Semi-automatic edge grinding equipment and edge grinding method

Abstract

The invention discloses semi-automatic edge grinding equipment and an edge grinding method, and the semi-automatic edge grinding equipment comprises a supporting body which is used for arranging a limiting system, a grinding system and an angle adjusting system; the limiting system comprises a limiting scale table and a limiting plate, a first rectangular through hole and a plurality of limiting grooves parallel to the first rectangular through hole are formed in the limiting scale table, the first rectangular through hole is used for arranging a limiting screw, and the limiting screw is used for enabling the limiting scale table to move relative to the base plate in the first direction; the limiting plate is provided with a plurality of limiting blocks matched with the limiting grooves, and the limiting blocks are used for enabling the limiting plate to move relative to the limiting scale table in the first direction; the grinding system comprises a gear motor, a connecting shaft and a grinding plate; and the angle adjusting system comprises a pointer, an angle plate and an elastic screw. According to the edge grinding device, the problems of inconsistent edge angles and unequal depths in the edge grinding process are solved, and the working efficiency is improved.

Description

Technical Field

[0001] This application relates to the technical field of substrate wafer processing, and particularly to a semi-automatic edge grinding device and an edge grinding method. Background Art

[0002] Cadmium telluride substrates are usually used in refrigerated infrared detectors. The substrate is mainly the substrate for epitaxial layer growth, and plays a role in supporting, fixing, and material property matching during the production and manufacturing process. During the processing of the substrate, the wafer needs to be processed by corrosion, grinding, polishing, epitaxy, die splitting, etc.

[0003] Currently, in the conventional edge grinding process, there are generally two methods: manual edge grinding and automatic edge grinding. In the manual edge grinding method, the substrate wafer is placed on the sandpaper for edge grinding. Among them, the angle and force can only be controlled by the operator's experience. When holding the substrate and grinding it on the sandpaper, the two sides of the substrate are unevenly stressed, which poses a certain risk of die splitting for brittle materials. At the same time, when manually grinding the edge, it is impossible to keep the angle and parallelism completely consistent when holding the substrate. Therefore, the edges of the processed substrates will have inconsistent angles and different depths, and in more serious cases, it will affect the subsequent processing. The automatic edge grinding method is to place the substrate wafer to be ground on the stage, and enter the shape of the substrate wafer into the system by scanning. Then, the grinding tool performs multiple circumferential grindings on the substrate wafer from the outside to the inside according to the path automatically generated in the system. The automatic edge grinding method has better effects than the manual edge grinding method and can meet the grinding requirements of various shapes, but there are problems of low efficiency and high equipment cost, and the prior art cannot solve this problem. Summary of the Invention

[0004] In order to solve the problems existing in the prior art, this application provides a semi-automatic edge grinding device and an edge grinding method.

[0005] The present application provides a semi-automatic edging device, including: a support body for setting a limit system, a grinding system and an angle adjustment system, the support body including a substrate and a bracket, the bracket being disposed on the surface of the substrate; a limit system, the limit system including a limit scale table and a limit plate, the limit scale table being provided with a first rectangular through hole along a first direction and a plurality of limit grooves parallel thereto, the first rectangular through hole being used for setting a limit screw, the limit screw being used to move the limit scale table relative to the substrate along the first direction, the limit plate being provided with a plurality of limit blocks matching the limit grooves, the limit blocks being used to move the limit plate relative to the limit scale table along the first direction; a grinding system, the grinding system including a reduction motor, a connecting shaft and a grinding plate, the reduction motor being disposed on the bracket, the grinding plate being connected to the reduction motor through the connecting shaft; an angle adjustment system, the angle adjustment system including a pointer, an angle plate and a tightening screw, the pointer being fixedly connected to the reduction motor, the angle plate being fixed on the bracket for determining the moving angle of the reduction motor.

[0006] Optionally, a reference line is provided on a side of the substrate parallel to the first direction, a scale is provided on a side of the limit scale table corresponding to the reference line, and the length of the reading area of the scale is greater than the moving distance of the limit scale table on the substrate.

[0007] Optionally, the length of the limit block in the first direction is less than the length of the limit groove in the first direction.

