Base
By designing a base with lateral dislocation holes, the problem of low heat dissipation efficiency of fluorescent materials in optical projectors is solved, and a higher heat dissipation area, lower weight load and higher structural rigidity are achieved, improving the overall performance of the projector.
Patent Information
- Application Number
- CN202311580741.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-24
- Publication Date
- 2025-05-27
AI Technical Summary
The heat dissipation demand for fluorescent materials in optical projectors is becoming increasingly stringent, and the prior art is difficult to effectively improve the heat dissipation efficiency of the roulette and its fluorescent materials.
A base is designed for application in a wavelength conversion device. A plurality of first holes and second holes are respectively provided on the first surface and the second surface of the base. The first hole is in communication with the second hole and is laterally dislocated, and the specific surface area and structural rigidity of the base are improved through this structure.
The specific surface area of the base is increased, thereby increasing the overall heat dissipation area, reducing the overall weight of the substrate, slowing down the motor load power, and increasing the structural rigidity of the substrate through the interlaced holes, stably increasing the rotation speed and cavity air flow operation.
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Figure CN120044670A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to a base, and more particularly to a base applied to a wavelength conversion device. Background Art
[0002] In recent years, optical projectors have been applied in many fields, and the application scope has been gradually expanding, such as from consumer products to high-tech devices. Various optical projectors are also widely used in schools, homes, and commercial occasions to magnify the display pattern provided by the signal source and display it on the projection screen.
[0003] For the light source configuration of an optical projector, it can drive a fluorescent material to emit light through a solid-state laser light source. In this regard, the fluorescent material can be coated on a turntable, and a motor is used to drive the turntable to rotate at a high speed, so that the energy of the laser light source received by the local fluorescent material per unit time is reduced, thereby achieving the purpose of heat dissipation. However, with the continuous increase in the brightness requirement of the optical projector, the heat dissipation requirement for the fluorescent material has become increasingly stringent.
[0004] Therefore, how to enable the turntable and the fluorescent material thereon to have a better heat dissipation method has become one of the important research topics at present. Summary of the Invention
[0005] In view of this, an object of the present disclosure is to propose a base that can solve the above problems.
[0006] To achieve the above object, according to an embodiment of the present disclosure, a base is applied to a wavelength conversion device. The base includes a first surface and a second surface. A plurality of first holes are formed on the first surface. The second surface and the first surface are located on opposite sides of the base respectively. A plurality of second holes are formed on the second surface. One of the first holes communicates with at least one of the second holes. The edge of the at least one of the second holes laterally extends beyond the edge of the one of the first holes.
[0007] In one or more embodiments of the present disclosure, the number of the at least one of the second holes is plural.
[0008] In one or more embodiments of the present disclosure, one of the second holes communicates with at least one of the first holes. The edge of the at least one of the first holes laterally extends beyond the edge of the one of the second holes.
[0009] In one or more embodiments of the present disclosure, the number of the at least one of the first holes is plural.
[0010] In one or more embodiments of the present disclosure, the width of the first hole is substantially equal to the width of the second hole.
[0011] In one or more embodiments of the present disclosure, the first holes are regularly arranged on the first surface. The second holes are regularly arranged on the second surface.
[0012] In one or more embodiments of the present disclosure, the first holes are arranged on the first surface based on an array. The second holes are arranged on the second surface based on the aforementioned array.
[0013] In one or more embodiments of the present disclosure, the depth of the first holes and the depth of the second holes are less than the thickness of the base.
[0014] In one or more embodiments of the present disclosure, the base further includes a first substrate and a second substrate. The first holes penetrate the first substrate. The second holes penetrate the second substrate. The first surface is the surface of the first substrate away from the second substrate. The second surface is the surface of the second substrate away from the first substrate.
[0015] In one or more embodiments of the present disclosure, the base further includes a third substrate. The third substrate is stacked between the first substrate and the second substrate and has a plurality of through holes. One of the aforementioned first holes communicates with at least one of the aforementioned second holes through at least one of the through holes.
[0016] In one or more embodiments of the present disclosure, the base further includes a third substrate. The second substrate is stacked between the first substrate and the third substrate. The third substrate has a plurality of through holes. One of the through holes communicates with at least one of the second holes.
