Processing Method for Abnormal Exit of Wafer and Chip Ectopia

Abstract

The present invention provides a method for dealing with the abnormal exit of wafers and the misalignment of chips. The method for dealing with the abnormal exit of wafers and the misalignment of chips is to lift a circle of the edge of the adhesive film from the film-breaking ring and re-paste it on the film-breaking ring. Or apply pressure to the annular area of the adhesive film between the film-breaking ring and the wafer from the non-adhesive surface of the adhesive film. The method for dealing with the abnormal exit of wafers and the misalignment of chips provided by the present invention solves the problem of serious waste during the secondary cutting of wafers.

Description

Technical Field

[0001] The present invention relates to the field of wafer cutting, and particularly to a method for dealing with the abnormal exit of a wafer and the misalignment of chips. Background Art

[0002] When a wafer is placed in a cutting machine for cutting, since the position of the film-breaking ring is slightly lower than that of the workbench, the downward pressure of the clamping jaws will generate a certain expansion pressure on the adhesive film, so that the adhesive film is in a tightened state. During the wafer cutting process, if special situations such as sudden shutdown or operation error occur, it is necessary to take out the wafer assembly from the cutting machine. Then when the wafer is placed in the cutting machine again for cutting, due to the above-mentioned expansion pressure, the adhesive film will be tightened and deformed, thereby driving the wafer edge to be misaligned between 20 and 40 um, with the middle low and both sides high. This will cause the cutting channels not to be in a straight line during the re-cutting operation, resulting in the situation that the functional areas of the circuit part are cut. Eventually, the wafer is scrapped, wasting the wafer. The current solutions are: retaining more chips in the middle area and scrapping the chips on both sides; using a special cutting program for breakpoint cutting. However, the above cutting program is complex, requires multiple calibrations and alignments, is complicated and time-consuming to operate, and cannot guarantee the yield of all wafers. And both solutions will inevitably lead to wafer waste. Summary of the Invention

[0003] In order to solve the problem of serious waste during the secondary cutting of wafers, the present invention provides a method for dealing with the abnormal exit of a wafer and the misalignment of chips to solve the above problems.

[0004] A method for dealing with the abnormal exit of a wafer and the misalignment of chips, the wafer assembly includes a film-breaking ring, a wafer located inside it, and an adhesive film laid on both the film-breaking ring and the wafer at the same time. Lift a circle of the adhesive film near the edge from the film-breaking ring and re-paste it on the film-breaking ring, and keep a circle of the adhesive film near the middle adhered to a circle of the inner side of the film-breaking ring during the lifting process.

[0005] In a preferred embodiment of the method for dealing with the abnormal exit of a wafer and the misalignment of chips provided by the present invention, place a first jig on the film-breaking ring from the non-adhesive surface of the adhesive film;

[0006] The first jig includes a first pressing ring and a first limiting hook. The outer diameter of the first pressing ring is smaller than the diameter of the adhesive film and larger than the inner diameter of the film-breaking ring, and the inner diameter is smaller than the inner diameter of the film-breaking ring. The first pressing ring presses a circle of the adhesive film near the middle on a circle of the inner side of the film-breaking ring. The first limiting hook is arranged on the outer edge of the first pressing ring, and the first limiting hook is connected to the outer edge of the film-breaking ring;

[0007] Manually lift the position of the adhesive film not covered by the first jig from the film-breaking ring and re-paste it on the film-breaking ring; rotate the first jig, and manually perform the operations of lifting and re-pasting the position covered by the first limiting hook before rotation.

