Chip local coating device capable of avoiding generation of bubbles

Abstract

The invention discloses a chip local coating device capable of avoiding bubble generation, and relates to the technical field of chip analysis and processing equipment.The chip local coating device comprises a machine body shell and a ventilation assembly, the ventilation assembly is arranged on the side wall of the machine body shell, and an operation panel is arranged on the machine body shell; the ventilation assembly comprises ventilation holes, a sealing groove, an air compression groove, an air compression plate, a sealing plate, a through hole, a dust screen and an air pump, the ventilation holes are symmetrically formed in the two sides of the machine body shell, the sealing groove is formed in the middle of the ventilation holes, the air compression groove is formed in one side of the sealing groove, the air compression plate is arranged in the air compression groove, and the sealing plate is connected to one side of the air compression plate. A through hole is formed in the surface of the sealing plate, a dust screen is connected into the vent hole in one side of the machine body shell, and one side of the vent hole in the other side of the machine body shell is connected with an air pump through a pipeline. When the device is used, a chip can be placed in a closed space, and air in the device is exhausted, so that bubbles in silicone grease are removed, the coating effect is ensured, dust can be prevented from being adhered to the chip, and the chip can be conveniently moved during observation and coating.

Description

Technical Field

[0001] The present invention relates to the technical field of chip analysis and processing equipment, and specifically provides a chip partial coating device for avoiding bubble generation. Background Art

[0002] A chip is mainly composed of a device layer, various metal layers, and dielectric layers. Chip delamination analysis is mainly applied to chip failure analysis and reverse engineering. During the chip delamination process, due to uneven grinding or improper metal reaction, the metal layers of the chip are at different levels, which is called "layer misalignment". The chip itself has a relatively small area and limited operating space. Therefore, once layer misalignment occurs during the chip delamination process, a coating device is needed to coat a covering material on the pitted or less-layered parts of the chip. The covering material forms a protective film on the pitted or less-layered parts of the chip by virtue of its shielding and adhesion properties, so as to achieve only delaminating the parts with more layers during the dry etching and wet etching delamination processes, making the chip at the same level.

[0003] For example, the invention patent with the application number CN202111473541.2 discloses a chip partial coating device for avoiding bubble generation. The coating device coats a covering material on the pitted or less-layered parts of the chip, and the covering material forms a protective film on the pitted or less-layered parts of the chip by virtue of its shielding and adhesion properties. However, during coating, the coating effect may be reduced due to the presence of bubbles in the silicone grease, and during the observation and coating processes, the chip is located outside, which may adhere to dust, resulting in deviation of the observation and analysis results or affecting the coating effect.

[0004] Therefore, in view of this, research and improvement are carried out on the existing structure and deficiencies, and a chip partial coating device for avoiding bubble generation is proposed. Summary of the Invention

[0005] The purpose of the present invention is to provide a chip partial coating device for avoiding bubble generation to solve the problems raised in the above background art.

[0006] To achieve the above purpose, the present invention provides the following technical solution: A chip partial coating device for avoiding bubble generation, including a body shell and a ventilation component. The ventilation component is arranged on the side wall of the body shell, and an operation panel is arranged on the body shell. The ventilation component includes a ventilation hole, a sealing groove, a pressure air groove, a pressure air plate, a sealing plate, a through hole, a dust separation net, and an air pump. The ventilation holes are symmetrically arranged on both sides of the body shell, and a sealing groove is arranged in the middle of the ventilation hole. A pressure air groove is arranged on one side of the sealing groove, and a pressure air plate is arranged in the pressure air groove. One side of the pressure air plate is connected to a sealing plate, and through holes are formed on the surface of the sealing plate. A dust separation net is connected in the ventilation hole on one side of the body shell, and an air pump is connected to one side of the ventilation hole on the other side of the body shell through a pipeline.

[0007] Furthermore, the ventilation component further includes a ventilation cavity, an airbag, a pressure plate, and a pneumatic spring. A ventilation cavity is provided at the rear side of the body housing, and an airbag is arranged inside the ventilation cavity. One side of the airbag is connected to a pressure plate, and pneumatic springs are symmetrically connected to both sides of the pressure plate.

