Intelligent power module based on HVIC chip

Abstract

The invention relates to the technical field of intelligent power modules, and discloses an intelligent power module based on an HVIC chip, and the module comprises an LVIC chip; the HVIC chip comprises an interlocking and dead zone circuit, and the interlocking and dead zone circuit is connected with the high-voltage driving circuit of the HVIC chip and the low-voltage driving circuit of the LVIC chip; the power assembly comprises a three-phase upper bridge arm circuit and a three-phase lower bridge arm circuit, the driving signal input end of the three-phase upper bridge arm circuit is connected with the driving signal output end of the high-voltage driving circuit of the HVIC chip, and the driving signal input end of the three-phase lower bridge arm circuit is connected with the driving signal output end of the low-voltage driving circuit of the LVIC chip; the HVIC chip comprises a lead frame, an HVIC chip body and a conducting element, and the HVIC chip body and the conducting element are both arranged on the lead frame. According to the invention, the module structure is simplified, the complexity of the circuit is reduced, and the overall integration level is improved; and the overall operation efficiency and reliability are improved.

Description

Technical Field

[0001] The invention relates to the technical field of intelligent power modules, and in particular to an intelligent power module based on an HVIC chip. Background Art

[0002] In modern power electronic devices, Intelligent Power Module (IPM) plays a vital role. IPM integrates power switching devices and drive control circuits to achieve efficient and accurate power conversion and control. With the rapid development of power electronics technology, the performance requirements for IPM are getting higher and higher, especially in high voltage and high current applications.

[0003] HVIC (High Voltage Integrated Circuit) chip is a high voltage integrated circuit that can withstand higher voltages and has the ability to drive power devices. Applying HVIC chips to intelligent power modules can further improve the module's integration and reliability while reducing system complexity and cost.

[0004] However, the application environment of the existing intelligent power module is relatively harsh. It is often used in places with high temperature and humidity, severe cold, coastal areas, etc., especially now that the integration of modules is getting higher and higher. If the module is started in a high humidity environment, the module has not yet heated up, and the moisture attached to the surface of the module has not been driven away, there is internal leakage, resulting in module failure, making the module integration complex, the heating control effect poor, the reliability low, and the adaptability small. Therefore, the present invention designs an intelligent power module based on the HVIC chip. Summary of the invention

[0005] The purpose of the present invention is to provide an intelligent power module based on an HVIC chip to solve the problems of the existing intelligent power modules in that the application environment is relatively harsh, internal leakage is prone to occur, resulting in module failure, complex module integration, poor heat control effect, low reliability and small adaptability.

[0006] The present invention provides an intelligent power module based on an HVIC chip, comprising:

[0007] LVIC chip;

[0008] The HVIC chip includes an interlock and dead zone circuit, wherein the interlock and dead zone circuit is connected to a high voltage drive circuit of the HVIC chip and a low voltage drive circuit of the LVIC chip;

[0009] A power component, the power component comprising a three-phase upper bridge arm circuit and a three-phase lower bridge arm circuit, the drive signal input end of the three-phase upper bridge arm circuit is connected to the drive signal output end of the high-voltage drive circuit of the HVIC chip, and the drive signal input end of the three-phase lower bridge arm circuit is connected to the drive signal output end of the low-voltage drive circuit of the LVIC chip;

[0010] The HVIC chip comprises a lead frame, an HVIC chip body and a conducting element. The HVIC chip body is arranged on the lead frame, and the conducting element is arranged on the lead frame.

[0011] In some embodiments of the present application, a power access terminal is provided on the lead frame, a power terminal is provided on the HVIC chip body, the input terminal of the conductive element is connected to the power access terminal, and the output terminal of the conductive element is connected to the power terminal of the HVIC chip body.

[0012] In some embodiments of the present application, the conductive element includes an IGBT tube and an FRD tube, the IGBT tube and the FRD tube are connected, the anode of the IGBT tube and the FRD tube is the input end of the conductive element, and the cathode of the IGBT tube and the FRD tube is the output end of the conductive element.