[0008] Optionally, a second rectangular through hole is provided on the limit plate, the width of the second rectangular through hole is greater than the diameter of the limit screw, and the position of the second rectangular through hole corresponds to the position of the first rectangular through hole.

[0009] Optionally, a reference card strip is provided on a side of the limit plate close to the grinding plate for fixing the device to be edged on the limit plate.

[0010] Optionally, the bracket includes two columns and a cross bar fixed between the columns, and the reduction motor is rotatably fixed on the cross bar through a tightening screw.

[0011] Optionally, the rotation speed range of the reduction motor is 0 - 100 r / min.

[0012] Optionally, the grinding plate is disposed perpendicular to the connecting shaft.

[0013] The present application also provides an edge grinding method using the above semi-automatic edge grinding device, including the steps of: adjusting the angle of the grinding plate to a preset edge grinding angle; inserting the limiting plate with the device to be edge ground fixed thereon into the limiting scale table, and moving the limiting plate along the first direction until the limiting plate is relatively fixed with the limiting scale table; loosening the limiting screw, moving the relatively fixed limiting plate and limiting scale table in the first direction until the device to be edge ground contacts the grinding plate, and recording the first relative position between the limiting scale table and the substrate; removing the limiting plate with the device to be edge ground fixed thereon, moving the limiting scale table in the first direction to a second relative position according to the preset edge grinding depth, and fixing the limiting scale table and the substrate through the limiting screw; inserting the limiting plate with the device to be edge ground fixed thereon into the limiting scale table, and moving along the first direction to perform the edge grinding operation; repeating the operation on the remaining part to be edge ground of the device to be edge ground until the edge grinding is completed.

[0014] Optionally, a reference line is provided on a side of the substrate parallel to the first direction, a scale is provided on a side of the limiting scale table corresponding to the reference line, the length of the reading area of the scale is greater than the moving distance of the limiting scale table on the substrate, and the reference line and the scale are used to obtain the first relative position and the second relative position.

[0015] Compared with the prior art, the technical solution of the present application has the following beneficial effects:

[0016] The semi-automatic edge grinding device and edge grinding method provided by the present application can control the edge grinding effect by adjusting the positions of the limiting system and the grinding system. After fixing the position of the limiting scale table of the limiting system, only the limiting plate needs to be moved to complete the edge grinding operation of the backing film. In batch edge grinding operations, it is not necessary to repeatedly adjust the positions of the limiting system and the grinding system, which can ensure that the edge grinding degree is basically the same and improve the efficiency of edge grinding of the backing film; further, by adjusting the angle of the grinding plate through the angle adjustment system, different chamfering angles can be obtained, and fixing the angle can ensure that the edge grinding angle is the same each time; placing the backing film flat on the limiting plate for edge grinding operations can provide a certain rigid support for the backing film, reduce the risk of edge grinding cracking, and the extremely low equipment cost improves the cost performance of edge grinding. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0018] Figure 1Schematic three-dimensional structure diagram of a semi-automatic edge grinding device in an embodiment of the present application;

[0019] Figure 2 Schematic connection diagram of the limit scale table and the substrate of a semi-automatic edge grinding device in an embodiment of the present application;

[0020] Figure 3 Schematic connection diagram of the limit plate and the limit scale table of a semi-automatic edge grinding device in an embodiment of the present application;

[0021] Figure 4 Schematic relative position diagram of the scale on the limit scale table and the reference line on the substrate in an embodiment of the present application;

[0022] Figure 5 Schematic result diagram of the angle adjustment system of a semi-automatic edge grinding device in an embodiment of the present application;

[0023] Figure 6 Schematic flow diagram of an edge grinding method using the above semi-automatic edge grinding device in an embodiment of the present application;

[0024] Figure 7 Schematic diagram of the edge grinding process of a semi-automatic edge grinding device in an embodiment of the present application. Detailed implementation manners

[0025] The preferred embodiments of the present application will be described in more detail below. Although the preferred embodiments of the present application are described below, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments set forth herein.

[0026] In the present application, unless otherwise stated, the orientation terms such as "upper, lower" generally refer to the upper and lower of the device in the normal use state, and "inner, outer" refer to the inside and outside relative to the contour of the device. In addition, the terms "first, second, third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first, second, third" may explicitly or implicitly include one or more of such features. In the description of the present application, the meaning of "a plurality" is two or more unless otherwise specifically defined. Since the drawings are descriptions of the same device, the same reference numerals in the drawings represent the same components.

