Porous metal-based electronic component packaging and connecting structure in hearing aid

Abstract

The invention relates to the technical field of hearing aid equipment, in particular to a porous metal-based electronic component packaging and connecting structure in a hearing aid, which comprises a shell for packaging an electronic component, a powder composite layer is arranged on the outer surface of the shell, gradient holes are formed in the powder composite layer through laser layering melting, and the hole coverage rates of the gradient holes in different layers are different; a plurality of reticular micro-channels are formed between every two layers of pores of the powder composite layer through laser etching, and the micro-channels are filled with paraffin or graphene composite phase change materials. According to the invention, through the coupling design of the gradient pore structure and the porous metal material, sound-heat-electromagnetic multi-physical field cooperative regulation and control are completed, and the integration of sound absorption, noise reduction, heat dissipation and electromagnetic shielding is achieved; through laser etching of the cross-layer micro-channel and filling of the phase change material, precise control of directional heat dissipation and sound wave conduction is completed, and temperature rise suppression of an electronic element and improvement of sound signal fidelity are achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of hearing aid equipment, and in particular to a porous metal-based packaging connection structure for electronic components in hearing aids. Background Art

[0002] Application No. CN202122534777.4 discloses a new type of detachable RIC hearing aid, including a hearing aid component and a receiver component, and is connected by plugging and unplugging a male plug and a female plug, thereby improving the efficiency of maintenance or replacement while reducing the maintenance cost; the male plug includes a male plug base, on which a plurality of telescopic contacts are provided, and the female plug includes a female plug base, on which a connecting groove for the telescopic contacts to extend into and a plurality of conductive contacts provided in the connecting groove are provided. When the female plug is inserted into the hearing aid port, the telescopic contacts extend into the connecting groove, contact and compress the conductive contacts, and maintain a compressed contact state, thereby ensuring good touch transmission current. Therefore, the precision requirements for the conductive contacts in the female plug are not high, the mold price is cheaper, the manufacturing cost is lower, and the production process is simpler.

[0003] Traditional hearing aid electronic component packaging structures mostly use dense metal or polymer materials, which have significant defects: metal shells such as stainless steel are heavy and have serious sound wave reflection, resulting in a reduced signal-to-noise ratio; although polymer materials are lightweight, they have poor heat dissipation and lack electromagnetic shielding capabilities. Existing technologies attempt to optimize performance by adding heat dissipation holes or sound-absorbing layers, but a single structural design is difficult to take into account multiple requirements such as heat dissipation, noise reduction, electromagnetic compatibility, and environmental protection. Summary of the invention

[0004] In order to overcome the defects in the prior art, the purpose of the present invention is to provide an electronic component packaging and connection structure in a hearing aid based on porous metal to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides an electronic component packaging and connection structure in a hearing aid based on porous metal, comprising a shell for packaging electronic components, wherein a receiving cavity matching the shape of the electronic components is provided inside the shell; a powder composite layer is provided on the outer surface of the shell, and gradient holes are formed by laser layering and melting of the powder composite layer, and the hole coverage of the gradient holes in different layers is different, and the hole coverage of different layers extending outward from the shell surface shows a gradually increasing trend, and the hole coverage is 30-70% of the surface area of ​​the shell, and the pore diameters of the holes of different depths are 10-200 μm;

[0006] A plurality of mesh-like microchannels are formed between the pores of each layer of the powder composite layer by laser etching, and the microchannels are filled with paraffin or graphene composite phase change material; a piezoelectric micropump for absorbing heat from electronic components is arranged in the microchannel located outside the powder composite layer, and the piezoelectric micropump includes a piezoelectric ceramic driver, a serpentine microchannel and an interdigitated gold thin film electrode;

[0007] The outer surface of the powder composite layer is provided with an electromagnetic shielding layer and an anti-fouling layer in sequence.

[0008] As a further improvement of the present technical solution, the powder composite layer is composed of an outer layer, a middle layer and an inner layer in sequence, wherein the pore coverage of the outer layer is 50-70%, and the pore diameter is 50-200 μm; the pore coverage of the middle layer is 30-50%, and the pore diameter is 10-50 μm; the pore coverage of the inner layer is <30%, and the pore diameter is <10 μm.

