Method for improving production efficiency of micro-channel plate

Abstract

The invention relates to the technical field of microelectronic manufacturing, in particular to a method for improving the production efficiency of a microchannel plate, which comprises the following steps of: performing coating treatment on a raw material of the microchannel plate by adopting a pulse laser deposition technology, and accurately controlling the deposition rate by adjusting the laser energy density; according to the set deposition rate and film thickness requirements, the proportion of reaction gas in the plasma enhanced chemical vapor deposition process is adjusted in real time; based on data feedback of an environment sensor, humidity and temperature in the production process are dynamically adjusted; and based on the result of the condition optimization, finely regulating and controlling the pressure and time parameters when the micro-channel is formed. The uniformity of deposition on the inner wall surface of the micro-channel is realized by adjusting the proportion of the reaction gas; the environmental conditions are dynamically adjusted based on sensor data to ensure stable material shrinkage and stress distribution.

Description

Technical Field

[0001] The present invention relates to the field of microelectronic manufacturing technology, and specifically to a method for improving the production efficiency of microchannel plates. Background Art

[0002] A microchannel plate (MCP) is a multi-channel electron multiplier device that achieves high-gain amplification of signals by utilizing the secondary electron emission effect within tiny channels. Its core structure is a glass sheet with millions of tiny through-holes (with diameters ranging from about several micrometers to dozens of micrometers), and the inner wall of each through-hole is coated with a secondary electron emission material to form independent electron multiplication channels. When charged particles or photons enter the channels, multiple collisions are triggered, generating an exponentially growing electron cloud, thereby enabling highly sensitive signal detection.

[0003] However, during the plasma-enhanced chemical vapor deposition (PECVD) process of microchannel plates, due to changes in the proportion of reaction gases, the deposition on the inner wall of the microchannels is uneven, and changes in environmental humidity and temperature during the production process also affect the shrinkage rate of the material, resulting in uneven stress distribution. Summary of the Invention

[0004] In view of the deficiencies of the prior art, the present invention provides a method for improving the production efficiency of microchannel plates, which solves the problems of film uniformity, uneven deposition on the inner wall, material shrinkage rate, and uneven stress distribution.

[0005] To achieve the above objectives, the present invention is realized through the following technical solutions: A method for improving the production efficiency of microchannel plates, comprising the following steps:

[0006] S1. Coating treatment is performed on the raw materials of the microchannel plate using pulsed laser deposition technology, and the deposition rate is precisely controlled by adjusting the laser energy density to ensure the uniformity of the film;

[0007] S2. According to the set deposition rate and film thickness requirements, the proportion of reaction gases during the plasma-enhanced chemical vapor deposition (PECVD) process is adjusted in real time to ensure the uniformity of deposition on the inner wall of the microchannels;

[0008] S3. Based on the feedback of environmental sensor data, the humidity and temperature during the production process are dynamically adjusted to maintain a stable shrinkage rate of the material and a uniform stress distribution;

[0009] S4. Based on the results of the above condition optimization, the pressure and time parameters during microchannel forming are finely controlled to solve the problem of channel geometry deviation.

[0010] Preferably, the specific steps of step S1 are as follows:

[0011] Select a suitable basic energy range [Emin, Emax] according to the material property table of the microchannel plate raw materials used;

[0012] By introducing an intelligent controller and analyzing experimental data, a dynamic response type energy scheduling mode is formulated. This controller can automatically adjust the laser energy input according to the deposition progress at different positions;

[0013] Set the following mathematical expression to check the deposition uniformity: F = max{|ρi - ρavg|} / ρavg ≤ ThresHold, where ρi is the local thickness, ρavg is the average film thickness, F is the factor measuring the degree of deviation from the standard, and Threshold is the allowable error range to ensure that the overall thickness is close;

[0014] Adjust the scanning speed or the degree of spot overlap immediately according to the recognition result of the feedback coating morphology image to optimize the final film formation effect.