[0008] Furthermore, the through holes are staggeredly distributed on the two sealing plates, and the sealing plates are slidably connected to the body housing through sealing grooves. The pneumatic plate is engaged and slidably connected to the pneumatic groove, and the pneumatic groove is communicated with the airbag through a pipeline. The pressure plate is elastically connected to the body housing through a pneumatic spring, and a pressure sensor is arranged inside the pneumatic spring. The pressure sensor is connected to the operation panel through a circuit, and a lighting lamp is arranged inside the body housing.

[0009] Furthermore, a silicone grease bin is provided in the middle above the body housing, and lifting rods are symmetrically connected to both sides above the body housing. The lower ends of the lifting rods are connected to a backing plate, and a microscope is arranged on one side of the backing plate. The microscope is connected to the operation panel through a circuit.

[0010] Furthermore, a peristaltic pump is arranged on the other side of the backing plate, and a spraying port is arranged on the other side of the peristaltic pump. The peristaltic pump is communicated with the silicone grease bin through a hose, and the peristaltic pump is connected to the operation panel through a circuit.

[0011] Furthermore, limiting rods are symmetrically connected inside the body housing, and a sliding port is provided at the front side of the body housing. A conveying component is arranged inside the sliding port, and locking components are symmetrically arranged on both sides of the sliding port.

[0012] Furthermore, the conveying component includes a sliding frame, a limiting plate, a pressing block, a pulling plate, insertion holes, sliding grooves, and an inner frame. The sliding frame is slidably connected inside the sliding port, and a limiting plate is connected to one side of the sliding frame. The pressing block is connected to the other side of the limiting plate. The pulling plate is connected to the other side of the sliding frame, and insertion holes are symmetrically formed on the outer side of the sliding frame. Sliding grooves are symmetrically formed inside the sliding frame, and the inner frame is engaged and slidably connected between the sliding grooves. The limiting plate is slidably connected to the limiting rod.

[0013] Furthermore, the conveying component further includes sliding rails, a material placing frame, longitudinal adjusting rods, sliding plates, moving grooves, and moving cavities. Sliding rails are symmetrically formed inside the inner frame, and the material placing frame is engaged and slidably connected between the sliding rails. The longitudinal adjusting rods are threadedly connected to the lower part of the material placing frame, and a sliding plate is rotatably connected to one side of the longitudinal adjusting rod. Moving grooves are formed on both the sliding frame and the pulling plate, and a moving cavity is arranged in the middle of the pulling plate in the moving groove. The longitudinal adjusting rods are rotatably connected to the inner frame, and the longitudinal adjusting rods are slidably connected to the sliding frame and the pulling plate through the moving grooves. The sliding plate is engaged and slidably connected to the moving cavity.

[0014] Further, the conveying assembly further includes a transmission cavity, transmission gears, a rotating rod, a driving wheel, a transmission wheel, and a lateral adjusting rod. A transmission cavity is provided on one side of the sliding frame, and two transmission gears are rotatably connected in the transmission cavity. A rotating rod is connected to the middle of the transmission gear on one side of the transmission cavity, and a driving wheel is connected to one side of the transmission gear on the other side of the transmission cavity. A transmission wheel is provided on one side of the driving wheel, and a lateral adjusting rod is connected to the middle of the transmission wheel. The lateral adjusting rod is threadedly connected to the inner frame.

[0015] Further, the locking assembly includes a locking cavity, an insertion block, a locking spring, and a push-pull rod. Locking cavities are symmetrically provided on both sides of the sliding opening on the body shell, and the insertion block is snap-fitted and slidably connected in the locking cavity. A locking spring is connected to one side of the insertion block, and a push-pull rod is provided on the other side of the insertion block. The insertion block is snap-fitted and connected to the sliding frame through an insertion hole.

[0016] The present invention provides a chip partial coating device that avoids the generation of bubbles, and has the following beneficial effects: When in use, the chip can be placed in a closed space, and the device can be evacuated to remove the bubbles in the silicone grease, ensuring the coating effect, and avoiding dust from adhering to the chip, and also facilitating the movement of the chip during observation and coating.

