A tin plating device for copper wire processing

Abstract

The present invention relates to the technical field of copper wire tin plating equipment, and particularly relates to a tin plating equipment for copper wire processing. It includes: a tin plating guiding table, on which an installation frame is installed. The installation frame is rotatably connected with a first threaded rod, the first threaded rod is threadedly connected with a connecting sleeve, the connecting sleeve is limitedly and slidably connected with a sliding frame, two connecting frames are fixedly connected to the sliding frame, a support block is slidably connected to the connecting frame, a mounting seat is rotatably connected to the support block, a rotating cylinder is installed between the two mounting seats, and an annular shell is rotatably connected inside the rotating cylinder. By rolling the rotating cylinder along the surface of the tin liquid and combining the annular shell to reduce the temperature of the rotating cylinder, the tin liquid carries oxides and solidifies on the rotating cylinder, removing the oxides on the tin liquid and reducing the possibility of the copper wire adhering to oxides when leaving the tin liquid, ensuring the integrity of the tin layer on the copper wire surface and the quality of copper wire tin plating.

Description

Technical Field

[0001] The present invention relates to the technical field of copper wire tin plating equipment, and particularly relates to a tin plating equipment for copper wire processing. Background Art

[0002] A copper wire tin plating device is a device used to coat a tin layer on the surface of a copper wire. Its main purpose is to improve the anti-oxidation performance, electrical conductivity, and surface smoothness of the copper wire, and at the same time extend its service life. The process of copper wire tin plating usually includes: removing impurities and oxide layers on the surface of the copper wire; removing moisture on the surface of the copper wire; immersing the copper wire in molten tin liquid to uniformly coat a tin layer on its surface; quickly cooling the tin-plated copper wire to make it take shape; and finally winding the tin-plated copper wire into a coil through a winding step.

[0003] During the actual operation of the copper wire tin plating device, after the impurities and oxide layers on the surface of the copper wire are removed, the copper wire carries a small amount of moisture into the tin liquid. The moisture reacts with the tin liquid, generating bubbles and oxides. At the same time, oxides will also form on the surface of the tin liquid during the contact with oxygen. These oxides will float on the surface of the tin liquid. The bubbles generated by the reaction of the copper wire carrying moisture with the tin liquid will push away the oxides at the position where the copper wire enters the tin liquid. However, the oxides pushed away by the bubbles will gradually accumulate towards the position where the copper wire exits the tin liquid. After the oxides accumulate on the surface of the tin liquid for a long time, a dense layer will be formed, resulting in the copper wire being more likely to adhere to oxides when leaving the tin liquid. If the oxides adhere to the tin plating layer of the copper wire, it will not only affect the appearance and quality of the tin plating layer of the copper wire, but also affect the corrosion resistance and electrical conductivity of the coating. During subsequent processing or use, faults such as coating peeling off and poor contact are likely to occur, thereby reducing the reliability and service life of the product. Summary of the Invention

[0004] Aiming at the problem that oxides on the surface of the tin liquid accumulate for a long time and are easily adhered to the tin plating layer of the copper wire, the present invention provides a tin plating equipment for copper wire processing.

[0005] The technical solution is: A tin plating equipment for copper wire processing, comprising:

[0006] Tin-plating guiding table, on which a heater and a copper wire guide are provided. An installation frame is installed at the copper wire guide on the tin-plating guiding table. The installation frame is rotatably connected with a first threaded rod. The first threaded rod is threadedly connected with a connecting sleeve. The connecting sleeve is limited and slidably connected with a sliding frame. The sliding frame is slidably connected with the installation frame. Two connecting frames are fixedly connected to the sliding frame. A supporting block is slidably connected to the connecting frame. A mounting seat is rotatably connected to the supporting block. A rotating cylinder is installed between the two mounting seats. The rotating cylinder is coaxial with the two mounting seats. An annular shell is rotatably connected inside the rotating cylinder. The annular shell is provided with two water pipes. The water pipes of the annular shell penetrate through the adjacent mounting seat and are rotatably connected with it;

[0007] Control mechanism, arranged on one of the connecting frames, for controlling the uniform rotation and movement of the rotating cylinder;

[0008] Adjusting mechanism, arranged on the sliding frame, for adjusting the moving distance according to the thickness of the tin layer on the rotating cylinder.

[0009] As a preference of the present invention, a plurality of grooves evenly distributed are arranged on the surface of the rotating cylinder.

[0010] As a preference of the present invention, the control mechanism includes a first motor and a synchronization component. The first motor is installed on one of the connecting frames. A second threaded rod is rotatably connected inside the connecting frame close to the first motor. The second threaded rod is threadedly connected with the adjacent supporting block. The second threaded rod is fixedly connected with the output shaft of the first motor. A second motor is arranged on the installation frame. The output shaft of the second motor is fixedly connected with the first threaded rod. The synchronization component is arranged on one of the connecting frames, for making the rotating cylinder rotate at a uniform speed during the translation process.