[0013] In some embodiments of the present application, the HVIC chip includes a first metal layer and a second metal layer, the second metal layer is arranged on the surface of the first metal layer, and a chip bonding area is arranged on the second metal layer.

[0014] In some embodiments of the present application, bonding pad areas are provided on the lead frame, the number of the bonding pad areas matches the number of the chip bonding areas, and the chip bonding areas are connected to the bonding pad areas on the lead frame through wire bonding.

[0015] In some embodiments of the present application, the HVIC chip body is adhered to the lead frame by silver-containing epoxy resin or tin-lead solder.

[0016] In some embodiments of the present application, the HVIC chip further includes a plastic package, and the plastic package is used to cover the lead frame, the HVIC chip body and the conductive element.

[0017] In some embodiments of the present application, the HVIC chip further includes a heat sink, and the heat sink is disposed on the plastic package body.

[0018] In some embodiments of the present application, the HVIC chip also includes a working protection circuit and a logic circuit, the working protection circuit includes an over-temperature protection circuit, an over-current protection circuit, an under-voltage protection circuit and an over-voltage protection circuit, and the over-temperature protection circuit, the over-current protection circuit, the under-voltage protection circuit and the over-voltage protection circuit are all connected to the logic circuit.

[0019] Compared with the prior art, the beneficial effect of the present invention is that the present invention combines LVIC and HVIC chips to realize the effective integration of high-voltage and low-voltage drive circuits, thereby simplifying the internal structure of the module, reducing the number of external components, reducing the complexity of the peripheral circuit and improving the overall integration; the design of the interlocking and dead zone circuits ensures the coordinated work between the high-voltage drive circuit and the low-voltage drive circuit, avoids potential conflicts and losses, and improves the operating efficiency and reliability of the intelligent power module; at the same time, the HVIC chip has overcurrent, overvoltage, undervoltage and other protection functions, which can effectively prevent power devices from being damaged due to abnormal working conditions, thereby improving the reliability of the entire module. The layout of the three-phase upper bridge arm circuit and the three-phase lower bridge arm circuit takes into account the signal transmission efficiency and electromagnetic compatibility, ensuring the efficiency and stability of power conversion; by introducing a heat sink in the HVIC chip design, and using a plastic package to cover the lead frame, chip body and conductive element, the heat dissipation capacity of the module is effectively improved, ensuring long-term stable operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0021] Figure 1 The present invention is a schematic diagram of an intelligent power module based on an HVIC chip. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0023] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0024] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0025] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0026] like Figure 1 As shown, the present invention provides an intelligent power module based on an HVIC chip, characterized in that it includes: an LVIC chip, an HVIC chip and a power component.

[0027] The HVIC chip comprises an interlock and dead zone circuit, wherein the interlock and dead zone circuit is connected with a high voltage driving circuit of the HVIC chip and a low voltage driving circuit of the LVIC chip.

[0028] A power component, the power component includes a three-phase upper bridge arm circuit and a three-phase lower bridge arm circuit, the drive signal input end of the three-phase upper bridge arm circuit is connected to the drive signal output end of the high-voltage drive circuit of the HVIC chip, and the drive signal input end of the three-phase lower bridge arm circuit is connected to the drive signal output end of the low-voltage drive circuit of the LVIC chip.

[0029] The HVIC chip comprises a lead frame, an HVIC chip body and a conducting element. The HVIC chip body is arranged on the lead frame, and the conducting element is arranged on the lead frame.

