Heat dissipation device and server
By setting up water inlet and water outlet components in the heat dissipation device, the heat dissipation needs of different computing nodes can be adapted without adjustment, solving the cost increase caused by frequent cabinet adjustments, and improving the flexibility and compatibility of the device.
Patent Information
- Application Number
- CN202510527986.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-25
- Publication Date
- 2025-08-05
- Estimated Expiration
- 2045-04-25
AI Technical Summary
In the prior art, with the renewal of computing nodes, the design of the cabinet needs to be frequently adjusted, resulting in increased costs and waste of resources, and it is not possible to effectively compatible with computing nodes of different models.
A heat dissipation device is designed, including a water inlet assembly and a water outlet assembly. By setting up a water inlet and water outlet that can be connected to the water inlet and water outlet of the calculation node, it ensures that even if the calculation node is updated, there is no need to adjust the heat dissipation device structure and adapt to different calculation nodes.
It reduces design and production costs, improves the flexibility and reliability of the heat dissipation device, reduces resource consumption, and is compatible with more computing nodes.
Smart Images

Figure CN120045042B_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic equipment, and in particular to a heat dissipation device and a server. Background Art
[0002] Related technologies point out that with the continuous advancement of AI technology, the computing power and power consumption of single GPU cards continue to grow, making effective cooling of GPU cards in servers particularly important. In terms of AI cabinet design, considering the development and changes in computing nodes (primarily GPU cards), the entire cabinet design must also be adjusted to meet new requirements. The current practice is to integrate the power supply unit, GPU server, and cooling distribution unit (CDU) into the same cabinet, and typically use cold plate liquid cooling for heat dissipation.
[0003] Specifically, two liquid cooling pipes are configured at the rear of the cabinet, providing channels for the incoming and outgoing cooling liquid respectively. All server computing nodes are connected to the CDU located at the bottom of the cabinet through these two pipes. The CDU is responsible for providing secondary-side heat dissipation for the servers. However, with the upgrade of each generation of computing nodes, this design often requires redesigning and adapting to new cabinets, resulting in increased costs and waste of resources. Because the development speed of computing nodes is significantly faster than the evolution speed of cabinets, in most cases, changes to cabinets are passive adjustments made only to adapt to the needs of new computing nodes. This situation not only increases the cost of designing new cabinets, but also consumes a lot of human resources. Summary of the Invention
[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a heat dissipation device that reduces design and production costs, reduces resource consumption, ensures that the heat dissipation device is compatible with more computing nodes, and improves the flexibility and reliability of the heat dissipation device.
[0005] The present application also provides a server with a heat dissipation device.
[0006] According to the first aspect of the present application, the heat dissipation device is used to dissipate heat for computing nodes, and the heat dissipation device includes: a cabinet, the computing nodes are arranged in the cabinet, and each computing node has a water inlet and a water outlet; a cold distribution unit, the cold distribution unit is arranged in the cabinet; a water inlet component, the water inlet component is arranged on the cabinet, the water inlet component is connected between the cold distribution unit and each computing node, the water inlet component includes a plurality of water inlet pipes, the plurality of water inlet pipes extend in a vertical direction and are arranged at intervals in a first direction, and the water inlet of each computing node is connected to at least one of the plurality of water inlet pipes; a water outlet component, the water outlet component is arranged on the cabinet, the water outlet component is connected between the cold distribution unit and each computing node, the water outlet component includes a plurality of water outlet pipes, the plurality of water outlet pipes extend in a vertical direction and are arranged at intervals in the first direction, and the water outlet of each computing node is connected to at least one of the plurality of water outlet pipes.
[0007] According to the heat dissipation device of the present application, by setting a water inlet component and a water outlet component that can be connected and communicated with the water inlet and outlet of different computing nodes, even if the computing nodes are constantly improved, the heat dissipation device can adapt to the computing nodes without making adjustments. This reduces the design cost and production cost of the device, reduces resource consumption, ensures that the heat dissipation device can be compatible with more computing nodes, and improves the flexibility and reliability of the heat dissipation device.
[0008] In some feasible embodiments of the present application, the plurality of water inlet pipes and the plurality of water outlet pipes are arranged in a one-to-one correspondence, and each water inlet pipe and the corresponding water outlet pipe are arranged adjacent to each other to form a group.
[0009] In the above technical solution, the water inlet assembly and the water outlet assembly are suitable for being connected and communicated with different computing nodes. Even if different computing nodes are replaced, there is no need to replace the heat dissipation device, and there is no need to use longer pipes for connection, which ensures that the structure of the heat dissipation device is simple, easy to assemble and maintain, and reduces the difficulty of assembly and maintenance.
[0010] In some feasible embodiments of the present application, a truss is provided on the cabinet body, and a plurality of adjustment parts are provided on the truss, and the upper end of each water inlet pipe and the upper end of the corresponding water outlet pipe are connected to the corresponding adjustment part.
[0011] In the above technical solution, the water inlet pipe and / or water outlet pipe in each installation position can be adjusted accordingly according to the position of the water inlet and / or water outlet on the computing node, so that the computing node is connected to the cooling distribution unit without changing the structure of the heat dissipation device, so that the water inlet component and the water outlet component are suitable for connection with different computing nodes, thereby improving the flexibility of the heat dissipation device and reducing design costs and production costs.
[0012] In some feasible embodiments of the present application, each of the adjustment parts is formed as an adjustment hole, and a fixing rod is provided between each water inlet pipe and the cabinet body, and between each water outlet pipe and the cabinet body. The fixing rod extends along a second direction perpendicular to the first direction and passes through the adjustment hole, and the position of the fixing rod in the adjustment hole along the first direction is adjustable.
[0013] In the above technical solution, by setting an adjustment hole and a fixing rod, the water inlet assembly and / or the water outlet assembly are connected to the cabinet through the fixing rod through the adjustment hole, and the relative position with the cabinet is adjustable, which improves the flexibility and adaptability of the heat dissipation device and enhances the stability and stability of the heat dissipation device.
[0014] In some feasible embodiments of the present application, an adjusting member is provided between each water inlet pipe and the corresponding water outlet pipe, and the adjusting member is used to adjust the distance between the water inlet pipe and the corresponding water outlet pipe.
[0015] In the above technical solution, by setting an adjustment member between the water inlet pipe and the water outlet pipe, precise adjustment of the position of the water inlet pipe and / or the water outlet pipe is achieved, which improves the flexibility and adaptability of the heat dissipation device, simplifies the installation and maintenance steps, and improves the reliability and safety of the heat dissipation device.
[0016] In some feasible embodiments of the present application, the adjusting member is formed with two adjusting grooves arranged back to back, and the two adjusting grooves are respectively provided with a water inlet pipe and a corresponding water outlet pipe, and the distance between the two adjusting grooves is adjustable.
[0017] In the above technical solution, two adjustment grooves arranged back to back are formed on the adjustment member, and the distance between the two adjustment grooves is adjustable, thereby improving the adjustment flexibility of the water inlet assembly and / or the water outlet assembly. The water inlet pipe and / or the water outlet pipe are arranged in the adjustment groove, which not only fixes the water inlet pipe and / or the water outlet pipe, but also facilitates the adjustment of the distance between the water inlet pipe and / or the water outlet pipe, or facilitates the adjustment of the relative position between the water inlet pipe and / or the water outlet pipe and the cabinet body, and is suitable for assembly with computing nodes of different structures and models, thereby reducing the design cost and production cost of the heat dissipation device.
[0018] In some feasible embodiments of the present application, the adjusting member has an adjusting seat and two adjusting blocks, the two adjusting blocks are respectively arranged on both sides of the adjusting seat in the first direction, each adjusting block is formed with an adjusting slot, each adjusting block is formed with a first adjusting portion, and a second adjusting portion is formed on the adjusting seat, and the distance between each adjusting block and the adjusting seat is adjusted by cooperation between the first adjusting portion and the second adjusting portion.
[0019] In the above technical solution, an adjustment groove is provided on each adjustment block, and the water inlet pipe and / or the water outlet pipe is fixed in the adjustment groove. Through the cooperation between the first adjustment part and the second adjustment part, the position of each adjustment block relative to the adjustment seat can be accurately adjusted, thereby achieving precise adjustment of the water inlet pipe and the water outlet pipe, reducing the difficulty of installation and maintenance of the heat dissipation device.
