Power battery pack cooling module
By designing the power battery pack cooling module, the combination of temperature uniform plate, thermoelectric cooler, liquid-cooling plate and support plate is used to solve the problems of contact thermal resistance, uneven heat conduction and secondary thermal pollution in the power battery pack cooling system, and effective heat management and battery pack cooling effect are achieved.
Patent Information
- Application Number
- CN202510311322.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-17
- Publication Date
- 2025-05-23
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing power battery cooling system has a liquid-cooled plate that is likely to cause contact thermal resistance when it is directly contacted by the battery surface, resulting in local overheating; the thermoelectric refrigeration component has low integration with the radiator, which cannot achieve directional heat conduction; the cooling module will reversely transfer the absorbed heat into the battery box when it is working, resulting in secondary thermal pollution.
A power battery pack cooling module is designed, including a temperature uniform plate, a thermoelectric cooler, a liquid cooling plate and a support plate. The temperature equalization plate is attached to the heating surface of the power battery pack, the upper side of the thermoelectric cooler is attached to the temperature equalization plate, and the lower side is attached to the liquid-cooled plate; the liquid-cooled plate has a liquid inlet and a liquid outlet, and the support plate is a groove-like structure with an upward opening, and the inner surface is wrapped with heat insulation material.
This cooling module can effectively solve the problem of local overheating of the battery pack, realize directed heat transmission, and avoid back-transmitting of heat to the battery box, preventing secondary thermal pollution.
Smart Images

Figure CN120033378A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of thermal management technology for new energy vehicles, and specifically to the field of power battery pack cooling. Background Art
[0002] As the energy density of new energy vehicle power batteries increases, the heat generated during battery charging and discharging increases dramatically. If the heat cannot be removed in time, the temperature gradient of the battery pack will increase, the cycle life will be shortened, and even the risk of thermal runaway will be triggered.
[0003] Existing cooling technologies are mainly divided into three categories: air cooling, liquid cooling and phase change cooling. The air cooling system dissipates heat through air convection, but the heat exchange efficiency is low and it is difficult to meet the needs of high-rate charging and discharging; the liquid cooling system uses coolant to flow through metal plates (such as aluminum liquid cooling plates) to take away heat. Although it can improve the heat dissipation capacity, direct contact installation is prone to contact thermal resistance due to uneven surface, resulting in uneven heat dissipation in local areas; phase change material cooling relies on the material phase change to absorb heat, and has the defects of uncontrollable thermal conductivity rate and difficulty in continuous operation.
[0004] The power battery cooling system in the existing technology generally has the following problems: when the liquid cooling plate directly contacts the battery surface, it is easy to generate contact thermal resistance, resulting in local overheating; the thermoelectric cooling component and the radiator have low integration and cannot achieve directional heat conduction; when the cooling module is working, the absorbed heat will be transferred back to the battery box, causing secondary thermal pollution and other problems. Summary of the invention
[0005] In view of the problems existing in the prior art, the purpose of the present application is to provide a cooling module for a power battery pack to achieve effective cooling of the power battery pack.
[0006] The present application discloses a power battery pack cooling module, which includes a temperature averaging plate, a thermoelectric cooler, a liquid cooling plate and a support plate, wherein: the temperature averaging plate is attached to the heating surface of the power battery pack, the upper side of the thermoelectric cooler is attached to the temperature averaging plate, and the lower side of the thermoelectric cooler is attached to the liquid cooling plate; the liquid cooling plate has a liquid inlet and a liquid outlet; the support plate is a groove-shaped structure opening upward, and the inner surface of the support plate is wrapped with a heat insulating material;
[0007] The liquid cooling plate is accommodated in the groove structure of the bottom support plate.
[0008] Preferably, it also includes a top insulating thermal pad, and the temperature averaging plate is attached to the heating surface of the power battery pack through the insulating thermal pad.
[0009] Preferably, the heat generating surface is an electrode of a battery pack or a cell surface of a battery pack.
[0010] Preferably, it also includes an insulation layer, which is provided with through holes that match the shape of the thermoelectric cooler. In the assembled state, the upper surface of the thermoelectric cooler is flush with the upper surface of the insulation layer, and the lower surface of the thermoelectric cooler is flush with the lower surface of the insulation layer.
[0011] Preferably, the number of the through holes is 5-10, and the number of the thermoelectric chips is equal to the number of the through holes.
[0012] Preferably, it also includes an insulating thermal pad for a thermoelectric cooler, the upper side of the thermoelectric chip is attached to the temperature equalizing plate through the insulating thermal pad for the thermoelectric cooler, and the lower side of the thermoelectric chip is attached to the liquid cooling plate through another insulating thermal pad for the thermoelectric cooler.
[0013] The present application also provides a power battery pack having the above-mentioned cooling module.
[0014] In the present application, by setting up a cooling module for the power battery pack, on the one hand, the problem of local overheating of the battery pack can be solved and directional heat conduction of the battery pack can be achieved. When the cooling module is working, it can effectively prevent heat from being transferred back to the battery box to form secondary thermal pollution. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the structure of a cooling module for a power battery pack provided in an embodiment of the present application;
[0016] Among them: 1: top insulating thermal pad, 2: temperature equalizing plate, 3: thermal insulation layer, 4: liquid cooling plate, 5: insulating thermal pad for thermoelectric cooler, 6: thermoelectric cooler, 7: support plate. DETAILED DESCRIPTION
[0017] The exemplary embodiments disclosed in the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the specific embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present application and to fully convey the scope disclosed in the present application to those skilled in the art.
