Processing technology of electronic product shell decorated by diaphragm

Abstract

The invention relates to the technical field of electronic product shells, in particular to a processing technology of a diaphragm-decorated electronic product shell. The preparation method comprises the following steps: S1, uniformly mixing epoxy resin, organic silicon modified benzoxazine and acetone, adding modified boron nitride and graphene oxide, adding a curing agent, and uniformly mixing to obtain a resin glue solution; s2, coating the upper surface and the lower surface of the base cloth with the resin glue solution, and drying at 110-120 DEG C for 30-40 minutes to obtain a prepreg; a plurality of pieces of prepreg are stacked and laid, and a plate is obtained through a 3D pressing technology; s3, primary transfer printing, coating, primary printing, secondary transfer printing, film coating and secondary printing are sequentially conducted on the surface of the film, the pattern is transferred to the film, and a transfer printing film is obtained; s4, glue is screen-printed on the surface of the transfer printing film, the transfer printing film is attached to the plate, after drying and curing, release treatment is conducted, and the electronic product shell is obtained.

Description

Technical Field

[0001] The invention relates to the technical field of electronic product shells, in particular to a membrane-decorated electronic product shell processing technology. Background Art

[0002] With the continuous development of the consumer electronics market, consumers have a growing demand for the aesthetics and personalization of electronic products. The housing of electronic products must not only protect the internal components, but also attract consumers' attention in appearance. Film decoration technology is widely used in the processing of electronic product housings because it can achieve a variety of colors, patterns and special effects (such as frosted texture, high gloss effect, etc.).

[0003] However, many diaphragm-decorated housings have poor water resistance and the diaphragm material has insufficient friction resistance. In the case of long-term use or frequent contact, the diaphragm surface is prone to scratches and wear, which in turn affects the appearance and texture.

[0004] In order to solve these problems, we propose a membrane-decorated electronic product housing processing technology. Summary of the invention

[0005] The purpose of the present invention is to provide a membrane-decorated electronic product housing processing technology to solve the problems raised in the prior art.

[0006] To achieve the above object, the present invention provides the following technical solutions: A membrane-decorated electronic product housing processing technology comprises the following steps: Step S1: epoxy resin, organosilicon-modified benzoxazine and acetone are mixed evenly, modified boron nitride and graphene oxide are added, stirred at 40-50° C. for 20-40 min, and then a curing agent is added and mixed evenly to obtain a resin glue solution; Step S2: coating the resin glue on the upper surface and the lower surface of the base fabric respectively, and drying at 110-120° C. for 30-40 minutes to obtain a prepreg; stacking several pieces of the prepreg, and obtaining a board through 3D lamination technology; Step S3: performing primary transfer, coating, primary printing, secondary transfer, coating, and secondary printing on the surface of the film in sequence to transfer the pattern onto the film to obtain a transfer film; Step S4: screen-printing glue on the surface of the transfer film, laminating it with the plate, drying and curing it, and performing release treatment to obtain an electronic product housing.

[0007] Furthermore, the resin glue is composed of the following components, calculated by weight: 60-80 parts of epoxy resin, 10-20 parts of silicone-modified benzoxazine, 5-10 parts of modified boron nitride, 3-5 parts of graphene oxide, 30-50 parts of acetone, and 12-18 parts of curing agent.

[0008] Furthermore, the preparation method of the organosilicon-modified benzoxazine is as follows: Step (1): uniformly mix hexamethyldisiloxane, deionized water, isopropanol and hydrochloric acid, drip into a mixed solution of ethyl orthosilicate and 3-mercaptopropyltrimethylsilane, drip for 30-50 minutes, react at 60-70°C for 2-4 hours, wash and rotary evaporate to obtain mercapto-containing organosilicon; Step (2): uniformly mixing the mercapto-containing organosilicon, eugenol and a photoinitiator, and reacting them under ultraviolet light for 30-60 minutes to obtain organosilicon-modified eugenol; Step (3): 1,12-diaminododecane, polyformaldehyde and 1,4-dioxane are mixed evenly, and a mixed solution of organosilicon-modified eugenol and 1,4-dioxane is added dropwise over 30-50 minutes, and the mixture is reacted at 80-90° C. for 8-10 hours, and the mixture is subjected to rotary evaporation to obtain organosilicon-modified benzoxazine.

