Circuit board processing system equipped with elastic buffer pressing structure
By introducing the function of automatic laying and leveling of release paper in the circuit board processing system, the problems of low efficiency and prone to wrinkles of manual covering and removal of release paper are solved, and the pressing efficiency and quality of flexible circuit boards are improved.
Patent Information
- Application Number
- CN202510513160.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-23
- Publication Date
- 2025-05-23
- Estimated Expiration
- 2045-04-23
AI Technical Summary
The existing flexible circuit boards need to manually cover and remove the release paper before pressing, which is inefficient, and release paper wrinkles are prone to occur during the transfer process, affecting the quality of the pressing.
A circuit board processing system equipped with an elastic buffered press-fit structure is designed, including a paper covering unit and a leveling unit, which can automatically lay and level the release paper on the press-fit board, avoid manual intervention and reduce release paper wrinkles.
It improves the efficiency and quality of the compressed board of flexible circuit board, reduces the time and errors of manual operation, and ensures the flatness of the release paper and the stability of the compressed board.
Smart Images

Figure CN120035047A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of circuit board processing, in particular to a circuit board processing system equipped with an elastic buffer pressing structure. Background Art
[0002] Flexible circuit board (FPC for short) is a highly reliable and extremely flexible printed circuit board made of polyimide or polyester film as the substrate. The lamination of flexible circuit board (FPC) is a key process in its manufacturing process, which directly affects the reliability, interlayer bonding strength and electrical performance of the circuit board. Flexible circuit boards are generally laminated using a laminating machine. Before laminating, it is necessary to cover the upper and lower sides of the flexible circuit board with release paper, and then place the flexible circuit board covered with release paper into the laminating machine for laminating. The main purpose of covering with release paper is to prevent material adhesion and facilitate the removal of the laminated flexible circuit board from the laminating plate.
[0003] Before lamination, the existing flexible circuit board is generally covered with release paper on the upper and lower surfaces of the flexible circuit board manually, and then the flexible circuit board covered with release paper is transferred to the laminating plate in the laminating machine for lamination. After lamination, the laminated flexible circuit board needs to be removed from the laminating plate manually, and then the release paper on the upper and lower surfaces of the flexible circuit board is removed, and then the subsequent lamination of the flexible circuit board is repeated. The above lamination steps also have the following shortcomings: 1. The efficiency of manually covering and removing the release paper on the flexible circuit board is relatively low, and it is necessary to wait until the laminating plate is fully opened before the flexible circuit board can be taken out and the release paper on the surface of the flexible circuit board can be removed. The efficiency of covering and removing the release paper on the flexible circuit board needs to be further improved; 2. In the process of placing the flexible circuit board covered with release paper on the laminating plate, since the texture of the flexible circuit board and the release paper are relatively soft, the release paper is easy to wrinkle during the transfer process. During the lamination process, the wrinkled release paper will affect the surface flatness of the flexible circuit board during lamination, thereby affecting the quality of the lamination of the flexible circuit board. Summary of the invention
[0004] In order to solve the above problems, the present invention provides a circuit board processing system equipped with an elastic buffering pressing structure, including a casing and two groups of pressing plates installed inside the casing and symmetrically distributed on the left and right, a number of pressing plates in the same group are equidistantly distributed up and down, silicone pads are fixedly installed on the opposite sides of two adjacent pressing plates, an electric push rod is fixedly installed inside the casing for pushing the lowermost pressing plate to move up and down, an elastic buffering structure located on the top of the uppermost pressing plate is installed inside the casing, a paper covering unit for laying release paper is installed on the pressing plate, and a leveling unit for leveling the release paper is also installed on the side of the pressing plate provided with the silicone pad.
[0005] The paper covering unit includes a mounting frame fixedly mounted on the left and right sides of the pressing plate, a rotating shaft is rotatably mounted on the mounting frame, a winding roller and an unwinding roller are respectively connected to the left and right rotating shafts through splines, a driving component for driving the winding roller to rotate unidirectionally is mounted on the rotating shaft corresponding to the winding roller, and a positioning component for positioning the unwinding roller is mounted on the rotating shaft corresponding to the unwinding roller.
[0006] The flattening unit includes a flattening rod 1 which is movably arranged on the pressing plate left and right and symmetrically distributed left and right, and a flattening rod 2 which is movably arranged on the pressing plate front and back and symmetrically distributed front and back. A moving component is installed on the pressing plate to drive the corresponding flattening rod 1 and flattening rod 2 to move left and right and front and back respectively and to flatten the release paper.
[0007] In one possible implementation, a plurality of support frames distributed at the four corners of the same group of pressing plates are fixedly mounted on the inner wall of the casing, and a plurality of guide grooves which are equidistantly distributed front to back and increase in height in equal amounts are provided on one side of the support frame close to the pressing plate. Except for the topmost pressing plate, the other pressing plates distributed from top to bottom in the same group correspond one-to-one to the guide grooves distributed from front to back, and the pressing plates are slidably connected to the corresponding guide grooves up and down.
