Electrostatic chuck, power connection device, and semiconductor processing chamber

Abstract

The application provides an electrostatic elimination device, a power connection device and a semiconductor processing chamber. The electrostatic elimination device comprises a space part, which is arranged on an upper cover of the semiconductor processing chamber, and is formed with a first space for accommodating at least a part of a power connection block and a second space in communication with the first space and located above or on the side of the first space; a contact part movably arranged in the second space and grounded; and a stop part arranged on a main body of the semiconductor processing chamber. When the upper cover is opened, the contact part is located on one side of the second space close to the first space. When the upper cover is closed, the contact part is pushed from one side of the second space close to the first space to the other side of the second space away from the first space by the stop part with the space part as a reference.

Description

TECHNICAL FIELD

[0001] The present application relates to a kind of electric device, power connection device and semiconductor processing chamber, specifically, the electric device of target material can be automatically de-energized at appropriate time, power connection device and semiconductor processing chamber. BACKGROUND

[0002] With the development of science and technology, various electrical appliances have been applied to all aspects of production and life, providing great convenience. However, at the same time, there are also potential safety hazards, for example, when there is a risk of fire or electric shock when there is a risk of fire or electric shock. In order to avoid these accidents, grounding is usually used to guide the leaked current or excess charge to the ground.

[0003] The field of semiconductor processing is no exception. For example, in a physical vapor deposition chamber that uses sputtering to deposit a thin film on a substrate, when there is a risk of fire or electric shock, not only is it dangerous, but the excess charge accumulated in various parts of the chamber will form a pressure difference, which will have an adverse effect on the deposition of the thin film. Therefore, the housing must be grounded, and preferably the ground wire is firmly fixed to the housing using screws to ensure that the housing is always grounded.

[0004] In addition to the housing, some devices inside the chamber also need to be grounded, such as the target material. However, the reasons, purposes and methods of target material grounding have their own particularities, as follows.

[0005] The target material is usually installed on the upper cover of the chamber, and when the upper cover of the chamber is closed, the target material faces the process space inside the main body of the chamber. When argon gas is input into the vacuumized process space and the target material is connected to the cathode of the power supply, the electrons ionized from the argon atoms will bombard the target material, causing the material on the target material to sputter onto the substrate loaded in the process space, thereby forming a thin film. In this process, the target material will accumulate electric charge, and even after the power is turned off after the sputtering is completed, there will still be electric charge remaining on the target material.

[0006] Therefore, when workers need to inspect or replace the target material, the target material should be de-energized in advance to prevent the electric charge remaining on the target material from causing electric shock. Usually, the worker will first open the upper cover to expose the target material, and then manually connect a ground wire to the target material or the power connection block used to connect the target material to the power supply to drain the excess charge to the ground, thereby de-energizing the target material.

[0007] Although this method is direct and effective, it is cumbersome and dangerous to operate, and there is a risk of de-energization failure due to human error. On the other hand, as a consumable, the target material needs to be replaced frequently, and if this method is used to de-energize the target material each time, the replacement efficiency and safety will be greatly reduced.

[0008] Therefore, there is a need for a more efficient and safe method of removing the static electricity from the target material. SUMMARY

[0009] TECHNICAL PROBLEM

[0010] The present application aims to provide a static electricity removing device that selectively removes static electricity from a target material disposed in a semiconductor processing chamber according to the opening or closing of an upper cover of the semiconductor processing chamber.

[0011] Another object of the present application is to provide a power connection device comprising the static electricity removing device.

[0012] Another object of the present application is to provide a semiconductor processing chamber comprising the power connection device.