[0017] In one or more embodiments of the present disclosure, one of the first holes is aligned with one of the through holes in the stacking direction of the first substrate, the second substrate, and the third substrate.
[0018] In summary, in the base of the present disclosure, the first holes on the first surface communicate with the second holes on the second surface and are laterally misaligned. Thus, the base of the present disclosure can at least achieve the following advantages: (1) It can increase the specific surface area (SSA) of the base, thereby increasing the overall heat dissipation area; (2) It can reduce the overall weight of the substrate, thereby slowing down the motor load power; and (3) The staggered holes can further increase the structural rigidity of the substrate, thereby stably increasing the rotation speed and improving the airflow operation in the cavity.
[0019] The above is only used to elaborate on the problems to be solved by the present disclosure, the technical means for solving the problems, and the effects produced thereby. The specific details of the present disclosure will be introduced in detail in the following embodiments and related drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] To make the above and other objects, features, advantages, and embodiments of the present disclosure more obvious and understandable, the descriptions of the accompanying drawings are as follows:
[0021] Figure 1 To show a front view of a base according to an embodiment of the present disclosure;
[0022] Figure 2 To show Figure 1 a sectional view of the base in FIG. at section line 2-2;
[0023] Figure 3 To show a front view of a base according to an embodiment of the present disclosure;
[0024] Figure 4 To show Figure 3 a sectional view of the base in FIG. at section line 4-4;
[0025] Figure 5 To show a front view of a base according to an embodiment of the present disclosure;
[0026] Figure 6 To show Figure 5 a sectional view of the base in FIG. at section line 6-6;
[0027] Figure 7 To show a front view of a base according to an embodiment of the present disclosure;
[0028] Figure 8 To show Figure 7 a sectional view of the base in FIG. at section line 8-8;
[0029] Figure 9 To show a front view of an existing base;
[0030] Figure 10 To show a light source power-brightness curve graph of wavelength conversion devices of different embodiments of the base of the present disclosure and an existing base;
[0031] Figure 11 To show a light source power-temperature curve graph of wavelength conversion devices of different embodiments of the base of the present disclosure and an existing base.
[0032] Explanation of reference numerals in the drawings:
[0033] 100, 200, 300, 400, 900: Base
[0034] 100a, 210a, 410a: First surface
[0035] 100a1, 210a1, 410a1: First hole
[0036] 100a2: Setting area
[0037] 100b, 220a, 420a: Second surface
[0038] 100b1, 220a1, 420a1: Second hole
[0039] 210, 410: First substrate
[0040] 220, 420: Second substrate
[0041] 330, 430: Third substrate
[0042] 330a, 430a: Through hole
[0043] A1: First dimension
[0044] A2: Second dimension
[0045] D1, D2: Depth
[0046] H: Axial hole
[0047] T: Thickness Detailed implementation manners
[0048] The following will disclose multiple implementation manners of the present disclosure with the accompanying drawings. For the sake of clear illustration, many practical details will be described together in the following description. However, it should be understood that these practical details are not used to limit the present disclosure. That is to say, in some implementation manners of the present disclosure, these practical details are not necessary. In addition, for the purpose of simplifying the accompanying drawings, some conventional existing structures and elements will be shown in a simple schematic manner in the accompanying drawings.
[0049] Please refer to Figure 1 and Figure 2 . Figure 1 FIG. is a front view showing the base 100 according to an implementation manner of the present disclosure. Figure 2 FIG. is to show Figure 1 a sectional view of the base 100 in FIG. along the cutting line 2-2. As shown in Figure 1 and Figure 2 , in the present implementation manner, the base 100 can be applied to a wavelength conversion device (not shown in the figure). For example, the wavelength conversion device is a fluorescent wheel applied in a projection device (not shown in the figure). The projection device may further include a driving unit and a light source. The base 100 has an axial hole H. The driving unit is, for example, a motor, and the rotating shaft of the motor is engaged with the inner edge of the axial hole H. By rotating the rotating shaft of the motor, the wavelength conversion device can be driven to rotate. The light source is configured to emit light and form a light spot fixedly irradiated on the base 100. In some implementation manners, the light source is a solid-state laser light source, but the present disclosure is not limited thereto.
