A processing technology of a diaphragm decorated electronic product shell

Abstract

The present application relates to the technical field of electronic product shell, in particular to a kind of membrane decoration electronic product shell processing technology.The present application is by step S1: epoxy resin, organic silicon modified benzoxazine and acetone are mixed uniformly, modified boron nitride and graphene oxide are added, and curing agent is mixed uniformly, to obtain resin glue liquid;Step S2: resin glue liquid is coated on the upper surface of base cloth, lower surface, and dried at 110-120 DEG C for 30-40 min, to obtain prepreg;Several pieces of prepreg are stacked, and plate is obtained by 3D pressing technology;Step S3: first transfer, coating, first printing, second transfer, coating, second printing are sequentially carried out on the surface of membrane, and pattern is transferred to membrane, to obtain transfer membrane;Step S4: glue is silk-screen printed on the surface of transfer membrane, and it is laminated with plate, after drying and curing, it is carried out release treatment, to obtain electronic product shell.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic product shell, in particular to a film decoration electronic product shell processing technology. BACKGROUND

[0002] With the continuous development of the consumer electronics market, consumers increasingly demand aesthetic and personalized electronic products. Electronic product shells not only need to protect internal components, but also need to attract the attention of consumers in appearance. Film decoration technology can achieve a variety of colors, patterns and special effects (such as frosted texture, highlight effect, etc.), and is widely used in the processing of electronic product shells.

[0003] However, many film-decorated shells have poor water resistance, and the film material has insufficient friction resistance. In the case of long-term use or frequent contact, scratches and wear may appear on the surface of the film, affecting the appearance and texture.

[0004] To solve these problems, we propose a film-decorated electronic product shell processing technology. SUMMARY

[0005] The purpose of the present application is to provide a film-decorated electronic product shell processing technology to solve the problems in the prior art.

[0006] To achieve the above purpose, the present application provides the following technical solutions:

[0007] A film-decorated electronic product shell processing technology, comprising the following steps:

[0008] Step S1: Mix epoxy resin, silicone-modified benzoxazine and acetone uniformly, add modified boron nitride and graphene oxide, stir at 40-50℃ for 20-40min, then add curing agent and mix uniformly to obtain resin glue solution;

[0009] Step S2: Apply the resin glue solution to the upper and lower surfaces of the base cloth respectively, dry at 110-120℃ for 30-40min to obtain a prepreg; stack several pieces of prepreg, and obtain a plate through 3D pressing technology;

[0010] Step S3: Perform one-time transfer, coating, one-time printing, secondary transfer, film plating and secondary printing on the surface of the film in sequence to transfer the pattern to the film to obtain a transfer film;

[0011] Step S4: Silk screen glue on the surface of the transfer film, and bond with the plate. After drying and curing, perform release treatment to obtain an electronic product shell.

[0012] Furthermore, the resin adhesive is composed of the following components, in parts by weight: 60-80 parts epoxy resin, 10-20 parts organosilicon-modified benzoxazine, 5-10 parts modified boron nitride, 3-5 parts graphene oxide, 30-50 parts acetone, and 12-18 parts curing agent.

[0013] Furthermore, the preparation method of the organosilicon-modified benzoxazine is as follows:

[0014] Step (1): Mix hexamethyldisiloxane, deionized water, isopropanol and hydrochloric acid evenly, and add dropwise a mixed solution of tetraethyl orthosilicate and 3-mercaptopropyltrimethylsilane. The dropwise addition is completed in 30-50 minutes. React at 60-70℃ for 2-4 hours. After washing and rotary evaporation, mercapto-containing organosilicon is obtained.

[0015] Step (2): Mix mercapto-containing organosilicon, eugenol and photoinitiator evenly, and react under ultraviolet light for 30-60 min to obtain organosilicon-modified eugenol;

[0016] Step (3): Mix 1,12-diaminododecane, paraformaldehyde and 1,4-dioxane evenly, add a mixed solution of organosilicon-modified eugenol and 1,4-dioxane dropwise over 30-50 minutes, react at 80-90℃ for 8-10 hours, and obtain organosilicon-modified benzoxazine by rotary evaporation.