[0013] TECHNICAL SOLUTION

[0014] The present application provides a static electricity removing device for removing static electricity from a target material disposed in a semiconductor processing chamber, comprising: a space portion disposed in an upper cover of the semiconductor processing chamber, forming a first space for accommodating at least a portion of a power connection block connecting the target material and a power source, and a second space communicating with the first space and located above or aside the first space; a contact portion movably disposed in the second space and grounded; and a stop portion disposed in a main body of the semiconductor processing chamber, when the upper cover is opened, the contact portion is located at a side of the second space close to the first space, thereby contacting the power connection block disposed in the first space, when the upper cover is closed, the contact portion is pushed by the stop portion from the side of the second space close to the first space to the other side of the second space away from the first space, thereby separating from the power connection block disposed in the first space.

[0015] According to one embodiment, a spring is disposed at the other side of the second space away from the first space to apply a pushing force to the contact portion towards the first space.

[0016] According to one embodiment, the space portion forms a guide hole at the side of the second space away from the first space, and a protruding guide rod is formed at a surface of the contact portion away from the first space, the guide rod is inserted into the guide hole to guide the movement of the contact portion.

[0017] According to one embodiment, a stepped portion is disposed at an outer end of the guide hole, and a radially protruding boss portion is disposed at a top end of the guide rod, the boss portion is latched in the stepped portion to limit the contact portion in the second space.

[0018] According to one embodiment, a spring washer is provided between the first space and the second space.

[0019] According to one embodiment, an insulating portion is further provided on at least a portion of the outer surface of the stop portion.

[0020] According to one embodiment, when the second space is located at the side of the first space, the lower surface of the contact portion includes an inclined surface that is inclined downwardly away from the first space, for contacting the stop portion when the upper cover is closed.

[0021] The present application provides a power connection device, comprising: the above-described electric discharge device for discharging a target provided in a semiconductor processing chamber; and a power connection block provided on an upper cover of the semiconductor processing chamber and at least partially provided in a first space of a space portion of the electric discharge device, for connecting the target and a power source.

[0022] According to one embodiment, when the second space of the space portion is located above the first space, a through hole is formed in the portion of the power connection block located in the first space, the through hole is aligned with and capable of accommodating the stop portion of the electric discharge device.

[0023] The present application provides a semiconductor processing chamber provided with the above-described power connection device.

[0024] Advantages

[0025] The electric discharge device of the present application can selectively discharge a target provided in a semiconductor processing chamber according to the opening or closing of an upper cover of the semiconductor processing chamber.

[0026] The power connection device of the present application includes the electric discharge device of the present application, and thus can selectively discharge a target provided in a semiconductor processing chamber according to the opening or closing of an upper cover of the semiconductor processing chamber.

[0027] The semiconductor processing chamber of the present application includes the power connection device of the present application, and thus can selectively discharge a target provided in a semiconductor processing chamber according to the opening or closing of an upper cover of the semiconductor processing chamber. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 is a schematic view of an electric discharge device of one embodiment of the present application in combination with an upper cover, a main body, and a power connection block of a semiconductor processing chamber.

[0029] Figure 2 is a schematic view of an electric discharge device of one embodiment of the present application in combination with an upper cover, a main body, and a power connection block of a semiconductor processing chamber.Figure 1 Left view shown in enlarged detail in the A region in (b).

[0030] Figure 3 (a) and (b) in (b) are schematic diagrams showing a state when an upper cover of a semiconductor processing chamber is opened and a state when the upper cover is closed, respectively, of an electrostatic eliminating device according to one embodiment of the present application.

[0031] Figure 4 is a schematic diagram showing a power supply connecting device according to another embodiment of the present application in combination with an upper cover and a main body of a semiconductor processing chamber. Figure 1 Left view shown in enlarged detail in the A region in (b).

[0032] Figure 5 (a) and (b) in (b) are schematic diagrams showing a state when an upper cover of a semiconductor processing chamber is opened and a state when the upper cover is closed, respectively, of an electrostatic eliminating device according to another embodiment of the present application.

[0033] Figure 6 is a schematic diagram showing a power supply connecting device according to one embodiment of the present application in combination with an upper cover and a main body of a semiconductor processing chamber.