[0017] 1. After the sliding frame is pushed into the body shell in the present invention, the pressing block can apply pressure to the pressure plate and compress the air compression spring, thereby squeezing the airbag, squeezing the air in the airbag into the ventilation cavity, and then driving the sealing plate to move in the sealing groove through the air compression plate to adjust the position of the through hole, so that the air pump is communicated with the inside of the body shell through the ventilation hole. When the pressure sensor senses that the air compression spring is compressed to the limit, the indicator light on the operation panel will light up, indicating that the sliding frame completely enters the body shell and the inside of the body shell is a closed space. At this time, the lighting lamp inside the body shell is turned on, and the chip can be illuminated to facilitate observation and coating. Then, the lifting rod lowers the backing plate to make the microscope close to the chip for observation, and the peristaltic pump is controlled through the operation panel to coat the silicone grease in the silicone grease tank onto the chip through the spraying port. After the sliding frame completely enters the body shell, the air pump is started, and the air inside the body shell can be pumped out. When the air flows, the dust that may adhere to the chip can be peeled off for dust removal. When coating, the air pump continuously pumps air, and the air bubbles in the silicone grease coated on the chip can be pumped out to avoid the influence of air bubbles in the silicone grease on the coating effect. When the sliding frame is pulled out of the body shell, the air compression spring will drive the pressure plate to reset, thereby pumping the air in the ventilation cavity back into the airbag, making the sealing plate return to its original position, closing the ventilation hole communicating with the air pump, and opening the ventilation hole on the other side. The outside air can enter the body shell through the ventilation hole, and the dust-proof net can prevent dust from entering the body shell. In summary, when in use, the chip can be placed in a closed space, and the air in the device is pumped out, thereby removing the air bubbles in the silicone grease, ensuring the coating effect, and avoiding dust from adhering to the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a partial cross-sectional three-dimensional overall structure schematic diagram of a chip partial coating device for avoiding bubble generation according to the present invention;

[0019] Figure 2 is a partial cross-sectional front view structure schematic diagram of a chip partial coating device for avoiding bubble generation according to the present invention;

[0020] Figure 3 is a partial cross-sectional three-dimensional exploded front view structure schematic diagram of the body shell of a chip partial coating device for avoiding bubble generation according to the present invention;

[0021] Figure 4 is a partial cross-sectional three-dimensional exploded side view structure schematic diagram of the body shell of a chip partial coating device for avoiding bubble generation according to the present invention;

[0022] Figure 5 is a front view structure schematic diagram of a chip partial coating device for avoiding bubble generation according to the present invention;

[0023] Figure 6Schematic three-dimensional structure diagram of a chip partial coating device for avoiding bubble generation according to the present invention;

[0024] Figure 7 Schematic exploded three-dimensional structure diagram of the conveying component of a chip partial coating device for avoiding bubble generation according to the present invention.

[0025] In the figure: 1. Body housing; 2. Ventilation component; 201. Ventilation hole; 202. Sealing groove; 203. Compression air groove; 204. Compression air plate; 205. Sealing plate; 206. Through hole; 207. Dust separation net; 208. Air pump; 209. Ventilation cavity; 210. Airbag; 211. Pressure plate; 212. Compression air spring; 3. Operation panel; 4. Silicon grease bin; 5. Lifting rod; 6. Pad; 7. Microscope; 8. Peristaltic pump; 9. Spraying port; 10. Limiting rod; 11. Sliding port; 12. Conveying component; 1201. Sliding frame; 1202. Limiting plate; 1203. Pressing block; 1204. Pulling plate; 1205. Insertion hole; 1206. Sliding groove; 1207. Inner frame; 1208. Sliding rail; 1209. Material placing frame; 1210. Longitudinal adjusting rod; 1211. Sliding plate; 1212. Moving groove; 1213. Moving cavity; 1214. Transmission cavity; 1215. Transmission gear; 1216. Rotating rod; 1217. Driving wheel; 1218. Transmission wheel; 1219. Transverse adjusting rod; 13. Locking component; 1301. Locking cavity; 1302. Insertion block; 1303. Locking spring; 1304. Push-pull rod. Detailed implementation manner

[0026] Please refer to Figures 1 to 7 , the present invention provides a technical solution: a chip partial coating device for avoiding bubble generation, including a body housing 1 and a ventilation component 2. The ventilation component 2 is provided on the side wall of the body housing 1, and an operation panel 3 is provided on the body housing 1. The ventilation component 2 includes a ventilation hole 201, a sealing groove 202, a compression air groove 203, a compression air plate 204, a sealing plate 205, a through hole 206, a dust separation net 207 and an air pump 208. Ventilation holes 201 are symmetrically provided on both sides of the body housing 1, and a sealing groove 202 is provided in the middle of the ventilation hole 201. A compression air groove 203 is provided on one side of the sealing groove 202, and a compression air plate 204 is provided in the compression air groove 203. One side of the compression air plate 204 is connected to a sealing plate 205, and through holes 206 are provided on the surface of the sealing plate 205. A dust separation net 207 is connected in the ventilation hole 201 on one side of the body housing 1, and one side of the ventilation hole 201 on the other side of the body housing 1 is connected to an air pump 208 through a pipeline.