[0017] Furthermore, in step (1), the mercapto-containing organosilicon is composed of the following components, in parts by mass: 8-12 parts hexamethyldisiloxane, 10-15 parts deionized water, 15-20 parts isopropanol, 3-8 parts hydrochloric acid, 15-18 parts tetraethyl orthosilicate, and 18-20 parts 3-mercaptopropyltrimethylsilane.

[0018] Furthermore, the concentration of the hydrochloric acid is 1 wt%.

[0019] Furthermore, in step (2), the mercapto-containing silicone resin is composed of the following components, in parts by mass: 10-15 parts mercapto-containing organosilicon, 20-25 parts eugenol, and 1-3 parts photoinitiator.

[0020] Furthermore, the photoinitiator is 2-hydroxy-2-methylphenylacetone.

[0021] Furthermore, the process conditions for ultraviolet light irradiation are: irradiation wavelength 360-400nm, irradiation intensity 25-35mW / cm². 2 .

[0022] Furthermore, in step (3), the mass ratio of 1,12-diaminododecane, paraformaldehyde and 1,4-dioxane is 1:(0.5-1.0):(12-15).

[0023] Furthermore, in step (3), the mass of organosilicon-modified eugenol is 2-4 times the mass of paraformaldehyde, and the mass ratio of organosilicon-modified eugenol to 1,4-dioxane is 1:(3-5).

[0024] Furthermore, the preparation method of the modified boron nitride is as follows:

[0025] Step A: Mix boron nitride and sodium hydroxide aqueous solution evenly, stir at 70-80℃ for 44-48h, and after filtration, washing and drying, obtain hydroxylated boron nitride;

[0026] Step B: Hydroxylated boron nitride, anhydrous ethanol, deionized water and 3-aminopropyltrimethoxysilane are mixed evenly and reacted at 60-70℃ for 3-5 hours. After centrifugation, washing and drying, aminolated boron nitride is obtained.

[0027] Step C: Aminated boron nitride is ultrasonically dispersed in DMF to obtain a dispersion. Carboxyl-terminated hyperbranched polyester and p-toluenesulfonic acid are added, and the mixture is reacted at 30-40℃ for 5-8 hours. After filtration, washing, and drying, modified boron nitride is obtained.

[0028] Furthermore, in step A, the mass ratio of boron nitride to sodium hydroxide aqueous solution is 1:(10-15), and the concentration of sodium hydroxide aqueous solution is 3-5 mol / L.

[0029] Furthermore, in step B, the mass ratio of hydroxylated boron nitride to anhydrous ethanol, deionized water, and 3-aminopropyltrimethoxysilane is 1:(10-12):(2-4):(0.1-0.3).

[0030] Furthermore, in step C, the concentration of the dispersion is 2-3 g / L.

[0031] Furthermore, in step C, the mass of the terminal carboxyl hyperbranched polyester is 5-15% of the mass of the aminated boron nitride.

[0032] Furthermore, in step C, the mass of p-toluenesulfonic acid is 1-3% of the mass of aminoboron nitride.

[0033] Furthermore, in step S2, the amount of adhesive applied to one side is 150-200 g / m². 2 .

[0034] Furthermore, in step S2, the base fabric is made of any one of glass fiber, carbon fiber, ceramic fiber, or aramid.

[0035] Furthermore, in step S2, the process conditions for 3D pressing technology are: temperature of 200-220℃ and pressure of 5-8MPa.

[0036] Furthermore, in step S3, the process involves a first transfer of glitter sand, a first printing of varnish, a second transfer of texture, a metal oxide coating, and a second printing of color ink.

[0037] Compared with the prior art, the beneficial effects of the present invention are:

[0038] 1. The present invention provides a film-decorated electronic product casing processing technology, which uses epoxy resin and organosilicon-modified benzoxazine as the main resins, modified boron nitride and graphene oxide as inorganic fillers, and obtains a resin adhesive under the combined action of curing agent and solvent. The synergistic effect of organosilicon-modified benzoxazine and modified boron nitride improves the hydrophobicity and mechanical properties of the electronic product casing, providing more reliable protection for the electronic product.

