Inverter, energy management system and control method and control device thereof

Abstract

The invention provides an inverter, an energy management system and a control method and a control device of the energy management system. The inverter comprises an inverter main body and a heat dissipation system, wherein the heat dissipation system is arranged to dissipate heat of the inverter main body; the heat dissipation system comprises a semiconductor refrigeration system and an air cooling system; the refrigeration end of the semiconductor refrigeration system is matched with the inverter main body in a heat exchange manner; the air cooling system comprises an air cooling channel arranged in the inverter body, the air cooling channel is provided with an air inlet and one or more air outlets, and the positions of the air outlets correspond to a set heating area in the inverter body so as to blow air to the set heating area. In this way, the inverter can utilize the semiconductor refrigeration system to achieve overall efficient heat dissipation, and can also utilize the air cooling system to achieve targeted heat dissipation of an internal high-heating area. Thus, external integral efficient heat dissipation is matched with internal targeted local heat dissipation, the heat dissipation efficiency of the inverter is improved, and local overheating of the inverter body is avoided.

Description

Technical Field

[0001] The present application relates to, but is not limited to, the field of inverter technology, and specifically refers to an inverter, an energy management system, and their control methods and control devices. Background Art

[0002] Currently, inverters generally adopt two heat dissipation methods: natural heat dissipation and external forced air cooling. However, overall, the heat dissipation efficiency is relatively low, and local overheating is likely to occur, affecting the normal use of the inverter. Summary of the Invention

[0003] The technical problem to be solved by the present application is to provide an inverter, an energy management system, and their control methods and control devices, which are beneficial to improving the heat dissipation efficiency of the inverter and are not prone to local overheating.

[0004] An embodiment of the present application provides an inverter, including: an inverter main body and a heat dissipation system, where the heat dissipation system is configured to dissipate heat from the inverter main body; the heat dissipation system includes a thermoelectric refrigeration system and an air cooling system; the refrigeration end of the thermoelectric refrigeration system is in heat exchange cooperation with the inverter main body; the air cooling system includes an air cooling channel provided in the inverter main body, the air cooling channel is provided with an air inlet and one or more air outlets, and the positions of the air outlets correspond to the set heat generation areas in the inverter main body to blow air to the set heat generation areas.

[0005] The inverter provided by the embodiment of the present application has two heat dissipation methods: thermoelectric refrigeration and air cooling. It can not only use the thermoelectric refrigeration system to achieve overall efficient heat dissipation of the inverter main body, but also use the air cooling system to achieve targeted heat dissipation of the internal high heat generation areas, avoiding serious local heating of the inverter main body and resulting in failures. In this way, the external overall efficient heat dissipation is combined with the internal targeted local heat dissipation, which is beneficial to improving the heat dissipation efficiency of the inverter, and is beneficial to avoiding local overheating of the inverter main body, thereby being beneficial to improving the temperature uniformity of the inverter main body and being beneficial to the high-load operation of the inverter in harsh environments such as high temperatures.

[0006] An embodiment of the present application further provides an energy management system, which is characterized by including the inverter according to any one of the above embodiments.

[0007] An embodiment of the present application further provides a control method for the energy management system according to the above embodiment, and the control method includes:

[0008] Obtaining the operating parameters of the inverter;

[0009] Controlling the heat dissipation system and / or the inverter main body according to the operating parameters of the inverter.

[0010] An embodiment of the present application further provides a control device, including a processor and a memory storing a computer program. When the processor executes the computer program, the steps of the control method described in any one of the above embodiments are implemented. Description of the Drawings

[0011] Figure 1 It is a schematic diagram of the cooperation structure between an inverter and an air conditioner provided by some embodiments of the present application;

[0012] Figure 2 It is a schematic diagram of the internal structure of an inverter provided by some embodiments of the present application;

[0013] Figure 3 For Figure 2 It is a schematic rear view structure diagram of the shown inverter;

[0014] Figure 4 For Figure 2 It is a schematic partial sectional view structure diagram of the shown inverter;

[0015] Figure 5 It is a schematic three-dimensional structure diagram of an air outlet nozzle provided by some embodiments of the present application;

[0016] Figure 6 It is a schematic flowchart of a control method provided by some embodiments of the present application;

[0017] Figure 7 It is a schematic diagram of the control principle of an inverter provided by some embodiments of the present application.

[0018] In the drawings, the list of components represented by each reference numeral is as follows:

[0019] 1 Inverter main body, 11 High-voltage IGBT area, 12 Low-voltage IGBT area, 13 Inductor area, 15 Air-cooling channel, 151 First air inlet, 152 Second air inlet, 153 Air outlet, 154 Sub-channel, 16 Air outlet nozzle, 161 Connector head, 162 Air guide cone, 1621 Air inlet hole, 1622 Air guide slit, 163 Connecting arm, 17 Central control unit, 18 Air permeable valve, 19 Communication line;

[0020] 2 Semiconductor refrigeration system, 21 Heat absorption plate, 211 First outer shell, 212 First partition rib, 213 First air flow channel, 22 Semiconductor refrigeration plate, 23 Heat dissipation plate, 231 Second outer shell, 232 Second partition rib, 233 Second air flow channel, 24 Cold air channel, 25 Hot air channel;

[0021] 3 Air supply system;

[0022] 41 Four-way valve, 42 Five-way valve, 43 Two-way valve;

[0023] 5 Air conditioner. Detailed Embodiments

[0024] The principles and features of the present application will be described below in conjunction with the accompanying drawings. The examples given are only for explaining the present application and are not intended to limit the scope of the present application.

[0025] As Figures 1 to 4 shown, an embodiment of the present application provides an inverter, including: an inverter main body 1 and a heat dissipation system. The heat dissipation system is configured to dissipate heat from the inverter main body 1. The heat dissipation system includes a semiconductor refrigeration system 2 and an air-cooling system.