[0018] In the following description, a large number of specific details are given to provide a more thorough understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features known in the art are not described; that is, all features of the actual embodiments are not described here, and well-known functions and structures are not described in detail.
[0019] In the drawings, the sizes of layers, regions, elements and their relative sizes may be exaggerated for clarity. Like reference numerals denote like elements throughout.
[0020] A power battery pack cooling module comprises a top insulating thermal pad 1, a temperature equalizing plate 2, a heat insulating layer 3, a liquid cooling plate 4, an insulating thermal pad 5 for a thermoelectric cooler, a thermoelectric cooler 6 and a support plate 7.
[0021] The temperature plate 2 is attached to the heating surface of the power battery pack through the top insulating thermal pad 1, and the heating surface is the electrode of the battery pack or the surface of the battery cell of the battery pack. A plurality of through holes are arranged at intervals on the thermal insulation layer 3, and the through holes match the shape of the thermoelectric cooler 6, and the number of the thermoelectric coolers is equal to the number of the above-mentioned through holes. The thermoelectric cooler is accommodated in the above-mentioned through holes, and in the assembled state, the upper surface of the thermoelectric cooler is flush with the upper surface of the thermal insulation layer 3, and the lower surface of the thermoelectric cooler is flush with the lower surface of the thermal insulation layer 3.
[0022] Thermoelectric coolers, also known as TEC semiconductor coolers, are heat dissipation devices made using the Peltier effect, also known as the thermo-electric effect. When a direct current passes through a thermocouple composed of two semiconductor materials in a thermoelectric cooler, one end of the thermocouple absorbs heat and the other end releases heat.
[0023] The upper side of the thermoelectric cooler 6 is attached to the temperature equalizing plate 2 through an insulating thermal pad 5 for a thermoelectric cooler, and the lower side of the thermoelectric cooler 6 is attached to the liquid cooling plate 4 through another insulating thermal pad 5 for a thermoelectric cooler.
[0024] The liquid cooling plate 4 has a liquid inlet and a liquid outlet, through which the cooling liquid circulates, and the liquid cooling plate is used to transfer the heat on the thermoelectric chip to the cooling liquid.
[0025] The support plate 7 is a groove-shaped structure that opens upward, and the inner surface of the support plate is wrapped with a heat-insulating material. The above-mentioned liquid cooling plate 4 is accommodated in the groove-shaped structure of the support plate 7. In the assembled state, the support plate 7 is surrounded by the heat-insulating material and the heat-insulating layer 3 of the support plate 7. This arrangement enables the cooling module to effectively take away the heat conducted to the temperature-averaging plate by the power battery pack, while preventing the cooling module from diffusing the absorbed heat into the battery box, thereby avoiding unnecessary heat diffusion during cooling.
[0026] It should be understood that the "in an embodiment of the present application" or "in some embodiments" mentioned throughout the specification means that specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in an embodiment of the present application" or "in some embodiments" appearing throughout the specification may not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in various embodiments of the present application, the size of the sequence number of the above-mentioned processes does not mean the order of execution, and the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present application. The above-mentioned sequence numbers of the embodiments of the present application are for description only and do not represent the advantages and disadvantages of the embodiments.
[0027] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.
Claims
1. A power battery pack cooling module, the cooling module comprising a temperature averaging plate, a thermoelectric cooler, a liquid cooling plate and a support plate, wherein: The temperature equalizer is attached to the heating surface of the power battery pack, the upper side of the thermoelectric cooler is attached to the temperature equalizer, and the lower side of the thermoelectric cooler is attached to the liquid cooling plate; The liquid cooling plate has a liquid inlet and a liquid outlet; The support plate is an upwardly open groove-shaped structure, and the inner surface of the support plate is wrapped with a heat-insulating material; The liquid cooling plate is accommodated in the groove structure of the bottom support plate.
2. The power battery pack cooling module according to claim 1, characterized in that: It also includes a top insulating thermal pad, and the temperature spreader is attached to the heating surface of the power battery pack through the insulating thermal pad.
3. The power battery pack cooling module according to claim 1, characterized in that: The heating surface is the electrode of the battery pack or the surface of the battery cell of the battery pack.
4. The power battery pack cooling module according to any one of claims 1 to 3, characterized in that: It also includes an insulation layer with through holes that match the shape of the thermoelectric cooler. In the assembled state, the upper surface of the thermoelectric cooler is flush with the upper surface of the insulation layer, and the lower surface of the thermoelectric cooler is flush with the lower surface of the insulation layer.
5. The power battery pack cooling module according to claim 4, characterized in that: The number of the through holes is 5-10, and the number of the thermoelectric chips is equal to the number of the through holes.
6. The power battery pack cooling module according to claim 1, characterized in that: It also includes an insulating thermal pad for a thermoelectric cooler. The upper side of the thermoelectric chip is attached to the temperature equalizing plate through the insulating thermal pad for the thermoelectric cooler, and the lower side of the thermoelectric chip is attached to the liquid cooling plate through another insulating thermal pad for the thermoelectric cooler.
7. A power battery pack, characterized in that: The power battery pack has a cooling module according to any one of claims 1 to 6.