[0039] A mercapto-containing organosilicon resin was prepared by hydrolysis copolymerization of hexamethyldisiloxane (MM), 3-mercaptopropyltrimethylsilane (KH-580), and tetraethyl orthosilicate (TEOS). This resin can further undergo a mercapto-olefin click reaction with the double bonds in eugenol, thus solving the problem of double bond instability in eugenol molecules and obtaining organosilicon-modified eugenol. Finally, using 1,12-diaminododecane, organosilicon-modified eugenol, and paraformaldehyde as raw materials, a hydrophobic alkyl long chain, organosilicon structure, and rigid benzoxazine structure were introduced to prepare organosilicon-modified benzoxazine. The hydroxyl groups after ring-opening polymerization of the benzoxazine structure can undergo polymerization reaction with epoxy groups, further achieving cross-linking and curing with epoxy groups. This significantly enhances the hydrophobicity, heat resistance, and wear resistance of the material, reduces water penetration, and maintains good physical properties at higher temperatures, thereby enhancing the overall durability and long-term reliability of electronic product casings.

[0040] Boron nitride (BN) surface is hydroxylated using a strong base to covalently attach -OH groups to B sites, forming hydroxylated boron nitride. Subsequently, it is modified by a carboxyl-terminated hyperbranched polyester in conjunction with 3-aminopropyltrimethoxysilane to obtain modified boron nitride. The hyperbranched polyester structure has a high molecular weight and good mechanical properties, which can effectively improve the strength and toughness of electronic product casings and significantly improve its dispersibility in epoxy resins. Detailed Implementation

[0041] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] In this embodiment, the epoxy resin is bisphenol A type epoxy resin, grade E-44; boron nitride is hexagonal boron nitride with a particle size of 500nm, sourced from Zhengzhou Ruichang Chemical Products Co., Ltd.; graphene oxide is model DN-20DY, with an average thickness of 1-3nm, a diameter of 4-7μm, and 2-5 layers, sourced from Zhejiang Zhitai Nanomaterials Co., Ltd.; curing agent is 4,4-diaminodiphenyl sulfone; glass fiber cloth is alkali-free glass roving with a thickness of 0.1mm, sourced from Taizhou Zhong Sheng Glass Fiber Products Co., Ltd.; PET film is 0.2mm thick, grade 818, sourced from Dongguan Jubang Plastic Materials Co., Ltd.; PET adhesive is model DN-85, sourced from Yangzhou Wenqi Materials Co., Ltd.; and carboxyl-terminated hyperbranched polyester is grade C102, sourced from Wuhan Hyperbranched Resin Technology Co., Ltd.

[0043] In the following examples and comparative examples, 1 part equals 10g.

[0044] Example 1: A processing technology for electronic product casings with diaphragm decoration, comprising the following processes:

[0045] Step S1: Mix 60 parts epoxy resin, 10 parts organosilicon-modified benzoxazine and 30 parts acetone evenly, add 5 parts modified boron nitride and 3 parts graphene oxide, stir at 40°C for 20 minutes, then add 12 parts curing agent and mix evenly to obtain resin solution.

[0046] Step S2: Apply the resin solution to the upper and lower surfaces of the fiberglass cloth respectively (coating amount on one side is 150g / m²). 2 The prepreg was dried at 110℃ for 30 minutes to obtain the prepreg; five sheets of prepreg were stacked and laminated using 3D pressing technology (temperature 200℃, pressure 5MPa) to obtain the board;

[0047] Step S3: On the surface of the PET film, perform the following steps in sequence: transfer sanding, coating, varnish printing, texture transfer, vacuum coating (alumina), and color ink printing to transfer the pattern onto the film and obtain the transfer film.

[0048] Step S4: Screen print PET adhesive on the surface of the transfer film, bond it to the board, dry and cure it, and then perform a release treatment to obtain the electronic product shell;

[0049] The preparation method of organosilicon-modified benzoxazine is as follows:

[0050] Step (1): Mix 8 parts hexamethyldisiloxane, 10 parts deionized water, 15 parts isopropanol and 3 parts 1wt% hydrochloric acid evenly, and add dropwise a mixed solution of 15 parts tetraethyl orthosilicate and 18 parts 3-mercaptopropyltrimethylsilane. The dropwise addition is completed in 30 min. React at 60℃ for 2 h. After washing and rotary evaporation, mercapto-containing organosilicon is obtained.