[0030] In the present embodiment, the intelligent power module is composed of multiple key components, including a low voltage integrated circuit (LVIC) chip, a high voltage integrated circuit (HVIC) chip and a power module. Specifically, the HVIC chip integrates interlocking and dead zone circuits, which are closely connected to the high voltage drive circuit of the HVIC chip and the low voltage drive circuit of the LVIC chip, ensuring the coordinated work of each part inside the module. In terms of the power module, the component is composed of a three-phase upper bridge arm circuit and a three-phase lower bridge arm circuit. The drive signal input end of the three-phase upper bridge arm circuit is connected to the drive signal output end of the high voltage drive circuit of the HVIC chip, and the drive signal input end of the three-phase lower bridge arm circuit is connected to the drive signal output end of the low voltage drive circuit of the LVIC chip. This connection mode enables the entire power module to efficiently control the transmission and conversion of power. In addition, the HVIC chip itself is composed of a lead frame, an HVIC chip body and a conductive element. The HVIC chip body is placed on the lead frame, and the conductive element is placed in the appropriate position of the lead frame. This structural design not only ensures the stability and reliability of the chip, but also facilitates assembly and testing during the production process.

[0031] In summary, the HVIC chip-based intelligent power module proposed in the present invention realizes efficient, stable and easy-to-control power management functions through the optimized combination of components. This module has broad application prospects in the field of power electronics, especially in situations requiring precise control and high-efficiency conversion.

[0032] In some embodiments of the present application, a power access terminal is provided on the lead frame, a power terminal is provided on the HVIC chip body, the input terminal of the conductive element is connected to the power access terminal, and the output terminal of the conductive element is connected to the power terminal of the HVIC chip body.

[0033] In this embodiment, a power access port is provided on the structure of the lead frame. The main function of this power access port is to provide necessary power support for the entire circuit system. At the same time, the core part of the HVIC chip body is also equipped with a special power supply terminal, which is used to receive and process the power signal from the external power supply to ensure that the chip can operate normally. In order to achieve the smooth transmission of the power signal, a key conduction element is introduced in the circuit design. The input end of the conduction element is directly connected to the power access terminal on the lead frame, ensuring that the power signal can smoothly enter the circuit system from the external power supply. Next, the output end of the conduction element is closely connected to the power supply end of the HVIC chip body, so that the stable power signal processed by the conduction element can be smoothly transmitted to the HVIC chip body, providing it with continuous and stable power support. Through this connection method, not only the efficient transmission of the power signal is ensured, but also the stability and reliability of the entire circuit system are improved. This design not only optimizes the circuit layout, but also provides convenience for subsequent circuit debugging and maintenance, ensuring the efficient operation of the entire system.

[0034] In some embodiments of the present application, the conductive element includes an IGBT tube and an FRD tube, the IGBT tube and the FRD tube are connected, the anode of the IGBT tube and the FRD tube is the input end of the conductive element, and the cathode of the IGBT tube and the FRD tube is the output end of the conductive element.

[0035] In this embodiment, the conduction element is composed of an IGBT tube and an FRD tube. Specifically, the IGBT tube and the FRD tube are connected to each other through their corresponding terminals to form a complete conduction path. The specific connection method is as follows: after the IGBT tube and the FRD tube are connected to each other, the anode of the common component is the input end of the conduction element. Similarly, the cathode of the common component after the IGBT tube and the FRD tube are connected is the output end of the conduction element. Through this connection method, the IGBT tube and the FRD tube work together to realize the function of the conduction element.

[0036] It can be seen that by using the combination of IGBT tubes and FRD tubes, the characteristics of fast switching and low conduction loss can be achieved in the conducting element. The IGBT tube is responsible for the switching action, while the FRD tube provides a freewheeling path when the IGBT tube is turned off, thereby reducing switching losses and improving efficiency. At the same time, since the anodes of the IGBT tube and the FRD tube are connected to the input terminal and the cathodes are the output terminals, this structure simplifies the circuit design, makes the circuit layout more compact, and is beneficial to reducing the volume of the overall device. And this design can also improve the reliability of the system because the combination of the IGBT tube and the FRD tube can effectively handle current and voltage fluctuations, reduce the thermal stress of the components, and extend the service life of the components. Due to the collaborative work of the IGBT tube and the FRD tube, the conducting element can provide better protection functions to prevent overcurrent and overvoltage conditions from damaging the circuit, enabling it to be applicable to a variety of different power supplies and load conditions, with good versatility and adaptability.