[0011] As a preference of the present invention, the synchronization component includes:

[0012] A first rack, fixedly connected to one of the connecting frames. A first one-way wheel is arranged on the mounting seat close to the first rack. A first gear is arranged on the first one-way wheel of the mounting seat. The first gear meshes with the first rack.

[0013] As a preference of the present invention, the diameter of the pitch circle of the first gear is not greater than the diameter of the rotating cylinder. The first rack is located below the first gear, for controlling the rotation direction of the rotating cylinder and the ratio of its rotation speed to its moving speed.

[0014] Preferably, as the present invention, the adjusting mechanism includes a fixed rod and an offset assembly. The fixed rod is fixedly connected to one side of the mounting frame. The fixed rod is slidably connected with a sliding bent rod. A positioning block is slidably connected to the mounting frame in a limited manner. The positioning block is used to hinder the movement of the sliding frame. One side of the sliding bent rod is provided with an inclined surface. The inclined surface of the sliding bent rod is used to squeeze the positioning block. The sliding bent rod is slidably connected with the sliding frame. The offset assembly is arranged on the sliding frame and is used to detect the maximum thickness of the tin layer on the surface of the rotating cylinder;

[0015] A second rack is arranged on one side of the mounting frame. A second one-way wheel is arranged on the mounting seat close to the second rack. A second gear is arranged on the second one-way wheel of the mounting seat. The second gear is used to mesh with the second rack.

[0016] Preferably, as the present invention, the offset assembly includes:

[0017] A sliding plate is slidably connected to the sliding frame. A first spring is fixedly connected between the sliding plate and the mounting frame. Two connecting bent rods are fixedly connected to the sliding plate. The connecting bent rods are slidably connected with the sliding frame. The sliding bent rod is slidably connected with the adjacent connecting bent rod.

[0018] Preferably, as the present invention, a limiting plate is slidably connected to the mounting frame in a limited manner. A second spring is fixedly connected between the limiting plate and the mounting frame. Sawteeth are arranged on the limiting plate. Sawteeth are arranged on the positioning block. The sawteeth on the positioning block and the sawteeth on the limiting plate are jointly used to hinder the movement of the positioning block. A limiting bent rod is slidably connected to the sliding frame. A tension spring is fixedly connected between the limiting bent rod and the sliding frame. A blind hole is arranged on the connecting sleeve. The limiting bent rod limits the movement of the connecting sleeve through the blind hole on the connecting sleeve. A protrusion is arranged on the positioning block. The protrusion of the positioning block is used to squeeze the limiting bent rod.

[0019] Preferably, the lower side surface of the sawteeth on the positioning block is a horizontal plane, and the upper side surface of the sawteeth on the positioning block is an inclined surface. The shape of the sawteeth on the limiting plate is complementary to the shape of the sawteeth on the positioning block.

[0020] Preferably, as the present invention, it further includes:

[0021] A fixing mechanism is arranged on the mounting frame and is used to position the fixing position of the mounting frame on the tin plating guiding table. The fixing mechanism includes:

[0022] A plurality of fixing bolts are all threadedly connected to the mounting frame. A pressing plate is rotatably connected by the plurality of fixing bolts. The pressing plate is used to press the copper wire guide on the tin plating guiding table. The mounting frame is threadedly connected with a plurality of fastening bolts, and the fastening bolts are used to press the tin plating guiding table.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. The present invention makes the rotating cylinder roll along the surface of the tin liquid, and combines with the annular shell to reduce the temperature of the rotating cylinder, so that the tin liquid carries the oxides and solidifies on the rotating cylinder, removing the oxides on the tin liquid, reducing the possibility of the copper wire adhering to the oxides when leaving the tin liquid, and ensuring the integrity of the tin layer on the surface of the copper wire and the quality of copper wire tin plating.

[0024] 2. The present invention changes the position of the positioning block through the sliding bent rod according to the change of the tin layer thickness on the surface of the rotating cylinder, restricting the downward movement distance of the sliding frame, so that the tin layer on the rotating cylinder maintains stable contact with the tin liquid during the process of gradually increasing thickness, ensuring the stability of the effect of removing the oxides on the surface of the tin liquid by the rotating cylinder each time.

