Automatic packaging equipment for metal indium ingots

By designing the molding components and cover components of the automatic packaging equipment, the deformation and oxidation problems in the indium ingot packaging are solved, and the purity and appearance of the indium ingot is effectively protected, and the cost is reduced.

CN120039481AActive Publication Date: 2025-05-27KAIDI TEC & DEV CO LTD
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Patent Information

Application Number
CN202510256273.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-05
Publication Date
2025-05-27
Estimated Expiration
2045-03-05

AI Technical Summary

Technical Problem

In the prior art, when packaging metal indium ingots, plastic sealed bags cannot effectively prevent the indium ingots from deforming, and the glass bottle packaging cost is high.

Method used

An automatic packaging device is designed, including molding components and cover components. The molded assembly is pressed out and placed grooves are placed by molding, and the hardness of the grooves protects the indium ingot from impact and extrusion; the cover assembly seals the groove openings to prevent oxidation and metal reactions.

Benefits of technology

Effectively protect the indium ingot from physical damage and chemical contamination, maintain its purity and appearance, and has an advantage in cost than glass bottle packaging.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides automatic packaging equipment for metal indium ingots, and relates to the technical field of mechanical equipment, the automatic packaging equipment comprises a forming assembly and a cover assembly, the forming assembly comprises a bottom die part and an upper die part, when a PVC hard sheet passes through the forming assembly, the bottom die part and the upper die part are subjected to die assembly, a containing groove is pressed in the PVC hard sheet, and the cover assembly is arranged in the containing groove; and the manipulator puts the silver ingot into the placing groove, and the PVC hard sheet drives the indium ingot to move to the cover assembly. The packaging device has the beneficial effects that the forming assembly and the cover assembly are arranged, the forming assembly presses a PVC hard sheet out of the containing groove, the size of the containing groove is larger than that of an indium ingot, the containing groove has certain hardness, when the packaged indium ingot is impacted or extruded, the containing groove can protect the indium ingot, the indium ingot is prevented from being deformed or scratched, and the packaging efficiency is improved. The cover assembly seals the opening of the containing groove, so that the indium ingot is located in a sealed space, the indium ingot is prevented from being oxidized or reacting with other metal, and the purity of the indium ingot is guaranteed.
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Description

Technical Field

[0001] The present invention relates to the technical field of mechanical equipment, and in particular to an automatic packing device for indium ingots. Background Art

[0002] Indium metal is a silver-white metal with a slightly pale blue luster. Indium is very soft in texture, and scratches can be easily left on its surface with a fingernail. Indium has good plasticity and ductility and can be pressed into thin sheets. Therefore, indium is mainly used in the production of ITO targets (for liquid crystal displays and flat screens), semiconductor materials and devices, etc. When storing indium ingots, they should be separated from other metals. Non-metallic containers such as plastic or glass can be used for packaging, which can prevent the indium ingots from oxidation or other contamination.

[0003] Currently, most indium ingots on the market are packaged with plastic seal bags during packaging. However, plastic seal bags can only protect indium ingots from oxidation. Since the material of indium ingots is relatively soft, they are prone to deformation due to knocking, bumping, and impact during transportation, thus affecting their appearance. If glass bottles are used for packaging indium, the packaging cost will be increased. Summary of the Invention

[0004] The present invention overcomes the disadvantages in the prior art, and provides a forming component and a covering component. The forming component presses out a placement groove on the PVC hard sheet. The size of the placement groove is larger than that of the indium ingot. Due to the certain hardness of the placement groove, when the packaged indium ingot is impacted or squeezed, the placement groove can protect the indium ingot from deformation or being scratched. The covering component seals the opening of the placement groove, so that the indium ingot is in a sealed space, avoiding oxidation of the indium ingot or reaction with other metals, and ensuring the purity of the indium ingot.

[0005] In order to solve the above technical problems, the invention is realized through the following technical solutions: An automatic packing device for indium ingots, including a forming component and a covering component. The forming component includes a bottom die component and an upper die component. When the PVC hard sheet passes through the forming component, the bottom die component and the upper die component are closed, and a placement groove is pressed on the PVC hard sheet. The manipulator places the silver ingot into the placement groove, and the PVC hard sheet moves the indium ingot to the covering component with it; The covering component is provided with a covering PVC reel, and the PVC soft sheet roll is arranged at the covering PVC reel. The covering component is also provided with a covering hot pressing component. A pressure-bearing component is arranged directly below the covering hot pressing component. The PVC soft sheet and the PVC hard sheet with the indium ingot pass through between the covering hot pressing component and the pressure-bearing component after overlapping; The cover hot pressing component includes a hot pressing plate, which is detachably connected with a hot pressing conversion plate. After the hot pressing plate is electrified, it generates heat and transfers the heat to the hot pressing conversion plate. The hot pressing conversion plate presses down to press the PVC soft sheet and the PVC hard sheet with indium ingots together.

[0006] Furthermore, the bottom mold component includes a bottom mold base block and a bottom mold conversion block; A bottom mold slide rail is arranged on the bottom mold base block, a limiting strip is arranged on one side of the bottom mold slide rail, and a first side lock chute is further arranged at one end of the bottom mold base block away from the limiting strip; A chute is arranged at the lower end of the bottom mold conversion block, a limiting groove is arranged at one end of the chute, and a second side lock chute is arranged at one end of the bottom mold conversion block away from the limiting groove; The chute is slidably connected with the bottom mold slide rail; When the bottom mold base block coincides with the bottom mold conversion block, the limiting groove is engaged with the limiting strip, and the first side lock chute coincides with the second side lock chute; Both the first side lock chute and the second side lock chute are slidably connected with a side lock block, and the side lock block is connected with the bottom mold base block and the bottom mold conversion block together through a side lock bolt.

