Semiconductor device and manufacturing method thereof

Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor device and a manufacturing method thereof.The semiconductor device comprises a manufacturing box body, a placement box door, a manufacturing groove, a limiting mechanism, a conveying mechanism and an auxiliary mechanism, supporting legs are arranged at the four corners of the lower portion of the manufacturing box body, and the manufacturing groove is formed in the manufacturing box body; a working platform is arranged in the manufacturing groove, a limiting mechanism is arranged in the working platform, a conveying mechanism driven by an air cylinder is arranged on the working platform and located on one side of the limiting mechanism, an auxiliary mechanism driven by threads is arranged on the conveying mechanism, and the auxiliary mechanism is matched with the limiting mechanism through the conveying mechanism. The conveying mechanism can convey materials, so that the stability and the accuracy of the materials in the whole processing flow are guaranteed, the problems of falling off, deviation and the like of the materials in the transportation process are avoided, the auxiliary mechanism can be adjusted according to chips required by loading, and the loading efficiency is improved. And the processing quality problem caused by inaccurate chip size or position is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and particularly to a semiconductor device and a manufacturing method thereof. Background Art

[0002] A semiconductor device is an electronic component made using the characteristics of semiconductor materials. Common semiconductor devices include diodes, transistors, integrated circuits, etc. Semiconductor devices play a crucial role in modern electronic devices. For example, various types of semiconductor devices are required in various electronic devices such as mobile phones, computers, televisions, etc.;

[0003] The process of manufacturing semiconductor devices usually includes multiple steps such as wafer growth, wafer processing, and device packaging. Wafer growth refers to the process of growing a single-crystalline silicon thin film on a single-crystalline silicon substrate under high-temperature and high-vacuum conditions through chemical vapor deposition or other methods to form a wafer. Wafer processing includes process steps such as photolithography, etching, and ion implantation, which are used to form the structure and features of the device. Finally, device packaging is to connect the processed wafer to the leads and package it into a housing for use in an actual circuit;

[0004] However, when manufacturing existing semiconductor devices, manual operation is required to convey the chips needed for loading. However, the errors that may be brought about by manual operation. Therefore, an automated loading and conveying process can improve production efficiency and accuracy, enabling the loading board to automatically and accurately stop at the specified position, improving the production efficiency and quality. However, the existing conveying device is not convenient to adjust according to the chips needed for loading, resulting in processing quality problems caused by inaccurate chip size or position. In view of this, we propose a semiconductor device and a manufacturing method thereof to solve the existing problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a semiconductor device and a manufacturing method thereof to solve the problems raised in the above background art.

[0006] To achieve the above object, the present invention provides the following technical solution: a semiconductor device manufacturing apparatus, comprising a manufacturing box body, a placement box door, a manufacturing groove, a limiting mechanism, a conveying mechanism, and an auxiliary mechanism. Support legs are provided at the four corners below the manufacturing box body, a manufacturing groove is provided inside the manufacturing box body, and a working platform is provided inside the manufacturing groove. A protective cover plate is provided at the opening of the manufacturing groove, and a hinge is provided at the connection between the protective cover plate and the manufacturing box body. A limiting mechanism is provided inside the working platform, and a conveying mechanism driven by a cylinder is provided on one side of the limiting mechanism on the working platform. A screw-driven auxiliary mechanism is provided on the conveying mechanism, and the auxiliary mechanism cooperates with the limiting mechanism through the conveying mechanism. An encapsulation device is provided inside the manufacturing groove, and the encapsulation device is located above the limiting mechanism. Grooves are provided on both side surfaces of the manufacturing box body on both sides of the limiting mechanism, and the limiting mechanism is located inside the grooves. A placement box door is provided on one side of the manufacturing box body on one side of the conveying mechanism.

[0007] Preferably, the limiting mechanism includes a conveying motor, a fixed frame, a synchronous belt, a driving wheel, a placement plate, a guiding frame, a cross bar, a rotating shaft, a first telescopic cylinder, a rotating frame, a pressing rod, a buffer spring, a limiting block, a fixed rod, and a limiting plate. Fixed frames are symmetrically provided on one side of the working platform close to the opening of the manufacturing groove, a cross bar is provided on the fixed frames, guiding frames are provided on both sides of the cross bar, a placement plate is provided below the middle of the guiding frames, a conveying motor is provided on one side of the placement plate, and a driving wheel is provided through the placement plate by the conveying motor.

[0008] Preferably, fixed rods are symmetrically provided on the guiding frames, limiting blocks are provided on the upper sides of the fixed rods, a limiting plate is movably provided on the fixed rods between the limiting blocks and the guiding frames, and a buffer spring is provided on the fixed rods between the limiting plate and the guiding frames. First telescopic cylinders are symmetrically provided on one side of the guiding frames, a rotating frame is provided on the guiding frames close to the first telescopic cylinders, a pressing rod is movably connected to the rotating frame, and one side of the pressing rod is movably connected to the output end of the first telescopic cylinder. The pressing rod cooperates with the limiting plate.

