Wafer flat edge positioning device

Abstract

The invention discloses a wafer flat edge positioning device, and relates to the technical field of semiconductor silicon wafer processing auxiliary equipment.The wafer flat edge positioning device comprises a fixing plate, a supporting frame is fixedly installed at the top of the fixing plate, a working platform is fixedly installed at the top of the supporting frame, and a driving motor fixedly penetrates through the bottom of the fixing plate; a screw rod is fixedly mounted at the output end of the driving motor, a sleeve is in threaded connection with the circumferential surface of the screw rod, a circular groove is formed in the top of the working platform, and the device further comprises a clamping device; wherein the clamping device comprises a carrying plate, a sliding plate, a connecting rod, a long rod, a placing plate, a loading frame, a telescopic rod, a first spring, a pushing plate, a cylindrical rod and a rubber sheet, the rubber sheet automatically adapts to the flat edge and the curved surface of the wafer, the positioning effect is improved, damage to the curved surface of the wafer is further avoided, and the working efficiency is improved. Therefore, the stability of flat edge positioning of the wafer is improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor silicon wafer processing auxiliary equipment, in particular to a wafer flat edge positioning device. Background Art

[0002] The wafer flat edge positioning device is a device used in the semiconductor manufacturing process to ensure the precise positioning of the wafer. It positions the flat edge of the wafer to ensure the accuracy of subsequent processing steps.

[0003] The patent with patent announcement number CN213905333U relates to a wafer positioning device, including: a positioning table; a turntable for placing wafers and driving the wafers to rotate; a positioning component for aligning the wafer with the center of the turntable; and a monitoring component for capturing the position of the V-groove of the wafer and setting the V-groove toward a preset position; wherein the turntable is placed above the positioning table and is concentrically arranged with the positioning table; the positioning component can push the wafer toward the center of the turntable; the monitoring component and the positioning component are staggered and can move toward one side of the wafer along the radius of the positioning table. The patented structure is simple to cooperate, and can quickly locate the center of any wafer, and accurately set the V-groove of the wafer toward the set position, so that the wafer is always concentrically arranged with the thinning table during the subsequent grinding process, ensuring the consistency of the wafer thinning thickness, ensuring the thinning quality, and improving the product qualification rate; at the same time, it is also convenient for subsequent tracking of defective product records to ensure traceability of wafer quality.

[0004] The above patent has the function of quickly positioning the center of any wafer. Through the coordination between the structures, the center of the wafer can be quickly positioned, and the V-groove of the wafer can be accurately set toward the set position, so that the wafer is always concentrically set with the thinning table during the subsequent grinding process. However, during the positioning process, the positioning component needs to contact the flat edge and curved surface of the wafer at the same time, and apply a stable thrust to these two parts to ensure accurate positioning. When the planar positioning component contacts the curved surface of the wafer, the thrust will be concentrated on a small part of the curved surface. This concentrated thrust will cause local wear of the wafer during the positioning process, thereby having a negative impact on the integrity of the wafer. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a wafer flat edge positioning device, which solves the problems raised in the above-mentioned background technology.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a wafer flat edge positioning device, comprising a fixing plate, a support frame is fixedly installed on the top of the fixing plate, a working platform is fixedly installed on the top of the supporting frame, a driving motor is fixedly passed through the bottom of the fixing plate, a screw is fixedly installed on the output end of the driving motor, a sleeve is threadedly connected to the circumferential surface of the screw, a circular groove is provided on the top of the working platform, a trapezoidal groove is relatively provided on the top of the working platform, and also includes a clamping device; wherein, the clamping device includes a carrying plate, a sliding plate, a connecting rod, a long rod, a placing plate, a loading frame, a telescopic rod, a No. 1 spring, a pushing plate, a cylindrical rod and a rubber sheet, the driving motor is started, the output end of the driving motor rotates clockwise to drive the sleeve to move downward, the movement of the sleeve drives the carrying plate to move downward, and the carrying plate is fixedly mounted on the sleeve The circumferential surface of the sliding plate slides through the inner and outer walls of the working platform, one end of the connecting rod rotates and passes through the inner and outer walls of the carrying plate, and the other end of the connecting rod rotates and passes through the inner and outer walls of the sliding plate. The long rod is fixedly installed on the top of the carrying plate, and the long rod slides through the inner and outer walls of the working platform, the placing plate is fixedly installed on the top of the long rod, and the loading frame is fixedly installed on the top of the sliding plate. The telescopic rod slides through the inner and outer walls of the loading frame, and the No. 1 spring is arranged between the telescopic rod and the loading frame. The pushing plate is fixedly installed on a side of the telescopic rod close to the placing plate, and the cylindrical rod rotates and passes through the inner and outer walls of the pushing plate. The rubber sheet is arranged on the circumferential surface of the cylindrical rod, and an arc surface one is opened on a side of the pushing plate close to the rubber sheet, and the curved surface formed by the rubber sheet in the bending contacts with the arc surface one, so that the pushing plate provides support for the deformed rubber sheet.