[0008] In a preferred embodiment of the method for processing the abnormal exit of the wafer and the misalignment of the chip provided by the present invention, the second fixture is placed on the film-breaking ring from the non-adhesive surface of the adhesive film;

[0009] The second fixture includes a second pressing ring, a connecting frame, a limiting frame and a scraper. The outer diameter of the second pressing ring is smaller than the diameter of the adhesive film and larger than the inner diameter of the film-breaking ring, and the inner diameter is smaller than the inner diameter of the film-breaking ring. The second pressing ring presses a middle circle of the adhesive film against an inner circle of the film-breaking ring. The connecting frame, the limiting frame and the scraper are sequentially arranged on the surface of the second pressing ring. The center position of the limiting frame is movably connected to the connecting frame. The edge of the limiting frame extends beyond the second pressing ring and is connected to the outer edge of the film-breaking ring. The scraper is installed on the limiting frame through a slide rail, and the slide rail is arranged along the radial direction of the limiting frame;

[0010] Control the scraper to lift the position of the adhesive film not covered by the second pressing ring from the film-breaking ring, and manually re-paste the adhesive film on the film-breaking ring.

[0011] A method for processing the abnormal exit of the wafer and the misalignment of the chip. The wafer assembly includes a film-breaking ring, a wafer located inside it, and an adhesive film laid on both the film-breaking ring and the wafer at the same time. Pressure is applied to the annular area between the film-breaking ring and the wafer of the adhesive film from the non-adhesive surface of the adhesive film, and the adhesive film remains adhered to the film-breaking ring during the pressure application process.

[0012] Pressure is applied to the annular area between the film-breaking ring and the wafer of the adhesive film from the non-adhesive surface of the adhesive film, and at the same time, vibration is applied to the film-breaking ring from the side of the film-breaking ring away from the adhesive film. The adhesive film remains adhered to the film-breaking ring during the pressure application and vibration processes.

[0013] In a preferred embodiment of the method for processing the abnormal exit of the wafer and the misalignment of the chip provided by the present invention, the third fixture is placed on the adhesive film from the non-adhesive surface of the adhesive film;

[0014] The third fixture includes a third pressing ring and a third limiting hook. The outer diameter of the third pressing ring is smaller than the inner diameter of the film-breaking ring, the inner diameter is larger than the diameter of the wafer, and the thickness is larger than the thickness of the film-breaking ring. The third limiting hook is arranged on the surface of the third pressing ring. The third pressing ring presses on the adhesive film, and the third limiting hook is connected to the outer edge of the film-breaking ring;

[0015] Apply pressure to the annular area between the film-breaking ring and the wafer of the adhesive film through the third pressing ring until the third limiting hook contacts the adhesive film.

[0016] In a preferred embodiment of the method for processing the abnormal exit of the wafer and the misalignment of the chip provided by the present invention, the fixture is placed under the film-breaking ring from the adhesive surface of the adhesive film;

[0017] The fixture is annular, with its inner and outer dimensions being the same as those of the film-breaking ring. A plurality of limiting plates are provided at the edge, and the limiting plates are connected to the outer edge of the film-breaking ring. A plurality of through holes are provided in a circle along the fixture.

[0018] Vibration originates from contacting the film-breaking ring in the through holes, and vibration is applied to the film-breaking ring.

[0019] Compared with the prior art, the method for processing abnormal wafer exit and chip misalignment provided by the present invention has the following beneficial effects:

[0020] 1. The basic principle of the solution provided by the present invention is to make the adhesive film in a relaxed state and reserve in advance the margin required for the expansion of the adhesive film. Specifically, there are two directions: operating the adhesive film around the edge to make it in a relaxed state, and operating the adhesive film around the middle to make it in a relaxed state.

[0021] When the gripper places the wafer assembly back onto the cutting equipment in any direction of operation, the adhesive film no longer expands, avoiding wafer misalignment caused by the expansion deformation of the adhesive film when the gripper presses it down. Ensure that after the wafer returns to the cutting machine workbench again, it can stay close to the original position (the error is between 2 - 5um). Effectively avoid cutting errors, thereby achieving zero loss of wafer cutting yield.

[0022] 2. The solution provided by the present invention can be completed through manual operation, or can be completed through a jig by manual or automatic operation, with convenient operation and wide application range. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a structural schematic diagram of a wafer assembly;

[0024] Figure 2 is a structural diagram of the method for processing abnormal wafer exit and chip misalignment in Embodiment 1;

[0025] Figure 3 is a structural diagram of the method for processing abnormal wafer exit and chip misalignment in Embodiment 2;

[0026] Figure 4 is a structural schematic diagram of the second jig in Embodiment 2;

[0027] Figure 5 is a structural diagram of the method for processing abnormal wafer exit and chip misalignment in Embodiment 3;

[0028] Figure 6 is a structural diagram of the method for processing abnormal wafer exit and chip misalignment in Embodiment 4.

