Liquid cooling case and server

Abstract

The invention relates to a liquid cooling case and a server, and belongs to the technical field of heat dissipation, and the liquid cooling case comprises a case cover module which comprises an upper case cover and a lower case cover; the box body module comprises a box body and a heat dissipation module arranged in the box body, the upper box cover is connected with the upper half part of one end of the box body through a first hinge connecting piece, and the lower box cover is connected with the lower half part of one end of the box body through a second hinge connecting piece; the heat dissipation module comprises a cold plate, and the cold plate is arranged between the upper box cover and the lower box cover. According to the box cover, the cold plate is arranged in the middle through the up-down oppositely-buckled structural form, meanwhile, the chips arranged on the upper side and the lower side of the box cover are cooled, the space utilization rate is increased, efficient heat dissipation of the whole machine is achieved, cooling liquid can be conveniently discharged through the page type overall structure, the cover is opened for maintenance, and the maintainability of the immersion liquid cooling case is improved.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation, and particularly to a liquid-cooled chassis and a server. Background Art

[0002] Immersion cooling technology has received attention due to its superior cooling efficiency. The existing immersion cooling technology generally adopted is mainly a soaking type of cooling, which means that electronic devices are soaked in an immersion cooling box; the internal flow of the immersion cooling box depends on the change in the cold and hot density of the coolant itself. However, since the cooling medium is input from the end side of the immersion cooling box, there is a large difference in cold and hot density only near the input port, resulting in a relatively slow local flow rate near the electronic devices located far from the port. As a result, local hot spots or even fluid dead zones may be formed near the electronic devices. Based on this, on the one hand, the temperature difference in the immersion cooling box is large, greatly reducing the cooling effect. On the other hand, a liquid film or gas film is likely to form on the surface of the electronic devices, which is not conducive to heat dissipation. In addition, the existing immersion cooling box is not convenient to disassemble and assemble, and has poor maintainability, further restricting the application of immersion cooling technology. Summary of the Invention

[0003] Based on this, it is necessary to provide a liquid-cooled chassis and a server that can improve space utilization, achieve efficient heat dissipation of the whole machine, and improve the maintainability of the immersion liquid-cooled chassis for the above technical problems.

[0004] In a first aspect, a liquid-cooled chassis is provided. The liquid-cooled chassis includes:

[0005] A lid module, which includes an upper lid and a lower lid, and heat-generating devices to be cooled are provided on both the upper lid and the lower lid;

[0006] A box body module, which includes a box body and a heat dissipation module disposed inside the box body. The upper lid is connected to the upper half of one end of the box body through a first hinge connection member, and the lower lid is connected to the lower half of one end of the box body through a second hinge connection member;

[0007] The heat dissipation module includes a cold plate, and the cold plate is disposed between the upper lid and the lower lid.

[0008] Optionally, the heat-generating devices to be cooled include:

[0009] A graphics processor module board, which is respectively disposed on the upper lid and the lower lid, and handles are respectively disposed at one ends of the upper lid and the lower lid.

[0010] Optionally, the box body module further includes:

[0011] A network connector, which is disposed at the other end of the box body.

[0012] Optionally, the cabinet module further includes a first liquid-cooling blind plug connector, a second liquid-cooling blind plug connector, a high-density connector, and a power supply device:

[0013] The first liquid-cooling blind plug connector, the high-density connector, the power supply device, and the second liquid-cooling blind plug connector are sequentially arranged at one end of the cabinet.

[0014] Optionally, the heat dissipation module further includes:

[0015] A liquid outlet, which is connected to the first liquid-cooling blind plug connector;

[0016] A liquid inlet, which is connected to the second liquid-cooling blind plug connector;

[0017] A liquid distributor, one end of the liquid distributor is connected to the liquid outlet through a first coolant flow channel, and the other end of the liquid distributor is connected to the liquid inlet through a second coolant flow channel;

[0018] A cold plate bracket, which is used to fix the cold plate and is connected to the cabinet;

[0019] A third coolant flow channel is arranged inside the cold plate, and both ends of the third coolant flow channel close to the liquid distributor are connected to the liquid distributor.

[0020] Optionally, it further includes:

[0021] Multiple fourth coolant flow channels are arranged inside the liquid distributor to generate multiple coolant circuits. The coolant in a single coolant circuit flows through two cold plates, the two cold plates are arranged in parallel, and the multiple fourth coolant flow channels are arranged in parallel.

[0022] Optionally, the cold plate includes:

[0023] An upper cavity and a lower cavity, the upper cavity and the lower cavity are arranged in parallel and separated in the middle.

[0024] Optionally, it further includes:

[0025] A first sealing housing, which is used to seal the high-density connector. The first sealing housing is fixedly connected to the cabinet, and a first sealing ring is arranged at the connection between the first sealing housing and the cabinet.

[0026] Optionally, it further includes:

[0027] A second sealing housing, which is used to seal the power supply device. The second sealing housing is fixedly connected to the cabinet, and a second sealing ring is arranged at the connection between the second sealing housing and the cabinet.

[0028] In a second aspect, a server is provided, which includes the liquid-cooled chassis described above.