[0007] According to the above technical solution, the size of the placing plate is adapted to the circular groove, an anti-slip groove is provided on the top of the placing plate, the wafer is placed on the top of the placing plate, the bottom of the wafer contacts the anti-slip groove on the placing plate, a limiting groove is provided on the top of the loading frame, and a sliding groove is provided on the top of the loading frame.

[0008] According to the above technical solution, a No. 1 volute spring is arranged between the cylindrical rod and the push plate. The cylindrical rod stretches the No. 1 volute spring during rotation, and the No. 1 volute spring is deformed due to the stretching. The rubber sheet is provided with corrugations on the side away from the arc surface one. The corrugations of the rubber sheet contact the wafer during movement, so that the rubber sheet continues to move and applies a relative thrust to the wafer. The push plate is provided with a circular hole on the side away from the rubber sheet.

[0009] According to the above technical scheme, the wafer flat edge positioning device also includes a protective device and a locking device; the protective device includes a fixed frame, a contact rod, a stop block, a No. 2 spring, a J-shaped plate, a Z-shaped plate and a limit plate, the contact rod contacts the inner wall of the circular hole during movement, and the contact rod is blocked by the push plate and stops moving, the fixed frame is fixedly installed on the surface of the loading frame, the contact rod slides through a side of the fixed frame close to the push plate, the stop block is fixedly installed on a side of the contact rod away from the push plate, the No. 2 spring is arranged between the stop block and the fixed frame, the J-shaped plate slides through the inner and outer walls of the fixed frame, the Z-shaped plate is arranged between the J-shaped plate and the fixed frame, the limit plate slides through the inner and outer walls of the J-shaped plate, the Z-shaped plate itself has elasticity, a side of the stop block close to the J-shaped plate is provided with an inclined surface one, a side of the J-shaped plate close to the stop block is provided with an arc surface two, the arc surface one of the J-shaped plate contacts with the inclined surface one of the stop block during movement, the inclined surface one applies resistance to the arc surface one, and the J-shaped plate moves downward under the influence of the resistance.

[0010] According to the above technical solution, a second inclined surface is provided on one side of the limit plate away from the stop block, and the size of the limit plate is adapted to the trapezoidal groove. The bottom of the limit plate contacts the inner wall of the trapezoidal groove during movement, and at the same time, the second inclined surface of the limit plate fits with the trapezoidal groove, so that the trapezoidal groove imposes a limit on the limit plate, and a card groove is provided on the surface of the J-shaped plate.

[0011] According to the above technical scheme, the locking device includes a movable plate, a T-shaped rod, a grip rod, a No. 3 spring, a limiting rod, a No. 4 spring, a rectangular plate and an L-shaped plate. The grip rod is pulled to move upward, and the movement of the grip rod drives the T-shaped rod to move upward. The T-shaped rod stretches the No. 3 spring during the movement. The movable plate is slidably installed on the top of the loading frame, the T-shaped rod slides through the inner and outer walls of the movable plate, the grip rod is rotatably installed on the top of the T-shaped rod, the No. 3 spring is arranged between the T-shaped rod and the movable plate, the limiting rod slides through the inner and outer walls of the movable plate, and the No. 4 spring is arranged between the limiting rod and the movable plate, the rectangular plate is fixedly installed on the circumferential surface of the grip rod, and the L-shaped plate is fixedly installed on the top of the movable plate, the movable plate is in contact with the sliding groove, the bottom of the T-shaped rod is in contact with the inner wall of the limiting groove, and the T-shaped rod is separated from the limiting groove during the movement, so that the limit imposed on the movable plate by the loading frame is released.