[0029] Numbers in the figure: film collapse ring 1, film 2, wafer 3, first pressure ring 41, first limiting hook 42, second pressure ring 51, connecting frame 52, bearing 53, limiting frame 54, slide rail 55, scraper 56, third pressure ring 61, third limiting hook 62, clamp 7, limiting plate 71. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0031] Example 1: Please also refer to Figure 1 and Figure 2 , are respectively a structural schematic diagram of a wafer assembly and a structural diagram of a method for processing abnormal wafer exit and chip misalignment in this embodiment.

[0032] The wafer assembly includes a collapse film ring 1, a wafer 3 located inside the collapse film ring, and an adhesive film 2 laid on both the collapse film ring 1 and the wafer 3. The edge of the adhesive film 2 is located on the collapse film ring 1.

[0033] The processing method for abnormal wafer exit and chip misalignment is:

[0034] After the wafer assembly is taken out from the cutting device, it is turned over so that the adhesive film 2 faces upward. The film collapse ring 1 is supported and the first fixture is placed.

[0035] The first fixture includes a first pressing ring 41 and a first limiting hook 42. The outer diameter of the first pressing ring 41 is smaller than the diameter of the film 2 and larger than the inner diameter of the membrane collapse ring 1, and the inner diameter is smaller than the inner diameter of the membrane collapse ring 1. Under this size, the first pressing ring 41 can press the inner circle of the part of the film 2 located on the membrane collapse ring 1, and the outermost circle is open, which is convenient for subsequent operations.

[0036] Two first limiting hooks 42 are symmetrically arranged on the outer edge of the first pressing ring 41. The first limiting hook 42 is a flat plate integrated with the first pressing ring 41, with its end bent downward and connected with the flat edge of the membrane collapse ring 1 to position the first pressing ring 41 and make it concentric with the membrane collapse ring 1.

[0037] Manually lift up the outermost circle of the adhesive film 2 not covered by the first pressing ring 41 and re-stick it on the film collapse ring 1. Replace the position of the first fixture in time to clear the area previously covered by the first limiting hook 42, and perform the same lifting and sticking operations.

[0038] During the operation, due to the presence of the first pressure ring 41, the middle circle of the adhesive film 2 is always kept adhered to the inner circle of the film collapse ring 1, and the adhesive film 2 will not completely separate from the film collapse ring 1. After the operation is completed, the wafer assembly is put back into the cutting equipment for secondary cutting.

[0039] Example 2: Please refer to Figure 3 and Figure 4 , which are respectively the structural diagram of the processing method for the abnormal exit of the wafer and the chip misalignment, and the structural schematic diagram of the second jig. Among them, Figure 4 is the structural schematic diagram after separating the upper and lower parts of the second jig, Figure 4 -a is the bottom view of the upper part, Figure 4 -b is the top view of the lower part.

[0040] The processing method for the abnormal exit of the wafer and the chip misalignment includes:

[0041] After taking out the wafer assembly from the cutting equipment, turn it over so that the side of the adhesive film 2 faces up. Hold the film-breaking ring 1 and place the second jig.

[0042] The second jig includes a second pressing ring 51, a connecting frame 52, a bearing 53, a limiting frame 54, a slide rail 55, and a scraper 56. The second pressing ring 51 is the same as the first pressing ring 41 in Example 1.

[0043] On the surface of the second pressing ring 51, a radially arranged connecting frame 52 is fixed, and their edges are aligned and concentric in the middle. The center of the connecting frame 52 is a circular flat plate for installing the bearing 53. The shape of the limiting frame 54 is similar to that of the connecting frame 52, including a circular center and a radially arranged outer side. The center position is connected to the connecting frame 52 through the bearing 53, and the outer side extends outward and crosses the second pressing ring 51, and the end bends downward to form an arc-shaped edge, which is connected to the arc edge position of the film-breaking ring 1 to achieve the positioning of the second pressing ring 51 and make it concentric with the film-breaking ring 1.