[0009] Furthermore, in step (1), the mercapto-containing silicone is composed of the following components, calculated by weight: 8-12 parts of hexamethyldisiloxane, 10-15 parts of deionized water, 15-20 parts of isopropyl alcohol, 3-8 parts of hydrochloric acid, 15-18 parts of ethyl orthosilicate, and 18-20 parts of 3-mercaptopropyltrimethylsilane.

[0010] Furthermore, the concentration of the hydrochloric acid is 1wt%.

[0011] Furthermore, in step (2), the mercapto-containing silicone resin is composed of the following components, calculated by weight: 10-15 parts of mercapto-containing silicone, 20-25 parts of eugenol, and 1-3 parts of photoinitiator.

[0012] Furthermore, the photoinitiator is 2-hydroxy-2-methylpropiophenone.

[0013] Furthermore, the process conditions of the ultraviolet irradiation are: irradiation wavelength 360-400nm, irradiation intensity 25-35mW / cm 2 .

[0014] Furthermore, in the step (3), the mass ratio of 1,12-diaminododecane, paraformaldehyde and 1,4-dioxane is 1:(0.5-1.0):(12-15).

[0015] Furthermore, in step (3), the mass of the organosilicon-modified eugenol is 2-4 times the mass of the paraformaldehyde, and the mass ratio of the organosilicon-modified eugenol to 1,4-dioxane is 1:(3-5).

[0016] Furthermore, the preparation method of the modified boron nitride is as follows: Step A: Evenly mix boron nitride and sodium hydroxide aqueous solution, stir at 70-80° C. for 44-48 hours, filter, wash and dry to obtain hydroxylated boron nitride; Step B: Evenly mix hydroxylated boron nitride, anhydrous ethanol, deionized water and 3-aminopropyltrimethoxysilane, react at 60-70° C. for 3-5 hours, and obtain aminoated boron nitride after centrifugation, washing and drying; Step C: ultrasonically disperse the amino boron nitride in DMF to obtain a dispersion, add the terminal carboxyl hyperbranched polyester and p-toluenesulfonic acid, react at 30-40° C. for 5-8 hours, and obtain modified boron nitride after filtering, washing and drying.

[0017] Furthermore, in step A, the mass ratio of boron nitride to the sodium hydroxide aqueous solution is 1:(10-15), and the concentration of the sodium hydroxide aqueous solution is 3-5 mol / L.

[0018] Furthermore, in step B, the mass ratio of hydroxylated boron nitride to anhydrous ethanol, deionized water, and 3-aminopropyltrimethoxysilane is 1:(10-12):(2-4):(0.1-0.3).

[0019] Furthermore, in step C, the concentration of the dispersion is 2-3 g / L.

[0020] Furthermore, in the step C, the mass of the carboxyl-terminated hyperbranched polyester is 5-15% of the mass of the amino boron nitride.

[0021] Further, in step C, the mass of p-toluenesulfonic acid is 1-3% of the mass of amination boron nitride. Furthermore, in step S2, the amount of adhesive applied on one side is 150-200 g / m 2 .

[0022] Furthermore, in step S2, the material of the base fabric is any one of glass fiber, carbon fiber, ceramic fiber, and aramid.

[0023] Furthermore, in step S2, the process conditions of the 3D pressing technology are: temperature of 200-220° C. and pressure of 5-8 MPa.

[0024] Furthermore, in the step S3, the flash sand is transferred once, the varnish is printed once, the texture is transferred twice, the coating layer is a metal oxide coating layer, and the color ink is printed twice.