[0008] In one possible implementation, the elastic buffer structure includes an elastic telescopic rod fixedly mounted on the inner top wall of the casing for elastically buffering the pressing plate, the bottom of the telescopic section of the elastic telescopic rod is fixedly connected to the top of the uppermost pressing plate, and a top block located on the top of the uppermost pressing plate is also fixedly mounted on the inner top wall of the casing.
[0009] In one possible implementation, the driving assembly includes a driven gear rotatably mounted on a rotating shaft, a ratchet pawl structure is installed between the driven gear and the rotating shaft to limit the driven gear from rotating in one direction, a driving rack is meshed on one side of the driven gear close to the corresponding pressing plate, and the end of the driving rack away from the driven gear is fixedly connected to the adjacent pressing plate.
[0010] In one possible implementation, the positioning assembly includes a fixed plate fixedly mounted on a rotating shaft, a side of the fixed plate away from the corresponding unwinding roller is provided with a plurality of circumferentially evenly distributed positioning grooves, a mounting block rotatably mounted on the rotating shaft and located between the fixed plate and the corresponding mounting frame, the mounting block is fixedly connected to the corresponding mounting frame by bolts, and positioning beads symmetrically distributed up and down are slidably mounted on the side of the mounting block opposite to the fixed plate, the positioning beads cooperate with the positioning grooves, and a return spring is fixedly connected between the positioning beads and the inner wall of the mounting block.
[0011] In one possible implementation, the paper covering unit also includes guide rollers symmetrically distributed on the left and right sides of the silicone pad, and the guide rollers are rotatably mounted on the corresponding lamination plates through roller frames. The release paper unwound from the unwinding roller is guided by the guide rollers and then wound onto the corresponding unwinding roller.
[0012] In one possible implementation, the moving assembly includes a movable seat slidably installed on the pressing plate and symmetrically distributed front and back about the corresponding leveling rod one, a return spring two is fixedly connected between the side of the movable seat away from the leveling rod one and the inner wall of the pressing plate, a rotating gear one and a rotating gear two are rotatably installed on the side of the movable seat close to the corresponding leveling rod one, the rotating gear one and the corresponding rotating gear two are meshed with each other, and the rotating gear one and the rotating gear two are respectively fixedly connected with a rotating rod one and a rotating rod two on the sides close to the center of the silicone pad, the rotating rod one end away from the rotating gear one is hinged with a movable block, the movable block is slidably connected to the leveling rod one back and forth, a slider two is rotatably installed on the top of the end of the rotating rod two away from the rotating gear two, the slider two is slidably connected to the leveling rod two left and right, and a rotating component that drives the rotating gear one to rotate is also installed on the movable seat.
[0013] In one possible implementation, the rotating component includes a hollow prism fixedly mounted on a movable seat near a side of a corresponding leveling rod, the hollow prism is located at the center of a rotating gear one, a movable sleeve is slidably mounted on the hollow prism, a reset spring three is fixedly connected between the movable seat and the movable sleeve and passes through the hollow prism, a plurality of arc grooves evenly distributed circumferentially are provided on the inner wall of the rotating gear one, a slider one corresponding to the arc grooves is fixedly connected to the movable sleeve, and the slider one is slidably connected to the corresponding slider one.
[0014] In one possible implementation, sliding grooves are provided at both the front and rear ends of the leveling rod, and the movable block is installed in the corresponding sliding groove for sliding forward and backward movement at one end away from the corresponding rotating rod, and a compression spring is fixedly connected between the side of the movable block away from the center of the leveling rod and the inner wall of the leveling rod.
[0015] In one possible implementation, movable grooves are provided at both left and right ends of the leveling rod 2, and the slider 2 is slidably connected to the corresponding movable grooves left and right. Rubber pads are fixedly installed on the side of the leveling rod 2 and the leveling rod 1 close to the corresponding silicone pad, and the rubber pads are pressed against the surface of the corresponding release paper.
[0016] The beneficial effects of the present invention are as follows: 1. The present invention automatically re-lays release paper on the surface of the silicone pad and flattens the laid release paper during the lamination and separation of the lamination plate through the mutual cooperation of the lamination plate, the paper covering unit and the flattening unit. There is no need to manually cover the release paper on the surface of the flexible circuit board, and the release paper is replaced during the opening process of the lamination plate, thereby improving the efficiency of the flexible circuit board lamination, avoiding the occurrence of wrinkles on the release paper, and improving the quality of the flexible circuit board lamination.
[0017] 2. In the process of pressing the pressing plates of the present invention, the pressing force between adjacent pressing plates is used to drive the rotating component to drive the rotating gear 1 and the rotating rod 1 to rotate, so that the leveling rod 1 and the leveling rod 2 are respectively moved in the direction away from the center of the pressing plates to level the release paper, thereby avoiding wrinkles on the release paper. After the leveling is completed, the movable seat can shrink toward the inside of the pressing plate under the push of the pressing force of the adjacent pressing plates, and the leveling rod 1 and the leveling rod 2 are moved to the outside of the silicone pad, thereby avoiding the leveling rod 1 and the leveling rod 2 affecting the mutual pressing between the adjacent silicone pads. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a three-dimensional structural schematic diagram of the present invention.