[0026] The refrigeration end of the semiconductor refrigeration system 2 is in heat exchange cooperation with the inverter main body 1. When the semiconductor refrigeration system 2 is started, the refrigeration end cools down, and the heat generated by the inverter main body 1 can be conducted to the heating end, realizing heat dissipation of the inverter main body 1. The refrigeration end of the semiconductor refrigeration system 2 can be in direct contact with the inverter main body 1, or there can be a heat-conducting medium between the refrigeration end and the inverter main body 1, as long as heat exchange (i.e., heat exchange cooperation) can be achieved. The semiconductor refrigeration system 2 can be located outside the inverter main body 1 and fixedly connected to the inverter main body 1 to realize overall heat dissipation of the inverter main body 1. The inverter main body 1 can include a radiator, and the semiconductor refrigeration system 2 is in heat exchange cooperation with the radiator. The radiator can include structures such as a heat dissipation substrate and heat dissipation fins. The heat generated by the heating elements of the inverter main body 1 can be transferred to the radiator, and the heat of the radiator can be quickly taken away by the semiconductor refrigeration system 2.

[0027] The air-cooling system includes an air-cooling channel 15 provided in the inverter main body 1. The air-cooling channel 15 is provided with an air inlet and one or more openable and closable air outlets 153. The position of the air outlet 153 corresponds to a set heat-generating area in the inverter main body 1 to blow air to the set heat-generating area. The set heat-generating area can be a high heat-generating area in the inverter main body 1, such as the area where the high-voltage IGBT (Insulated Gate Bipolar Transistor) is located, the area where the low-voltage IGBT is located, and the area where the inductor is located. In this way, the air-cooling channel 15 can supply air to the high heat-generating areas in the inverter main body 1 to realize targeted heat dissipation of the high heat-generating areas in the inverter main body 1.

[0028] In the related art, natural heat dissipation and external forced air-cooling heat dissipation are both for overall heat dissipation of the inverter and cannot perform targeted heat dissipation on the high-heat areas inside the inverter, and local overheating is likely to occur.

[0029] The inverter provided by the embodiment of the present application has two heat dissipation methods, namely semiconductor refrigeration and air cooling. It can not only use the semiconductor refrigeration system 2 to achieve overall efficient heat dissipation of the inverter main body 1, but also use the air cooling system to achieve targeted heat dissipation of the internal high-heat generation areas, avoiding faults caused by serious local heating of the inverter main body 1. In this way, the overall external efficient heat dissipation is combined with the internal targeted local heat dissipation, which is beneficial to improving the heat dissipation efficiency of the inverter, avoiding local overheating of the inverter main body 1, thus being beneficial to improving the temperature uniformity of the inverter main body 1 and facilitating the high-load operation of the inverter in harsh environments such as high temperature.

[0030] Among them, the position and number of the air outlets 153 of the air cooling channel 15 are not limited and can be reasonably determined according to the position, number and size of the high-heat generation areas in the inverter main body 1. The air cooling channel 15 can include a plurality of sub-channels 154 to facilitate air cooling of different high-heat generation areas. The on-off and flow rate of each of the plurality of sub-channels 154 can be controlled by a control valve assembly to facilitate intelligent distribution of the air volume of different high-heat generation areas.

[0031] In one example, as Figure 2 shown, the inverter main body 1 includes three high-heat generation areas, namely the high-voltage IGBT area 11, the low-voltage IGBT area 12 and the inductor area 13, because the high-voltage IGBT, low-voltage IGBT and inductor generate relatively serious heat. Correspondingly, the air cooling channel 15 includes three parallel sub-channels 154. The first sub-channel 154 passes through the high-voltage IGBT area 11, and an air outlet 153 is provided in the high-voltage IGBT area 11; the second sub-channel 154 passes through the low-voltage IGBT area 12, and an air outlet 153 is provided in the low-voltage IGBT area 12; the third sub-channel 154 passes through the inductor area 13, and two air outlets 153 are provided in the inductor area 13 (because the inductor area 13 is larger than the high-voltage IGBT area 11 and the low-voltage IGBT area 12).

[0032] In some exemplary embodiments, as Figures 1 to 3 shown, the inverter further includes a air supply system 3 and a control valve assembly. The air supply system 3 can be fixed to the inverter main body 1. The air supply system 3 can be but is not limited to a fan system. The fan system can include structures such as a fan body, a housing, a valve and related pipelines. The control valve assembly can include a plurality of control valves. The control valves can have both on-off functions and flow rate adjustment functions.

[0033] As Figure 1 and Figure 2As shown, the air inlet includes a first air inlet 151 and a second air inlet 152. The first air inlet 151 is connected to the air supply system 3 and is configured to supply natural air to the air-cooling channel 15. The second air inlet 152 is configured to communicate with the air duct of the air conditioner 5 to supply the cold air formed by the refrigeration of the air conditioner 5 to the air-cooling channel 15.

[0034] The control valve assembly is configured to: control the on / off of the connection between the first air inlet 151 and the air supply system 3, and control the on / off of the connection between the second air inlet 152 and the air duct of the air conditioner 5.

[0035] In this way, when the first air inlet 151 is connected to the air supply system 3 and the air supply system 3 is started, the air supply system 3 can send the outside air into the air-cooling channel 15, so that the air outlet 153 can blow natural air to the high-heat generation area in the inverter main body 1, and use the natural air to dissipate heat from the high-heat generation area. Thus, the air-cooling system is equivalent to including a natural air-cooling subsystem, and the natural air-cooling subsystem can meet the targeted heat dissipation requirements of the internal high-heat generation area when the inverter main body 1 does not generate much heat.