[0027] As described in the background art, in the current conventional edge grinding process, it is generally divided into two methods: manual edge grinding and automatic edge grinding. When manually grinding the edge of a substrate on sandpaper, the forces on both sides of the substrate are uneven, resulting in inconsistent angles and varying depths at the edges of the processed substrate. In more severe cases, it will affect subsequent processing. Compared with manual edge grinding, the automatic edge grinding method has better results and can meet the grinding requirements of various shapes, but it has problems such as low efficiency and expensive automatic edge grinding equipment.

[0028] Therefore, the present application provides a semi-automatic edge grinding device and an edge grinding method, which can effectively solve the above problems and improve work efficiency.

[0029] The present application provides a semi-automatic edge grinding device, including: a support body for setting a limit system, a grinding system, and an angle adjustment system. The support body includes a substrate and a bracket, and the bracket is arranged on the surface of the substrate; a limit system, which includes a limit scale table and a limit plate. The limit scale table is provided with a first rectangular through hole in a first direction and a plurality of limit grooves parallel thereto. The first rectangular through hole is used to set a limit screw, and the limit screw is used to move the limit scale table relative to the substrate in the first direction. The limit plate is provided with a plurality of limit blocks matching the limit grooves, and the limit blocks are used to move the limit plate relative to the limit scale table in the first direction; a grinding system, which includes a reduction motor, a connecting shaft, and a grinding plate. The reduction motor is arranged on the bracket, and the grinding plate is connected to the reduction motor through the connecting shaft; an angle adjustment system, which includes a pointer, an angle plate, and a tightening screw. The pointer is fixedly connected to the reduction motor, and the angle plate is fixed on the bracket for determining the moving angle of the reduction motor.

[0030] The following further details the specific examples of the present application with reference to the accompanying drawings.

[0031] The present application provides a semi-automatic edge grinding device, as Figure 1 shown. The semi-automatic edge grinding device includes a support body, a limit system, a grinding system, and an angle adjustment system. Among them, the moving direction of the device to be edge-ground during the edge grinding process is the first direction.

[0032] Specifically, the support body includes a substrate 41 and a bracket. The bracket is arranged on the surface of the substrate 41 and includes two support columns 42 and a crossbar 43 fixed between the support columns. The support body is used to set the limit system, the grinding system, and the angle adjustment system.

[0033] The grinding system includes a reduction motor 11, a connecting shaft 12, and a grinding plate 13. The grinding plate 13 is arranged perpendicular to the connecting shaft 12 to ensure that there is no jitter when the grinding plate rotates. The grinding plate 13 is connected to the reduction motor 11 through the connecting shaft 12, and the reduction motor 11 is fixed on the crossbar 43 of the bracket by a tightening screw 33. By adjusting the angle of the reduction motor 11, different edge grinding angles can be obtained. Fixing the angle can ensure that the edge grinding angle is consistent each time.

[0034] In some embodiments, the material of the grinding plate can be vegetable flannel sandpaper, diamond sandpaper, grinding discs, etc.

[0035] The limiting system includes a limiting scale table 21, a limiting plate 22, and a limiting screw 23. The limiting screw 23 fixes the limiting scale table 21 on the substrate 41. During use, when the limiting screw 23 is loosened, the limiting scale table 21 can move relative to the substrate 41. When the limiting screw 23 is tightened, the limiting scale table 21 and the substrate 41 can be relatively fixed.

[0036] In an embodiment of the present application, Figure 2 is a schematic diagram of the connection relationship between the limiting scale table and the substrate, Figure 3 is a schematic diagram of the connection relationship between the limiting plate and the limiting scale table. Combining Figure 2 - Figure 3 , a first rectangular through hole 211 along a first direction is provided on the limiting scale table 21, and a limiting screw hole is provided on the substrate 41. The limiting screw hole and the first rectangular through hole 211 are used to set the limiting screw 23, so that the limiting scale table 21 can move on the substrate 41 along the first direction. Specifically, since the length direction of the first rectangular through hole 211 is the first direction, when the limiting screw 23 is tightened, the limiting scale table 21 and the substrate 41 are relatively fixed by extrusion; when the limiting screw 23 is loosened, the limiting scale table 21 can move relative to the substrate 41 along the length direction of the first rectangular through hole 211, that is, the limiting scale table 21 can move relative to the substrate 41 along the first direction.