[0029] The above liquid-cooled chassis and server, the liquid-cooled chassis includes: a lid module, the lid module includes an upper lid and a lower lid; a box body module, the box body module includes a box body and a heat dissipation module disposed inside the box body, the upper lid is connected to the upper half of one end of the box body through a first hinge connection member, and the lower lid is connected to the lower half of one end of the box body through a second hinge connection member; the heat dissipation module includes a cold plate, the cold plate is disposed between the upper lid and the lower lid. The lid of the present application has a structure of upper and lower buckling, with the cold plate placed in the middle, and at the same time, it dissipates heat from the upper and lower chips disposed on the lid, improving the space utilization rate, achieving efficient heat dissipation of the whole machine, and through the overall structure of a book page type, it is convenient to drain the coolant and open the lid for maintenance, improving the maintainability of the immersion liquid-cooled chassis. Description of the Drawings

[0030] Figure 1 Schematic diagram of the overall structure of the liquid-cooled chassis in one embodiment;

[0031] Figure 2 Another schematic diagram of the overall structure of the liquid-cooled chassis in one embodiment;

[0032] Figure 3 Another schematic diagram of the overall structure of the liquid-cooled chassis in one embodiment;

[0033] Figure 4 Schematic diagram of the lid module structure of the liquid-cooled chassis in one embodiment;

[0034] Figure 5 Schematic diagram of the box body structure of the liquid-cooled chassis in one embodiment;

[0035] Figure 6 Schematic diagram of the box body module structure of the liquid-cooled chassis in one embodiment;

[0036] Figure 7 Schematic diagram of the high-density connector structure of the liquid-cooled chassis in one embodiment;

[0037] Figure 8 Schematic diagram of the high-density connector sealing structure of the liquid-cooled chassis in one embodiment;

[0038] Figure 9 Schematic diagram of the power Clip sealing structure of the liquid-cooled chassis in one embodiment;

[0039] Figure 10 Schematic diagram of the heat dissipation module structure of the liquid-cooled chassis in one embodiment.

[0040] The identifications in the figures are as follows:

[0041] Cover module 100, box body module 200, heat dissipation module 300, upper cover 101, lower cover 102, device to be cooled 1, box body 201, first hinge connection member 2, second hinge connection member 3, cold plate 301, graphics processor module board 103, handle 104, network connector 202, first liquid cooling blind plug connector 203, second liquid cooling blind plug connector 204, high-density connector 205, power supply device 206, liquid outlet 302, liquid inlet 303, liquid distributor 304, cold plate bracket 307, first sealing housing 400, first sealing ring 401, second sealing housing 500, second sealing ring 501, upper cavity 310, lower cavity 311. Detailed implementation manners

[0042] To make the objectives, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are only a part rather than all of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0043] It should be understood that in the description of the present application, unless clearly required by the context, the words such as "including" and "comprising" throughout the specification should be interpreted as the meaning of including rather than exclusive or exhaustive; that is, the meaning of "including but not limited to".

[0044] It should also be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. In addition, in the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0045] In the description of the present application, it should be noted that unless otherwise clearly defined and limited, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection, an electrical connection, or a connection capable of mutual communication; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0046] It should be noted that the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present application.

[0047] With the increase in the power consumption of chips and servers, the power density of a single cabinet is continuously increasing. The traditional air-cooled heat dissipation mode is gradually limited in terms of heat transfer performance and energy consumption optimization. The energy efficiency of existing methods is relatively low, resulting in a power usage effectiveness (PUE) higher than the ideal state and unable to meet the requirements of the data center for efficient operation.

[0048] As an emerging cooling method, liquid cooling technology removes the heat of heating components through liquid cooling working fluids. Compared with air cooling, it has more advantages, including supporting the heat dissipation of high-power chips, extending the chip life, reducing the PUE of the data center, improving the heat transfer efficiency, reducing heat dissipation hot spots, supporting a higher cabinet density, reducing noise, and enhancing environmental adaptability. According to the different ways of contact heat transfer between the coolant and the heating equipment, the types of liquid cooling technology can be divided into cold plate liquid cooling and immersion liquid cooling. Among them, cold plate liquid cooling is more widely used. However, due to the further improvement of heat dissipation requirements, the design of a full liquid cooling cold plate is difficult and the structure is complex, making it difficult to cover all components. In addition, some components are pluggable and the shape standards are not unified, presenting technical problems.

[0049] According to the background technology, immersion cooling technology has received attention due to its superior cooling efficiency. The immersion cooling technology commonly used in the existing technology is mainly a soaking type of cooling, which means immersing electronic devices in an immersion cooling box. The internal flow of the immersion cooling box depends on the change in the cold and hot density of the coolant itself. However, since the cooling medium is input from the end side of the immersion cooling box, there is only a large cold and hot density difference near the input port, resulting in a relatively slow local flow velocity near the electronic devices located far from the port. As a result, local hot spots or even fluid dead zones will be formed near the electronic devices. Based on this, on the one hand, the temperature difference in the immersion cooling box is relatively large, greatly reducing the cooling effect. On the other hand, a liquid film or gas film is easily formed on the surface of the electronic devices, which is not conducive to heat dissipation. In addition, the existing immersion cooling box is not convenient to disassemble and assemble, and its maintainability is poor, further restricting the application of immersion cooling technology.

[0050] To solve the above technical problems, the present application provides a liquid cooling chassis and a server. By designing the box cover in a structure form of upper and lower buckling, the cold plate is placed in the middle, and at the same time, it cools the chips on the upper and lower sides of the box cover, improving the space utilization rate and achieving efficient heat dissipation of the whole machine. In addition, through the book page type of overall structure, it is convenient to drain the coolant and open the cover for maintenance, improving the maintainability of the immersion liquid cooling chassis.