[0036] When the second air inlet 152 is connected to the air duct of the air conditioner 5 and the air conditioner 5 is operating in a refrigeration mode, the air outlet 153 can blow the cold air formed by the refrigeration of the air conditioner 5 to the high-heat generation area in the inverter main body 1, and use the cold air formed by the refrigeration of the air conditioner 5 to dissipate heat from the high-heat generation area. The temperature of the cold air formed by the refrigeration of the air conditioner 5 is lower than that of the natural air, so the heat dissipation efficiency is higher. Thus, the air-cooling system is equivalent to including a cold air-cooling subsystem, and the cold air-cooling subsystem can meet the targeted heat dissipation requirements of the internal high-heat generation area when the inverter main body 1 generates relatively serious heat.

[0037] Among them, the first air inlet 151 and the air supply system 3 can be connected by a pipeline provided with a first control valve, or can be directly connected by the first control valve, and the first control valve can control the on / off between the first air inlet 151 and the air supply system 3.

[0038] The second air inlet 152 and the air duct of the air conditioner 5 can be connected by a pipeline provided with a second control valve (which can be configured in the form of an air duct to improve the air supply efficiency), or can be directly connected by the second control valve, and the second control valve can control the on / off between the second air inlet 152 and the air duct of the air conditioner 5.

[0039] The air duct of the air conditioner 5 connected to the second air inlet 152 can refer to the air duct where the indoor heat exchanger is located. The type of the air conditioner 5 is not limited. For example: it can be a ducted air conditioner, or a non-ducted air conditioner; it can be a split air conditioner, or an integrated air conditioner; it can be a floor-standing air conditioner, or a wall-mounted air conditioner or a ceiling-mounted air conditioner.

[0040] In some exemplary embodiments, the inverter further includes a cold air channel 24 and a hot air channel 25, asFigures 1 to 3 as shown

[0041] One end of the cold air duct 24 is matched with the refrigerating end of the semiconductor refrigeration system 2, and the other end is arranged to be communicable with the air duct of the air conditioner 5, so as to convey the cold air formed by the refrigeration of the refrigerating end to the air duct of the air conditioner 5. The temperature of the cold air is not limited, as long as it is the air formed by the refrigeration of the refrigerating end of the semiconductor refrigeration system 2. The cold air duct 24 can cooperate with the aforementioned air supply system 3 to form flowing air under the drive of the air supply system 3. Of course, the cold air can also be sucked into the air duct by the blower of the air conditioner 5.

[0042] One end of the hot air duct 25 is matched with the heating end of the semiconductor refrigeration system 2, and the other end is arranged to be communicable with the air duct of the air conditioner 5, so as to convey the hot air formed by the heating of the heating end to the air duct of the air conditioner 5. The temperature of the hot air is not limited, as long as it is the air formed by the heating of the heating end of the semiconductor refrigeration system 2. The hot air duct 25 can cooperate with the aforementioned air supply system 3 to form flowing air under the drive of the air supply system 3. Of course, the hot air can also be sucked into the air duct by the blower of the air conditioner 5.

[0043] The control valve assembly is also arranged to: control the on-off of the cold air duct 24 and the air duct of the air conditioner 5, and control the on-off of the hot air duct 25 and the air duct of the air conditioner 5.

[0044] In this way, when the control valve assembly connects the cold air duct 24 and the air duct of the air conditioner 5 and starts the semiconductor refrigeration system 2, the inverter can also convey cold air to the air duct of the air conditioner 5 through the cold air duct 24, and the air duct of the air conditioner 5 sends the cold air into the room, so that the room can be cooled to meet the cooling requirements of the room.

[0045] When the control valve assembly connects the hot air duct 25 and the air duct of the air conditioner 5 and starts the semiconductor refrigeration system 2, the inverter can also convey hot air to the air duct of the air conditioner 5 through the hot air duct 25, and the air duct of the air conditioner 5 sends the hot air into the room, so that the room can be heated to meet the heating requirements of the room.

[0046] When starting the semiconductor refrigeration system 2 to dissipate heat from the inverter main body 1, the hot air duct 25 can be connected to the air duct of the air conditioner 5, so that the heat released by the semiconductor refrigeration system 2 can be used for heating the room. This is beneficial to reducing the dissipated heat and improving the energy utilization rate.

[0047] Among them, the cold air duct 24 and the air duct of the air conditioner 5 can be connected through a pipeline provided with a third control valve (which can be set in the form of an air duct to improve the air supply efficiency), or directly connected through the third control valve, and the third control valve can control the on-off between the cold air duct 24 and the air duct of the air conditioner 5.

[0048] The hot air duct 25 can be connected to the air duct of the air conditioner 5 through a pipeline provided with a fourth control valve (which can be set in the form of an air duct to improve the air supply efficiency), or directly connected through the fourth control valve. The fourth control valve can control the on-off between the hot air duct 25 and the air duct of the air conditioner 5.

[0049] The second control valve, the third control valve, and the fourth control valve can be separately arranged, or two of them can be integrated into one control valve (such as a three-way valve, a four-way valve 41, etc.), or all three can be integrated into one control valve (such as a four-way valve 41, a five-way valve 42, etc.). This is beneficial for reducing the number of control valves and can also share the pipeline connected to the air duct of the air conditioner 5, thus facilitating the simplification of the structure and reducing the cost.

[0050] In one example, as Figures 1 to 3 shown, the control valve assembly includes: two four-way valves 41, one five-way valve 42, and three two-way valves 43. One of the four ports of one four-way valve 41 is respectively connected to one end of the three sub-channels 154 of the air-cooling channel 15 and the first air inlet 151, and the four ports of the other four-way valve 41 are respectively connected to the other end of the three sub-channels 154 of the air-cooling channel 15 and the second air inlet 152. The air supply system 3 has three air outlets, and the three air outlets are respectively used for supplying air to the air-cooling channel 15, the cold air duct 24, and the hot air duct 25. The three two-way valves respectively control the on-off of the three air outlets of the air supply system 3. Four of the ports of the five-way valve 42 are respectively connected to the second air inlet 152, the cold air duct 24, the hot air duct 25, and the air duct of the air conditioner 5.