[0027] Please refer to Figures 1 to 6, the ventilation component 2 further includes a ventilation cavity 209, an airbag 210, a pressure plate 211, and a gas compression spring 212. A ventilation cavity 209 is provided at the rear side of the body housing 1, and an airbag 210 is provided in the ventilation cavity 209. One side of the airbag 210 is connected to a pressure plate 211, and gas compression springs 212 are symmetrically connected to both sides of the pressure plate 211. The through holes 206 are staggeredly distributed on the two sealing plates 205, and the sealing plates 205 are slidably connected to the body housing 1 through the sealing grooves 202. The gas compression plate 204 is engaged and slidably connected to the gas compression groove 203, and the gas compression groove 203 is communicated with the airbag 210 through a pipeline. The pressure plate 211 is elastically connected to the body housing 1 through the gas compression spring 212, and a pressure sensor is provided inside the gas compression spring 212. The pressure sensor is connected to the operation panel 3 through a circuit. A lighting lamp is provided inside the body housing 1. A silicone grease bin 4 is provided in the middle above the body housing 1, and lifting rods 5 are symmetrically connected to both sides above the body housing 1. The lower ends of the lifting rods 5 are connected to a backing plate 6, and a microscope 7 is provided on one side of the backing plate 6. The microscope 7 is connected to the operation panel 3 through a circuit. A peristaltic pump 8 is provided on the other side of the backing plate 6, and a spraying port 9 is provided on the other side of the peristaltic pump 8. The peristaltic pump 8 is communicated with the silicone grease bin 4 through a hose, and the peristaltic pump 8 is connected to the operation panel 3 through a circuit;

[0028] The specific operation is as follows. After pushing the sliding frame 1201 into the body housing 1, the pressing block 1203 can apply pressure to the pressure plate 211 and compress the air compression spring 212, thereby squeezing the airbag 210, squeezing the air in the airbag 210 into the ventilation cavity 209, and then driving the sealing plate 205 to move in the sealing groove 202 through the air compression plate 204 to adjust the position of the through hole 206, so that the air pump 208 is connected to the inside of the body housing 1 through the ventilation hole 201. When the pressure sensor senses that the air compression spring 212 is compressed to the limit, the indicator light on the operation panel 3 will light up, indicating that the sliding frame 1201 has completely entered the body housing 1 and the inside of the body housing 1 is a sealed space. At this time, the lighting lamp inside the body housing 1 is turned on, and the chip can be illuminated for easy observation and coating. Then, the lifting rod 5 lowers the backing plate 6 to bring the microscope 7 close to the chip for observation, and the peristaltic pump 8 is controlled through the operation panel 3 to coat the silicone grease in the silicone grease bin 4 onto the chip through the spraying port 9. After the sliding frame 1201 completely enters the body housing 1, the air pump 208 is started, and the air inside the body housing 1 can be pumped out. When the air flows, the dust that may adhere to the chip can be peeled off for dust removal. During coating, the air pump 208 continuously pumps air, and the bubbles in the silicone grease coated on the chip can be pumped out to avoid bubbles in the silicone grease affecting the coating effect. During the process of pulling the sliding frame 1201 out of the body housing 1, the air compression spring 212 will drive the pressure plate 211 to reset, thereby pumping the air in the ventilation cavity 209 back into the airbag 210, making the sealing plate 205 return to its original position, closing the ventilation hole 201 connecting the air pump 208, and opening the ventilation hole 201 on the other side. The outside air can enter the body housing 1 through the ventilation hole 201, and the dust-proof net 207 can prevent dust from entering the body housing 1. In summary, when in use, the chip can be placed in a sealed space, and the air inside the device can be pumped out to remove the bubbles in the silicone grease, ensure the coating effect, and avoid dust from adhering to the chip.