[0012] According to the above technical solution, a spherical surface 1 is provided on one side of the limiting rod close to the J-shaped plate, and the spherical surface 1 contacts the side of the J-shaped plate close to the slot. The J-shaped plate moves downward and separates from the surface in contact with the spherical surface 1, so that the deformed No. 4 spring recovers and drives the limiting rod to move away from the contact rod. The size of the limiting rod is adapted to the slot.

[0013] According to the above technical solution, the rectangular plate contacts the inner wall of the L-shaped plate, and the surface of the rectangular plate in contact with the L-shaped plate is separated when the rectangular plate rotates, so that the limit imposed by the L-shaped plate on the upward movement of the grip rod is released, and a No. 2 spiral spring is arranged between the grip rod and the T-shaped rod. The grip rod stretches the No. 2 spiral spring during rotation, and the No. 2 spiral spring is deformed due to the stretching.

[0014] The present invention provides a wafer flat edge positioning device, which has the following beneficial effects:

[0015] (1) In the wafer flat edge positioning device, the movement of the long rod drives the placement plate to move downward, and the movement of the placement plate drives the wafer to move downward. The placement plate and the sliding plate move synchronously to reduce the positioning time, and the lifting of the placement plate allows the operator to easily place or remove the wafer, which helps to improve the convenience of operation. At the same time, the inner concave surface formed by the bending of the rubber sheet fits the curved surface of the wafer. The rubber sheet automatically adapts to the flat edge and curved surface of the wafer, which improves the positioning effect and avoids damage to the curved surface of the wafer, thereby improving the stability of the wafer flat edge positioning.

[0016] (2) In the wafer flat edge positioning device, the limit plate contacts the inner wall of the trapezoidal groove, so that the trapezoidal groove applies a limit to the limit plate, and the limit plate imposes restrictions on the movement of the fixed frame, ensuring that the rubber sheet can apply a stable clamping force when positioning wafers of different sizes. At the same time, when the J-shaped plate encounters an emergency and cannot be smoothly reset upward, the trapezoidal groove applies resistance to the second inclined surface of the limit plate. By providing the second inclined surface, the limit plate can still be separated from the trapezoidal groove when the J-shaped plate cannot be smoothly reset due to a malfunction, thereby avoiding safety hazards caused by jamming, thereby ensuring the normal operation of the positioning.

[0017] (3) In the wafer flat edge positioning device, the limiting rod contacts the inner wall of the card slot, so that the limiting rod applies a limit to the J-shaped plate. By applying a limit to the J-shaped plate by the limiting rod, it is ensured that the limiting plate and the trapezoidal groove maintain stable contact, which helps to improve the positioning accuracy. The limit imposed by the limiting rod requires standardized operation to be released. At the same time, the position of the movable plate is adjusted so that the J-shaped plate will not be limited by the limiting rod during movement. By adjusting the position of the movable plate, the operator can choose to enable or release the limiting rod according to actual needs, which effectively improves the flexibility of using the limiting rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 It is a schematic diagram of a half-section structure of the working platform of the present invention;

[0020] Figure 3 It is a schematic diagram of the position structure of the connecting rod of the present invention;

[0021] Figure 4 For the present invention Figure 3 The enlarged structural diagram at A in the middle;

[0022] Figure 5 It is a schematic diagram of the internal structure of the clamping device of the present invention;

[0023] Figure 6 It is a schematic diagram of the structure of the protective device of the present invention;

[0024] Figure 7 This is a schematic diagram of the structure of the locking device of the present invention;