[0019] Figure 2 It is a sectional view of the left side of the present invention.
[0020] Figure 3 It is a schematic diagram of the three-dimensional structure of the pressed plate of the present invention.
[0021] Figure 4 It is a schematic diagram of the three-dimensional structure of the coating unit of the present invention.
[0022] Figure 5 It is a partial cross-sectional view of the drive assembly of the present invention.
[0023] Figure 6 It is a partial cross-sectional view of the positioning assembly of the present invention.
[0024] Figure 7 It is a schematic diagram of the three-dimensional structure of the leveling unit of the present invention.
[0025] Figure 8 It is a partial cross-sectional view of the moving assembly of the present invention.
[0026] Figure 9 It is an exploded view of the leveling unit of the present invention.
[0027] Figure 10 It is a three-dimensional structural schematic diagram of the rotating gear 1 of the present invention.
[0028] Figure 11 It is a three-dimensional structural schematic diagram of the compression spring of the present invention.
[0029] Figure 12 It is a distribution diagram of release papers on the upper and lower sides of the middle pressing plate of the present invention.
[0030] In the figure: 1, housing; 11, support frame; 12, guide groove; 2, pressing plate; 21, silicone pad; 3, electric push rod; 4, elastic buffer structure; 41, elastic telescopic rod; 42, top block; 5, paper covering unit; 51, mounting frame; 52, rotating shaft; 53, winding roller; 54, unwinding roller; 55, driving assembly; 551, driven gear; 552, ratchet pawl structure; 553, driving rack; 56, positioning assembly; 561, fixing plate; 562, positioning groove; 563, mounting block; 564, positioning bead; 565, reset spring 1; 57. Guide roller; 6. Leveling unit; 61. Leveling rod one; 611. Slide groove; 612. Compression spring; 62. Leveling rod two; 621. Movable groove; 63. Moving assembly; 631. Movable seat; 632. Return spring two; 633. Rotating gear one; 634. Turning rod one; 635. Movable block; 636. Rotating component; 6361. Hollow prism; 6362. Movable sleeve; 6363. Return spring three; 6364. Arc groove; 6365. Slider one; 637. Rotating gear two; 638. Turning rod two; 639. Slider two. DETAILED DESCRIPTION
[0031] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described below, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.
[0032] See also Figures 1 - 3 , a circuit board processing system equipped with an elastic buffer pressing structure, comprising a casing 1 and two groups of pressing plates 2 installed inside the casing 1 and symmetrically distributed on the left and right, a number of pressing plates 2 in the same group are equidistantly distributed up and down, the number of pressing plates 2 in the same group is three, silicone pads 21 are fixedly installed on the opposite sides of two adjacent pressing plates 2, the silicone pads 21 play a buffering role in the pressing process to prevent the flexible circuit board from being damaged due to excessive pressure during pressing, an electric push rod 3 is fixedly installed inside the casing 1 to push the lowest pressing plate 2 to move up and down, the top of the telescopic section of the electric push rod 3 is fixedly connected to the bottom of the lowest pressing plate 2, an elastic buffer structure 4 located on the top of the highest pressing plate 2 is installed inside the casing 1, a paper covering unit 5 for laying release paper is installed on the pressing plate 2, and a leveling unit 6 for leveling the release paper is also installed on the side of the pressing plate 2 provided with the silicone pad 21.
[0033] See also Figures 1 - 3 , a number of support frames 11 distributed at the four corners of the same group of pressing plates 2 are fixedly installed on the inner wall of the housing 1, and a number of guide grooves 12 are opened on the side of the support frame 11 close to the pressing plate 2, which are equidistantly distributed front and back and have equally increasing heights. Except for the top pressing plate 2, the other pressing plates 2 distributed from top to bottom in the same group correspond one to one with the guide grooves 12 distributed from front to back, and the pressing plates 2 are connected to the corresponding guide grooves 12 by sliding up and down. It should be noted that the support frame 11 and the guide grooves 12 are both existing technologies. The guide grooves 12 are used to guide and support the corresponding pressing plates 2. On the one hand, the stability of the pressing plates 2 in the process of pressing and laminating is improved. On the other hand, when the pressing plates 2 move downward and separate, the heights of the different pressing plates 2 moving downward are limited, so that the pressing plates 2 are equidistantly distributed up and down, which is convenient for placing the flexible circuit board on the silicone pad 21.
[0034] In the initial state, the three pressing plates 2 are in an equidistantly separated state. When the flexible circuit board is to be pressed, the flexible circuit board is first placed on the release paper on the top of the silicone pad 21, and the electric push rod 3 is used to push the lowest pressing plate 2 to move upward. When the lowest flexible circuit board contacts the release paper on the lower side of the middle pressing plate 2, the lowest pressing plate 2 pushes the middle pressing plate 2 to move upward together, and then the middle pressing plate 2 pushes the top pressing plate 2 to move upward and squeeze the elastic buffer structure 4, so that the three pressing plates 2 are pressed against each other to achieve the pressing of the flexible circuit board. After the pressing is completed, the electric push rod 3 drives the lowest pressing plate 2 to move downward, so that the three pressing plates 2 are successively restored to their initial heights, and finally the pressed flexible circuit board is removed.