[0037] A plurality of limiting grooves 212 parallel to the first rectangular through hole 211 are also provided on the limiting scale table 21. Referring to Figure 3 , a plurality of limiting blocks 223 matching the limiting grooves 212 are provided on the side of the limiting plate opposite to the limiting scale table 21. The limiting blocks 223 are used to be embedded in the limiting grooves 212. Among them, the length of the limiting blocks 223 in the first direction is less than the length of the limiting grooves 212 in the first direction, so that the limiting plate 22 moves relative to the limiting scale table 21 along the first direction, that is, the limiting blocks 223 can move in the limiting grooves 212 along the first direction, but the moving range is limited by the limiting grooves 212.

[0038] In some embodiments, the limit screw fixes the limit scale table to the substrate. At this time, the position of the limit groove is fixed, so that the movement range of the limit block is restricted, thus achieving the purpose of controlling the depth of edge grinding. When the position of the limit scale table is changed, the movement range of the limit block is changed, and the depth of edge grinding naturally changes.

[0039] In a specific embodiment, as Figure 3 shown, a reference card strip 222 is further provided on one side of the surface of the limit plate 22 close to the grinding plate 13, which is used to fix the device to be edge-ground on the limit plate, and can ensure the stability of edge grinding during the edge grinding process.

[0040] In an embodiment of the present application, as Figure 1 shown, a second rectangular through hole 221 is provided on the limit plate 22, and the position of the second rectangular through hole 221 corresponds to the position of the first rectangular through hole. The width of the second rectangular through hole 221 is greater than the diameter of the limit screw 23, which ensures that after the limit screw 23 fixes the limit scale table 21 and the substrate 41, the limit plate 22 can still slide normally on the limit scale table 21 along the first direction.

[0041] Referring to Figure 4 , in an embodiment of the present application, a reference line 411 is provided on a side edge of the substrate 41 parallel to the first direction, and a scale 213 is provided on a side edge of the limit scale table 21 corresponding to the reference line 411. The reference line 411 and the scale 213 numerically represent the edge grinding effect, and can adjust the edge grinding depth according to different processing requirements and unify the edge grinding depth each time, which is convenient for the staff to learn and standardize after production. Specifically, when the limit scale table 21 moves, a relative displacement is generated between the scale 213 and the reference line 411, and the reading is obtained by combining the numerical difference aligned by the reference line 411 before and after the movement. The length of the reading area of the scale 213 is greater than the moving distance of the limit scale table 21 on the substrate 41. The reference line 411 and the scale 213 cooperate to jointly determine the relative position of the limit scale table and the substrate, and then adjust the depth of edge grinding, which can ensure that the edge grinding degree is basically the same in batch edge grinding operations and improve the edge grinding efficiency.

[0042] The position of the limit system and the grinding system of the semi-automatic edge grinding device ensures that each edge grinding meets the processing requirements and has consistent and controllable effects, avoiding the situation that the edge grinding effects are different or even the edge disappears in subsequent processing; at the same time, the limit system of the semi-automatic edge grinding device has a simple structure, does not need to be repeatedly positioned like an automatic edge grinding device after zeroing and positioning, and the equipment cost is relatively low.

[0043] In an embodiment of the present application, referring to Figure 1 and Figure 5, the angle adjustment system includes a pointer 31, an angle plate 32, and a tension screw 33. The angle plate 32 is fixed on the cross bar 43, and the reduction motor 11 is rotatably fixed on the cross bar 43 through the tension screw 33. The pointer 31 is fixed together with the reduction motor 11. After loosening the tension screw 33, rotate the reduction motor 11. The reduction motor 11 can be adjusted to different angles with the cross bar 43 as the axis. Before starting the edge grinding, by changing the angle of the reduction motor 11, the angle of the grinding plate can be adjusted, so as to obtain different edge grinding angles and fix them, and the angle remains consistent during the edge grinding process.

[0044] In some embodiments, the rotational speed range of the reduction motor is 0 - 100 r / min.