[0044] On the limiting frame 54, a slide rail 55 is arranged along its radial direction, and a scraper 56 is arranged on the side of the outer end of the slide rail 55 close to the second pressing ring 51. The scraper 56 is a blunt knife.

[0045] Manually press down the scraper 56 to make it abut against the film-breaking ring 1, and then move it inward along the slide rail 55 until it touches the second pressing ring 51, so as to lift the outermost side of the adhesive film 2. Subsequently, move the limiting frame 54, the slide rail 55, and the scraper 56 together in a circle or more, so that the scraper 56 lifts the outermost circle of the adhesive film 2 and manually reattaches it to the film-breaking ring 1. After the operation is completed, put the wafer assembly back into the cutting equipment for secondary cutting.

[0046] Example 3: Please refer to Figure 5 , which is the structural diagram of the processing method for the abnormal exit of the wafer and the chip misalignment in this example.

[0047] The processing method for the abnormal exit of the wafer and the chip misalignment includes:

[0048] After removing the wafer assembly from the cutting device, turn it over so that the side of the adhesive film 2 faces upward. Hold the film-breaking ring 1 and place the third fixture.

[0049] The third fixture includes a third pressing ring 61 and a third limiting hook 62. The outer diameter of the third pressing ring 61 is smaller than the inner diameter of the film-breaking ring 1, the inner diameter is larger than the diameter of the wafer 3, and the thickness is larger than the thickness of the film-breaking ring 1.

[0050] Four third limiting hooks 62 are symmetrically arranged on the upper surface of the third pressing ring 61, and the ends are bent downward to connect with the flat edge position of the film-breaking ring 1, so as to position the third pressing ring 61 and make it concentric with the film-breaking ring 1. After placing the third fixture, manually apply pressure, and use the thickness of the third pressing ring 61 itself to squeeze the adhesive film 2 downward until the third limiting hook 62 also contacts the adhesive film 2.

[0051] After the operation is completed, place the wafer assembly back into the cutting device for secondary cutting.

[0052] Example 4: Please refer to Figure 6 , which is the structural diagram of the processing method for abnormal wafer exit and chip misalignment in this example.

[0053] The processing method for abnormal wafer exit and chip misalignment includes:

[0054] First, hold the fixture 7. After removing the wafer assembly from the cutting device, turn it over so that the side of the adhesive film 2 faces upward, place it on the fixture 7, and then place the third fixture. The vibration source extends into the wafer assembly through each through hole of the fixture 7 to lift the film-breaking ring 1 and transmit vibration.

[0055] The shape of the fixture 7 is the same as that of the film-breaking ring 1, and a circle of multiple through holes is provided along the ring shape, and a plurality of limiting plates 71 are provided at the edge for connecting with the flat edge position of the film-breaking ring 1. Each limiting plate 71 is disconnected in the middle for the third limiting hook 62 of the third fixture to pass through. The structure of the third fixture is similar to that in Example 3, and a plurality of counterweight blocks are provided on the top of the third pressing ring 61 to replace manual pressure application, and the width of the third limiting hook 62 is reduced to adapt to the structure of the limiting plate 71.

[0056] Under the combined action of vibration and counterweight, the relaxation operation of the adhesive film 2 is realized. After the operation is completed, place the wafer assembly back into the cutting device for secondary cutting.

[0057] The above are only the embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the content of the specification of the present invention, or directly or indirectly applied to other related technical fields, shall be equally included in the patent protection scope of the present invention.

Claims

1. A method for dealing with the abnormal exit of a wafer and the misalignment of chips. The wafer assembly includes a film-breaking ring, a wafer located inside it, and a glue film laid on both the film-breaking ring and the wafer at the same time. It is characterized in that: Peel off the edge part of the glue film from the film-breaking ring and re-paste it on the film-breaking ring. During the peeling process, keep the middle part of the glue film adhered to the inner part of the film-breaking ring.