[0025] 3. The present invention connects the tin plating guiding table and the mounting frame through the fastening bolts on the fixing mechanism, enabling the initial position of the rotating cylinder to be adjusted conveniently, and improving the convenience of the rotating cylinder to adaptively adjust according to the position of the copper wire entering and leaving the tin liquid. Description of the Drawings

[0026] Figure 1 is a three-dimensional structural schematic diagram of the present invention;

[0027] Figure 2 is a three-dimensional structural schematic diagram of the parts at the mounting frame and the rotating cylinder of the present invention;

[0028] Figure 3 is a three-dimensional structural schematic diagram of the parts at the first rack and the first gear of the present invention;

[0029] Figure 4 is a three-dimensional structural schematic diagram of the structure at the annular shell of the present invention;

[0030] Figure 5 is an exploded view of the internal structure of the rotating cylinder of the present invention;

[0031] Figure 6 is a three-dimensional structural schematic diagram of the parts at the first motor and the second threaded rod of the present invention;

[0032] Figure 7 is a three-dimensional structural schematic diagram of the parts at the sliding frame and the connecting sleeve of the present invention;

[0033] Figure 8 is a three-dimensional structural schematic diagram of the parts at the fixed rod and the sliding bent rod of the present invention;

[0034] Figure 9Schematic three-dimensional structure diagram of the parts at the positioning block and the limiting plate of the present invention;

[0035] Figure 10 Cross-sectional view of the parts at the positioning block and the limiting bent rod of the present invention;

[0036] Figure 11 Cross-sectional view of the parts at the positioning block and the limiting plate of the present invention.

[0037] The markings of each component in the drawings are as follows: 1 - Tin-plated guiding platform, 2 - Mounting frame, 3 - First threaded rod, 4 - Sliding frame, 5 - Connecting frame, 6 - Support block, 7 - Mounting seat, 8 - Rotating cylinder, 9 - Ring-shaped shell, 10 - Positioning block, 11 - Connecting sleeve, 21 - First motor, 22 - Second threaded rod, 23 - Second motor, 31 - First rack, 32 - First gear, 41 - Sliding plate, 42 - Connecting bent rod, 51 - Fixed rod, 52 - Sliding bent rod, 53 - Second rack, 54 - Second gear, 61 - Limiting plate, 62 - Limiting bent rod, 71 - Fixed bolt, 72 - Pressing plate, 73 - Fastening bolt. Detailed implementation manners

[0038] Next, in conjunction with the attached Figure 1 - attached Figure 11 , the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present invention.

[0039] Embodiment 1: During the use of the existing copper wire tin-plating device, oxides on the surface of the molten tin liquid will gradually accumulate, and the copper wire is prone to adhering oxides when leaving the tin liquid, resulting in incomplete tin plating layer of the copper wire, which will not only affect the appearance and quality of the tin plating layer of the copper wire, but also affect the corrosion resistance of the plating layer and the service life of the product.

[0040] What is disclosed in this embodiment is a tin-plating device for copper wire processing, which is used to simultaneously plate a layer of tin on the surfaces of multiple copper wires.

[0041] Referring to the attached Figure 1 - attached Figure 6, the copper wire tin plating device includes a tin plating guiding table 1, a mounting frame 2, a heater and a copper wire guide on the tin plating guiding table 1, and a first threaded rod 3 rotatably connected to the mounting frame 2, a sliding frame 4, a connecting frame 5, a support block 6, a mounting seat 7, a rotating cylinder 8, an annular shell 9, a positioning block 10, a connecting sleeve 11, a control mechanism and an adjusting mechanism. The mounting frame 2 is rotatably connected with a first threaded rod 3, the first threaded rod 3 is threadedly connected with a sliding frame 4, the sliding frame 4 is slidably connected with the mounting frame 2, two connecting frames 5 are fixedly connected to the sliding frame 4, a support block 6 is slidably connected to the connecting frame 5, a mounting seat 7 is rotatably connected to the support block 6, a rotating cylinder 8 is installed between the two mounting seats 7, the rotating cylinder 8 is coaxial with the two mounting seats 7, an annular shell 9 is rotatably connected inside the rotating cylinder 8, the annular shell 9 is provided with two water pipes, and the water pipes of the annular shell 9 penetrate through the adjacent mounting seats 7 and are rotatably connected therewith. The heater first heats molten tin liquid on the tin plating guiding table 1, and then the copper wire is conveyed from left to right and pressed into the tin liquid by the copper wire guide to complete the tin plating operation of the copper wire. When oxides appear on the right part of the surface of the tin liquid, the control mechanism controls the rotating cylinder 8 to move along the surface of the tin liquid and rotate synchronously, and circulating cooling water is introduced into the annular shell 9 through the water pipes of the annular shell 9, so that the surface temperature of the rotating cylinder 8 is slightly lower than the melting point of the tin liquid, and the surface layer of the tin liquid carries oxides and adheres to the rotating cylinder 8 and quickly solidifies, while the tin liquid inside still remains in a flowing state, and a new tin layer can be continuously stacked on the tin layer surface of the rotating cylinder 8 subsequently. During the process of the control mechanism controlling the rotating cylinder 8 to move back to its original position, the adjusting mechanism detects the thickness change of the tin layer on the surface of the rotating cylinder 8, automatically calculates and adjusts the limit position of the movement of the sliding frame 4, and adjusts the distance of the next downward movement of the rotating cylinder 8, so that the rotating cylinder 8 can perform multiple operations of removing oxide impurities and the tin liquid can stably adhere to the rotating cylinder 8.