[0051] Step (2): Mix 10 parts of mercapto-containing organosilicon, 20 parts of eugenol and 1 part of 2-hydroxy-2-methylphenylacetone evenly, and irradiate under ultraviolet light at a wavelength of 360 nm and an intensity of 25 mW / cm². 2 The reaction was carried out for 30 minutes to obtain organosilicon-modified eugenol;

[0052] Step (3): Mix 10 parts of 1,12-diaminododecane, 5 parts of paraformaldehyde and 120 parts of 1,4-dioxane evenly, add 10 parts of organosilicon-modified eugenol and 30 parts of 1,4-dioxane dropwise, and add the mixture dropwise over 30 minutes. React at 80°C for 8 hours. After rotary evaporation, organosilicon-modified benzoxazine is obtained.

[0053] The preparation method of modified boron nitride is as follows:

[0054] Step A: Mix 5 parts boron nitride and 50 parts 3 mol / L sodium hydroxide aqueous solution evenly, stir at 70℃ for 44 h, and after filtration, washing and drying, obtain hydroxylated boron nitride;

[0055] Step B: Mix 5 parts of hydroxylated boron nitride, 50 parts of anhydrous ethanol, 10 parts of deionized water and 0.5 parts of 3-aminopropyltrimethoxysilane evenly, react at 60°C for 3 hours, and obtain aminolated boron nitride after centrifugation, washing and drying.

[0056] Step C: 5 parts of amino boron nitride were ultrasonically dispersed in DMF to obtain a 2 g / L dispersion. 0.25 parts of carboxyl-terminated hyperbranched polyester and 0.05 parts of p-toluenesulfonic acid were added, and the mixture was reacted at 30 °C for 5 h. After filtration, washing, and drying, modified boron nitride was obtained.

[0057] Example 2: A processing technology for electronic product casings with diaphragm decoration, comprising the following processes:

[0058] Step S1: Mix 70 parts epoxy resin, 15 parts organosilicon-modified benzoxazine and 40 parts acetone evenly, add 8 parts modified boron nitride and 4 parts graphene oxide, stir at 45°C for 30 minutes, then add 16 parts curing agent and mix evenly to obtain resin solution.

[0059] Step S2: Apply the resin solution to the upper and lower surfaces of the fiberglass cloth respectively (coating amount on one side is 180g / m²). 2 The prepreg was dried at 115℃ for 35 minutes to obtain the prepreg; five sheets of prepreg were stacked and pressed together using 3D pressing technology (temperature 210℃, pressure 6MPa) to obtain the board;

[0060] Step S3: On the surface of the PET film, perform the following steps in sequence: transfer sanding, coating, varnish printing, texture transfer, vacuum coating (alumina), and color ink printing to transfer the pattern onto the film and obtain the transfer film.

[0061] Step S4: Screen print PET adhesive on the surface of the transfer film, bond it to the board, dry and cure it, and then perform a release treatment to obtain the electronic product shell;

[0062] The preparation method of organosilicon-modified benzoxazine is as follows:

[0063] Step (1): Mix 10 parts hexamethyldisiloxane, 14 parts deionized water, 18 parts isopropanol and 6 parts 1wt% hydrochloric acid evenly, and add dropwise a mixed solution of 17 parts tetraethyl orthosilicate and 19 parts 3-mercaptopropyltrimethylsilane. The dropwise addition is completed in 40 min. React at 65℃ for 3 h. After washing and rotary evaporation, mercapto-containing organosilicon is obtained.

[0064] Step (2): Mix 14 parts of mercapto-containing organosilicon, 24 parts of eugenol and 2 parts of 2-hydroxy-2-methylphenylacetone evenly, and irradiate under ultraviolet light at a wavelength of 380 nm and an intensity of 30 mW / cm². 2 The reaction was carried out for 50 minutes to obtain organosilicon-modified eugenol;

[0065] Step (3): Mix 6.25 parts of 1,12-diaminododecane, 5 parts of paraformaldehyde and 85 parts of 1,4-dioxane evenly, add 15 parts of organosilicon-modified eugenol and 60 parts of 1,4-dioxane dropwise, and add the mixture dropwise over 40 minutes. React at 85°C for 9 hours. After rotary evaporation, organosilicon-modified benzoxazine is obtained.