[0051] Of course, those skilled in the art can reasonably adjust the number and position of the control valves according to the requirements of the flow path, and no further examples will be given here.

[0052] In some exemplary embodiments, the semiconductor refrigeration system 2 includes: a heat absorption plate 21, a semiconductor refrigeration plate 22, and a heat dissipation plate 23 that are sequentially stacked, as Figure 1 and Figure 4 shown.

[0053] One side plate surface of the heat absorption plate 21 is in heat exchange cooperation with the inverter main body 1, the other side plate surface of the heat absorption plate 21 is in heat exchange cooperation with the cold surface of the semiconductor refrigeration plate 22, and the hot surface of the semiconductor refrigeration plate 22 is in heat exchange cooperation with one side plate surface of the heat dissipation plate 23. Therefore, the heat absorption plate 21 forms the refrigeration end of the semiconductor refrigeration system 2, and the heat dissipation plate 23 forms the heating end of the semiconductor refrigeration system 2.

[0054] Among them, after the semiconductor refrigeration plate 22 is powered on, one side plate surface forms a cold surface, and the other side plate surface forms a hot surface. The heat absorption plate 21 contacts the cold surface, the temperature decreases, and it can exchange heat with the inverter main body 1 to absorb the heat of the inverter main body 1, so that the temperature of the inverter main body 1 decreases. The absorbed heat can be conducted to the hot surface and then released through the heat dissipation plate 23.

[0055] The heat absorption plate 21 can be in direct contact with the inverter body 1, or there can be a heat-conducting medium between the heat absorption plate 21 and the inverter body 1, as long as heat exchange (i.e., heat transfer cooperation) can be achieved. Similarly, between the heat absorption plate 21 and the semiconductor refrigeration plate 22, and between the semiconductor refrigeration plate 22 and the heat dissipation plate 23, they can be in direct contact or there can be a heat-conducting medium, as long as heat exchange (i.e., heat transfer cooperation) can be achieved.

[0056] In one example, the heat absorption plate 21, the semiconductor refrigeration plate 22, and the heat dissipation plate 23 are fixedly connected to ensure the stability and reliability of the semiconductor refrigeration system 2. The fixing method is not limited and can be connection by fasteners, welding, snap connection, etc.

[0057] In some exemplary embodiments, a first air flow channel 213 is provided in the heat absorption plate 21, and a second air flow channel 233 is provided in the heat dissipation plate 23, as Figure 4 shown.

[0058] The air inlet end of the first air flow channel 213 is arranged to be connected to the air supply system 3, and the air outlet end is arranged to be able to communicate with the air duct of the air conditioner 5 to deliver cold air to the air duct of the air conditioner 5. The air outlet end of the first air flow channel 213 can communicate with the air duct of the air conditioner 5 through the cold air channel 24. In this solution, the air supply system 3 can be combined with the air supply system 3 that delivers natural wind to the air-cooled channel 15, or can be separately arranged.

[0059] The air inlet end of the second air flow channel 233 is arranged to be connected to the air supply system 3, and the air outlet end is arranged to be able to communicate with the air duct of the air conditioner 5 to deliver hot air to the air duct of the air conditioner 5. The air outlet end of the second air flow channel 233 can communicate with the air duct of the air conditioner 5 through the hot air channel 25. In this solution, the air supply system 3 can be combined with the air supply system 3 that delivers natural wind to the air-cooled channel 15, or can be separately arranged. The first air flow channel 213 and the second air flow channel 233 can share the air supply system 3 or not share the air supply system 3.

[0060] Providing air flow channels in the heat absorption plate 21 and the heat dissipation plate 23 is beneficial for the air to fully absorb the cold of the heat absorption plate 21 / the heat of the heat dissipation plate 23, thereby being beneficial for improving the temperature regulation efficiency when the semiconductor refrigeration system 2 regulates the temperature of the room.

[0061] In some exemplary embodiments, as Figure 4 shown, the heat absorption plate 21 includes a first outer shell 211 with openings at both ends and a plurality of first partition ribs 212 arranged in parallel and provided in the first outer shell 211. The first outer shell 211 and the plurality of first partition ribs 212 enclose a plurality of first air flow channels 213. This can ensure the ventilation of the heat absorption plate 21 while ensuring the heat absorption efficiency. Exemplarily, the heat absorption plate 21 can be a hollow aluminum plate and can be produced by an extrusion molding process.

[0062] In some exemplary embodiments, Figure 4 As shown, the heat sink 23 includes a second shell 231 with openings at both ends and a plurality of second partition ribs 232 arranged in a wave shape in the second shell 231. The second shell 231 and the plurality of second partition ribs 232 enclose a plurality of second air flow channels 233. This is conducive to increasing the heat dissipation area of ​​the heat sink 23, thereby improving the heat dissipation efficiency. For example, the interior of the heat sink 23 may be a corrugated aluminum sheet. The heat sink 23 may be produced by a brazing process.

[0063] In some exemplary embodiments, the air cooling system further includes an air outlet nozzle 16 disposed at the air outlet 153, such as Figure 5 As shown. The air outlet nozzle 16 includes a joint part and an air guide part connected to the joint part. The joint part is connected to the air outlet 153, and the air guide part is connected to the joint part, and is configured to disperse and spray the airflow output by the joint part. The air guide part can be connected to the joint part through a connecting arm 163.

[0064] This is beneficial to improving the uniformity of air blowing from the air outlet 153 to the corresponding high-heat-generating area, thereby helping to improve the temperature uniformity of the high-heat-generating area in the inverter body 1 .