[0051] In one embodiment, as Figure 1 and Figure 2As shown, a liquid-cooled chassis is provided, including: a lid module 100, the lid module 100 includes an upper lid 101 and a lower lid 102, and a device to be cooled 1 is provided on both the upper lid 101 and the lower lid 102; a box body module 200, the box body module 200 includes a box body 201 and a heat dissipation module 300 arranged inside the box body 201, the upper lid 101 is connected to the upper half of one end of the box body 201 through a first hinge connection member 2, and the lower lid 102 is connected to the lower half of one end of the box body 201 through a second hinge connection member 3; the heat dissipation module 300 includes a cold plate 301, the cold plate 301 is arranged between the upper lid 101 and the lower lid 102, wherein, the box body 201 is integrally processed from aluminum alloy, or can also be processed by other methods such as welding, and screws are added to the edge of the upper lid 101 to cope with application scenarios with higher pressure.

[0052] In some specific embodiments, as Figure 4 shown, the device to be cooled 1 includes: a graphics processor module board 103, the graphics processor module board 103 is respectively arranged on the upper lid 101 and the lower lid 102, and handles 104 are respectively arranged at one ends of the upper lid 101 and the lower lid 102.

[0053] Specifically, the graphics processor module board 103 is a UBB module. The UBB module (Unit Base Board) is a module board used to carry multiple GPUs (Graphics Processing Unit, a microprocessor specifically used for graphics processing) integrated into a matrix platform. The main function of the UBB module is to provide high-speed data transmission and communication between GPUs and between GPUs and CPUs (Central Processing Unit). In an AI (Artificial Intelligence) server, the UBB module is an important part of the GPU board group, usually used to carry the entire GPU platform to ensure efficient computing and communication performance. The UBB module is mainly used in the following aspects in an AI server, including: high-speed data transmission: The UBB module ensures high-speed data transmission between GPUs and between GPUs and CPUs through a high-density printed circuit board (PCB) design, meeting the needs of large-scale parallel computing; integrating multiple GPUs: The UBB module can integrate multiple GPUs into a matrix platform to improve the overall computing power and efficiency; high reliability: Since the UBB module undertakes a large number of computing tasks, its design needs to ensure high reliability and stability to cope with high-load and high-frequency computing requirements. Based on this, as Figure 3 and Figure 4As shown, the UBB module of this application supports 8 OAM acceleration cards (GPU acceleration cards), supports 4 network chips in front of the AI node, and 4 optical modules in the front window to achieve high-speed network switching. The rear window is interconnected with the switching node through a high-density connector. The board integrates a BMC (Baseboard Management Controller) chip, which is responsible for managing the VR power supply (Trans Inductor Voltage Regulator, a power supply technology that uses a coupled inductor secondary winding series-tuned inductor to increase the coupled current), PHY (Physical Layer, the port physical layer, which is the bottom layer in the OSI - Open System Interconnection model and is a chip responsible for sending and receiving Ethernet data frames), clock, RTC (Real-Time Clock, an integrated circuit chip that can provide continuous and accurate time information for electronic devices and keep time data from being lost when powered off), Retimerr, and temperature sensors; among them, as Figure 3 and Figure 4 shown, a UBB module is provided on each lid. The lid serves as the substrate of the UBB module, acting as the support for the UBB board card, and the PCB is locked on the substrate.

[0054] In some specific embodiments, as Figure 1 and Figure 2 shown, the upper lid 101, the lower lid 102 and the box body 201 are respectively connected by a first hinge connector 2 and a second hinge connector 3, so as to drive the UBB module provided on the lid to flip up and down and buckle on the box body 201 of the chassis. At the same time, the surface of the OAM chip supported by the UBB module can be attached to the cold plate 301, so as to ensure the rapid heat dissipation of the OAM chip. Further, the upper lid 101, the lower lid 102 and the box body 201 are sealed through a sealing ring. The sealing ring is fixed on the box body 201, and the upper lid 101 and the lower lid 102 are fixed by screws at the front window of the box body 201. Among them, the screw fastener can be further replaced by other tool-free locking methods such as electromagnetic locks to improve the maintainability of the chassis. The same applies hereinafter; as Figure 4 shown, two handles 104 are provided at one end of the upper lid 101 and the lower lid 102 for easy opening and maintenance.

[0055] In the above embodiment, the lid is designed in a structure form of upper and lower buckling, and the cold plate is placed in the middle, which can cool the chips on both the upper and lower sides at the same time. A system architecture with a high-density layout of 16 OAM acceleration cards can be realized in a 1.5U space, improving the space utilization rate. And through the book-page type overall structure, it is convenient to drain the coolant and open the lid for maintenance, improving the maintainability of the immersion liquid-cooled chassis.

[0056] In some specific embodiments, an adjustable telescopic rod 4 (not shown in the figure) is further disposed between the upper box cover 101 and the lower box cover 102. The adjustable telescopic rod 4 includes a sleeve 5 and a rod 6. The sleeve 5 and the rod 6 are slidably connected. One end of the sleeve 5 is fixedly connected to the lower box cover 102, and the other end is connected to one end of the rod 6. The other end of the rod 6 is fixedly connected to the upper box cover 101. A plurality of through holes 7 are provided at the edge of the sleeve 5. When the upper box cover 101 is opened, the corresponding through hole 7 is selected according to the opening angle between the upper box cover 101 and the lower box cover 102, and the telescopic rod buckle 8 is used to pass through the through hole 7 to fix the telescopic length of the adjustable telescopic rod 4, thereby fixing the opening angle of the upper box cover 101.