[0007] Furthermore, the forming assembly further includes a forming base, a support column is arranged on the forming base, a forming upper plate block and an adjusting gasket are inserted on the support column. By adjusting the positions of the forming upper plate block and the adjusting gasket, the height of the forming upper plate block can be set, and the top end of the support column is connected with a top nut; The upper mold component is connected with the forming upper plate block through a mold locking bolt; The forming base is connected with a forming lifting cylinder, a bottom mold lifting rail is arranged at the lower end of the bottom mold base block, the output end of the forming lifting cylinder is connected with the bottom mold base block, and the bottom mold lifting rail is movably inserted into the forming base.

[0008] Furthermore, an upper plate slide rail is arranged at the lower end of the forming upper plate block. The upper mold component includes an upper mold base block, and an upper mold chute is arranged on the upper mold base block. The upper plate slide rail is inserted into the upper mold chute; A convex mold positioning groove is arranged on the forming upper plate block, a convex mold insertion hole is arranged in the convex mold positioning groove, and a convex mold is detachably connected with the convex mold positioning groove. The convex mold includes a convex mold insertion post, and the convex mold insertion post is inserted into the convex mold insertion hole; A mold locking insert bar is inserted into the upper mold base block. The mold locking insert bar penetrates into the upper mold base block from one side of the upper mold base block, and the mold locking insert bar is inserted together with the convex mold insertion post and finally penetrates out from the other side of the upper mold base block; One end of the mold locking insert bar penetrating out of the upper mold base block is connected with a mold locking nut.

[0009] Furthermore, the cover component includes a cover base; The cover hot pressing component further includes a hot pressing cylinder, the hot pressing plate is connected to the output end of the hot pressing cylinder, the hot pressing plate is also connected with a first spring, and the other end of the first spring is connected to the cover base; The pressure bearing component includes a pressure bearing base, the pressure bearing base is connected with a second spring, the other end of the second spring is connected to a pressure bearing bottom plate, the lower end of the pressure bearing bottom plate is connected with a pressure bearing guide post, and the pressure bearing guide post is movably inserted into the pressure bearing base.

[0010] Furthermore, both sides of the pressure bearing base are connected with hot pressing side limiting components, the hot pressing side limiting components include hot pressing limiting blocks, one side of the hot pressing limiting block is provided with a hot pressing limiting slide bar, and the hot pressing limiting block is rotatably connected with a hot pressing limiting adjusting screw; The hot pressing limiting slide bar is slidably inserted into the pressure bearing base, and the hot pressing limiting adjusting screw is threadedly connected with the pressure bearing base; One side of the cover base is provided with a cover roll transition shaft.

[0011] Furthermore, a power component and an indium ingot loading platform are arranged between the forming component and the cover component. A film roll component, a transition shaft component, a tensioning component, and a preheating component are arranged on the side of the forming component away from the cover component from far to near. A power component and a receiving conveyor belt are arranged on the side of the cover component away from the forming component from near to far; The rolled PVC hard sheet is installed on the film roll component. After the PVC hard sheet is pulled out, it passes through the transition shaft component and the tensioning component and is sent into the preheating component. The preheating component heats the PVC hard sheet to make it soft. The softened PVC hard sheet then passes through the forming component to press out a placement groove. Driven by the power component, the PVC hard sheet with the placement groove passes through the indium ingot loading platform. A manipulator is arranged on the side of the indium ingot loading platform. The manipulator grabs the indium ingot and puts it into the placement groove. The cover hot pressing component presses a layer of PVC soft sheet at the opening of the placement groove. The encapsulated indium ingot is pushed onto the receiving conveyor belt by the drive of the second group of power components.

[0012] Furthermore, the film roll component includes a lever, the middle of the lever is rotatably connected to a lever bracket, one end of the lever is provided with a film roll placement groove, a locking block is hinged to the side of the film roll placement groove, and the locking block is connected with a locking bolt; One end of the lever away from the film roll placement groove is provided with a force applying rod; Above the force applying rod, there is a lever lifting cylinder. Lifting positioning rods are arranged on both sides of the lever lifting cylinder, and the output end of the lever lifting cylinder is connected with a push plate; When the lever lifting cylinder pushes out, the push plate presses the force applying rod downwards, and the film roll placement groove at the other end of the lever rises; The tensioning component includes a tensioning cylinder, and the output end of the tensioning cylinder is connected with a tensioning shaft; The preheating component includes a preheating frame body, the preheating frame body is connected to a first preheating belt, preheating lifting frame bodies are arranged on both sides of the preheating frame body, the preheating lifting frame bodies are connected to preheating lifting cylinders, and the output ends of the preheating lifting cylinders are connected to a second preheating belt.

[0013] Furthermore, the power component includes a power shaft, both ends of the power shaft are connected to power lifting seats, the power lifting seats are slidably connected to a power base, the power base is connected to a power lifting cylinder, the output end of the power lifting cylinder is connected to the power lifting seat, and one end of the power shaft is also connected to a power motor; The power base is rotatably connected to a power adaptation shaft.