[0050] The wavelength conversion device further includes a phosphor layer (not shown in the figure). The phosphor layer is disposed on the base 100 and configured to receive the light emitted by the light source. Specifically, the light emitted by the light source can reach the phosphor layer via a specifically designed optical path (such as a mirror, a beam splitter, etc.) and generate a light spot on the phosphor layer. As Figure 1 shown in Figure 2 and
[0051] shown in Figure 1 and Figure 2 , in the present embodiment, the first surface 100a of the base 100 is provided with a plurality of first holes 100a1. The base 100 further includes a second surface 100b. The second surface 100b and the first surface 100a are respectively located on opposite sides of the base 100. A plurality of second holes 100b1 are provided on the second surface 100b. One of the first holes 100a1 communicates with at least one of the second holes 100b1. The edge of the aforementioned at least one of the second holes 100b1 laterally extends beyond the edge of the aforementioned one of the first holes 100a1. In other words, the first holes 100a1 on the first surface 100a communicate with the second holes 100b1 on the second surface 100b and are laterally misaligned.
[0052] Through the foregoing structural configuration, the base 100 of the present embodiment can at least achieve the following advantages: (1) it can increase the specific surface area (SSA) of the base 100, thereby increasing the overall heat dissipation area; (2) it can reduce the overall weight of the substrate, thereby slowing down the motor load power; and (3) the staggered first holes 100a1 and second holes 100b1 can further increase the structural rigidity of the substrate, thereby stably increasing the rotation speed and improving the cavity air flow operation. It should be noted that the aforementioned specific surface area refers to the total surface area possessed by the base 100 per unit mass.
[0053] In some embodiments, the specific surface area of the base 100 is more than 20% greater than its geometric area, but the present disclosure is not limited thereto. The aforementioned geometric area refers to the total area of the base 100 without the first holes 100a1 and the second holes 100b1. The geometric area can be obtained by summing the orthographic projection areas of the respective surfaces of the base 100.
[0054] In some embodiments, the overall weight of the base 100 having the first hole 100a1 and the second hole 100b1 can be reduced by about 5% to about 60%, but the present disclosure is not limited thereto.
[0055] As Figure 1 shown, one of the aforementioned first holes 100a1 communicates with three second holes 100b1, but the present disclosure is not limited thereto. In practical applications, the number of second holes 100b1 communicating with one of the first holes 100a1 can be flexibly increased or decreased.
[0056] In practical applications, there are many groups of structures in which one first hole 100a1 communicates with multiple second holes 100b1, such as Figure 1 and Figure 2 shown.
[0057] As Figure 2 shown, in the present embodiment, one of the second holes 100b1 communicates with at least one of the first holes 100a1. The edge of the aforementioned at least one of the first holes 100a1 laterally extends beyond the edge of the aforementioned one of the second holes 100b1. For example, the aforementioned one of the second holes 100b1 can communicate with three first holes 100a1, but the present disclosure is not limited thereto. In practical applications, the number of first holes 100a1 communicating with the aforementioned one of the second holes 100b1 can be flexibly increased or decreased.
[0058] In practical applications, there are many groups of structures in which one second hole 100b1 communicates with multiple first holes 100a1, such as Figure 2 shown.
[0059] In practical applications, by making each first hole 100a1 communicate with multiple second holes 100b1 and be laterally misaligned, and at the same time making each second hole 100b1 communicate with multiple first holes 100a1 and be laterally misaligned, the aforementioned advantages can be made more significant.
[0060] In some embodiments, the width of the first hole 100a1 is substantially equal to the width of the second hole 100b1. For example, both the first hole 100a1 and the second hole 100b1 are circular holes and have substantially the same aperture. Thus, the first hole 100a1 and the second hole 100b1 can be processed with the same tool and thus the manufacturing cost can be reduced.
[0061] In some embodiments, the first holes 100a1 are regularly arranged on the first surface 100a. For example, the first holes 100a1 are arranged on the first surface 100a based on an array. The array is composed of a first dimension A1 and a second dimension A2. That is, the first holes 100a1 are arranged along both the first dimension A1 and the second dimension A2 simultaneously.