[0029] Please refer to Figures 3 to 7, a limiting rod 10 is symmetrically connected inside the body housing 1, and a sliding opening 11 is provided on the front side of the body housing 1. A conveying assembly 12 is arranged inside the sliding opening 11, and locking assemblies 13 are symmetrically arranged on both sides of the sliding opening 11. The conveying assembly 12 includes a sliding frame 1201, a limiting plate 1202, a pressing block 1203, a pulling plate 1204, an insertion hole 1205, a sliding groove 1206 and an inner frame 1207. The sliding frame 1201 is slidably connected inside the sliding opening 11, and a limiting plate 1202 is connected to one side of the sliding frame 1201. The other side of the limiting plate 1202 is connected to a pressing block 1203. The other side of the sliding frame 1201 is connected to a pulling plate 1204, and insertion holes 1205 are symmetrically formed on the outer side of the sliding frame 1201. Sliding grooves 1206 are symmetrically formed inside the sliding frame 1201, and an inner frame 1207 is snap-fitted and slidably connected between the sliding grooves 1206. The limiting plate 1202 is slidably connected to the limiting rod 10. The conveying assembly 12 further includes a sliding rail 1208, a material placing frame 1209, a longitudinal adjusting rod 1210, a sliding plate 1211, a moving groove 1212 and a moving cavity 1213. Sliding rails 1208 are symmetrically formed inside the inner frame 1207, and a material placing frame 1209 is snap-fitted and slidably connected between the sliding rails 1208. The lower part of the material placing frame 1209 is threadedly connected to a longitudinal adjusting rod 1210, and a sliding plate 1211 is rotatably connected to one side of the longitudinal adjusting rod 1210. Moving grooves 1212 are formed on both the sliding frame 1201 and the pulling plate 1204, and a moving cavity 1213 is arranged in the middle of the moving groove 1212 on the pulling plate 1204. The longitudinal adjusting rod 1210 is rotatably connected to the inner frame 1207, and the longitudinal adjusting rod 1210 is slidably connected to the sliding frame 1201 and the pulling plate 1204 through the moving groove 1212. The sliding plate 1211 is snap-fitted and slidably connected to the moving cavity 1213. The conveying assembly 12 further includes a transmission cavity 1214, a transmission gear 1215, a rotating rod 1216, a driving wheel 1217, a transmission wheel 1218 and a transverse adjusting rod 1219. A transmission cavity 1214 is arranged on one side of the sliding frame 1201, and two transmission gears 1215 are rotatably connected inside the transmission cavity 1214. A rotating rod 1216 is connected to the middle of the transmission gear 1215 on one side of the transmission cavity 1214, and a driving wheel 1217 is connected to one side of the transmission gear 1215 on the other side of the transmission cavity 1214. A transmission wheel 1218 is arranged on one side of the driving wheel 1217, and a transverse adjusting rod 1219 is connected to the middle of the transmission wheel 1218. The transverse adjusting rod 1219 is threadedly connected to the inner frame 1207. The locking assembly 13 includes a locking cavity 1301, an insertion block 1302, a locking spring 1303 and a push-pull rod 1304. Locking cavities 1301 are symmetrically arranged on both sides of the sliding opening 11 of the body housing 1, and an insertion block 1302 is snap-fitted and slidably connected inside the locking cavity 1301. A locking spring 1303 is connected to one side of the insertion block 1302, and a push-pull rod 1304 is arranged on the other side of the insertion block 1302. The insertion block 1302 is snap-fitted and connected to the sliding frame 1201 through the insertion hole 1205;