[0034] Figure 7 (a) and (b) in (b) are schematic diagrams showing a state when an upper cover of a semiconductor processing chamber is opened and a state when the upper cover is closed, respectively, of a power supply connecting device according to one embodiment of the present application.

[0035] Reference Signs

[0036] 1: Electrostatic eliminating device

[0037] 1a: Upper half

[0038] 1b: Lower half

[0039] 11: Space portion

[0040] 11a: First space

[0041] 11b: Second space

[0042] 12: Contact portion

[0043] 12a: Inclined surface

[0044] 13: Stop portion

[0045] 13a: Insulating portion

[0046] 14: Spring

[0047] 15: Guide hole

[0048] 15a: Step portion

[0049] 16: Guide rod

[0050] 16a: boss portion

[0051] 2: power connection device

[0052] 21: power connection block

[0053] 21a: through hole

[0054] 3: semiconductor processing chamber

[0055] 31: upper cover

[0056] 32: main body

[0057] 4: target material DETAILED DESCRIPTION

[0058] Hereinafter, one or more embodiments of the present application will be described in detail with reference to the accompanying drawings. Obviously, the one or more embodiments are merely a part of embodiments of the present application and do not represent all embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative effort belong to the scope of the present application.

[0059] The terms used in the following detailed description of the embodiments of the present application are merely used to explain or illustrate the particular embodiments of the present application and are not intended to limit the scope of the present application. In addition, the singular forms "a," "an," and "the" used in the present application are intended to include the plural forms, unless the context clearly indicates otherwise. It will be further understood that the terms "one or more," "at least one," "one or more than one," and the like used in the detailed description of the embodiments of the present application are intended to mean one, two, three, or more than three.

[0060] In addition, the terms "in one embodiment," "in some embodiments," "in one or more embodiments," and the like used in the specification of the present application are intended to mean that a particular technical feature described in connection with the embodiment can be included in more than one embodiment of the present application. Accordingly, the "in one embodiment," "in some embodiments," "in one or more embodiments" appearing in different places in the specification do not necessarily refer to the same embodiment, but can refer to the same embodiment or different embodiments, unless the particular technical features described in connection with the embodiments cannot be used independently or in combination.

[0061] In addition, when an element is described as "including", "comprising", "having", "containing", "providing", "consisting of", "consisting essentially of", or "formed by" another element, it should be understood that, in the description of such an element, the word "including" or "comprising" or "having" or "containing" or "providing" or "consisting of" or "consisting essentially of" or "formed by" indicates an open-ended inclusion or description of also including other elements not specified in the "including", "comprising", "having", "containing", "providing", "consisting of", "consisting essentially of", or "formed by" element. However, it should be noted that the term "formed by" is not intended to be an open-ended inclusion or description of also including other elements not specified in the "formed by" element, but rather, the term "formed by" is intended to mean that the other element forms a part of the "formed by" element.

[0062] It should be understood that, when using the ordinal terms "first", "second", and the like in the description of various elements, these ordinal terms are used only to distinguish one element from another, and should not be construed as indicating a primary or secondary relationship, a chronological or chronological order, or the like. Within the scope of the present application, a first element can be designated as a second element, and a second element can be designated as a first element.

[0063] In the present application, when the terms "on", "under", "between", and the like are used to describe the positional relationship of two or more elements, it means that one or more other elements can be provided between the two or more elements, unless the terms "just", "adjacent" and the like are used.

[0064] Hereinafter, one or more embodiments of the present application will be described in detail with reference to the accompanying drawings so that those skilled in the art can clearly and completely understand the present application. When the description of well-known structures or features is deemed to unnecessarily obscure the essence of the present application, the description of such well-known structures or features will be omitted.

[0065] The present application provides a device for removing electricity, a power connection device, and a semiconductor processing chamber. The device for removing electricity of the present application can selectively remove electricity from a target material provided in the semiconductor processing chamber according to the opening or closing of an upper cover of the semiconductor processing chamber. Specifically, the device for removing electricity can ground the target material to remove electricity from the target material when the upper cover is opened, and can unground the target material to stop removing electricity from the target material when the upper cover is closed.