[0014] Furthermore, the power adaptation shaft includes an adaptation base shaft, the adaptation base shaft includes a shaft core, both ends of the shaft core are provided with ends, and the diameter of the shaft core is smaller than the diameter of the ends; The outer circumference of the shaft core is surrounded by conversion shafts, and no less than two conversion shafts enclose a circumference; pin holes are provided at the ends of the conversion shafts, and connection holes are provided at the ends; the connection holes and the pin holes are coaxially arranged, and conversion pins are threadedly connected to the connection holes; The conversion pin includes a threaded section and a plugging slide rod section, the threaded section is connected to the connection hole, and the plugging slide rod section is plugged at the pin hole; The indium ingot loading platform includes a platform base, width adjustment blocks are arranged on both sides above the platform base, and the width adjustment blocks are connected to the platform base through fixing bolts.

[0015] Compared with the prior art, the beneficial effects of the present invention are: 1. A forming component and a cover component are provided. The forming component presses out a placement groove on the PVC hard sheet. The size of the placement groove is larger than the size of the indium ingot. Since the placement groove has a certain hardness, when the packaged indium ingot is impacted or squeezed, the placement groove can protect the indium ingot and prevent the indium ingot from deforming or being scratched. The cover component seals the opening of the placement groove, so that the indium ingot is in a sealed space, avoiding the indium ingot from being oxidized or reacting with other metals, and ensuring the purity of the indium ingot.

[0016] 2. A film roll component is provided. The film roll component is provided with a lever. The rolled PVC hard sheet is installed at one end of the lever, and a force-applying rod is arranged at the other end of the lever. Since the rolled PVC hard sheet is heavy, during installation, the lever lifting cylinder can be retracted first. At this time, the end of the lever provided with the film roll placement groove can be easily pressed down by the operator. Then, the rolled PVC hard sheet is pushed above the film roll placement groove. Then, the output rod of the lever lifting cylinder is pushed out, and the push plate presses down the force-applying rod. The rolled PVC hard sheet at the other end of the lever will be lifted, which is convenient for pulling out the PVC hard sheet during the subsequent use of the equipment.

[0017] 3. A power component is provided. The power component includes a power adaptation shaft. The outer diameter at the core position of the power adaptation shaft can be set by replacing the conversion shaft with different outer diameters. Therefore, when the depth of the placement groove changes, the conversion shaft with a different outer diameter can be installed according to the depth of the placement groove, thus making the adaptability of the power component greater. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings are used to provide a further understanding of the present invention and, together with the embodiments of the present invention, are used to explain the invention, but do not constitute a limitation to the present invention. In the drawings: Figure 1 is the overall schematic diagram of the automatic packaging device according to the embodiment of the present invention; Figure 2 is the side view of the automatic packaging device according to the embodiment of the present invention; Figure 3 is the first structural schematic diagram of the film roll assembly according to the embodiment of the present invention; Figure 4 is the second structural schematic diagram of the film roll assembly according to the embodiment of the present invention; Figure 5 is the exploded schematic diagram of the preheating assembly according to the embodiment of the present invention; Figure 6 is the structural schematic diagram of the forming assembly according to the embodiment of the present invention; Figure 7 is the exploded schematic diagram of the forming assembly according to the embodiment of the present invention; Figure 8 is the exploded schematic diagram of the bottom die component according to the embodiment of the present invention; Figure 9 is the exploded schematic diagram of the upper die component according to the embodiment of the present invention; Figure 10 is the structural schematic diagram of the power component according to the embodiment of the present invention; Figure 11 is the exploded schematic diagram of the power component according to the embodiment of the present invention; Figure 12 is the perspective view of the power adaptation shaft according to the embodiment of the present invention; Figure 13 is the exploded schematic diagram of the indium ingot loading platform according to the embodiment of the present invention; Figure 14 is the structural schematic diagram of the cover component according to the embodiment of the present invention; Figure 15 is the exploded schematic diagram of the cover component according to the embodiment of the present invention; Figure 16 is the exploded schematic diagram of the cover hot pressing component and the pressure bearing component according to the embodiment of the present invention; Figure 17 is the exploded schematic diagram of the pressure bearing component according to the embodiment of the present invention.

[0019] In the figure: 1. Film roll assembly; 101. Lever bracket; 102. Lever; 1021. Film roll placement groove; 1022. Locking block; 1023. Locking bolt; 1024. Force application rod; 103. Lever lifting cylinder; 104. Lifting positioning rod; 105. Pushing plate; 2. Transition shaft assembly; 3. Tensioning assembly; 301. Tensioning cylinder; 302. Tensioning shaft; 4. Preheating assembly; 401. Preheating frame; 402. First preheating belt; 403. Preheating lifting frame; 404. Preheating lifting cylinder; 405. Second preheating belt; 5. Forming assembly; 501. Forming base; 5011. Support pillar; 502. Forming lifting cylinder; 503. Bottom die component; 5031. Bottom die base block; 503D. Limiting strip; 503E. Bottom die slide rail; 503F. First side lock chute; 503G. Bottom die lifting rail; 5032. Bottom die changeover block; 503A. Limiting groove; 503B. Chute; 503C. Second side lock chute; 503H. Forming female die; 5033. Side lock block; 5034. Side lock bolt; 504. Forming upper plate; 5041. Upper plate slide rail; 505. Upper die component; 5051. Upper die base block; 505A. Upper die chute; 505B. Upper die jack; 505C. Punch positioning groove; 505D. Punch jack; 5052. Punch; 505E. Punch insertion post; 5053. Die locking nut; 5054. Die locking insert; 506. Die locking bolt; 507. Adjusting gasket; 508. Top nut; 6. Power assembly; 601. Power base; 602. Power lifting cylinder; 603. Power lifting seat; 604. Power shaft; 605. Power motor; 606. Power adaptation shaft; 6061. Adaptation base shaft; 606A. End; 606B. Shaft core; 606C. Connection hole; 6062. Changeover shaft; 606D. Pin hole; 6063. Changeover pin; 606E. Threaded section; 606F. Plugging slide bar section; 7. Indium ingot loading platform; 701. Platform base; 702. Width adjusting block; 703. Fixed bolt; 8. Cover assembly; 801. Cover base; 802. Cover PVC reel; 804. Cover roll transition shaft; 806. Cover hot pressing component; 8061. Hot pressing cylinder; 8062. First spring; 8063. Hot pressing plate; 8064. Hot pressing changeover plate;; 807. Hot pressing side limiting component; 8071. Hot pressing limiting block; 8072. Hot pressing limiting slide bar; 8073. Hot pressing limiting adjusting screw; 808. Pressure bearing component; 8081. Pressure bearing base; 8082. Second spring; 8083. Pressure bearing guide post; 8084. Pressure bearing bottom plate; 9. Material receiving conveyor belt. Detailed implementation manners