[0057] In the above embodiment, the opening angle of the upper box cover is fixed by the provided adjustable telescopic rod, so as to facilitate the maintenance of the components inside the chassis and the discharge of the coolant, and further improve the maintainability of the immersion liquid cooling chassis.

[0058] In some specific embodiments, the box module 200 further includes: a network connector 202, and the network connector 202 is disposed at the other end of the box 201.

[0059] Specifically, as Figure 5 and Figure 6 shown, 8 network connectors 202, also known as optical module sealed connectors, are provided at the opening of the other end (i.e., the front window of the box 201) of the box 201. Among them, the network connector 202 is an important connecting device for realizing smooth data movement and communication within the network infrastructure. They physically connect devices to each other through cables and physical interfaces to ensure seamless and stable transmission of data between devices, allowing devices to communicate effectively. There are various types of network connectors, and each is carefully designed to meet different network requirements. Based on this, the network connector 202 provided in this application is used for external network data exchange.

[0060] In some specific embodiments, the box module 200 further includes a first liquid cooling blind plug connector 203, a second liquid cooling blind plug connector 204, a high-density connector 205, and a power supply device 206: The first liquid cooling blind plug connector 203, the high-density connector 205, the power supply device 206, and the second liquid cooling blind plug connector 204 are sequentially disposed at one end of the box 201.

[0061] Specifically, as Figure 5 and Figure 6As shown, at one end of the box body 201 (i.e., the rear window of the box body 201), a first liquid-cooling blind plug connector 203, a high-density connector 205, a power supply device 206, and a second liquid-cooling blind plug connector 204 are sequentially arranged; among them, the first liquid-cooling blind plug connector 203 is connected to the liquid outlet 302, the second liquid-cooling blind plug connector 204 is connected to the liquid inlet 303, and the power supply device 206 refers to a power supply Clip. The Clip bonding technology in the power supply refers to a packaging process that uses a copper strip (Cu Clip) to connect the chip and the pin. This technology realizes the connection between the chip and the pin by using a solid copper bridge welded to the solder, thereby obtaining a unique packaging resistance value, a higher current capacity, and better heat dissipation performance; the liquid-cooling blind plug connector is a special connector design, mainly used in liquid-cooling systems, especially in occasions such as data centers that require efficient heat dissipation. The liquid-cooling blind plug connector adopts a blind plug design, that is, it directly inserts into the holes of the radiator to achieve the cooling effect. The liquid-cooling blind plug connector relies on the power of the water flow to distribute the coolant to various parts of the radiator to ensure the realization of the cooling effect. Since there are multiple holes on the radiator, users can insert the connector at the required position. Therefore, the use of liquid-cooling blind plug connectors makes the liquid-cooling system more flexible and convenient; the high-density connector 205 is a high-end electrical connector, widely used in extreme conditions such as high power, high frequency, and high temperature, and its performance requirements are extremely high. The linearity, accuracy, and stability between the connectors are very important. The high density of the high-density connector 205 is mainly reflected in two aspects: one is the high density of the product itself, that is, the number of connector pins is increasing, and the other is the high density of installation, that is, the connector is becoming increasingly miniaturized and micro-miniaturized, and the number of connectors that can be installed per unit area (space) is increasing.

[0062] In the above embodiment, through the modular immersion liquid-cooling chassis, a variety of sealed connectors are integrated at the rear window to achieve blind plugging of water, electricity, and data, so as to realize the separate maintenance of nodes in the cabinet and improve the maintainability of the immersion liquid-cooling chassis.

[0063] In some specific embodiments, the heat dissipation module 300 further includes: a liquid outlet 302, which is connected to the first liquid-cooling blind plug connector 203; a liquid inlet 303, which is connected to the second liquid-cooling blind plug connector 204; a liquid distributor 304, one end of the liquid distributor 304 is connected to the liquid outlet 302 through the first coolant flow channel 305, and the other end of the liquid distributor 304 is connected to the liquid inlet 303 through the second coolant flow channel 306; a cold plate bracket 307, which is used to fix the cold plate 301 and is connected to the box body 201; a third coolant flow channel 308 is arranged in the cold plate 301, and both ends of the third coolant flow channel 308 close to the liquid distributor 304 are connected to the liquid distributor 304.

[0064] Inside the liquid distributor 304, there are multiple fourth coolant channels 309 to generate multiple coolant loops. The coolant in a single coolant loop flows through two cold plates 301. The two cold plates 301 are arranged in parallel, and the multiple fourth coolant channels 309 are arranged in parallel.

[0065] The cold plate 301 includes an upper cavity 310 and a lower cavity 311. The upper cavity 310 and the lower cavity 311 are arranged in parallel and separated in the middle.