[0025] In the figure: 1. fixed plate; 2. support frame; 3. working platform; 4. driving motor; 5. screw rod; 6. sleeve; 7. carrying plate; 8. sliding plate; 9. connecting rod; 10. long rod; 11. placing plate; 12. loading frame; 13. telescopic rod; 14. No. 1 spring; 15. pushing plate; 16. cylindrical rod; 17. rubber sheet; 181. fixed frame; 182. contact rod; 183. stop block; 184. No. 2 spring; 185. J-shaped plate; 186. Z-shaped plate; 187. limit plate; 191. moving plate; 192. T-shaped rod; 193. grip rod; 194. No. 3 spring; 195. limit rod; 196. No. 4 spring; 197. rectangular plate; 198. L-shaped plate. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] See also Figure 1-Figure 7, one embodiment of the present invention is: a wafer flat edge positioning device, comprising a fixed plate 1, a support frame 2 is fixedly installed on the top of the fixed plate 1, a working platform 3 is fixedly installed on the top of the support frame 2, a driving motor 4 is fixedly penetrated at the bottom of the fixed plate 1, a screw rod 5 is fixedly installed on the output end of the driving motor 4, a sleeve 6 is threadedly connected to the circumferential surface of the screw rod 5, a circular groove is opened on the top of the working platform 3, and a trapezoidal groove is relatively opened on the top of the working platform 3, and also includes a clamping device; wherein the clamping device includes a carrying plate 7, a sliding plate 8, a connecting rod 9, a long rod 10, a placing plate 11, a loading frame 12, a telescopic rod 13, a No. 1 spring 14, a pushing plate 15, a cylindrical rod 16 and a rubber sheet 17, the carrying plate 7 is fixedly installed on the circumferential surface of the sleeve 6, the sliding plate 8 slides through the inner and outer walls of the working platform 3, and one end of the connecting rod 9 rotates The connecting rod 9 is rotatably connected to the inner and outer walls of the mounting plate 7, and the other end of the connecting rod 9 is rotatably connected to the inner and outer walls of the sliding plate 8. The long rod 10 is fixedly installed on the top of the mounting plate 7, and the long rod 10 slides through the inner and outer walls of the working platform 3. The placing plate 11 is fixedly installed on the top of the long rod 10, and the loading frame 12 is fixedly installed on the top of the sliding plate 8. The telescopic rod 13 slides through the inner and outer walls of the loading frame 12. A spring 14 is arranged between the telescopic rod 13 and the loading frame 12. The pushing plate 15 is fixedly installed on the side of the telescopic rod 13 close to the placing plate 11. The cylindrical rod 16 is rotatably connected to the inner and outer walls of the pushing plate 15. The rubber sheet 17 is arranged on the circumferential surface of the cylindrical rod 16. The side of the pushing plate 15 close to the rubber sheet 17 is provided with an arc surface 1. The placing plate 11 and the sliding plate 8 move synchronously, which reduces the positioning time and helps to improve the convenience of the overall operation.

[0028] The size of the placing plate 11 is adapted to the circular groove, an anti-slip groove is provided on the top of the placing plate 11, a limiting groove is provided on the top of the loading frame 12, and a sliding groove is provided on the top of the loading frame 12. By providing the anti-slip groove, the wafer is prevented from shifting during the positioning process, thereby improving the stability during positioning.

[0029] A scroll spring No. 1 is arranged between the cylindrical rod 16 and the push plate 15, and a corrugation is provided on the side of the rubber sheet 17 away from the arc surface 1, and a circular hole is provided on the side of the push plate 15 away from the rubber sheet 17. The rubber sheet 17 automatically adapts to the flat edge and curved surface of the wafer, thereby improving the positioning accuracy and avoiding damage to the curved surface of the wafer.