[0020] In some feasible embodiments of the present application, the heat dissipation device further includes: a diverter plate, which is arranged on the cabinet and is connected to the cold distribution unit.
[0021] In the above technical solution, a diverter plate is arranged between the water inlet component and the cold distribution unit and between the water outlet component and the cold distribution unit. In this way, even if the position of the water inlet pipe of the water inlet component changes and / or the position of the water outlet pipe of the water outlet component changes, it can still be connected to the cold distribution unit through the diverter plate. The water inlet component and the water outlet component are suitable for connection with different computing nodes, and there is no need to use longer pipes for connection, which ensures that the structure of the heat dissipation device is simple, easy to assemble and maintain, reduces the difficulty of assembly and maintenance, and enhances the adaptability and extensibility of the heat dissipation device.
[0022] In some feasible embodiments of the present application, the water inlet assembly includes: a water inlet manifold, which is connected between the cold distribution unit and each of the water inlet pipes, each of the water inlet pipes is connected to the water inlet manifold, and the water inlet manifold is connected to the cold distribution unit and / or the diversion plate.
[0023] In the above technical solution, a water inlet manifold is provided between the cooling distribution unit and the water inlet pipe, so that the refrigerant can be evenly distributed from the cooling distribution unit to each water inlet pipe, ensuring that each computing node can obtain the same or demand-adjusted refrigerant flow. The distribution of the refrigerant is centrally managed by the water inlet manifold, which reduces the complex piping layout and makes the structure of the water inlet component simple and clear, which is convenient for assembly, daily maintenance and troubleshooting.
[0024] In some feasible embodiments of the present application, a first connecting pipe is connected between the water inlet manifold and each of the water inlet pipes, and a second connecting pipe is connected between the water inlet manifold and the cold distribution unit and / or the diverter plate.
[0025] In the above technical solution, the water inlet manifold is connected to each water inlet pipe through a first connecting pipe. The first connecting pipe connects the water inlet manifold and the water inlet pipe to ensure that the refrigerant can be accurately distributed to each computing node. Even if the position of the water inlet pipe is adjusted, it will not affect the connection between the water inlet pipe and the water inlet manifold. Even if a different computing node is replaced, the water inlet assembly can still be connected to the computing node, thereby improving the flexibility and convenience of the heat dissipation device.
[0026] In some feasible embodiments of the present application, the water outlet assembly includes: a water outlet manifold, which is connected between the cold distribution unit and each of the water outlet pipes, each of the water outlet pipes is connected to the water outlet manifold, and the water outlet manifold is connected to the cold distribution unit and / or the diversion plate.
[0027] In the above technical solution, a water outlet manifold is provided between the cooling distribution unit and the water outlet pipe, so that the heated refrigerant from each computing node can be centrally recovered, and the refrigerant is guided back to the cooling distribution unit or the diversion plate for further cooling, ensuring that the refrigerant can be recovered evenly and efficiently. The recovery of the refrigerant is centrally managed by the water outlet manifold, which reduces the complex piping layout and makes the structure of the water outlet component simple and clear, which is convenient for assembly, daily maintenance and troubleshooting.
[0028] In some feasible embodiments of the present application, a first connecting pipe is connected between the water outlet manifold and each of the water outlet pipes, and a second connecting pipe is connected between the water outlet manifold and the cold distribution unit and / or the diversion plate.
[0029] In the above technical solution, the water outlet manifold is connected to each water outlet pipe through a first connecting pipe. The first connecting pipe connects the water outlet manifold to the water outlet pipe, ensuring that the refrigerant can be accurately and efficiently concentrated. Even if the position of the water outlet pipe is adjusted, it will not affect the connection between the water outlet pipe and the water outlet manifold. Even if different computing nodes are replaced, the water outlet component can still be connected to the computing node, thereby improving the flexibility and convenience of the heat dissipation device.
[0030] In some feasible embodiments of the present application, a third connecting pipe is connected between the water inlet pipe and the water inlet of the computing node, and between the water outlet pipe and the water outlet of the computing node.
[0031] In the above technical solution, the third connecting pipe is used to accurately connect the water inlet pipe with the water inlet of the computing node, and the water outlet pipe with the water outlet of the computing node, to ensure that the refrigerant can accurately enter and leave each computing node. The length and angle of the third connecting pipe can be flexibly adjusted to adapt to different installation requirements.
[0032] In some feasible embodiments of the present application, a plurality of installation positions are provided on the cabinet body, and each of the installation positions is provided with a water inlet pipe and / or a water outlet pipe.
[0033] The server according to the second aspect of the present application includes the heat dissipation device according to the first aspect of the present application.
[0034] According to the server of the present application, by setting the heat dissipation device of the first aspect of the present application, it has the same technical effect, that is, by setting the water inlet component and the water outlet component that can be connected and communicated with the water inlet and water outlet of different computing nodes, even if the computing nodes are constantly improved, the heat dissipation device can adapt to the computing nodes without making adjustments, which reduces the design cost and production cost of the device, reduces resource consumption, ensures that the heat dissipation device can be compatible with more computing nodes, and improves the flexibility and reliability of the heat dissipation device.
[0035] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0036] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0037] Figure 1 A schematic diagram of a heat dissipation device provided in an embodiment of the present application;
[0038] Figure 2 A partially enlarged schematic diagram of a heat dissipation device according to an embodiment of the present application;
[0039] Figure 3 A schematic diagram of a computing node in one embodiment of the present application;
[0040] Figure 4 A schematic diagram of a computing node in another embodiment of the present application;
[0041] Figure 5 This is a schematic diagram of a computing node in yet another embodiment of the present application;
[0042] Figure 6 This is a schematic diagram of a computing node in yet another embodiment of the present application;
[0043] Figure 7 This is a schematic diagram of a computing node in yet another embodiment of the present application.
[0044] The above drawings include the following reference numerals:
[0045] 100. Heat dissipation device;
[0046] 1. Cabinet;
[0047] 2. Cold distribution unit;
[0048] 3. Water inlet assembly; 31. Water inlet pipe; 32. Water inlet manifold;
[0049] 4. Water outlet assembly; 41. Water outlet pipe; 42. Water outlet manifold;
[0050] 5. Truss; 51. Adjustment hole;
[0051] 6. Fixing rod;
[0052] 7. Adjustment member; 71. Adjustment seat; 72. Adjustment block; 73. Adjustment slot;
[0053] 8. Diverter plate; 9. First connecting pipe; 10. Second connecting pipe; 11. Third connecting pipe;
[0054] 200, computing node; 201, water inlet; 202, water outlet;
[0055] P1, first position; P2, second position; P3, third position. DETAILED DESCRIPTION
[0056] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0057] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.
[0058] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.
[0059] In the description of the embodiments of this application, the technical terms "first" and "second" are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.
[0060] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0061] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.
[0062] In the description of the embodiments of the present application, the term "plurality" refers to more than two (including two).
[0063] Related technologies point out that with the continuous advancement of AI technology, the computing power and power consumption of single GPU cards continue to grow, making effective cooling of GPU cards in servers even more critical. Currently, AI servers primarily use air cooling and cold plate liquid cooling to address this challenge. Because different GPU models have different cooling requirements, the cooling system design within each server also varies.
[0064] In terms of AI cabinet design, considering the development and changes in computing nodes (primarily GPU cards), the design of the entire cabinet must also be adjusted accordingly to adapt to new requirements. The current practice is to integrate the power supply unit, GPU server, and cooling distribution unit (CDU) into the same cabinet, and usually use cold plate liquid cooling for heat dissipation. Specifically, two liquid cooling pipes are configured at the rear of the cabinet to provide channels for the incoming and outgoing coolant respectively. All server computing nodes are connected to the CDU at the bottom of the cabinet through these two pipes. The CDU is responsible for providing secondary side heat dissipation for the server.
[0065] However, with each new generation of compute nodes, this design often requires a complete redesign of the cabinets to accommodate them, resulting in increased costs and wasted resources. Because compute nodes are evolving significantly faster than cabinets, cabinet modifications are often made passively to accommodate the demands of new compute nodes. This situation not only increases the cost of designing new cabinets but also consumes significant human resources. Therefore, reducing cabinet production costs has become an urgent issue.