[0035] See also Figure 1 and Figure 2 The elastic buffer structure 4 includes an elastic telescopic rod 41 fixedly mounted on the inner top wall of the casing 1 for elastically buffering the pressing plate 2. The bottom of the telescopic section of the elastic telescopic rod 41 is fixedly connected to the top of the uppermost pressing plate 2. A top block 42 located on the top of the uppermost pressing plate 2 is also fixedly mounted on the inner top wall of the casing 1.
[0036] When the electric push rod 3 pushes the pressing plate 2 to move upward, when the middle pressing plate 2 is pressed together with the top pressing plate 2, the elastic telescopic rod 41 can play an elastic buffering role for the top pressing plate 2, so that the top pressing plate 2 moves upward a short distance and then contacts the top block 42 to press the flexible circuit board, thereby avoiding the sudden increase in the pressing pressure between adjacent pressing plates 2, which may cause the flexible circuit board to be crushed, thereby improving the yield rate of the flexible circuit board pressing.
[0037] See also Figures 1 - 6The paper covering unit 5 includes a mounting frame 51 fixedly mounted on the left and right sides of the laminating plate 2, a rotating shaft 52 is rotatably mounted on the mounting frame 51, a winding roller 53 and an unwinding roller 54 are respectively connected to the left and right rotating shafts 52 through splines, a driving component 55 for driving the winding roller 53 to rotate unidirectionally is mounted on the rotating shaft 52 corresponding to the winding roller 53, and a positioning component 56 for positioning the unwinding roller 54 is mounted on the rotating shaft 52 corresponding to the unwinding roller 54.
[0038] Unused release paper is wound on the unwinding roller 54, and the end of the release paper is fixedly wound on the winding roller 53. The release paper is unwound and wound up by the coordinated use of the unwinding roller 54 and the winding roller 53, and the release paper is covered on the surface of the silicone pad 21. During the lamination process, the flexible circuit board and the silicone pad 21 can be prevented from sticking together, which facilitates the separation of the flexible circuit board and does not require manual covering, thereby improving the efficiency of the flexible circuit board lamination process.
[0039] It should be noted that the unwinding rollers 54 at the top and bottom unwind single-layer release paper, and the other unwinding rollers 54 unwind double-layer release paper (such as Figure 12 As shown), the double-layer release paper is separated into two single-layer release papers after leaving the unwinding roller 54, and then covers the silicone pads 21 on the upper and lower sides of the corresponding lamination plate 2 respectively, and finally the two single-layer release papers are reeled together by the reeling roller 53 cooperating with the unwinding roller 54.
[0040] See also Figures 1 - 6 The driving assembly 55 includes a driven gear 551 rotatably mounted on the rotating shaft 52, and a ratchet pawl structure 552 is installed between the driven gear 551 and the rotating shaft 52 to limit the driven gear 551 from rotating in one direction. A driving rack 553 is meshed on the side of the driven gear 551 close to the corresponding pressing plate 2, and the end of the driving rack 553 away from the driven gear 551 is fixedly connected to the adjacent pressing plate 2.
[0041] The rotation direction of the driven gear 551 is restricted by setting a ratchet pawl structure 552. When the electric push rod 3 pushes the pressing plate 2 to move upward, as the adjacent pressing plates 2 approach each other, the end of the driving rack 553 away from the corresponding driven gear 551 will approach the driven gear 551 under the push of the pressing plate 2, and the driving rack 553 can drive the driven gear 551 to rotate. Due to the existence of the ratchet pawl structure 552, the driven gear 551 cannot drive the rotating shaft 52 to rotate through the ratchet pawl structure 552, thereby preventing the winding roller 53 from winding up the release paper during the lamination process.
[0042] When the electric push rod 3 drives the pressing plate 2 to move downward to separate the adjacent pressing plates 2 from each other, as the distance between the adjacent pressing plates 2 gradually increases, the end of the driving rack 553 away from the corresponding driven gear 551 will be driven away from the driven gear 551 by the pressing plate 2, and the driving rack 553 is used to drive the driven gear 551 to rotate. The driven gear 551 drives the rotating shaft 52 and the winding roller 53 to rotate through the ratchet pawl structure 552, so that the winding roller 53 can rewind the laminated release paper, so that the release paper can be separated from the silicone pad 21 by the used part and the unused part can be re-covered on the silicone pad 21. During the rewinding process, the leveling rod 61 can block the flexible circuit board to prevent the flexible circuit board from moving with the release paper and being wound onto the unwinding roller 54. There is no need to manually lay the release paper, which shortens the time spent on replacing the release paper, facilitates the subsequent lamination of the flexible circuit board, and improves the efficiency of the flexible circuit board lamination.