[0009] Preferably, the conveying mechanism includes a first conveying frame, a first slide rail, a first sliding block, a first rodless cylinder, a second conveying frame, a second rodless cylinder, a second slide rail, a lifting frame, a second telescopic cylinder, a second sliding block, and a third sliding block. A first conveying frame is horizontally provided on one side of the working platform on one side of the limiting mechanism, a first slide rail and a first rodless cylinder are respectively provided on both sides of the first conveying frame, and a first sliding block is slidably connected to the first slide rail and the first rodless cylinder.

[0010] Preferably, a second conveyor frame is vertically arranged on one side of the first conveyor frame of the working platform. Second slide rails and second rodless cylinders are respectively arranged on both sides of the second conveyor frame. A second sliding block is slidably connected to the second slide rails and the second rodless cylinders. A lifting frame is arranged on one side of the second sliding block. A second telescopic cylinder is arranged on the upper side of the lifting frame. The output end of the second telescopic cylinder is fixedly connected to a third sliding block. A mechanical gripper is arranged on one side of the third sliding block.

[0011] Preferably, the auxiliary mechanism includes an adjusting frame, a mounting seat, a bidirectional lead screw, a guide rod, an auxiliary blanking frame, a transmission block, a deviation rectifying frame, a stop rod, a sliding groove and a baffle. An adjusting frame is arranged between the first conveyor frame and the second conveyor frame and on the working platform. A mounting seat is arranged in the middle of the adjusting frame. Guide rods and a bidirectional lead screw are respectively arranged on both sides of the mounting seat in the adjusting frame. A driving motor is embedded on one side of the adjusting frame. The output end of the driving motor is fixedly connected to one end of the bidirectional lead screw.

[0012] Preferably, transmission blocks are movably connected to both sides of the bidirectional lead screw and the guide rod with the mounting seat as the center. The inner side of one side of the transmission block is in a threaded structure. The threads between the transmission block and the bidirectional lead screw are mutually matched. An auxiliary blanking frame is arranged on the upper side of the transmission block. A deviation rectifying frame is arranged between the auxiliary blanking frames. A guide block is arranged on one side of the auxiliary blanking frame. A stop rod is arranged between the guide blocks. A sliding groove is formed in the guide block for the stop rod. A baffle is arranged in the middle of the stop rod.

[0013] Preferably, the first sliding block, the baffle and the mechanical gripper cooperate with each other.

[0014] Preferably, a loading plate is arranged on the synchronous belt between the limiting plates on the guide frames. Placement grooves are equidistantly arranged on the loading plate.

[0015] A method for manufacturing a semiconductor device includes the following steps:

[0016] S1: Place the loading plate to be processed between the synchronous belt and the limiting plate. Start the conveyor motor to drive the driving wheel to work. The driving wheel drives the synchronous wheel and the limiting block on the fixed frame to move together through the synchronous belt;

[0017] S2: When the loading plate reaches below the encapsulation device, start the first telescopic cylinder through control. The first telescopic cylinder can drive the pressure rod to flip on the rotating frame, so that the limiting plate can be pressed and move downward. At the same time, the buffer spring plays a buffering role to ensure that the device stops at the specified position;

[0018] S3: Work by starting the drive motor inside the adjustment frame. The drive motor can drive the bidirectional lead screw to rotate on the mounting base, so as to drive the transmission blocks on both sides centered on the mounting base to move horizontally on the guide rods. Adjust according to the chips required for loading. After the adjustment is completed, place the required chips into the auxiliary blanking frame in sequence. A deviation rectifying frame is arranged in the middle of the auxiliary blanking frame to ensure the correct alignment of the target material;

[0019] S4: The first slide rail and the first rodless cylinder on the first conveyor frame are connected to the first sliding block and used to drive the first sliding block to move horizontally. At the same time, the second slide rail and the second rodless cylinder on the second conveyor frame are connected to the second sliding block and used to drive the second sliding block to move horizontally. One side of the second sliding block is connected to the lifting frame. A second telescopic cylinder is arranged on the lifting frame, and the telescopic of the second telescopic cylinder is used to control the up and down movement of the lifting frame. The third sliding block on the lifting frame is connected to the mechanical gripper and used to grip and release the target material. Control the telescopic of each cylinder, the movement of the sliding block and the up and down movement of the lifting frame to realize the conveying, positioning and gripping of the material;

[0020] S5: The conveying mechanism can pick up the target material from the auxiliary mechanism and accurately convey it to the next working process, realizing the high efficiency and reliability of automated production. After the chips are placed, the loading plate is conveyed to the next working process through the conveying motor, realizing the automated loading and conveying process, and improving production efficiency and accuracy.

