Substrate processing apparatus and substrate processing method

Abstract

The present invention relates to a substrate processing apparatus and a substrate processing method, and specifically, the apparatus for processing a substrate comprises: a chamber having a processing space; a support unit for supporting the substrate in the processing space; a liquid discharge unit for discharging the processing solution in liquid form onto the substrate supported on the support unit; and a liquid supply unit including a tank storing the treatment solution, a supply line connecting the tank and the liquid discharge unit, and a filter installed between the tank and the supply line, the filter including: an inlet port through which the treatment solution flows from the tank to the filter; a treatment solution flows out from the filter to an outlet port of the liquid discharge unit; and an exhaust port for discharging the liquid containing bubbles to the outside of the filter, and the liquid supply unit further includes a circulation line connected to the exhaust port of the filter and circulating the treatment solution discharged from the exhaust port of the filter to a line connected to the inlet port of the filter.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0165714 filed in the Korean Intellectual Property Office on November 24, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present invention relates to a substrate processing device and a substrate processing method for processing a substrate. Background Art

[0004] In order to manufacture semiconductor devices, various processes such as photography, deposition, ashing, etching and ion implantation are performed. In addition, before and after performing these processes, a cleaning process is performed to clean particles remaining on the substrate.

[0005] The cleaning process also includes: a process of supplying a treatment solution to a substrate supported and rotated on a spin head; a process of removing the treatment solution from a substrate by supplying a cleaning solution (such as deionized water (DIW)) to the substrate; a process of supplying an organic solvent (such as isopropyl alcohol (IPA) liquid) having a lower surface tension than the cleaning solution to the substrate to replace the cleaning solution on the substrate with the organic solvent; and a drying process of removing the replaced organic solvent from the substrate.

[0006] In this case, the treatment solution is supplied from the tank in a mixed state, and a filter is provided on a pipeline supplying the treatment solution for filtering the treatment solution.

[0007] In this case, the filter filtering the treatment solution is formed with a vent port to discharge the treatment solution, and the filter is connected to circulate the treatment solution in the filter to the tank side.

[0008] However, there is a problem that the treatment solution discharged from the exhaust port of the filter to the tank contains particles and may contaminate the treatment solution.

[0009] Therefore, the processing solution exhausted from the exhaust port of the filter is sometimes discarded, which increases the cost of substrate manufacturing.

[0010] Furthermore, the processing solution exhausted from the exhaust port may generate bubbles in the filter replacement process, and when the bubbles flow into the substrate treating process, the bubbles may cause process defects. Summary of the invention

[0011] The present invention is directed to providing a substrate processing apparatus and a substrate processing method that ensure that a contaminated processing solution exhausted from an exhaust port of a filter does not cause a process defect.

[0012] The present invention is directed to providing a substrate processing apparatus and a substrate processing method which reuse a contaminated processing solution exhausted from an exhaust port of a filter, thereby reducing manufacturing costs.

[0013] The present invention is directed to providing a substrate processing apparatus and a substrate processing method for preventing a processing solution discharged from an exhaust port of a filter from entering a process when the processing solution contains bubbles.

[0014] Problems to be solved by the present invention are not limited to the above-mentioned problems, and unmentioned problems will be clearly understood by those skilled in the art from the following description.

[0015] An exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a chamber having a processing space; a support unit for supporting the substrate in the processing space; a liquid discharge unit for discharging a processing solution in liquid form onto the substrate supported on the support unit; and a liquid supply unit comprising a tank for storing the processing solution, a supply line connecting the tank and the liquid discharge unit, and a filter installed between the tank and the supply line, wherein the filter comprises: an inlet port through which the processing solution flows from the tank into the filter; an outlet port through which the processing solution flows out from the filter to the liquid discharge unit; and an exhaust port for discharging liquid containing bubbles to the outside of the filter, and the liquid supply unit further comprises a circulation line connected to the exhaust port of the filter and circulates the processing solution discharged from the exhaust port of the filter to the line connected to the inlet port of the filter.

[0016] According to an exemplary embodiment, the liquid supply unit may include: a drain line that branches from the circulation line and discharges the treatment solution discharged from the exhaust port; and a valve unit that is used to control a flow path of the treatment solution so that the treatment solution discharged from the exhaust port selectively flows to the drain line or a line connected to the inlet port.

[0017] According to an exemplary embodiment, the liquid supply unit may further include a valve controller controlling the valve unit, and the valve controller may control the valve unit so that the processing solution exhausted from the exhaust port flows to the line connected to the inlet port when processing the substrate.

[0018] According to an exemplary embodiment, the liquid supply unit may further include a valve controller that controls the valve unit, and the valve controller may control the valve unit so that the treatment solution discharged from the exhaust port flows to the exhaust line during the initial setting of the filter. In this case, the initial setting may include replacement of the filter.

[0019] According to an exemplary embodiment, the liquid supply unit may further include: a bubble detection sensor for detecting bubbles in the circulation pipeline; and a valve controller for controlling the valve unit, and the valve controller may enable the treatment solution discharged from the exhaust port to flow to the discharge pipeline when the bubbles detected by the bubble detection sensor are equal to or greater than a set amount.

[0020] According to an exemplary embodiment, the valve controller may control the valve unit so that the treatment solution discharged from the exhaust port flows to the line connected to the inlet port when the bubbles detected by the bubble detection sensor are less than a set amount.

[0021] According to an exemplary embodiment, the liquid supply unit may further include a valve controller that controls the valve unit, and the valve controller may control the valve unit so that the processing solution discharged from the exhaust port flows to the exhaust line during an initial setting of supplying the processing solution to the substrate, and then the processing solution discharged from the exhaust port flows to the line connected to the inlet port.

[0022] According to an exemplary embodiment, the valve unit may be a three-way valve installed at a point where the circulation line and the discharge line are connected.

[0023] According to an exemplary embodiment, a bubble detection sensor may be provided between the exhaust port and the three-way valve.

[0024] According to an exemplary embodiment, the liquid supply unit may further include: a measuring line having one end connected to the outlet port of the filter; and a densitometer mounted on the measuring line and having the other end connected to the circulation line.

[0025] According to an exemplary embodiment, the filter may be a membrane filter.

[0026] According to an exemplary embodiment, the liquid supply unit may further include a discharge valve installed in the discharge pipeline and opening and closing the passage of the discharge pipeline, and the discharge port may be located at the bottom end of the filter, and when the discharge valve is opened, the treatment solution may be discharged by falling, and the exhaust port may be located at the top end of the filter, and when the treatment solution is completely filled in the filter, the treatment solution may be discharged upward.

[0027] Another exemplary embodiment of the present invention provides a method for processing a substrate, the method comprising: processing a substrate by supplying a processing solution from a tank to the substrate via a filter, wherein the processing solution flows into the filter through an inlet port of the filter, and the processing solution filtered from the filter is discharged from the filter through an outlet port of the filter, bubbles in the filter or the processing solution containing bubbles is discharged from the filter through an exhaust port of the filter when the processing solution flows from the inlet port to the outlet port, and the processing solution discharged from the exhaust port of the filter flows through a path selected from a first path and a second path, the processing solution circulates upstream of the filter through the first path and then flows into the inlet port of the filter again, and the processing solution is discharged from the exhaust port of the filter through the second path and then discharged to the outside.

[0028] According to an exemplary embodiment, during processing of a substrate, the processing solution discharged from the exhaust port of the filter may flow to the second path at the beginning of supply of the processing solution through the filter, and thereafter, the processing solution discharged from the exhaust port of the filter may flow to the first path.

[0029] According to an exemplary embodiment, the method may further include detecting bubbles in the treatment solution discharged from the exhaust port, wherein when the amount of the detected bubbles is equal to or greater than a set value, the treatment solution discharged from the exhaust port of the filter may flow to the second path, and when the amount of the detected bubbles is less than the set value, the treatment solution discharged from the exhaust port of the filter may flow to the first path.

[0030] According to the exemplary embodiment, in a setup operation of the apparatus before supplying the treatment solution to the substrate, the treatment solution exhausted from the exhaust port of the filter may flow to the second path.

[0031] According to an exemplary embodiment, in a state where the treatment solution is circulated by connecting an outlet port of the filter and an inlet port of the filter through a pipeline, a densitometer may be installed in the pipeline to measure the concentration of the treatment solution.

[0032] According to an exemplary embodiment, the discharge port may be located at the bottom end of the filter, the exhaust port may be located at the top end of the filter, and the treatment solution may drop to the bottom end of the discharge port and be discharged to the second path, and when the treatment solution is completely filled in the filter, the treatment solution may be discharged from the top end of the exhaust port to the first path.

[0033] Another exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a chamber having a processing space; a support unit for supporting the substrate in the processing space; a liquid discharge unit for discharging a processing solution in liquid form onto the substrate supported on the support unit; and a liquid supply unit comprising a tank for storing the processing solution, a supply line connecting the tank and the liquid discharge unit, and a filter installed between the tank and the supply line, wherein the filter comprises: an inlet port through which the processing solution flows from the tank into the filter; an outlet port through which the processing solution flows from the filter to the liquid discharge unit; and an exhaust port for discharging liquid containing bubbles to the outside of the filter, and the liquid supply unit further comprises: a circulation line connected to the exhaust port of the filter and circulates the processing solution discharged from the exhaust port of the filter to a line connected to the inlet port of the filter; and a discharge line branched from the circulation line and discharging liquid discharged from the exhaust port a discharged processing solution; a measuring pipeline having one end connected to an outlet port of a filter and the other end connected to a circulation pipeline; a densitometer mounted on the measuring pipeline; a valve unit for controlling a flow path of the processing solution so that the processing solution discharged from the exhaust port selectively flows to the exhaust pipeline or the pipeline connected to the inlet port; a bubble detection sensor for detecting bubbles in the circulation pipeline; and a valve controller for controlling the valve unit, and the valve controller controls the valve unit so that the processing solution discharged from the exhaust port flows to the exhaust pipeline when the bubbles detected by the bubble detection sensor are equal to or greater than a set amount, and the processing solution discharged from the exhaust port flows to the pipeline connected to the inlet port when the bubbles detected by the bubble detection sensor are less than the set amount, and the valve controller controls the valve unit so that the processing solution discharged from the exhaust port flows to the exhaust pipeline at the beginning of supplying the processing solution to the substrate, and thereafter, the processing solution discharged from the exhaust port flows to the pipeline connected to the inlet port.