[0065] In some embodiments, Figure 5 As shown, the air guide portion includes an air guide cone 162. The cross-sectional area of ​​the air guide cone 162 gradually increases in the direction away from the joint portion. An air inlet hole 1621 is provided at one end of the air guide cone 162 close to the joint portion (i.e., the small end). The air inlet hole 1621 is arranged relatively spaced apart from the joint portion. The air guide cone 162 is provided with a plurality of guide slits 1622 along the circumferential direction. The guide slits 1622 penetrate the end of the air guide cone 162 away from the joint portion (i.e., the large end). The plurality of guide slits 1622 can be evenly spaced apart along the circumference of the air guide cone 162, so that the shape of the air guide cone 162 is similar to an umbrella-like structure.

[0066] In this way, part of the airflow blown out of the joint part can enter the air guide cone 162 through the air inlet hole 1621, and then be discharged along the air guide cone 162 from the large end of the air guide cone 162 and the guide slit 1622; another part of the airflow can directly flow along the outer wall of the air guide cone 162 and spray toward the high-heating area. In this way, the air outlet nozzle 16 can blow more evenly toward the high-heating area, thereby achieving uniform heat dissipation.

[0067] Of course, the shape of the air outlet nozzle is not limited thereto, for example, it may also be in the form of a nozzle similar to a shower structure or capable of rotating.

[0068] In some exemplary embodiments, the inverter body 1 is provided with a vent valve 18, such as Figure 4As shown, the gas sent into the inverter body 1 by the air cooling channel 15 can be discharged through the breathable valve 18. The breathable valve 18 can be a large flow breathable valve 18.

[0069] The embodiment of the present application further provides an energy management system, including an inverter as described in any one of the above embodiments, and thus has all the above beneficial effects, which will not be repeated here.

[0070] In some exemplary embodiments, the energy management system further includes an air conditioner, which is configured to be controllable in linkage with the inverter.

[0071] The present application also provides a control method for an energy management system as in any of the above embodiments. Figure 6 As shown, the control method includes:

[0072] Step S202: obtaining operating parameters of the inverter;

[0073] Step S204: controlling the heat dissipation system and / or the inverter body 1 according to the operating parameters of the inverter.

[0074] The control method provided in the embodiment of the present application can obtain the operating parameters of the inverter and control the heat dissipation system and / or the inverter body 1 according to the operating parameters of the inverter, which is beneficial to avoid overheating of the inverter body 1, thereby helping to improve the reliability of the inverter and extend the service life of the inverter.

[0075] In some exemplary embodiments, controlling the heat dissipation system and / or the inverter body 1 according to the operating parameters of the inverter includes:

[0076] Determining the heat dissipation requirement level of the inverter body 1 according to the operating parameters of the inverter;

[0077] The heat dissipation system and / or the inverter main body 1 is controlled according to the heat dissipation requirement level of the inverter main body 1 .

[0078] First determine the heat dissipation requirement level of the inverter body 1, and then control the heat dissipation system and / or the inverter body 1 according to the heat dissipation requirement level, which is conducive to adopting an appropriate method to cope with different working conditions, so as to achieve the purpose of taking into account the heat dissipation and operation requirements of the inverter and being green and energy-saving.

[0079] In some exemplary embodiments, the operating parameters include the operating power of the inverter (which may be recorded as P0), and determining the heat dissipation requirement level of the inverter body 1 according to the operating parameters of the inverter includes:

[0080] Based on the operating power of the inverter being less than or equal to the first set power, determining that the heat dissipation requirement level of the inverter body 1 is zero level;

[0081] Based on the operating power of the inverter main body 1 being greater than the first set power and less than or equal to the second set power, it is determined that the heat dissipation requirement level of the inverter main body 1 is low;

[0082] Based on the operating power of the inverter main body 1 being greater than the second set power, it is determined that the heat dissipation requirement level of the inverter main body 1 is high.

[0083] Among them, the first set power is less than the second set power. The first set power can be the low operating power of the inverter, which can be denoted as P1. The second set power can be the high operating power within the rated power range of the inverter, which can be denoted as P2.

[0084] Of course, the heat dissipation requirement level of the inverter main body 1 is not limited to the above three levels, and can also be two levels, four levels or more levels. The operating parameters are not limited to the operating power, and can also include parameters such as working temperature and working duration. The determination method of the heat dissipation requirement level of the inverter main body 1 is not limited to the above scheme. For example, the operating load of the inverter can also be determined by the temperature of the inverter main body 1 and / or the ambient temperature. When the inverter operates at a low load, the heat dissipation requirement level is zero; when it operates at a medium load, the heat dissipation requirement level is low; when it operates at a high load, the heat dissipation requirement level is high.

[0085] In some exemplary embodiments, the heat dissipation requirement level includes: zero level.

[0086] The control method further includes: based on the heat dissipation requirement level of the inverter main body 1 being zero, determining whether there is a temperature adjustment requirement in the room.

[0087] It can be determined according to whether the indoor temperature is within the set temperature range. For example: when the indoor temperature is lower than the lower limit value of the set temperature range, it is determined that there is a temperature adjustment requirement in the room and the temperature adjustment requirement is a heating requirement. When the indoor temperature is higher than the upper limit value of the set temperature range, it is determined that there is a temperature adjustment requirement in the room and the temperature adjustment requirement is a cooling requirement. The indoor temperature can be obtained through a temperature sensor provided in the air conditioner 5 for detecting the indoor temperature.

[0088] Alternatively, it can also be determined according to the status of the air conditioner 5. For example: when the air conditioner 5 operates in the heating mode, it is determined that there is a temperature adjustment requirement in the room as a heating requirement; when the air conditioner 5 operates in the cooling mode, it is determined that there is a temperature adjustment requirement in the room as a cooling requirement.