[0066] Specifically, as Figure 10 shown, the heat dissipation module 300 consists of a liquid outlet 302, a liquid inlet 303, a liquid distributor 304, cold plates 301, cold plate brackets 307, and multiple coolant channels. The heat dissipation module 300 is arranged in the middle part of the box body 201. The two ends of the liquid distributor 304 are fixed on both sides of the box body 201. The two ends of each cold plate bracket 307 are also fixed on both sides of the box body 201 and arranged in parallel with the liquid distributor 304. One heat dissipation module 300 includes 8 cold plates 301 and one liquid distributor 304. Four cold plates 301 in a row are arranged in parallel. The two rows of cold plates 301 are fixed respectively through the liquid distributor 304, cold plate brackets 307, and two cold plate brackets 307, that is, the cold plates 301 are respectively arranged between the liquid distributor 304 and the cold plate brackets 307, and between the two cold plate brackets 307; the liquid distributor 304 includes 4 branches arranged in parallel, that is, 4 fourth coolant channels 309, to generate 4 coolant loops. The coolant in each coolant loop flows through two cold plates 301. The two cold plates 301 are arranged in parallel. Based on this, the coolant enters the liquid distributor 304 through the liquid inlet 303. Inside the liquid distributor 304, the coolant is divided into four paths. The four paths are arranged in parallel. Each branch flows through two cold plates 301. The two cold plates 301 in each branch are arranged in parallel. Each cold plate 301 is divided into upper and lower sides, that is, into an upper cavity 310 and a lower cavity 311. The upper and lower side cavities are arranged in parallel and separated in the middle. The coolant flows out of the cold plate 301 after flowing through the cold plate 301 on the front window side to the front window position of the chassis box body 201. The coolant flows through other components inside the chassis and finally flows out from the rear window water outlet.

[0067] In the above embodiment, through the set heat dissipation structure of directional flow - immersion liquid cooling, taking into account the advantages of cold plate liquid cooling and immersion liquid cooling, it realizes that the coolant preferentially cools high - power chips directionally to take away heat. And 16 OAM chips are arranged in parallel, achieving uniform and efficient heat dissipation. At the same time, the immersion cooling method can take away the heat of other heating devices, and finally realizes the purpose of efficient heat dissipation of the whole machine, further improving the heat dissipation efficiency of the whole machine.

[0068] In some specific embodiments, such as Figure 7 、 Figure 8 and Figure 9As shown in the figure, corresponding sealed structure housings are respectively provided for the high-density connector 205 and the power Clip of the conventional specification (i.e., the power supply device 206), which are the first sealed housing 400 and the second sealed housing 500 respectively. The first sealed housing 400 is used to seal the high-density connector 205. The first sealed housing 400 is fixedly connected to the box body 201, and a first sealing ring 401 is provided at the connection between the first sealed housing 400 and the box body 201. Specifically, the first sealed housing 400 designed for the high-density connector 205 can be fastened to the rear window of the chassis box body 201 by screws. The first sealed housing 400 and the box body 201 are sealed by the sealing ring. Inside the first sealed housing 400, the connector is transferred in a sealed manner. The first sealed housing 400 is designed with a guiding pin (guiding pin) to ensure blind docking between the high-density connector 205 and the data bus of the whole cabinet. Overall, the rear window of the chassis box body 201 integrates several fully sealed blind plug connectors for water, electricity, and data, which can be adapted to the blind plug of the water, electricity, and data three buses of the whole cabinet. Further, the second sealed housing 500 is used to seal the power supply device 206. The second sealed housing 500 is fixedly connected to the box body 201, and a second sealing ring 501 is provided at the connection between the second sealed housing 500 and the box body 201. Specifically, the second sealed housing 500 designed for the power Clip of the conventional specification can be fastened to the rear window of the chassis box body 201 by screws. The second sealed housing 500 and the box body 201 are sealed by the sealing ring. Inside the second sealed housing 500, it is transferred to the copper bar through a cable and finally connected to the UBB board through a cable. Glue is poured into the inner cavity of the second sealed housing 500 to achieve fixation and sealing.

[0069] In the above embodiment, by setting the sealed structure housing, the sealing performance of the overall structure is improved, thereby improving the feasibility of the directional flow - immersion liquid cooling heat dissipation structure, and further realizing the efficient heat dissipation of the whole machine.

[0070] In the above liquid cooling chassis, the liquid cooling chassis includes: a box cover module, and the box cover module includes an upper box cover and a lower box cover; a box body module, and the box body module includes a box body and a heat dissipation module arranged inside the box body. The upper box cover is connected to the upper half of one end of the box body through a first hinge connection member, and the lower box cover is connected to the lower half of one end of the box body through a second hinge connection member; the heat dissipation module includes a cold plate, and the cold plate is arranged between the upper box cover and the lower box cover. The box cover of the present application has a structure of upper and lower buckling, with the cold plate placed in the middle, and at the same time, it cools the chips on the upper and lower sides arranged on the box cover, improving the space utilization rate, realizing the efficient heat dissipation of the whole machine, and through the overall structure of the book page type, it is convenient to drain the coolant and open the cover for maintenance, improving the maintainability of the immersion liquid cooling chassis.

[0071] In one embodiment, a server is provided, which includes the liquid-cooled chassis described above. Among them, the liquid-cooled chassis includes: a cover module 100, the cover module 100 includes an upper cover 101 and a lower cover 102, and a device to be cooled 1 is provided on both the upper cover 101 and the lower cover 102; a box body module 200, the box body module 200 includes a box body 201 and a heat dissipation module 300 arranged inside the box body 201. The upper cover 101 is connected to the upper half of one end of the box body 201 through a first hinge connecting piece 2, and the lower cover 102 is connected to the lower half of one end of the box body 201 through a second hinge connecting piece 3; the heat dissipation module 300 includes a cold plate 301, and the cold plate 301 is arranged between the upper cover 101 and the lower cover 102.

[0072] In some specific embodiments, as Figure 4 shown, the device to be cooled 1 includes: a graphics processor module board 103, the graphics processor module board 103 is respectively arranged on the upper cover 101 and the lower cover 102, and a handle 104 is arranged at one end of each of the upper cover 101 and the lower cover 102.