[0034] Since the processing solution discharged from the exhaust port of the filter is circulated to the inlet port of the filter, the present invention reduces the processing solution by re-filtering the contaminated processing solution discharged from the exhaust port and by reusing the processing solution, thereby achieving the effect of reducing process defects caused by the processing solution.

[0035] Furthermore, when the processing solution from the exhaust port of the filter contains bubbles, the present invention achieves the effect of preventing process defects caused by the bubbles by exhausting the processing solution containing the bubbles.

[0036] The effects of the present invention are not limited to the above-mentioned effects, and unmentioned effects will be clearly understood by those skilled in the art from the present specification and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 is a top plan view showing a substrate processing facility according to an exemplary embodiment of the present invention.

[0038] Figure 2 It shows Figure 1 A cross-sectional view of a substrate treating apparatus.

[0039] Figure 3 It is schematically shown Figure 2 Diagram of the liquid supply unit.

[0040] Figure 4 is schematically shown with Figure 3 Diagram of a filter-connected recurrent unit shown.

[0041] Figure 5 and Figure 6 It shows that Figure 3 FIG. 1 is a diagram illustrating a moving process of a processing solution flowing in a liquid supply unit.

[0042] Figure 7 It shows the use of Figure 3 Flow chart of a process for processing a substrate using a device.

[0043] Figure 8 yes Figure 2 A cross-sectional view of a modified example of a substrate processing apparatus is shown.

[0044] Fig. 9 is a diagram showing the following path, Figure 4 The circulation unit shown filters the process solution through this path.

[0045] Fig.10 is a diagram showing the following path, Fig. 9 The circulation unit shown discharges the processing solution including the generated bubbles through the path.

[0046] Fig.11 The arrows show the Fig. 9 and Fig.10 Diagram of the flow of process solution out of the filter. DETAILED DESCRIPTION

[0047] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments are provided so that the disclosure is thorough and the scope is fully conveyed to those skilled in the art. Many specific details (such as examples of specific components, devices and methods) are set forth to provide a thorough understanding of the embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be adopted, and example embodiments can be embodied in many different forms, and specific details should not be construed as limiting the scope of the present disclosure. In some example embodiments, well-known processes, well-known device structures and well-known technologies are not described in detail.

[0048] The terms used herein are for the purpose of describing specific example embodiments only and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "a, an" and "the" may be intended to include plural forms. The terms "comprises, comprising", "including" and "having" are inclusive, and therefore specifically refer to the presence of the feature, integer, step, operation, element and / or component, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof. Unless explicitly identified as an order of execution, the method steps, processes and operations described herein should not be interpreted as having to be performed in the specific order discussed or illustrated. It should also be understood that additional or alternative steps may be adopted.

[0049] When an element or layer is referred to as being "on another element or layer," "engaged to another element or layer," "connected to another element or layer," or "coupled to another element or layer," the element or layer may be directly on, directly engaged to, connected to, or coupled to another element or layer, or there may be intermediate elements or layers. Conversely, when an element is referred to as being "directly on another element or layer," "directly engaged to," "directly connected to," or "directly coupled to," there may be no intermediate elements or layers. Other words used to describe the relationship between elements should be interpreted similarly (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items.

[0050] Although the terms "first", "second", "third", etc. can be used to describe different elements, components, regions, layers and / or sections in this article, unless otherwise specified, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer and / or section from another region, layer and / or section. When used in this article, unless the context clearly indicates, terms such as "first", "second" and other numerical items do not imply order or sequence. Therefore, without departing from the teaching of the example embodiment, the first element, the first component, the first area, the first layer or the first section discussed below can be referred to as the second element, the second component, the second area, the second layer or the second section.

[0051] For ease of description, spatially relative terms (e.g., "inside," "outside," "below," "below," "below," "above," and "above," etc.) may be used herein to describe the relationship of one element or feature shown in the drawings to another (or other) element or feature. Spatially relative terms may be intended to cover different orientations of the device in use or operation in addition to the orientations described in the drawings. For example, if the device in the figure is turned over, an element described as being "below" or "beneath" other elements or features will subsequently be oriented to be "above" the other elements or features. Thus, the example term "below" may cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or oriented in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0052] When the terms "same" or "same" are used in the description of the exemplary embodiments, it should be understood that some imprecision may exist. Therefore, when an element or value is referred to as being the same as another element or value, it should be understood that the element or value is the same as the other element or value within a manufacturing or operating tolerance range (e.g., ±10%).

[0053] When the term "about" or "substantially" is used with a numerical value, it should be understood that the associated numerical value includes a manufacturing or operating tolerance (e.g., ±10%) around the numerical value. In addition, when the words "generally" and "substantially" are used in conjunction with geometric shapes, it should be understood that the exactness of the geometric shape is not required, but the latitude of the shape is within the scope of the present disclosure.

[0054] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the exemplary embodiments belong. It should be further understood that terms, including those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0055] In the present exemplary embodiment, a wafer will be described as an example of an object to be processed. However, the technical spirit of the present invention can be applied to an apparatus for processing other types of substrates than a wafer.

[0056] Figure 1 is a top plan view showing a substrate processing facility according to an exemplary embodiment of the present invention. Figure 2 It is shown Figure 1 A cross-sectional view of a substrate processing apparatus. Figure 3 It is schematically shown Figure 2 Diagram of the liquid supply unit. Figure 5 and Figure 6 It shows that Figure 3 FIG. 1 is a diagram illustrating a moving process of a processing solution flowing in a liquid supply unit. Figure 7 It shows the use of Figure 3 Flow chart of a process for processing a substrate using a device.

[0057] Reference Figures 1 to 7 , the substrate processing facility 1 includes an index module 10 and a process processing module 20, and the index module 10 has a load port 120 and a transfer frame 140. The load port 120, the transfer frame 140, and the process processing module 20 are arranged in a row in sequence. Hereinafter, the direction in which the load port 120, the transfer frame 140, and the process processing module 20 are arranged is referred to as a first direction 12, a direction perpendicular to the first direction 12 when viewed from above is referred to as a second direction 14, and a direction perpendicular to a plane including the first direction 12 and the second direction 14 is referred to as a third direction 16.

[0058] The carrier 18 containing the substrate W is mounted on the loading port 120. A plurality of loading ports 120 are provided, and the plurality of loading ports are arranged in a row along the second direction 14. Figure 1In the embodiment, four loading ports 120 are provided. However, the number of loading ports 120 may be increased or decreased according to conditions such as process efficiency and floor space of the process module 20. A slot (not shown) provided to support an edge of a substrate is formed in the carrier 18. The plurality of slots are provided along the third direction 16, and the substrates are positioned in the carrier for stacking with the substrates spaced apart from each other in the third direction 16. A front opening unified pod (FOUP) may be used as the carrier 18.

[0059] The process module 20 may include a buffer unit 220, a transfer chamber 240, and process chambers 260 and 280. The transfer chamber 240 is arranged so that its longitudinal direction is parallel to the first direction 12. The process chambers 260 and 280 are arranged on opposite sides of the transfer chamber 240 along the second direction 14. The process chambers 260 may be arranged symmetrically with respect to the transfer chamber 240. A portion of the process chambers 260 and 280 is arranged along the longitudinal direction of the transfer chamber 240. In addition, a portion of the process chambers 260 and 280 is arranged to be stacked on top of each other. That is, the process chambers 260 and 280 may be arranged on opposite sides of the transfer chamber 240 in an A×B array (A and B are natural numbers equal to or greater than 1). Here, "A" is the number of process chambers 260 and 280 arranged in a row along the first direction 12, and "B" is the number of process chambers 260 and 280 arranged in a row along the third direction 16. When four or six process chambers 260, 280 are provided on each of opposite sides of the transfer chamber 240, the process chambers 260, 280 may be provided in a 2×2 or 3×2 array. The number of process chambers 260, 280 may be increased or decreased. Different from the foregoing, the process chamber 260 may be provided only on one side of the transfer chamber 240. In addition, the process chambers 260, 280 may be provided on one side and opposite sides of the transfer chamber 240 in a single layer. Furthermore, the process chambers 260, 280 may be provided in various arrangements different from the foregoing.

[0060] The process chambers 260, 280 of this exemplary embodiment may be classified as including a cleaning chamber and a drying chamber. In this case, the cleaning chamber may be used for a substrate processing facility for cleaning a substrate, which will be described below, and the drying chamber may be used for a substrate processing facility for drying a substrate.

[0061] The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 may provide a space for the substrate W to stay before the substrate W is transferred between the transfer chamber 240 and the transfer frame 140. The buffer unit 220 is provided with a slot (not shown) in which the substrate W is placed, and the slots (not shown) are provided in plural to be spaced apart from each other in the third direction 16. In the buffer unit 220, a side facing the transfer frame 140 and a side facing the transfer chamber 240 are respectively opened.

[0062] The transfer frame 140 transfers the substrate W between the carrier 18 located at the loading port 120 and the buffer unit 220. The transfer frame 140 is provided with an index rail 142 and an index robot 144. The index rail 142 is provided so that its longitudinal direction is parallel to the second direction 14. The index robot 144 is mounted on the index rail 142 and moves linearly in the second direction 14 along the index rail 142. The index robot 144 includes a base 144a, a body 144b, and an index arm 144c. The base 144a is installed to be movable along the index rail 142. The body 144b is coupled to the base 144a. The body 144b is provided to be movable on the base 144a in the third direction 16. In addition, the body 144b is provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b and provided to be movable forward and backward relative to the body 144b. The plurality of index arms 144c are configured to be driven individually. The index arms 144c are configured to be stacked in a state of being spaced apart from each other in the third direction 16. When the substrate W is transferred from the process module 20 to the carrier 18, a portion of the index arms 144c may be used, and when the substrate W is transferred from the carrier 18 to the process module 20, another portion of the plurality of index arms 144c may be used. In the process of loading and unloading the substrate W by the index robot 144, particles generated from the substrate W before the process may be prevented from being attached to the substrate W after the process.