[0089] In some embodiments, controlling the heat dissipation system according to the heat dissipation requirement level of the inverter main body 1 includes:

[0090] Based on the heat dissipation requirement level of the inverter main body 1 being zero level, it is determined that there is a temperature regulation requirement in the room and the temperature regulation requirement is a cooling requirement. Then, control the control valve assembly of the inverter to connect the air supply system 3 with the cold air channel 24 of the inverter and connect the cold air channel 24 with the air duct of the air conditioner 5, and start the semiconductor refrigeration system 2 and the air supply system 3 to deliver cold air to the air duct of the air conditioner 5, so as to deliver cold air to the room through the air conditioner 5;

[0091] Based on the heat dissipation requirement level of the inverter main body 1 being zero level, it is determined that there is a temperature regulation requirement in the room and the temperature regulation requirement is a heating requirement. Then, control the control valve assembly of the inverter to connect the air supply system 3 with the hot air channel 25 of the inverter and connect the hot air channel 25 with the air duct of the air conditioner 5, and start the semiconductor refrigeration system 2 and the air supply system 3 to deliver hot air to the air duct of the air conditioner 5, so as to deliver hot air to the room through the air conditioner 5.

[0092] When the heat dissipation requirement level of the inverter main body 1 is zero level, it indicates that the inverter main body 1 has no heat dissipation requirement. Therefore, there is no need to dissipate heat for the inverter main body 1 through the heat dissipation system. At this time, the semiconductor refrigeration system 2 of the heat dissipation system is idle and can be used to regulate the temperature of the indoor space. Therefore, it is judged whether there is a temperature regulation requirement in the room. When there is a temperature regulation requirement in the room and the room needs to be cooled down, cold air is provided by the semiconductor refrigeration system 2 and delivered to the room through the air duct of the air conditioner 5 to achieve cooling of the room; when there is a temperature regulation requirement in the room and the room needs to be heated up, hot air is provided by the semiconductor refrigeration system 2 and delivered to the room through the air duct of the air conditioner 5 to achieve heating of the room.

[0093] Among them, the cold air / hot air delivered to the air conditioner 5 by starting the semiconductor refrigeration system 2 and the air supply system 3 can be delivered when the air conditioner 5 is just started for precooling / preheating, or can be delivered during the operation of the air conditioner 5 to reduce the load of the air conditioner 5 itself.

[0094] In some exemplary embodiments, the heat dissipation requirement level includes: low level.

[0095] Controlling the heat dissipation system according to the heat dissipation requirement level of the inverter main body 1 includes:

[0096] Based on the heat dissipation requirement level of the inverter main body 1 being low level, control the control valve assembly of the inverter to connect the air supply system 3 of the inverter with the first air inlet 151, and start the semiconductor refrigeration system 2 and the air supply system 3 to dissipate heat for the inverter main body 1.

[0097] When the heat dissipation requirement level of the inverter main body 1 is low, it indicates that the inverter main body 1 has a heat dissipation requirement, but the heat dissipation requirement is relatively low. Therefore, only the semiconductor refrigeration system 2 is needed to dissipate the heat of the inverter main body 1 as a whole, and combined with the natural wind air cooling subsystem to dissipate the heat of the high-heat generation area in the inverter main body 1 specifically, so as to ensure the internal temperature balance of the inverter main body 1, meet the heat dissipation requirement of the inverter main body 1, and enable the inverter main body 1 to quickly cool down to the appropriate operating temperature range. Based on the temperature of the inverter main body 1 being reduced to the set operating temperature range, the heat dissipation system is turned off.

[0098] In some exemplary embodiments, the heat dissipation requirement level includes: high level.

[0099] The control method further includes:

[0100] Based on the heat dissipation requirement level of the inverter main body 1 being high, obtain the status information of the air conditioner 5 (the status information of the air conditioner 5 can be obtained through communication with the air conditioner 5);

[0101] According to the status information of the air conditioner 5, determine that the air conditioner 5 is in a non-heating mode, and control the air conditioner 5 to operate refrigeration to send air to the air cooling channel 15 of the inverter.

[0102] Controlling the heat dissipation system and / or the inverter main body 1 according to the heat dissipation requirement level of the inverter main body 1 includes:

[0103] Based on the heat dissipation requirement level of the inverter main body 1 being high, and according to the status information of the air conditioner 5, determine that the air conditioner 5 is in a non-heating mode, then control the control valve assembly of the inverter to connect the air duct of the air conditioner 5 with the second air inlet 152, and start the semiconductor refrigeration system 2 to dissipate the heat of the inverter main body 1;

[0104] Based on the heat dissipation requirement level of the inverter main body 1 being high, and according to the status information of the air conditioner 5, determine that the air conditioner 5 is in a heating mode, and control the inverter main body 1 to derate operation.

[0105] When the heat dissipation requirement level of the inverter main body 1 is high, it indicates that the inverter main body 1 has a heat dissipation requirement, and the heat dissipation requirement is relatively high. Simply through the semiconductor refrigeration system 2 and the natural wind air cooling subsystem, it is not enough to meet the heat dissipation requirement of the inverter main body 1. At this time, obtain the status information of the air conditioner 5, and determine the coping strategy according to the status information of the air conditioner 5.

[0106] When the air conditioner 5 is in a non-heating mode, such as in a cooling mode or a non-operating state, the thermoelectric cooling system 2 can be used to dissipate heat from the inverter main body 1 as a whole, and in combination with the cold air air-cooling subsystem, targeted heat dissipation can be carried out on the high-heat-generation areas inside the inverter main body 1 to meet the heat dissipation requirements of the inverter main body 1, enabling the inverter main body 1 to quickly cool down to a suitable operating temperature range, which is beneficial for the inverter to operate overload in high-temperature weather such as midsummer. Based on the temperature of the inverter main body 1 dropping to within the set operating temperature range, the heat dissipation system is turned off. Among them, when the air conditioner 5 is in the cooling mode, the air conditioner 5 is controlled to maintain cooling operation; when the air conditioner 5 is in the non-operating state, the air conditioner 5 is started and controlled to operate in the cooling mode.