[0066] Based on the above considerations, in order to reduce the production cost of the cabinet, the applicant has designed a heat dissipation device after in-depth research. Figure 1-Figure 7 A heat dissipation device 100 according to an embodiment of the first aspect of the present application is described.
[0067] like Figure 1-Figure 7 As shown, Figure 1 A schematic diagram of a heat dissipation device provided according to an embodiment of the present application; Figure 2 A partially enlarged schematic diagram of a heat dissipation device according to an embodiment of the present application; Figure 3 A schematic diagram of a computing node in one embodiment of the present application; Figure 4 A schematic diagram of a computing node in another embodiment of the present application; Figure 5 This is a schematic diagram of a computing node in yet another embodiment of the present application; Figure 6 This is a schematic diagram of a computing node in yet another embodiment of the present application; Figure 7 This is a schematic diagram of a computing node in yet another embodiment of the present application.
[0068] According to the heat dissipation device 100 of the embodiment of the first aspect of the present application, the heat dissipation device 100 is used to dissipate heat from the computing node 200, and the heat dissipation device 100 includes: a cabinet 1, a cold distribution unit 2, a water inlet component 3 and a water outlet component 4.
[0069] Specifically, the computing node 200 is arranged in the cabinet 1, and each computing node 200 has a water inlet 201 and a water outlet 202. The cold distribution unit 2 is arranged in the cabinet 1, and the water inlet component 3 is arranged on the cabinet 1. The water inlet component 3 is connected between the cold distribution unit 2 and each computing node 200. The water inlet component 3 includes a plurality of water inlet pipes 31, and the plurality of water inlet pipes 31 extend in the vertical direction and are arranged at intervals in the first direction. The water inlet 201 of each computing node 200 is connected to at least one of the plurality of water inlet pipes 31. The water outlet component 4 is arranged on the cabinet 1, and the water outlet component 4 is connected between the cold distribution unit 2 and each computing node 200. The water outlet component 4 includes a plurality of water outlet pipes 41, and the plurality of water outlet pipes 41 extend in the vertical direction and are arranged at intervals in the first direction. The water outlet 202 of each computing node 200 is connected to at least one of the plurality of water outlet pipes 41.
[0070] It can be understood that the cabinet 1 serves as the basic structure of the entire heat dissipation device 100, and is used to accommodate the computing node 200, the cold distribution unit 2 (CDU), the water inlet component 3 and the water outlet component 4, etc. The computing node 200 is installed in the cabinet 1, and each computing node 200 has a water inlet 201 and a water outlet 202. In this way, each computing node 200 can be connected and communicated with the cold distribution unit 2 through its own water inlet 201 and water outlet 202, thereby reducing the difficulty of connecting the computing node 200 with the cold distribution unit 2.
[0071] The cold distribution unit 2 is located in the cabinet 1. The cold distribution unit 2 is used to provide power for the circulation of the refrigerant and adjust the temperature of the computing node 200. In this way, the cold distribution unit 2 transports the refrigerant to the computing node 200, and the refrigerant exchanges heat with the computing node 200. After the heat exchange, the refrigerant carrying heat flows back from the computing node 200 to the cold distribution unit 2, and the refrigerant exchanges heat again in the cold distribution unit 2 to reduce the refrigerant temperature.
[0072] The water inlet assembly 3 is located on the cabinet 1 and is used to distribute the refrigerant to the water inlet 201 of each computing node 200. The water inlet assembly 3 includes a plurality of water inlet pipes 31, each of which extends in a vertical direction. The water inlet pipes 31 extend in a first direction (such as Figure 1 The water inlet 201 of each computing node 200 is connected to at least one water inlet pipe 31. In this way, each computing node 200 can be connected to the water inlet component 3 and connected to the cold distribution unit 2, ensuring that each computing node 200 can receive a sufficient and uniform supply of refrigerant. The water inlet component 3 can adapt to computing nodes 200 of different numbers and layouts, which helps to reduce the cost of redesigning the cabinet 1 due to the replacement of computing nodes 200.
[0073] The water outlet assembly 4 is located on the cabinet 1. The water outlet assembly 4 is used to collect the refrigerant flowing out of each computing node 200 and transport the refrigerant collected by each computing node 200 back to the cooling distribution unit. The water outlet assembly 4 includes a plurality of water outlet pipes 41. Each water outlet pipe 41 extends in a vertical direction. The water inlet pipe 31 is in a first direction (such as Figure 1 The water outlet 202 of each computing node 200 is connected to at least one water outlet pipe 41. In this way, each computing node 200 can be connected to the water outlet component 4 and connected to the cold distribution unit 2, ensuring that the refrigerant in each computing node 200 flows back to the cold distribution unit 2. Therefore, the water outlet component 4 can adapt to computing nodes 200 of different numbers and layouts. The water outlet component 4 cooperates with the water inlet component 3, which helps to reduce the cost of updating the design of the cabinet 1 due to the replacement of computing nodes 200.
[0074] The working process of the heat dissipation device 100 of the present application is described below:
[0075] First, the refrigerant flows out of the cold distribution unit 2 and flows into the water inlet component 3, and then the refrigerant flows from the water inlet component 3 into the computing node 200 through the water inlet 201. The refrigerant exchanges heat in the computing node 200. After the heat exchange, the refrigerant carrying heat flows out of the computing node 200 and flows into the water outlet pipe 41 through the water outlet 202. Finally, after the heat exchange, the refrigerant carrying heat flows out of the water outlet pipe 41 and flows back to the cold distribution unit 2, thereby ensuring the heat dissipation effect of the computing node 200.
[0076] In a specific embodiment, referring to Figure 1 As shown, the computing node 200 and the cooling distribution unit 2 are both located in the cabinet 1, the water inlet assembly 3 and the water outlet assembly 4 are both located on the cabinet 1, the water inlet assembly 3 includes three water inlet pipes 31, the water outlet assembly 4 includes three water outlet pipes 41, the water inlet pipes 31 and the water outlet pipes 41 extend in the up and down directions, and the cabinet 1 has a first position P1, a second position P2 and a third position P3. The first position P1 is provided with an inlet pipe 31 and an outlet pipe 41, and the inlet pipe 31 and the outlet pipe 41 are arranged adjacent to each other. The second position P2 is provided with an inlet pipe 31 and a water outlet pipe 41, the water inlet pipe 31 and the water outlet pipe 41 are arranged adjacent to each other, and a water inlet pipe 31 and a water outlet pipe 41 are provided in the third position P3, and the water inlet pipe 31 and the water outlet pipe 41 are arranged adjacent to each other. In this way, even if a different computing node 200 is replaced, there is no need to replace the heat dissipation device 100. The water inlet assembly 3 and the water outlet assembly 4 are suitable for being connected and communicated with different computing nodes 200, and there is no need to use a longer pipe for connection, thereby ensuring that the structure of the heat dissipation device 100 is simple, easy to assemble and maintain, and reducing the difficulty of assembly and maintenance.
[0077] That is, when the water inlet 201 of the computing node 200 is located at the first position P1, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the first position P1; when the water outlet 202 of the computing node 200 is located at the first position P1, the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the first position P1;
[0078] When the water inlet 201 of the computing node 200 is located at the first position P1, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the first position P1; when the water outlet 202 of the computing node 200 is located at the second position P2, the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the second position P2;
[0079] When the water inlet 201 of the computing node 200 is located at the first position P1, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the first position P1; when the water outlet 202 of the computing node 200 is located at the third position P3, the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the third position P3;
[0080] When the water inlet 201 of the computing node 200 is located at the second position P2, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the second position P2; when the water outlet 202 of the computing node 200 is located at the first position P1, the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the first position P1;
[0081] When the water inlet 201 of the computing node 200 is located at the second position P2, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the second position P2; when the water outlet 202 of the computing node 200 is located at the second position P2, the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the second position P2;
[0082] When the water inlet 201 of the computing node 200 is located at the second position P2, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the second position P2. When the water outlet 202 of the computing node 200 is located at the third position P3, the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the third position P3.