[0015] Preferably, the specific steps of S2 are as follows:

[0016] Use a flowmeter in cooperation with a quality monitoring system to online measure the mixing ratio of various gases participating in the CVD process;

[0017] Set the expected deposition thickness dth according to the film thickness target and the known deposition rate V. Continuously approach dtarget = dth + Δd through an iterative algorithm until the optimal solution is obtained. Δd is determined by the formula Δd = (V * tdeposit / R), where V is the deposition rate, tdeposit is the total deposition time, and R is a proportionality factor reflecting the reaction activity level, used to quantify the deviation of the actual deposition rate caused by the change in gas composition;

[0018] Establish a gas flow simulation model to identify and optimize in advance the possible uneven deposition areas, and particularly strengthen the process parameter management at this position to achieve better flatness control;

[0019] Arrange a special person to be responsible for tracking the key performance indicators at each stage during the entire CVD process and adjust them to the optimal state immediately to ensure the uniformity and reliability of each layer formed.

[0020] Preferably, the specific steps of S3 are as follows:

[0021] Continuously obtain the internal state of the working space through high-precision temperature and humidity sensing probes installed on the production line;

[0022] Based on the data obtained above, use system software to analyze the recommended set points under the best environmental conditions in the current situation;

[0023] Based on the following formula for evaluating whether a stable working environment index is reached: S = a * exp

b * (T - Tset) + c * abs(RH - RHstd)

[0024] Adopt a combination of circulating water cooling and air curtain barrier to strictly limit the possibility of unplanned moisture intrusion and enhance the system's ability to resist external interference.

[0025] Preferably, the specific steps of the S4 step are as follows:

[0026] Based on the feedback data of the microchannel size measurement sensor, dynamically calculate the optimal pressure adjustment increment △P to adapt to different channel wall thickness differences and ensure consistent channel geometry;

[0027] Use the formula △T = k * △D to adjust the time increment △T, where △D is the change in material thickness and k is a proportionality coefficient related to the device characteristics. This relationship helps to maintain uniformity; when ΔT > Tmax (the set maximum allowable time difference), set ΔT to Tmax;

[0028] Introduce a real-time monitoring system to detect and compensate for the influence of fluctuations in the environmental temperature T on the time increment ΔT;

[0029] Verify the results after each adjustment and compare and analyze them with the original samples to continuously optimize the adjustment strategy.

[0030] The present invention provides a method for improving the production efficiency of microchannel plates. It has the following beneficial effects:

[0031] 1. The present invention regulates the deposition rate of raw materials to ensure the uniformity of the coating; adjusts the ratio of reaction gases to achieve the uniformity of deposition on the inner wall of the microchannel; dynamically adjusts the environmental conditions based on sensor data to ensure the stability of the material shrinkage rate and stress distribution; precisely controls the forming pressure and time of the microchannel to avoid geometric shape deviation; and finally, strictly controls the current density and solution composition during electroplating or coating to maintain the consistency of the thickness of the electrode or surface conductive layer. Detailed implementation mode

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0033] Embodiment:

[0034] An embodiment of the present invention provides a method for improving the production efficiency of a microchannel plate, including the following steps:

[0035] S1. First, the coating treatment is carried out on the raw material of the microchannel plate by using the pulsed laser deposition technology to solve the problem of how to regulate the deposition rate of the raw material of the microchannel plate. In this process, the laser source emits a laser beam with a set energy density, evaporates the target substance at a momentary high temperature, and makes it quickly condense on the substrate material to form a thin film. In this process, the laser energy density is a very important variable because it not only affects the velocity of the evaporated particles but also indirectly affects their diffusion rate and the quality of the finally formed thin film. In order to effectively control the growth rate of the thin film and achieve an ideal uniform effect, a special control system has been developed, which can automatically fine-tune the energy of each pulse according to the experimental preset target, so that the actual deposition rate is always within the designed range. For example, in one embodiment, if the target thickness needs to remain unchanged, but it is found that one side starts to deposit faster, the control system will reduce the number of pulses at this position or reduce the energy output per unit area until the deposition process on the entire surface tends to be uniform. This method effectively overcomes the defect of uncontrollable speed in the traditional method, significantly improves the consistency and aesthetics of the finished product, and because of its very high precision, it has high practicability in large-scale production.

[0036] S2. Then, to solve the problem of uneven deposition on the inner wall surface of the microchannel, the method emphasizes that the ratio of the reaction gases in the PECVD process should be adjusted in real time according to the set deposition rate and the requirements of the thin film thickness. This step involves complex chemical reactions and gaseous transport processes. Accurately dispensing each pair of reacting gases is crucial for whether high-quality products can be manufactured. For this purpose, a high-precision mass flow controller (MFC) is used in cooperation with an on-line detection device to continuously monitor the changes in the concentrations of different elements in the chamber. Once any deviation is detected, the feedback loop is immediately activated to reset the quantity of the gas released from the input port until all data are within the optimal range.

