Double-shaft double-workbench precise full-automatic scribing machine

Abstract

The invention provides a double-shaft double-workbench precise full-automatic scribing machine which comprises a machine base, a machine body is installed on the upper surface of the machine base, and a cutting assembly is installed on the machine body; the cutting assembly comprises a first vision module, a Z-axis first driving module and a Z-axis second driving module. And a Y-axis third driving module and a Y-axis fourth driving module are mounted on the front surface of the lathe bed. According to the invention, the first rotary workbench and the second rotary workbench are respectively carried, when the PCB module in the first rotary workbench is processed, the second rotary workbench can carry out operations such as carrying, cleaning and calibration at the same time, and after the PCB module in the first rotary workbench is cut, the PCB module in the second rotary workbench can be cleaned and calibrated. And the second rotary working table immediately enters the cutting station and carries out cutting operation, so that the machining standby time of the cutting main shaft can be shortened, the overall production efficiency is improved, and the cutting machine is particularly suitable for the situation that continuous and large-batch production is needed.

Description

Technical Field

[0001] The invention relates to an automatic dicing machine, in particular to a double-axis double-worktable precision fully automatic dicing machine, belonging to the technical field of dicing machines. Background Art

[0002] The dicing machine is a widely used device in the field of semiconductor manufacturing and processing. It is mainly used to divide wafers or other hard and brittle materials (such as silicon wafers, sapphire substrates, LED substrates, etc.) into smaller unit chips. The working principle of the dicing machine is to use strong grinding or laser irradiation as the dicing mechanism, and the air static pressure electric spindle drives the blade or laser beam to move in a straight line direction with the contact point of the workpiece, so as to split each chip with independent electrical.

[0003] Common dicing machines all use conventional single-axis single-platform, dual-axis single-platform or dual-axis single-platform plus a feeding system for cutting.

[0004] The common dual-axis dicing machines on the market, although they have achieved the technical upgrade of dual-axis cutting, are still generally limited to the design of a single workbench in terms of workbench configuration. This means that when cutting, the entire workbench is fully occupied and is specifically used to carry the LED mini display PCB module to be cut and fixed on the cutting station. However, such a design has a significant efficiency bottleneck:

[0005] When the workbench is in the cutting state, it cannot prepare materials at the same time, that is, it cannot load the next PCB module to be cut or perform other preparations, which leads to a "waiting time". That is, after completing a cut, it is necessary to wait for the workbench to be emptied, reload new materials, and reposition before starting the next cut. This discontinuity in the process directly limits the overall production efficiency, especially when continuous and large-scale production is required, this efficiency loss is particularly obvious;

[0006] Therefore, a dual-axis dual-table precision fully automatic dicing machine is proposed. Summary of the invention

[0007] In view of this, the present invention provides a dual-axis dual-worktable precision fully automatic dicing machine to solve or alleviate the technical problems existing in the prior art and at least provide a beneficial option.

[0008] The technical solution of the embodiment of the present invention is implemented as follows: a dual-axis dual-table precision fully automatic dicing machine, comprising a machine base, a bed is installed on the upper surface of the machine base, and a cutting assembly is installed on the bed;

[0009] The cutting assembly includes a first visual module, a first rotating worktable, a second rotating worktable, a second visual module, a Z-axis first driving module, and a Z-axis second driving module;

[0010] The front surface of the bed is installed with the third Y-axis drive module and the fourth Y-axis drive module, the rear surface of the bed is installed with the second Y-axis drive module and the first Y-axis drive module, the inner bottom wall of the bed is installed with the first X-axis drive module and the second X-axis drive module, the first rotary worktable is installed on the mover of the first X-axis drive module, the second rotary worktable is installed on the mover of the second X-axis drive module, the first Z-axis drive module is installed on the mover of the first Y-axis drive module, the second Z-axis drive module is installed on the mover of the second Y-axis drive module, the first visual module is installed on the mover of the third Y-axis drive module, the second visual module is installed on the mover of the fourth Y-axis drive module, the bottom of the second Z-axis drive module is installed with the second cutting spindle, and the bottom of the first Z-axis drive module is installed with the first cutting spindle.