[0063] The transfer chamber 240 transfers the substrate W between the buffer unit 220 and the process chamber 260. A guide rail 242 and a main robot 244 are provided to the transfer chamber 240. The guide rail 242 is provided so that its longitudinal direction is parallel to the first direction 12. The main robot 244 is mounted on the guide rail 242 and moves linearly along the first direction 12 on the guide rail 242. The main robot 244 includes a base 244a, a body 244b and a main arm 244c. The base 244a is installed to be movable along the guide rail 242. The body 244b is coupled to the base 244a. The body 244b is provided to be movable along the third direction 16 on the base 244a. In addition, the body 244b is provided to be rotatable on the base 244a. The main arm 244c is coupled to the body 244b and provided to be movable forward and backward relative to the body 244b.

[0064] Hereinafter, the substrate processing apparatus 300 disposed in the process chamber 260 will be described. In the present exemplary embodiment, as an example, a case where the substrate processing facility 1 performs a liquid treatment process on a substrate will be described. The liquid treatment process also includes a process of cleaning the substrate.

[0065] Figure 2 It is shown Figure 1 A cross-sectional view of a substrate processing apparatus. Figure 2 The substrate processing apparatus 300 further includes a chamber 310, a processing container 320, a spin head 340, a lifting unit 360, a liquid discharge unit 400, a gas flow forming unit 500, a liquid supply unit 600, and a controller 900. The chamber 310 provides a processing space 312 in which a process of processing a substrate W is performed.

[0066] The processing container 320 is positioned in the processing space 312 and is arranged in the shape of a cup having an open upper portion. When viewed from above, the processing container 320 is positioned to overlap with the emptying line. The processing container 320 includes an internal recovery container 322 and an external recovery container 326. Each of the recovery container 322 and the recovery container 326 recovers a processing solution different from the processing solution used in the process. The internal recovery container 322 is arranged in a ring shape having a ring around the spin head 340, and the external recovery container 326 is arranged in a ring shape having a ring around the internal recovery container 322. The internal space 322a of the internal recovery container 322 and the space 326a between the external recovery container 326 and the internal recovery container 322 are used as inlet ports, which are used to make the processing solution flow into the internal recovery container 322 and the external recovery container 326 respectively. The circulation line 322b and the circulation line 326b are respectively connected to the bottom surface of the recovery container 322 and the bottom surface of the recovery container 326 to extend vertically in the downward direction. Each of the circulation line 322b and the circulation line 326b serves as a discharge line to discharge the treatment solution flowing through the corresponding recovery container 322, 326. The discharged treatment solution may be reused by an external treatment solution regeneration system (not shown).

[0067] The spin head 340 is provided as a substrate supporting unit 340 that supports and rotates the substrate W. The spin head 340 is provided in the processing container 320. The spin head 340 supports the substrate W and rotates the substrate W during the process. The spin head 340 has a body 342, a supporting pin 344, a chuck pin 346 and a supporting shaft 348. The body 342 has a top surface that is substantially circular when viewed from above. The supporting shaft 348 rotated by the motor 349 is fixedly coupled to the lower surface of the body 342. A plurality of supporting pins 344 are provided. The supporting pins 344 are spaced apart at a predetermined interval at the edge of the upper surface of the body 342 and protrude upward from the body 342. The supporting pins 344 are arranged in combination with each other to have an overall annular shape. The supporting pins 344 support the edge of the rear surface of the substrate W so that the substrate W is spaced apart from the upper surface of the body 342 by a predetermined distance. A plurality of chuck pins 346 are provided. The chuck pin 346 is provided farther from the center of the body 342 than the supporting pins 344. The chuck pin 346 is arranged to protrude upward from the body 342. The chuck pin 346 supports the lateral portion of the substrate W so that the substrate W does not move laterally from the normal position when the spin head 340 rotates. The chuck pin 346 is arranged to move linearly between a standby position and a supporting position along the radial direction of the body 342. The standby position is a position farther from the center of the body 342 than the supporting position. When the substrate W is loaded onto or unloaded from the spin head 340, the chuck pin 346 is positioned at the standby position, and when a process is performed on the substrate W, the chuck pin 346 is positioned at the supporting position. In the supporting position, the chuck pin 346 contacts the lateral portion of the substrate W.

[0068] The lifting unit 360 adjusts the relative height between the processing container 320 and the spin head 340. The lifting unit 360 linearly moves the processing container 320 in the up and down directions. When the processing container 320 moves in the vertical direction, the relative height of the processing container 320 relative to the spin head 340 changes. The lifting unit 360 includes a bracket 362, a moving shaft 364, and a driver 366. The bracket 362 is fixedly mounted on the outer wall of the processing container 320, and the moving shaft 364 that moves in the vertical direction by the driver 366 is fixedly coupled to the bracket 362. When the substrate W is placed on the spin head 340 or lifted from the spin head 340, the processing container 320 is lowered so that the spin head 340 protrudes above the top of the processing container 320. In addition, when the process is in progress, the height of the processing container 320 is adjusted according to the type of processing solution supplied to the substrate W so that the processing solution flows into a predetermined recovery container 326.

[0069] Different from the above description, the elevating unit 360 may move the spin head 340 in the vertical direction instead of the process container 320 .

[0070] The liquid discharge unit 400 supplies various types of liquids to the substrate W. The liquid discharge unit 400 also includes a plurality of nozzles 410, 420, 430. Each nozzle is moved to a process position and a standby position by a nozzle position driver. In this article, the process position is defined as a position where the nozzles 410, 420, 430 can discharge liquid onto the substrate W positioned in the processing container 320, and the standby position is defined as a position where the nozzles 410, 420, 430 wait outside the process position. According to an example, the process position may be a position where the nozzles 410, 420, 430 can supply liquid to the center of the substrate W. For example, when viewed from above, the nozzles 410, 420, 430 may be linearly or axially movable to move between the process position and the standby position. The processing solution discharged from the liquid discharge unit 400 onto the substrate W may be a liquefied processing solution. Additionally, in the standby position, the recovery pipe 450 may be disposed below the third nozzle 430. When the third nozzle 430 discharges a chemical liquid for cleaning, the recovery pipe 450 recovers the chemical liquid.

[0071] The plurality of nozzles 410, 420, 430 discharge different types of liquids. The processing solution discharged from the nozzles 410, 420, 430 may include at least one of a chemical, a rinse solution, a cleaning solution, and a drying fluid. Figure 2 In an exemplary embodiment of the present invention, the first nozzle 410 may be a nozzle for discharging chemicals. For example, the chemical may be a liquid capable of etching a film formed on the substrate W or removing particles remaining on the substrate W. The chemical may be a liquid having a strong acid or strong base property. The chemical may include sulfuric acid, hydrofluoric acid, or ammonia. In addition, the second nozzle 420 may be a nozzle for discharging a rinsing solution. The rinsing solution may be a solution capable of rinsing the chemicals remaining on the substrate W. For example, the rinsing solution may be pure water. In addition, the second nozzle 420 may be a nozzle for discharging a cleaning solution. The cleaning solution may be a solution for processing the support unit 340, the processing container 320, and the recovery pipe 450 after processing the substrate W. In addition, the third nozzle 430 may be a nozzle for discharging a drying fluid. The drying fluid may be provided as a solution capable of replacing the rinsing solution remaining on the substrate W. The drying fluid may be a solution having a lower surface tension than the rinsing solution. The drying fluid may be an organic solvent. The drying fluid may be isopropyl alcohol (IPA). The third nozzle 430 may be connected to the liquid supply unit 600 to receive the drying fluid.

[0072] The airflow forming unit 500 forms a downward airflow in the processing space 312. The airflow forming unit 500 supplies airflow from the top of the chamber 310 and exhausts airflow from the lower part of the chamber 310. The airflow forming unit 500 further includes an airflow supply unit 520 and an exhaust unit 540. The airflow supply unit 520 and the exhaust unit 540 are positioned to face each other in the vertical direction.

[0073] The airflow supply unit 520 supplies gas in a downward direction. The gas supplied from the airflow supply unit 520 can be air from which impurities are removed. The airflow supply unit 520 also includes a fan 522, an airflow supply line 524, a supply valve 528, and an airflow filter 526. The fan 522 is installed on the ceiling surface of the chamber 310. When viewed from above, the fan 522 is positioned to face the processing container. The fan 522 can be positioned to provide air toward the substrate W located in the processing container. The airflow supply line 524 is connected to the fan 522 to supply air toward the fan 522. The supply valve 528 is installed in the airflow supply line 524 to adjust the amount of air supplied. The airflow filter 526 is installed in the airflow supply line 524 to filter the air. For example, the airflow filter 526 can remove particles and moisture contained in the air.

[0074] The emptying unit 540 empties the processing space 312. The emptying unit 540 also includes an emptying pipe 542, a decompression member 546 and an emptying valve 548. The emptying pipe 542 is installed on the bottom surface of the chamber 310 and is arranged as a pipe for emptying the processing space 312. The emptying pipe 542 is positioned so that the emptying port faces upward. The emptying pipe 542 is positioned so that the emptying port is communicated with the inside of the processing container. In other words, the top of the emptying pipe 542 is located in the processing container. Therefore, the downward airflow formed in the processing container is emptied through the emptying pipe 542.