[0083] When the water inlet 201 of the computing node 200 is located at the third position P3, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the third position P3; when the water outlet 202 of the computing node 200 is located at the first position P1, the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the first position P1;
[0084] When the water inlet 201 of the computing node 200 is located at the third position P3, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the third position P3; when the water outlet 202 of the computing node 200 is located at the second position P2, the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the second position P2;
[0085] When the water inlet 201 of the computing node 200 is located at the third position P3, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the third position P3. When the water outlet 202 of the computing node 200 is located at the third position P3, the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the third position P3.
[0086] According to the heat dissipation device 100 of the embodiment of the present application, by providing a water inlet component 3 and a water outlet component 4 that can be connected and communicated with the water inlet 201 and the water outlet 202 of different computing nodes 200, even if the computing node 200 is continuously improved, the heat dissipation device 100 can adapt to the computing node 200 without making any adjustments, thereby reducing the design cost and production cost of the device, reducing resource consumption, ensuring that the heat dissipation device 100 can be compatible with more computing nodes 200, and improving the flexibility and reliability of the heat dissipation device 100.
[0087] In any embodiment of the present application, multiple water inlet pipes 31 are arranged in one-to-one correspondence with multiple water outlet pipes 41, and each water inlet pipe 31 is arranged adjacent to the corresponding water outlet pipe 41 to form a group. In this way, the water inlet assembly 3 and the water outlet assembly 4 are suitable for connecting and communicating with different computing nodes 200. Figure 1As shown, it can be understood that when the water inlet 201 of the computing node 200 is located at the first position P1 and the water outlet 202 of the computing node 200 is located at the first position P1, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the first position P1, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the first position P1; when the water inlet 201 of the computing node 200 is located at the first position P1 and the water outlet 202 of the computing node 200 is located at the second position P2, the computing node 200 The water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the first position P1, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the second position P2. When the water inlet 201 of the computing node 200 is located at the first position P1 and the water outlet 202 of the computing node 200 is located at the third position P3, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the first position P1, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the third position P3.
[0088] When the water inlet 201 of the computing node 200 is located at the second position P2 and the water outlet 202 of the computing node 200 is located at the first position P1, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the second position P2, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the first position P1; when the water inlet 201 of the computing node 200 is located at the second position P2 and the water outlet 202 of the computing node 200 is located at the second position P2, the computing node 200 The water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the second position P2, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the second position P2; when the water inlet 201 of the computing node 200 is located at the second position P2 and the water outlet 202 of the computing node 200 is located at the third position P3, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the second position P2, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the third position P3;
[0089] When the water inlet 201 of the computing node 200 is located at the third position P3 and the water outlet 202 of the computing node 200 is located at the first position P1, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the third position P3, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the first position P1; when the water inlet 201 of the computing node 200 is located at the third position P3 and the water outlet 202 of the computing node 200 is located at the second position P2, the computing node 200 The water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the third position P3, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the second position P2; when the water inlet 201 of the computing node 200 is located at the third position P3 and the water outlet 202 of the computing node 200 is located at the third position P3, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the third position P3, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the third position P3.
[0090] In other embodiments of the present application, the number of water inlet pipes and the number of water outlet pipes 41 may not be equal according to actual needs, that is, the number of water inlet pipes may be less than the number of water outlet pipes 41, or the number of water inlet pipes may be more than the number of water outlet pipes 41, and the positions of the water inlet pipes and the water outlet pipes 41 may be arranged according to actual needs to be suitable for more improved computing nodes 200.
[0091] In any embodiment of the present application, the cabinet 1 is provided with a truss 5, which is provided with multiple adjustment portions. The upper end of each water inlet pipe 31 is connected to the upper end of the corresponding water outlet pipe 41. This improves the flexibility and adaptability of the heat dissipation device 100. The position of the water inlet pipe 31 and the water outlet pipe 41 is adjusted by the corresponding adjustment portions, ensuring that all computing nodes 200 can be connected to the water inlet pipe 31 and the water outlet pipe 41 through the truss 5.
[0092] It can be understood that each water inlet pipe 31 and the corresponding water outlet pipe 41 are connected to the truss 5 through an adjustment part. In this way, the water inlet pipe 31 and / or the water outlet pipe 41 in each installation position can be adjusted accordingly according to the position of the water inlet 201 and / or the water outlet 202 on the computing node 200, so that the computing node 200 is connected to the cold distribution unit 2 without changing the structure of the heat dissipation device 100, so that the water inlet component 3 and the water outlet component 4 are suitable for connection with different computing nodes 200, thereby improving the flexibility of the heat dissipation device 100 and reducing the design cost and production cost.
[0093] Reference Figure 1As shown, the truss 5 is fixed on the cabinet 1, and three adjustment parts are provided on the truss 5. The three adjustment parts are respectively located in three installation positions, one adjustment part is provided in the first position P1, one adjustment part is provided in the second position P2, and one adjustment part is provided in the third position P3. The water inlet pipe 31 and the water outlet pipe 41 in the first position P1 are both connected to the cabinet 1 through the adjustment part in the first position P1. The adjustment part in the first position P1 is used to adjust the relative position of the water inlet pipe 31 and / or the water outlet pipe 41 in the first position P1 and the cabinet 1 in the first direction, and the second position P1 is used to adjust the relative position of the water inlet pipe 31 and / or the water outlet pipe 41 in the first position P1 and the cabinet 1 in the first direction. The water inlet pipe 31 and the water outlet pipe 41 in the position P2 are both connected to the cabinet 1 through the adjusting part in the second position P2. The adjusting part in the second position P2 is used to adjust the relative position of the water inlet pipe 31 and / or the water outlet pipe 41 in the second position P2 and the cabinet 1 in the first direction. The water inlet pipe 31 and the water outlet pipe 41 in the third position P3 are both connected to the cabinet 1 through the adjusting part in the third position P3. The adjusting part in the third position P3 is used to adjust the relative position of the water inlet pipe 31 and / or the water outlet pipe 41 in the third position P3 and the cabinet 1 in the first direction.
[0094] In any embodiment of the present application, each adjustment portion is formed as an adjustment hole 51, and a fixing rod 6 is provided between each water inlet pipe 31 and the cabinet 1 and between each water outlet pipe 41 and the cabinet 1. The fixing rod 6 extends in a second direction perpendicular to the first direction (such as Figure 2 The fixing rod 6 extends in the first direction (in the second direction shown) and passes through the adjustment hole 51. The position of the fixing rod 6 within the adjustment hole 51 is adjustable along the first direction. Thus, by providing the adjustment hole 51 and the fixing rod 6, the water inlet assembly 3 and / or the water outlet assembly 4 are connected to the cabinet 1 via the fixing rod 6 passing through the adjustment hole 51, and their relative positions with the cabinet 1 are adjustable, thereby improving the flexibility and adaptability of the heat dissipation device 100 and enhancing the stability of the heat dissipation device 100.
[0095] It is understood that when the structures and sizes of computing nodes 200 of different models or configurations differ, the position of each water inlet pipe 31 and water outlet pipe 41 relative to the cabinet 1 can be precisely adjusted by adjusting the position of the fixing rod 6 within the adjustment hole 51. When the computing node 200 needs to be replaced or upgraded, the heat sink 100 can be reconfigured by simply adjusting the position of the fixing rod 6, without the need for large-scale modification of the entire heat sink 100 or redesigning the structure of the heat sink 100, thereby reducing production costs. In addition, this allows for an optimized piping layout within the available space, avoiding unnecessary space waste, helping to reduce cross-talk and interference between different pipes, ensuring smooth operation of the heat sink 100, and reducing the failure rate of the heat sink 100.
[0096] For example, refer to Figure 1 and Figure 2As shown, the adjustment hole 51 is formed as a long strip through hole extending in the first direction, and the fixing rod 6 is arranged between each water inlet pipe 31 and the cabinet body 1 and between each water outlet pipe 41 and the cabinet body 1. The fixing rod 6 extends along the second direction, one end of the fixing rod 6 is connected to the water inlet pipe 31 and / or the water outlet pipe 41, and the other end of the fixing rod 6 extends into and passes through the adjustment hole 51 and is connected to the cabinet body 1. When the relative position of the water inlet pipe 31 and / or the water outlet pipe 41 and the cabinet body 1 needs to be adjusted, the position of the fixing rod 6 in the adjustment hole 51 can be adjusted.