[0021] Compared with the prior art, the beneficial effects of the present invention are:

[0022] 1. Place the loading plate to be processed between the synchronous belt and the limit plate, start the conveying motor to drive the driving wheel to work. The driving wheel drives the synchronous wheel and the limit block on the fixed frame to move together through the synchronous belt. When the loading plate reaches below the encapsulation equipment, control to start the first telescopic cylinder. The first telescopic cylinder can drive the pressure rod to flip on the rotating frame, so that the limit plate is pressed and moves downward. At the same time, the buffer spring plays a buffering role to ensure that the device stops at the specified position. After the chips are placed, the loading plate is conveyed to the next working process through the conveying motor, which can realize the automated loading and conveying process and improve production efficiency and accuracy.

[0023] 2. The first slide rail and the first rodless cylinder on the first conveyor frame are connected to the first sliding block and are used to drive the first sliding block to move horizontally. The second slide rail and the second rodless cylinder on the second conveyor frame are connected to the second sliding block and are used to drive the second sliding block to move horizontally. One side of the second sliding block is connected to the lifting frame. A second telescopic cylinder is arranged on the lifting frame, and the up-and-down movement of the lifting frame is controlled by the telescopic movement of the second telescopic cylinder. The third sliding block on the lifting frame is connected to the mechanical gripper and is used to grip and release the target material. The working principle of the entire conveying mechanism is to realize the conveying, positioning, and gripping of the material by controlling the telescopic movement of each cylinder, the movement of the sliding block, and the up-and-down movement of the lifting frame.

[0024] 3. Work is carried out by starting the drive motor inside the adjustment frame. The drive motor can drive the bidirectional lead screw to rotate on the mounting seat, thereby driving the two transmission blocks on both sides centered on the mounting seat to move horizontally on the guide rod, so as to be adjusted according to the chips required for loading. After the adjustment is completed, the required chips are sequentially placed in the auxiliary blanking frame. A deviation correction frame is arranged in the middle of the auxiliary blanking frame to ensure the correct alignment of the target material. When the auxiliary blanking frame adjusts the size, the stop rod can move along the direction of the sliding groove to fix the target material. The baffle is located in the middle of the stop rod to prevent the target material from accidentally sliding or falling off during the working process. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is the overall structural schematic diagram of the present invention;

[0026] Figure 2 is the side view of the limit mechanism of the present invention;

[0027] Figure 3 is Figure 2 the partial enlarged structural schematic diagram of A in;

[0028] Figure 4 is the structural schematic diagram of the placement rack of the present invention;

[0029] Figure 5 is the structural schematic diagram of the protection mechanism of the present invention;

[0030] Figure 6 is the structural schematic diagram of the auxiliary mechanism of the present invention;

[0031] Figure 7 is the structural schematic diagram of the stop rod in this auxiliary mechanism.

[0032] In the figure: 1. Production box body; 2. Support leg; 3. Placing box door; 4. Production groove; 5. Protective cover plate; 6. Encapsulation device; 7. Limiting mechanism; 701. Conveyor motor; 702. Fixed frame; 703. Synchronous belt; 704. Driving wheel; 705. Placing plate; 706. Guide frame; 707. Cross bar; 708. Rotating shaft; 709. First telescopic cylinder; 710. Rotating frame; 711. Pressing rod; 712. Buffer spring; 713. Limiting block; 714. Fixed rod; 715. Limiting plate; 716. Synchronous pulley; 8. Loading plate; 9. Conveying mechanism; 901. First conveying frame; 902. First slide rail; 903. First sliding block; 904. First rodless cylinder; 905. Second conveying frame; 906. Second rodless cylinder; 907. Second slide rail; 908. Lifting frame; 909. Second telescopic cylinder; 910. Second sliding block; 911. Third sliding block; 912. Mechanical gripper; 10. Working platform; 11. Auxiliary mechanism; 1101. Adjusting frame; 1102. Mounting seat; 1103. Bi-directional lead screw; 1104. Guide rod; 1105. Auxiliary blanking frame; 1106. Transmission block; 1107. Deviation rectifying frame; 1108. Stop bar; 1109. Sliding groove; 1110. Baffle; 1111. Guide block. Detailed implementation manners

[0033] To make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below in combination with the detailed implementation manners and with reference to the accompanying drawings. It should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present invention. In addition, in the following description, the descriptions of well-known structures and technologies are omitted to avoid unnecessarily confusing the concepts of the present invention.