[0020] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only for the purpose of illustration and explanation of the present invention, and are not intended to limit the present invention.

[0021] As shown Figures 1 to 17 is an automatic packing device for indium ingots, which is used for hermetically packaging indium ingots. It includes a forming component 5 and a covering component 8. The forming component 5 includes a bottom die part 503 and an upper die part 505. When the PVC hard sheet passes through the forming component 5, the bottom die part 503 and the upper die part 505 are closed to press a placement groove on the PVC hard sheet. The manipulator places the silver ingot into the placement groove. The PVC hard sheet moves with the indium ingot to the covering component 8. The size of the placement groove is larger than that of the indium ingot. Since the placement groove has a certain hardness, when the packaged indium ingot is impacted or squeezed, the placement groove can protect the indium ingot from deformation or being scratched. The covering component 8 is provided with a covering PVC reel 802, and the PVC soft sheet roll is arranged at the covering PVC reel 802. The covering component 8 is also provided with a covering hot pressing part 806. A pressure-bearing part 808 is arranged directly below the covering hot pressing part 806. After the PVC soft sheet and the PVC hard sheet with the indium ingot overlap, they pass through between the covering hot pressing part 806 and the pressure-bearing part 808. The covering hot pressing part 806 includes a hot pressing plate 8063, and the hot pressing plate 8063 is detachably connected with a hot pressing conversion plate 8064. After the hot pressing plate 8063 is energized, it generates heat and transfers the heat to the hot pressing conversion plate 8064. The hot pressing conversion plate 8064 presses down to press the PVC soft sheet and the PVC hard sheet with the indium ingot together. The covering component 8 seals the opening of the placement groove, so that the indium ingot is in a sealed space, avoiding the indium ingot from being oxidized or reacting with other metals, and ensuring the purity of the indium ingot.

[0022] The bottom die component 503 includes a bottom die base block 5031 and a bottom die conversion block 5032; a bottom die slide rail 503E is provided on the bottom die base block 5031, a limiting strip 503D is provided on one side of the bottom die slide rail 503E, and a first side lock chute 503F is further provided at one end of the bottom die base block 5031 away from the limiting strip 503D; a chute 503B is provided at the lower end of the bottom die conversion block 5032, a limiting groove 503A is provided at one end of the chute 503B, and a second side lock chute 503C is provided at one end of the bottom die conversion block 5032 away from the limiting groove 503A; the chute 503B is slidably connected to the bottom die slide rail 503E; when the bottom die base block 5031 coincides with the bottom die conversion block 5032, the limiting groove 503A is engaged with the limiting strip 503D, so that the limiting groove 503A can prevent misalignment when the bottom die base block 5031 is docked with the bottom die conversion block 5032, enabling quick positioning when the bottom die base block 5031 is combined with the bottom die conversion block 5032, and the first side lock chute 503F coincides with the second side lock chute 503C; both the first side lock chute 503F and the second side lock chute 503C are slidably connected to a side lock block 5033, and the side lock block 5033 is connected to the bottom die base block 5031 and the bottom die conversion block 5032 through side lock bolts 5034. When the size of the indium ingot to be packaged changes, that is, the size of the placement groove needs to change, at this time, it can be achieved by replacing different bottom die conversion blocks 5032. First, remove the side lock bolt 5034 connected to the bottom die conversion block 5032, loosen the side lock bolt 5034 connected to the bottom die base block 5031, and then move the side lock block 5033 towards the bottom die base block 5031. When the side lock block 5033 no longer blocks the side of the bottom die conversion block 5032, the bottom die conversion block 5032 can be slid out from the side away from the limiting strip 503D. Then, insert the chute 503B of the new bottom die conversion block 5032 into the bottom die slide rail 503E, and push the new bottom die conversion block 5032 into the bottom die base block 5031 until the limiting groove 503A is engaged with the limiting strip 503D. Then, push the side lock block 5033 towards the bottom die conversion block 5032 to block the side of the bottom die conversion block 5032, and then pass the side lock bolt 5034 through the side lock block 5033 to connect with the bottom die conversion block 5032, thus completing the process of replacing the bottom die conversion block 5032. The whole process is simple to operate and can be quickly positioned, so it is very convenient for the operator.