[0009] As a further improvement of the present technical solution, the microchannels located in the outer layer are 80-200μm wide and are directly connected to the external environment for rapid heat dissipation; the microchannels located in the middle layer are capillary microchannels with a width of 10-50μm, which utilize the capillary effect of porous metal to enhance the cyclic penetration of phase change materials; the microchannels located in the inner layer are dedicated channels for sound wave conduction, with a width of <10μm.

[0010] As a further improvement of the present technical solution, an elastic conductive connector is provided on the inner wall of the shell, which includes a porous metal silver-plated hemisphere and a flexible conductive adhesive layer. The porous metal silver-plated hemisphere is convex and arranged in an array, and the flexible conductive adhesive layer covers the surface of the porous metal silver-plated hemisphere.

[0011] As a further improvement of the technical solution, the electromagnetic shielding layer is composited by a chemical nickel plating layer and a graphene / ferrite coating; the chemical nickel plating layer is 2-5 μm thick, and the graphene / ferrite coating is 10-20 μm thick.

[0012] As a further improvement of the technical solution, the anti-fouling layer is composited by titanium dioxide nanotubes as a bottom layer, polydopamine / fluorosilane as a middle layer and graphene quantum dots as a top layer.

[0013] As a further improvement of the technical solution, an adaptive interface layer is provided between the shell and the electronic component, which is composited by liquid metal droplets, pyrolytic carbon-coated boron nitride nanosheets and a polyurethane elastic matrix.

[0014] As a further improvement of the technical solution, a porous metal fiber felt is provided between the shell and the PCB board of the electronic component. The porous metal fiber felt has a porosity of >90%, a fiber diameter of 5-20 μm, and a Z-shaped three-dimensional arrangement structure.

[0015] As a further improvement of the technical solution, the shell is provided with an acoustic tuning hole, the aperture of the acoustic tuning hole is 0.5-1mm, and the inner wall of the hole is provided with a spiral groove with a groove depth of 50-100μm, and the inner side surface of the acoustic tuning hole is covered with a porous metal film.

[0016] As a further improvement of the technical solution, the upper end of the shell is connected to the earplug wire end through a magnetic interlocking structure, and the magnetic interlocking structure is composed of a NdFeB permanent magnet array distribution and magnetic attraction of a soft magnetic alloy sheet.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. The packaging and connection structure of electronic components in hearing aids based on porous metals completes the coordinated regulation of acoustic-thermal-electromagnetic multi-physical fields through the coupling design of gradient pore structure and porous metal materials, achieves the integrated integration of sound absorption and noise reduction, heat dissipation and electromagnetic shielding, and breaks through the technical bottleneck of the single function of traditional packaging materials.

[0019] 2. The porous metal-based electronic component packaging and connection structure in the hearing aid achieves precise control of directional heat dissipation and sound wave conduction through laser etching of cross-layer microchannels and filling with phase change materials, thereby suppressing the temperature rise of electronic components and improving the fidelity of sound signals, solving the contradiction between high-power chip heat dissipation and voice signal distortion.

[0020] 3. The porous metal-based packaging and connection structure of electronic components in hearing aids integrates the anti-fouling layer and the electromagnetic shielding inner layer to achieve graded optimization of surface protection and internal functions, achieve IP68 dust and water resistance and improve the antibacterial rate, significantly improving the adaptability of hearing aids in complex ear canal environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings described herein are only for explanation purposes and are not intended to limit the scope of the present invention in any way. In addition, the shapes and proportional dimensions of the various components in the drawings are only schematic, used to help understand the present invention, and are not specifically limited to the shapes and proportional dimensions of the various components of the present invention. Those skilled in the art, under the guidance of the present invention, select various possible shapes and proportional dimensions to implement the present invention according to specific circumstances.