[0066] Hereinafter, the device for removing electricity of the present application will be described in detail.

[0067] Figure 1 is a schematic view of a device for removing electricity according to an embodiment of the present application, in combination with an upper cover, a main body, and a power connection block of a semiconductor processing chamber.

[0068] AsFigure 1 As shown, the target 4 and the power connection block 21 connecting the target 4 to a power source (not shown) are disposed on the upper cover 31 of the semiconductor processing chamber 3. The static elimination device 1 of the present invention can be disposed in the semiconductor processing chamber 3 adjacent to the power connection block 21. Specifically, the static elimination device 1 may include an upper portion 1a disposed on the upper cover 31 of the semiconductor processing chamber 3 and a lower portion 1b disposed on the main body 32 of the semiconductor processing chamber 3. When the upper cover 31 is opened, the upper portion 1a and the lower portion 1b are separated from each other, thereby grounding the power connection block 21 to eliminate static electricity from the target 4. When the upper cover 31 is closed, the upper portion 1a and the lower portion 1b are coupled to each other, thereby releasing the grounding of the power connection block 21 and stopping the static elimination of the target 4.

[0069] Figure 2 According to one embodiment of the present invention, Figure 1 The left side view is shown with details in the A area in FIG. In order to more clearly show the static elimination device 1, Figure 2 The power connection block 21 is omitted.

[0070] like Figure 2 As shown, the static elimination device 1 may include a space portion 11. The space portion 11 may be provided on the upper cover 31 of the semiconductor processing chamber 3, and may be formed with a first space 11a and a second space 11b connected to the first space 11a. For ease of distinction, the dividing line between the first space 11a and the second space 11b is marked with a dotted line. The first space 11a is used to accommodate at least a portion of the power connection block 21, that is, the first space 11a may partially overlap with the position of the upper cover 31 for setting the power connection block 21. The space portion 11 may be formed by a separate shell and be provided on the upper cover 31 in a manner of combining the shell with the upper cover 31, or it may be directly formed by opening a prescribed space on the upper cover 31.

[0071] Figure 2The second space 11b is shown as being located above the first space 11a, but the present application is not limited thereto, and the second space 11b can also be located beside the first space 11a, and as long as the space portion 11 when the second space 11b is located above the first space 11a and each component arranged in the space portion 11 described later are horizontally laid down in their entirety, the space portion 11 when the second space 11b is located beside the first space 11a and each component arranged in the space portion 11 described later can be obtained. Therefore, the present application will be described below with reference to the case where the second space 11b is located above the first space 11a, and the case where the second space 11b is located beside the first space 11a will not be described repeatedly.

[0072] In addition, the electrostatic elimination device 1 can further include a contact portion 12 movably arranged in the second space 11b to approach or move away from the first space 11a according to the opening or closing of the upper cover 31. In addition, the contact portion 12 can be grounded, for example, can be separately connected to a ground wire (not shown), thereby constituting a movable ground terminal to selectively ground the power supply connecting block 21, so as to eliminate the electrostatic of the target material 4 at a proper time.

[0073] In addition, the electrostatic elimination device 1 can further include a stop portion 13 provided on the main body 32 of the semiconductor processing chamber 3 for adjusting the relative position of the contact portion 12 in the second space 11b, so as to selectively approach or move away from the first space 11a by the contact portion 12, thereby selectively contacting or separating the contact portion 12 and the power supply connecting block 21. The stop portion 13 can be formed as a rod extending in the up-down direction as shown in Figure 2 The present application is not limited thereto, and the stop portion 13 can be formed in a required shape and size according to the shape, size, etc. of the space portion 11 and the contact portion 12, and a person skilled in the art can make a proper selection according to actual needs.

