2), and a vent (302) is arranged on the other side of the lower surface of the tray (2), and a vent (302) is arranged on one side of the vent (302). An air groove (303) is provided, and a collection box (304) is provided on the other side of the vent (302); a turntable (305) is provided on the inner side of the tray (2), and a ring groove (306) is provided on the side wall of the turntable (305); a material placement groove (307) is symmetrically provided on the surface of the turntable (305), and a vent (308) is provided on the lower wall of the material placement groove (307); a diverter groove (309) is provided on one side of the vent (308), and a suction port (310) is provided on one side of the diverter groove (309); a filter frame (311) is slidably connected inside the collection box (304), and an air pump (312) is connected to the other side of the collection box (304) through a pipeline, and an air outlet pipe (313) is connected to one side of the air pump (312).

2. The automatic pan loading and unloading device for semiconductor chip processing according to claim 1, characterized in that: The rotating disk (305) is connected to the tray (2) by means of the annular groove (306); the ventilation groove (303) is connected to the collecting box (304) by means of the ventilation port (302); the diversion groove (309) is connected to the through groove (301) and the ventilation groove (303) by means of the air suction port (310); and the ventilation holes (308) are distributed in an array with respect to the material placing groove (307).

3. The automatic pan loading and unloading device for semiconductor chip processing according to claim 1, characterized in that: The collecting box (304) and the air pump (312) are both fixed on the lower surface of the tray (2); the air outlet pipe (313) is a three-way pipe, and the end of the air outlet pipe (313) away from the air pump (312) is close to the turntable (305).

4. The automatic pan loading and unloading device for semiconductor chip processing according to claim 1, characterized in that: A rotating groove (4) is provided in the middle of the tray (2), and a rotating plate (5) is rotatably connected in the rotating groove (4). A support rod (6) is connected to one side of the rotating plate (5), and a transmission wheel (7) is connected to the lower part of the support rod (6).

5. The automatic pan loading and unloading device for semiconductor chip processing according to claim 4, characterized in that: One side of the transmission wheel (7) is meshed with a driving wheel (8), and one side of the driving wheel (8) is connected to a driving motor (9); the other side of the transmission wheel (7) is meshed with a synchronous wheel (10), and one side of the synchronous wheel (10) is connected to a feeding belt (11) via a belt and a pulley.

6. The automatic pan loading and unloading device for semiconductor chip processing according to claim 1, characterized in that: A magnetic ring (12) is connected to one side of the tray (2); the turntable (305) is symmetrically provided with sliding cavities (13) on both sides of the material placement groove (307); a sliding groove (14) is provided in the middle of the sliding cavity (13); a return spring (15) is connected inside the sliding cavity (13); and a pad (16) is connected to the other end of the return spring (15).

7. The automatic pan loading and unloading device for semiconductor chip processing according to claim 6, characterized in that: A telescopic spring (17) is connected inside the slide groove (14), and the other end of the telescopic spring (17) is connected to a pressing plate (18), a clamping block (19) is connected to the middle of the pressing plate (18), and one end of the pressing plate (18) away from the telescopic spring (17) is connected to a limiting plate (20).

8. The automatic pan loading and unloading device for semiconductor chip processing according to claim 7, characterized in that: The pressing plate (18) is connected to the backing plate (16) by a clamping block (19), and the pressing plate (18) is slidably connected to the turntable (305) by a sliding groove (14). The backing plate (16) and the pressing plate (18) are elastically connected to the sliding cavity (13) and the sliding groove (14) by a return spring (15) and a telescopic spring (17), respectively, and a slope is provided on the side of the pressing plate (18) close to the telescopic spring (17).

9. The automatic pan loading and unloading device for semiconductor chip processing according to claim 8, characterized in that: One end of the limit plate (20) is connected to an adsorption spring (21), and the other end of the adsorption spring (21) is connected to an adsorption plate (22). The adsorption plate (22) has symmetrical limit grooves (23) on both sides, and the adsorption plate (22) is slidably connected to the limit plate (20) through the limit grooves (23).

10. The automatic pan loading and unloading device for semiconductor chip processing according to claim 9, characterized in that: The side of the adsorption plate (22) close to the material trough (307) and the side of the pad (16) close to the material trough (307) are symmetrically connected with a sleeve (24), the inner side of the sleeve (24) is connected with a clamping spring (25), and the other end of the clamping spring (25) is connected with a slide bar (26), the other end of the slide bar (26) is connected with a clamping plate (27), and the slide bar (26) is slidably connected to the sleeve (24), and the upper end of the clamping plate (27) is provided with an inclined surface.

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