[0022] Figure 1 It is a structural schematic diagram of a hearing aid housing of the present invention;

[0023] Figure 2 This is one of the schematic diagrams of the structure of the outer layer of the local surface of the shell of the present invention magnified under a microscope;

[0024] Figure 3 The second schematic diagram of the structure of the outer layer of the local surface of the shell of the present invention is magnified under a microscope;

[0025] Figure 4 The third schematic diagram of the structure of the outer layer of the local surface of the shell of the present invention is magnified under a microscope;

[0026] Figure 5 It is a schematic cross-sectional view of the shell of the present invention;

[0027] The meaning of each number in the figure is:

[0028] 1. Shell; 10. Acoustic tuning hole; 11. Outer layer; 12. Middle layer; 13. Inner layer; 2. Microchannel; 3. Electromagnetic shielding layer; 4. Anti-fouling layer. DETAILED DESCRIPTION

[0029] The details of the present invention can be more clearly understood by combining the accompanying drawings with the description of the specific embodiments of the present invention. However, the specific embodiments of the present invention described herein are only used for the purpose of explaining the present invention and cannot be understood as limiting the present invention in any way. Under the guidance of the present invention, the technical personnel's conception is based on any possible variation of the present invention, which should be regarded as belonging to the scope of the present invention. The terms "installation" and "connection" should be understood in a broad sense, which means direct connection and indirect connection through an intermediate medium.

[0030] The terms "central axis", "vertical", "horizontal", "front", "back", "up", "down", "left", "right", "top", "bottom", "inside", "outside" and the like used herein to indicate positions or positional relationships are based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the equipment or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, in the description of the present invention, the meaning of "several" is two or more, unless otherwise clearly and specifically defined.

[0031] See also Figure 1-Figure 5 As shown, the present invention provides an electronic component packaging and connection structure in a hearing aid based on porous metal, comprising a shell 1 for packaging electronic components, wherein the shell 1 is provided with a receiving cavity whose shape matches that of the electronic components; a powder composite layer is provided on the outer surface of the shell 1, and gradient holes are formed by laser layering and melting of the powder composite layer, and the hole coverage of the gradient holes in different layers is different, and the hole coverage of different layers extending outward from the surface of the shell 1 shows a gradually increasing trend, and the hole coverage is 30-70% of the surface area of ​​the shell 1, and the pore diameter of the holes of different depths is 10-200μm; the formed porous metal gradient structure realizes the functional integration of sound absorption and noise reduction, heat dissipation and electromagnetic shielding.

[0032] Furthermore, the powder composite layer is composed of an outer layer 11, an intermediate layer 12 and an inner layer 13 in sequence, wherein the pore coverage of the outer layer 11 is 50-70% and the pore size is 50-200 μm; the pore coverage of the intermediate layer 12 is 30-50% and the pore size is 10-50 μm; the pore coverage of the inner layer 13 is <30% and the pore size is <10 μm; thereby forming a functional zoning optimization, the outer layer 11 is Ti6Al4V spherical powder with a particle size of 50-200 μm, The intermediate layer 12 is made of the same base material powder with a particle size of 20-50 μm and the pore-forming agent with a particle size of 50-100 μm, mixed into powder at a ratio of 7:3; the inner layer 13 is composed of pure Ti6Al4V fine powder with a particle size of 10-30 μm and 0.5 wt% graphene reinforcement phase added; thereby improving the sound absorption frequency band coverage of the outer layer 11, the electromagnetic shielding effectiveness of the inner layer 13 and the heat dissipation efficiency of the intermediate layer 12.

[0033] Specifically, the powder composite layer is manufactured layer by layer using laser melting (SLM):

[0034] Tiers Laser power Scan speed Layer thickness Porosity Control Strategies Outer Layer 280W 800mm / s 50μm High power melting through pore forming agent to form large pores Middle Layer 200W 1200mm / s 30μm Partial melting retains pore-forming agent voids Inner Layer 150W 1500mm / s 20μm Melt-retained pore-forming agent voids

[0035] Laser pre-etching:

[0036] Use picosecond laser with wavelength of 532nm and pulse width of 10ps;

[0037] The etching path is programmed hierarchically based on the 3D model:

[0038] Outer layer 11: straight thick channel, width 200 μm, depth 500 μm;