[0011] Further preferably, a product handling assembly is installed on the front surface of the bed;

[0012] The product handling assembly includes a product Y-axis handling module, a product X-axis handling module, and a material taking suction cup;

[0013] The product Y-axis transport module is installed on the front surface of the bed, the product X-axis transport module is installed on the mover of the product Y-axis transport module, the mover of the product X-axis transport module is fixedly connected with a mounting plate, and the material picking suction cup is installed on the lower surface of the mounting plate.

[0014] Further preferably, a product code scanning reader and a cleaning module are respectively installed on both sides of the mounting plate.

[0015] Further preferably, a material box scanning reader is installed on the mover of the product X-axis transport module.

[0016] Further preferably, a material preparation assembly is installed on the front surface of the bed, and the material preparation assembly includes a material preparation table, a first material pushing module, a material box lifting module, a product positioning module, a material box placement table and a second material pushing module;

[0017] The material box placement platform is installed on the mover of the material box lifting module, the first material pushing module and the second material pushing module are both installed on the lower surface of the material preparation platform, and the product positioning module is installed on the upper surface of the material preparation platform.

[0018] Further preferably, the mover of the first pushing module and the mover of the second pushing module are both located above the material preparation table and correspond to the positions of the material box placement table and the product positioning module.

[0019] Further preferably, the material box lifting module is installed on the lower surface of the material preparation table, and the material preparation table is installed on the front surface of the bed.

[0020] Further preferably, the position of the product X-axis transport module corresponds to the position of the product positioning module.

[0021] Further preferably, a base is installed at the bottom of the bed, and a shell is installed on the upper surface of the base.

[0022] Further preferably, a touch screen is installed on one side of the casing, a warning light is installed on the upper surface of the casing, and an operation window is installed on the front surface of the casing.

[0023] The embodiment of the present invention has the following advantages due to the adoption of the above technical solution:

[0024] The present invention is equipped with a first rotary worktable and a second rotary worktable respectively. When the PCB module in the first rotary worktable is processed, the second rotary worktable can simultaneously perform operations such as transportation, cleaning, and calibration. After the PCB module in the first rotary worktable is cut, the second rotary worktable immediately enters the cutting station and performs the cutting operation, while the PCB module processed in the first rotary worktable can be cleaned, unloaded, and loaded with new materials. The two worktables work alternately, thereby shortening the processing standby time of the cutting spindle and improving the overall production efficiency. The present invention is particularly suitable for situations where continuous and large-scale production is required.

[0025] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 This is a structural diagram of a dual-axis dual-table precision fully automatic dicing machine of the present invention;

[0028] Figure 2 It is a schematic diagram of the installation position of the cutting assembly of the present invention;

[0029] Figure 3It is a schematic diagram of the installation positions of the material preparation component and the product handling component of the present invention;

[0030] Figure 4 It is a structural diagram of the cutting assembly of the present invention;

[0031] Figure 5 It is a structural diagram of the material preparation component of the present invention;

[0032] Figure 6 This is a structural diagram of the product handling component of the present invention.

[0033] Figure numerals: 101, material preparation component; 11, material preparation platform; 12, first material pusher module; 13, material box lifting module; 14, product positioning module; 15, material box placement platform; 16, second material pusher module; 201, product handling component; 21, product Y-axis handling module; 22, product X-axis handling module; 23, material box code scanning reader; 24, product code scanning reader; 25, material suction cup; 26, cleaning module; 27, mounting plate; 301, cutting component; 31, Y-axis third driving module; 32, first visual module Group; 33, X-axis first drive module; 34, X-axis second drive module; 35, first rotary table; 36, second rotary table; 37, second visual module; 38, Y-axis fourth drive module; 39, Y-axis first drive module; 40, Z-axis first drive module; 41, first cutting spindle; 42, Y-axis second drive module; 43, Z-axis second drive module; 44, second cutting spindle; 45, bed; 51, base; 52, operation window; 53, casing; 54, warning light; 55, touch screen. DETAILED DESCRIPTION

[0034] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0035] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0036] In the prior art, when the workbench is in the cutting state, it cannot prepare materials at the same time, that is, it cannot load the next PCB module to be cut or perform other preparation work, which leads to a "waiting time". That is, after completing one cutting, it is necessary to wait for the workbench to be emptied, reload new materials, and reposition before starting the next cutting. This discontinuity in the process directly limits the overall production efficiency, especially when continuous and large-scale production is required, this efficiency loss is particularly obvious;