[0030] When the present embodiment is working, the wafer is placed on the top of the placement plate 11, the bottom of the wafer contacts the anti-skid groove on the placement plate 11, the angle of the wafer is manually adjusted to make the flat edge of the wafer parallel to the rubber sheet 17, and then the drive motor 4 is started, the output end of the drive motor 4 rotates clockwise to drive the sleeve 6 to move downward, the movement of the sleeve 6 drives the carrying plate 7 to move downward, the movement of the carrying plate 7 drives the long rod 10 to move downward, the movement of the long rod 10 drives the placement plate 11 to move downward, the movement of the placement plate 11 drives the wafer to move downward, the circumferential surface of the placement plate 11 contacts the inner wall of the circular groove during the movement, the working platform 3 provides support for the placement plate 11 through the circular groove, and the movement of the carrying plate 7 drives the end of the connecting rod 9 away from the sliding plate 8 to move downward, so that the connecting rod 9 The other end of the rod 9 moves toward the placement plate 11, and the movement of the connecting rod 9 drives the sliding plate 8 to move toward the placement plate 11. The movement of the sliding plate 8 drives the loading frame 12 to move toward the placement plate 11. The movement of the loading frame 12 drives the telescopic rod 13 to move toward the placement plate 11. The movement of the telescopic rod 13 drives the pushing plate 15 to move toward the placement plate 11. The movement of the pushing plate 15 drives the cylindrical rod 16 to move toward the placement plate 11. The movement of the cylindrical rod 16 drives the rubber sheet 17 to move toward the placement plate 11. The corrugations of the rubber sheet 17 contact the wafer during movement, so that the rubber sheet 17 continues to move and applies opposite thrust to the wafer, thereby completing the positioning of the wafer. The synchronous movement of the placement plate 11 and the sliding plate 8 reduces the positioning time. At the same time, the placement plate 11 The lifting design allows the operator to easily place or take out the wafer, thereby improving the convenience of the overall operation. The rubber sheet 17 on one side contacts the flat edge of the wafer during movement, and the rubber sheet 17 is blocked by the flat edge of the wafer and stops moving. The loading frame 12 continues to move to squeeze and stretch the No. 1 spring 14, and the No. 1 spring 14 is stretched and deformed. The deformed No. 1 spring 14 applies a reaction force to the telescopic rod 13, and the telescopic rod 13 is affected by the reaction force and applies a thrust to the push plate 15, so that the cylindrical rod 16 applies a thrust to the rubber sheet 17, and the rubber sheet 17 is affected by the thrust and applies pressure to the flat edge of the wafer. At the same time, the rubber sheet 17 on the other side contacts the curved surface of the wafer during movement, and the position where the rubber sheet 17 contacts the curved surface is blocked and stops. The cylindrical rod 16 moves, so that the cylindrical rod 16 continues to move and drives the two ends of the rubber sheet 17 to bend. The cylindrical rod 16 also rotates with the bending of the rubber sheet 17. The cylindrical rod 16 stretches the No. 1 scroll spring during rotation, and the No. 1 scroll spring is deformed by the stretching. At the same time, the inner concave surface formed by the rubber sheet 17 during bending fits the curved surface of the wafer. The curved surface formed by the rubber sheet 17 during bending contacts the arc surface, so that the push plate 15 provides support for the deformed rubber sheet 17. The loading frame 12 continues to move and repeats the above movement, so that the deformed rubber sheet 17 applies a thrust to the curved surface of the wafer, thereby completing the precise positioning of the flat edge of the wafer. The rubber sheet 17 automatically adapts to the flat edge and curved surface of the wafer, thereby improving the positioning accuracy and avoiding damage to the curved surface of the wafer.This improves the stability of the wafer flat edge positioning.

[0031] See also Figure 1-Figure 7 On the basis of the above embodiment, another embodiment of the present invention further includes a protective device and a locking device; the protective device includes a fixed frame 181, a contact rod 182, a stopper 183, a second spring 184, a J-shaped plate 185, a Z-shaped sheet 186 and a limit plate 187, the fixed frame 181 is fixedly mounted on the surface of the loading frame 12, the contact rod 182 slides through a side of the fixed frame 181 close to the push plate 15, the stopper 183 is fixedly mounted on a side of the contact rod 182 away from the push plate 15, and the second spring 184 is arranged between the stopper 183 and the fixed frame 18 1, the J-shaped plate 185 slides through the inner and outer walls of the fixed frame 181, the Z-shaped piece 186 is arranged between the J-shaped plate 185 and the fixed frame 181, the limiting plate 187 slides through the inner and outer walls of the J-shaped plate 185, the Z-shaped piece 186 itself is elastic, the side of the stop block 183 close to the J-shaped plate 185 is provided with an inclined surface 1, and the side of the J-shaped plate 185 close to the stop block 183 is provided with an arc surface 2. The movement of the fixed frame 181 is restricted by the limiting plate 187 to ensure that the rubber sheet 17 can apply a stable clamping force when positioning wafers of different sizes.

[0032] A second inclined surface is provided on the side of the limit plate 187 away from the stop block 183. The size of the limit plate 187 is adapted to the trapezoidal groove. A card slot is provided on the surface of the J-shaped plate 185. By providing the second inclined surface, the limit plate 187 can still be separated from the trapezoidal groove when the J-shaped plate 185 cannot be smoothly reset due to a malfunction, thereby avoiding safety hazards caused by jamming.