[0075] The pressure reducing member 546 reduces the pressure of the emptying pipe 542. A negative pressure is formed in the emptying pipe 542 by the pressure reducing member 546, thereby emptying the process container. The emptying valve 548 is installed in the emptying pipe 542 and opens and closes the emptying port of the emptying pipe 542. The emptying valve 548 adjusts the emptying amount.

[0076] Figure 3 It is schematically shown Figure 2 FIG. 6 is a diagram of a liquid supply unit 600 .

[0077] The liquid supply unit 600 includes a common pipeline portion 700 and a dedicated pipeline portion 800. Here, the common pipeline portion 700 of the liquid supply unit 600 corresponds to pipelines commonly used by the plurality of substrate processing apparatuses 300 when processing a substrate W, and the dedicated pipeline portion 800 corresponds to a plurality of pipelines connecting the common pipeline portion 700 and each of the plurality of substrate processing apparatuses 300.

[0078] First, further reference Figure 3 The common pipeline part 700 of the liquid supply unit 600 is described, and the common pipeline part 700 of the liquid supply unit 600 also includes the first tank unit 610, the second tank unit 620, the first heating unit 640 and the second heating unit 660. The gas supply unit 600 is connected to the liquid discharge unit 400. More specifically, the liquid supply unit 600 is connected to the dedicated pipeline part 800 to supply the drying fluid to the third nozzle 430 formed in each liquid discharge unit 400.

[0079] The first tank unit 610 further includes a first tank 612. The first tank 612 is formed in a barrel shape with a receiving space 612a formed therein. The interior of the first tank 612 receives a drying fluid. The receiving space 612a of the first tank 612 receives isopropyl alcohol. The first tank 612 is connected to a circulation line 641 described later. The first tank 612 may be connected to a supply line 661 described later.

[0080] The first tank unit 610 further includes a heater 614. The heater 614 is installed in the receiving space 612a of the first tank 612. The heater 614 may be installed to be immersed in the organic solvent received in the first tank 612. The third heater 614 may adjust the temperature of the organic solvent received in the first tank 612. In one example, the heater 614 may heat the organic solvent received in the first tank 612 to a temperature equal to or higher than the boiling point of the organic solvent, or may heat the organic solvent received in the first tank 612 to a temperature lower than the boiling point. The heater 614 may be set to have the same temperature as the first heater 642 or the second heater 662 described later.

[0081] The first tank unit 610 also includes a vacuum pump 616. The vacuum pump 616 is installed in the first tank 612. The vacuum pump 616 can be installed on a vacuum line 615 connected to the first tank 612. In one example, the vacuum line 615 can be connected to the upper wall of the first tank 612. The vacuum pump 616 provides vacuum pressure to the receiving space 612a by connecting to the vacuum line 615 of the first tank 612. The vacuum pump 616 provides negative pressure to the receiving space 612a by connecting to the vacuum line 615 of the first tank 612. The vacuum pump 616 can keep the receiving space 612a of the first tank 612 in a negative pressure atmosphere. This can prevent the dissolved gas remaining in the receiving space 612a from infiltrating the degassed organic solvent through the first heating unit 640.

[0082] The first tank unit 610 also includes a discharge unit 617. The discharge unit 617 discharges the drying fluid received in the first tank 612 to the outside. In one example, when the drying fluid received in the first tank 612 is contaminated or when the drying fluid needs to be replaced, the discharge unit 617 can discharge the drying fluid to the outside. The discharge unit 617 also includes a discharge line 617a and an open / close valve 617b installed on the discharge line 617a. The discharge line 617a can be connected to the lower wall of the first tank 612. The discharge line 617a is a moving path for discharging the treatment solution to the outside. The open / close valve 617b can be installed on the discharge line 617a to adjust the discharge amount of the drying fluid received in the first tank 612. In one example, when the drying fluid received in the first tank 612 does not need to be discharged, the open / close valve 617b can remain closed, and when the drying fluid received in the first tank 612 is discharged, the open / close valve 617b can remain open.

[0083] The second tank unit 620 may have the same structure as the first tank unit 610. The second tank unit 620 and the first tank unit 610 may receive the same treatment solution. Specifically, the second tank unit 620 also includes a second tank 622 having a receiving space 622a, a heater 624 installed in the receiving space 622a, a vacuum pump 626 installed on a vacuum line 625, and a discharge unit 627 including a discharge line 627a and an opening / closing valve 627b. Since the second tank unit 620 has the same structure and function as the first tank unit 610, a detailed description of each configuration of the second tank unit 620 is omitted herein, and the description of the first tank unit 610 may be referred to as needed.

[0084] The first heating unit 640 further includes a circulation line 641. The circulation line 641 is connected to the first tank 612 for circulating the drying fluid received in the first tank 612. The circulation line 641 is connected to the second tank 622 for circulating the drying fluid received in the second tank 622. The circulation line 641 further includes a first circulation line 641a connected to the upper wall of the first tank 612, a second circulation line 641b connected to the lower wall of the first tank 612, and a third circulation line 641c connecting the first circulation line 641a and the second circulation line 641b. In addition, the circulation line 641 further includes a fourth circulation line 641d connected to the upper wall of the second tank 622 and a fifth circulation line 641e connected to the lower wall of the second tank 622. In this case, the third circulation line 641c connects the fourth circulation line 641d and the fifth circulation line 641e. The first circulation line 641a, the third circulation line 641c and the fourth circulation line 641d are joined at the first point P1, and the second circulation line 641b, the third circulation line 641c and the fifth circulation line 641e are joined at the second point P2. In other words, the third circulation line 641c may be a line connected between the first point P1 and the second point P2.

[0085] Each of the first circulation line 641a, the second circulation line 641b, the fourth circulation line 641d, and the fifth circulation line 641e is equipped with an opening / closing valve 644. Each of the opening / closing valves 644 can be selectively opened or closed to form a circulation path of the drying fluid described herein. The first circulation line 641a, the second circulation line 641b, and the third circulation line 641c form a first circulation path in which the drying fluid received in the receiving space 612a of the first tank 612 circulates. The third circulation line 641c, the fourth circulation line 641d, and the fifth circulation line 641e form a second circulation path in which the drying fluid received in the receiving space 622a of the second tank 622 circulates. When the drying fluid received in the first tank 612 circulates through the first circulation path, the drying fluid received in the second tank 622 does not circulate through the second circulation path. In this case, the on / off valves 644 installed on the first circulation line 641a and the second circulation line 641b may be controlled to be opened, and the on / off valves 644 installed on the fourth circulation line 641d and the fifth circulation line 641e may be controlled to be closed. On the contrary, when the drying fluid received in the first tank 612 is not circulated through the first circulation path and the drying fluid received in the second tank 622 is circulated through the second circulation path, the on / off valves 644 installed on the fourth circulation line 641d and the fifth circulation line 641e may be controlled to be opened, and the on / off valves 644 installed on the first circulation line 641a and the second circulation line 641b may be controlled to be closed.

[0086] The first heating unit 640 also includes a first heater 642. The first heater 642 is installed in the third circulation line 641c. The first heater 642 heats the drying fluid flowing in the circulation line 641. The first heater 642 can heat the drying fluid flowing in the circulation line 641 to a temperature equal to or higher than the boiling point of the drying fluid. For example, when the drying fluid is isopropyl alcohol (IPA), the first heater 642 can heat the isopropyl alcohol (IPA) to a temperature equal to or higher than the boiling point (83°C) of the isopropyl alcohol (IPA). Since the isopropyl alcohol (IPA) is heated to a boiling point or above the boiling point, the isopropyl alcohol (IPA) boils, and in this process, the dissolved gas dissolved in the isopropyl alcohol (IPA) can be degassed and discharged as bubbles. In this case, the amount of dissolved gas in the isopropyl alcohol (IPA) heated to or above the boiling point circulated through the circulation line 641 is maintained at a very low level, and then, bubbles generated by local pressure changes due to pipe diameters, head differences, passages through resistors, or changes in the roughness of the inner surface of the pipe can be minimized in the supply process through the supply line 661. This can significantly reduce the possibility of bubbles falling on the substrate W together with the IPA when the IPA is discharged onto the substrate W, which can achieve the effect of reducing particles on the substrate W.

[0087] At the same time, the first heater 642 can heat the drying fluid flowing through the inside of the circulation line 641 to a temperature equal to or higher than the boiling point within a predetermined time. In this case, the predetermined time can prevent the amount of the solution from being significantly reduced due to artificial boiling by boiling point heating. In addition, the predetermined time can vary according to the type of solution flowing through the inside of the circulation line 641.

[0088] The first heating unit 640 further includes a pump 643. The pump 643 provides power to allow the drying fluid included in the first tank 612 or the second tank 622 to move within the circulation line 641. In one example, the pump 643 may be a pressure reducing pump. The pump 643 may be provided on the third circulation line 641c. In this case, when the drying fluid included in the first tank 612 circulates along the first circulation path, or when the drying fluid included in the second tank 622 circulates along the second circulation path, the two circulations may be performed by a single pump 643, which has the effect of simplifying the structure.

[0089] The second heating unit 660 further includes a supply line 661. The supply line 661 is connected to the first tank 612 to supply the drying fluid received in the first tank 612 to the substrate W. The supply line 661 is connected to the second tank 622 to supply the drying fluid received in the second tank 622 to the substrate W. The supply line 661 further includes a first supply line 661a connected to the upper wall of the first tank 612, a second supply line 661b connected to the lower wall of the first tank 612, a third supply line 661c connected to the upper wall of the second tank 622, and a fourth supply line 661d connected to the lower wall of the second tank 622. Here, the first supply line 661a and the third supply line 661c are joined at a third point P3, and the second supply line 661b and the fourth supply line 661d are joined at a fourth point P4. The supply line 661 further includes a fifth supply line 661e connected to the first supply line 661a and the third supply line 661c at point P3, and a sixth supply line 661f connected to the second supply line 661b and the fourth supply line 661d at point P4. The fifth supply line 661e and the sixth supply line 661f are joined at one point and connected to the nozzle 430.