[0030] The specific operation is as follows. When in use, after placing the chip into the material placing frame 1209 and fixing it, slide the sliding frame 1201 in the sliding port 11 and push the sliding frame 1201 into the body housing 1, then the chip can be moved into the body housing 1 for waiting to be observed and coated. When the sliding frame 1201 moves, the limiting plate 1202 can limit the sliding frame 1201 through the limiting rod 10 to prevent the sliding frame 1201 from tilting. After the sliding frame 1201 completely enters the body housing 1, the insertion block 1302 can be inserted into the insertion hole 1205 under the action of the locking spring 1303 to fix the sliding frame 1201 and prevent the chip from shifting due to the movement of the sliding frame 1201 during observation and coating. At the same time, the pull-out plate 1204 can seal the sliding port 11 to prevent external air from entering through the sliding port 11. After the observation and coating are completed, pull the push rod 1304 to draw the insertion block 1302 into the locking cavity 1301 from the insertion hole 1205 and compress the locking spring 1303, then the restriction of the insertion block 1302 on the sliding frame 1201 can be released, and the sliding frame 1201 can be completely pulled out of the body housing 1 to take out the chip. At this time, the limiting plate 1202 can seal the sliding port 11 to prevent external air carrying dust from entering the body housing 1 through the sliding port 11. In summary, during use, the sliding frame 1201 can be fixed to prevent the chip from shifting due to the movement of the sliding frame 1201, and external dust can be prevented from entering the body housing 1 through the sliding port 11. When observing the chip, the chip can be moved to adjust the observation position. When moving the chip, rotate the longitudinal adjustment rod 1210, and the material placing frame 1209 can be driven to move back and forth in the inner frame 1207 through the sliding rail 1208, so as to longitudinally adjust the position of the chip. Rotate the rotating rod 1216, and the driving gear 1215 can drive the driving wheel 1217 to rotate in the transmission cavity 1214, so that the transmission wheel 1218 drives the transverse adjustment rod 1219 to rotate, and the inner frame 1207 moves left and right in the sliding frame 1201 through the sliding groove 1206, thereby transversely adjusting the position of the chip. When the inner frame 1207 moves, it can drive the longitudinal adjustment rod 1210 to move on the pull-out plate 1204 and the sliding frame 1201 through the moving groove 1212, preventing the inner frame 1207 from being unable to move due to interference. When the longitudinal adjustment rod 1210 moves in the moving groove 1212, it can drive the sliding plate 1211 to move in the moving cavity 1213, so that the moving plate keeps the moving groove 1212 closed while not hindering the movement of the longitudinal adjustment rod 1210, preventing air from entering the body housing 1 through the moving groove 1212. In summary, during use, the position of the chip can be adjusted conveniently and the interior of the body housing 1 can be kept sealed.

[0031] In summary, for the local coating device of the chip that avoids the generation of air bubbles, during use, first place the chip in and fix it in the material placement frame 1209, and then slide the sliding frame 1201 in the sliding port 11 to push the sliding frame 1201 into the body shell 1, so that the chip can be moved into the body shell 1 for observation and coating. When the sliding frame 1201 moves, the limiting plate 1202 can limit the sliding frame 1201 through the limiting rod 10 to prevent the sliding frame 1201 from skewing. After the sliding frame 1201 completely enters the body shell 1, the insertion block 1302 can be inserted into the insertion hole 1205 under the action of the locking spring 1303 to fix the sliding frame 1201 and prevent the chip from shifting due to the movement of the sliding frame 1201 during observation and coating. At the same time, the pull-out plate 1204 can seal the sliding port 11 to prevent external air from entering through the sliding port 11. After pushing the sliding frame 1201 into the body shell 1, the pressing block 1203 can apply pressure to the pressure plate 211 and compress the air pressure spring 212, thereby squeezing the airbag 210 and squeezing the air in the airbag 210 into the ventilation cavity 209, so that the air pressure plate 204 drives the sealing plate 205 to move in the sealing groove 202 to adjust the position of the through hole 206, enabling the air pump 208 to communicate with the inside of the body shell 1 through the ventilation hole 201. When the pressure sensor senses that the air pressure spring 212 is compressed to the limit, the indicator light on the operation panel 3 will light up, indicating that the sliding frame 1201 has completely entered the body shell 1 and the inside of the body shell 1 is a sealed space. At this time, the lighting lamp inside the body shell 1 is turned on, and the chip can be illuminated for easy observation and coating. Then, the lifting rod 5 lowers the cushion plate 6 to bring the microscope 7 closer to the chip for observation. When observing the chip, the chip can be moved to adjust the observation position. When moving the chip, rotate the longitudinal adjustment rod 1210, which can drive the material placement frame 1209 to move back and forth in the inner frame 1207 through the sliding rail 1208, thereby longitudinally adjusting the position of the chip. By rotating the rotating rod 1216, the driving gear 1215 can drive the driving wheel 1217 to rotate in the transmission cavity 1214, so that the transmission wheel 1218 drives the transverse adjustment rod 1219 to rotate, causing the inner frame 1207 to move left and right in the sliding frame 1201 through the sliding groove 1206, and further transversely adjusting the position of the chip. When the inner frame 1207 moves, it can drive the longitudinal adjustment rod 1210 to move on the pull-out plate 1204 and the sliding frame 1201 through the moving groove 1212, preventing the inner frame 1207 from being unable to move due to interference. When the longitudinal adjustment rod 1210 moves in the moving groove 1212, it can drive the sliding plate 1211 to move in the moving cavity 1213, enabling the moving plate to keep the moving groove 1212 closed while not hindering the movement of the longitudinal adjustment rod 1210 and preventing air from entering the body shell 1 through the moving groove 1212. Then, control the peristaltic pump 8 through the operation panel 3 to coat the silicone grease in the silicone grease bin 4 onto the chip through the spraying port 9. After the sliding frame 1201 completely enters the body shell 1,When the air pump 208 is started, the air inside the body housing 1 can be pumped out. When the air flows, the dust that may adhere to the chip can be peeled off for dust removal. During coating, the air pump 208 continuously pumps air, and the air bubbles in the silicone grease coated on the chip can be pumped out to avoid the influence of air bubbles in the silicone grease on the coating effect. After observation and coating are completed, by pulling the push rod 1304, the insertion block 1302 is drawn into the locking cavity 1301 from the insertion hole 1205 and the locking spring 1303 is compressed, the restriction of the insertion block 1302 on the sliding frame 1201 can be released, and then the sliding frame 1201 can be completely pulled out of the body housing 1 to take out the chip. At this time, the limit plate 1202 can close the sliding port 11 to prevent external air carrying dust from entering the body housing 1 through the sliding port 11. During the process of pulling the sliding frame 1201 out of the body housing 1, the air compression spring 212 will drive the pressure plate 211 to reset, so as to pump the air in the ventilation cavity 209 back into the airbag 210, making the sealing plate 205 return to its original position, closing the ventilation hole 201 communicating with the air pump 208, and opening the ventilation hole 201 on the other side. Then, the external air can enter the body housing 1 through the ventilation hole 201, and the dust-proof net 207 can prevent dust from entering the body housing 1.,