[0033] The locking device includes a moving plate 191, a T-shaped rod 192, a gripping rod 193, a No. 3 spring 194, a limiting rod 195, a No. 4 spring 196, a rectangular plate 197 and an L-shaped plate 198. The moving plate 191 is slidably mounted on the top of the loading frame 12, the T-shaped rod 192 slides through the inner and outer walls of the moving plate 191, the gripping rod 193 is rotatably mounted on the top of the T-shaped rod 192, the No. 3 spring 194 is arranged between the T-shaped rod 192 and the moving plate 191, and the limiting rod 195 slides through the inner and outer walls of the moving plate 191. On the inner and outer walls of the movable plate 191, a No. 4 spring 196 is arranged between the limiting rod 195 and the movable plate 191, the rectangular plate 197 is fixedly installed on the circumferential surface of the grip rod 193, the L-shaped plate 198 is fixedly installed on the top of the movable plate 191, the movable plate 191 is in contact with the slide groove, and the bottom of the T-shaped rod 192 is in contact with the inner wall of the limiting groove. The limiting rod 195 is used to apply a limit to the J-shaped plate 185 to ensure that the limiting plate 187 maintains stable contact with the trapezoidal groove, which helps to improve the positioning accuracy.

[0034] A spherical surface 1 is provided on one side of the limiting rod 195 close to the J-shaped plate 185, and the spherical surface 1 is in contact with a side of the J-shaped plate 185 close to the slot. The size of the limiting rod 195 is adapted to the slot. By providing the spherical surface 1, the wear between the J-shaped plate 185 and the limiting rod 195 when it moves is reduced, thereby extending the service life of the limiting rod 195.

[0035] A No. 2 spiral spring is arranged between the inner walls of the rectangular plate 197 and the L-shaped plate 198 contacting the grip rod 193 and the T-shaped rod 192. By adjusting the position of the movable plate 191, the operator can choose to enable or release the limiting rod 195 according to actual needs.

[0036] When the present embodiment is working, after the rubber sheet 17 is stopped from moving by the obstruction of the wafer, the push plate 15 also stops moving, and at the same time, the loading frame 12 moves to drive the fixed frame 181 to move toward the push plate 15, and the fixed frame 181 moves to drive the J-shaped plate 185 and the contact rod 182 to move toward the push plate 15, and the side of the contact rod 182 away from the stop block 183 contacts the inner wall of the circular hole during movement, and the contact rod 182 is stopped from moving by the obstruction of the push plate 15, and the fixed frame 181 continues to move to stretch the No. 2 spring 184, and the No. 2 spring 184 is stretched and deformed, and at the same time, the arc surface of the J-shaped plate 185 contacts the stop block 183 during movement. When the inclined surface 183 contacts the curved surface 1, the inclined surface 182 exerts resistance on the curved surface 183, and the J-shaped plate 185 moves downward under the influence of the resistance. The J-shaped plate 185 squeezes the Z-shaped piece 186 during the movement, and the Z-shaped piece 186 is squeezed and deformed. At the same time, the movement of the J-shaped plate 185 drives the limiting plate 187 to move downward. The bottom of the limiting plate 187 contacts the inner wall of the trapezoidal groove during the movement. At the same time, the inclined surface 2 of the limiting plate 187 fits the trapezoidal groove, so that the trapezoidal groove imposes a limit on the limiting plate 187. The limiting plate 187 stops moving due to the limit, and the J-shaped plate 185 stops moving together, resulting in the fixed frame 181 restricting the continued movement of the loading frame 12. The movement of the fixed frame 181 is restricted by the limit plate 187 to ensure that the rubber sheet 17 can apply a stable clamping force when positioning wafers of different sizes. After the positioning is completed, the loading frame 12 moves away from the placement plate 11, and the movement of the loading frame 12 drives the fixed frame 181 to move away from the placement plate 11. The fixed frame 181 gradually reduces the pulling force applied to the second spring 184 during the movement, so that the contact surface of the stop block 183 and the J-shaped plate 185 are separated, and the deformed Z-shaped sheet 186 recovers and drives the J-shaped plate 185 to move upward. The movement of the J-shaped plate 185 drives the limit plate 187 to move upward, and the limit The surface of the plate 187 in contact with the trapezoidal groove gradually separates during the movement, thereby completing the reset work. When the J-shaped plate 185 fails to reset upward due to an emergency, the J-shaped plate 185 moves away from the push plate 15 to drive the limit plate 187 to move. The trapezoidal groove applies resistance to the second inclined surface of the limit plate 187. The limit plate 187 moves upward under the influence of the resistance. The limit plate 187 gradually separates from the trapezoidal groove during the movement. By providing the second inclined surface, the limit plate 187 can still be separated from the trapezoidal groove when the J-shaped plate 185 fails to reset smoothly due to a fault, thereby avoiding the safety hazard caused by jamming, thereby ensuring the normal operation of the positioning.