[0039] Middle layer 12: dendritic fractal channel, branching angle 60°, width 50 μm;

[0040] Inner layer 13: spiral acoustic channel, pitch 100 μm, width 10 μm;

[0041] Selective chemical etching:

[0042] Corrosive solution: HF (5%) + HNO3 (10%) mixed solution, temperature 40°C;

[0043] Corrosion time gradient control:

[0044] Tiers Corrosion time Channel expansion rate Outer Layer 30min 120％ Middle Layer 15min 50％ Inner Layer 5min 10％

[0045] Process advantages:

[0046] The positioning accuracy of laser etching reaches ±2μm, and the roughness of the channel wall Ra<1μm; chemical etching eliminates the laser heat-affected zone and improves the quality of the inner wall of microchannel 2.

[0047] Specifically, laser etching is used to form a network of microchannels 2 between the pores of each layer of the powder composite layer. The microchannels 2 are filled with paraffin or graphene composite phase change materials. Paraffin is a low-cost phase change material, and graphene composite materials have high thermal conductivity and electrical conductivity, which are used to manage the temperature of the shell 1. Ultrafast laser etching is used for microchannel 2 processing: pulse width <1ps, avoiding heat-affected zone, and channel depth consistency >95%; vacuum infiltration is used to fill the phase change material to ensure that the material completely fills the pores and microchannels 2.

[0048] Furthermore, a piezoelectric micropump for absorbing heat from electronic components is provided in the microchannel 2 located outside the powder composite layer, and the piezoelectric micropump includes a piezoelectric ceramic driver, a serpentine microchannel and an interdigitated gold thin film electrode; the piezoelectric ceramic driver is PZT-5H, with dimensions of 1×1×0.2mm; deformation is generated through voltage excitation to drive the phase change material fluid to flow, that is, a piezoelectric effect occurs; the curvature radius of the serpentine microchannel is 0.1-0.3mm, which is used to enhance fluid disturbance and improve heat dissipation efficiency; the small curvature radius reduces flow resistance and is suitable for high-frequency drive; the line width of the interdigitated gold thin film electrode is 10μm, which is used to accurately control the local electric field distribution of the piezoelectric ceramic and achieve high-frequency, low-power drive.

[0049] Furthermore, the microchannel 2 located in the outer layer 11 has a channel width of 80-200 μm, which is directly connected to the external environment for rapid heat dissipation; the microchannel 2 located in the middle layer 12 is a capillary microchannel with a width of 10-50 μm, which uses the capillary effect of porous metal to enhance the cyclic penetration of the phase change material 5; the microchannel 2 located in the inner layer 13 is a dedicated channel for sound wave conduction, and its width is <10 μm.

[0050] The mechanism for dynamically adjusting the fluid flow rate in the microchannel 2 is to control the deformation of the piezoelectric ceramic by adjusting the voltage parameters applied to the PZT-5H, such as frequency and amplitude, thereby changing the driving force of the micropump.

[0051] Among them, the key control parameters are:

[0052] Voltage frequency: high frequency (>100Hz) → fast vibration → increased flow rate;

[0053] Voltage amplitude: high voltage (such as 50V) → deformation increases → single drive flow increases.

[0054] Heat dissipation capacity adjustment logic:

[0055] Low load: low frequency / low pressure drive → reduced flow rate → energy saving mode;

[0056] High load: high frequency / high pressure drive → increased flow rate → improved heat dissipation efficiency.

[0057] In addition, the serpentine microchannel is designed in coordination with the electrode, and the curvature radius of the serpentine channel is 0.1-0.3mm → reducing turbulent loss and adapting to the fluid inertia under high-frequency vibration; the path is extended → increasing the heat exchange time between the fluid and the shell 1.

[0058] Furthermore, the advantages of interdigital electrodes are: 10μm line width → high-precision electric field distribution → enhanced controllability of local deformation of piezoelectric ceramics to reduce driving energy consumption.