[0043] See also Figures 1 - 6 The positioning assembly 56 includes a fixed plate 561 fixedly mounted on the rotating shaft 52. A plurality of positioning grooves 562 uniformly distributed in the circumferential direction are provided on the side of the fixed plate 561 away from the corresponding unwinding roller 54. A mounting block 563 located between the fixed plate 561 and the corresponding mounting frame 51 is rotatably mounted on the rotating shaft 52. The mounting block 563 is fixedly connected to the corresponding mounting frame 51 by bolts. Positioning beads 564 symmetrically distributed up and down are slidably mounted on the side of the mounting block 563 opposite to the fixed plate 561. The positioning beads 564 cooperate with the positioning grooves 562. A return spring 565 is fixedly connected between the positioning beads 564 and the inner wall of the mounting block 563.
[0044] The return spring 565 gives the positioning bead 564 an elastic force to move toward the fixed plate 561, so that the positioning bead 564 can cooperate with the positioning groove 562, and the rotating shaft 52 and the unwinding roller 54 can be positioned to prevent the rotating shaft 52 and the unwinding roller 54 from rotating arbitrarily, resulting in the release paper becoming loose. When the winding roller 53 winds up the release paper, the pulling force of the release paper drives the unwinding roller 54 to rotate, and then the unwinding roller 54 drives the rotating shaft 52 and the fixed plate 561 overcomes the matching force between the positioning bead 564 and the positioning groove 562 and rotates, so that the unwinding roller 54 unwinds the release paper. When the positioning groove 562 and the positioning bead 564 are misaligned, the positioning bead 564 will move toward the inside of the mounting block 563 under the push of the fixed plate 561, so that the return spring 565 is compressed. When the positioning groove 562 and the positioning bead 564 are directly opposite to each other, the positioning bead 564 will match with the positioning groove 562 again under the push of the return spring 565.
[0045] See also Figure 4 and Figure 12The paper covering unit 5 also includes guide rollers 57 symmetrically distributed on the left and right sides of the silicone pad 21. The guide rollers 57 are rotatably installed on the corresponding pressing plate 2 through the roller frame. The release paper unwound from the unwinding roller 54 is guided by the guide rollers 57 and then wound onto the corresponding unwinding roller 54.
[0046] The guide roller 57 is provided to guide the release paper so that the release paper can adhere to the surface of the silicone pad 21, and the unwinding roller 54 and the winding roller 53 can smoothly unwind and rewind the release paper, thereby reducing the possibility of wrinkles on the release paper during the unwinding and rewinding process, thereby improving the flatness of the release paper.
[0047] See also Figure 2 , Figure 3 , Figure 7 The flattening unit 6 includes a flattening rod 61 which is movably arranged on the pressing plate 2 left and right and symmetrically distributed left and right, and a flattening rod 62 which is movably arranged on the pressing plate 2 front and back and symmetrically distributed front and back. A moving component 63 is installed on the pressing plate 2 to drive the corresponding flattening rod 61 and the flattening rod 62 to move left and right and front and back respectively and to flatten the release paper.
[0048] See also Figure 2 , Figure 3 , Figure 7 , Figure 8 and Figure 9 The moving assembly 63 includes a movable seat 631 which is slidably mounted on the pressing plate 2 and is symmetrically distributed front and back about the corresponding leveling rod 1 61. A return spring 2 632 is fixedly connected between the side of the movable seat 631 away from the leveling rod 1 61 and the inner wall of the pressing plate 2. A rotating gear 1 633 and a rotating gear 2 637 are rotatably mounted on the side of the movable seat 631 close to the corresponding leveling rod 1 61. The rotating gear 1 633 and the corresponding rotating gear 2 637 are meshed and matched. The rotating gear 1 633 and the rotating gear 2 637 are meshed and matched. A rotating rod 1 634 and a rotating rod 2 638 are fixedly connected to one side of 37 near the center of the silicone pad 21. A movable block 635 is hinged at one end of the rotating rod 1 634 away from the rotating gear 1 633. The movable block 635 is connected to the leveling rod 1 61 for sliding back and forth. A slider 2 639 is rotatably installed on the top of one end of the rotating rod 2 638 away from the rotating gear 2 637. The slider 2 639 is connected to the leveling rod 2 62 for sliding left and right. A rotating component 636 for driving the rotating gear 1 633 to rotate is also installed on the movable seat 631.
[0049] See also Figure 3 , Figure 7 , Figure 8 , Figure 9 and Figure 10The rotating component 636 includes a hollow prism 6361 fixedly mounted on the movable seat 631 near the corresponding leveling rod 61, the hollow prism 6361 is located at the center of the rotating gear 633, a movable sleeve 6362 is slidably sleeved up and down on the hollow prism 6361, a return spring 3 6363 penetrating the hollow prism 6361 is fixedly connected between the movable seat 631 and the movable sleeve 6362, a plurality of arc grooves 6364 evenly distributed in the circumferential direction are opened on the inner wall of the rotating gear 633, a slider 6365 corresponding to the arc groove 6364 is fixedly connected to the movable sleeve 6362, and the slider 6365 is slidably connected to the corresponding slider 6365.