[0074] At this time, the space portion 11 and the contact portion 12 constitute the main part of the upper half portion 1a shown in Figure 1 , and the stop portion 13 constitutes the main part of the lower half portion 1b shown in Figure 1 .

[0075] Although not shown, in order to stably match the stop portion 13 and the contact portion 12 with each other, the contact surfaces of the contact portion 12 and the stop portion 13 can be formed in a matching shape, for example, a protrusion and a groove, etc., or a groove matching the profile shape of the upper surface of the stop portion 13 is formed on the lower surface of the contact portion 12, etc.

[0076] Figure 3 Fig. 1 is a schematic view showing the state of the de-electrization device according to an embodiment of the present application when the upper cover is opened.

[0077] As shown in Fig. 1(a), when the upper cover 31 is opened, the contact portion 12 is located at the side of the second space 11b close to the first space 11a, so as to contact the power supply connecting block 21 arranged in the first space 11a, thereby grounding the target material 4 and de-electrizing the target material 4. Figure 3 As shown in Fig. 1(b), when the upper cover 31 is closed, the contact portion 12 is pushed by the stop portion 13 from the side of the second space 11b close to the first space 11a to the side of the second space 11b away from the first space 11a, so as to be separated from the power supply connecting block 21 arranged in the first space 11a, thereby ungrounding the target material 4 and stopping de-electrizing the target material 4.

[0078] Figure 3 As shown in Fig. 1(b), when the upper cover 31 is closed, the contact portion 12 is pushed by the stop portion 13 from the side of the second space 11b close to the first space 11a to the side of the second space 11b away from the first space 11a, so as to be separated from the power supply connecting block 21 arranged in the first space 11a, thereby ungrounding the target material 4 and stopping de-electrizing the target material 4.

[0079] Therefore, according to the present application, when it is necessary to check or replace the target material 4, only one action of opening the upper cover 31 is needed to automatically de-electrize the target material 4, without the need to first open the upper cover 31 to expose the target material 4 and then manually temporarily connect a grounding wire to the target material 4 or the power supply connecting block 21 for connecting the target material 4 and the power supply. That is, the present application provides a novel, efficient and safe de-electrization solution for the target material.

[0080] Further, as shown in Fig. 1(b), as a preferred embodiment, a spring 14 can be further arranged at the side of the second space 11b away from the first space 11a, so as to apply a pushing force to the contact portion 12 towards the first space 11a. Figure 2 Referring again to Fig. 1(a), when the upper cover 31 is opened, the pushing force applied by the spring 14 to the contact portion 12 can ensure that the contact portion 12 tightly contacts the power supply connecting block 21, so as to avoid the contact portion 12 from being separated from the power supply connecting block 21, thereby ensuring the stability and reliability of the de-electrization operation for the target material 4.

[0081] Figure 3 Referring again to Fig. 1(b), when the upper cover 31 is closed, the pushing force applied by the spring 14 to the contact portion 12 can ensure that the contact portion 12 tightly contacts the power supply connecting block 21, so as to avoid the contact portion 12 from being separated from the power supply connecting block 21, thereby ensuring the stability and reliability of the de-electrization operation for the target material 4.

[0082] Referring again to Fig. 1(b), when the upper cover 31 is closed, the pushing force applied by the spring 14 to the contact portion 12 can ensure that the contact portion 12 tightly contacts the power supply connecting block 21, so as to avoid the contact portion 12 from being separated from the power supply connecting block 21, thereby ensuring the stability and reliability of the de-electrization operation for the target material 4. Figure 3 ​​(b) of FIG. 1, when the upper cover 31 is closed, the spring 14 can absorb the impact generated when the contact portion 12 contacts the stop portion 13, so as to avoid damage to the contact portion 12 and the stop portion 13, and meanwhile, the pushing force applied by the spring 14 to the contact portion 12 can stably fix the contact portion 12 on the stop portion 13, so as to avoid disengagement of the contact portion 12 from the stop portion 13.