[0073] Specifically, the graphics processor module board 103 is a UBB module. The UBB module (Unit Base Board, substrate) refers to a module board used to integrate multiple GPUs (Graphics Processing Unit, a microprocessor dedicated to graphics processing) into a matrix platform. The main function of the UBB module is to provide high-speed data transmission and communication between GPUs and between GPUs and CPUs (Central Processing Unit, central processor). In an AI (Artificial Intelligence) server, the UBB module is an important part of the GPU board group, usually used to carry the entire GPU platform to ensure efficient computing and communication performance. The UBB module is mainly used in the following aspects in an AI server, including high-speed data transmission: The UBB module ensures high-speed data transmission between GPUs and between GPUs and CPUs through a high-density printed circuit board (PCB) design to meet the needs of large-scale parallel computing; integrating multiple GPUs: The UBB module can integrate multiple GPUs into a matrix platform to improve the overall computing power and efficiency; high reliability: Since the UBB module undertakes a large number of computing tasks, its design needs to ensure high reliability and stability to cope with high-load and high-frequency computing requirements. Based on this, as Figure 3 and Figure 4As shown, the UBB module of this application supports 8 OAM acceleration cards (GPU acceleration cards), supports 4 network chips in front of the AI node, and 4 optical modules in the front window to achieve high-speed network switching. The rear window is interconnected with the switching node through a high-density connector. The board integrates a BMC (Baseboard Management Controller) chip, which is responsible for managing the VR power supply (Trans Inductor Voltage Regulator, a power supply technology that uses a coupled inductor secondary winding in series with a tuning inductor to increase the coupled current), PHY (Physical Layer, the port physical layer, which is the lowest layer in the OSI - Open System Interconnection model and is a chip responsible for sending and receiving Ethernet data frames), clock, RTC (Real - Time Clock, an integrated circuit chip that can provide continuous and accurate time information for electronic devices and keep time data from being lost in the event of a power outage), Retimerr, and temperature sensors; among them, as Figure 3 and Figure 4 shown, a UBB module is provided on each box cover. The box cover serves as the substrate of the UBB module, used as the support for the UBB board card, and the PCB is locked on the substrate.

[0074] In some specific embodiments, as Figure 1 and Figure 2 shown, the upper box cover 101, the lower box cover 102 and the box body 201 are respectively connected by a first hinge connector 2 and a second hinge connector 3, so as to drive the UBB module provided on the box cover to flip up and down and buckle on the box body 201 of the chassis. At the same time, the surface of the OAM chip supported by the UBB module can be attached to the cold plate 301, so as to ensure the rapid heat dissipation of the OAM chip. Further, the upper box cover 101, the lower box cover 102 and the box body 201 are sealed through a sealing ring. The sealing ring is fixed on the box body 201, and the upper box cover 101 and the lower box cover 102 are fixed by screws at the front window of the box body 201. Among them, the screw fasteners can be further replaced by other tool - free locking methods such as electromagnetic locks to improve the maintainability of the chassis. The same applies hereinafter; as Figure 4 shown, two handles 104 are provided at one end of the upper box cover 101 and the lower box cover 102 for easy opening and maintenance.

[0075] In the above - mentioned embodiment, the box cover is designed in an up - and - down buckling structure form, and the cold plate is placed in the middle, which can cool the chips on both the upper and lower sides at the same time. A system architecture with a high - density layout of 16 OAM acceleration cards can be realized in a 1.5U space, improving the space utilization rate. And through the book - page - type overall structure, it is convenient to drain the coolant and open the cover for maintenance, improving the maintainability of the immersion liquid - cooled chassis.

[0076] In some specific embodiments, the cabinet module 200 further includes: a network connector 202, which is disposed at the other end of the cabinet 201.

[0077] Specifically, as Figure 5 and Figure 6 shown, 8 network connectors 202, also known as optical module sealed connectors, are disposed at the opening of the other end (i.e., the front window of the cabinet 201) of the cabinet 201. Among them, the network connector 202 is an important connecting device for realizing smooth data movement and communication within the network infrastructure. They physically connect devices to each other through cables and physical interfaces to ensure seamless and stable transmission of data between devices, allowing devices to communicate effectively. There are various types of network connectors, each of which is carefully designed to meet different network requirements. Based on this, the network connector 202 provided in this application is used for external network data exchange.

[0078] In some specific embodiments, the cabinet module 200 further includes a first liquid-cooling blind plug connector 203, a second liquid-cooling blind plug connector 204, a high-density connector 205, and a power supply device 206: The first liquid-cooling blind plug connector 203, the high-density connector 205, the power supply device 206, and the second liquid-cooling blind plug connector 204 are sequentially disposed at one end of the cabinet 201.