[0042] The specific structures and connection relationships of the above-mentioned various components are as follows:

[0043] Please refer to the appendix Figure 1 - Appendix Figure 6 , there is an external control panel on the tin plating guiding table 1 (a conventional mechanism, not shown in the figure). A mounting frame 2 is installed in the middle of the tin plating guiding table 1. The first threaded rod 3 is rotatably connected to the rear of the mounting frame 2. By rotating the first threaded rod 3, the sliding frame 4 is controlled to move up and down. The sliding frame 4 is located on the right side of the mounting frame 2. The two connecting frames 5 are distributed front and back on the sliding frame 4. The distance between the two connecting frames 5 is equal to the width of the surface of the tin liquid. Only the lower side of the rotating cylinder 8 is in contact with the tin liquid. There is a cooling water pump outside the tin plating guiding table 1 (a conventional mechanism, not shown in the figure). The cooling water pump is used to inject cooling water into the water pipes of the annular shell 9 to make the cooling water circulate in the annular shell 9, maintain the temperature of the surface of the rotating cylinder 8, ensure the solidification state of the tin on the rotating cylinder 8, and make the tin liquid carry oxides and be solidified and adhered to the rotating cylinder 8 after being lifted by the rotating cylinder 8. Multiple grooves on the rotating cylinder 8 are used to increase the contact area between the tin liquid and the rotating cylinder 8 and assist the solidified tin to adhere to the rotating cylinder 8.

[0044] Refer to the attached Figure 2 , the attached Figure 3 and the attached Figure 6 , both the first motor 21 and the second threaded rod 22 are located on the rear connecting frame 5. The output shaft of the first motor 21 controls the forward and reverse rotation of the second threaded rod 22, thereby controlling the left and right movement of the rear support block 6. The support block 6 drives the rotating cylinder 8 to move left and right through the rear mounting seat 7. The heater, the annular shell 9, the first motor 21 and the second motor 23 are all electrically connected to the control panel. The first gear 32 and the first rack 31 are used to make the rotating cylinder 8 rotate synchronously when moving left and right (regarding the surface of the tin liquid as the ground and the rotating cylinder 8 as a wheel, the rotating cylinder 8 rolls along the surface of the tin liquid, so that the oxides on the surface of the tin liquid are lifted by the tin liquid with the rotating cylinder 8 and then solidify and adhere to the rotating cylinder 8). The diameter of the pitch circle of the first gear 32 is not greater than the diameter of the rotating cylinder 8, and is used to make the speed of the rotating cylinder 8 moving to the right not greater than the linear speed of the edge of the rotating cylinder 8, so that the oxides can stably adhere to the rotating cylinder 8 along with the tin liquid (if the diameter of the pitch circle of the first gear 32 is greater than the diameter of the rotating cylinder 8, the linear speed of the edge of the rotating cylinder 8 is less than its speed of moving to the right, and the situation that the rotating cylinder 8 pushes the oxides on the surface of the tin liquid to the right will occur). Through multiple moving and rolling operations of the rotating cylinder 8, the oxides on the surface of the tin liquid solidify layer by layer and adhere to the rotating cylinder 8 along with the tin liquid. The diameter of the rotating cylinder 8 gradually increases with its multiple cleanings of the oxides until the annular shell 9 can no longer lower the temperature of the lowermost side of the rotating cylinder 8 (the thickness of the tin layer on the surface of the rotating cylinder 8 reaches the limit), and then the solidified tin and oxides attached to the rotating cylinder 8 are cleaned. By adsorbing and removing the oxides on the surface of the tin liquid through the rotating cylinder 8, the cleanliness of the surface of the tin liquid near the place where the copper wire leaves the tin liquid is ensured, the possibility of the oxides adsorbing on the tin plating layer of the copper wire is reduced, the integrity of the tin plating layer of the copper wire and the quality of the copper wire tin plating are ensured. The first gear 32 can drive the rotating cylinder 8 to rotate synchronously through the first one-way wheel only when rotating clockwise (viewed from the front to the rear).