[0025] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention discloses a membrane-decorated electronic product shell processing technology, which uses epoxy resin and silicone-modified benzoxazine as main resins, modified boron nitride and graphene oxide as inorganic fillers, and combines with a curing agent and a solvent to obtain a resin glue solution, wherein the synergistic effect of silicone-modified benzoxazine and modified boron nitride jointly improves the hydrophobicity and mechanical properties of the electronic product shell, providing more reliable protection for the electronic product; Through the hydrolysis copolymerization of hexamethyldisiloxane (MM), 3-mercaptopropyltrimethylsilane (KH-580) and tetraethyl orthosilicate (TEOS), a mercapto-containing silicone resin was prepared, which can further undergo a mercapto-ene click reaction with the double bonds in eugenol, thereby solving the problem of double bond instability in the eugenol molecule and obtaining silicone-modified eugenol; finally, using 1,12-diaminododecane, silicone-modified eugenol and polyformaldehyde as raw materials, a hydrophobic alkyl long chain, silicone structure and rigid benzoxazine structure were introduced to obtain silicone-modified benzoxazine. The hydroxyl group of the benzoxazine structure after polymerization and ring opening can undergo a polymerization reaction with the epoxy group, further realizing cross-linking and curing with the epoxy group, significantly enhancing the hydrophobicity, heat resistance and wear resistance of the material, reducing the penetration of moisture, and being able to maintain good physical properties at higher temperatures, thereby enhancing the overall durability and long-term reliability of the electronic product housing; The surface of boron nitride (BN) was hydroxylated using a strong base, and the -OH group was covalently linked to the B site to form hydroxylated boron nitride. Subsequently, it was modified by terminal carboxyl hyperbranched polyester in collaboration with 3-aminopropyltrimethoxysilane to obtain modified boron nitride. The hyperbranched polyester structure has a high molecular weight and good mechanical properties, which can effectively improve the strength and toughness of the electronic product casing and significantly improve its dispersibility in the epoxy matrix. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] In this embodiment, the epoxy resin is bisphenol A epoxy resin, brand E-44; boron nitride: hexagonal boron nitride, particle size is 500nm, sourced from Zhengzhou Ruichang Chemical Products Co., Ltd.; graphene oxide: model DN-20DY, average thickness 1-3nm, diameter 4-7μm, number of layers 2-5 layers, sourced from Zhejiang Zhiti Nano New Materials Co., Ltd.; curing agent: 4,4-diaminodiphenyl sulfone; glass fiber cloth: alkali-free glass roving, thickness 0.1mm, sourced from Taizhou Zhongsheng Fiberglass Products Co., Ltd.; PET film: thickness 0.2mm, brand 818, sourced from Dongguan Jubang Plastic Materials Co., Ltd.; PET glue: model DN-85, sourced from Yangzhou Wenqi Materials Co., Ltd.; terminal carboxyl hyperbranched polyester: brand C102, sourced from Wuhan Hyperbranched Resin Technology Co., Ltd.

[0028] In the following examples and comparative examples, 1 part is equal to 10 g.

[0029] Embodiment 1: A membrane-decorated electronic product housing processing technology, comprising the following processes: Step S1: 60 parts of epoxy resin, 10 parts of organosilicon-modified benzoxazine and 30 parts of acetone are mixed evenly, 5 parts of modified boron nitride and 3 parts of graphene oxide are added, and the mixture is stirred at 40° C. for 20 minutes, and 12 parts of curing agent are added and mixed evenly to obtain a resin glue solution; Step S2: Coat the resin glue on the upper and lower surfaces of the glass fiber cloth (the coating amount on one side is 150g / m 2 ), dried at 110°C for 30 minutes to obtain a prepreg; 5 pieces of prepreg were stacked and laminated, and a plate was obtained by 3D pressing technology (temperature 200°C, pressure 5MPa); Step S3: performing a primary transfer printing of flash sand, coating, a primary printing of varnish, a secondary transfer printing of texture, vacuum coating (aluminum oxide), and a secondary printing of color ink on the surface of the PET film in sequence, transferring the pattern to the film to obtain a transfer film; Step S4: screen printing PET glue on the surface of the transfer film, laminating it with the plate, drying and curing it, and performing release treatment to obtain an electronic product housing; The preparation method of silicone-modified benzoxazine is as follows: Step (1): 8 parts of hexamethyldisiloxane, 10 parts of deionized water, 15 parts of isopropanol and 3 parts of 1 wt% hydrochloric acid are uniformly mixed, and a mixed solution of 15 parts of ethyl orthosilicate and 18 parts of 3-mercaptopropyltrimethylsilane is dripped into the mixture for 30 minutes, and the mixture is reacted at 60°C for 2 hours. After washing and rotary evaporation, a mercapto-containing organosilicon is obtained; Step (2): 10 parts of mercapto-containing silicone, 20 parts of eugenol and 1 part of 2-hydroxy-2-methylpropiophenone were mixed evenly and irradiated under ultraviolet light with a wavelength of 360 nm and an intensity of 25 mW / cm2 , react for 30 min to obtain organosilicon-modified eugenol; Step (3): 10 parts of 1,12-diaminododecane, 5 parts of paraformaldehyde and 120 parts of 1,4-dioxane are mixed evenly, and a mixed solution of 10 parts of organosilicon-modified eugenol and 30 parts of 1,4-dioxane is added dropwise for 30 minutes, and the mixture is reacted at 80° C. for 8 hours, and subjected to rotary evaporation to obtain organosilicon-modified benzoxazine; The preparation method of modified boron nitride is as follows: Step A: 5 parts of boron nitride and 50 parts of 3 mol / L sodium hydroxide aqueous solution are mixed evenly, stirred at 70° C. for 44 hours, filtered, washed and dried to obtain hydroxylated boron nitride; Step B: 5 parts of hydroxylated boron nitride, 50 parts of anhydrous ethanol, 10 parts of deionized water and 0.5 parts of 3-aminopropyltrimethoxysilane were mixed evenly, reacted at 60° C. for 3 hours, and after centrifugation, washing and drying, aminoated boron nitride was obtained; Step C: Ultrasonic dispersion of 5 parts of amino boron nitride in DMF to obtain a 2 g / L dispersion, adding 0.25 parts of terminal carboxyl hyperbranched polyester and 0.05 parts of p-toluenesulfonic acid, reacting at 30° C. for 5 hours, filtering, washing and drying to obtain modified boron nitride.