[0090] Each of the first supply line 661a, the second supply line 661b, the third supply line 661c, and the fourth supply line 661d is equipped with an opening / closing valve 669. Each of the opening / closing valves 669 can be selectively opened or closed to form a supply path for a drying fluid described later. The first supply line 661a, the second supply line 661b, the fifth supply line 661e, and the sixth supply line 661f form a first supply path through which the drying fluid received in the first tank 612 is supplied to the substrate W via the nozzle 430. The third supply line 661c, the fourth supply line 661d, the fifth supply line 661e, and the sixth supply line 661f form a second supply path through which the drying fluid contained in the second tank 622 is supplied to the substrate W via the nozzle 430. When the drying fluid received in the first tank 612 is supplied through the first supply path, the drying fluid received in the second tank 622 is not supplied through the second supply path. In this case, the on / off valves 669 installed on the first supply line 661a and the second supply line 661b may be controlled to be opened, and the on / off valves 669 installed on the third supply line 661c and the fourth supply line 662d may be controlled to be closed. Conversely, when the drying fluid received in the first tank 612 is not supplied through the first supply path and the drying fluid received in the second tank 622 is supplied via the second supply path, the on / off valves 669 installed on the third supply line 661c and the fourth supply line 661d may be controlled to be opened, and the on / off valves 669 installed on the first supply line 661a and the second supply line 661b may be controlled to be closed.

[0091] In addition, when the drying fluid received in the first tank 612 circulates through the first circulation path, the on / off valve 669 installed on the first supply path is controlled to be closed, and the on / off valve 669 installed on the second supply path is controlled to be opened. Conversely, when the drying fluid included in the second tank 622 circulates through the second circulation path, the on / off valve 669 installed on the first supply path is controlled to be opened, and the on / off valve 669 installed on the second supply path is controlled to be closed. That is, the first circulation path and the second supply path operate together, and the second circulation path and the first supply path operate together. In this way, the drying fluid in the second tank 622 circulates in the first circulation path and is supplied to the substrate W while the drying fluid in the first tank 612 circulates in the first circulation path and degasses the dissolved gas into bubbles. In this case, the drying fluid in the second tank 622 may have been heated to a boiling point or above the boiling point by circulation, and the bubbles may have been emptied. When the drying fluid in the second tank 622 is completely emptied, the degassed drying fluid received in the first tank 612 is supplied to the substrate W, and the second tank 622 can be filled with the drying fluid and the process of degassing the dissolved gas into bubbles can be performed while the drying fluid circulates along the second circulation path.

[0092] The second heating unit 660 also includes a second heater 662. The second heater 662 heats the drying fluid flowing in the supply line 661. The second heater 662 heats the drying fluid flowing in the supply line 661 to a temperature lower than the boiling point of the drying fluid. For example, when the drying fluid is isopropyl alcohol (IPA), the second heater 662 can heat the isopropyl alcohol (IPA) to a temperature lower than the boiling point (83°C) of the isopropyl alcohol (IPA). Preferably, the second heater 662 can heat the isopropyl alcohol (IPA) to a temperature between 65°C and 75°C, and supply the heated isopropyl alcohol (IPA) to the substrate W. In this case, the drying fluid that has been heated to a boiling point or above the boiling point by the first heating unit 640 and the dissolved gas has been degassed into bubbles can be supplied to the substrate through the nozzle 430 along the supply line 661 while the second heating unit 660 keeps the temperature below the boiling point. In this way, even in the case of local pressure changes due to tube diameter, head difference, channel through a resistor, or changes in the roughness of the inner surface of the pipe, the drying fluid from which the dissolved gas has been degassed does not generate bubbles when flowing through the supply line 661, and particles on the substrate W are reduced.

[0093] The second heater 662 is installed on the sixth supply line 661f. Figure 3, the second heater 662 can be installed upstream of the junction of the fifth supply line 661e and the sixth supply line 661f. In this case, the upstream refers to a position adjacent to the outlet port from which the first tank 612 or the second tank 622 starts to supply the treatment solution, and the downstream refers to the opposite position. The direction from upstream to downstream refers to the direction in which the treatment solution is discharged from the tank 612 and the tank 622 and supplied to the nozzle 430, and refers to the direction away from the outlet port of the tank 612 and the tank 622. The outlet port of the first tank 612 is formed on the lower wall of the first tank 612 connected to the second supply line 661b, and the outlet port of the second tank 622 is formed on the lower wall of the second tank 622 connected to the fourth supply line 661d. In addition, the upstream can refer to a position adjacent to the fourth point P4, which is the junction of the second supply line 661b and the fourth supply line 661d.

[0094] The second heating unit 660 further includes a pump 663. The pump 663 provides power to allow the drying fluid received in the first tank 612 or the second tank 622 to move in the supply line 661. In one example, the pump 663 may be a pressure reducing pump. The filter 663 may be installed in the sixth supply line 661f. In this case, when the drying fluid received in the first tank 612 is supplied along the first supply path, or when the drying fluid received in the second tank 622 is supplied along the second supply path, the two cycles may be performed by a single pump 663, which has the effect of simplifying the structure.

[0095] The second heating unit 660 further includes a first pressure sensor 664. The first pressure sensor 664 is disposed on the sixth supply line 661f. The first pressure sensor 664 is installed upstream of the junction of the fifth supply line 661e and the sixth supply line 661f. The first pressure sensor 664 can sense the flow pressure of the drying fluid before supplying the drying fluid to the nozzle 430. The first pressure sensor 664 can detect a change in the flow rate of the drying fluid passing through the interior of the sixth supply line 661f. Alternatively, the first pressure sensor 664 can detect a change in the pressure of the drying fluid flowing through the sixth supply line 661f.

[0096] The second heating unit 660 further includes a filter 665. The filter 665 is disposed on the sixth supply line 661f. The filter 665 is installed upstream of the junction of the fifth supply line 661e and the sixth supply line 661f. Before the drying fluid is supplied to the nozzle 430, the filter 665 filters any residual contaminants, particles, etc. remaining in the drying fluid.

[0097] The second heating unit 660 also includes a flow meter 666. The flow meter 666 is disposed on the sixth supply line 661f. The flow meter 666 is installed upstream of the junction of the fifth supply line 661e and the sixth supply line 661f. The flow meter 666 measures the flow rate of the drying fluid flowing through the supply line 661. In one example, the flow meter 666 can measure the flow rate by measuring the change in unit area or the change in mass per hour of the drying fluid flowing through the sixth supply line 661f. However, various methods can be used to measure the flow rate of the drying fluid flowing through the supply line 661 without limitation.

[0098] The pump 663, the second heater 662, the first pressure sensor 664, the filter 665 and the flow meter 666 installed on the sixth supply line 661f can be installed in order from upstream to downstream. However, the present invention is not limited to this, and some of these configurations can be omitted. In addition, a bubble cutter (not shown) can also be installed between the filter 665 and the flow meter 666 to remove any residual bubbles in the fluid.

[0099] The second heating unit 660 further includes a second pressure sensor 667. The second pressure sensor 667 is installed on the fifth supply line 661e. The second pressure sensor 667 is installed downstream of the junction of the fifth supply line 661e and the sixth supply line 661f. The second pressure sensor 667 measures the pressure of the drying fluid remaining after flowing through the inside of the fifth supply line 661e along the sixth supply line 661f and being supplied to the nozzle 430.

[0100] The second heating unit 660 further includes a static pressure regulator 668. The static pressure regulator 668 is installed on the fifth supply line 661e. The static pressure regulator 668 is installed downstream of the junction of the fifth supply line 661e and the sixth supply line 661f. The static pressure regulator 668 is installed downstream of the second pressure sensor 667 on the fifth supply line 661e. The static pressure regulator 668 can be adjusted according to the pressure value measured by the second pressure sensor 667 and the pressure value measured by the first pressure sensor 664 to maintain a constant pressure in the entire supply line 661.

[0101] Next, the dedicated pipeline portion 800 of the liquid supply unit 600 will be described, and the liquid supply unit 600 includes a plurality of dedicated pipeline portions 800, each of which is connected to each of a plurality of substrate processing apparatuses 300. These dedicated pipeline portions 800 are connected to the plurality of substrate processing apparatuses 300, and each of the substrate processing apparatuses 300 discharges the drying fluid under the control of the controller 900.

[0102] Therefore, the dedicated pipeline part 800 of the liquid supply unit 600 includes a dedicated pipeline 801, a dedicated pipeline side flow meter 802, a dedicated pipeline side flow regulating valve 803, a dedicated pipeline side temperature sensor 804, a dedicated pipeline side supply control valve 805, a dedicated pipeline side recovery pipeline 806 and a dedicated pipeline side recovery valve 807.

[0103] The dedicated line 801 has one end connected to the sixth supply line 661f and the other end connected to the nozzle 430. The dedicated line 801 may be provided in plurality and respectively connected to the plurality of substrate processing apparatuses 300. The dedicated lines 801 form a path for discharging the drying fluid circulated through the common line portion 700 to the nozzle 430.

[0104] The dedicated pipeline side flow meter 802 is installed in the dedicated pipeline 801. The dedicated pipeline side flow meter 802 measures the flow rate of the dedicated pipeline 801 and provides information on the flow rate of the drying fluid discharged through the dedicated pipeline 801 to the operator.

[0105] The dedicated line side flow regulating valve 803 is installed on the dedicated line 801. In this case, the dedicated line side flow control valve 803 may be installed between the dedicated line side flow meter 802 and the nozzle 430. These dedicated line side flow control valves 803 adjust the flow rate discharged to the nozzle 430 according to the adjustment value. Therefore, the flow rate discharged from each of the substrate processing apparatuses 300 can be adjusted by the dedicated line side flow regulating valve 803 installed in each of the substrate processing apparatuses 300. In this case, the substrate processing apparatus 300 can adjust the amount of the discharged drying fluid by adjusting the dedicated line side flow regulating valve 803 according to the processing process.