[0045] The above settings can achieve that during the operation of the copper wire tin plating device, when the oxides on the surface of the molten tin liquid accumulate and are about to approach the position where the copper wire leaves the tin liquid, the operator makes the output shaft of the second motor 23 drive the first threaded rod 3 to rotate a fixed number of turns through the control panel, the sliding frame 4 moves downward, the rotating cylinder 8 approaches the surface of the tin liquid, and at the same time, by injecting cooling water into the annular shell 9, the temperature on the surface of the rotating cylinder 8 is rapidly reduced. When the sliding frame 4 moves downward to the limit, the rotating cylinder 8 contacts the surface of the tin liquid. At this time, the control panel starts the first motor 21, and the first motor 21 makes the rotating cylinder 8 move to the right through the second threaded rod 22. The support block 6 and the mounting seat 7 drive the first gear 32 to move synchronously. The first gear 32 rotates because it meshes with the first rack 31. The first gear 32 and the mounting seat 7 drive the rotating cylinder 8 to rotate clockwise (viewed from front to back) through the first one-way wheel. The rotating cylinder 8 picks up the tin on the surface, and the tin carries the oxides and adheres to the surface of the rotating cylinder 8. At the same time, the tin carrying the oxides solidifies under the influence of the temperature on the surface of the rotating cylinder 8 after leaving the tin liquid with the rotating cylinder 8.

[0046] After the rotating cylinder 8 rotates clockwise for one circle, the oxides on the surface of the tin liquid solidify with the tin liquid and adhere to the rotating cylinder 8. After that, the control panel makes the rotating cylinder 8 move upward through the second motor 23, and the rotating cylinder 8 loses contact with the surface of the tin liquid. A layer of solid tin containing oxides appears on the surface of the rotating cylinder 8. The first motor 21 makes the rotating cylinder 8 quickly move to the left to the limit through the second threaded rod 22. When the rotating cylinder 8 moves to the left to the limit, the adjusting mechanism is not triggered. As the rotating cylinder 8 moves upward, the adjusting mechanism adjusts the position of the positioning block 10 by detecting the thickness of the tin adhered to the rotating cylinder 8, so as to achieve the purpose of limiting the moving distance when the rotating cylinder 8 moves downward next time, making the lowest side of the tin layer on the rotating cylinder 8 contact the tin liquid, and then making the rotating cylinder 8 stack another layer of tin on it again through movement and rotation. After the rotating cylinder 8 works multiple times, when the tin liquid that the tin layer on the rotating cylinder 8 cannot contact solidifies (that is, the thickness of the tin layer on the rotating cylinder 8 reaches the limit range of the temperature reduction of the annular shell 9), the control panel gives an alarm, so that the operator removes the tin layer on the rotating cylinder 8 (the tin layer can be remelted and the oxides and reusable tin can be separated). When the rotating cylinder 8 moves upward to the limit, the control panel turns off the second motor 23, and the rotating cylinder 8 returns to its initial position.

[0047] Adjusting mechanism:

[0048] Refer to Appendix Figure 2 、Appendix Figure 3 and Appendix Figure 7 -Appendix Figure 11 Refer to Appendix

[0049] Refer to Appendix Figure 6 and Appendix Figure 9, the sliding plate 41 is flush with the leftmost side of the rotating cylinder 8, and the axis of the sliding plate 41 and the rotating cylinder 8 is in the same horizontal plane. Initially, the positioning block 10 is at the lowermost side of the first threaded rod 3, and the sliding plate 41 only contacts the leftmost side of the rotating cylinder 8. The length of the sliding plate 41 is the same as the length of the rotating cylinder 8.

[0050] Refer to the appendix Figure 2 , appendix Figure 3 and appendix Figure 7 - appendix Figure 11 , the inclined surface of the sliding bent rod 52 is inclined from top to bottom and leftward, the inclination angle of the inclined surface of the connecting bent rod 42 is 45°, and the fixed rod 51 is used to make the sliding bent rod 52 move only left and right. When the thickness of the tin layer on the rotating cylinder 8 increases, the tin layer on the rotating cylinder 8 pushes the sliding plate 41 and the connecting bent rod 42 to move leftward, and the sliding bent rod 52 moves synchronously with the connecting bent rod 42. Initially, after the sliding frame 4 presses the positioning block 10, the lowermost side of the rotating cylinder 8 just contacts the molten tin. The upper side of the serrations on the positioning block 10 is inclined from top to bottom and rightward. The shape of the serrations on the positioning block 10 is complementary to the shape of the serrations on the limiting plate 61, and is used to make the limiting plate 61 limit the positioning block 10 to only move upward. Initially, the limiting bent rod 62 is located in the blind hole of the connecting sleeve 11. During the rotation of the first threaded rod 3, the first threaded rod 3 controls the up and down movement of the sliding frame 4 through the connecting sleeve 11. The protrusion on the positioning block 10 is used to pull the limiting bent rod 62, so that the connecting sleeve 11 and the sliding frame 4 slide relative to each other. The positioning block 10 is provided with a through hole for the connecting sleeve 11 to pass through, so that the sliding frame 4 drives the rotating cylinder 8 to stop at a set height through the positioning block 10. The resistance when the positioning block 10 moves is greater than the maximum pulling force of the tension spring connected to the limiting bent rod 62. The direction in which the second gear 54 drives the rotating cylinder 8 to rotate through the second one-way wheel is the same as the direction in which the first gear 32 drives the rotating cylinder 8 to rotate through the first one-way wheel.