[0045] This application also provides an edge grinding method using the above semi-automatic edge grinding equipment, and the specific steps are as Figure 6 shown, in combination with Figure 6 - Figure 7 , the method for opening holes in the passivation layer of the mercury cadmium telluride chip includes the following steps:

[0046] S1: Adjust the angle of the grinding plate to a preset edge grinding angle.

[0047] First, unscrew the tension screw, rotate the reduction motor with the cross bar as the axis, and read the target angle through the pointer and the angle plate, so as to adjust the angle of the grinding plate to a preset edge grinding angle. After determining the edge grinding angle, tighten the tension screw to fix the angle.

[0048] S2: Insert the limit plate fixed with the device to be edge ground into the limit scale table, and move the limit plate along the first direction until the limit plate is relatively fixed with the limit scale table.

[0049] Specifically, place the device 100 to be edge ground on the limit plate and press the edge to be ground tightly against the reference strip. Then, place the side of the limit plate with the limit block facing down on the limit scale table, so that the limit block is aligned and inserted into the limit groove. Then, since the length of the limit block in the first direction is less than the length of the limit groove in the first direction, the limit plate can move relative to the limit scale table along the first direction; move the limit plate in the first direction until the limit block abuts against the edge of the limit groove close to the grinding plate, that is, the limit plate is relatively fixed with the limit scale table. At this time, the limit plate and the limit scale table are aligned on the side close to the grinding plate.

[0050] S3: Loosen the limit screw, move the relatively fixed limit plate and limit scale table in the first direction until the device to be edge ground contacts the grinding plate, and record the first relative position between the limit scale table and the substrate.

[0051] In one embodiment of the present application, loosen the limit screw, and move the relatively fixed limit plate and the limit scale table together towards the grinding plate until the device 100 to be edge-ground just contacts the grinding plate. At this time, the scale on the limit scale table and the reference line on the substrate together determine the position of the limit scale table relative to the substrate. Read the reading of the reference line on the scale, which is the first relative position of the limit scale table and the substrate.

[0052] S4: Remove the limit plate fixed with the device to be edge-ground. According to the preset edge-grinding depth, move the limit scale table in the first direction to the second relative position, and fix the limit scale table and the substrate with the limit screw.

[0053] After that, remove the limit plate provided with the device 100 to be edge-ground. According to the preset edge-grinding depth, with the help of the reading of the reference line on the scale, move the limit scale table towards the grinding plate until the change in the reading of the reference line on the scale is the same as the edge-grinding depth, that is, move the limit scale table towards the grinding plate to the second relative position, and tighten the limit screw to fix the limit scale table and the substrate.

[0054] In some embodiments, the length of the reading area of the scale is greater than the moving distance of the limit scale table on the substrate, and the reference line and the scale are used to obtain the first relative position and the second relative position.

[0055] In some embodiments, the first relative position and the second relative position are adjusted according to actual needs, and no limitation is imposed on this in the present application.

[0056] S5: Embed the limit plate fixed with the device to be edge-ground on the limit scale table, and move it along the first direction to perform the edge-grinding operation.

[0057] Specifically, align the limit block of the limit plate with the limit groove, place the limit plate back on the limit scale table, then place the device 100 to be edge-ground on the limit plate and press the edge to be ground tightly against the reference card strip for fixation. Then, move along the first direction, that is, move along the grinding plate, until the limit block reaches the maximum limit of the limit groove, and keep the device 100 to be edge-ground in close contact with the reference card strip during this period to complete one edge-grinding operation.

[0058] In some embodiments, the device to be edge-ground adopts a flat push-in type edge-grinding, which can give a certain rigid support to the device to be edge-ground and reduce the risk of edge-grinding cracking.

[0059] S6: Repeat the operation for the remaining edges to be ground of the device to be edge-ground until the edge-grinding is completed.

[0060] Adjust the position of the device 100 to be edge-ground, replace the device to be edge-ground, and repeat the above steps until the edge-grinding process of all edges of the device 100 to be edge-ground is completed.