[0034] As Figures 1 - 7As shown in the figure, a semiconductor device manufacturing apparatus proposed by the present invention includes a manufacturing box body 1, a placement box door 3, a manufacturing groove 4, a limiting mechanism 7, a conveying mechanism 9, and an auxiliary mechanism 11. Support legs 2 are provided at the four corners of the lower part of the manufacturing box body 1. A manufacturing groove 4 is formed in the manufacturing box body 1, and a working platform 10 is arranged in the manufacturing groove 4. A protective cover plate 5 is arranged at the notch of the manufacturing groove 4. A hinge is arranged at the connection between the protective cover plate 5 and the manufacturing box body 1. A limiting mechanism 7 is arranged in the working platform 10, and a conveying mechanism 9 driven by a cylinder is arranged on one side of the limiting mechanism 7 on the working platform 10. A threaded driving auxiliary mechanism 11 is arranged on the conveying mechanism 9. The auxiliary mechanism 11 cooperates with the limiting mechanism 7 through the conveying mechanism 9. An encapsulation device 6 is arranged in the manufacturing groove 4, and the encapsulation device 6 is located above the limiting mechanism 7. Grooves are formed on both side surfaces of the manufacturing box body 1 on both sides of the limiting mechanism 7, and the limiting mechanism 7 is located in the grooves. A placement box door 3 is arranged on one side of the manufacturing box body 1 on one side of the conveying mechanism 9. The encapsulation device 6 can load and process the loading plate 8 located inside the manufacturing groove 4. The principle and use process of this encapsulation device 6 are the same as those of the prior art and will not be described in detail here.

[0035] In an optional embodiment, the limiting mechanism 7 includes a conveying motor 701, a fixing frame 702, a synchronous belt 703, a driving wheel 704, a placement plate 705, a guiding frame 706, a cross bar 707, a rotating shaft 708, a first telescopic cylinder 709, a rotating frame 710, a pressing rod 711, a buffer spring 712, a limiting block 713, a fixing rod 714, and a limiting plate 715. Fixing frames 702 are symmetrically arranged on one side of the working platform 10 close to the notch of the manufacturing groove 4. A cross bar 707 is arranged on the fixing frame 702. Guiding frames 706 are arranged on both sides of the cross bar 707. A placement plate 705 is arranged below the middle of the guiding frame 706. A conveying motor 701 is arranged on one side of the placement plate 705. A driving wheel 704 is arranged through the placement plate 705 by the conveying motor 701. Synchronous wheels 716 are arranged at equal intervals on the guiding frame 706. The synchronous wheels 716 cooperate with the driving wheel 704 through the synchronous belt 703.

[0036] In an optional embodiment, fixing rods 714 are symmetrically arranged on the guiding frame 706. A limiting block 713 is arranged above the fixing rod 714. A limiting plate 715 is movably arranged on the fixing rod 714 between the limiting block 713 and the guiding frame 706. A buffer spring 712 is arranged on the fixing rod 714 between the limiting plate 715 and the guiding frame 706. First telescopic cylinders 709 are symmetrically arranged on one side of the guiding frame 706. A rotating frame 710 is arranged on the guiding frame 706 close to the first telescopic cylinder 709. A pressing rod 711 is movably connected to the rotating frame 710. One side of the pressing rod 711 is movably connected to the output end of the first telescopic cylinder 709. The pressing rod 711 cooperates with the limiting plate 715.

[0037] In an alternative embodiment, a loading plate 8 is disposed on the synchronous belt 703 between the limiting plate 715 and the guiding frame 706, and placing grooves are equally spaced on the loading plate 8; the loading plate 8 to be processed is placed between the synchronous belt 703 and the limiting plate 715, and the conveying motor 701 is started to drive the driving wheel 704 to work. The driving wheel 704 drives the synchronous wheel 716 and the limiting block 713 on the fixing frame 702 to move together through the synchronous belt 703. When the loading plate 8 reaches below the encapsulation device 6, the first telescopic cylinder 709 is controlled to start. The first telescopic cylinder 709 can drive the pressing rod 711 to turn on the rotating frame 710, so that the limiting plate 715 is pressed and moves downward. At the same time, the buffer spring 712 plays a buffering role to ensure that the device stops at the specified position. After the chips are placed, the loading plate 8 is conveyed to the next working process by the conveying motor 701, and an automated loading and conveying process can be realized, improving production efficiency and accuracy.

[0038] In an alternative embodiment, the conveying mechanism 9 includes a first conveying frame 901, a first slide rail 902, a first sliding block 903, a first rodless cylinder 904, a second conveying frame 905, a second rodless cylinder 906, a second slide rail 907, a lifting frame 908, a second telescopic cylinder 909, a second sliding block 910 and a third sliding block 911. The first conveying frame 901 is horizontally disposed on one side of the limiting mechanism 7 on the working platform 10. The first slide rail 902 and the first rodless cylinder 904 are respectively disposed on both sides of the first conveying frame 901, and a first sliding block 903 is slidably connected to the first slide rail 902 and the first rodless cylinder 904.