[0062] In some embodiments, the second holes 100b1 are regularly arranged on the second surface 100b. For example, the second holes 100b1 are also arranged on the second surface 100b based on the aforementioned array. In other words, when looking directly at the first surface 100a and the second surface 100b, the pattern formed by the arrangement of the first holes 100a1 is the same as the pattern formed by the arrangement of the second holes 100b1, and the two patterns can be coincident by rotation. Therefore, the second holes 100b1 on the second surface 100b can be made in the same way as the first holes 100a1 on the first surface 100a, thereby simplifying the manufacturing difficulty and reducing the manufacturing cost.
[0063] As Figure 2 shown, in the present embodiment, the depth D1 of the first holes 100a1 and the depth D2 of the second holes 100b1 are less than the thickness T of the base 100. During the actual manufacturing process, the first holes 100a1 can be dug out along the direction perpendicular to the first surface 100a, and the first holes 100a1 do not penetrate through the base 100. Then, the second holes 100b1 are dug out along the direction perpendicular to the second surface 100b, and each first hole 100a1 is connected to at least one second hole 100b1, and / or each second hole 100b1 is connected to at least one first hole 100a1, and thus the manufacturing of the base 100 can be completed. In other words, the first holes 100a1 and the second holes 100b1 are laterally misaligned and do not coincide in the direction perpendicular to the first surface 100a or the second surface 100b. Therefore, compared with the design of a single hole directly penetrating through, the foregoing advantages can be achieved.
[0064] In some embodiments, the thickness T of the base 100 ranges from about 0.5 mm to about 50 mm, but the present disclosure is not limited thereto.
[0065] In some embodiments, the porosity of the substrate ranges from about 5% to about 75%, but the present disclosure is not limited thereto.
[0066] In some embodiments, the reflective and light-impermeable base 100 includes a metal material. The metal material may include, for example, Al, Ag, Cu, Fe, Mo, or an alloy of any combination thereof, but the present disclosure is not limited thereto.
[0067] In some embodiments, the reflective and light-impermeable base 100 comprises a ceramic material. The ceramic material may include, for example, materials such as AlN, BN, SiC, Al 2 O 3 and the like, but the present disclosure is not limited thereto.
[0068] In some embodiments, the reflective and light-impermeable base 100 comprises a semiconductor material. The semiconductor material may include, for example, elemental semiconductor materials (e.g., Si, Ge), binary semiconductor materials (e.g., GaAs, InP, GaN, InAs, ZnSe, ZnS, InSe, etc.) or other multi-component compound semiconductors with more than two components, but the present disclosure is not limited thereto.
[0069] In some embodiments, the material of the transmissive and light-permeable base 100 includes glass, quartz, sapphire or CaF 2 , but the present disclosure is not limited thereto.
[0070] Please refer to Figure 3 and Figure 4 . Figure 3 FIG. is a front view showing the base 200 according to an embodiment of the present disclosure. Figure 4 FIG. is a sectional view showing the base 200 in Figure 3 at the cutting line 4-4. As shown in Figure 3 and Figure 4 , in the present embodiment, the base 200 includes a first substrate 210 and a second substrate 220. The first substrate 210 has a first surface 210a away from the second substrate 220 and a first hole 210a1 penetrating through the first substrate 210. The second substrate 220 has a second surface 220a away from the first substrate 210 and a first hole 210a1 penetrating through the second substrate 220. One of the first holes 210a1 communicates with at least one of the second holes 220a1. The edge of at least one of the second holes 220a1 laterally extends beyond the edge of the aforementioned one of the first holes 210a1. In other words, the first hole 210a1 on the first surface 210a communicates with the second hole 220a1 on the second surface 220a and is laterally misaligned. With such a structural configuration, the base 200 of the present embodiment can also achieve at least the aforementioned advantages.
[0071] As shown in Figure 3 , the aforementioned one of the first holes 210a1 communicates with three second holes 220a1, but the present disclosure is not limited thereto. In practical applications, the number of second holes 220a1 that communicate with the aforementioned one of the first holes 210a1 can be flexibly increased or decreased.
[0072] In practical applications, the number of sets of structures in which one first hole 210a1 communicates with multiple second holes 220a1 is large, such as Figure 3 and Figure 4 shown.