[0083] As another preferred embodiment, as shown in Figure 2 FIG. 1, the space portion 11 can further be formed with a guide hole 15 on the side of the second space 11b away from the first space 11a, and meanwhile, a protruding guide rod 16 can be further formed on the surface of the contact portion 12 away from the first space 11a. The guide rod 16 can be aligned with and inserted into the guide hole 15, so as to guide the movement of the contact portion 12. Further, a stepped portion 15a can be arranged on the outer side end of the guide hole 15, and meanwhile, a radially protruding boss portion 16a can be arranged on the top end of the guide rod 16. The boss portion 16a can be latched in the stepped portion 15a, so as to limit the contact portion 12 within the second space 11b.

[0084] Referring again to Figure 3 (a) of FIG. 1, when the upper cover 31 is opened, the guide hole 15 and the guide rod 16 cooperate with each other, so as to ensure that the contact portion 12 stably moves towards the power supply connecting block 21, so as to avoid that the contact portion 12 cannot contact the power supply connecting block 21 due to deviation of the moving direction, or is damaged due to collision with the inner wall of the space portion 11. When the contact portion 12 contacts the power supply connecting block 21, the boss portion 16a is also latched in the stepped portion 15a, so as to limit the contact portion 12 from further moving towards the first space 11a, thereby preventing damage to the contact portion 12 and the power supply connecting block 21 due to excessive application of the gravity of the contact portion 12 or the pushing force of the spring 14 to the contact surface between the contact portion 12 and the power supply connecting block 21.

[0085] Referring again to Figure 3 (b) of FIG. 1, when the upper cover 31 is closed, the guide hole 15 and the guide rod 16 cooperate with each other, so as to ensure that the contact portion 12 stably moves away from the power supply connecting block 21, so as to avoid that the contact portion 12 is damaged due to collision with the inner wall of the space portion 11 due to deviation of the moving direction.

[0086] As another preferred embodiment, although not shown, a spring washer can be provided between the first space 11a and the second space 11b, for example, the spring washer can be arranged on the surface of the power connection block 21 close to the second space 11b, so that the contact portion 12 can be in closer contact with the power connection block 21, thereby ensuring the stability and reliability of the de-electrification operation on the target material 4, and at the same time, when the contact portion 12 is in contact with the power connection block 21, the spring washer can play a buffering role between the contact portion 12 and the power connection block 21, so as to prevent the contact portion 12 and the power connection block 21 from being damaged by colliding with each other.

[0087] As another preferred embodiment, as shown in Figure 2 , the de-electrification device 1 can further include an insulating portion 13a, which can be arranged on at least a portion of the outer surface of the stop portion 13, so as to avoid the interference of the de-electrification operation on the target material 4 and the like caused by the conductive stop portion 13. For example, the insulating portion 13a can be arranged on the lower portion of the stop portion 13, so as to insulate the stop portion 13 from the main body 32. Although not shown, the insulating portion 13a can be arranged on the side surface of the stop portion 13, so as to further separate the stop portion 13 from the power connection block 21 while ensuring the insulation of the stop portion 13 from the power connection block 21. In addition, although not shown, the insulating portion 13a can be arranged on the upper portion of the stop portion 13, so as to insulate the stop portion 13 from the contact portion 12. In this way, it can be avoided that the charge possibly carried by the main body 32 is conducted to the target material 4 through the stop portion 13 when the upper cover 31 is closed or when the contact portion 12 simultaneously contacts the stop portion 13 and the power connection block 21, thereby affecting the effect of the de-electrification operation.

[0088] The material of the insulating portion 13a can be selected from the commonly used insulating materials in the art (for example, rubber, plastic, etc.), and the shape and size of the insulating portion 13a can be appropriately selected according to actual needs. In addition, the stop portion 13 itself can also be made of an insulating material.