[0030] Embodiment 2: A membrane-decorated electronic product housing processing technology, comprising the following processes: Step S1: 70 parts of epoxy resin, 15 parts of organosilicon-modified benzoxazine and 40 parts of acetone are mixed evenly, 8 parts of modified boron nitride and 4 parts of graphene oxide are added, and the mixture is stirred at 45° C. for 30 minutes, and 16 parts of curing agent are added and mixed evenly to obtain a resin glue solution; Step S2: Coat the resin glue on the upper and lower surfaces of the glass fiber cloth (the coating amount on one side is 180g / m 2 ), dried at 115°C for 35 minutes to obtain a prepreg; 5 pieces of prepreg were stacked and a plate was obtained by 3D pressing technology (temperature 210°C, pressure 6MPa); Step S3: performing a primary transfer printing of flash sand, coating, a primary printing of varnish, a secondary transfer printing of texture, vacuum coating (aluminum oxide), and a secondary printing of color ink on the surface of the PET film in sequence, transferring the pattern to the film to obtain a transfer film; Step S4: screen printing PET glue on the surface of the transfer film, laminating it with the plate, drying and curing it, and performing release treatment to obtain an electronic product housing; The preparation method of silicone-modified benzoxazine is as follows: Step (1): 10 parts of hexamethyldisiloxane, 14 parts of deionized water, 18 parts of isopropanol and 6 parts of 1 wt% hydrochloric acid are mixed evenly, and a mixed solution of 17 parts of ethyl orthosilicate and 19 parts of 3-mercaptopropyltrimethylsilane is added dropwise for 40 minutes, and the mixture is reacted at 65°C for 3 hours. After washing and rotary evaporation, a mercapto-containing organosilicon is obtained; Step (2): 14 parts of mercapto-containing silicone, 24 parts of eugenol and 2 parts of 2-hydroxy-2-methylpropiophenone were mixed evenly and irradiated with ultraviolet light at a wavelength of 380 nm and an intensity of 30 mW / cm 2 , react for 50 min to obtain organosilicon-modified eugenol; Step (3): 6.25 parts of 1,12-diaminododecane, 5 parts of paraformaldehyde and 85 parts of 1,4-dioxane are uniformly mixed, and a mixed solution of 15 parts of organosilicon-modified eugenol and 60 parts of 1,4-dioxane is added dropwise for 40 minutes, and the mixture is reacted at 85° C. for 9 hours, and subjected to rotary evaporation to obtain organosilicon-modified benzoxazine; The preparation method of modified boron nitride is as follows: Step A: 8 parts of boron nitride and 96 parts of 4 mol / L sodium hydroxide aqueous solution were mixed evenly, stirred at 75° C. for 46 hours, filtered, washed and dried to obtain hydroxylated boron nitride; Step B: 8 parts of hydroxylated boron nitride, 88 parts of anhydrous ethanol, 24 parts of deionized water and 1.6 parts of 3-aminopropyltrimethoxysilane were mixed evenly, reacted at 65° C. for 4 hours, and after centrifugation, washing and drying, aminoated boron nitride was obtained; Step C: 8 parts of amino boron nitride are ultrasonically dispersed in DMF to obtain a 2.5 g / L dispersion, 0.8 parts of terminal carboxyl hyperbranched polyester and 0.16 parts of p-toluenesulfonic acid are added, and the mixture is reacted at 35° C. for 7 hours. After filtering, washing and drying, modified boron nitride is obtained.