[0066] The preparation method of modified boron nitride is as follows:

[0067] Step A: Mix 8 parts boron nitride and 96 parts 4 mol / L sodium hydroxide aqueous solution evenly, stir at 75℃ for 46 h, and after filtration, washing and drying, obtain hydroxylated boron nitride;

[0068] Step B: Mix 8 parts of hydroxylated boron nitride, 88 parts of anhydrous ethanol, 24 parts of deionized water and 1.6 parts of 3-aminopropyltrimethoxysilane evenly, react at 65°C for 4 hours, and obtain aminolated boron nitride after centrifugation, washing and drying.

[0069] Step C: 8 parts of amino boron nitride were ultrasonically dispersed in DMF to obtain a 2.5 g / L dispersion. 0.8 parts of carboxyl-terminated hyperbranched polyester and 0.16 parts of p-toluenesulfonic acid were added, and the mixture was reacted at 35 °C for 7 h. After filtration, washing, and drying, modified boron nitride was obtained.

[0070] Example 3: A processing technology for electronic product casings with film decoration, comprising the following processes:

[0071] Step S1: Mix 80 parts epoxy resin, 20 parts organosilicon-modified benzoxazine and acetone evenly, add 10 parts modified boron nitride and 5 parts graphene oxide, stir at 50°C for 40 minutes, then add 18 parts curing agent and mix evenly to obtain resin solution.

[0072] Step S2: Apply the resin solution to the upper and lower surfaces of the fiberglass cloth respectively (coating amount on one side is 200g / m²). 2 The prepreg was dried at 120℃ for 40 minutes to obtain the prepreg; five sheets of prepreg were stacked and laminated using 3D pressing technology (temperature 220℃, pressure 8MPa) to obtain the board;

[0073] Step S3: On the surface of the PET film, perform the following steps in sequence: transfer sanding, coating, varnish printing, texture transfer, vacuum coating (alumina), and color ink printing to transfer the pattern onto the film and obtain the transfer film.

[0074] Step S4: Screen print PET adhesive on the surface of the transfer film, bond it to the board, dry and cure it, and then perform a release treatment to obtain the electronic product shell;

[0075] The preparation method of organosilicon-modified benzoxazine is as follows:

[0076] Step (1): Mix 12 parts hexamethyldisiloxane, 15 parts deionized water, 20 parts isopropanol and 8 parts 1wt% hydrochloric acid evenly, and add dropwise a mixed solution of 18 parts tetraethyl orthosilicate and 20 parts 3-mercaptopropyltrimethylsilane. The dropwise addition is completed in 50 min. React at 70℃ for 4 h. After washing and rotary evaporation, mercapto-containing organosilicon is obtained.

[0077] Step (2): Mix 15 parts of mercapto-containing organosilicon, 25 parts of eugenol and 3 parts of 2-hydroxy-2-methylphenylacetone evenly, and irradiate under ultraviolet light at a wavelength of 400 nm and an intensity of 35 mW / cm². 2 The reaction was carried out for 60 minutes to obtain organosilicon-modified eugenol;

[0078] Step (3): Mix 5 parts of 1,12-diaminododecane, 5 parts of paraformaldehyde and 75 parts of 1,4-dioxane evenly, add 20 parts of organosilicon-modified eugenol and 100 parts of 1,4-dioxane dropwise, and add the mixture dropwise over 50 minutes. React at 90°C for 10 hours. After rotary evaporation, organosilicon-modified benzoxazine is obtained.

[0079] The method for preparing the modified boron nitride is as follows:

[0080] Step A: Mix 10 parts of boron nitride and 5 mol / L sodium hydroxide aqueous solution evenly, stir at 70-80℃ for 44-48 h, and after filtration, washing and drying, hydroxylated boron nitride is obtained;

[0081] Step B: Mix 10 parts of hydroxylated boron nitride, 120 parts of anhydrous ethanol, 40 parts of deionized water and 3 parts of 3-aminopropyltrimethoxysilane evenly, react at 70°C for 5 hours, and obtain aminolated boron nitride after centrifugation, washing and drying.