[0051] The above arrangement can be realized that during the process of the first threaded rod 3 driving the sliding frame 4 and the rotating cylinder 8 to move upward through the connecting sleeve 11, when the control panel controls the first motor 21 to move the rotating cylinder 8 to the left to the limit, the second gear 54 is not engaged with the lowermost side of the second rack 53, and as the rotating cylinder 8 moves upward, the second rack 53 is engaged with the second gear 54, and the second gear 54 drives the rotating cylinder 8 to rotate clockwise (from front to back) through the second one-way wheel and the rear mounting seat 7, and different positions of the tin layer on the rotating cylinder 8 squeeze the sliding plate 41 (for measuring the thickest point of the tin layer on the rotating cylinder 8) in turn, and the sliding plate 41 drives the sliding bent rod 52 to move left through the connecting bent rod 42, and the sliding plate 41 compresses the first spring connected to it, the inclined surface of the sliding bent rod 52 pushes the positioning block 10 to move upward, the inclined surface of the serrations on the positioning block 10 squeezes the serrations on the limiting plate 61, the limiting plate 61 moves to the right and compresses the second spring connected to it, and when the rotating cylinder 8 moves upward to the limit, it returns to the initial position, and when the rotating cylinder 8 moves downward again, the protrusion on the positioning block 10 contacts and pushes the limiting bent rod 62 to move backward, the limiting bent rod 62 stretches the tension spring connected to it, the limit of the connecting sleeve 11 is released, the sliding frame 4 is supported by the positioning block 10 and stops moving (at this time, the limiting plate 61 supports the positioning block 10 through the meshing serrations), and the connecting sleeve 11 moves downward relative to the sliding frame 4 , the connecting sleeve 11 is inserted into the through hole of the positioning block 10. When the second motor 23 drives the first threaded rod 3 to rotate a fixed number of times, the control panel turns off the second motor 23, and the lowermost side of the rotating cylinder 8 with the tin layer contacts the tin liquid. The above operation makes the tin layer on the rotating cylinder 8 gradually thicken. The position of the positioning block 10 is adjusted by sliding the bent rod 52, and the downward movement distance of the rotating cylinder 8 is adaptively adjusted to ensure the effective contact between the rotating cylinder 8 and the tin liquid. At the same time, the thickness of the single-layer solidified tin layer on the rotating cylinder 8 is accurately controlled. In the process of the rotating cylinder 8 moving upward again, the connecting sleeve 11 contacts and drives the sliding frame 4 to move upward, and the sliding frame 4 loses contact with the positioning block 10. When the protrusion on the positioning block 10 is in contact with the tin liquid, the connecting sleeve 11 contacts and drives the sliding frame 4 to move upward. The sliding frame 4 loses contact with the positioning block 10. After the limit bending rod 62 loses contact, the limit bending rod 62 is reinserted into the blind hole of the connecting sleeve 11 under the tension of the tension spring connected to it, and the sliding frame 4 and the connecting sleeve 11 are relatively fixed. When the rotating cylinder 8 loses contact with the sliding plate 41, the sliding plate 41 moves to the right and resets under the elastic force of the first spring connected to it. Finally, after the operator removes the tin layer on the rotating cylinder 8, the operator manually moves the limit plate 61 to the right, and the second spring accumulates force to separate the serrations on the limit plate 61 from the serrations on the positioning block 10, and restores the positioning block 10 to its initial position. Then, the limit plate 61 is released to reset under the action of the second spring. At this point, all parts in the device are moved and reset.

[0052] Embodiment 2: A tin plating device for copper wire processing disclosed in this embodiment further improves the structure of the mounting frame 2 on the basis of Embodiment 1, making the mounting frame 2 a detachable structure. Since the depth at which the copper wire enters the tin solution needs to be set through the copper wire guide on the tin plating guiding table 1 before initial use, the distance between the positions where the copper wire enters and exits the tin solution is different. Therefore, it is necessary to change the initial position of the rotating cylinder 8 so that the rotating cylinder 8 will not contact the copper wire after moving and rotating one circle.

[0053] The specific structures, connection relationships, and working processes of the components in Embodiment 1 will not be elaborated here.