[0023] The forming assembly 5 further includes a forming base 501. A support column 5011 is provided on the forming base 501. A forming upper plate 504 and an adjusting gasket 507 are inserted on the support column 5011. The top end of the support column 5011 is connected to a top nut 508. When the thickness of the indium ingot changes, the depth of the placing groove changes. At this time, the thickness of the bottom die replacement block 5032 also changes. Therefore, when the bottom die replacement block 5032 is lifted by the forming lifting cylinder 502, its highest height will also change accordingly. At this time, by adjusting the positions of the forming upper plate 504 and the adjusting gasket 507, the height of the forming upper plate 504 can be set, so that the forming assembly 5 can adapt to the packaging of indium ingots of different sizes.

[0024] The forming base 501 is connected to the forming lifting cylinder 502. A bottom die lifting rail 503G is provided at the lower end of the bottom die base block 5031. The output end of the forming lifting cylinder 502 is connected to the bottom die base block 5031. The bottom die lifting rail 503G is movably inserted into the forming base 501. The forming lifting cylinder 502 pushes the bottom die component 503 upward, so that the bottom die component 503 is engaged with the upper die component 505, and thus the heated and softened PVC hard sheet can be pressed out to form the placing groove.

[0025] The upper die component 505 and the forming upper plate 504 are connected by die locking bolts 506; a upper plate slide rail 5041 is provided at the lower end of the forming upper plate 504. The upper die component 505 includes an upper die base block 5051, and an upper die chute 505A is provided on the upper die base block 5051. The upper plate slide rail 5041 is inserted into the upper die chute 505A; a punch positioning groove 505C is provided on the forming upper plate 504, and a punch insertion hole 505D is provided in the punch positioning groove 505C. The punch positioning groove 505C is detachably connected with a punch 5052. The punch 5052 includes a punch insertion post 505E, and the punch insertion post 505E is inserted into the punch insertion hole 505D; a die locking strip 5054 is inserted into the upper die base block 5051. The die locking strip 5054 penetrates into the upper die base block 5051 from one side, and the die locking strip 5054 is inserted together with the punch insertion post 505E, and finally the die locking strip 5054 penetrates out from the other side of the upper die base block 5051; one end of the die locking strip 5054 penetrating out of the upper die base block 5051 is connected with a die locking nut 5053. When replacing the punch 5052, it is necessary to first remove the upper die base block 5051. Just loosen the die locking bolts 506, and the upper die component 505 can be pulled out along the upper plate slide rail 5041. Then remove the die locking nut 5053 and pull out the die locking strip 5054, and the punch 5052 can be taken out from the upper die base block 5051. After replacing with a new punch 5052, insert the die locking strip 5054 into the upper die base block 5051 again, so that the die locking strip 5054 can insert the punch 5052 and the upper die base block 5051 together. In this way, when replacing the punch 5052, it is very fast and one upper die base block 5051 can adapt to a variety of different punches 5052, making the upper die component 505 more adaptable and more flexible in use.

[0026] The cover assembly 8 includes a cover base 801; a cover roll transition shaft 804 is provided on one side of the cover base 801. The cover hot pressing component 806 further includes a hot pressing cylinder 8061. The hot pressing plate 8063 is connected to the output end of the hot pressing cylinder 8061. The hot pressing plate 8063 is also connected with a first spring 8062, and the other end of the first spring 8062 is connected with the cover base 801; the first spring 8062 also plays a role of pulling and limiting the hot pressing plate 8063. When the hot pressing cylinder 8061 pulls up the hot pressing plate 8063, the first spring 8062 can play an auxiliary role.

[0027] The pressure-bearing component 808 includes a pressure-bearing base 8081. The pressure-bearing base 8081 is connected to a second spring 8082. The other end of the second spring 8082 is connected to a pressure-bearing bottom plate 8084. The lower end of the pressure-bearing bottom plate 8084 is connected to a pressure-bearing guide post 8083. The pressure-bearing guide post 8083 is movably inserted into the pressure-bearing base 8081. When the hot-pressing conversion plate 8064 hot-presses the PVC hard sheet and the PVC soft sheet with indium ingots, causing the contact areas between the two to fuse together, the second spring 8082 is compressed downward. At this time, the second spring 8082 can exert an upward thrust on the PVC hard sheet, making the PVC hard sheet and the PVC soft sheet fit more closely, resulting in a better bonding effect between the two.

[0028] On both sides of the pressure-bearing base 8081, there are hot-pressing side limiting components 807 connected. The hot-pressing side limiting component 807 includes a hot-pressing limiting block 8071. On one side of the hot-pressing limiting block 8071, there is a hot-pressing limiting slide rod 8072. The hot-pressing limiting block 8071 is rotatably connected to a hot-pressing limiting adjusting screw 8073. The hot-pressing limiting slide rod 8072 is slidably inserted into the pressure-bearing base 8081, and the hot-pressing limiting adjusting screw 8073 is threadedly connected to the pressure-bearing base 8081. By rotating the hot-pressing limiting adjusting screw 8073, the position between the two hot-pressing limiting blocks 8071 can be adjusted, so as to limit all the PVC hard sheets and PVC soft sheets with indium ingots in the middle, facilitating the alignment of the acting directions of the two, and making the final sealing effect better.