[0037] S3. Then comes the part about real-time regulation of changes in environmental humidity and temperature. Since microelectronic devices usually require an extremely high degree of precision, the surrounding environmental factors often play a crucial role in their construction process. In particular, excessive air humidity may cause the material to absorb moisture and expand, causing the product to warp and deform, while if the air is too dry, the powder particles may fly and be difficult to condense. Similarly, extreme temperature differences can easily cause problems such as plastic deformation or cracking. Therefore, intelligent monitoring equipment is introduced to track and record the changes in these indicators around the clock, and predict potential risks through algorithm models so as to take preventive measures in advance, such as ventilation and dehumidification or turning on auxiliary heating facilities, so that the overall atmosphere during processing is in a constant state, which is conducive to reducing the probability of defective products. It is also beneficial to the physical and mental health of workers and improves the comfort and safety of on-site operations.

[0038] S4. Based on the above conditions, the specific parameters of pressure and time in the microchannel molding process that are further optimized are also important factors that determine the quality of the finished product and the accuracy of the external dimensions. On this basis, it is proposed that by making more precise adjustments to these two dimensions, the position errors that may occur in the previous process can be better corrected to achieve a better product qualification rate.

[0039] To sum up, by comprehensively and systematically covering the solutions to several types of key challenges in four aspects, it not only reflects the advantages and characteristics of interdisciplinary comprehensive integration in the modern high-tech field, but also helps to promote the related industries to continue to move towards high-end, green and intelligent development.

[0040] The S1 steps are as follows:

[0041] First, select a suitable basic energy range [Emin, Emax], which depends on the material property table of the microchannel plate raw material. The goal here is to determine the basic laser energy density during pulsed laser deposition through material properties to ensure that the material can effectively respond and form high-quality films under controlled conditions.

[0042] Secondly, a dynamic response energy scheduling mode is established by combining an intelligent controller with experimental data analysis. This process includes automatically adjusting the laser energy that can be input to the sample surface according to the deposition progress at different locations. For example, in one embodiment, the intelligent control system monitors the film thickness in different areas in real time through sensors, and adjusts the power parameters in each scanning cycle accordingly to ensure that the entire micro-area can evenly receive the required energy and prevent defects caused by overheating or cooling in individual places.

[0043] Furthermore, a specific mathematical expression is introduced to check the uniformity: F = max{|ρi - ρavg|} / ρavg ≤ ThresHold, where ρi represents the local thickness value at each detection point, that is, the actually measured coating thickness at each location; ρavg represents the standard thickness averaged over all detection points and is used as a reference benchmark point; F is a factor that measures the deviation of the local thickness from being too thick or too thin relative to the mean value; Threshold means the maximum allowable error limit, and the default value can be taken as 3% - 5%. By defining the standard in this way, the quality fluctuation range is controlled to ensure that the high-standard requirements for the overall film density and structural consistency are maintained.

[0044] Finally, the final film-forming quality is optimized based on the feedback image recognition technology. Specifically, according to the instant coating surface morphology map obtained from a high-resolution optical microscope, two important parameters can be dynamically adjusted, namely the scanning speed and the overlap percentage between the light spots. For example, when the scanning rate is too fast, stripe phenomena may occur, so the scanning speed is appropriately reduced, and increasing the overlap percentage can enhance the tightness of the connection between adjacent scans, thereby improving the smoothness and integrity of the finished product.

[0045] Through the application of the above steps and their specific implementation plans, not only can high-performance microchannel plate products be manufactured efficiently and accurately, but also the stability and flexibility of the production process are significantly improved.

[0046] The specific steps of S2 are as follows:

[0047] The first step is to introduce a flow meter in the CVD reaction in cooperation with a quality monitoring system. The mixing ratio of various gases participating in the process is measured online to maintain stable reaction conditions and optimize the ratio of gaseous reactants.

[0048] The second step is to adjust the expected final deposition layer thickness dth according to the expected film thickness target and the existing deposition rate V, and seek the optimal value through an iterative algorithm. Specifically, the actually measured deposition thickness is gradually approximated to the target dtarget = dth + Δd until the optimal solution is obtained. Δd is determined by the formula Δd = (V * tdeposit / R), where V is the deposition rate, tdeposit is the total deposition time, and R reflects the actual deviation degree of the deposition rate caused by the change in reaction activity (the value range is between 0.8 and 1.2). The purpose of setting such a formula is to make the increment or decrement calculated each time can be accurately quantified and fed back to the adjustment of process parameters, so as to more effectively achieve the ideal film thickness distribution.