[0079] Specifically, as Figure 5 and Figure 6As shown in the figure, at one end of the box body 201 (i.e., the rear window of the box body 201), a first liquid cooling blind plug connector 203, a high-density connector 205, a power supply device 206, and a second liquid cooling blind plug connector 204 are sequentially arranged; among them, the first liquid cooling blind plug connector 203 is connected to the liquid outlet 302, the second liquid cooling blind plug connector 204 is connected to the liquid inlet 303, and the power supply device 206 refers to the power supply Clip. The Clip bonding technology in the power supply refers to a packaging process that uses a copper strip (Cu Clip) to connect the chip and the pin. This technology realizes the connection between the chip and the pin by using a solid copper bridge welded to the solder, thereby obtaining a unique packaging resistance value, a higher current capacity, and better heat dissipation performance; the liquid cooling blind plug connector is a special connector design, mainly used in liquid cooling systems, especially in occasions such as data centers that require efficient heat dissipation. The liquid cooling blind plug connector adopts a blind plug design, that is, it directly inserts into the holes of the radiator to achieve the cooling effect. The liquid cooling blind plug connector relies on the force of the water flow to distribute the coolant to each part of the radiator to ensure the realization of the cooling effect. Since there are multiple holes on the radiator, users can insert the connector at the required position. Therefore, the use of liquid cooling blind plug connectors makes the liquid cooling system more flexible and convenient; the high-density connector 205 is a high-end electrical connector, widely used in extreme conditions such as high power, high frequency, and high temperature, and its performance requirements are extremely high. The linearity, accuracy, and stability between the connectors are very important. The high density of the high-density connector 205 is mainly reflected in two aspects: one is the high density of the product itself, that is, the number of connector pins is increasing, and the other is the high density of installation, that is, the connector is becoming increasingly miniaturized and micro-miniaturized, and the number of connectors that can be installed per unit area (space) is increasing.

[0080] In the above-mentioned embodiment, through the modular immersion liquid cooling chassis, a variety of sealed connectors are integrated at the rear window to achieve blind plugging of water, electricity, and data, so as to realize the separate maintenance of the nodes in the cabinet and improve the maintainability of the immersion liquid cooling chassis.

[0081] In some specific embodiments, the heat dissipation module 300 further includes: a liquid outlet 302, the liquid outlet 302 is connected to the first liquid cooling blind plug connector 203; a liquid inlet 303, the liquid inlet 303 is connected to the second liquid cooling blind plug connector 204; a liquid distributor 304, one end of the liquid distributor 304 is connected to the liquid outlet 302 through a first coolant flow channel 305 (not shown in the figure), and the other end of the liquid distributor 304 is connected to the liquid inlet 303 through a second coolant flow channel 306 (not shown in the figure); a cold plate bracket 307, the cold plate bracket 307 is used to fix the cold plate 301 and is connected to the box body 201; a third coolant flow channel 308 (not shown in the figure) is provided in the cold plate 301, and both ends of the third coolant flow channel 308 close to the liquid distributor 304 are connected to the liquid distributor 304.

[0082] Inside the liquid distributor 304, there are multiple fourth coolant channels 309 (not shown in the figure) to generate multiple coolant loops. The coolant in a single coolant loop flows through two cold plates 301. The two cold plates 301 are arranged in parallel, and the multiple fourth coolant channels 309 are arranged in parallel.

[0083] The cold plate 301 includes an upper cavity 310 and a lower cavity 311. The upper cavity 310 and the lower cavity 311 are arranged in parallel and separated in the middle.

[0084] Specifically, as Figure 10 shown, the heat dissipation module 300 consists of a liquid outlet 302, a liquid inlet 303, a liquid distributor 304, cold plates 301, cold plate brackets 307, and multiple coolant channels. The heat dissipation module 300 is arranged in the middle part of the box body 201. The two ends of the liquid distributor 304 are fixed on both sides of the box body 201. The two ends of each cold plate bracket 307 are also fixed on both sides of the box body 201 and arranged in parallel with the liquid distributor 304. One heat dissipation module 300 includes 8 cold plates 301 and one liquid distributor 304. Four cold plates 301 in a row are arranged in parallel. The two rows of cold plates 301 are fixed respectively through the liquid distributor 304, cold plate brackets 307, and two cold plate brackets 307, that is, the cold plates 301 are respectively arranged between the liquid distributor 304 and the cold plate brackets 307, and between the two cold plate brackets 307; the liquid distributor 304 includes 4 branches arranged in parallel, that is, 4 fourth coolant channels 309, to generate 4 coolant loops. The coolant in each coolant loop flows through two cold plates 301. The two cold plates 301 are arranged in parallel. Based on this, the coolant enters the liquid distributor 304 through the liquid inlet 303. Inside the liquid distributor 304, the coolant is divided into four paths. The four paths are arranged in parallel. Each branch flows through two cold plates 301. The two cold plates 301 in each branch are arranged in parallel. Each cold plate 301 is divided into upper and lower sides, that is, into an upper cavity 310 and a lower cavity 311. The upper and lower side cavities are arranged in parallel and separated in the middle. The coolant flows out of the cold plate 301 after flowing through the cold plate 301 on the front window side to the front window position of the chassis box body 201. The coolant flows through other components inside the chassis and finally flows out from the rear window water outlet.

[0085] In the above embodiment, through the set heat dissipation structure of directional flow - immersion liquid cooling, taking into account the advantages of cold plate liquid cooling and immersion liquid cooling, the coolant preferentially cools high - power chips directionally to take away heat. And 16 OAM chips are arranged in parallel, achieving uniform and efficient heat dissipation. At the same time, the immersion cooling method can take away the heat of other heating devices, finally achieving the purpose of efficient heat dissipation of the whole machine and further improving the heat dissipation efficiency of the whole machine.