[0039] In an alternative embodiment, a second conveyor rack 905 is vertically arranged on one side of the first conveyor rack 901 of the working platform 10. Second slide rails 907 and a second rodless cylinder 906 are respectively arranged on both sides of the second conveyor rack 905. A second slider 910 is slidably connected to the second slide rails 907 and the second rodless cylinder 906. A lifting frame 908 is arranged on one side of the second slider 910. A second telescopic cylinder 909 is arranged on the upper side of the lifting frame 908. The output end of the second telescopic cylinder 909 is fixedly connected to a third slider 911. A mechanical gripper 912 is arranged on one side of the third slider 911; the first slide rail 902 and the first rodless cylinder 904 on the first conveyor rack 901 are connected to the first slider 903 and are used to drive the first slider 903 to move horizontally, while the second slide rail 907 and the second rodless cylinder 906 on the second conveyor rack 905 are connected to the second slider 910 and are used to drive the second slider 910 to move horizontally. One side of the second slider 910 is connected to the lifting frame 908. A second telescopic cylinder 909 is arranged on the lifting frame 908. The up and down movement of the lifting frame 908 is controlled by the telescopic movement of the second telescopic cylinder 909. The third slider 911 on the lifting frame 908 is connected to the mechanical gripper 912 and is used to clamp and release the target material. The working principle of the entire conveying mechanism 9 is to realize the conveying, positioning and clamping of the material by controlling the telescopic movement of each cylinder, the movement of the slider and the up and down movement of the lifting frame.

[0040] In an alternative embodiment, the auxiliary mechanism 11 includes an adjusting frame 1101, a mounting seat 1102, a bidirectional lead screw 1103, a guide rod 1104, an auxiliary blanking frame 1105, a transmission block 1106, a deviation rectifying frame 1107, a stop rod 1108, a sliding groove 1109 and a baffle 1110. The adjusting frame 1101 is arranged between the first conveyor rack 901 and the second conveyor rack 905 and on the working platform 10. A mounting seat 1102 is arranged in the middle of the adjusting frame 1101. A guide rod 1104 and a bidirectional lead screw 1103 are respectively arranged on both sides of the mounting seat 1102 in the adjusting frame 1101. A driving motor is embedded on one side of the adjusting frame 1101, and the output end of the driving motor is fixedly connected to one end of the bidirectional lead screw 1103.

[0041] In an alternative embodiment, drive blocks 1106 are movably connected to both sides of the bidirectional lead screw 1103 and the guide rod 1104 with the mounting base 1102 as the center. One side of the drive block 1106 has a threaded structure, and the threads between the drive block 1106 and the bidirectional lead screw 1103 are in mutual cooperation. An auxiliary blanking frame 1105 is provided above the drive block 1106, and a deviation rectifying frame 1107 is provided between the auxiliary blanking frames 1105. A guide block 1111 is provided on one side of the auxiliary blanking frame 1105, a stop rod 1108 is provided between the guide blocks 1111, a sliding groove 1109 is provided in the guide block 1111 for the stop rod 1108, and a baffle 1110 is provided in the middle of the stop rod 1108; By starting the drive motor inside the adjusting frame 1101 to work, the drive motor can drive the bidirectional lead screw 1103 to rotate on the mounting base 1102, thereby driving the drive blocks 1106 on both sides with the mounting base 1102 as the center to move horizontally on the guide rod 1104, so as to be adjusted according to the chips required for loading. After the adjustment is completed, the required chips are sequentially placed in the auxiliary blanking frame 1105, and a deviation rectifying frame 1107 is provided in the middle of the auxiliary blanking frame 1105 to ensure the correct alignment of the target material. When the auxiliary blanking frame 1105 adjusts the size, the stop rod 1108 can move along the direction of the sliding groove 1109 to fix the target material. The baffle 1110 is located in the middle of the stop rod 1108 to prevent the target material from accidentally sliding or falling off during the work process.

[0042] In an alternative embodiment, the first sliding block 903 cooperates with the baffle 1110 and the mechanical claw 912.

[0043] A method for manufacturing a semiconductor device includes the following steps:

[0044] S1: Place the loading plate 8 to be processed between the synchronous belt 703 and the limit plate 715, start the conveying motor 701, drive the driving wheel 704 to work, and the driving wheel 704 drives the synchronous wheel 716 and the limit block 713 on the fixed frame 702 to move together through the synchronous belt 703;

[0045] S2: When the loading plate 8 reaches below the encapsulation device 6, control and start the first telescopic cylinder 709. The first telescopic cylinder 709 can drive the pressure rod 711 to flip on the rotating frame 710, so that the limit plate 715 can be pressed and move downward. At the same time, the buffer spring 712 plays a buffering role to ensure that the device stops at the specified position;