[0097] In any embodiment of the present application, an adjustment member 7 is provided between each water inlet pipe 31 and the corresponding water outlet pipe 41. The adjustment member 7 is used to adjust the distance between the water inlet pipe 31 and the corresponding water outlet pipe 41. Thus, by providing the adjustment member 7 between the water inlet pipe 31 and the water outlet pipe 41, precise adjustment of the position of the water inlet pipe 31 and / or the water outlet pipe 41 is achieved, thereby improving the flexibility and adaptability of the heat dissipation device 100, simplifying the installation and maintenance steps, and improving the reliability and safety of the heat dissipation device 100.
[0098] Reference Figure 1 and Figure 2 As shown, an adjusting member 7 is provided between the water inlet pipe 31 and the water outlet pipe 41 in the first position P1, one end of the fixing rod 6 in the first position P1 is connected to the adjusting member 7, and the other end of the fixing rod 6 in the first position P1 is connected to the cabinet 1, and the adjusting member 7 in the first position P1 can adjust the distance between the water inlet pipe 31 and the water outlet pipe 41 in the first position P1; an adjusting member 7 is provided between the water inlet pipe 31 and the water outlet pipe 41 in the second position P2, one end of the fixing rod 6 in the second position P2 is connected to the adjusting member 7, and the second position The other end of the fixed rod 6 in P2 is connected to the cabinet 1, and the adjusting member 7 in the second position P2 can adjust the distance between the water inlet pipe 31 and the water outlet pipe 41 in the second position P2; an adjusting member 7 is provided between the water inlet pipe 31 and the water outlet pipe 41 in the third position P3, one end of the fixed rod 6 in the third position P3 is connected to the adjusting member 7, and the other end of the fixed rod 6 in the third position P3 is connected to the cabinet 1, and the adjusting member 7 in the third position P3 can adjust the distance between the water inlet pipe 31 and the water outlet pipe 41 in the third position P3.
[0099] In any embodiment of the present application, the adjustment member 7 is formed with two adjustment slots 73 arranged in opposite directions, and the two adjustment slots 73 are respectively provided with a water inlet pipe 31 and a corresponding water outlet pipe 41, and the distance between the two adjustment slots 73 is adjustable. Thus, by forming two adjustment slots 73 arranged in opposite directions on the adjustment member 7, and the distance between the two adjustment slots 73 is adjustable, the adjustment flexibility of the water inlet assembly 3 and / or the water outlet assembly 4 is improved, and the water inlet pipe 31 and / or the water outlet pipe 41 are arranged in the adjustment slot 73, which not only plays a role in fixing the water inlet pipe 31 and / or the water outlet pipe 41, but also facilitates the adjustment of the distance between the water inlet pipe 31 and / or the water outlet pipe 41, or facilitates the adjustment of the relative position between the water inlet pipe 31 and / or the water outlet pipe 41 and the cabinet 1, and is suitable for assembly with computing nodes 200 of different structures and models, thereby reducing the design cost and production cost of the heat dissipation device 100.
[0100] For example, refer to Figure 1 and Figure 2 As shown, two adjusting grooves 73 are formed on the adjusting member 7 in the first position P1, and the two adjusting grooves 73 are arranged at intervals in the first direction and their openings face opposite directions. The water inlet pipe 31 in the first position P1 is fixed in one adjusting groove 73, and the water outlet pipe 41 in the first position P1 is fixed in the other adjusting groove 73. The relative position of the water inlet pipe 31 and / or the water outlet pipe 41 in the first position P1 with respect to the cabinet 1 is adjusted by the adjusting member 7, or the distance between the water inlet pipe 31 and the water outlet pipe 41 in the first position P1 is adjusted by the adjusting member 7; two adjusting grooves 73 are formed on the adjusting member 7 in the second position P2, and the two adjusting grooves 73 are arranged at intervals in the first direction and their openings face opposite directions. The water inlet pipe 31 in the second position P2 is fixed in one adjusting groove 73, and the water outlet pipe 41 in the second position P2 is fixed in the second adjusting groove 73. 41 is fixed in another adjusting groove 73, the water inlet pipe 31 and / or the water outlet pipe 41 in the second position P2 are adjusted in relative position to the cabinet 1 by the adjusting member 7, or the distance between the water inlet pipe 31 and the water outlet pipe 41 in the second position P2 is adjusted by the adjusting member 7; two adjusting grooves 73 are formed on the adjusting member 7 in the third position P3, the two adjusting grooves 73 are arranged at intervals in the first direction and the openings are facing opposite directions, the water inlet pipe 31 in the third position P3 is fixed in one adjusting groove 73, the water outlet pipe 41 in the third position P3 is fixed in the other adjusting groove 73, the water inlet pipe 31 and / or the water outlet pipe 41 in the third position P3 are adjusted in relative position to the cabinet 1 by the adjusting member 7, or the distance between the water inlet pipe 31 and the water outlet pipe 41 in the third position P3 is adjusted by the adjusting member 7.
[0101] In any embodiment of the present application, the adjustment member 7 includes an adjustment seat 71 and two adjustment blocks 72, the two adjustment blocks 72 being respectively arranged on both sides of the adjustment seat 71 in a first direction, each adjustment block 72 being formed with an adjustment slot 73, each adjustment block 72 being formed with a first adjustment portion, and the adjustment seat 71 being formed with a second adjustment portion, and the distance between each adjustment block 72 and the adjustment seat 71 being adjusted by the cooperation of the first adjustment portion and the second adjustment portion. Thus, an adjustment slot 73 is provided on each adjustment block 72, and the water inlet pipe 31 and / or the water outlet pipe 41 are fixed in the adjustment slot 73. Through the cooperation between the first adjustment portion and the second adjustment portion, the position of each adjustment block 72 relative to the adjustment seat 71 can be precisely adjusted, thereby achieving precise adjustment of the water inlet pipe 31 and the water outlet pipe 41, thereby reducing the difficulty of installation and maintenance of the heat dissipation device 100.
[0102] For example, refer to Figure 1 and Figure 2 As shown, the adjustment member 7 in the first position P1 has an adjustment seat 71 and two adjustment blocks 72, and the two adjustment blocks 72 are adjacently arranged in the first direction on both sides of the adjustment seat 71, and each adjustment block 72 is formed with an adjustment groove 73, and each adjustment block 72 is formed with a first adjustment portion, and the adjustment seat 71 is formed with a second adjustment portion. The distance between each adjustment block 72 and the adjustment seat 71 is adjusted by the cooperation of the first adjustment portion and the second adjustment portion. The water inlet pipe 31 in the first position P1 is fixed in one adjustment groove 73, and the water outlet pipe 41 in the first position P1 is fixed in another adjustment groove 73. The relative position of the water inlet pipe 31 and / or the water outlet pipe 41 in the first position P1 and the cabinet 1 is adjusted by the cooperation of the first adjustment portion and the second adjustment portion, or the distance between the water inlet pipe 31 and the water outlet pipe 41 in the first position P1 is adjusted by the cooperation of the first adjustment portion and the second adjustment portion.
[0103] The adjusting member 7 in the second position P2 has an adjusting seat 71 and two adjusting blocks 72. The two adjusting blocks 72 are adjacently arranged in the first direction on both sides of the adjusting seat 71. An adjusting groove 73 is formed on each adjusting block 72. Each adjusting block 72 is formed with a first adjusting portion. The adjusting seat 71 is formed with a second adjusting portion. The distance between each adjusting block 72 and the adjusting seat 71 is adjusted by the cooperation of the first adjusting portion and the second adjusting portion. The water inlet pipe 31 in the second position P2 is fixed in one adjusting groove 73. The water outlet pipe 41 in the second position P2 is fixed in another adjusting groove 73. The relative position of the water inlet pipe 31 and / or the water outlet pipe 41 in the second position P2 to the cabinet 1 is adjusted by the cooperation of the first adjusting portion and the second adjusting portion, or the distance between the water inlet pipe 31 and the water outlet pipe 41 in the second position P2 is adjusted by the cooperation of the first adjusting portion and the second adjusting portion.