[0107] When the air conditioner 5 is in the heating mode, the air conditioner 5 cannot deliver cold air to the air-cooling channel 15 inside the inverter main body 1, resulting in the inability to enable the cold air air-cooling subsystem. Therefore, the inverter is controlled to derate its operation to reduce the heat generation of the inverter main body 1, enabling the inverter main body 1 to quickly cool down to a suitable operating temperature range.

[0108] In one embodiment, controlling the heat dissipation system and / or the inverter main body 1 according to the heat dissipation requirement level of the inverter main body 1 further includes:

[0109] Based on the heat dissipation requirement level of the inverter main body 1 being high, and determining that the air conditioner 5 is in a non-heating mode according to the status information of the air conditioner 5, an instruction to operate in the cooling mode is sent to the air conditioner 5 to make the air conditioner 5 operate in the cooling mode.

[0110] Controlling the air conditioner 5 to operate in the cooling mode to supply air to the air-cooling channel 15 of the inverter includes: in response to the instruction to operate in the cooling mode sent by the inverter, controlling the air conditioner 5 to operate in the cooling mode to supply air to the air-cooling channel 15 of the inverter.

[0111] In other words, when the heat dissipation requirement level of the inverter main body 1 is high and the air conditioner 5 is in a non-heating mode, the operation of the air conditioner 5 to operate in the cooling mode can be actively carried out by the air conditioner based on the above information (the heat dissipation requirement level is high and the air conditioner 5 is in a non-heating mode) to perform targeted heat dissipation on the high-heat-generation areas inside the inverter main body 1, or it can be passively carried out after the air conditioner receives the instruction to operate in the cooling mode sent by the inverter based on the above information to perform targeted heat dissipation on the high-heat-generation areas inside the inverter main body 1.

[0112] In one example, controlling the heat dissipation system and / or the inverter main body 1 according to the heat dissipation requirement level of the inverter main body 1 further includes: based on the heat dissipation requirement level of the inverter main body 1 being high and the air conditioner 5 being in the heating mode, controlling the control valve assembly of the inverter to connect the air supply system 3 with the first air inlet 151, and starting the thermoelectric cooling system 2 and the air supply system 3 to dissipate heat from the inverter main body 1.

[0113] In other words, when the heat dissipation requirement level of the inverter main body 1 is high and the air conditioner 5 is in the heating mode, in addition to derating the inverter, the inverter main body 1 can be cooled by the semiconductor refrigeration system 2 and the natural wind air cooling subsystem, so that the inverter main body 1 can be quickly cooled to a suitable operating temperature range.

[0114] In some embodiments, when the heat dissipation requirement level of the inverter main body 1 is not zero level, that is, when the inverter main body 1 has a heat dissipation requirement, the function of the inverter to supply hot air / cold air to the air conditioner 5 is turned off, such as Figure 7 shown, to preferentially ensure the heat dissipation requirement of the inverter main body 1.

[0115] Figure 7 Schematically shows the working principle diagram of the energy management system provided by some embodiments of the present application. According to the operating power P0 of the inverter, it is roughly divided into three cases:

[0116] 1) When P0 ≤ P1, if there is a heating / cooling requirement indoors, hot air / cold air is supplied to the air conditioner through the semiconductor refrigeration system; if there is no cooling / heating requirement indoors, the function of the inverter to supply hot air / cold air to the air conditioner is turned off.

[0117] 2) When P1 < P0 ≤ P2, heat dissipation is performed through the semiconductor refrigeration system + natural wind air cooling subsystem;

[0118] 3) When P0 > P2, if the air conditioner is in the cooling mode / non-operating state (i.e., non-heating mode), heat dissipation is performed through the semiconductor refrigeration system + air conditioner cold air air cooling subsystem; if the air conditioner is in the heating mode, the inverter operates at a reduced rating.

[0119] Moreover, when P0 > P1, the function of the inverter to supply hot air / cold air to the air conditioner is also turned off.

[0120] The embodiment of the present application also provides a control device, including a processor and a memory storing a computer program. When the processor executes the computer program, the steps of the control method in any of the above embodiments are implemented, and thus it has all the above beneficial effects and will not be elaborated here.

[0121] The control device may include a central control unit 17, and the central control unit 17 may be arranged in the inverter main body 1, such as Figure 2As shown, it has functions such as temperature measurement and communication. The central control unit 17 can monitor the temperatures in different areas within the inverter main body 1 through temperature control probes distributed on the heating elements in the inverter main body 1, so as to reasonably control the air output volumes of different air outlets 153 of the air cooling channel 15. The central control unit 17 can also communicate with the control valve assembly to control the on / off and flow rate of the flow path through the control valve assembly. The central control unit 17 can also communicate with the air conditioner 5, and can receive the information sent by the air conditioner 5 or send instructions to the air conditioner 5 (for example, when the heat dissipation requirement level of the inverter is high and the air conditioner is in a non-heating mode, send an instruction for the air conditioner to operate in a cooling mode).

[0122] In one example, the air conditioner 5 can be a ducted air conditioner 5, and the ducted air conditioner 5 includes an indoor unit and an outdoor unit. In the normal mode, the indoor unit is connected to the outdoor unit. In the special mode, the indoor unit can be connected to the inverter. For example, when the air conditioner 5 starts the heating function but needs preheating and cannot supply air immediately, the inverter can provide hot air. The air conditioner 5 and the inverter can be connected through a communication line 19 (such as Figure 1 as shown) to achieve communication.

[0123] The processor may be an integrated circuit chip with the ability to process signals. The above-mentioned processor can be a general-purpose processor, including a central processing unit (CPU for short), a network processor (NP for short), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components. It can implement or execute the various methods, steps and logic block diagrams disclosed in the embodiments of the present invention. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor, etc.