[0061] A semi-automatic edge-grinding device and an edge-grinding method provided by the present application can adjust the edge-grinding angle before edge-grinding, and the angle remains consistent during the edge-grinding process; at the same time, the scale and reference line on the side cooperate to adjust the edge-grinding depth according to different processing requirements; further, the device to be edge-ground adopts a flat pushing type edge-grinding, which gives a certain rigid support to the device and reduces the risk of edge-grinding cracking. The semi-automatic edge-grinding device provided by the present application can solve the problem that the angle and parallelism cannot be completely consistent during manual edge-grinding, improve work efficiency, and also reduce the high cost of using an automatic edge-grinding device.

[0062] The above are only the embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, such as the mutual combination of technical features between embodiments, or direct or indirect application in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A semi-automatic edge grinding device, characterized in that: include: A support body, used to set a limit system, a grinding system and an angle adjustment system, the support body comprising a substrate and a bracket, the bracket being arranged on the surface of the substrate; A limit system, the limit system comprising a limit scale platform and a limit plate, the limit scale platform is provided with a first rectangular through hole along a first direction and a plurality of limit slots parallel thereto, the first rectangular through hole is used to set a limit screw, the limit screw is used to make the limit scale platform move along the first direction relative to the substrate, the limit plate is provided with a plurality of limit blocks matching the limit slots, the limit blocks are used to make the limit plate move along the first direction relative to the limit scale platform; A grinding system, the grinding system comprising a reduction motor, a connecting shaft and a grinding plate, the reduction motor being arranged on the bracket, and the grinding plate being connected to the reduction motor through the connecting shaft; An angle adjustment system includes a pointer, an angle plate and a tightening screw. The pointer is fixedly connected to the reduction motor, and the angle plate is fixed on a bracket to determine the moving angle of the reduction motor.

2. The semi-automatic edge grinding device according to claim 1, characterized in that: A reference line is arranged on a side parallel to the first direction on the substrate, a scale is arranged on a side corresponding to the reference line of the limit scale platform, and a length of the scale reading area is greater than a moving distance of the limit scale platform on the substrate.

3. The semi-automatic edge grinding device according to claim 1, characterized in that: The length of the limiting block in the first direction is smaller than the length of the limiting groove in the first direction.

4. The semi-automatic edge grinding device according to claim 1, characterized in that: The limiting plate is provided with a second rectangular through hole, the width of the second rectangular through hole is greater than the diameter of the limiting screw, and the position of the second rectangular through hole corresponds to the position of the first rectangular through hole.

5. The semi-automatic edge grinding device according to claim 1, characterized in that: A reference clamping strip is provided on one side of the surface of the limiting plate close to the grinding plate, and is used to fix the device to be edged on the limiting plate.

6. The semi-automatic edge grinding device according to claim 1, characterized in that: The bracket comprises two pillars and a cross bar fixed between the pillars, and the reduction motor is rotatably fixed on the cross bar by a loose screw.

7. The semi-automatic edge grinding device according to claim 1, characterized in that: The speed range of the reduction motor is 0-100r / min.

8. The semi-automatic edge grinding device according to claim 1, characterized in that: The grinding plate is arranged perpendicular to the connecting axis.

9. An edge grinding method using the semi-automatic edge grinding device according to any one of claims 1 to 8, characterized in that: Includes steps: Adjusting the angle of the grinding plate to a preset grinding angle; Embedding a limit plate on which the device to be edged is fixed on the limit scale platform, and moving the limit plate along a first direction until the limit plate and the limit scale platform are relatively fixed; Loosen the limit screw, move the relatively fixed limit plate and limit scale table in a first direction until the edge grinding component contacts the grinding plate, and record the first relative position of the limit scale table and the substrate; Remove the limit plate fixed with the device to be edged, move the limit scale table in the first direction to a second relative position according to a preset edge grinding depth, and fix the limit scale table and the substrate by a limit screw; The limiting plate on which the device to be edged is fixed is embedded in the limiting scale platform and moved along the first direction to perform the edge grinding operation; Repeat the operation for the remaining edges of the device to be edged until the edge grinding is completed.

10. The edge grinding method according to claim 9, characterized in that: The substrate is provided with a reference line on a side parallel to the first direction, and the limit scale is provided with a scale on a side corresponding to the reference line, the length of the scale reading area is greater than the moving distance of the limit scale on the substrate, and the reference line and the scale are used to obtain the first relative position and the second relative position.

Images