[0050] See also Figure 3 , Figure 7 , Figure 8 , Figure 9 and Figure 10 The hollow prism 6361 guides the movable sleeve 6362 to prevent the movable sleeve 6362 from deflecting; in the initial state, the leveling rod 1 61 and the leveling rod 2 62 are both located on the side of the release paper away from the corresponding silicone pad 21. Before the two adjacent silicone pads 21 are pressed together, the two movable sleeves 6362 facing each other first contact each other, and then the movable sleeve 6362 moves toward the corresponding movable seat 631 under the action of the pressing force, so that the return spring 3 6363 is compressed and contracted, and at the same time, the movable seat 631 will also move to the inside of the pressing plate 2 under the action of the pressing force. After moving a short distance, the leveling rod 1 61 and the leveling rod 2 62 are pressed against the surface of the release paper, and then the movable seat 631 stops moving due to the obstruction of the silicone pad 21; the movable sleeve 6362 will drive the slider 1 6365 to move together when moving, and the slider 1 6365 will slide along the arc groove 6364 and drive the rotating gear 1 633 and the rotating rod 1 634 to deflect ninety degrees to the outside of the pressing plate 2, and then the rotating rod 1 634 pushes the movable block 635 and the leveling rod 1 61 to move away from the center of the pressing plate 2, so that the leveling rod 1 61 can level the release paper in the left and right directions.
[0051] During the rotation process, the rotating gear 1 633 will drive the rotating gear 2 637 to rotate in the opposite direction, and the rotating gear 2 637 will drive the rotating rod 2 638 to deflect ninety degrees to the outside of the pressing plate 2, and then the rotating rod 2 638 will drive the leveling rod 2 62 to move away from the center of the pressing plate 2, so that the leveling rod 2 62 will level the release paper in the front and back directions, thereby preventing the release paper from wrinkles and improving the lamination quality of the flexible circuit board.
[0052] When the rotating rod 1 634 and the rotating rod 2 638 rotate ninety degrees, the movable sleeve 6362 is completely pressed into the inside of the rotating gear 1 633. At this time, the rotating rod 1 634 and the rotating rod 2 638 no longer rotate, and at the same time, the leveling rod 1 61 and the leveling rod 2 62 are pushed to the outside of the vertical projection surface of the silicone pad 21. The leveling rod 1 61 and the leveling rod 2 62 are no longer blocked by the silicone pad 21. Then, as the adjacent pressing plates 2 continue to approach, the movable seat 631 moves toward the inside of the pressing plate 2 again under the action of the pressing force. At this time, the reset spring 2 632 is compressed and contracted, and the movable seat 631 will drive the leveling rod 1 61 to move to the left and right sides of the silicone pad 21, and drive the leveling rod 2 62 to move to the front and back sides of the silicone pad 21, so as to avoid the leveling rod 1 61 and the leveling rod 2 62 blocking the mutual pressing of the adjacent silicone pads 21.
[0053] When the leveling rod 61 moves to the left and right sides of the pressing plate 2, the leveling rod 61 can press down the left and right sides of the release paper on the silicone pad 21, so that the release paper can better fit to the silicone pad 21, and the air between the release paper and the silicone pad 21 can be exhausted to prevent the release paper from bulging during the pressing process, thereby further improving the flatness of the release paper.
[0054] After the pressing is completed, the two adjacent pressing plates 2 are separated from each other, and at this time, the movable seat 631 moves toward the outside of the pressing plate 2 under the action of the rebound force of the second return spring 632, and at the same time, the movable sleeve 6362 tends to move toward the outside of the rotating gear 1 633 under the push of the rebound force of the third return spring 6363. However, since the leveling rod 1 61 is located on the left and right sides of the silicone pad 21 and the leveling rod 2 62 is located on the front and back sides of the silicone pad 21, the rotating rod 1 634 and the rotating rod 2 638 will be blocked by the silicone pad 21 and cannot be deflected toward the inside of the pressing plate 2. When the movable seat 631 moves outward from the pressing plate 2 to the maximum extent, the leveling rod 1 61 and the leveling rod 2 62 move between the two adjacent silicone pads 21. At this time, the rotating rod 1 634 and the rotating rod 2 638 8 is no longer blocked by the silicone pad 21, and the movable sleeve 6362 is pushed to move to the outside of the rotating gear 1 633 by the rebound force of the reset spring 3 6363, and the rotating gear 1 633 is pushed to rotate in the opposite direction by the cooperation of the slider 1 6365 and the arc groove 6364, so that the rotating rod 1 634 pushes the movable block 635 and the leveling rod 1 61 to move toward the center of the pressing plate 2, and the leveling rod 1 61 returns to the side of the silicone pad 2 away from the corresponding pressing plate 2. When the rotating gear 1 633 rotates in the opposite direction, it will drive the rotating gear 2 637 to rotate in the opposite direction, so that the rotating rod 2 638 drives the leveling rod 2 62 to move toward the center of the pressing plate 2, and the leveling rod 2 62 returns to the side of the silicone pad 21 away from the corresponding pressing plate 2.