[0037] The J-shaped plate 185 moves downward and separates from the contact surface of the spherical surface, so that the deformed No. 4 spring 196 recovers and drives the limiting rod 195 to move away from the contact rod 182. The limiting rod 195 contacts the inner wall of the card slot during the movement, so that the limiting rod 195 applies a limit to the J-shaped plate 185 moved to the specified position, so that the limit plate 187 maintains a stable contact with the trapezoidal groove when the wafer is positioned. After the positioning is completed, the operator rotates the grip 193, and the grip 193 stretches the No. 2 scroll spring during the rotation. The No. 2 scroll spring is stretched and deformed. At the same time, the rotation of the grip 193 drives the rectangular plate 197 to rotate. The rectangular plate 197 rotates and separates from the surface in contact with the L-shaped plate 198, so that the limit imposed by the L-shaped plate 198 on the upward movement of the grip 193 is released, and the grip 193 is pulled to move upward. The movement of the grip 193 drives the T-shaped rod 192 to move upward. The T-shaped rod 192 stretches the No. 3 spring 194 during the movement, and the No. 3 spring 194 is deformed due to the stretching. At the same time, the T-shaped rod 192 separates from the limit groove during the movement, so that the limit imposed by the loading frame 12 on the moving plate 191 is released, and the grip 193 is pulled to move toward the contact rod 182. The movement of the grip 193 drives the T-shaped rod 192 to move toward the contact rod 182. The movement of the T-shaped rod 192 drives the moving plate 191 to move toward the contact rod 182, and the movement of the moving plate 191 drives the limiting rod 195 to move toward the contact rod 182. The limiting rod 195 is separated from the slot during movement, and the limiting rod 195 is used to limit the J-shaped plate 185 to ensure that the limiting plate 187 maintains stable contact with the trapezoidal groove, which helps to improve the positioning accuracy. The limit imposed by the limiting rod 195 requires standardized operation to be released. When the limiting rod 195 is no longer needed to limit the J-shaped plate 185, repeat the above operation to release the limit imposed on the moving plate 191, and then pull the gripping rod 193 to drive the T-shaped rod 1 92 moves, and the movement of the T-shaped rod 192 drives the moving plate 191 to move. When the moving plate 191 moves to the specified position, the control handle 193 moves downward, and the movement of the handle 193 drives the T-shaped rod 192 to move downward. When the T-shaped rod 192 moves, the deformed No. 3 spring 194 gradually recovers. At the same time, the T-shaped rod 192 contacts the inner wall of the slot during movement, so that the J-shaped plate 185 will not be limited by the limiting rod 195 during movement. By adjusting the position of the moving plate 191, the operator can choose to enable or release the limiting rod 195 according to actual needs, which effectively improves the flexibility of using the limiting rod 195.

[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer flat edge positioning device, comprising a fixing plate (1), characterized in that: A support frame (2) is fixedly mounted on the top of the fixed plate (1), a working platform (3) is fixedly mounted on the top of the support frame (2), a driving motor (4) is fixedly penetrated through the bottom of the fixed plate (1), a screw rod (5) is fixedly mounted on the output end of the driving motor (4), a sleeve (6) is threadedly connected to the circumferential surface of the screw rod (5), a circular groove is provided on the top of the working platform (3), a trapezoidal groove is relatively provided on the top of the working platform (3), and a clamping device, a protective device and a locking device are also included; The clamping device comprises a carrying plate (7), a sliding plate (8), a connecting rod (9), a long rod (10), a placing plate (11), a loading frame (12), a telescopic rod (13), a No. 1 spring (14), a pushing plate (15), a cylindrical rod (16) and a rubber sheet (17); the carrying plate (7) is fixedly mounted on the circumferential surface of the sleeve (6); the sliding plate (8) slides through the inner and outer walls of the working platform (3); one end of the connecting rod (9) rotates through the inner and outer walls of the carrying plate (7); the other end of the connecting rod (9) rotates through the inner and outer walls of the sliding plate (8); the long rod (10) is fixedly mounted on the top of the carrying plate (7); the long rod (10) slides The working platform (3) is penetrated through the inner and outer walls, the placement plate (11) is fixedly mounted on the top of the long rod (10), the loading frame (12) is fixedly mounted on the top of the sliding plate (8), the telescopic rod (13) slides through the inner and outer walls of the loading frame (12), the first spring (14) is arranged between the telescopic rod (13) and the loading frame (12), the pushing plate (15) is fixedly mounted on a side of the telescopic rod (13) close to the placement plate (11), the cylindrical rod (16) rotates through the inner and outer walls of the pushing plate (15), the rubber sheet (17) is arranged on the circumferential surface of the cylindrical rod (16), and the pushing plate (15) is provided with an arc surface one on a side close to the rubber sheet (17).