[0073] Such as Figure 4 shown, in this embodiment, one of the second holes 220a1 communicates with at least one of the first holes 210a1. The edge of the aforementioned at least one of the first holes 210a1 laterally extends beyond the edge of the aforementioned one of the second holes 220a1. For example, the aforementioned one of the second holes 220a1 can communicate with three first holes 210a1, but the present disclosure is not limited thereto. In practical applications, the number of first holes 210a1 that communicate with the aforementioned one of the second holes 220a1 simultaneously can be increased or decreased flexibly.
[0074] In practical applications, the number of sets of structures in which one second hole 220a1 communicates with multiple first holes 210a1 is large, such as Figure 4 shown.
[0075] In practical applications, by making each first hole 210a1 communicate with multiple second holes 220a1 and be laterally misaligned, and at the same time making each second hole 220a1 communicate with multiple first holes 210a1 and be laterally misaligned, the aforementioned advantages can be made more prominent.
[0076] In some embodiments, the width of the first hole 210a1 is substantially equal to the width of the second hole 220a1. For example, both the first hole 210a1 and the second hole 220a1 are circular holes and have substantially the same aperture. Thus, the first hole 210a1 and the second hole 220a1 can be processed with the same tool and thus the manufacturing cost can be reduced.
[0077] In some embodiments, the first holes 210a1 are regularly arranged on the first surface 210a. For example, the first holes 210a1 are arranged on the first surface 210a based on an array. The array is composed of a first dimension A1 and a second dimension A2. That is, the first holes 210a1 are arranged along both the first dimension A1 and the second dimension A2 simultaneously.
[0078] In some embodiments, the second holes 220a1 are regularly arranged on the second surface 220a. For example, the second holes 220a1 are also arranged on the second surface 220a based on the aforementioned array. In other words, when looking directly at the first surface 210a and the second surface 220a, the pattern formed by the first holes 210a1 is the same as the pattern formed by the second holes 220a1, and the two patterns can be coincident by rotation. Therefore, the second holes 220a1 on the second surface 220a can be made in the same way as the first holes 210a1 on the first surface 210a, thereby simplifying the manufacturing difficulty and reducing the manufacturing cost.
[0079] In the actual manufacturing process, through first holes 210a1 can be dug out on the first substrate 210, and through second holes 220a1 can be dug out on the second substrate 220. Then, the first substrate 210 and the second substrate 220 are stacked together so that each first hole 210a1 communicates with at least one second hole 220a1, and / or each second hole 220a1 communicates with at least one first hole 210a1, and thus the production of the base 200 can be completed.
[0080] Please refer to Figure 5 and Figure 6 . Figure 5 FIG. is a front view showing the base 300 according to an embodiment of the present disclosure. Figure 6 is shown to Figure 5 a sectional view of the base 300 along the cutting line 6-6 in. As Figure 5 and Figure 6 shown, in the present embodiment, the base 300 includes a first substrate 210, a second substrate 220, and a third substrate 330, wherein the first substrate 210 and the second substrate 220 are the same as those in the Figure 3 shown embodiment, so the above related descriptions can be referred to and will not be repeated here. Specifically, in the present embodiment, the third substrate 330 is stacked between the first substrate 210 and the second substrate 220 and has a plurality of through holes 330a. One of the first holes 210a1 communicates with at least one of the second holes 220a1 through at least one of the through holes 330a. With such a structural configuration, the base 300 of the present embodiment can also achieve at least the aforementioned advantages.
[0081] As Figure 5 and Figure 6 shown, the edge of the aforementioned at least one of the through holes 330a laterally extends beyond the edge of the aforementioned one of the first holes 210a1. In other words, the first hole 210a1 of the first substrate 210 communicates with the through hole 330a of the third substrate 330 and is laterally misaligned. Thereby, the aforementioned advantages can be made more significant.
[0082] As Figure 5As shown, one of the foregoing in the first hole 210a1 communicates with three through-holes 330a, but the present disclosure is not limited thereto. In practical applications, the number of through-holes 330a that communicate with one of the foregoing in the first hole 210a1 can be increased or decreased flexibly.
[0083] In practical applications, there are many groups of structures in which one first hole 210a1 communicates with multiple through-holes 330a, such as Figure 5 shown.