[0104] The adjusting member 7 in the third position P3 has an adjusting seat 71 and two adjusting blocks 72. The two adjusting blocks 72 are arranged adjacent to each other in the first direction on both sides of the adjusting seat 71. An adjusting groove 73 is formed on each adjusting block 72. Each adjusting block 72 is formed with a first adjusting portion. A second adjusting portion is formed on the adjusting seat 71. The distance between each adjusting block 72 and the adjusting seat 71 is adjusted by the cooperation of the first adjusting portion and the second adjusting portion. The water inlet pipe 31 in the third position P3 is fixed in an adjusting groove 73, and the water outlet pipe 41 in the third position P3 is fixed in another adjusting groove 73. The water inlet pipe 31 and / or the water outlet pipe 41 in the third position P3 are adjusted in relative position to the cabinet 1 by the cooperation of the first adjusting portion and the second adjusting portion, or the distance between the water inlet pipe 31 and the water outlet pipe 41 in the third position P3 is adjusted by the cooperation of the first adjusting portion and the second adjusting portion.
[0105] For example, the first adjustment portion and the second adjustment portion may be connected by meshing teeth to facilitate adjustment of the distance between the adjustment block 72 and the adjustment seat 71 . The connection method of the first adjustment portion and the second adjustment portion includes but is not limited to this.
[0106] In any embodiment of the present application, the heat dissipation device 100 further includes: a diverter plate 8, which is provided on the cabinet 1 and is in communication with the cold distribution unit 2. It is understandable that the diverter plate 8 is provided between the water inlet component 3 and the cold distribution unit 2 and between the water outlet component 4 and the cold distribution unit 2. In this way, even if the position of the water inlet pipe 31 of the water inlet component 3 is changed and / or the position of the water outlet pipe 41 of the water outlet component 4 is changed, it is still possible to communicate with the cold distribution unit 2 through the diverter plate 8. The water inlet component 3 and the water outlet component 4 are suitable for being connected to different computing nodes 200, and there is no need to use longer pipes for connection, which ensures that the structure of the heat dissipation device 100 is simple, easy to assemble and maintain, reduces the difficulty of assembly and maintenance, and enhances the adaptability and extensibility of the heat dissipation device 100.
[0107] Furthermore, the provision of the diverter plate 8 also serves to regulate the refrigerant flow rate, ensuring that the refrigerant can be evenly distributed to each computing node 200, reducing the pressure loss of the refrigerant during transmission, and ensuring that the heat dissipation device 100 can operate efficiently at a lower pressure. The diverter plate 8 becomes a centralized interface point for centralized management of all pipeline connections in and out of the cooling distribution unit 2, reducing potential leakage points, and improving the sealing and safety of the heat dissipation device 100.
[0108] The working principle of the heat dissipation device 100 provided with the diverter plate 8 is described below:
[0109] First, the refrigerant flows out of the cold distribution unit 2 and flows into the diverter disk 8. The diverter disk 8 sends the refrigerant to each water inlet pipe 31 according to a preset path. The water inlet pipe 31 then guides the refrigerant to the corresponding computing node 200; then, the refrigerant that has absorbed heat in the computing node 200 flows into the corresponding water outlet pipe 41 through the water outlet 202, and returns to the diverter disk 8 through the water outlet pipe 41. It is then collected by the diverter disk 8 and guided back to the cold distribution unit 2 for further cooling, in preparation for circulating into the computing node 200 for heat exchange.
[0110] In any embodiment of the present application, the water inlet assembly 3 includes: a water inlet manifold 32, the water inlet manifold 32 is connected between the cold distribution unit 2 and each water inlet pipe 31, each water inlet pipe 31 is connected to the water inlet manifold 32, and the water inlet manifold 32 is connected to the cold distribution unit 2 and / or the diverter plate 8. It can be understood that the water inlet manifold 32 is provided between the cold distribution unit 2 and the water inlet pipe 31, so that the refrigerant can be evenly distributed from the cold distribution unit 2 to each water inlet pipe 31, ensuring that each computing node 200 can obtain the same or demand-adjusted refrigerant flow rate, and the distribution of the refrigerant is centrally managed by the water inlet manifold 32, which reduces the complex piping layout, makes the structure of the water inlet assembly 3 simple and clear, and facilitates assembly, daily maintenance and troubleshooting.
[0111] For example, refer to Figure 1 and Figure 2 As shown, the water inlet manifold 32 is connected between the diverter plate 8 and each water inlet pipe 31, and the lower ends of the three water inlet pipes 31 are all connected to the water inlet manifold 32, and the water inlet manifold 32 is communicated with the diverter plate 8. In this way, the refrigerant flows from the cold distribution unit 2 to the diverter plate 8, and then flows from the diverter plate 8 into the water inlet manifold 32, and then the refrigerant flows from the water inlet manifold 32 into each water inlet pipe 31, and finally flows from the water inlet pipe 31 through the water inlet 201 into the computing node 200 for heat exchange.
[0112] In other embodiments, the water inlet manifold 32 is connected between the cold distribution unit 2 and each water inlet pipe 31, and the lower ends of the three water inlet pipes 31 are all connected to the water inlet manifold 32, and the water inlet manifold 32 is communicated with the cold distribution unit 2. In this way, the refrigerant flows from the cold distribution unit 2 into the water inlet manifold 32, and then the refrigerant flows from the water inlet manifold 32 into each water inlet pipe 31, and finally flows from the water inlet pipe 31 through the water inlet 201 into the computing node 200 for heat exchange, that is, the diverter disk 8 is not provided in this embodiment, and the water inlet manifold 32 is directly connected to the cold distribution unit 2.
[0113] In any embodiment of the present application, a first connecting pipe 9 is connected between the water inlet manifold 32 and each water inlet pipe 31 , and a second connecting pipe 10 is connected between the water inlet manifold 32 and the cold distribution unit 2 and / or the diverter plate 8 . It can be understood that the water inlet manifold 32 is connected to each water inlet pipe 31 through the first connecting pipe 9, and the first connecting pipe 9 connects the water inlet manifold 32 to the water inlet pipe 31, ensuring that the refrigerant can be accurately distributed to each computing node 200. Even if the position of the water inlet pipe 31 is adjusted, it will not affect the connection between the water inlet pipe 31 and the water inlet manifold 32. Even if a different computing node 200 is replaced, the water inlet component 3 can still be connected to the computing node 200, which improves the flexibility and convenience of the heat dissipation device 100; the water inlet manifold 32 is connected to the cold distribution unit 2 and / or the diverter plate 8 through the second connecting pipe 10, and the second connecting pipe 10 connects the water inlet manifold 32 to the cold distribution unit 2 and / or the diverter plate 8, ensuring that the refrigerant can flow from the cold distribution unit 2 and / or the diverter plate 8 into the second connecting pipe 10, which is convenient for assembly and maintenance.
[0114] For example, refer to Figure 1 and Figure 2 As shown, the first connecting pipe 9 is connected between the water inlet manifold 32 and the water inlet pipe 31, the first connecting pipe 9 is connected to the lower end of the water inlet pipe 31, and the second connecting pipe 10 is connected between the water inlet manifold 32 and the diverter plate 8. In this way, the refrigerant flows from the cold distribution unit 2 to the diverter plate 8, and then flows from the diverter plate 8 through the second connecting pipe 10 into the water inlet manifold 32. Then the refrigerant flows from the water inlet manifold 32 through the first connecting pipe 9 into the water inlet pipe 31, and finally flows from the water inlet pipe 31 through the water inlet 201 into the computing node 200 for heat exchange.
[0115] In other embodiments, the first connecting pipe 9 is connected between the water inlet manifold 32 and the water inlet pipe 31, the first connecting pipe 9 is connected to the lower end of the water inlet pipe 31, and the second connecting pipe 10 is connected between the water inlet manifold 32 and the cold distribution unit 2. In this way, the refrigerant flows from the cold distribution unit 2 through the second connecting pipe 10 into the water inlet manifold 32, and then the refrigerant flows from the water inlet manifold 32 through the first connecting pipe 9 into the water inlet pipe 31, and finally flows from the water inlet pipe 31 through the water inlet 201 into the computing node 200 for heat exchange.