2. A wafer flat edge positioning device according to claim 1, characterized in that: The size of the placement plate (11) is matched with the circular groove, the top of the placement plate (11) is provided with an anti-slip groove, the top of the loading frame (12) is provided with a limiting groove, and the top of the loading frame (12) is provided with a sliding groove.

3. A wafer flat edge positioning device according to claim 2, characterized in that: A spiral spring No. 1 is arranged between the cylindrical rod (16) and the push plate (15); a surface of the rubber sheet (17) away from the arc surface No. 1 is provided with corrugations; and a surface of the push plate (15) away from the rubber sheet (17) is provided with a circular hole.

4. A wafer flat edge positioning device according to claim 3, characterized in that: The protective device comprises a fixed frame (181), a contact rod (182), a stop block (183), a second spring (184), a J-shaped plate (185), a Z-shaped plate (186) and a limit plate (187); the fixed frame (181) is fixedly mounted on the surface of the loading frame (12); the contact rod (182) slides through a side of the fixed frame (181) close to the push plate (15); the stop block (183) is fixedly mounted on a side of the contact rod (182) away from the push plate (15); the second spring (184) is arranged Between the stop block (183) and the fixed frame (181), the J-shaped plate (185) slides through the inner and outer walls of the fixed frame (181), the Z-shaped plate (186) is arranged between the J-shaped plate (185) and the fixed frame (181), the limit plate (187) slides through the inner and outer walls of the J-shaped plate (185), the Z-shaped plate (186) itself has elasticity, a first inclined surface is provided on one side of the stop block (183) close to the J-shaped plate (185), and a second curved surface is provided on one side of the J-shaped plate (185) close to the stop block (183).

5. The wafer flat edge positioning device according to claim 4, characterized in that: A second inclined surface is provided on a side of the limiting plate (187) away from the stop block (183). The size of the limiting plate (187) is adapted to the trapezoidal groove. A clamping groove is provided on the surface of the J-shaped plate (185).

6. A wafer flat edge positioning device according to claim 5, characterized in that: The locking device comprises a moving plate (191), a T-shaped rod (192), a gripping rod (193), a No. 3 spring (194), a limiting rod (195), a No. 4 spring (196), a rectangular plate (197) and an L-shaped plate (198); the moving plate (191) is slidably mounted on the top of the loading frame (12); the T-shaped rod (192) slides through the inner and outer walls of the moving plate (191); the gripping rod (193) is rotatably mounted on the top of the T-shaped rod (192); the No. 3 spring (194) is arranged Between the T-shaped rod (192) and the movable plate (191), the limiting rod (195) slides through the inner and outer walls of the movable plate (191), the No. 4 spring (196) is arranged between the limiting rod (195) and the movable plate (191), the rectangular plate (197) is fixedly mounted on the circumferential surface of the gripping rod (193), the L-shaped plate (198) is fixedly mounted on the top of the movable plate (191), the movable plate (191) contacts the slide groove, and the bottom of the T-shaped rod (192) contacts the inner wall of the limiting groove.

7. A wafer flat edge positioning device according to claim 6, characterized in that: A spherical surface 1 is formed on a surface of the limiting rod (195) close to the J-shaped plate (185), and the spherical surface 1 contacts a surface of the J-shaped plate (185) close to the slot. The size of the limiting rod (195) is adapted to the slot.

8. The wafer flat edge positioning device according to claim 7, characterized in that: The rectangular plate (197) contacts the inner wall of the L-shaped plate (198), and a second spiral spring is arranged between the gripping rod (193) and the T-shaped rod (192).

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