[0032] The embodiments of the present invention are given for purposes of illustration and description, and are not intended to be exhaustive or to limit the invention to the disclosed form. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are chosen and described in order to better explain the principles of the invention and its practical application, and to enable those of ordinary skill in the art to understand the invention and design various embodiments with various modifications suitable for specific purposes.

Claims

1. A chip local coating device for avoiding bubble generation, characterized in that: The invention comprises a machine body shell (1) and a ventilation assembly (2), wherein the ventilation assembly (2) is arranged on a side wall of the machine body shell (1), and an operation panel (3) is arranged on the machine body shell (1), wherein the ventilation assembly (2) comprises a ventilation hole (201), a sealing groove (202), an air pressure groove (203), an air pressure plate (204), a sealing plate (205), a through hole (206), a dust screen (207) and an air pump (208), and the ventilation holes (201) are symmetrically arranged on both sides of the machine body shell (1), and the ventilation holes (201) A sealing groove (202) is provided in the middle, a compressed air groove (203) is provided on one side of the sealing groove (202), and a compressed air plate (204) is provided in the compressed air groove (203), a sealing plate (205) is connected to one side of the compressed air plate (204), and a through hole (206) is provided on the surface of the sealing plate (205), a dustproof net (207) is connected to the air vent (201) on one side of the machine body shell (1), and an air pump (208) is connected to one side of the air vent (201) on the other side of the machine body shell (1) through a pipeline.

2. A chip local coating device for avoiding bubble generation according to claim 1, characterized in that: The ventilation assembly (2) further comprises a ventilation cavity (209), an air bag (210), a pressure plate (211) and a gas pressure spring (212); the ventilation cavity (209) is arranged on the rear side of the housing (1), and the air bag (210) is arranged in the ventilation cavity (209); one side of the air bag (210) is connected to the pressure plate (211), and the two sides of the pressure plate (211) are symmetrically connected to the gas pressure springs (212).

3. A chip local coating device for avoiding bubble generation according to claim 2, characterized in that: The through holes (206) are distributed alternately on the two sealing plates (205), and the sealing plates (205) are slidably connected to the machine body shell (1) through the sealing grooves (202), the air pressure plate (204) is slidably connected to the air pressure groove (203) by snapping, and the air pressure groove (203) is connected to the air bag (210) through a pipeline, the pressure plate (211) is elastically connected to the machine body shell (1) through an air pressure spring (212), and a pressure sensor is arranged inside the air pressure spring (212), and the pressure sensor is connected to the operation panel (3) through a line, and an illumination lamp is arranged inside the machine body shell (1).

4. A chip local coating device for avoiding bubble generation according to claim 1, characterized in that: A silicone grease bin (4) is provided in the middle of the upper part of the body shell (1), and lifting rods (5) are symmetrically connected to both sides of the upper part of the body shell (1), the lower ends of the lifting rods (5) are connected to a pad (6), and a microscope (7) is provided on one side of the pad (6), and the microscope (7) is connected to the operation panel (3) through a circuit.