[0046] S3: Work is carried out by starting the drive motor inside the adjustment frame 1101. The drive motor can drive the bidirectional lead screw 1103 to rotate on the mounting base 1102, so as to drive the transmission blocks 1106 on both sides centered on the mounting base 1102 to move horizontally on the guide rod 1104. Adjust according to the chips required for loading. After the adjustment is completed, place the required chips into the auxiliary blanking frame 1105 in sequence. A deviation rectifying frame 1107 is arranged in the middle of the auxiliary blanking frame 1105 to ensure the correct alignment of the target material;

[0047] S4: The first slide rail 902 and the first rodless cylinder 904 on the first conveying frame 901 are connected to the first sliding block 903 and are used to drive the first sliding block 903 to move horizontally. At the same time, the second slide rail 907 and the second rodless cylinder 906 on the second conveying frame 905 are connected to the second sliding block 910 and are used to drive the second sliding block 910 to move horizontally. One side of the second sliding block 910 is connected to the lifting frame 908. A second telescopic cylinder 909 is arranged on the lifting frame 908. The up and down movement of the lifting frame 908 is controlled by the telescopic movement of the second telescopic cylinder 909. The third sliding block 911 on the lifting frame 908 is connected to the mechanical gripper 912 and is used to grip and release the target material. By controlling the telescopic movement of each cylinder, the movement of the sliding block and the up and down movement of the lifting frame, the conveying, positioning and gripping of the material are realized;

[0048] S5: The conveying mechanism 9 can pick up the target material from the auxiliary mechanism 11 and accurately convey it to the next working process, realizing the high efficiency and reliability of automated production. After the chips are placed, the loading plate 8 is conveyed to the next working process by the conveying motor 701, realizing the automated loading and conveying process and improving the production efficiency and accuracy.

[0049] The working principle of the present invention is as follows: When using this device, first place the loading plate 8 to be processed between the synchronous belt 703 and the limit plate 715, start the conveying motor 701 to drive the driving wheel 704 to work. The driving wheel 704 drives the synchronous wheel 716 and the limit block 713 on the fixed frame 702 to move together through the synchronous belt 703. When the loading plate 8 reaches below the encapsulation device 6, control the start of the first telescopic cylinder 709. The first telescopic cylinder 709 can drive the pressure rod 711 to flip on the rotating frame 710, so that the limit plate 715 is pressed and moves downward. At the same time, the buffer spring 712 plays a buffering role to ensure that the device stops at the specified position. After the chips are placed, the loading plate 8 is conveyed to the next working process by the conveying motor 701, and the automated loading and conveying process can be realized, improving the production efficiency and accuracy;

[0050] It works by starting the drive motor inside the adjustment frame 1101. The drive motor can drive the bidirectional lead screw 1103 to rotate on the mounting base 1102, thereby driving the transmission blocks 1106 on both sides centered on the mounting base 1102 to move horizontally on the guide rod 1104, so that it can be adjusted according to the chips required for loading. After the adjustment is completed, the required chips are sequentially placed in the auxiliary blanking frame 1105. And a deviation correction frame 1107 is provided in the middle of the auxiliary blanking frame 1105 to ensure the correct alignment of the target material. And when the auxiliary blanking frame 1105 adjusts the size, the stop bar 1108 can move along the direction of the sliding groove 1109 to fix the target material. The baffle 1110 is located in the middle of the stop bar 1108 to prevent the target material from accidentally sliding or falling off during the working process;

[0051] The first slide rail 902 and the first rodless cylinder 904 on the first conveyor frame 901 are connected to the first sliding block 903 and are used to drive the first sliding block 903 to move horizontally. The second slide rail 907 and the second rodless cylinder 906 on the second conveyor frame 905 are connected to the second sliding block 910 and are used to drive the second sliding block 910 to move horizontally. One side of the second sliding block 910 is connected to the lifting frame 908. A second telescopic cylinder 909 is provided on the lifting frame 908, and the telescopic movement of the second telescopic cylinder 909 is used to control the up and down movement of the lifting frame 908. The third sliding block 911 on the lifting frame 908 is connected to the mechanical gripper 912 and is used to grip and release the target material. The working principle of the entire conveying mechanism 9 is to realize the conveying, positioning and gripping of the material by controlling the telescopic movement of each cylinder, the movement of the sliding block and the up and down movement of the lifting frame; The auxiliary mechanism 11 and the conveying mechanism 9 cooperate with each other to realize the precise processing and positioning of the target material. The auxiliary mechanism 11 can be adjusted as needed, such as adjusting the position of the auxiliary blanking frame 1105 to ensure the correct positioning and fixation of the target material; At the same time, the conveying mechanism 9 can pick up the target material from the auxiliary mechanism 11 and accurately convey it to the next working process, realizing the high efficiency and reliability of automated production.