[0037] In some embodiments of the present application, the HVIC chip includes a first metal layer and a second metal layer, the second metal layer is disposed on the surface of the first metal layer, and a chip bonding area is provided on the second metal layer.

[0038] In this embodiment, the high voltage integrated circuit (HVIC) chip includes two main metal layers. Specifically, the first metal layer is located at the bottom layer, and the second metal layer is formed on the surface of the first metal layer after immersion gold treatment. To ensure the reliability and functionality of the chip, a chip bonding area is provided on the second metal layer. This chip bonding area is a key area for electrical connection during chip manufacturing and packaging processes, and it allows the chip to be effectively connected to other electronic components or circuit boards. Through this dual-metal layer design, the HVIC chip can not only withstand higher voltages, but also provide more stable performance and a longer service life.

[0039] It can be seen that by adopting two main metal layers in the present application, the HVIC chip can withstand higher voltages, thus meeting the requirements of high-voltage applications. The immersion gold treatment of the second metal layer and the setting of the chip bonding area ensure the reliability of electrical connection during chip manufacturing and packaging processes, and thus provide more stable performance. And due to the optimized design of the dual-metal layer structure and the chip bonding area, the durability of the HVIC chip is enhanced, thereby extending its service life. The chip bonding area, as a key area for electrical connection, enables the chip to be effectively connected to other electronic components or circuit boards, improving the integration and performance of the overall circuit.

[0040] In some embodiments of the present application, a bonding pad area is provided on the lead frame, the number of the bonding pad areas matches the number of the chip bonding areas, and the chip bonding areas are connected to the bonding pad areas on the lead frame through wire bonding.

[0041] In this embodiment, bonding pad areas are provided on the lead frame. The number of these bonding pad areas is exactly the same as the number of chip bonding areas, ensuring that each chip bonding area can find a corresponding pad area. Through a precise wire bonding process, the chip bonding area is reliably connected to the corresponding bonding pad area on the lead frame, thereby achieving electrical and mechanical connection between the chip and the frame. This precise matching and connection method ensures the stability of the chip during the packaging process and the high performance of the final product.

[0042] It can be seen that the present application ensures that each chip bonding area can find the corresponding pad area, thereby improving the accuracy of the connection between the chip and the lead frame. And through the precise wire bonding process, the reliable connection between the chip bonding area and the corresponding bonding pad area on the lead frame is achieved, and the stability of the electrical and mechanical connection is enhanced. This precise matching and connection method significantly improves the stability of the chip during the packaging process, thereby ensuring the high performance of the final product.

[0043] In some embodiments of the present application, the HVIC chip body is adhered to the lead frame by silver-containing epoxy resin or tin-lead solder.

[0044] In this embodiment, the HVIC chip body is firmly adhered and fixed to the corresponding position of the lead frame by using silver-containing epoxy resin or tin-lead solder.

[0045] It can be seen that the present application improves the bonding strength between the HVIC chip and the lead frame, ensuring that the chip is not easy to fall off during subsequent packaging and use. Using silver-containing epoxy resin or tin-lead solder as a bonding material can effectively improve the efficiency of heat conduction, help the chip dissipate heat, and extend its service life. By firmly sticking and fixing, the displacement of the chip caused by mechanical stress or temperature changes is reduced, thereby improving the stability and reliability of the entire electronic device. This method simplifies the production process, reduces production costs, and at the same time ensures product quality, with good economic benefits.

[0046] In some embodiments of the present application, the HVIC chip further includes a plastic package, and the plastic package is used to cover the lead frame, the HVIC chip body and the conductive element.