5. A chip local coating device for avoiding bubble generation according to claim 4, characterized in that: A peristaltic pump (8) is provided on the other side of the pad (6), and a spray port (9) is provided on the other side of the peristaltic pump (8). The peristaltic pump (8) is connected to the silicone grease bin (4) through a hose, and the peristaltic pump (8) is connected to the operation panel (3) through a line.

6. A chip local coating device for avoiding bubble generation according to claim 1, characterized in that: A limiting rod (10) is symmetrically connected inside the machine body shell (1), and a sliding opening (11) is arranged on the front side of the machine body shell (1), a conveying component (12) is arranged inside the sliding opening (11), and locking components (13) are symmetrically arranged on both sides of the sliding opening (11).

7. A chip local coating device for avoiding bubble generation according to claim 6, characterized in that: The conveying assembly (12) comprises a sliding frame (1201), a limiting plate (1202), a pressing block (1203), a pull-out plate (1204), an insertion hole (1205), a sliding groove (1206) and an inner frame (1207); the sliding frame (1201) is slidably connected inside the sliding opening (11); one side of the sliding frame (1201) is connected to the limiting plate (1202); the other side of the limiting plate (1202) is connected to the pressing block (1203); the other side of the sliding frame (1201) is connected to the pull-out plate (1204); the insertion holes (1205) are symmetrically provided on the outer side of the sliding frame (1201); the sliding grooves (1206) are symmetrically provided on the inner side of the sliding frame (1201); the inner frame (1207) is slidably connected between the sliding grooves (1206); the limiting plate (1202) is slidably connected to the limiting rod (10).

8. A chip local coating device for avoiding bubble generation according to claim 7, characterized in that: The conveying assembly (12) further comprises a sliding rail (1208), a material placing frame (1209), a longitudinal adjustment rod (1210), a sliding plate (1211), a moving groove (1212) and a moving cavity (1213); the sliding rail (1208) is symmetrically provided on the inner side of the inner frame (1207); the material placing frame (1209) is slidably connected between the sliding rails (1208); the longitudinal adjustment rod (1210) is threadedly connected to the lower part of the material placing frame (1209); and the sliding plate (1211) is rotatably connected to one side of the longitudinal adjustment rod (1210). The inner frame (1207) is provided with a plate (1211), the sliding frame (1201) and the pull-out plate (1204) are both provided with a movable groove (1212), and the pull-out plate (1204) is provided with a movable cavity (1213) in the middle of the movable groove (1212), the longitudinal adjustment rod (1210) is rotatably connected to the inner frame (1207), and the longitudinal adjustment rod (1210) is slidably connected to the sliding frame (1201) and the pull-out plate (1204) through the movable groove (1212), and the sliding plate (1211) is slidably connected to the movable cavity (1213) by snap-fitting.

9. A chip local coating device for avoiding bubble generation according to claim 8, characterized in that: The conveying assembly (12) further comprises a transmission chamber (1214), a transmission gear (1215), a rotating rod (1216), a power wheel (1217), a transmission wheel (1218) and a transverse adjustment rod (1219); a transmission chamber (1214) is provided on one side of the sliding frame (1201); two transmission gears (1215) are rotatably connected in the transmission chamber (1214); a rotating rod (1216) is connected to the middle of the transmission gear (1215) on one side of the transmission chamber (1214); a power wheel (1217) is connected to one side of the transmission gear (1215) on the other side of the transmission chamber (1214); a transmission wheel (1218) is provided on one side of the power wheel (1217); a transverse adjustment rod (1219) is connected to the middle of the transmission wheel (1218); and the transverse adjustment rod (1219) is threadedly connected to the inner frame (1207).

10. The chip local coating device for avoiding bubble generation according to claim 7, characterized in that: The locking assembly (13) comprises a locking cavity (1301), an insertion block (1302), a locking spring (1303) and a push-pull rod (1304); the body shell (1) is symmetrically provided with locking cavities (1301) on both sides of the sliding opening (11); and an insertion block (1302) is slidably connected in the locking cavity (1301); one side of the insertion block (1302) is connected with a locking spring (1303), and the other side of the insertion block (1302) is provided with a push-pull rod (1304); the insertion block (1302) is snap-connected with the sliding frame (1201) through an insertion hole (1205).

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