[0082] Step C: 10 parts of amino boron nitride were ultrasonically dispersed in DMF to obtain a 3 g / L dispersion. 1.5 parts of carboxyl-terminated hyperbranched polyester and 0.3 parts of p-toluenesulfonic acid were added, and the mixture was reacted at 40 °C for 8 h. After filtration, washing, and drying, modified boron nitride was obtained.

[0083] Comparative Example 1: A processing technology for an electronic product casing with film decoration, comprising the following processes:

[0084] The preparation method of eugenol-based benzoxazine is as follows:

[0085] 6.25 parts of 1,12-diaminododecane, 5 parts of paraformaldehyde and 85 parts of 1,4-dioxane were mixed evenly, and 15 parts of a mixed solution of eugenol and 60 parts of 1,4-dioxane were added dropwise over 40 minutes. The mixture was then reacted at 85°C for 9 hours and obtained by rotary evaporation.

[0086] Compared with Example 2, Comparative Example 1 replaced the organosilicon-modified benzoxazine with the same mass of eugenol-based benzoxazine, and the other steps were the same as in Example 2.

[0087] Comparative Example 2: A processing technology for an electronic product casing with film decoration, comprising the following processes:

[0088] The preparation method of aminated boron nitride is as follows:

[0089] Step A: Mix 8 parts boron nitride and 96 parts 4 mol / L sodium hydroxide aqueous solution evenly, stir at 75℃ for 46 h, and after filtration, washing and drying, obtain hydroxylated boron nitride;

[0090] Step B: Mix 8 parts of hydroxylated boron nitride, 88 parts of anhydrous ethanol, 24 parts of deionized water and 1.6 parts of 3-aminopropyltrimethoxysilane evenly, react at 65°C for 4 hours, and obtain aminolated boron nitride after centrifugation, washing and drying.

[0091] Compared with Example 2, Comparative Example 2 replaced the modified boron nitride with the same mass of amino boron nitride, and the other steps were the same as in Example 2.

[0092] Comparative Example 3: A processing technology for an electronic product casing with film decoration, comprising the following processes:

[0093] Compared with Example 2, Comparative Example 3 only added 5 parts of organosilicon-modified benzoxazine, and the other steps were the same as in Example 2.

[0094] experiment:

[0095] 1. Water absorption test: Take the electronic product shells obtained in Examples 1-3 and Comparative Examples 1-3, make them into 50mm×10mm samples, immerse them in deionized water for 24h, test the temperature at 25℃, take them out and wipe the surface moisture dry, measure and record the mass difference before and after immersion, and calculate the water absorption rate.

[0096] 2. Tensile strength test: Take the electronic product shells obtained in Examples 1-3 and Comparative Examples 1-3, and test their tensile strength according to the method disclosed in Part 4 of GB / T1040.4-2006. The tensile rate is 50 mm / min.

[0097] 3. Wear resistance test: Take the electronic product shells obtained in Examples 1-3 and Comparative Examples 1-3. The sample size is 30mm×7mm. The test is conducted using a friction and wear tester. The wear material is 45# steel with a hardness of 45HRC. The load is 200N, the rotation speed is 400r / min, and the time is 60min. The wear amount is recorded.

[0098] The test results are as follows:

[0099]

[0100] Based on the data in the table above, the following conclusions can be clearly drawn:

[0101] Compared with Examples 1-3, the products obtained in Comparative Examples 1 and 2 showed increased water absorption and wear, and decreased tensile strength, indicating that the organosilicon-modified benzoxazine prepared in this invention has better hydrophobic and mechanical properties than eugenol-based benzoxazine; and the modified boron nitride prepared in this invention has better strength and toughness than aminated boron nitride, thereby improving the mechanical properties of the material.

[0102] Compared with Examples 1-3, the water absorption and wear of the product obtained in Comparative Example 3 increased, while the tensile strength decreased. It can be seen that when the amount of organosilicon-modified benzoxazine added is reduced, the hydrophobicity and mechanical properties of the material will decrease. This indicates that the resin solution prepared by the present invention is affected by its component ratio. By selecting the component ratio within the range described above, a material with better performance can be prepared.

[0103] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within the present invention.