[0047] In this embodiment, the high voltage integrated circuit (HVIC) chip not only includes its core component, i.e., the HVIC chip body, but is also equipped with a plastic package. The main function of this plastic package is to completely cover and protect the entire lead frame, the HVIC chip body, and the conductive element. In this way, the plastic package can effectively prevent the external environment from eroding and damaging the internal structure of the chip, thereby ensuring that the HVIC chip can maintain good performance and stability under various complex conditions. In addition, the plastic package also plays the role of insulation and heat dissipation, further improving the reliability and service life of the chip.

[0048] It can be seen that the plastic package of the present application completely covers and protects the entire lead frame, the HVIC chip body and the conductive element, effectively preventing the external environment from eroding and damaging the internal structure of the chip. And due to the protective effect of the plastic package, the HVIC chip can maintain good performance and stability under various complex conditions; the plastic package has an insulating effect, which can avoid current leakage and ensure the safe operation of the chip; the plastic package also plays a role in heat dissipation, which helps to dissipate the heat of the chip, thereby improving the reliability and service life of the chip.

[0049] In some embodiments of the present application, the HVIC chip further includes a heat sink, and the heat sink is disposed on the plastic package body.

[0050] In this embodiment, the structure of the HVIC chip also includes a heat sink. The heat sink is mounted on the plastic package of the chip. The main function of the heat sink is to help the chip dissipate excess heat during operation, thereby keeping the temperature of the chip within a safe range and ensuring its normal operation. In this way, the heat sink effectively improves the stability and service life of the chip.

[0051] In some embodiments of the present application, the HVIC chip also includes a working protection circuit and a logic circuit, the working protection circuit includes an over-temperature protection circuit, an over-current protection circuit, an under-voltage protection circuit and an over-voltage protection circuit, and the over-temperature protection circuit, the over-current protection circuit, the under-voltage protection circuit and the over-voltage protection circuit are all connected to the logic circuit.

[0052] In this embodiment, in addition to the core functional circuit, a working protection circuit and a logic circuit are specially designed in the HVIC chip. The main function of the working protection circuit is to ensure that the chip can operate safely under various abnormal conditions and avoid damage caused by faults. Specifically, the working protection circuit includes an over-temperature protection circuit, an over-current protection circuit, an under-voltage protection circuit and an over-voltage protection circuit. The function of the over-temperature protection circuit is to monitor the temperature of the chip. Once the temperature is detected to exceed the preset safety threshold, the protection mechanism will be immediately activated to prevent damage to the chip caused by overheating. The over-current protection circuit is responsible for monitoring the current flowing through the chip. If the current exceeds the normal working range, the circuit will quickly cut off the current to avoid damage to the chip due to excessive current. The under-voltage protection circuit ensures that the chip can respond in time when the supply voltage is lower than the normal working range to prevent unstable operation or damage caused by insufficient voltage. Finally, the over-voltage protection circuit takes quick measures when the supply voltage is detected to exceed the safety range to prevent damage to the chip due to excessive voltage. All these protection circuits are closely connected with the logic circuit, which is responsible for receiving signals from each protection circuit and making corresponding processing decisions based on these signals. For example, when the over-temperature protection circuit sounds an alarm, the logic circuit will immediately start cooling measures or shut down some functions of the chip to ensure that the chip temperature returns to a safe range. Similarly, when the over-current, under-voltage or over-voltage protection circuit sounds an alarm, the logic circuit will also take corresponding protection measures to ensure that the chip can operate safely under various abnormal conditions. Through this multi-level and all-round protection mechanism, the HVIC chip can maintain stable operation in various complex working environments, greatly improving its reliability and service life.

[0053] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that they can still modify or replace the technical solution of the present invention with equivalents, and these modifications or equivalent replacements cannot cause the modified technical solution to deviate from the spirit and scope of the technical solution of the present invention.