[0055] See also Figure 7 , Figure 8 and Figure 11A slide groove 611 is provided at both the front and rear ends of the leveling rod 61, and the movable block 635 is slidably installed in the corresponding slide groove 611 at one end away from the corresponding rotating rod 634, and a compression spring 612 is fixedly connected between the side of the movable block 635 away from the center of the leveling rod 61 and the inner wall of the leveling rod 61.
[0056] When the rotating rod 634 pushes the movable block 635 to move away from the center of the pressing plate 2, the movable block 635 will slide along the slide groove 611, and the compression springs 612 on the front and rear sides will apply the same elastic force to the leveling rod 61 during the movement of the movable block 635, so that the leveling rod 61 is in a front-to-back centered state, avoiding the front-to-back deflection of the leveling rod 61 during the left-right movement.
[0057] See also Figure 7 and Figure 8 The left and right ends of the second leveling rod 62 are provided with movable grooves 621, and the second slider 639 is slidably connected to the corresponding movable groove 621. The second leveling rod 62 and the first leveling rod 61 are fixedly installed with rubber pads on one side close to the corresponding silicone pad 21, and the rubber pads are pressed against the surface of the corresponding release paper.
[0058] When the rotating rod 2 638 pushes the leveling rod 2 62 to move away from the center of the pressing plate 2, the sliding block 2 639 will slide left and right along the movable groove 621, and the movable groove 621 provides sufficient offset for the deflection of the sliding block 2 639; the rubber pads at the bottom of the leveling rod 1 61 and the leveling rod 2 62 can increase the friction between the release paper, so that the leveling rod 1 61 and the leveling rod 2 62 can stretch and flatten the release paper, and at the same time reduce the impact force of the leveling rod 1 61 and the leveling rod 2 62 pressing on the release paper, thereby avoiding indentations when the release paper is pressed by the leveling rod 1 61 and the leveling rod 2 62.
[0059] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "connect", "install", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, an integral connection, or a sliding connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0060] The embodiments of this specific implementation method are all preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Therefore, all equivalent changes made based on the structure, shape, and principle of the present invention should be included in the protection scope of the present invention.
Claims
1. A circuit board processing system with an elastic buffer pressing structure, comprising a housing (1) and two groups of pressing plates (2) installed inside the housing (1) and symmetrically distributed left and right, wherein a plurality of pressing plates (2) in the same group are equidistantly distributed up and down, and a silicone pad (21) is fixedly installed on the opposite side of two adjacent pressing plates (2), characterized in that: An elastic buffer structure (4) located on the top of the uppermost pressing plate (2) is installed inside the housing (1); a paper covering unit (5) for laying release paper is installed on the pressing plate (2); and a leveling unit (6) for leveling the release paper is also installed on one side of the pressing plate (2) provided with a silicone pad (21); The paper covering unit (5) comprises a mounting frame (51) fixedly mounted on the left and right sides of the pressing plate (2); a rotating shaft (52) is rotatably mounted on the mounting frame (51); a winding roller (53) and an unwinding roller (54) are respectively connected to the two rotating shafts (52) via splines; a driving component (55) for driving the winding roller (53) to rotate in one direction is mounted on the rotating shaft (52) corresponding to the winding roller (53); and a positioning component (56) for positioning the unwinding roller (54) is mounted on the rotating shaft (52) corresponding to the unwinding roller (54); The flattening unit (6) comprises a flattening rod (61) which is movably arranged on the pressing plate (2) and is symmetrically arranged on the left and right sides, and a flattening rod (62) which is movably arranged on the pressing plate (2) and is symmetrically arranged on the front and back sides. The pressing plate (2) is provided with a moving component (63) which drives the corresponding flattening rod (61) and the corresponding flattening rod (62) to move left and right and front and back respectively and flatten the release paper.
2. A circuit board processing system with an elastic buffer pressing structure according to claim 1, characterized in that: A plurality of support frames (11) are fixedly mounted on the inner wall of the casing (1) and are distributed at the four corners of the same group of pressing plates (2). A plurality of guide grooves (12) are provided on one side of the support frame (11) close to the pressing plates (2) and are equidistantly distributed front to back and with increasing heights in equal amounts. Except for the top pressing plate (2), the other pressing plates (2) distributed from top to bottom in the same group correspond one to one with the guide grooves (12) distributed from front to back, and the pressing plates (2) are connected to the corresponding guide grooves (12) in an upward and downward sliding manner. An electric push rod (3) is fixedly mounted inside the casing (1) and is used to push the bottom pressing plate (2) to move up and down.
3. A circuit board processing system with an elastic buffer pressing structure according to claim 1, characterized in that: The elastic buffer structure (4) comprises an elastic telescopic rod (41) fixedly mounted on the inner top wall of the housing (1) for elastically buffering the pressing plate (2); the bottom of the telescopic section of the elastic telescopic rod (41) is fixedly connected to the top of the uppermost pressing plate (2); and a top block (42) located on the top of the uppermost pressing plate (2) is also fixedly mounted on the inner top wall of the housing (1).