[0049] The third step involves establishing a gas flow simulation model to identify potential non-uniform deposition areas in advance. For example, in the manufacturing of microchannel plates, poor coverage may occur in certain areas such as corners. Based on this modeling and simulation, it can help determine these special locations and allow for process corrections or enhancements at these points, such as increasing the local gas supply density or adjusting the temperature settings, to ensure that all surfaces receive the same treatment intensity and obtain a more flat and uniform coating layer.

[0050] The fourth step is to assign a dedicated person to comprehensively track and record each stage during the entire CVD cycle and implement timely responsive adjustment strategies. During this process, the focus will be on monitoring the performance indicators (KPIs) of different process segments, including factors such as pressure, flow rate, and power. Maintaining the consistency of the entire deposition process can thus improve the film formation homogeneity and long-term stable performance at each layer, further enhancing the quality output level of the microchannel plate.

[0051] The specific steps of S3 are as follows:

[0052] Continuously obtain the status information inside the working space through high-precision temperature and humidity sensing probes installed on the production line. By this means, ensure the accuracy of real-time monitoring of the temperature and humidity conditions during the production process of microchannel plates, enabling rapid detection of environmental changes and providing an accurate basis for the next adjustment strategy. For example, in a specific case, whenever a new microchannel processing cycle is started on the production line, the sensing device will immediately enter the data collection stage to record the actual temperature and humidity values in the workshop at each moment.

[0053] Based on the previously obtained dataset, the system reacts and makes predictions about the current situation by means of preset algorithms or rules, and uses the system software to analyze the optimal solution under the current situation - that is, the recommended setting points for the best working condition parameters. This process can help find the best environmental control points that can both meet the quality standards and improve the processing rate.

[0054] The formula S = a*exp

b*(T - Tset)+c*abs(RH - RH_std)

[0055] To avoid the impact caused by unplanned moisture penetration into the clean room, the microchannel plate manufacturing area adopts a form of a circulating water - cooling device combined with an air curtain barrier to enhance the protection level, ensuring a good air pressure difference and air flow isolation state inside and outside the enclosed area, and reducing the frequency and intensity of external factors affecting the production line. Specifically, the circulating refrigeration unit can maintain a cool and constant temperature level in the room, while the continuously operating wind - blocking partition can effectively block the flow path of external humid gas, delaying the speed of moisture diffusion to the processing position, thereby better supporting the stability of the entire production process.

[0056] The specific steps of S4 are as follows:

[0057] First, optimize and adjust the pressure during the microchannel forming process. Collect feedback data through a microchannel size measurement sensor and dynamically calculate the optimal pressure adjustment increment △P. This can effectively adapt to the channel wall thickness differences between different product batches on the production line, ensuring that the geometric shape of each formed microchannel maintains consistency and high precision.

[0058] In the second step, use the formula △T = k*△D to adjust the time increment, where the parameter △D represents the change in material thickness under specific processing conditions, and k is a proportionality coefficient determined according to the characteristics of relevant manufacturing equipment. Usually, the value of k is within a small range to ensure that the adjustment is neither excessive nor insufficient. This setting allows the system to correspondingly change the curing or processing time based on the specific value obtained after fine - tuning. If the calculated time difference exceeds the preset maximum allowable value Tmax (set maximum allowable time difference), the system will automatically correct the out - of - range time value to Tmax. This approach ensures good product uniformity even under complex process requirements.

[0059] Subsequently, to address the potential impact of uncertainties caused by changes in the ambient temperature T during the production process on the time increment ΔT, this solution introduces an advanced real-time monitoring mechanism to continuously monitor and evaluate the effects of these external disturbances and make timely adjustment compensations accordingly, thereby further stabilizing the production parameters. Specifically, in actual operation, once abnormal temperature fluctuations occur, this link can promptly notify the control system to take appropriate compensation measures according to predefined rules to avoid product quality problems caused by environmental factors.

[0060] Finally, each parameter modification requires checking and verifying its results and strictly comparing them with previous samples to ensure that each improvement moves towards the goal of optimizing performance and quality. Various statistical analysis methods may be employed during this process to quantify the improvement effects and identify areas that can still be optimized. For example, after several consecutive batches of tests, it is found that a certain type of adjustment pattern is more conducive to improving the overall efficiency and yield rate of the microchannel plate than others.