[0029] A power component 6 and an indium ingot loading platform 7 are arranged between the forming component 5 and the cover component 8. On the side of the forming component 5 away from the cover component 8, there are a film roll component 1, a transition shaft component 2, a tensioning component 3, and a preheating component 4 arranged from far to near. On the side of the cover component 8 away from the forming component 5, there are a power component 6 and a receiving conveyor belt 9 arranged from near to far. The roll-shaped PVC hard sheet is installed on the film roll component 1. After the PVC hard sheet is pulled out, it passes through the transition shaft component 2 and the tensioning component 3 and is sent into the preheating component 4. The preheating component 4 heats the PVC hard sheet to make it soft. The softened PVC hard sheet then passes through the forming component 5 to press out a placement groove. Driven by the power component 6, the PVC hard sheet with the placement groove passes through the indium ingot loading platform 7. A manipulator is arranged on the side of the indium ingot loading platform 7. The manipulator grabs the indium ingot from an external positioning platform and places it into the placement groove. The cover hot-pressing component 806 presses a layer of PVC soft sheet at the opening of the placement groove. The encapsulated indium ingot is pushed onto the receiving conveyor belt 9 driven by the second group of power components 6.

[0030] The indium ingot loading platform 7 includes a platform base 701. On both sides above the platform base 701, there are width adjustment blocks 702, and the width adjustment blocks 702 are connected to the platform base 701 through fixing bolts 703. When the PVC hard sheet for pressing out the placement groove comes to the indium ingot loading platform 7, the width adjustment blocks 702 can limit its left and right positions, making the positioning more accurate when the manipulator places the indium ingot into it.

[0031] The film roll assembly 1 includes a lever 102. The middle of the lever 102 is rotatably connected to a lever bracket 101. One end of the lever 102 is provided with a film roll placement groove 1021. A locking block 1022 is hinged to the side of the film roll placement groove 1021, and the locking block 1022 is connected to a locking bolt 1023; the end of the lever 102 away from the film roll placement groove 1021 is provided with a force application rod 1024; above the force application rod 1024, there is a lever lifting cylinder 103. On both sides of the lever lifting cylinder 103, there are lifting positioning rods 104, and the output end of the lever lifting cylinder 103 is connected to a push plate 105; since the rolled PVC hard sheet is relatively heavy, during installation, the lever lifting cylinder 103 can be retracted first. At this time, the end of the lever 102 provided with the film roll placement groove 1021 can be easily pressed down by the operator. Then, the rolled PVC hard sheet is pushed above the film roll placement groove 1021, and then the output end of the lever lifting cylinder 103 is pushed out. The push plate 105 presses the force application rod 1024 downward, and the film roll placement groove 1021 at the other end of the lever 102 rises; the rolled PVC hard sheet at the other end of the lever will be lifted, facilitating the subsequent pulling out of the PVC hard sheet during the use of the equipment. The setting of the film roll assembly 1 makes it more labor-saving for the operator to replace the rolled PVC hard sheet.

[0032] The tensioning assembly 3 includes a tensioning cylinder 301. The output end of the tensioning cylinder 301 is connected to a tensioning shaft 302. After the PVC hard sheet is pulled out and wound around the equipment, the tensioning cylinder 301 pushes out the tensioning shaft 302 to tension the PVC hard sheet, making the positioning of the PVC hard sheet more accurate during processing.

[0033] The preheating assembly 4 includes a preheating frame body 401. The preheating frame body 401 is connected to a first preheating belt 402. On both sides of the preheating frame body 401, there are preheating lifting frame bodies 403. The preheating lifting frame bodies 403 are connected to preheating lifting cylinders 404. The output end of the preheating lifting cylinder 404 is connected to a second preheating belt 405. Heating components are arranged in the first preheating belt 402 and the second preheating belt 405, such as an electric heating plate that generates heat when powered on. Therefore, the belt surfaces of the first preheating belt 402 and the second preheating belt 405 have a certain amount of heat. When the PVC hard sheet passes between the first preheating belt 402 and the second preheating belt 405, it is quickly softened, so that when it reaches the forming assembly 5, the PVC hard sheet can be pressurized and shaped. Moreover, after being shaped by the forming assembly 5, the temperature of the PVC hard sheet can also be quickly reduced. Therefore, when the shaped PVC hard sheet is transferred to the indium ingot, its temperature will not affect the stability of the silver ingot.

[0034] The power assembly 6 includes a power shaft 604. Both ends of the power shaft 604 are connected to power lifting seats 603. The power lifting seats 603 are slidably connected to a power base 601. The power base 601 is connected to a power lifting cylinder 602. The output end of the power lifting cylinder 602 is connected to the power lifting seat 603. One end of the power shaft 604 is also connected to a power motor 605; the power base 601 is rotatably connected to a power adaptation shaft 606. The power adaptation shaft 606 includes an adaptation base shaft 6061. The adaptation base shaft 6061 includes a shaft core 606B. At both ends of the shaft core 606B, there are end parts 606A. The diameter of the shaft core 606B is smaller than the diameter of the end parts 606A; the outer periphery of the shaft core 606B is surrounded by a conversion shaft 6062. No less than two conversion shafts 6062 enclose a circumference; at the end of the conversion shaft 6062, there is a pin hole 606D, and at the end part 606A, there is a connection hole 606C; the connection hole 606C and the pin hole 606D are coaxially arranged, and a conversion pin 6063 is threadedly connected to the connection hole 606C; the conversion pin 6063 includes a threaded section 606E and a plugging slide rod section 606F. The threaded section 606E is connected to the connection hole 606C, and the plugging slide rod section 606F is plugged at the pin hole 606D; therefore, when the depth of the placement groove changes, different outer diameter conversion shafts 6062 can be installed according to the depth of the placement groove, making the adaptability of the power assembly 6 greater, so that when the conversion shaft 6062 rotates, its outer periphery can always support the bottom of the placement groove, making the shape of the placement groove more stable.