2. The processing method for abnormal wafer exit and chip misalignment according to claim 1, characterized in that: Place the first fixture on the film-breaking ring from the non-glue side of the glue film. The first fixture includes a first pressing ring and a first limiting hook. The outer diameter of the first pressing ring is smaller than the diameter of the glue film and larger than the inner diameter of the film-breaking ring, and its inner diameter is smaller than the inner diameter of the film-breaking ring. The first pressing ring presses the middle part of the glue film against the inner part of the film-breaking ring. The first limiting hook is arranged on the outer edge of the first pressing ring and is connected to the outer edge of the film-breaking ring. Manually peel off the part of the glue film not covered by the first fixture from the film-breaking ring and re-paste it on the film-breaking ring. Rotate the first fixture and manually perform the operations of peeling off and re-pasting the part that was covered by the first limiting hook before rotation.

3. The processing method for the abnormal exit of the wafer and the misalignment of the chip according to claim 1, characterized in that: Place the second fixture on the film-breaking ring from the non-glue side of the glue film. The second fixture includes a second pressing ring, a connecting frame, a limiting frame, and a scraper. The outer diameter of the second pressing ring is smaller than the diameter of the glue film and larger than the inner diameter of the film-breaking ring, and its inner diameter is smaller than the inner diameter of the film-breaking ring. The second pressing ring presses the middle part of the glue film against the inner part of the film-breaking ring. The connecting frame, the limiting frame, and the scraper are sequentially arranged on the surface of the second pressing ring. The central position of the limiting frame is movably connected to the connecting frame. The edge of the limiting frame extends beyond the second pressing ring and is connected to the outer edge of the film-breaking ring. The scraper is installed on the limiting frame through a slide rail, and the slide rail is arranged radially along the limiting frame. Control the scraper to peel off the part of the glue film not covered by the second pressing ring from the film-breaking ring, and manually re-paste the glue film on the film-breaking ring.

4. A method for handling the displacement of chips due to abnormal wafer withdrawal. The wafer assembly includes a film-breaking ring, a wafer located inside it, and a glue film laid on both the film-breaking ring and the wafer. It is characterized in that: Apply pressure to the annular area between the film-breaking ring and the wafer from the non-glue side of the glue film. During the pressure application process, keep the glue film adhered to the film-breaking ring.

5. The method for processing the abnormal exit of the wafer and the misalignment of the chip according to claim 4, wherein: Apply pressure to the annular area between the film-breaking ring and the wafer from the non-glue side of the glue film, and at the same time, apply vibration to the film-breaking ring from the side of the film-breaking ring away from the glue film. During the pressure application and vibration processes, keep the glue film adhered to the film-breaking ring.

6. The processing method for abnormal wafer exit and chip misalignment according to claim 4 or 5, characterized in that: Place the third fixture on the glue film from the non-glue side of the glue film. The third fixture includes a third pressing ring and a third limiting hook. The outer diameter of the third pressing ring is smaller than the inner diameter of the film-breaking ring, the inner diameter is larger than the diameter of the wafer, and the thickness is larger than the thickness of the film-breaking ring. The third limiting hook is arranged on the surface of the third pressing ring. The third pressing ring presses on the glue film, and the third limiting hook is connected to the outer edge of the film-breaking ring. Apply pressure to the annular area between the film-breaking ring and the wafer through the third pressing ring until the third limiting hook touches the glue film.

7. The processing method for abnormal wafer exit and chip misalignment according to claim 5, characterized in that: Place the fixture under the film-breaking ring from the glue side of the glue film. The fixture is annular, and its inner and outer dimensions are the same as those of the film-breaking ring. Multiple limiting plates are arranged at the edge, and the limiting plates are connected to the outer edge of the film-breaking ring. A circle of multiple through holes is arranged along the fixture. The vibration source contacts the film-breaking ring through the through holes to apply vibration to the film-breaking ring.

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