[0116] In any embodiment of the present application, the water outlet assembly 4 includes: a water outlet manifold 42, the water outlet manifold 42 is connected between the cold distribution unit 2 and each water outlet pipe 41, each water outlet pipe 41 is connected to the water outlet manifold 42, and the water outlet manifold 42 is connected to the cold distribution unit 2 and / or the diverter plate 8. It can be understood that the water outlet manifold 42 is provided between the cold distribution unit 2 and the water outlet pipe 41, so that the heated refrigerant from each computing node 200 can be centrally recovered and the refrigerant can be guided back to the cold distribution unit 2 or the diverter plate 8 for re-cooling, ensuring that the refrigerant can be recovered evenly and efficiently. The centralized management of the refrigerant recovery through the water outlet manifold 42 reduces the complex pipeline layout, making the structure of the water outlet assembly 4 simple and clear, and convenient for assembly, daily maintenance and troubleshooting.
[0117] For example, refer to Figure 1 and Figure 2 As shown, the water outlet manifold 42 is connected between the diverter plate 8 and each water outlet pipe 41, and the lower ends of the three water outlet pipes 41 are all connected to the water outlet manifold 42, and the water outlet manifold 42 is connected to the diverter plate 8. In this way, the computing node 200 carrying heat after heat exchange flows into the water outlet pipe 41 through the water outlet 202, and then the refrigerant carrying heat flows into the water outlet manifold 42 from the water outlet pipe 41, and then flows from the water outlet manifold 42 into the diverter plate 8, and finally the refrigerant carrying heat flows from the diverter plate 8 into the cooling distribution unit 2 to cool in preparation for the next cycle.
[0118] In other embodiments, the water outlet manifold 42 is connected between the diversion plate 8 and each water outlet pipe 41, and the lower ends of the three water outlet pipes 41 are all connected to the water outlet manifold 42, and the water outlet manifold 42 is connected to the cold distribution unit 2. In this way, the computing node 200 carrying heat after heat exchange flows into the water outlet pipe 41 through the water outlet 202, and then the refrigerant carrying heat flows into the water outlet manifold 42 from the water outlet pipe 41, and then the refrigerant carrying heat flows from the water outlet manifold 42 into the cold distribution unit 2 to cool in preparation for the next cycle.
[0119] In any embodiment of the present application, a first connecting pipe 9 is connected between the water outlet manifold 42 and each water outlet pipe 41 , and a second connecting pipe 10 is connected between the water outlet manifold 42 and the cold distribution unit 2 and / or the diversion plate 8 . It can be understood that the water outlet manifold 42 is connected to each water outlet pipe 41 through the first connecting pipe 9, and the first connecting pipe 9 connects the water outlet manifold 42 to the water outlet pipe 41, ensuring that the refrigerant can be accurately and efficiently concentrated. Even if the position of the water outlet pipe 41 is adjusted, it will not affect the connection between the water outlet pipe 41 and the water outlet manifold 42. Even if different computing nodes 200 are replaced, the water outlet component 4 can be connected to the computing node 200, which improves the flexibility and convenience of the heat dissipation device 100; the water outlet manifold 42 is connected to the cold distribution unit 2 and / or the diverter plate 8 through the second connecting pipe 10, and the second connecting pipe 10 connects the water outlet manifold 42 to the cold distribution unit 2 and / or the diverter plate 8, ensuring that the refrigerant can flow from the second connecting pipe 10 into the cold distribution unit 2 and / or the diverter plate 8, which is convenient for assembly and maintenance.
[0120] For example, refer to Figure 1 and Figure 2 As shown, the first connecting pipe 9 is connected between the water outlet manifold 42 and the water outlet pipe 41, the first connecting pipe 9 is connected to the lower end of the water outlet pipe 41, and the second connecting pipe 10 is connected between the water outlet manifold 42 and the diversion disk 8. In this way, the refrigerant carrying heat after heat exchange in each computing node 200 flows into the water outlet pipe 41 through the water outlet 202, and then the refrigerant carrying heat flows into the water outlet manifold 42 from the water outlet pipe 41 through the first connecting pipe 9, and then the refrigerant carrying heat flows from the water outlet manifold 42 through the second connecting pipe 10 into the diversion disk 8, and finally the refrigerant carrying heat flows from the diversion disk 8 into the cooling distribution unit 2.
[0121] In other embodiments, the first connecting pipe 9 is connected between the water outlet manifold 42 and the water outlet pipe 41, the first connecting pipe 9 is connected to the lower end of the water outlet pipe 41, and the second connecting pipe 10 is connected between the water outlet manifold 42 and the cold distribution unit 2. In this way, the refrigerant carrying heat after heat exchange in each computing node 200 flows into the water outlet pipe 41 through the water outlet 202, and then the refrigerant carrying heat flows into the water outlet manifold 42 from the water outlet pipe 41 through the first connecting pipe 9, and finally the refrigerant carrying heat flows from the water outlet manifold 42 through the second connecting pipe 10 into the cold distribution unit 2.
[0122] In any embodiment of the present application, a third connecting pipe 11 is connected between the water inlet pipe 31 and the water inlet 201 of the computing node 200, and between the water outlet pipe 41 and the water outlet 202 of the computing node 200. It can be understood that the third connecting pipe 11 is used to accurately connect the water inlet pipe 31 to the water inlet 201 of the computing node 200, and the water outlet pipe 41 to the water outlet 202 of the computing node 200, to ensure that the refrigerant can accurately enter and leave each computing node 200. The third connecting pipe 11 can be flexibly adjusted in length and angle to adapt to different installation requirements, thereby improving the flexibility, cooling efficiency and maintenance convenience of the heat dissipation device 100, meeting current heat dissipation requirements, and providing convenience for future upgrades of the computing nodes 200, simplifying the installation and maintenance process of the heat dissipation device 100, and reducing production costs.
[0123] For example, refer to Figure 1 and Figure 2 As shown, a third connecting pipe 11 is connected between each water inlet pipe 31 and the water inlet 201 of each computing node 200, and a third connecting pipe 11 is connected between each water outlet pipe 41 and the water outlet 202 of each computing node 200. The refrigerant flows from the cold distribution unit 2 to the diverter plate 8, and then flows from the diverter plate 8 through the second connecting pipe 10 into the water inlet manifold 32. Then the refrigerant flows from the water inlet manifold 32 through the first connecting pipe 9 into the water inlet pipe 31, and finally flows from the water inlet pipe 31 through the third connecting pipe 11 and into the computing node 200 from the water inlet 201 for heat exchange.
[0124] In other embodiments, the refrigerant flows from the cold distribution unit 2 through the second connecting pipe 10 into the water inlet manifold 32, and then the refrigerant flows from the water inlet manifold 32 through the first connecting pipe 9 into the water inlet pipe 31, and finally from the water inlet pipe 31 through the third connecting pipe 11 and flows from the water inlet 201 into the computing node 200 for heat exchange.
[0125] In summary, it should be noted that if a diverter disk 8 is provided in the heat dissipation device 100, the water inlet manifold 32 and the water outlet manifold 42 can be connected to the diverter disk 8 and / or the cold distribution unit 2; if the heat dissipation device 100 is not provided with a diverter disk 8, the water inlet manifold 32 and the water outlet manifold 42 are connected to the cold distribution unit 2.
[0126] In any embodiment of the present application, the cabinet 1 is provided with a plurality of installation positions, and each installation position is provided with a water inlet pipe 31 and / or a water outlet pipe 41. Figure 1 and Figure 2As shown, there are three installation positions, namely the first position P1, the second position P2 and the third position P3. When the water inlet 201 of the computing node 200 is located at the first position P1 and the water outlet 202 of the computing node 200 is located at the first position P1, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the first position P1, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the first position P1; when the water inlet 201 of the computing node 200 is located at the first position P1 and the water outlet 202 of the computing node 200 is located at the first position P1, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the first position P1, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the first position P1; When the computing node 200 is located at the second position P2, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the first position P1, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the second position P2; when the water inlet 201 of the computing node 200 is located at the first position P1 and the water outlet 202 of the computing node 200 is located at the third position P3, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the first position P1, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the third position P3;
[0127] When the water inlet 201 of the computing node 200 is located at the second position P2 and the water outlet 202 of the computing node 200 is located at the first position P1, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the second position P2, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the first position P1; when the water inlet 201 of the computing node 200 is located at the second position P2 and the water outlet 202 of the computing node 200 is located at the second position P2, the computing node 200 The water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the second position P2, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the second position P2; when the water inlet 201 of the computing node 200 is located at the second position P2 and the water outlet 202 of the computing node 200 is located at the third position P3, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the second position P2, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the third position P3;
[0128] When the water inlet 201 of the computing node 200 is located at the third position P3 and the water outlet 202 of the computing node 200 is located at the first position P1, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the third position P3, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the first position P1; when the water inlet 201 of the computing node 200 is located at the third position P3 and the water outlet 202 of the computing node 200 is located at the second position P2, the computing node 200 The water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the third position P3, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the second position P2; when the water inlet 201 of the computing node 200 is located at the third position P3 and the water outlet 202 of the computing node 200 is located at the third position P3, the water inlet 201 of the computing node 200 is connected to the water inlet pipe 31 in the third position P3, and the water outlet 202 of the computing node 200 is connected to the water outlet pipe 41 in the third position P3.