[0089] The above describes the de-electrification device according to the present application based on the case where the second space is located above the first space. Hereinafter, a preferred embodiment that can be implemented only in the case where the second space is located beside the first space is described.

[0090] Figure 4 is a left view showing the details in the A area in Figure 1 enlarged according to another embodiment of the present application. In order to more clearly show the de-electrification device 1, the power connection block 21 is omitted in Figure 4 ​

[0091] As Figure 4 shown in (a) and (b) of FIG. 11, when the second space 11b is located at the side of the first space 11a, the lower surface of the contact portion 12 can include an inclined surface 12a inclined in a manner gradually away from the first space 11a from top to bottom for contacting the stop portion 13 when the upper cover 31 is closed. Thus, when the upper cover 31 is closed, the inclined surface 12a and the upper surface of the stop portion 13 are matched with each other, and the contact portion 12 can be moved in a direction away from the power connection block 21.

[0092] Figure 5 (a) and (b) of FIG. 11 are schematic views respectively showing the state of the de-electrization device according to another embodiment of the present application when the upper cover of the semiconductor processing chamber is opened and closed.

[0093] As Figure 5 shown in (a) of FIG. 11, when the upper cover 31 is opened, the contact portion 12 abuts on the power connection block 21, thereby grounding the target material 4, and thus de-electrizing the target material 4.

[0094] As Figure 5 shown in (b) of FIG. 11, when the upper cover 31 is closed, the stop portion 13 pushes the contact portion 12 away from the power connection block 21, thereby ungrounding the target material 4, and thus stopping de-electrizing the target material 4.

[0095] Although not shown, as a preferred embodiment, the upper surface of the stop portion 13 can be formed to have the same inclination as the inclined surface 12a, so that the inclined surface 12a and the upper surface of the stop portion 13 are matched with each other, thereby making the contact portion 12 more stably and smoothly pushed by the stop portion 13, and meanwhile, increasing the area of contact between the contact portion 12 and the stop portion 13, thereby reducing the abrasion of the inclined surface 12a and the upper surface of the stop portion 13.

[0096] Although not shown, as another preferred embodiment, a ball, a roller or a cylinder or the like can be arranged on the upper surface of the stop portion 13, so that the contact portion 12 is more stably and smoothly pushed by the stop portion 13.

[0097] The above describes the destaticizer of the present application in detail by way of example of the contact portion moving in a manner of overall translation, but the present application is not limited to this, and the contact portion can also be a structure in which one end is fixed and the other end rotates about the one end, and the other end can be pushed by the stop portion so as to approach or move away from the first space as the upper cover is opened or closed, and the guide hole (a round hole, a square hole, a long hole, etc. can be appropriately selected), the guide rod (a straight shape or a curved shape, etc. can be appropriately selected), the spring, the spring washer, the insulating portion, etc. can also be applied to this destaticizer in the same manner, and thus repeated descriptions are omitted here.

[0098] The power connection device of the present application is described in detail below, but repeated descriptions of the destaticizer of the present application described above are omitted.

[0099] Figure 6 is a schematic view of a power connection device of one embodiment of the present application shown in combination with an upper cover and a main body of a semiconductor processing chamber.

[0100] As shown in Figure 6 , the power connection device 2 can include the destaticizer 1 of the present application for destaticizing a target material 4 disposed in a semiconductor processing chamber 3, and a power connection block 21 disposed on an upper cover 31 of the semiconductor processing chamber 3 and at least a portion of which is disposed in the first space 11a of the space portion 11 of the destaticizer 1 for connecting the target material 4 and a power source.

[0101] The power connection block 21 can be a commonly used power connection block in the art, and the present application is not limited to this.

[0102] As a preferred embodiment, when the second space 11b of the space portion 11 is located above the first space 11a, a through hole 21a can be formed in the portion of the power connection block 21 located in the first space 11a. Specifically, the through hole 21a can be aligned with the stop portion 13 of the destaticizer 1, and the through hole 21a can accommodate the stop portion 13, so that the contact portion 12 of the destaticizer 1, the power connection block 21, and the stop portion 13 of the destaticizer 1 can be stacked in a height direction from top to bottom, so that the structure of the power connection device 2 is more compact.