4. A circuit board processing system with an elastic buffer pressing structure according to claim 1, characterized in that: The driving assembly (55) comprises a driven gear (551) rotatably mounted on a rotating shaft (52); a ratchet pawl structure (552) is mounted between the driven gear (551) and the rotating shaft (52) for limiting the driven gear (551) from rotating in one direction; a driving rack (553) is meshed with a side of the driven gear (551) close to the corresponding pressing plate (2); and an end of the driving rack (553) away from the driven gear (551) is fixedly connected to an adjacent pressing plate (2).
5. A circuit board processing system with an elastic buffer pressing structure according to claim 1, characterized in that: The positioning assembly (56) comprises a fixing plate (561) fixedly mounted on the rotating shaft (52); a plurality of positioning grooves (562) evenly distributed in the circumferential direction are formed on a side of the fixing plate (561) away from the corresponding unwinding roller (54); a mounting block (563) rotatably mounted on the rotating shaft (52) and located between the fixing plate (561) and the corresponding mounting frame (51); the mounting block (563) is fixedly connected to the corresponding mounting frame (51) via bolts; positioning beads (564) symmetrically distributed up and down are slidably mounted on a side of the mounting block (563) opposite to the fixing plate (561) in a forward and backward manner; the positioning beads (564) cooperate with the positioning grooves (562); and a return spring (565) is fixedly connected between the positioning beads (564) and the inner wall of the mounting block (563).
6. A circuit board processing system with an elastic buffer pressing structure according to claim 1, characterized in that: The paper covering unit (5) further comprises guide rollers (57) symmetrically distributed on the left and right sides of the silicone pad (21); the guide rollers (57) are rotatably mounted on the corresponding pressing plate (2) via a roller frame; the release paper unwound from the unwinding roller (54) is guided by the guide rollers (57) and then wound onto the corresponding unwinding roller (54).
7. A circuit board processing system with an elastic buffer pressing structure according to claim 1, characterized in that: The moving assembly (63) comprises a movable seat (631) which is slidably mounted on the pressing plate (2) and is symmetrically distributed frontward and rearward about the corresponding leveling rod (61); a return spring (632) is fixedly connected between the side of the movable seat (631) away from the leveling rod (61) and the inner wall of the pressing plate (2); a rotating gear (633) and a rotating gear (637) are rotatably mounted on the side of the movable seat (631) close to the corresponding leveling rod (61); the rotating gear (633) and the corresponding rotating gear (637) are meshed and matched; the rotating gear (633) and the rotating gear (637) are meshed and matched. 7) A rotating rod 1 (634) and a rotating rod 2 (638) are fixedly connected to one side near the center of the silicone pad (21), and a movable block (635) is hingedly connected to the end of the rotating rod 1 (634) away from the rotating gear 1 (633). The movable block (635) is connected to the leveling rod 1 (61) in a forward and backward sliding manner. A slider 2 (639) is rotatably installed on the top of the end of the rotating rod 2 (638) away from the rotating gear 2 (637). The slider 2 (639) is connected to the leveling rod 2 (62) in a left and right sliding manner. A rotating component (636) for driving the rotating gear 1 (633) to rotate is also installed on the movable seat (631).
8. A circuit board processing system with an elastic buffer pressing structure according to claim 7, characterized in that: The rotating component (636) includes a hollow prism (6361) fixedly mounted on a movable seat (631) near a side of a corresponding leveling rod (61); the hollow prism (6361) is located at the center of a rotating gear (633); a movable sleeve (6362) is slidably mounted on the hollow prism (6361); a return spring (6363) penetrating the hollow prism (6361) is fixedly connected between the movable seat (631) and the movable sleeve (6362); a plurality of arc grooves (6364) uniformly distributed in the circumferential direction are formed on the inner wall of the rotating gear (633); a slider (6365) corresponding to the arc grooves (6364) is fixedly connected to the movable sleeve (6362); and the slider (6365) is slidably connected to the corresponding slider (6365).
9. A circuit board processing system with an elastic buffer pressing structure according to claim 7, characterized in that: The front and rear ends of the leveling rod (61) are both provided with a slide groove (611), and the end of the movable block (635) away from the corresponding rotating rod (634) is slidably installed in the corresponding slide groove (611) forward and backward, and a compression spring (612) is fixedly connected between the side of the movable block (635) away from the center of the leveling rod (61) and the inner wall of the leveling rod (61).
10. A circuit board processing system with an elastic buffer pressing structure according to claim 7, characterized in that: The left and right ends of the second leveling rod (62) are both provided with movable grooves (621), and the second slider (639) is slidably connected to the corresponding movable grooves (621) left and right. The second leveling rod (62) and the first leveling rod (61) are both fixedly installed with rubber pads on one side close to the corresponding silicone pad (21), and the rubber pads are pressed tightly against the surface of the corresponding release paper.
Citation Information
Patent Citations
Flexible circuit board surface mounting device and method
CN117042331A
Release paper processing and pressing device capable of achieving non-stop butt joint
CN117207641A
Pressing device for processing flexible circuit board
CN210745676U
Self-adaptive pressing device for circuit board double-sided laminating machine
CN214901458U
Leveling mechanism for release paper processing
CN218619454U