[0054] Refer to Appendix Figure 2 , Appendix Figure 3 , Appendix Figure 5 and Figure 9 , the fastening bolt 73 is used to squeeze the tin plating guiding table 1 to relatively fix the mounting frame 2 to the tin plating guiding table 1. By rotating the fixing bolt 71, the pressing plate 72 squeezes the copper wire guide on the tin plating guiding table 1, which is used to position the initial contact position of the rotating cylinder 8 with the tin solution and adjust the final position of the rotating cylinder 8 after rotating one circle, so as to avoid the rotating cylinder 8 contacting the copper wire that has just left the tin solution. The mounting seat 7 is bolted to the rotating cylinder 8, which is convenient for the operator to disassemble. At the same time, the operator injects hot oil (a high-temperature liquid with a temperature slightly lower than the melting point of tin) into the annular shell 9 through the water pipe of the annular shell 9 to soften the tin layer, so that the tin attached to the rotating cylinder 8 is softened, which is convenient for the operator to remove the tin from the rotating cylinder 8.

[0055] The above structure can achieve that before the existing copper wire tin plating device is used, it is necessary to set the depth at which the copper wire enters the tin solution through the copper wire guide, resulting in different distances between the positions where the copper wire enters the tin solution. Therefore, it is necessary to adjust the initial position of the rotating cylinder 8. After the operator completes the adjustment of the copper wire guide on the tin plating guiding table 1, the operator places the mounting frame 2 on the tin plating guiding table 1, rotates the fixing bolt 71 to make the pressing plate 72 squeeze the copper wire guide on the tin plating guiding table 1, and then adjusts the position of the rotating cylinder 8 through the mounting frame 2. Finally, the mounting frame 2 is fixed on the tin plating guiding table 1 through the fastening bolt 73. Subsequently, the rotating cylinder 8 is used to remove the oxides on the tin solution multiple times. When the thickness of the tin layer on the rotating cylinder 8 reaches the limit (that is, the cooling of the annular shell 9 cannot solidify the tin solution adhered to the tin layer on the rotating cylinder 8), the operator releases the bolt connection between the mounting seat 7 and the rotating cylinder 8, disassembles the rotating cylinder 8, and injects hot oil (or other high-temperature fluids) into the annular shell 9 to soften the tin on the rotating cylinder 8, which is convenient for the operator to quickly remove the tin with oxides on the rotating cylinder 8 and improve the convenience of using this device.

[0056] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only the specific implementation manners. Obviously, according to the content of this specification, many modifications and changes can be made. This specification selects and specifically describes these embodiments in order to better explain the principle and practical application of the present invention, so that those skilled in the art can well understand and utilize the present invention. As long as it does not deviate from the structure of the invention or exceed the protection scope of the present invention, it should fall within the protection scope of the present invention.

Claims

1. A tin plating device for copper wire processing, characterized by comprising: A tin plating guiding table (1), on which a heater and a copper wire guide are provided. An installation frame (2) is installed at the copper wire guide on the tin plating guiding table (1). The installation frame (2) is rotatably connected to a first threaded rod (3). The first threaded rod (3) is threadedly connected to a connecting sleeve (11). The connecting sleeve (11) is limited and slidably connected to a sliding frame (4). The sliding frame (4) is slidably connected to the installation frame (2). Two connecting frames (5) are fixedly connected to the sliding frame (4). A support block (6) is slidably connected to the connecting frame (5). An installation seat (7) is rotatably connected to the support block (6). A rotating cylinder (8) is installed between the two installation seats (7). The rotating cylinder (8) is coaxial with the two installation seats (7). An annular shell (9) is rotatably connected inside the rotating cylinder (8). The annular shell (9) is provided with two water pipes. The water pipes of the annular shell (9) penetrate through the adjacent installation seat (7) and are rotatably connected thereto; A control mechanism, arranged on one of the connecting frames (5), for controlling the uniform rotation and movement of the rotating cylinder (8); An adjusting mechanism, arranged on the sliding frame (4), for adjusting the moving distance according to the thickness of the tin layer on the rotating cylinder (8); During the process of the control mechanism controlling the moving reset of the rotating cylinder (8), the adjusting mechanism detects the thickness change of the tin layer on the surface of the rotating cylinder (8), automatically calculates and adjusts the limit position of the sliding frame (4) moving, and adjusts the distance of the next downward movement of the rotating cylinder (8), so that the rotating cylinder (8) can perform multiple operations of removing oxide impurities and make the tin liquid stably adhere to the rotating cylinder (8); The adjusting mechanism includes a fixed rod (51) and an offset component. The fixed rod (51) is fixedly connected to one side of the installation frame (2). The fixed rod (51) is slidably connected to a sliding bent rod (52). A positioning block (10) is limited and slidably connected to the installation frame (2). The positioning block (10) is used to hinder the movement of the sliding frame (4). One side of the sliding bent rod (52) is provided with an inclined surface. The inclined surface of the sliding bent rod (52) is used to squeeze the positioning block (10). The sliding bent rod (52) is slidably connected to the sliding frame (4). The offset component is arranged on the sliding frame (4) and is used to detect the maximum thickness of the tin layer on the surface of the rotating cylinder (8).