Claims

1. A processing technology for electronic product casings decorated with diaphragm film, characterized in that: Includes the following steps: Step S1: Mix epoxy resin, organosilicon-modified benzoxazine and acetone evenly, add modified boron nitride and graphene oxide, stir at 40-50℃ for 20-40 minutes, then add curing agent and mix evenly to obtain resin solution. Step S2: Apply resin liquid to the upper and lower surfaces of the base fabric respectively, and dry at 110-120℃ for 30-40 minutes to obtain prepreg; take several pieces of prepreg and stack them, and obtain the board through 3D pressing technology; Step S3: Perform one transfer, coating, one printing, two transfers, coating, and two printing on the surface of the film in sequence to transfer the pattern onto the film and obtain a transfer film. Step S4: Screen print adhesive on the surface of the transfer film, bond it to the board, dry and cure it, and then perform a release treatment to obtain the electronic product shell; The preparation method of the organosilicon-modified benzoxazine is as follows: Step (1): Mix hexamethyldisiloxane, deionized water, isopropanol and hydrochloric acid evenly, and add dropwise a mixed solution of tetraethyl orthosilicate and 3-mercaptopropyltrimethylsilane. The dropwise addition is completed in 30-50 minutes. React at 60-70℃ for 2-4 hours. After washing and rotary evaporation, mercapto-containing organosilicon is obtained. Step (2): Mix mercapto-containing organosilicon, eugenol and photoinitiator evenly, and react under ultraviolet light for 30-60 min to obtain organosilicon-modified eugenol; Step (3): Mix 1,12-diaminododecane, paraformaldehyde and 1,4-dioxane evenly, add a mixed solution of organosilicon-modified eugenol and 1,4-dioxane dropwise over 30-50 minutes, react at 80-90℃ for 8-10 hours, and obtain organosilicon-modified benzoxazine by rotary evaporation; The method for preparing the modified boron nitride is as follows: Step A: Mix boron nitride and sodium hydroxide aqueous solution evenly, stir at 70-80℃ for 44-48h, and after filtration, washing and drying, obtain hydroxylated boron nitride; Step B: Hydroxylated boron nitride, anhydrous ethanol, deionized water and 3-aminopropyltrimethoxysilane are mixed evenly and reacted at 60-70℃ for 3-5 hours. After centrifugation, washing and drying, aminolated boron nitride is obtained. Step C: Aminated boron nitride is ultrasonically dispersed in DMF to obtain a dispersion. Carboxyl-terminated hyperbranched polyester and p-toluenesulfonic acid are added, and the mixture is reacted at 30-40℃ for 5-8 hours. After filtration, washing, and drying, modified boron nitride is obtained. The resin adhesive is composed of the following components, in parts by weight: 60-80 parts epoxy resin, 10-20 parts organosilicon-modified benzoxazine, 5-10 parts modified boron nitride, 3-5 parts graphene oxide, 30-50 parts acetone, and 12-18 parts curing agent.

2. The electronic product casing processing technology with diaphragm decoration according to claim 1, characterized in that: In step (1), the mercapto-containing organosilicon is composed of the following components, in parts by mass: 8-12 parts hexamethyldisiloxane, 10-15 parts deionized water, 15-20 parts isopropanol, 3-8 parts hydrochloric acid, 15-18 parts tetraethyl orthosilicate, and 18-20 parts 3-mercaptopropyltrimethylsilane.

3. The electronic product casing processing technology with diaphragm decoration according to claim 1, characterized in that: In step (2), the mercapto-containing silicone resin is composed of the following components, in parts by mass: 10-15 parts mercapto-containing organosilicon, 20-25 parts eugenol, and 1-3 parts photoinitiator.

4. The electronic product casing processing technology with diaphragm decoration according to claim 1, characterized in that: In step (3), the mass ratio of 1,12-diaminododecane, paraformaldehyde and 1,4-dioxane is 1:(0.5-1.0):(12-15).

5. The electronic product casing processing technology with diaphragm decoration according to claim 1, characterized in that: In step S2, the base fabric is made of any one of glass fiber, carbon fiber, ceramic fiber, or aramid.

6. The electronic product casing processing technology with diaphragm decoration according to claim 1, characterized in that: In step S3, the transfer is done once using glitter sand.

7. An electronic product casing with film decoration, manufactured using the processing technology described in any one of claims 1-6.

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