[0031] Embodiment 3: A membrane-decorated electronic product housing processing technology, comprising the following processes: Step S1: 80 parts of epoxy resin, 20 parts of organosilicon-modified benzoxazine and acetone are mixed evenly, 10 parts of modified boron nitride and 5 parts of graphene oxide are added, and the mixture is stirred at 50° C. for 40 minutes, and 18 parts of curing agent are added and mixed evenly to obtain a resin glue solution; Step S2: Apply the resin glue to the upper and lower surfaces of the glass fiber cloth (the coating amount on one side is 200g / m 2 ), dried at 120°C for 40 minutes to obtain a prepreg; 5 pieces of prepreg were stacked and a plate was obtained by 3D pressing technology (temperature 220°C, pressure 8MPa); Step S3: performing a primary transfer printing of flash sand, coating, a primary printing of varnish, a secondary transfer printing of texture, vacuum coating (aluminum oxide), and a secondary printing of color ink on the surface of the PET film in sequence, transferring the pattern to the film to obtain a transfer film; Step S4: screen printing PET glue on the surface of the transfer film, laminating it with the plate, drying and curing it, and performing release treatment to obtain an electronic product housing; The preparation method of silicone-modified benzoxazine is as follows: Step (1): 12 parts of hexamethyldisiloxane, 15 parts of deionized water, 20 parts of isopropanol and 8 parts of 1 wt% hydrochloric acid are mixed evenly, and a mixed solution of 18 parts of ethyl orthosilicate and 20 parts of 3-mercaptopropyltrimethylsilane is added dropwise for 50 minutes, and the mixture is reacted at 70°C for 4 hours. After washing and rotary evaporation, a mercapto-containing organosilicon is obtained; Step (2): 15 parts of mercapto-containing silicone, 25 parts of eugenol and 3 parts of 2-hydroxy-2-methylpropiophenone were mixed evenly and irradiated with ultraviolet light at a wavelength of 400 nm and an intensity of 35 mW / cm 2 , react for 60 min to obtain organosilicon-modified eugenol; Step (3): 5 parts of 1,12-diaminododecane, 5 parts of paraformaldehyde and 75 parts of 1,4-dioxane are uniformly mixed, and a mixed solution of 20 parts of organosilicon-modified eugenol and 100 parts of 1,4-dioxane is added dropwise for 50 minutes, and the mixture is reacted at 90° C. for 10 hours, and subjected to rotary evaporation to obtain organosilicon-modified benzoxazine; The preparation method of the modified boron nitride is as follows: Step A: 10 parts of boron nitride and 5 mol / L sodium hydroxide aqueous solution are mixed evenly, stirred at 70-80° C. for 44-48 hours, filtered, washed and dried to obtain hydroxylated boron nitride; Step B: 10 parts of hydroxylated boron nitride, 120 parts of anhydrous ethanol, 40 parts of deionized water and 3 parts of 3-aminopropyltrimethoxysilane were mixed evenly, reacted at 70° C. for 5 hours, and after centrifugation, washing and drying, aminoated boron nitride was obtained; Step C: ultrasonically disperse 10 parts of amino boron nitride in DMF to obtain a 3 g / L dispersion, add 1.5 parts of terminal carboxyl hyperbranched polyester and 0.3 parts of p-toluenesulfonic acid, react at 40° C. for 8 hours, and obtain modified boron nitride after filtering, washing and drying.