[0106] The dedicated line side temperature sensor 804 is installed on the dedicated line 801. The dedicated line side temperature sensor 804 may measure the temperature of the drying fluid supplied to each of the substrate processing apparatuses 300, and transmit the measured temperature value to the controller 900. In this case, the controller 900 may receive and monitor the temperature value of the drying fluid from the dedicated line side temperature sensor 804, and may generate a warning when the temperature value of the drying fluid supplied through the dedicated line 801 exceeds a preset value.

[0107] The dedicated line side supply control valve 805 is installed on the dedicated line 801. In this case, the dedicated line side supply control valve 805 may be installed between the dedicated line side flow regulating valve 803 and the nozzle 430. The dedicated line side supply control valve 805 may be controlled by the controller 900 to be in an open or closed state. In this case, the dedicated line side supply control valve 805 may be controlled by the controller 900 to be opened only when the substrate processing apparatus 300 is processing the substrate W to allow the drying fluid to be supplied to the nozzle 430, and may be closed to prevent the drying fluid from being supplied to the nozzle 430 when the substrate W is not being processed. In this case, the dedicated line side supply control valve 805 is formed as a three-way valve, so that when the dedicated line side supply control valve 805 is closed to prevent the drying fluid from being supplied to the nozzle 430 side, the drying fluid is recovered through the dedicated line side recovery line 806.

[0108] The dedicated line side recovery line 806 is connected between the dedicated line side supply control valve 805 and the fifth supply line 661e of the common line portion 700. The dedicated line side recovery line 806 forms a path for recovering the drying fluid to the common line portion 700 when the dedicated line side supply control valve 805 is closed to prevent the drying fluid from being supplied to the nozzle 430 side.

[0109] The dedicated line side recovery valve 807 is installed in the dedicated line side recovery line 806. The dedicated line side recovery valve 807 has an open state controlled by the controller 900, and when a situation such as an inspection of the substrate processing apparatus 300 or an inspection indicator light of the common line portion 700 occurs, when a situation occurs where the drying fluid is discharged more than a certain number of times, or when an operation of adjusting the flow rate of the drying fluid occurs, the dedicated line side recovery valve 807 can be switched to a closed state to prevent the drying fluid from being recovered.

[0110] At the same time, the controller 900 controls each of the plurality of opening / closing valves 644 provided on the circulation line 641. The controller 900 controls each of the plurality of opening / closing valves 669 provided on the supply line 661. The controller 900 may control each of the opening / closing valve 644 provided on the first circulation path, the opening / closing valve 644 provided on the second circulation path, the opening / closing valve 669 provided on the first supply path, and the opening / closing valve 669 provided on the second supply path. The controller 900 may control the opening / closing valve 664 provided in the first circulation path and the opening / closing valve 669 provided in the second supply path to be opened or closed at the same time, and may control the opening / closing valve 664 provided in the second circulation path and the opening / closing valve 669 provided in the first supply path to be opened or closed at the same time. When the controller 900 controls the opening / closing valve provided on the first circulation path and the second supply path to be opened, the controller 900 controls the opening / closing valve provided on the second circulation path and the first supply path to be closed. On the contrary, when controlling the opening / closing valves provided on the second circulation path and the first supply path to be opened, the controller 900 may control the opening / closing valves provided on the first circulation path and the second supply path to be closed.

[0111] In the following, reference will be made to Figure 5 and Figure 6 The moving process of the processing solution in the liquid supply unit 600 is described in detail.

[0112] Figure 5 and Figure 6 It is shown in Figure 3 FIG. 1 is a diagram showing a moving process of a treatment solution flowing in a liquid supply unit. In more detail, Figure 5 is a diagram showing a process in which the processing solution in the liquid supply unit 600 flows through the first circulation path and the second circulation path, and Figure 6 is a diagram showing a process in which the processing solution in the liquid supply unit 600 flows through the second circulation path and the first circulation path.

[0113] Reference Figure 5 and Figure 6, the first circulation line 641a, the second circulation line 641b, and the third circulation line 641c form a first circulation path in which the drying fluid received in the receiving space 612a of the first tank 612 circulates. The third circulation line 641c, the fourth circulation line 641d, and the fifth circulation line 641e form a second circulation path in which the drying fluid received in the receiving space 622a of the second tank 622 circulates. In addition, the first supply line 661a, the second supply line 661b, the fifth supply line 661e, and the sixth supply line 661f form a first supply path. The third supply line 661c, the fourth supply line 661d, the fifth supply line 661e, and the sixth supply line 661f form a second supply path.

[0114] Reference Figure 5 and Figure 6, the drying fluid in the first tank 612 is heated to a temperature equal to or higher than the boiling point while circulating along the first circulation path, during which the dissolved gas in the drying fluid is degassed into bubbles and discharged. The bubble degassing process through the first circulation path lasts for a period of time, and the degassed drying fluid is received in the first tank 612. In the first tank 612, the vacuum pump 626 creates a vacuum atmosphere in the receiving space 612a to prevent other gases from re-dissolving in the degassed drying fluid. The drying fluid in the second tank 622 flows to the dedicated pipeline 801 along the second supply path and is supplied to the substrate W through the nozzle 430 connected to the dedicated pipeline 801. Here, the dedicated pipeline side supply control valve 805 is controlled by the controller 900 to be in an open state so that the drying fluid is discharged to the nozzle 430 side. In this case, the drying fluid received in the second tank 622 may be a drying fluid in a bubble degassed state. The drying fluid in the second tank 622 is supplied to the substrate W while being kept at a temperature below the boiling point by the second heater 662. Even if the drying fluid experiences a local pressure change (e.g., a pressure drop) when moving along the supply line 661, the drying fluid degassed by bubbles generates relatively fewer bubbles than the drying fluid without degassed. In this case, even if the drying fluid is supplied to the substrate W, the amount of bubbles generated is also low, which also causes the effect of reducing particles on the substrate W. After all the drying fluid received in the second tank 622 has been supplied to the substrate W, the drying fluid waiting in the first tank 612 in a bubble degassed state flows along the first supply path to the dedicated line 801 and is supplied to the substrate W through the nozzle 430 connected to the dedicated line 801. Here, the dedicated line side supply control valve 805 is controlled by the controller 900 to be in an open state, so that the drying fluid is discharged to the nozzle 430 side. The drying fluid is supplied to the emptied second tank 622 again, and the bubble degassing process is performed through the second circulation path. The bubble degassing process performed by the second circulation path is the same as the bubble degassing process performed by the first circulation path. In this case, the controller 900 controls the on / off valve 644 provided in the first circulation path to be closed, and controls the on / off valve 644 provided in the second circulation path to be opened. In addition, the controller 900 controls the on / off valve 669 provided on the first supply path to be opened, and controls the on / off valve 669 provided on the second supply path to be closed. In addition, the dedicated pipeline side supply control valve 805 is controlled by the controller 900 to be in a closed state to prevent the drying fluid from being discharged to the nozzle 430.

[0115] Hereinafter, a substrate processing method according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0116] Figure 7 It is shown that the use Figure 3 A flow chart of a process for processing a substrate using an apparatus.

[0117] The substrate treating method according to the exemplary embodiment of the present invention further includes a chemical supplying operation S100 , a rinsing operation S200 , a replacing operation S300 , and a drying operation S400 .

[0118] In the chemical supply operation S100, chemicals are discharged onto the substrate W through the first nozzle 410 to remove metal foreign matter, organic matter, particles, etc. remaining on the substrate W. For example, the chemical may be a liquid capable of etching a film formed on the substrate W or removing particles remaining on the substrate W. The chemical may be a liquid having a strong acid or strong base property. The chemical may include sulfuric acid, hydrofluoric acid, or ammonia. The rinse solution may be a solution capable of rinsing the chemical remaining on the substrate W.

[0119] In the rinsing operation S200 , pure water (DIW) is discharged onto the substrate W through the second nozzle 420 to remove any chemicals remaining on the substrate W.

[0120] In the replacement operation S300, a drying fluid is supplied onto the substrate W through the third nozzle 430 to replace the rinsing solution remaining on the substrate W with the drying fluid. The drying fluid may be a liquid having a lower surface tension than the rinsing solution. For example, the drying fluid may be isopropyl alcohol (IPA).

[0121] The replacement operation S300 further includes a primary heating operation S320 and a secondary heating operation S340.

[0122] The primary heating operation S320 heats the drying fluid to a temperature equal to or higher than the boiling point of the drying fluid to remove bubbles from the drying fluid before supplying the drying fluid to the substrate. In this case, the drying fluid is heated to a temperature equal to or higher than the boiling point of the drying fluid while the drying fluid is circulated through the circulation line 641 connected to the tank 612 and the tank 622.

[0123] The secondary heating operation S340 supplies a drying fluid having a temperature lower than the boiling point to the substrate after the primary heating operation S320. In this case, the dedicated pipeline side supply control valve 805 is controlled by the controller 900 to be in an open state so that the drying fluid is discharged to the nozzle 430 side. In the secondary heating operation S340, after removing bubbles from the drying fluid, the drying fluid is secondary heated under the condition that the drying fluid is supplied to the substrate, but the secondary heating heats the drying fluid to a temperature lower than the boiling point of the drying fluid. The drying fluid may include isopropanol. In this case, in the primary heating operation S320, the isopropanol is heated at a temperature equal to or higher than 83°C, which is the boiling point of isopropanol, and in the secondary heating operation S340, the isopropanol is heated at a temperature lower than the boiling point of isopropanol. In this case, preferably, the heating temperature in the secondary heating operation S340 is between 65°C and 75°C.

[0124] In the drying operation S400, the organic solvent on the substrate may be removed by supplying a drying gas to the substrate. In this case, in the drying operation S400, the substrate liquid-treated in the cleaning chamber is transferred by the main robot 244 to a drying chamber (not shown) for drying.

[0125] In the following, the Figure 4 The cycle unit shown in .