[0084] In some embodiments, one of the second holes 220a1 communicates with at least one of the through-holes 330a. The edge of the foregoing at least one of the through-holes 330a laterally extends beyond the edge of the foregoing one of the second holes 220a1. For example, the foregoing one of the second holes 220a1 can communicate with three through-holes 330a, but the present disclosure is not limited thereto. In other words, the second hole 220a1 of the second substrate 220 communicates with the through-hole 330a of the third substrate 330 and is laterally misaligned. Thereby, the foregoing advantages can be made more prominent.
[0085] In practical applications, the number of through-holes 330a that communicate with the foregoing one of the second holes 220a1 can be increased or decreased flexibly.
[0086] During actual manufacturing, through first holes 210a1 can be dug out on the first substrate 210, through second holes 220a1 can be dug out on the second substrate 220, and through-holes 330a can be dug out on the third substrate 330. Then, the third substrate 330 is stacked between the first substrate 210 and the second substrate 220, such that each first hole 210a1 communicates with at least one second hole 220a1 via at least one through-hole 330a, and / or such that each second hole 220a1 communicates with at least one first hole 210a1 via at least one through-hole 330a, and thus the fabrication of the base 300 can be completed.
[0087] Please refer to Figure 7 and Figure 8 . Figure 7 FIG. is a front view showing a base 400 according to an embodiment of the present disclosure. Figure 8 To show Figure 7 a sectional view of the base 400 in FIG. at the cutting line 8-8. As Figure 7 and Figure 8As shown, in the present embodiment, the base 400 includes a first substrate 410, a second substrate 420, and a third substrate 430. The first substrate 410 has a first surface 410a away from the second substrate 420 and a first hole 410a1 passing through the first substrate 410. The second substrate 420 has a second surface 420a away from the first substrate 410 and a second hole 420a1 passing through the second substrate 420. The first substrate 410 and the second substrate 420 are similar to Figure 3 the first substrate 210 and the second substrate 220 in the embodiment shown, so the relevant descriptions above can be referred to and will not be elaborated here. One difference between the combination of the first substrate 410 and the second substrate 420 in the present embodiment and Figure 3 the embodiment shown is that one of the first holes 410a1 in the present embodiment communicates with four second holes 420a1, but the present disclosure is not limited thereto.
[0088] As Figure 8 shown, in the present embodiment, the second substrate 420 is stacked between the first substrate 410 and the third substrate 430. The third substrate 430 has a plurality of through holes 430a. One of the through holes 430a communicates with at least one of the second holes 420a1. The edge of the aforementioned at least one of the second holes 420a1 laterally extends beyond the edge of the aforementioned one of the through holes 430a. In other words, the through hole 430a of the third substrate 430 communicates with the second hole 420a1 of the second substrate 420 and is laterally misaligned. Thus, the aforementioned advantages can be made more significant.
[0089] In practical applications, the aforementioned one of the through holes 430a communicates with a plurality of second holes 420a1, and the number of second holes 420a1 that communicate with the aforementioned one of the through holes 430a at the same time can be increased or decreased elastically.
[0090] In practical applications, the number of groups of the structure in which one through hole 430a communicates with a plurality of second holes 420a1 is large, as Figure 8 shown.
[0091] In one embodiment, one of the first holes 410a1 is aligned with one of the through holes 430a in the stacking direction of the first substrate 410, the second substrate 420, and the third substrate 430. For example, as Figure 7 and Figure 8 shown, all the first holes 410a1 and all the through holes 430a coincide in the stacking direction of the first substrate 410, the second substrate 420, and the third substrate 430.
[0092] During the actual manufacturing process, a through first hole 410a1 can be dug on the first substrate 410, a through second hole 420a1 can be dug on the second substrate 420, and a through via hole 430a can be dug on the third substrate 430. Then, the second substrate 420 is stacked between the first substrate 410 and the third substrate 430, such that each first hole 410a1 communicates with a via hole 430a through at least one second hole 420a1, and thus the production of the base 300 can be completed.