[0059] Furthermore, the inner wall of the housing 1 is provided with an elastic conductive connector, which includes a porous metal silver-plated hemisphere and a flexible conductive adhesive layer. The porous metal silver-plated hemisphere is convex and arranged in an array, and the flexible conductive adhesive layer covers the surface of the porous metal silver-plated hemisphere. The contact resistance is <0.1Ω, the assembly tolerance is compensated by ±0.05mm, and the contact stability is improved under a vibration environment.

[0060] Specifically, the outer surface of the powder composite layer is provided with an electromagnetic shielding layer 3 and an anti-fouling layer 4 in sequence; the electromagnetic shielding layer 3 is composited by a chemical nickel plating layer and a graphene / ferrite coating; the chemical nickel plating layer is 2-5 μm thick, and the graphene / ferrite coating is 10-20 μm thick; the anti-fouling layer 4 is composited by titanium dioxide nanotubes as a bottom layer, polydopamine / fluorosilane as a middle layer and graphene quantum dots as a top layer.

[0061] Among them, chemical nickel plating:

[0062] Plating solution formula: NiSO4·6H2O 30g / L+NaH2PO2·H2O 25g / L+complexing agent;

[0063] Plating conditions: pH = 4.5, temperature 85 ° C, time 60 min; forming a 2-5 μm uniform coating, coverage > 99%;

[0064] Graphene / ferrite composite spraying:

[0065] Materials: graphene nanosheets, 3-5 layers + MnZn ferrite, particle size 200nm;

[0066] Process: electrostatic spraying, voltage 50kV, flow rate 0.5mL / min;

[0067] The coating thickness is 10-20 μm and the porosity is <5%.

[0068] Among them, the anti-fouling layer adopts atomic layer deposition (ALD) process:

[0069] TiO2 nanotube layer: TiCl4+H2O, deposition temperature 250°C; cycle number 500 times, tube diameter 50-100nm;

[0070] The alternating layers of polydopamine / fluorosilane were deposited by immersion method: dopamine solution, 2 mg / mL, pH=8.5 was alternately deposited with fluorosilane vapor for 3 times, and the monolayer thickness was about 20 nm.

[0071] Furthermore, an adaptive interface layer is provided between the housing 1 and the electronic component, which is composed of GaInSn liquid metal droplets, pyrolytic carbon-coated boron nitride nanosheets and a polyurethane elastic matrix, and the interface thermal resistance is 0.05K·mm 2 / W, improving self-repair efficiency and thermal cycle life.

[0072] Furthermore, a porous metal fiber felt is provided between the shell 1 and the PCB board of the electronic component. The porous metal fiber felt has a porosity of >90%, a fiber diameter of 5-20 μm, and a Z-shaped three-dimensional arrangement structure; it is used to improve the shock absorption efficiency, axial stiffness and vibration energy absorption rate.

[0073] Furthermore, the shell 1 is provided with an acoustic tuning hole 10, the aperture of the acoustic tuning hole 10 is 0.5-1mm, and the inner wall of the hole is provided with a spiral groove with a groove depth of 50-100μm, and the inner side surface of the acoustic tuning hole 10 is covered with a porous metal film; it is used to improve the frequency response flatness, reduce high-frequency noise, and improve the efficiency of sound wave vortex diffusion.

[0074] Furthermore, the upper end of the shell 1 is connected to the end of the earplug wire through a magnetic interlocking structure, and the magnetic interlocking structure is composed of a NdFeB permanent magnet array distribution and a soft magnetic alloy sheet magnetic attraction. The NdFeB permanent magnet is distributed in the end face of the earplug wire, and the soft magnetic alloy sheet is embedded in the upper end face of the shell 1, which is convenient for disassembly and cleaning of the earplug wire.