2. The tin plating equipment for copper wire processing according to claim 1, characterized in that, The surface of the rotating cylinder (8) is provided with a plurality of uniformly distributed grooves.

3. The tin plating device for copper wire processing according to claim 2, characterized in that, The control mechanism includes a first motor (21) and a synchronization component. The first motor (21) is installed on the connection frame (5) on one side. A second threaded rod (22) is rotatably connected inside the connection frame (5) near the first motor (21). The second threaded rod (22) is threadedly connected to the adjacent support block (6). The second threaded rod (22) is fixedly connected to the output shaft of the first motor (21). A second motor (23) is provided on the mounting bracket (2). The output shaft of the second motor (23) is fixedly connected to the first threaded rod (3). The synchronization component is arranged on the connection frame (5) on one side and is used to make the rotating cylinder (8) rotate at a uniform speed during the translation process.

4. The tin plating equipment for copper wire processing according to claim 3, characterized in that, The synchronization component includes: A first rack (31) fixedly connected to the connection frame (5) on one side. A first one-way wheel is arranged on the mounting seat (7) near the first rack (31). A first gear (32) is arranged on the first one-way wheel of the mounting seat (7). The first gear (32) meshes with the first rack (31).

5. A tin plating device for copper wire processing according to claim 4, characterized in that, The diameter of the pitch circle of the first gear (32) is not greater than the diameter of the rotating cylinder (8). The first rack (31) is located below the first gear (32) and is used to control the rotation direction of the rotating cylinder (8) and the ratio of its rotation speed to its moving speed.

6. The tin plating device for copper wire processing according to claim 4, characterized in that, A second rack (53) is arranged on one side of the mounting bracket (2). A second one-way wheel is arranged on the mounting seat (7) near the second rack (53). A second gear (54) is arranged on the second one-way wheel of the mounting seat (7). The second gear (54) is used to mesh with the second rack (53).

7. The tin plating equipment for copper wire processing according to claim 6, characterized in that, The offset component includes: A sliding plate (41) is slidably connected to the sliding frame (4). A first spring is fixedly connected between the sliding plate (41) and the mounting bracket (2). Two connecting bent rods (42) are fixedly connected to the sliding plate (41). The connecting bent rods (42) are slidably connected to the sliding frame (4). The sliding bent rod (52) is slidably connected to the adjacent connecting bent rod (42).

8. A tin plating device for copper wire processing according to claim 7, characterized in that, A limiting plate (61) is slidably and limitedly connected inside the mounting bracket (2). A second spring is fixedly connected between the limiting plate (61) and the mounting bracket (2). Sawteeth are arranged on the limiting plate (61). Sawteeth are arranged on the positioning block (10). The sawteeth on the positioning block (10) and the sawteeth on the limiting plate (61) are jointly used to hinder the movement of the positioning block (10). A limiting bent rod (62) is slidably connected to the sliding frame (4). A tension spring is fixedly connected between the limiting bent rod (62) and the sliding frame (4). A blind hole is arranged on the connecting sleeve (11). The limiting bent rod (62) limits the movement of the connecting sleeve (11) through the blind hole on the connecting sleeve (11). A protrusion is arranged on the positioning block (10). The protrusion on the positioning block (10) is used to squeeze the limiting bent rod (62).

9. A tin plating device for copper wire processing according to claim 8, characterized in that, The lower side of the serrations on the positioning block (10) is a horizontal plane, and the upper side of the serrations on the positioning block (10) is an inclined plane. The shape of the serrations on the limiting plate (61) is complementary to the shape of the serrations on the positioning block (10).

10. A tin plating device for copper wire processing according to claim 9, characterized in that it further Including: A fixing mechanism is provided on the mounting bracket (2) for positioning the mounting bracket (2) at a fixed position on the tin plating guiding table (1). The fixing mechanism includes: A plurality of fixing bolts (71) are all threadedly connected to the mounting bracket (2). A plurality of the fixing bolts (71) are commonly rotatably connected to a pressing plate (72). The pressing plate (72) is used to squeeze the copper wire guide on the tin plating guiding table (1). The mounting bracket (2) is threadedly connected with a plurality of fastening bolts (73), and the fastening bolts (73) are used to squeeze the tin plating guiding table (1).

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