[0093] Please refer to Figures 9 to 11 。 Figure 9 FIG. is a front view showing an existing base 900. Figure 10 FIG. is a graph showing the light source power - brightness of a wavelength conversion device using different embodiments of the base disclosed herein and the existing base 900. Figure 11 FIG. is a graph showing the light source power - temperature of a wavelength conversion device using different embodiments of the base disclosed herein and the existing base 900. As Figure 9 shown, the existing base 900 has a plurality of arrow - shaped perforations. For comparison with this existing wavelength conversion device, in Figure 10 and Figure 11 actual tests are carried out with the embodiment E1 of the base 100 shown in Figure 1 and the embodiment E2 of the base 200 shown in Figure 3 . And, Figure 10 and Figure 11 the curves in are measured for the existing wavelength conversion device and embodiments E1, E2 under the condition of the same rotation speed.
[0094] It can be clearly seen from Figure 10 that for embodiments E1 and E2, the brightness (i.e., luminous efficiency) of the phosphor layer does not deteriorate severely as the light source power increases (i.e., there is no thermal decay phenomenon). Therefore, for the projection devices using embodiments E1 and E2, at the maximum light source power of 396 W, the brightness can be significantly increased by about 5% compared with the existing wavelength conversion device. Additionally, it can be clearly seen from Figure 11 that the temperature measured at the light spot of embodiments E1 and E2 is at least 40 °C lower than the temperature at the light spot of the existing wavelength conversion device. Therefore, the thermal decay phenomenon of the phosphor layer due to high temperature can be effectively avoided.
[0095] From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that in the base of the present disclosure, the first hole on the first surface communicates with the second hole on the second surface and is laterally misaligned. Thus, the base of the present disclosure can at least achieve the following advantages: (1) it can increase the specific surface area of the base, thereby increasing the overall heat dissipation area; (2) it can reduce the overall weight of the substrate, thereby slowing down the motor load power; and (3) the staggered holes can further increase the structural rigidity of the substrate, thereby stably increasing the rotation speed and improving the airflow operation in the cavity.
[0096] Although the present disclosure has been disclosed as above in embodiments, it is not intended to limit the present disclosure. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to that defined by the scope of the appended claims.
Claims
1. A base, applied to a wavelength conversion device, the base comprising: A first surface, on which a plurality of first holes are formed; and A second surface, located on opposite sides of the base from the first surface, on which a plurality of second holes are formed, wherein one of the plurality of first holes communicates with at least one of the plurality of second holes, and an edge of at least one of the plurality of second holes laterally extends beyond an edge of one of the plurality of first holes.
2. The base according to claim 1, wherein the number of at least one of the plurality of second holes is plural.
3. The base according to claim 1, wherein one of the plurality of second holes communicates with at least one of the plurality of first holes, and an edge of at least one of the plurality of first holes laterally extends beyond an edge of one of the plurality of second holes.
4. The base according to claim 3, wherein the number of at least one of the plurality of first holes is plural.
5. The base according to claim 1, wherein a width of the plurality of first holes is substantially equal to a width of the plurality of second holes.
6. The base according to claim 1, wherein the plurality of first holes are regularly arranged on the first surface, and the plurality of second holes are regularly arranged on the second surface.
7. The base according to claim 6, wherein the plurality of first holes are arranged on the first surface based on an array, and the plurality of second holes are arranged on the second surface based on the array.
8. The base according to claim 1, wherein a depth of the plurality of first holes and a depth of the plurality of second holes are less than a thickness of the base.
9. The base according to claim 1, further comprising: A first substrate, wherein the plurality of first holes penetrate through the first substrate; and A second substrate, wherein the plurality of second holes penetrate through the second substrate, wherein the first surface is a surface of the first substrate away from the second substrate, and the second surface is a surface of the second substrate away from the first substrate.
10. The base according to claim 9, further comprising a third substrate, the third substrate being laminated between the first substrate and the second substrate and having a plurality of through holes, and one of the plurality of first holes communicates with at least one of the plurality of second holes via at least one of the plurality of through holes.
11. The base according to claim 9, further comprising a third substrate, the second substrate being laminated between the first substrate and the third substrate, the third substrate having a plurality of through holes, and one of the plurality of through holes communicates with at least one of the plurality of second holes.
12. The base according to claim 11, wherein one of the plurality of first holes is aligned with one of the plurality of through holes in a stacking direction of the first substrate, the second substrate and the third substrate.