[0035] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features. However, any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An automatic packaging device for metal indium ingots, characterized in that: The invention comprises a molding component (5) and a cover component (8), wherein the molding component (5) comprises a bottom mold component (503) and an upper mold component (505). When the PVC hard sheet passes through the molding component (5), the bottom mold component (503) and the upper mold component (505) are molded together to form a placement groove on the PVC hard sheet. The robot arm places the silver ingot into the placement groove, and the PVC hard sheet moves with the indium ingot to the cover component (8); The cover assembly (8) is provided with a cover PVC reel (802), the PVC soft film roll is arranged on the cover PVC reel (802), the cover assembly (8) is further provided with a cover heat-pressing component (806), a pressure-bearing component (808) is arranged directly below the cover heat-pressing component (806), and the PVC soft film and the PVC hard film with the indium ingot are overlapped and passed between the cover heat-pressing component (806) and the pressure-bearing component (808); The cover hot pressing component (806) comprises a hot pressing plate (8063), the hot pressing plate (8063) being detachably connected to a hot pressing mold changing plate (8064), the hot pressing plate (8063) generating heat after being powered on and transferring heat to the hot pressing mold changing plate (8064), and the hot pressing mold changing plate (8064) pressing down to press the PVC soft sheet and the PVC hard sheet with the indium ingot together.

2. The automatic packaging equipment for metal indium ingots according to claim 1, characterized in that: The bottom mold component (503) comprises a bottom mold base block (5031) and a bottom mold change block (5032); The bottom mold base block (5031) is provided with a bottom mold slide rail (503E), a limit strip (503D) is provided on one side of the bottom mold slide rail (503E), and a first side locking slide groove (503F) is also provided on one end of the bottom mold base block (5031) away from the limit strip (503D); The bottom mold changing block (5032) is provided with a slide groove (503B) at the lower end, a limiting groove (503A) is provided at one end of the slide groove (503B), and a second side locking slide groove (503C) is provided at one end of the bottom mold changing block (5032) away from the limiting groove (503A); The slide groove (503B) is slidably connected to the bottom mold slide rail (503E); When the bottom mold base block (5031) and the bottom mold change block (5032) overlap, the limiting groove (503A) and the limiting strip (503D) are engaged, and the first side locking slide groove (503F) and the second side locking slide groove (503C) overlap; The first side locking groove (503F) and the second side locking groove (503C) are both slidably connected to the side locking block (5033), and the side locking block (5033) is connected to the bottom mold base block (5031) and the bottom mold change block (5032) through the side locking bolts (5034).

3. The automatic packaging equipment for metal indium ingots according to claim 2, characterized in that: The molding assembly (5) further comprises a molding base (501), the molding base (501) being provided with a pillar (5011), the pillar (5011) being plugged with a molding upper plate (504) and an adjusting gasket (507), and the height of the molding upper plate (504) can be set by adjusting the positions of the molding upper plate (504) and the adjusting gasket (507), and the uppermost end of the pillar (5011) is connected to a top nut (508); The upper mold component (505) is connected to the upper molding plate (504) via a mold locking bolt (506); The molding base (501) is connected to the molding lifting cylinder (502); a bottom mold lifting rail (503G) is provided at the lower end of the bottom mold base block (5031); the output end of the molding lifting cylinder (502) is connected to the bottom mold base block (5031); and the bottom mold lifting rail (503G) is movably plugged into the molding base (501).

4. The automatic packaging equipment for metal indium ingots according to claim 3 is characterized in that: The lower end of the molding upper plate (504) is provided with an upper plate slide rail (5041), the upper mold component (505) comprises an upper mold base block (5051), the upper mold base block (5051) is provided with an upper mold slide groove (505A), and the upper plate slide rail (5041) is inserted into the upper mold slide groove (505A); The upper forming plate (504) is provided with a punch positioning groove (505C), a punch insertion hole (505D) is provided in the punch positioning groove (505C), the punch positioning groove (505C) is detachably connected with a punch (5052), the punch (5052) comprises a punch insertion column (505E), and the punch insertion column (505E) is inserted into the punch insertion hole (505D); The upper die base block (5051) is plugged with a mold locking strip (5054), the mold locking strip (5054) is inserted from one side of the upper die base block (5051), the mold locking strip (5054) and the punch plug column (505E) are inserted in series together, and the mold locking strip (5054) finally passes out from the other side of the upper die base block (5051); One end of the mold locking strip (5054) passing through the upper mold base block (5051) is connected to the mold locking nut (5053).

5. The automatic packaging equipment for metal indium ingots according to claim 1, characterized in that: The cover assembly (8) comprises a cover base (801); The cover heat-pressing component (806) further comprises a heat-pressing cylinder (8061), a heat-pressing plate (8063) connected to the output end of the heat-pressing cylinder (8061), the heat-pressing plate (8063) further connected to a first spring (8062), and the other end of the first spring (8062) connected to the cover base (801); The pressure-bearing component (808) comprises a pressure-bearing base (8081), the pressure-bearing base (8081) is connected to a second spring (8082), the other end of the second spring (8082) is connected to a pressure-bearing bottom plate (8084), the lower end of the pressure-bearing bottom plate (8084) is connected to a pressure-bearing guide column (8083), and the pressure-bearing guide column (8083) is movably plugged into the pressure-bearing base (8081).