[0126] Figure 4 is schematically shown with Figure 3 Diagram of a filter-connected recurrent unit shown.

[0127] like Figure 4 As shown, in the substrate treating apparatus according to the exemplary embodiment of the present invention, the liquid supply unit 600 may further include a circulation unit 1000 .

[0128] The circulation unit 1000 is connected to the exhaust port 665c of the filter 665, and circulates the treatment solution discharged from the filter 665 to the inlet port 665a side of the filter 665. Here, as an example of the filter 665, the filter 665 can be configured as a membrane filter. Therefore, the filter 665 is formed with an inlet port 665a through which the treatment solution flows in and an outlet port 665b through which the filtered treatment solution is discharged, and the filter 665 also includes an exhaust port 665c for discharging the treatment solution in a filled state to remove bubbles in the treatment solution and a discharge port 665d for discharging the treatment solution remaining inside. In this case, as Fig.11As shown, filter 665 can have an inlet port 665a and a discharge port 665d positioned at the bottom, so that the treatment solution can be discharged in a free fall manner through the discharge port 665d when discharged. In addition, filter 665 can have an outlet port 665b and an exhaust port 665c positioned at the top, so that when full of treatment solution, filter 665 can discharge the treatment solution through the exhaust port 665c. In this way, filter 665 can be installed on the fifth supply line 661e, to filter the treatment solution flowing on the fifth supply line 661e. In addition, filter 665 can include multiple filters, and multiple filters 665 can be connected in parallel to each other.

[0129] Meanwhile, the circulation unit 1000 may further include a circulation line 1010 connecting the exhaust port 665 c of the filter 665 and the inlet port 665 a of the filter 665 .

[0130] Like this, because the treatment solution discharged from the exhaust port 665c of filter 665 circulates to the inlet port 665a side of filter 665, therefore, the contaminated treatment solution discharged to the exhaust port 665c flows into the filter 665 side again and is filtered again.Therefore, the pollution source of the treatment solution discharged from the exhaust port 665c is filtered, and can not cause process defects.In addition, because the contaminated treatment solution discharged from the exhaust port 665c circulates to the filter 665 side again, therefore, the treatment solution discharged from the exhaust port 665c can be reused to reduce the treatment solution.In this case, one end of the circulation line 1010 can also be connected to the inlet port 665a of the filter 665 by the fifth supply line 661e connected to the circulation line 1010.

[0131] In addition, the circulation unit 1000 may be installed on the circulation line 1010 to discharge the treatment solution discharged from the exhaust port 665c of the filter 665 to the buffer tank when bubbles are generated in the treatment solution, and to allow the treatment solution to flow in the circulation line 1010 without generating bubbles.

[0132] As one example of the circulation unit 1000 , the circulation unit 1000 may include a bubble detection sensor 1021 , a valve controller 1022 , and a valve unit 1023 .

[0133] The bubble detection sensor 1021 is installed in the circulation line. The bubble detection sensor 1021 is installed upstream of the valve unit 1023. When a certain amount of air is detected in the treatment solution flowing in the circulation line, the bubble detection sensor 1021 generates a bubble detection signal.

[0134] The valve controller 1022 may be formed by a circuit unit having a control function. The valve controller 1022 interacts with the bubble detection sensor 1021 and the valve unit 1023. When the valve controller 1022 receives a bubble detection signal from the bubble detection sensor 1021, the valve controller 1022 sends a state conversion signal to the valve unit 1023, and the valve unit 1023 receiving the state conversion signal switches the state from the first state to the second state. In this case, when no bubble detection signal is input within a preset time period, the valve controller 1022 may switch the state of the valve unit 1023 from the second state to the first state by stopping outputting the state conversion signal to the valve unit 1023.

[0135] In addition, during the initial setup of supplying the processing solution to the substrate, the valve controller 1022 may control the valve unit 1023 to allow the processing solution discharged from the exhaust port 665c to flow to the exhaust line 1040, and then control the valve unit 1023 to allow the processing solution discharged from the exhaust port 665c to flow to the line connected to the inlet port 665a. In one example, the setup may be a state in which the filter 665 is replaced with a new filter, or may be a state in which the processing fluid inside the filter 665 is emptied and refilled.

[0136] The valve unit 1023 is installed on the circulation line 1010. In this way, the valve unit 1023 interacts with the bubble detection sensor 1021. The valve unit 1023 can be formed by a three-way valve including an inlet port 1023a, a first outlet port 1023b and a second outlet port 1023c. In the first state where the bubble detection sensor 1021 does not detect bubbles, the valve unit 1023 can be formed in a state where the inlet port 1023a and the first outlet port 1023b are opened and the second outlet port 1023c is closed. Therefore, when the valve unit 1023 is in the first state, the valve unit 1023 can continuously circulate the treatment solution discharged from the exhaust port 665c of the filter 665. In the second state where the bubble detection sensor 1021 detects bubbles, the valve unit 1023 can be formed in a state where the inlet port 1023a and the second outlet port 1023c are opened and the first outlet port 1023b is closed. Therefore, when the valve unit 1023 is in the second state, the valve unit 1023 may prevent the processing solution exhausted from the exhaust port 665c of the filter 665 from flowing into the circulation line 1010 and allow the processing solution to flow toward the buffer tank 1030 to exhaust the processing solution containing bubbles.

[0137] The circulation unit 1000 may further include a buffer tank 1030 and a discharge line 1040 .

[0138] The buffer tank 1030 has a receiving space for storing the treatment solution. In this case, when the treatment solution stored in the buffer tank 1030 increases to a certain volume or more, the treatment solution can be discharged and disposed. The buffer tank 1030 is connected to the second outlet port 1023c of the valve unit 1023. In addition, the buffer tank 1030 is connected to the other end of the discharge line 1040.

[0139] The discharge line 1040 has one end connected to the discharge port 665d of the filter 665 and the other end connected to the buffer tank 1030. Therefore, the filter 665 can discharge any internal residual processing fluid to the buffer tank 1030 through the discharge line 1040 when discharge is required.

[0140] Therefore, the circulation unit 1000 including the discharge pipeline 1040 and the buffer tank 1030 ensures that the processing solution discharged from the discharge port 665d of the filter 665 is recovered when the filter 665 is replaced, so that the processing solution remaining in the filter 665 is prevented from entering the supply pipeline 661e side when the filter 665 is replaced, thereby preventing process defects.

[0141] In addition, the circulation unit 1000 may further include a discharge valve 1050 .

[0142] A drain valve 1050 is installed on the drain line 1040. The drain valve 1050 allows the filter 665 to be kept in a closed state when the filter 665 is filtering, thereby preventing the treatment solution from flowing from the filter 665 to the buffer tank 1030, and is switched to an open state when the filter 665 is replaced, thereby discharging the residual treatment solution inside the filter 665 to the buffer tank 1030. Therefore, the filter 665 can discharge any internal residual treatment fluid to the buffer tank 1030 through the drain valve 1050 when it is replaced.

[0143] Furthermore, the circulation unit 1000 may further include a measuring line 1060 and a densitometer 1070 .

[0144] One end of the measuring line 1060 is connected to the outlet port 665b of the filter 665. Therefore, the processing solution discharged from the filter 665 can be supplied to the measuring line 1060. In this case, one end of the measuring line 1060 can be connected to the outlet port 665b of the filter 665 through the fifth supply line 661e connected to the measuring line 1060.

[0145] The densitometer 1070 is installed on the measuring pipeline 1060. The densitometer 1070 can measure the concentration of the processing solution discharged from the filter 665 to provide information about the concentration of the processing solution. Therefore, the substrate processing apparatus according to the exemplary embodiment of the present invention can determine whether the concentration of the processing solution discharged from the filter 665 is a suitable concentration for processing the substrate. In this case, the densitometer 1070 measures the processing solution filtered from the filter 665, so that the concentration of the processing solution can be measured in a state where the concentration is not changed by pollutants such as particles. Therefore, the densitometer 1070 can measure the concentration of the processing solution more accurately.

[0146] In addition, the other end of the measuring line 1060 may be connected to the circulation line 1010. Therefore, the process solution flowing in the measuring line 1060 circulates through the circulation line 1010. Therefore, after the concentration is measured in the measuring line 1060, the process solution whose concentration is measured by the densitometer 1070 circulates through the circulation line 1010. Therefore, the process solution that may be contaminated after the concentration measurement is filtered again by the filter 665, so that the process solution discarded during the concentration measurement can be recovered and the process solution can be reduced.

[0147] In the above example, the substrate processing apparatus 300 for performing the liquid processing process is described as a single-blade type for performing liquid processing on a single substrate W. However, as Figure 8 As shown, the substrate processing apparatus 300a may also be configured as a batch type for performing liquid processing on a plurality of substrates W simultaneously.

[0148] Hereinafter, a moving process of the treatment fluid in the circulation unit will be described.

[0149] Fig. 9 It shows Figure 4 Diagram showing the path through which the circulation unit filters the process solution. Fig.10 It shows Fig. 9 A diagram showing a path through which a circulation unit discharges a treatment solution including generated bubbles. Fig.11 The arrows show the Fig. 9 and Fig.10 Diagram of the flow of process solution out of the filter.

[0150] like Fig. 9 As shown, the filter 665 of the circulation unit filters the processing solution supplied through the supply path P1.

[0151] In this case, when the treatment solution is completely filled in the exhaust port 665c of the filter 665, the treatment solution circulates through the exhaust port 665c of the filter 665 along the first path P2 of the circulation line 1010, and the treatment solution flowing to the circulation line 1010 circulates toward the inlet port 665a of the filter 665 to reuse the treatment solution. In this case, the discharge valve 1050 of the discharge line 1040 is formed in a closed state so that the treatment solution is not discharged.

[0152] Meanwhile, when the filter 665 is replaced and the initial setting is performed, residual air remains inside, and during the process of filling the filter 665 with the treating solution, the residual air is exhausted to the circulation line 1010 through the exhaust port 665 c .