[0052] It should be understood that the above specific embodiments of the present invention are used for illustrative explanation or interpretation of the principles of the present invention, and do not constitute a limitation to the present invention. Therefore, any modifications, equivalent replacements, improvements, etc. made without departing from the spirit and scope of the present invention shall be included within the protection scope of the present invention. In addition, the appended claims of the present invention are intended to cover all changes and modifications that fall within the scope and boundaries of the appended claims, or equivalent forms of such scope and boundaries.

Claims

1. A semiconductor device manufacturing apparatus, characterized in that: The invention comprises a production box body (1), a placing box door (3), a production slot (4), a limiting mechanism (7), a conveying mechanism (9) and an auxiliary mechanism (11), wherein the four corners below the production box body (1) are provided with supporting legs (2), a production slot (4) is provided in the production box body (1), a working platform (10) is provided in the production slot (4), a protective cover plate (5) is provided at the notch of the production slot (4), a hinge is provided at the connection between the protective cover plate (5) and the production box body (1), a limiting mechanism (7) is provided in the working platform (10), and a hinge is provided on the working platform (10) at the limit position. A cylinder-driven conveying mechanism (9) is arranged on one side of the positioning mechanism (7), and a thread-driven auxiliary mechanism (11) is arranged on the conveying mechanism (9). The auxiliary mechanism (11) cooperates with the conveying mechanism (9) and the limiting mechanism (7). A packaging device (6) is arranged in the production groove (4), and the packaging device (6) is located on the upper side of the limiting mechanism (7). Grooves are provided on both sides of the surface of the production box body (1) on both sides of the limiting mechanism (7), and the limiting mechanism (7) is located in the grooves. A box door (3) is arranged on one side of the production box body (1) on the side of the conveying mechanism (9).

2. A semiconductor device manufacturing apparatus according to claim 1, characterized in that: The limiting mechanism (7) comprises a conveying motor (701), a fixing frame (702), a synchronous belt (703), a driving wheel (704), a placing plate (705), a guide frame (706), a cross bar (707), a rotating shaft (708), a first telescopic cylinder (709), a rotating frame (710), a pressure rod (711), a buffer spring (712), a limiting block (713), a fixing rod (714) and a limiting plate (715). The fixing frame (702) is symmetrically arranged on one side of the working platform (10) near the notch of the manufacturing groove (4). ), and a cross bar (707) is arranged on the fixed frame (702), guide frames (706) are arranged on both sides of the cross bar (707), a placement plate (705) is arranged at the lower middle part of the guide frame (706), a conveying motor (701) is arranged on one side of the placement plate (705), the conveying motor (701) passes through the placement plate (705) and is provided with a driving wheel (704), synchronous wheels (716) are arranged at equal distances on the guide frame (706), and the synchronous wheel (716) and the driving wheel (704) cooperate with each other through a synchronous belt (703).

3. A semiconductor device manufacturing apparatus according to claim 2, characterized in that: A fixing rod (714) is symmetrically arranged on the guide frame (706), a limiting block (713) is arranged on the upper side of the fixing rod (714), a limiting plate (715) is movably arranged on the fixing rod (714) between the limiting block (713) and the guide frame (706), a buffer spring (712) is arranged on the fixing rod (714) between the limiting plate (715) and the guide frame (706), a first telescopic cylinder (709) is symmetrically arranged on one side of the guide frame (706), a rotating frame (710) is arranged on the side of the guide frame (706) close to the first telescopic cylinder (709), a pressure rod (711) is movably connected to the rotating frame (710), and one side of the pressure rod (711) is movably connected to the output end of the first telescopic cylinder (709), and the pressure rod (711) and the limiting plate (715) cooperate with each other.

4. A semiconductor device manufacturing apparatus according to claim 3, characterized in that: The conveying mechanism (9) comprises a first conveying frame (901), a first slide rail (902), a first sliding block (903), a first rodless cylinder (904), a second conveying frame (905), a second rodless cylinder (906), a second slide rail (907), a lifting frame (908), a second telescopic cylinder (909), a second sliding block (910) and a third sliding block (911); the first conveying frame (901) is horizontally arranged on one side of the limiting mechanism (7) on the working platform (10); the first slide rail (902) and the first rodless cylinder (904) are respectively arranged on both sides of the first conveying frame (901); and the first sliding block (903) is slidably connected to the first slide rail (902) and the first rodless cylinder (904).

5. A semiconductor device manufacturing apparatus according to claim 4, characterized in that: The working platform (10) is vertically provided with a second conveying frame (905) on one side of the first conveying frame (901); a second slide rail (907) and a second rodless cylinder (906) are respectively provided on both sides of the second conveying frame (905); a second sliding block (910) is slidably connected to the second slide rail (907) and the second rodless cylinder (906); a lifting frame (908) is provided on one side of the second sliding block (910); a second telescopic cylinder (909) is provided on the upper side of the lifting frame (908); a third sliding block (911) is fixedly connected to the output end of the second telescopic cylinder (909); a mechanical clamp (912) is provided on one side of the third sliding block (911).