6. The automatic packaging equipment for metal indium ingots according to claim 5, characterized in that: The two sides of the pressure bearing base (8081) are connected to a hot pressing side limit component (807), the hot pressing side limit component (807) comprises a hot pressing limit block (8071), one side of the hot pressing limit block (8071) is provided with a hot pressing limit sliding rod (8072), and the hot pressing limit block (8071) is rotatably connected to a hot pressing limit adjusting screw (8073); The hot-pressing limit sliding rod (8072) is slidably plugged into the pressure-bearing base (8081), and the hot-pressing limit adjusting screw rod (8073) is threadedly connected to the pressure-bearing base (8081); A cover roll transition shaft (804) is provided on one side of the cover base (801).

7. The automatic packaging equipment for metal indium ingots according to any one of claims 1 to 6, characterized in that: A power assembly (6) and an indium ingot loading platform (7) are arranged between the molding assembly (5) and the cover assembly (8); a film roll assembly (1), a transition shaft assembly (2), a tensioning assembly (3), and a preheating assembly (4) are arranged from far to near on the side of the molding assembly (5) away from the cover assembly (8); and a power assembly (6) and a material receiving conveyor belt (9) are arranged from near to far on the side of the cover assembly (8) away from the molding assembly (5); The rolled PVC hard sheet is mounted on a film roll assembly (1). After being pulled out, the PVC hard sheet is sent into a preheating assembly (4) through a transition shaft assembly (2) and a tensioning assembly (3). The preheating assembly (4) heats the PVC hard sheet to soften it. The softened PVC hard sheet is then pressed out of a placement groove through a molding assembly (5). Driven by a power assembly (6), the PVC hard sheet with the placement groove passes through an indium ingot loading platform (7). A manipulator is arranged on the side of the indium ingot loading platform (7). The manipulator grabs the indium ingot and places it into the placement groove. A cover hot pressing component (806) presses a layer of PVC soft film at the opening of the placement groove. The packaged indium ingot is pushed onto a receiving conveyor belt (9) through the drive of a second group of power assemblies (6).

8. The automatic packaging equipment for metal indium ingots according to claim 7, characterized in that: The film roll assembly (1) comprises a lever (102), the middle portion of the lever (102) being rotatably connected to the lever bracket (101), one end of the lever (102) being provided with a film roll placement groove (1021), a locking block (1022) being hingedly connected to the side of the film roll placement groove (1021), and the locking block (1022) being connected to a locking bolt (1023); A force application rod (1024) is provided at one end of the lever (102) away from the film roll placement groove (1021); A lever lifting cylinder (103) is arranged above the force application rod (1024), lifting positioning rods (104) are arranged on both sides of the lever lifting cylinder (103), and the output end of the lever lifting cylinder (103) is connected to a push plate (105); When the lever lifting cylinder (103) is pushed out, the push plate (105) presses the force rod (1024) downward, and the film roll placement groove (1021) at the other end of the lever (102) rises; The tensioning assembly (3) comprises a tensioning cylinder (301), wherein the output end of the tensioning cylinder (301) is connected to a tensioning shaft (302); The preheating assembly (4) comprises a preheating frame (401), the preheating frame (401) is connected to a first preheating belt (402), preheating lifting frames (403) are arranged on both sides of the preheating frame (401), the preheating lifting frames (403) are connected to a preheating lifting cylinder (404), and the output end of the preheating lifting cylinder (404) is connected to a second preheating belt (405).

9. The automatic packaging equipment for metal indium ingots according to claim 7, characterized in that: The power assembly (6) comprises a power shaft (604), both ends of the power shaft (604) are connected to a power lifting seat (603), the power lifting seat (603) is slidably connected to a power base (601), the power base (601) is connected to a power lifting cylinder (602), the output end of the power lifting cylinder (602) is connected to the power lifting seat (603), and one end of the power shaft (604) is also connected to a power motor (605); The power base (601) is rotatably connected to the power adaptation shaft (606).

10. The automatic packaging equipment for metal indium ingots according to claim 9, characterized in that: The power adaptation shaft (606) comprises an adaptation base shaft (6061), the adaptation base shaft (6061) comprises a shaft core (606B), end portions (606A) are arranged at both ends of the shaft core (606B), and the diameter of the shaft core (606B) is smaller than the diameter of the end portions (606A); The outer circumference of the shaft core (606B) is surrounded by a profile-changing shaft (6062), and no less than two profile-changing shafts (6062) form a circumference; a latch hole (606D) is provided at the end of the profile-changing shaft (6062), and a connecting hole (606C) is provided at the end (606A); the connecting hole (606C) and the latch hole (606D) are coaxially arranged, and a profile-changing latch (6063) is threadedly connected to the connecting hole (606C); The changeable latch (6063) comprises a threaded section (606E) and an inserting slide rod section (606F); the threaded section (606E) is connected to the connecting hole (606C), and the inserting slide rod section (606F) is inserted into the latch hole (606D); The indium ingot loading platform (7) comprises a platform base (701), and width adjustment blocks (702) are arranged on both sides above the platform base (701), and the width adjustment blocks (702) are connected to the platform base (701) via fixing bolts (703).

Citation Information

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