[0129] In this way, the positions of the water inlet pipe 31 and the water outlet pipe 41 can be adjusted to connect to different computing nodes 200, thereby improving the flexibility and adaptability of the heat dissipation device 100 and enhancing the stability of the heat dissipation device 100. In addition, according to actual needs, the number of water inlet pipes and the number of water outlet pipes 41 can be unequal, that is, the number of water inlet pipes can be less than the number of water outlet pipes 41, or the number of water inlet pipes can be more than the number of water outlet pipes 41. Moreover, according to actual needs, the positions of the water inlet pipes and the water outlet pipes 41 can be arranged to accommodate more improved computing nodes 200. The number of installation positions is not limited to this, and can be one installation position, two installation positions, three installation positions, four installation positions, etc.
[0130] The server according to the embodiment of the second aspect of the present application includes the heat dissipation device 100 according to the embodiment of the first aspect of the present application.
[0131] According to the server of the embodiment of the present application, by setting the heat dissipation device 100 of the embodiment of the first aspect of the present application, it has the same technical effect, that is, by setting the water inlet component 3 and the water outlet component 4 that can be connected and communicated with the water inlet 201 and the water outlet 202 of different computing nodes 200, even if the computing node 200 is constantly improved, the heat dissipation device 100 can adapt to the computing node 200 without making any adjustments, thereby reducing the design cost and production cost of the device, reducing resource consumption, ensuring that the heat dissipation device 100 can be compatible with more computing nodes 200, and improving the flexibility and reliability of the heat dissipation device 100.
[0132] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.
Claims
1. A heat dissipation device (100), characterized in that: The heat dissipation device (100) is used to dissipate heat from the computing node (200), and the heat dissipation device (100) comprises: A cabinet (1), wherein the computing nodes (200) are arranged in the cabinet (1), and each computing node (200) has a water inlet (201) and a water outlet (202); A cold distribution unit (2), the cold distribution unit (2) being arranged in the cabinet (1); A water inlet assembly (3), the water inlet assembly (3) being provided on the cabinet (1), the water inlet assembly (3) being connected between the cooling distribution unit (2) and each of the computing nodes (200), the water inlet assembly (3) comprising a plurality of water inlet pipes (31), the plurality of water inlet pipes (31) all extending in a vertical direction and arranged at intervals in a first direction, the water inlet (201) of each of the computing nodes (200) being in communication with at least one of the plurality of water inlet pipes (31); A water outlet assembly (4), the water outlet assembly (4) being provided on the cabinet (1), the water outlet assembly (4) being connected between the cooling distribution unit (2) and each of the computing nodes (200), the water outlet assembly (4) comprising a plurality of water outlet pipes (41), the plurality of water outlet pipes (41) all extending in a vertical direction and arranged at intervals in a first direction, the water outlet (202) of each of the computing nodes (200) being in communication with at least one of the plurality of water outlet pipes (41); An adjusting member (7) is provided between each water inlet pipe (31) and the corresponding water outlet pipe (41), and the adjusting member (7) is used to adjust the distance between the water inlet pipe (31) and the corresponding water outlet pipe (41).
2. The heat dissipation device (100) according to claim 1, characterized in that: The plurality of water inlet pipes (31) and the plurality of water outlet pipes (41) are arranged in one-to-one correspondence, and each water inlet pipe (31) and the corresponding water outlet pipe (41) are arranged adjacent to each other to form a group.
3. The heat dissipation device (100) according to claim 2, characterized in that: The cabinet (1) is provided with a truss (5), and the truss (5) is provided with a plurality of adjustment parts. The upper end of each water inlet pipe (31) and the upper end of the corresponding water outlet pipe (41) are connected to the corresponding adjustment part.
4. The heat dissipation device (100) according to claim 3, characterized in that: Each of the adjustment portions is formed as an adjustment hole (51), and a fixing rod (6) is provided between each of the water inlet pipes (31) and the cabinet (1), and between each of the water outlet pipes (41) and the cabinet (1). The fixing rod (6) extends in a second direction perpendicular to the first direction and passes through the adjustment hole (51), and the position of the fixing rod (6) in the adjustment hole (51) along the first direction is adjustable.
5. The heat dissipation device (100) according to claim 4, characterized in that: The regulating member (7) is formed with two regulating grooves (73) arranged in opposite directions. The two regulating grooves (73) are respectively provided with one water inlet pipe (31) and the corresponding water outlet pipe (41). The distance between the two regulating grooves (73) is adjustable.
6. The heat dissipation device (100) according to claim 5, characterized in that: The adjusting member (7) comprises an adjusting seat (71) and two adjusting blocks (72), the two adjusting blocks (72) being respectively arranged on both sides of the adjusting seat (71) in a first direction, each adjusting block (72) being formed with an adjusting slot (73), each adjusting block (72) being formed with a first adjusting portion and a second adjusting portion on the adjusting seat (71), and the distance between each adjusting block (72) and the adjusting seat (71) being adjusted by the cooperation of the first adjusting portion and the second adjusting portion.
7. The heat dissipation device (100) according to claim 6, characterized in that: Also includes: A diverter plate (8), the diverter plate (8) is arranged on the cabinet (1), and the diverter plate (8) is connected to the cold distribution unit (2).
8. The heat dissipation device (100) according to claim 7, characterized in that: The water inlet assembly (3) comprises: a water inlet manifold (32), the water inlet manifold (32) being connected between the cold distribution unit (2) and each of the water inlet pipes (31), each of the water inlet pipes (31) being in communication with the water inlet manifold (32), and the water inlet manifold (32) being in communication with the cold distribution unit (2) and / or the diverter plate (8).
9. The heat dissipation device (100) according to claim 8, characterized in that: A first connecting pipe (9) is connected between the water inlet manifold (32) and each of the water inlet pipes (31), and a second connecting pipe (10) is connected between the water inlet manifold (32) and the cold distribution unit (2) and / or the diverter plate (8).
10. The heat dissipation device (100) according to claim 7, characterized in that: The water outlet assembly (4) comprises: a water outlet manifold (42), the water outlet manifold (42) being connected between the cold distribution unit (2) and each of the water outlet pipes (41), each of the water outlet pipes (41) being in communication with the water outlet manifold (42), and the water outlet manifold (42) being in communication with the cold distribution unit (2) and / or the diverter plate (8).
11. The heat dissipation device (100) according to claim 10, characterized in that: A first connecting pipe (9) is connected between the water outlet manifold (42) and each of the water outlet pipes (41), and a second connecting pipe (10) is connected between the water outlet manifold (42) and the cold distribution unit (2) and / or the diverter plate (8).
12. The heat dissipation device (100) according to claim 1, characterized in that A third connecting pipe (11) is connected between the water inlet pipe (31) and the water inlet (201) of the computing node (200), and between the water outlet pipe (41) and the water outlet (202) of the computing node (200).
13. The heat dissipation device (100) according to any one of claims 1 to 12, characterized in that: The cabinet (1) is provided with a plurality of installation positions, and each installation position is provided with a water inlet pipe (31) and / or a water outlet pipe (41).
14. A server, characterized in that: The heat dissipation device (100) comprises any one of claims 1 to 13.
Citation Information
Patent Citations
Decoupling type data center cabinet and data center
CN117939839A
Decoupling type data center cabinet and data center
CN221807379U