6. A semiconductor device manufacturing apparatus according to claim 5, characterized in that: The auxiliary mechanism (11) comprises an adjusting frame (1101), a mounting seat (1102), a bidirectional screw rod (1103), a guide rod (1104), an auxiliary unloading frame (1105), a transmission block (1106), a deviation correction frame (1107), a blocking rod (1108), a sliding groove (1109) and a baffle (1110); the adjusting frame (1101) is arranged between the first conveying frame (901) and the second conveying frame (905) and on the working platform (10); a mounting seat (1102) is arranged in the middle of the adjusting frame (1101); the mounting seat (1102) is respectively provided with a guide rod (1104) and a bidirectional screw rod (1103) on both sides of the adjusting frame (1101); and a driving motor is embedded in one side of the adjusting frame (1101); and the output end of the driving motor is fixedly connected to one end of the bidirectional screw rod (1103).

7. A semiconductor device manufacturing apparatus according to claim 6, characterized in that: The bidirectional screw rod (1103) and the guide rod (1104) are movably connected with a transmission block (1106) on both sides with the mounting seat (1102) as the center. A threaded structure is formed inside one side of the transmission block (1106), and the threads between the transmission block (1106) and the bidirectional screw rod (1103) cooperate with each other. An auxiliary unloading frame (1105) is arranged on the upper side of the transmission block (1106), and a deviation correction frame (1107) is arranged between the auxiliary unloading frames (1105). A guide block (1111) is arranged on one side of the auxiliary unloading frame (1105), and a stop rod (1108) is arranged between the guide blocks (1111). The stop rod (1108) is provided with a sliding groove (1109) in the guide block (1111), and a baffle (1110) is arranged in the middle of the stop rod (1108).

8. A semiconductor device manufacturing apparatus according to claim 5, characterized in that: The first sliding block (903) cooperates with the baffle (1110) and the mechanical clamp (912).

9. A semiconductor device manufacturing apparatus according to claim 3, characterized in that: A loading plate (8) is provided on the synchronous belt (703) between the limiting plate (715) and the guide frame (706), and placement grooves are provided on the loading plate (8) at equal intervals.

10. A method for manufacturing a semiconductor device according to any one of claims 1 to 9, characterized in that: The steps include: S1: placing the loading plate (8) to be processed between the synchronous belt (703) and the limit plate (715), starting the conveying motor (701), driving the driving wheel (704) to work, and the driving wheel (704) drives the synchronous wheel (716) and the limit block (713) on the fixed frame (702) to move together through the synchronous belt (703); S2: When the loading plate (8) reaches below the packaging device (6), the first telescopic cylinder (709) is controlled to start, and the first telescopic cylinder (709) can drive the pressure rod (711) to flip on the rotating frame (710), so that the limit plate (715) is pressed and moves downward, and the buffer spring (712) plays a buffering role to ensure that the device stops at a specified position; S3: By starting the driving motor inside the adjustment frame (1101), the driving motor can drive the bidirectional screw rod (1103) to rotate on the mounting seat (1102), so that the transmission blocks (1106) on both sides centered on the mounting seat (1102) can be driven to move horizontally on the guide rod (1104), and the chips required for loading are adjusted. After the adjustment is completed, the required chips are placed in the auxiliary unloading frame (1105) in sequence. The middle part of the auxiliary unloading frame (1105) is provided with a correction frame (1107) to ensure the correct alignment of the target material; S4: The first slide rail (902) and the first rodless cylinder (904) on the first conveying frame (901) are connected to the first sliding block (903) for driving the first sliding block (903) to move horizontally. At the same time, the second slide rail (907) and the second rodless cylinder (906) on the second conveying frame (905) are connected to the second sliding block (910) for driving the second sliding block (910) to move horizontally. One side of the second sliding block (910) is connected to the lifting frame (908). The lifting frame (908) is provided with a second telescopic cylinder (909). The lifting frame (908) is controlled to move up and down by the extension and retraction of the second telescopic cylinder (909). The third sliding block (911) on the lifting frame (908) is connected to a mechanical clamp (912) for clamping and releasing the target material, controlling the extension and retraction of each cylinder, the movement of the sliding block and the up and down movement of the lifting frame to realize the conveying, positioning and clamping of the material. S5: The conveying mechanism (9) can clamp the target material from the auxiliary mechanism (11) and accurately convey it to the next work process, thereby realizing high efficiency and reliability of automated production. After the chip is placed, the loading plate (8) is conveyed to the next work process by the conveying motor (701), thereby realizing an automated loading and conveying process and improving production efficiency and accuracy.

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