[0061] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A method for improving the production efficiency of a microchannel plate, characterized in that: The following steps are involved: S1. Pulsed laser deposition technology is used to coat the raw materials of the microchannel plate, and the deposition rate is precisely controlled by adjusting the laser energy density to ensure the uniformity of the film; S2. According to the set deposition rate and film thickness requirements, the ratio of the reaction gas in the plasma enhanced chemical vapor deposition (PECVD) process is adjusted in real time to ensure the uniformity of the deposition on the wall surface inside the microchannel; S3. Based on the environmental sensor data feedback, dynamically adjust the humidity and temperature during the production process to maintain a stable shrinkage rate and uniform stress distribution of the material; S4. Based on the results of the above optimization conditions, the pressure and time parameters during microchannel molding are finely controlled to solve the problem of channel geometry deviation.

2. A method for improving the production efficiency of a microchannel plate according to claim 1, characterized in that: The S1 step is specifically as follows: Select the appropriate basic energy range [Emin, Emax] according to the material property table of the microchannel plate used; By introducing an intelligent controller and combining it with experimental data analysis, a dynamic response energy scheduling mode is developed. The controller can automatically adjust the laser energy input according to the deposition progress at different locations. The following mathematical expression is set to check deposition uniformity: F = max{|ρi-ρavg|} / ρavg≤ThresHold, where ρi is the local thickness, ρavg is the average film thickness, F is a factor to measure the degree of deviation from the standard, and Threshold is the allowable error range to ensure that the overall thickness is close; According to the feedback of coating morphology image recognition results, the scanning speed or spot overlap degree is adjusted in real time to optimize the final film forming effect.

3. A method for improving the production efficiency of a microchannel plate according to claim 1, characterized in that: The S2 step is specifically as follows: Use flow meters in conjunction with quality monitoring systems to measure the mixing ratio of various gases involved in the CVD process online; The expected deposition thickness dth is set according to the film thickness target and the known deposition rate V, and dtarget = dth + Δd is continuously approached by an iterative algorithm until the optimal solution is obtained. Δd is determined by the formula Δd = (V*tdeposit / R), where V is the deposition rate, tdeposit is the total deposition time, and R is a proportional factor reflecting the reaction activity level, which is used to quantify the actual deposition rate deviation caused by the change in gas composition; Establish a gas flow simulation model to identify and optimize possible uneven deposition areas in advance, and strengthen process parameter management specifically for this location to achieve better flatness control; Assign dedicated personnel to track the key performance indicators at each stage during the entire CVD process and adjust them to the optimal state in real time to ensure the uniformity and reliability of the formation of each layer.

4. The method for improving the production efficiency of a microchannel plate according to claim 1, characterized in that: The S3 step is specifically as follows: Continuously obtain the internal status of the workspace through high-precision temperature and humidity sensor probes installed on the production line; Based on the data obtained above, the system software is used to analyze the recommended set points under the best environmental conditions under the current situation; The following formula is used to evaluate whether a stable working environment index S=a*exp[b*(T-Tset)+c*abs(RH-RHetd)] is achieved, where a, b, c are constant factors, RH is the current relative humidity, RHstd is the set humidity, T is the current temperature, and Tset is the target temperature. If S is lower than a certain threshold, an alarm is triggered or an adjustment mechanism is adjusted to ensure consistent shrinkage of the material; A combination of circulating water cooling and air curtain barriers is used to strictly limit the possibility of unplanned moisture intrusion and enhance the system's ability to resist external interference.

5. The method for improving the production efficiency of a microchannel plate according to claim 1, characterized in that: The S4 step is specifically as follows: Based on the feedback data of the microchannel size measurement sensor, the optimal pressure adjustment increment △P is dynamically calculated to adapt to the different channel wall thickness differences and ensure the consistency of channel geometry; Use the formula △T=k*△D to adjust the time increment △T, where △D is the change in material thickness and k is a proportional coefficient related to the characteristics of the equipment. This relationship helps maintain uniformity; when △T>Tmax (set the maximum allowable time difference), set △T to Tmax; A real-time monitoring system is introduced to detect and compensate for the effect of fluctuations in ambient temperature T on the time increment ΔT; The results after each adjustment are verified and compared with the original samples, and the adjustment strategy is continuously optimized.