[0103] Figure 7 (a) and (b) in

[0104] As shown in Figure 7As shown in (a) , when the upper cover 31 is opened, the contact portion 12 abuts against the power connection block 21 , thereby grounding the target 4 and eliminating static electricity from the target 4 .

[0105] like Figure 7 As shown in (b), when the upper cover 31 is closed, the stopper 13 passes through the through hole 21a and pushes the contact portion 12 away from the power connection block 21, thereby releasing the grounding of the target material 4 and stopping the de-electrification of the target material 4.

[0106] Hereinafter, the semiconductor processing chamber of the present invention will be described, but the description overlapping with the static eliminating device and the power supply connecting device of the present invention described above will be omitted.

[0107] The semiconductor processing chamber of the present invention may include the power connection device 2 of the present invention.

[0108] Although not shown, the semiconductor processing chamber may be a physical vapor deposition chamber.

[0109] The above description of the embodiments of the present invention is intended only to facilitate a comprehensive understanding of the present invention and is not limited thereto. Those skilled in the art will be able to make various modifications and variations based on these descriptions. Therefore, the technical concept of the present invention is not limited to the above-described embodiments; the appended claims and their equivalents or equivalent variations all fall within the scope of the present invention.

Claims

1. A device for de-electrifying a target disposed in a semiconductor processing chamber, comprising: The device comprises: a space portion provided on an upper cover of the semiconductor processing chamber, and forming a first space for accommodating at least a part of a power supply connecting block connecting the target and a power supply, and a second space in communication with the first space and located above or aside the first space; a contact portion movably arranged in the second space and grounded; and a stop portion provided on a main body of the semiconductor processing chamber, when the upper cover is opened, the contact portion is located at a side of the second space close to the first space, thereby contacting the power supply connecting block arranged in the first space, when the upper cover is closed, the contact portion is pushed by the stop portion from the side of the second space close to the first space to another side of the second space away from the first space, thereby separating from the power supply connecting block arranged in the first space.

2. The device according to claim 1, wherein a spring is arranged at the other side of the second space away from the first space, to apply a pushing force to the contact portion towards the first space.

3. The device according to claim 1, wherein the space portion forms a guide hole at the other side of the second space away from the first space, and the contact portion forms a protruding guide rod at a surface thereof away from the first space, the guide rod is inserted into the guide hole to guide the movement of the contact portion.

4. The device according to claim 3, wherein a step portion is provided at an outer end of the guide hole, and a radially protruding boss portion is provided at a top end of the guide rod, the boss portion is latched in the step portion to limit the contact portion in the second space.

5. The device according to claim 1, wherein a spring washer is arranged between the first space and the second space.

6. The device according to claim 1, further comprising an insulation portion arranged on at least a part of an outer surface of the stop portion.

7. The device according to claim 1, wherein when the second space is located aside the first space, a lower surface of the contact portion comprises an inclined surface inclined from top to bottom away from the first space, for contacting the stop portion when the upper cover is closed. The device comprises:

8. A power connection device, characterized by the device for de-electrifying a target arranged in a semiconductor processing chamber according to any one of claims 1 to 7; and a power supply connecting block arranged on an upper cover of the semiconductor processing chamber, and at least a part of which is arranged in the first space of the space portion of the de-electrifying device, for connecting the target and a power supply.

9. The device according to claim 8, wherein when the second space of the space portion is located above the first space, a through hole is formed in the part of the power supply connecting block located in the first space, the through hole is aligned with the stop portion of the de-electrifying device, and can accommodate the stop portion. ​ ​ 10. A semiconductor processing chamber, comprising: configured with the power connection arrangement of any of claims 8-9.

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