[0075] It should be noted that the above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A porous metal-based electronic component packaging and connection structure in a hearing aid, comprising a housing (1) for packaging the electronic component, wherein a receiving cavity matching the shape of the electronic component is provided inside the housing (1); characterized in that: The outer surface of the shell (1) is provided with a powder composite layer, and the powder composite layer is melted by laser layering to form gradient holes, and the hole coverage of the gradient holes in different layers is different, and the hole coverage of different layers extending outward from the surface of the shell (1) shows a gradually increasing trend, and the hole coverage is 30-70% of the surface area of ​​the shell (1), and the pore diameters of the holes of different depths are 10-200 μm; A plurality of mesh-shaped microchannels (2) are formed between the pores of each layer of the powder composite layer by laser etching, and the microchannels (2) are filled with paraffin or graphene composite phase change material; a piezoelectric micropump for absorbing heat from electronic components is arranged in the microchannel (2) located outside the powder composite layer, and the piezoelectric micropump comprises a piezoelectric ceramic driver, a serpentine microchannel and an interdigitated gold thin film electrode; An electromagnetic shielding layer (3) and an anti-fouling layer (4) are sequentially arranged on the outer surface of the powder composite layer.

2. The porous metal-based electronic component packaging and connection structure in a hearing aid according to claim 1, characterized in that: The powder composite layer is composed of an outer layer (11), an intermediate layer (12) and an inner layer (13) in sequence, wherein the pore coverage of the outer layer (11) is 50-70% and the pore diameter is 50-200 μm; the pore coverage of the intermediate layer (12) is 30-50% and the pore diameter is 10-50 μm; the pore coverage of the inner layer (13) is less than 30% and the pore diameter is less than 10 μm.

3. The porous metal-based electronic component packaging and connection structure in a hearing aid according to claim 2, characterized in that: The microchannel (2) located in the outer layer (11) has a channel width of 80-200 μm, is directly connected to the external environment, and is used to quickly conduct heat; the microchannel (2) located in the middle layer (12) is a capillary microchannel with a width of 10-50 μm, which uses the capillary effect of porous metal to enhance the circulation penetration of the phase change material (5); the microchannel (2) located in the inner layer (13) is a dedicated channel for sound wave conduction, and its width is less than 10 μm.

4. The porous metal-based electronic component packaging and connection structure in a hearing aid according to claim 3, characterized in that: The inner wall of the shell (1) is provided with an elastic conductive connecting piece, which comprises a porous metal silver-plated hemisphere and a flexible conductive adhesive layer. The porous metal silver-plated hemisphere is convex and arranged in an array, and the flexible conductive adhesive layer covers the surface of the porous metal silver-plated hemisphere.

5. The porous metal-based electronic component packaging and connection structure in a hearing aid according to claim 4, characterized in that: The electromagnetic shielding layer (3) is composed of a composite of a chemically plated nickel layer and a graphene / ferrite coating; the chemically plated nickel layer has a thickness of 2-5 μm, and the graphene / ferrite coating has a thickness of 10-20 μm.

6. The porous metal-based electronic component packaging and connection structure in a hearing aid according to claim 5, characterized in that: The anti-fouling layer (4) is composited with titanium dioxide nanotubes as a bottom layer, polydopamine / fluorosilane as a middle layer and graphene quantum dots as a top layer.

7. The porous metal-based electronic component packaging and connection structure in a hearing aid according to claim 6, characterized in that: An adaptive interface layer is provided between the housing (1) and the electronic component, and is composited from liquid metal droplets, pyrolytic carbon-coated boron nitride nanosheets, and a polyurethane elastic matrix.

8. The porous metal-based electronic component packaging and connection structure in a hearing aid according to claim 7, characterized in that: A porous metal fiber felt is provided between the housing (1) and the PCB board of the electronic component. The porous metal fiber felt has a porosity of >90%, a fiber diameter of 5-20 μm, and a Z-shaped three-dimensional arrangement structure.

9. The porous metal-based electronic component packaging and connection structure in a hearing aid according to claim 8, characterized in that: The shell (1) is provided with an acoustic tuning hole (10), the aperture of the acoustic tuning hole (10) is 0.5-1 mm, the inner wall of the hole is provided with a spiral groove with a groove depth of 50-100 μm, and the inner side surface of the acoustic tuning hole (10) is covered with a porous metal film.

10. The porous metal-based electronic component packaging and connection structure in a hearing aid according to claim 9, characterized in that: The upper end of the shell (1) is connected to the earplug wire end via a magnetic interlocking structure, and the magnetic interlocking structure is composed of a NdFeB permanent magnet array distribution and a soft magnetic alloy sheet magnetic attraction.

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