[0037] For this see Figure 1-Figure 6, the embodiment of the present invention provides a dual-axis dual-table precision automatic dicing machine, including a machine base 51, a bed 45 is installed on the upper surface of the machine base 51, and a cutting assembly 301 is installed on the bed 45;

[0038] The cutting assembly 301 includes a first visual module 32, a first rotating worktable 35, a second rotating worktable 36, a second visual module 37, a Z-axis first driving module 40 and a Z-axis second driving module 43;

[0039] The front surface of the bed 45 is installed with the third Y-axis driving module 31 and the fourth Y-axis driving module 38, the rear surface of the bed 45 is installed with the second Y-axis driving module 42 and the first Y-axis driving module 39, the inner bottom wall of the bed 45 is installed with the first X-axis driving module 33 and the second X-axis driving module 34, the first rotating table 35 is installed on the mover of the first X-axis driving module 33, the second rotating table 36 is installed on the mover of the second X-axis driving module 34, and the Z-axis The first driving module 40 is mounted on the mover of the first driving module 39 of the Y axis, the second driving module 43 of the Z axis is mounted on the mover of the second driving module 42 of the Y axis, the first visual module 32 is mounted on the mover of the third driving module 31 of the Y axis, the second visual module 37 is mounted on the mover of the fourth driving module 38 of the Y axis, the second cutting spindle 44 is mounted on the bottom of the second driving module 43 of the Z axis, and the first cutting spindle 41 is mounted on the bottom of the first driving module 40 of the Z axis;

[0040] The PCB product can be carried by the first rotating worktable 35 and the second rotating worktable 36, and the position of the PCB module can be aligned by the first visual module 32 and the second visual module 37 during the cutting operation;

[0041] The first rotating worktable 35 is moved to the cutting station through the X-axis first driving module 33, that is, the PCB module is moved to the bottom of the first cutting spindle 41, and the Z-axis first driving module 40 is driven by the Y-axis first driving module 39, and the Z-axis first driving module 40 drives the first cutting spindle 41 to move, and the Z-axis second driving module 43 is driven by the Y-axis second driving module 42, and the Z-axis second driving module 43 drives the second cutting spindle 44. The PCB module is cut simultaneously by the two spindles, so that the cutting action of the PCB module can be quickly completed. The PCB module is driven to rotate by the first rotating worktable 35, so that different positions of the PCB module can be cut;

[0042] When the cutting of the PCB module on the first rotary table 35 is completed, the preparation of the PCB module on the second rotary table 36 is completed, and the first rotary table 35 is moved out of the cutting station by the first X-axis driving module 33, and the PCB module on the first rotary table 35 can be cleaned and unloaded. The second X-axis driving module 34 drives the second rotary table 36 to move to the bottom of the second cutting spindle 44 for cutting, and the PCB module on the first rotary table 35 that has been cut can be unloaded and loaded with new materials to be cut;

[0043] In order to solve the problems existing in the prior art, the embodiment of the present invention provides a dual-axis dual-table precision fully automatic dicing machine and solves the problems through the above technical solutions:

[0044] By separately carrying the first rotary worktable 35 and the second rotary worktable 36, when the PCB module in the first rotary worktable 35 is being processed, the second rotary worktable 36 can simultaneously perform operations such as transportation, cleaning, and calibration. When the cutting of the PCB module in the first rotary worktable 35 is completed, the second rotary worktable 36 immediately enters the cutting station and performs the cutting operation, while the processed PCB module in the first rotary worktable 35 can be cleaned, unloaded, and loaded with new materials. The two worktables work alternately, thereby shortening the processing standby time of the cutting spindle and improving the overall production efficiency. This is particularly suitable for situations where continuous and large-scale production is required.