[0153] In this case, the bubble detection sensor 1021 installed in the circulation line 1010 detects bubbles and generates a bubble detection signal, and transmits the bubble detection signal to the valve controller 1022. The valve controller 1022 receiving the bubble detection signal switches the state of the valve unit 1023 from the first state to the second state.

[0154] Then, if Fig.10 As shown, the valve unit 1023 switches the state to the second state in which the inlet port 1023a and the second outlet port 1023c are opened and the first outlet port 1023b is closed. Therefore, when the valve unit 1023 is in the second state, the valve unit 1023 prevents the processing solution discharged from the exhaust port 665c of the filter 665 from flowing to the first path P2 of the circulation line 1010, and allows the processing solution to flow along the second path P3 toward the buffer tank 1030. Therefore, the processing solution containing bubbles does not flow into the process of processing the substrate, and therefore, the processing solution does not cause process defects due to the bubbles.

[0155] Meanwhile, when no bubble is detected, the bubble detection sensor 1021 stops generating the bubble detection signal. In this case, when no bubble detection signal is input from the bubble detection sensor 1021 within a certain period of time, the valve controller 1022 switches the valve unit 1023 from the second state to the first state. Then, as shown in FIG. Fig. 9 As shown, in a state where the discharge of the processing solution to the buffer tank 1030 is stopped, the processing solution is circulated along the first path P2.

[0156] In this way, in the substrate processing apparatus according to the exemplary embodiment of the present invention, the processing solution discharged from the exhaust port 665c of the filter 665 is circulated to the inlet port 665a of the filter 665, so that the contaminated processing solution discharged from the exhaust port 665c of the filter 665 is filtered again to reduce process defects caused by the processing solution, and the processing solution is reduced by reusing the processing solution. In this case, when the processing solution contains bubbles, the processing solution discharged from the exhaust port 665c of the filter 665 is discharged to the buffer tank 1030, so that the process defects are not caused by the bubbles.

[0157] As described above, the present invention has been described with reference to specific matters such as specific components, limited exemplary embodiments and drawings, but these specific matters are only used to help general understanding of the present invention, and the present invention is not limited to the aforementioned exemplary embodiments. Those skilled in the art will understand that various changes and modifications are possible based on the description.

[0158] Therefore, the spirit of the present invention should not be limited to the described exemplary embodiments, and it can be seen that not only the claims described later but also all modifications equivalent to the claims belong to the scope of the present invention.

Claims

1. A device for processing a substrate, the device comprising: A chamber having a processing space; a supporting unit, the supporting unit being used to support a substrate in the processing space; a liquid discharge unit for discharging a processing solution in a liquid form onto the substrate supported on the support unit; as well as a liquid supply unit, the liquid supply unit comprising a tank, a supply line, and a filter, the tank storing the treatment solution, the supply line connecting the tank and the liquid discharge unit, the filter installed between the tank and the supply line, Wherein, the filter comprises: an inlet port through which the treatment solution flows from the tank into the filter; an outlet port through which the treatment solution flows out from the filter to the liquid discharge unit; and an exhaust port for exhausting the liquid containing bubbles to the outside of the filter, and The liquid supply unit further includes a circulation line connected to the exhaust port of the filter and circulates the treatment solution exhausted from the exhaust port of the filter to a line connected to the inlet port of the filter.

2. The device according to claim 1, wherein: The liquid supply unit comprises: a discharge line that branches from the circulation line and discharges the processing solution discharged from the exhaust port; and A valve unit for controlling a flow path of the treatment solution so that the treatment solution discharged from the exhaust port selectively flows to the discharge line or the line connected to the inlet port.

3. The device according to claim 2, wherein: The liquid supply unit further includes a valve controller for controlling the valve unit, and The valve controller controls the valve unit so that the processing solution exhausted from the exhaust port flows to the line connected to the inlet port when processing the substrate.

4. The device according to claim 2, wherein: The liquid supply unit further includes a valve controller for controlling the valve unit, and The valve controller controls the valve unit so that the treatment solution exhausted from the exhaust port flows to the exhaust line during initial setting of the filter.

5. The device according to claim 4, wherein: The initial setup includes replacement of the filter.

6. The device according to claim 2, wherein: The liquid supply unit further comprises: a bubble detection sensor, the bubble detection sensor being used to detect bubbles in the circulation line; and a valve controller for controlling the valve unit, and The valve controller allows the processing solution exhausted from the exhaust port to flow to the exhaust line when the bubbles detected by the bubble detection sensor are equal to or greater than a set amount.

7. The device according to claim 6, wherein: The valve controller controls the valve unit so that the processing solution exhausted from the exhaust port flows to the line connected to the inlet port when the bubbles detected by the bubble detection sensor are less than the set amount.

8. The device according to claim 2, wherein: The liquid supply unit further includes a valve controller for controlling the valve unit, and The valve controller controls the valve unit so that the processing solution discharged from the exhaust port flows to the exhaust line during an initial setting of supplying the processing solution to the substrate, and then the processing solution discharged from the exhaust port flows to the line connected to the inlet port.

9. The device according to claim 2, wherein: The valve unit is a three-way valve installed at a point where the circulation line and the discharge line are connected.

10. The device according to claim 6, wherein: The bubble detection sensor is disposed between the exhaust port and the three-way valve.

11. The device according to claim 1, wherein: The liquid supply unit further comprises: a measuring line having one end connected to the outlet port of the filter; and a densitometer installed on the measuring line, and The measuring line has the other end connected to the circulation line.

12. The device according to claim 1, wherein: The filter is a membrane filter.

13. The device according to claim 1, wherein: The filter further includes a discharge port for discharging the treatment solution remaining inside thereof; and The liquid supply unit further includes a discharge valve installed in the discharge line and opening and closing a passage of the discharge line, and The discharge port is located at the bottom end of the filter, and when the discharge valve is opened, the treatment solution is discharged by falling, and The exhaust port is located at the top end of the filter, and when the treatment solution is completely filled in the filter, the treatment solution is discharged upward.

14. A method for processing a substrate, the method comprising: processing the substrate by supplying a processing solution from a tank through a filter to the substrate, wherein the treatment solution flows into the filter through an inlet port of the filter, and the treatment solution filtered from the filter is discharged from the filter through an outlet port of the filter, When the treatment solution flows from the inlet port to the outlet port, bubbles in the filter or the treatment solution containing bubbles are discharged from the filter through the exhaust port of the filter, and The treatment solution discharged from the exhaust port of the filter flows through a path selected from a first path, through which the treatment solution circulates upstream of the filter and then flows again into the inlet port of the filter, and a second path, through which the treatment solution is discharged from the exhaust port of the filter and then discharged to the outside.

15. The method according to claim 14, wherein: During processing of the substrate, the processing solution discharged from the exhaust port of the filter flows to the second path when supply of the processing solution through the filter starts, and thereafter, the processing solution discharged from the exhaust port of the filter flows to the first path.

16. The method according to claim 14, wherein: The method further comprises: detecting bubbles in the treatment solution exhausted from the exhaust port, and When the amount of bubbles detected is equal to or greater than a set value, the treatment solution discharged from the exhaust port of the filter flows to the second path, and when the amount of bubbles detected is less than the set value, the treatment solution discharged from the exhaust port of the filter flows to the first path.

17. The method according to claim 14, wherein: In a setting operation of the apparatus before supplying the treatment solution to the substrate, the treatment solution exhausted from the exhaust port of the filter flows to the second path.

18. The method according to claim 14, wherein: In a state where the treatment solution is circulated by connecting the outlet port of the filter and the inlet port of the filter through a pipeline, a densitometer is installed in the pipeline to measure the concentration of the treatment solution.

19. The method according to claim 14, wherein: The exhaust port is located at the bottom end of the filter, the exhaust port is located at the top end of the filter, and The treatment solution drops to the bottom end of the discharge port and is discharged to the second path, and when the treatment solution is completely filled in the filter, the treatment solution is discharged from the top end of the exhaust port to the first path.

20. An apparatus for processing a substrate, the apparatus comprising: A chamber having a processing space; a supporting unit, the supporting unit being used to support a substrate in the processing space; a liquid discharge unit for discharging a processing solution in a liquid form onto the substrate supported on the support unit; as well as a liquid supply unit, the liquid supply unit comprising a tank, a supply line, and a filter, the tank storing the treatment solution, the supply line connecting the tank and the liquid discharge unit, the filter installed between the tank and the supply line, Wherein, the filter comprises: an inlet port through which the treatment solution flows from the tank into the filter; an outlet port through which the treatment solution flows out from the filter to the liquid discharge unit; and an exhaust port for exhausting the liquid containing bubbles to the outside of the filter, and The liquid supply unit further comprises: a circulation line connected to the exhaust port of the filter and circulating the treatment solution discharged from the exhaust port of the filter to a line connected to the inlet port of the filter; a discharge line branched from the circulation line and discharging the treatment solution discharged from the exhaust port; a measuring line having one end connected to the outlet port of the filter and the other end connected to the circulation line; An optical densitometer, the optical densitometer being installed on the measuring pipeline; a valve unit for controlling a flow path of the treatment solution so that the treatment solution discharged from the exhaust port selectively flows to the discharge line or the line connected to the inlet port; a bubble detection sensor, the bubble detection sensor being used to detect bubbles in the circulation line; and a valve controller for controlling the valve unit, and the valve controller controls the valve unit so that the treatment solution discharged from the exhaust port flows to the exhaust line when the bubbles detected by the bubble detection sensor are equal to or greater than a set amount, and the treatment solution discharged from the exhaust port flows to the line connected to the inlet port when the bubbles detected by the bubble detection sensor are less than the set amount, and The valve controller controls the valve unit so that the processing solution discharged from the exhaust port flows to the exhaust line at the start of supplying the processing solution to the substrate, and thereafter, the processing solution discharged from the exhaust port flows to the line connected to the inlet port.

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