[0032] Comparative Example 1: A membrane-decorated electronic product housing processing technology, comprising the following processes: The preparation method of eugenol-based benzoxazine is as follows: 6.25 parts of 1,12-diaminododecane, 5 parts of paraformaldehyde and 85 parts of 1,4-dioxane were mixed evenly, and a mixed solution of 15 parts of eugenol and 60 parts of 1,4-dioxane was added dropwise for 40 minutes, and the mixture was reacted at 85°C for 9 hours, and then subjected to rotary evaporation to obtain eugenol-based benzoxazine; Compared with Example 2, in Comparative Example 1, the organosilicon-modified benzoxazine is replaced with eugenol-based benzoxazine of the same mass, and the other steps are the same as those of Example 2.

[0033] Comparative Example 2: A membrane-decorated electronic product housing processing technology, comprising the following processes: The preparation method of amination boron nitride is as follows: Step A: 8 parts of boron nitride and 96 parts of 4 mol / L sodium hydroxide aqueous solution were mixed evenly, stirred at 75° C. for 46 hours, filtered, washed and dried to obtain hydroxylated boron nitride; Step B: 8 parts of hydroxylated boron nitride, 88 parts of anhydrous ethanol, 24 parts of deionized water and 1.6 parts of 3-aminopropyltrimethoxysilane were mixed evenly, reacted at 65° C. for 4 hours, and after centrifugation, washing and drying, aminoated boron nitride was obtained; Compared with Example 2, the modified boron nitride in Comparative Example 2 is replaced by an amino boron nitride of the same mass, and the other steps are the same as those in Example 2.

[0034] Comparative Example 3: A membrane-decorated electronic product housing processing technology, comprising the following processes: Compared with Example 2, Comparative Example 3 only adds 5 parts of organosilicon-modified benzoxazine, and the other steps are the same as Example 2.

[0035] experiment: 1. Water absorption test: Take the electronic product casings obtained in Examples 1-3 and Comparative Examples 1-3, make them into 50mm×10mm specimens, soak them in deionized water for 24h, the test temperature is 25°C, wipe off the surface moisture after taking them out, measure and record the quality difference before and after soaking, and calculate the water absorption rate.

[0036] 2. Tensile strength test: The electronic product housings obtained in Examples 1-3 and Comparative Examples 1-3 were tested for tensile strength according to the method disclosed in Part 4 of GB / T1040.4-2006, with a tensile rate of 50 mm / min.

[0037] 3. Wear resistance test: Take the electronic product casing obtained in Examples 1-3 and Comparative Examples 1-3, with a sample size of 30 mm × 7 mm, and use a friction and wear testing machine for testing. The grinding material is 45# steel with a hardness of 45HRC, a load of 200N, a rotation speed of 400r / min, and a time of 60min, and record the wear amount.

[0038] The test results are as follows: According to the data in the above table, we can clearly draw the following conclusions: Compared with Examples 1-3, the water absorption rate and wear amount of the products obtained in Comparative Examples 1 and 2 increased, and the tensile strength decreased, indicating that the silicone-modified benzoxazine prepared by the present invention has better hydrophobicity and mechanical properties than eugenol-based benzoxazine; compared with amino boron nitride, the modified boron nitride prepared by the present invention has better strength and toughness, thereby improving the mechanical properties of the material.

[0039] Compared with Examples 1-3, the water absorption rate and wear amount of the product obtained in Comparative Example 3 increased, and the tensile strength decreased. It can be seen that when the addition amount of silicone-modified benzoxazine is reduced, the hydrophobicity and mechanical properties of the material will decrease. This shows that the resin glue prepared by the present invention is affected by its component ratio. Selecting a component ratio within the said range can prepare a material with better performance.

[0040] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive in all respects, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention.