[0054] The system provided in the above embodiment is only illustrated by the division of the above functional modules. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the modules or steps in the embodiments of the present invention can be decomposed or combined. For example, the modules in the above embodiment can be combined into one module, or further divided into multiple sub-modules to complete all or part of the functions described above. The names of the modules and steps involved in the embodiments of the present invention are only for distinguishing the modules or steps, and are not regarded as improper limitations of the present invention.

[0055] Those skilled in the art should be able to appreciate that the modules and method steps of each example described in conjunction with the embodiments disclosed herein can be implemented with electronic hardware, computer software or a combination of the two, and the programs corresponding to the software modules and method steps can be placed in random access memory (RAM), internal memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disks, removable disks, CD-ROMs, or any other form of storage medium known in the technical field. In order to clearly illustrate the interchangeability of electronic hardware and software, the composition and steps of each example have been generally described in the above description according to the function. Whether these functions are performed in electronic hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present invention.

Claims

1. An intelligent power module based on HVIC chip, characterized in that: include: LVIC chip; The HVIC chip includes an interlock and dead zone circuit, wherein the interlock and dead zone circuit is connected to a high voltage drive circuit of the HVIC chip and a low voltage drive circuit of the LVIC chip; A power component, the power component comprising a three-phase upper bridge arm circuit and a three-phase lower bridge arm circuit, the drive signal input end of the three-phase upper bridge arm circuit is connected to the drive signal output end of the high-voltage drive circuit of the HVIC chip, and the drive signal input end of the three-phase lower bridge arm circuit is connected to the drive signal output end of the low-voltage drive circuit of the LVIC chip; The HVIC chip comprises a lead frame, an HVIC chip body and a conducting element. The HVIC chip body is arranged on the lead frame, and the conducting element is arranged on the lead frame.

2. The intelligent power module based on the HVIC chip according to claim 1, characterized in that: The lead frame is provided with a power supply access terminal, the HVIC chip body is provided with a power supply terminal, the input terminal of the conductive element is connected to the power supply access terminal, and the output terminal of the conductive element is connected to the power supply terminal of the HVIC chip body.

3. The intelligent power module based on the HVIC chip according to claim 2, characterized in that: The conduction element comprises an IGBT tube and an FRD tube, the IGBT tube and the FRD tube are connected, the anodes of the IGBT tube and the FRD tube are the input ends of the conduction element, and the cathodes of the IGBT tube and the FRD tube are the output ends of the conduction element.

4. The intelligent power module based on the HVIC chip according to claim 3, characterized in that: The HVIC chip comprises a first metal layer and a second metal layer, wherein the second metal layer is arranged on the surface of the first metal layer, and a chip bonding area is arranged on the second metal layer.

5. The intelligent power module based on the HVIC chip according to claim 4, characterized in that: The lead frame is provided with bonding pad areas, the number of which matches the number of the chip bonding areas, and the chip bonding areas are connected to the bonding pad areas on the lead frame through wire bonding.

6. The intelligent power module based on the HVIC chip according to claim 5, characterized in that: The HVIC chip body is adhered to the lead frame by silver-containing epoxy resin or tin-lead solder.

7. The intelligent power module based on the HVIC chip according to claim 6, characterized in that: The HVIC chip further comprises a plastic package, which is used to cover the lead frame, the HVIC chip body and the conducting element.

8. The HVIC chip-based intelligent power module according to claim 7, characterized in that: The HVIC chip further comprises a heat sink, and the heat sink is arranged on the plastic package body.

9. The HVIC chip-based intelligent power module according to claim 8, characterized in that: The HVIC chip also includes a working protection circuit and a logic circuit. The working protection circuit includes an over-temperature protection circuit, an over-current protection circuit, an under-voltage protection circuit and an over-voltage protection circuit. The over-temperature protection circuit, the over-current protection circuit, the under-voltage protection circuit and the over-voltage protection circuit are all connected to the logic circuit.

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