[0045] In one embodiment, a product handling assembly 201 is mounted on the front surface of the bed 45;

[0046] The product handling assembly 201 includes a product Y-axis handling module 21, a product X-axis handling module 22, and a material taking suction cup 25;

[0047] The product Y-axis handling module 21 is installed on the front surface of the bed 45, the product X-axis handling module 22 is installed on the mover of the product Y-axis handling module 21, the mover of the product X-axis handling module 22 is fixedly connected with a mounting plate 27, and the material taking suction cup 25 is installed on the lower surface of the mounting plate 27; the product code scanning reader 24 and the cleaning module 26 are respectively installed on both sides of the mounting plate 27; the material box code scanning reader 23 is installed on the mover of the product X-axis handling module 22;

[0048] Through the cooperation of the product Y-axis transport module 21 and the product X-axis transport module 22, the material picking suction cup 25 can be moved to the material picking station, the material box can be scanned and read by the material box scanning reader 23 to upload data, and the product can be scanned and read by the product scanning reader 24 to upload data, and the PCB module can be adsorbed by the material picking suction cup 25. Then, with the cooperation of the product Y-axis transport module 21 and the product X-axis transport module 22, the PCB module can be moved to the first rotary table 35 or the second rotary table 36 to realize the loading of the PCB module;

[0049] When unloading, the surface of the cut PCB module is cleaned by the cleaning module 26, and then the cut PCB module is adsorbed by the material picking suction cup 25. With the cooperation of the product Y-axis transport module 21 and the product X-axis transport module 22, the PCB module can be unloaded.

[0050] In one embodiment, a material preparation assembly 101 is installed on the front surface of the bed 45, and the material preparation assembly 101 includes a material preparation table 11, a first material pushing module 12, a material box lifting module 13, a product positioning module 14, a material box placement table 15 and a second material pushing module 16;

[0051] The material box placement table 15 is installed on the mover of the material box lifting module 13, the first material pushing module 12 and the second material pushing module 16 are both installed on the lower surface of the material preparation table 11, and the product positioning module 14 is installed on the upper surface of the material preparation table 11. The movers of the first material pushing module 12 and the movers of the second material pushing module 16 are both located above the material preparation table 11 and correspond to the positions of the material box placement table 15 and the product positioning module 14. The material box lifting module 13 is installed on the lower surface of the material preparation table 11, and the material preparation table 11 is installed on the front surface of the bed 45;

[0052] The material box placement table 15 is used to place the PCB module. The material box to be processed is placed on the material box placement table 15, and the material box is pushed to the discharge position by the material box lifting module 13. The first pushing module 12 pushes the PCB module to be cut into the product positioning module 14, and the PCB module is positioned and calibrated by the product positioning module 14, and then the product handling component 201 moves the PCB module to the workbench. When the PCB module is cut, the product handling component 201 moves the PCB module into the product positioning module 14, and then the second pushing module 16 pushes the PCB module into the material box.

[0053] In one embodiment, the position of the product X-axis transport module 22 corresponds to the position of the product positioning module 14 , and thus the loading and unloading of the PCB module can be achieved through the product transport component 201 .

[0054] In one embodiment, a base 51 is installed at the bottom of the bed 45, a casing 53 is installed on the upper surface of the base 51, a touch screen 55 is installed on one side of the casing 53, a warning light 54 is installed on the upper surface of the casing 53, and an operation window 52 is installed on the front surface of the casing 53. The material box can be taken out by opening the operation window 52.

[0055] When the present invention is working: the material box to be processed is placed on the material box placement table 15, the material box is pushed to the discharge position by the material box lifting module 13, the first material pushing module 12 pushes the PCB module to be cut into the product positioning module 14, the PCB module is positioned and calibrated by the product positioning module 14, and then the product handling component 201 moves the PCB module to the first rotating worktable 35, the X-axis first driving module 33 moves the first rotating worktable 35 to the cutting station, the Z-axis first driving module 40 is driven by the Y-axis first driving module 39, the Z-axis first driving module 40 drives the first cutting spindle 41 to move, the Z-axis second driving module 43 is driven by the Y-axis second driving module 42, the Z-axis second driving module 43 drives the second cutting spindle 44, and the PCB module is cut by the two spindles at the same time, so that the cutting of the PCB module can be quickly completed. The PCB module on the first rotary table 35 is driven to rotate in different positions to cut different positions of the PCB module. During the cutting process, the PCB module on the first rotary table 35 is ready for the PCB module on the second rotary table 36. The first X-axis driving module 33 moves the first rotary table 35 out of the cutting station to clean and unload the PCB module on the first rotary table 35. The second X-axis driving module 34 drives the second rotary table 36 to move to the bottom of the second cutting spindle 44 for cutting. As for the PCB module on the first rotary table 35 that has been cut, the product handling component 201 moves the PCB module to the product positioning module 14, and then the second pushing module 16 pushes the PCB module into the material box, and at the same time loads a new PCB module to be cut into the first rotary table 35.