[0086] In some specific embodiments, such as Figure 7 、 Figure 8 and Figure 9As shown in the figure, corresponding sealed structural housings are respectively provided for the high-density connector 205 and the power Clip of the conventional specification (i.e., the power supply device 206), which are the first sealed housing 400 and the second sealed housing 500 respectively. The first sealed housing 400 is used to seal the high-density connector 205. The first sealed housing 400 is fixedly connected to the box body 201, and a first sealing ring 401 is provided at the connection between the first sealed housing 400 and the box body 201. Specifically, the first sealed housing 400 designed for the high-density connector 205 can be fastened to the rear window of the chassis box body 201 by screws. The first sealed housing 400 and the box body 201 are sealed by the sealing ring. Inside the first sealed housing 400, the connector is transferred in a sealed manner. The first sealed housing 400 is designed with a guiding pin (guiding pin) to ensure blind docking between the high-density connector 205 and the data bus of the whole cabinet. Overall, the rear window of the chassis box body 201 integrates several fully sealed blind plug connectors for water, electricity, and data, which can be adapted to the blind plug of the water, electricity, and data three buses of the whole cabinet. Further, the second sealed housing 500 is used to seal the power supply device 206. The second sealed housing 500 is fixedly connected to the box body 201, and a second sealing ring 501 is provided at the connection between the second sealed housing 500 and the box body 201. Specifically, for the second sealed housing 500 designed for the power Clip of the conventional specification, the second sealed housing 500 can be fastened to the rear window of the chassis box body 201 by screws. The second sealed housing 500 and the box body 201 are sealed by the sealing ring. Inside the second sealed housing 500, it is transferred to the copper bar through a cable and finally connected to the UBB board through a cable. Glue is poured into the inner cavity of the second sealed housing 500 to achieve fixation and sealing.

[0087] In the above embodiment, by setting the sealed structural housing, the sealing performance of the overall structure is improved, thereby improving the feasibility of the heat dissipation structure of directional flow - immersion liquid cooling, and further realizing the efficient heat dissipation of the whole machine.

[0088] The technical features of the above embodiments can be combined arbitrarily. For the sake of brief description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0089] The above has introduced in detail a liquid-cooled chassis and a server provided by the embodiments of the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the technical solution and its core idea of the present application; those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A liquid cooling chassis, characterized in that: The liquid cooling chassis comprises: A box cover module (100), the box cover module (100) comprising an upper box cover (101) and a lower box cover (102), and heat dissipation equipment (1) is disposed on both the upper box cover (101) and the lower box cover (102); A box module (200), the box module (200) comprising a box (201) and a heat dissipation module (300) arranged inside the box (201), the upper box cover (101) being connected to the upper half of one end of the box (201) via a first hinge connector (2), and the lower box cover (102) being connected to the lower half of one end of the box (201) via a second hinge connector (3); The heat dissipation module (300) comprises a cold plate (301), and the cold plate (301) is arranged between the upper box cover (101) and the lower box cover (102).

2. The liquid cooling chassis according to claim 1, characterized in that: The heat dissipation device (1) comprises: A graphics processor module board (103), wherein the graphics processor module board (103) is respectively arranged on the upper box cover (101) and the lower box cover (102), and a handle (104) is respectively arranged at one end of the upper box cover (101) and the lower box cover (102).

3. The liquid cooling chassis according to claim 1, characterized in that: The box module (200) further comprises: A network connector (202), wherein the network connector (202) is arranged at the other end of the box (201).

4. The liquid cooling chassis according to claim 1, characterized in that: The box module (200) further comprises a first liquid-cooled blind-plug connector (203), a second liquid-cooled blind-plug connector (204), a high-density connector (205) and a power supply device (206): The first liquid-cooled blind-plug connector (203), the high-density connector (205), the power supply device (206), and the second liquid-cooled blind-plug connector (204) are sequentially arranged at one end of the box (201).

5. The liquid cooling chassis according to claim 4, characterized in that: The heat dissipation module (300) further includes: A liquid outlet (302), the liquid outlet (302) being connected to the first liquid-cooling blind plug connector (203); A liquid inlet (303), the liquid inlet (303) being connected to the second liquid-cooling blind plug connector (204); A liquid separator (304), one end of the liquid separator (304) being connected to the liquid outlet (302) via a first coolant flow channel (305), and the other end of the liquid separator (304) being connected to the liquid inlet (303) via a second coolant flow channel (306); A cold plate bracket (307), the cold plate bracket (307) being used to fix the cold plate (301) and connected to the box (201); A third cooling liquid flow channel (308) is provided in the cold plate (301), and both ends of the third cooling liquid flow channel (308) close to the liquid separator (304) are connected to the liquid separator (304).

6. The liquid cooling chassis according to claim 5, characterized in that: Also includes: A plurality of fourth coolant flow channels (309) are arranged inside the liquid distributor (304) to generate a plurality of coolant circuits. The coolant in a single coolant circuit flows through the two cold plates (301). The two cold plates (301) are arranged in parallel, and the plurality of fourth coolant flow channels (309) are arranged in parallel.

7. The liquid cooling chassis according to claim 1, characterized in that: The cold plate (301) comprises: An upper cavity (310) and a lower cavity (311), wherein the upper cavity (310) and the lower cavity (311) are arranged in parallel and separated in the middle.

8. The liquid cooling chassis according to claim 4, characterized in that: Also includes: The first sealed shell (400) is used to seal the high-density connector (205); the first sealed shell (400) is fixedly connected to the box body (201); and a first sealing ring (401) is provided at the connection between the first sealed shell (400) and the box body (201).

9. The liquid cooling chassis according to claim 4, characterized in that: Also includes: The second sealed shell (500) is used to seal the power supply device (206); the second sealed shell (500) is fixedly connected to the box body (201); and a second sealing ring (501) is provided at the connection between the second sealed shell (500) and the box body (201).

10. A server, characterized in that: A liquid-cooled chassis comprising any one of claims 1 to 9.

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