Claims

1. A membrane-decorated electronic product housing processing technology, characterized in that: The steps include: Step S1: epoxy resin, organosilicon-modified benzoxazine and acetone are mixed evenly, modified boron nitride and graphene oxide are added, stirred at 40-50° C. for 20-40 min, and then a curing agent is added and mixed evenly to obtain a resin glue solution; Step S2: coating the resin glue on the upper surface and the lower surface of the base fabric respectively, and drying at 110-120° C. for 30-40 minutes to obtain a prepreg; stacking several pieces of the prepreg, and obtaining a board through 3D lamination technology; Step S3: performing primary transfer, coating, primary printing, secondary transfer, coating, and secondary printing on the surface of the film in sequence to transfer the pattern onto the film to obtain a transfer film; Step S4: screen-printing glue on the surface of the transfer film, laminating it with the plate, drying and curing it, and performing release treatment to obtain an electronic product housing.

2. The electronic product housing processing technology for film decoration according to claim 1 is characterized by: The resin glue is composed of the following components, calculated by weight: 60-80 parts of epoxy resin, 10-20 parts of organosilicon-modified benzoxazine, 5-10 parts of modified boron nitride, 3-5 parts of graphene oxide, 30-50 parts of acetone, and 12-18 parts of curing agent.

3. The electronic product housing processing technology for film decoration according to claim 2 is characterized by: The preparation method of the organosilicon-modified benzoxazine is as follows: Step (1): uniformly mix hexamethyldisiloxane, deionized water, isopropanol and hydrochloric acid, drip into a mixed solution of ethyl orthosilicate and 3-mercaptopropyltrimethylsilane, drip for 30-50 minutes, react at 60-70°C for 2-4 hours, wash and rotary evaporate to obtain mercapto-containing organosilicon; Step (2): uniformly mixing the mercapto-containing organosilicon, eugenol and a photoinitiator, and reacting them for 30-60 minutes under ultraviolet light to obtain organosilicon-modified eugenol; Step (3): 1,12-diaminododecane, polyformaldehyde and 1,4-dioxane are mixed evenly, and a mixed solution of organosilicon-modified eugenol and 1,4-dioxane is added dropwise over 30-50 minutes, and the mixture is reacted at 80-90° C. for 8-10 hours, and the mixture is subjected to rotary evaporation to obtain organosilicon-modified benzoxazine.

4. The process for processing an electronic product housing with film decoration according to claim 3 is characterized in that: In the step (1), the mercapto-containing organosilicon is composed of the following components, calculated by weight: 8-12 parts of hexamethyldisiloxane, 10-15 parts of deionized water, 15-20 parts of isopropyl alcohol, 3-8 parts of hydrochloric acid, 15-18 parts of ethyl orthosilicate, and 18-20 parts of 3-mercaptopropyltrimethylsilane.

5. The electronic product housing processing technology for film decoration according to claim 3 is characterized by: In the step (2), the mercapto-containing silicone resin is composed of the following components, calculated by weight: 10-15 parts of mercapto-containing silicone, 20-25 parts of eugenol, and 1-3 parts of photoinitiator.

6. The electronic product housing processing technology for film decoration according to claim 3 is characterized by: In the step (3), the mass ratio of 1,12-diaminododecane, paraformaldehyde and 1,4-dioxane is 1:(0.5-1.0):(12-15).

7. The electronic product housing processing technology for film decoration according to claim 2 is characterized by: The preparation method of the modified boron nitride is as follows: Step A: Evenly mix boron nitride and sodium hydroxide aqueous solution, stir at 70-80° C. for 44-48 hours, filter, wash and dry to obtain hydroxylated boron nitride; Step B: Evenly mix hydroxylated boron nitride, anhydrous ethanol, deionized water and 3-aminopropyltrimethoxysilane, react at 60-70° C. for 3-5 hours, and obtain aminoated boron nitride after centrifugation, washing and drying; Step C: ultrasonically disperse the amino boron nitride in DMF to obtain a dispersion, add the terminal carboxyl hyperbranched polyester and p-toluenesulfonic acid, react at 30-40° C. for 5-8 hours, and obtain modified boron nitride after filtering, washing and drying.

8. The electronic product housing processing technology for film decoration according to claim 1 is characterized by: In the step S2, the material of the base fabric is any one of glass fiber, carbon fiber, ceramic fiber and aramid.

9. The electronic product housing processing technology for film decoration according to claim 1 is characterized by: In the step S3, the primary transfer is to flash sand.

10. An electronic product housing decorated with a film made according to the processing technology described in any one of claims 1 to 9.

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