[0056] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of various changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A dual-axis dual-table precision fully automatic dicing machine, comprising a machine base (51), characterized in that: A bed (45) is installed on the upper surface of the machine base (51), and a cutting assembly (301) is installed on the bed (45); The cutting assembly (301) comprises a first visual module (32), a first rotating worktable (35), a second rotating worktable (36), a second visual module (37), a Z-axis first driving module (40) and a Z-axis second driving module (43); The front surface of the bed (45) is mounted with a third Y-axis driving module (31) and a fourth Y-axis driving module (38); the rear surface of the bed (45) is mounted with a second Y-axis driving module (42) and a first Y-axis driving module (39); the inner bottom wall of the bed (45) is mounted with a first X-axis driving module (33) and a second X-axis driving module (34); the first rotating worktable (35) is mounted on a mover of the first X-axis driving module (33); the second rotating worktable (36) is mounted on a mover of the second X-axis driving module (34); The Z-axis first driving module (40) is mounted on the mover of the Y-axis first driving module (39), the Z-axis second driving module (43) is mounted on the mover of the Y-axis second driving module (42), the first visual module (32) is mounted on the mover of the Y-axis third driving module (31), the second visual module (37) is mounted on the mover of the Y-axis fourth driving module (38), the second cutting spindle (44) is mounted at the bottom of the Z-axis second driving module (43), and the first cutting spindle (41) is mounted at the bottom of the Z-axis first driving module (40).

2. A dual-axis dual-table precision fully automatic dicing machine according to claim 1, characterized in that: A product handling assembly (201) is installed on the front surface of the bed (45); The product handling assembly (201) comprises a product Y-axis handling module (21), a product X-axis handling module (22), and a material taking suction cup (25); The product Y-axis transport module (21) is mounted on the front surface of the bed (45), the product X-axis transport module (22) is mounted on the mover of the product Y-axis transport module (21), a mounting plate (27) is fixedly connected to the mover of the product X-axis transport module (22), and the material taking suction cup (25) is mounted on the lower surface of the mounting plate (27).

3. A dual-axis dual-table precision fully automatic dicing machine according to claim 2, characterized in that: A product code scanning reader (24) and a cleaning module (26) are respectively installed on both sides of the installation plate (27).

4. A dual-axis dual-table precision fully automatic dicing machine according to claim 3, characterized in that: A material box code scanning reader (23) is installed on the mover of the product X-axis transport module (22).

5. The dual-axis dual-table precision fully automatic dicing machine according to claim 1, characterized in that: A material preparation assembly (101) is installed on the front surface of the bed (45), and the material preparation assembly (101) includes a material preparation platform (11), a first material pushing module (12), a material box lifting module (13), a product positioning module (14), a material box placement platform (15) and a second material pushing module (16); The material box placement platform (15) is installed on the mover of the material box lifting module (13), the first material pushing module (12) and the second material pushing module (16) are both installed on the lower surface of the material preparation platform (11), and the product positioning module (14) is installed on the upper surface of the material preparation platform (11).

6. A dual-axis dual-table precision fully automatic dicing machine according to claim 5, characterized in that: The mover of the first material pushing module (12) and the mover of the second material pushing module (16) are both located above the material preparation platform (11) and correspond to the positions of the material box placement platform (15) and the product positioning module (14).

7. A dual-axis dual-table precision fully automatic dicing machine according to claim 6, characterized in that: The material box lifting module (13) is installed on the lower surface of the material preparation platform (11), and the material preparation platform (11) is installed on the front surface of the bed (45).

8. The dual-axis dual-table precision fully automatic dicing machine according to claim 7, characterized in that: The position of the product X-axis transport module (22) corresponds to the position of the product positioning module (14).

9. The dual-axis dual-table precision fully automatic dicing machine according to claim 1, characterized in that: A base (51) is installed at the bottom of the bed (45), and a housing (53) is installed on the upper surface of the base (51).

10. The dual-axis dual-table precision fully automatic dicing machine according to claim 9, characterized in that: A touch screen (55) is installed on one side of the housing (53), a warning light (54) is installed on the upper surface of the housing (53), and an operation window (52) is installed on the front surface of the housing (53).

Images