[0124] The embodiment of the present application also provides a computer-readable storage medium storing a computer program, and when the computer program is executed by a processor, it implements the steps of the control method in any of the above embodiments, and thus has all the above beneficial effects and will not be elaborated here.

[0125] In summary, the inverter, its control method and control device provided by the embodiment of the present application have high heat dissipation efficiency, can specifically cool the high-temperature devices inside the inverter main body, and can complement the advantages of household air conditioners, comprehensively utilizing the household cold and heat resources.

[0126] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0127] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0128] In the present application, unless otherwise clearly specified and defined, the terms "mounted", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0129] In the present application, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0130] In the description of this specification, the descriptions with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0131] Although the embodiments of this application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limitations to this application. Those of ordinary skill in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

[0132] In any one or more of the above exemplary embodiments, the functions described can be implemented by hardware, software, firmware or any combination thereof. If implemented in software, the functions can be stored on or transmitted via a computer-readable medium as one or more instructions or codes and executed by a hardware-based processing unit. The computer-readable medium can include a computer-readable storage medium corresponding to a tangible medium such as a data storage medium, or a communication medium including any medium that facilitates a computer program, for example, being transmitted from one place to another according to a communication protocol. In this way, the computer-readable medium generally corresponds to a non-transitory tangible computer-readable storage medium or a communication medium such as a signal or a carrier wave. The data storage medium can be any available medium that can be accessed by one or more computers or one or more processors to retrieve instructions, codes, and / or data structures for implementing the techniques described in this disclosure. A computer program product can include a computer-readable medium.

[0133] By way of example, and not limitation, such computer-readable storage media can include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, flash memory, or any other medium that can be used to store the desired program code in the form of instructions or data structures and that can be accessed by a computer. Also, any connection can be termed a computer-readable medium. By way of example, if instructions are transmitted using coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of the medium. However, it should be understood that computer-readable storage media and data storage media do not include connections, carrier waves, signals, or other transient media, but are directed to non-transitory tangible storage media. As used herein, disk and optical disks include compact disk (CD), laser disk, optical disk, digital versatile disk (DVD), floppy disk, or Blu-ray disk, etc., where disks typically reproduce data magnetically, while optical disks use lasers to optically reproduce data. Combinations of the above should also be included within the scope of computer-readable media.

[0134] By way of example, the instructions can be executed by one or more processors, such as one or more digital signal processors (DSPs), general purpose microprocessors, application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), or other equivalent integrated or discrete logic circuits. Thus, the term "processor" as used herein can refer to any one of the foregoing structures or any other structure suitable for implementing the techniques described herein. Additionally, in some aspects, the functionality described herein can be provided within dedicated hardware and / or software modules configured for encoding and decoding, or incorporated in a combined codec. Also, the techniques can be fully implemented in one or more circuits or logic elements.

[0135] The technical solutions of the embodiments of the present disclosure can be implemented in a wide variety of devices or apparatuses, including wireless handsets, integrated circuits (ICs) or a group of ICs (e.g., a chipset). The various components, modules, or units described in the embodiments of the present disclosure are emphasized to highlight the functional aspects of the apparatuses configured to perform the described techniques, but do not necessarily need to be implemented by different hardware units. Rather, as described above, the various units can be combined in a codec hardware unit or provided by a collection of interoperating hardware units, including one or more processors as described above, in conjunction with appropriate software and / or firmware.

Claims

1. An inverter, It is characterized in that include: An inverter body and a heat dissipation system, wherein the heat dissipation system is configured to dissipate heat from the inverter body; the heat dissipation system includes a semiconductor refrigeration system and an air cooling system; The refrigeration end of the semiconductor refrigeration system cooperates with the inverter body in heat exchange; The air cooling system includes an air cooling channel arranged in the inverter body, the air cooling channel is provided with an air inlet and one or more air outlets, the positions of the air outlets correspond to the set heating areas in the inverter body, so as to blow air to the set heating areas.

2. The inverter according to claim 1, It is characterized in that Also included are air supply systems and control valve assemblies; The air inlet comprises a first air inlet and a second air inlet; the first air inlet is connected to the air supply system and is configured to deliver natural wind to the air cooling channel; the second air inlet is configured to communicate with the air duct of the air conditioner to deliver cold air generated by air conditioning refrigeration to the air cooling channel; The control valve assembly is configured to control the connection and disconnection between the first air inlet and the air supply system, and to control the connection and disconnection between the second air inlet and the air duct of the air conditioner.

3. The inverter according to claim 2, It is characterized in that It also includes cold air channels and hot air channels; One end of the cold air channel cooperates with the refrigeration end of the semiconductor refrigeration system, and the other end is configured to be able to communicate with the air duct of the air conditioner to transport the cold air formed by the refrigeration end to the air duct of the air conditioner; One end of the hot air channel cooperates with the heating end of the semiconductor refrigeration system, and the other end is configured to be connected to the air duct of the air conditioner to transport the hot air generated by the heating end to the air duct of the air conditioner; The control valve assembly is also configured to control the connection and disconnection between the cold air passage and the air passage of the air conditioner, and to control the connection and disconnection between the hot air passage and the air passage of the air conditioner.

4. The inverter according to any one of claims 1 to 3, It is characterized in that The semiconductor refrigeration system includes: a heat absorbing plate, a semiconductor refrigeration plate and a heat dissipation plate which are stacked in sequence; the heat absorbing plate cooperates with the inverter body and the cold surface of the semiconductor refrigeration plate in heat exchange to form a cooling end of the semiconductor refrigeration system; the heat dissipation plate cooperates with the hot surface of the semiconductor refrigeration plate in heat exchange to form a heating end of the semiconductor refrigeration system.

5. The inverter according to claim 4, It is characterized in that The heat absorbing plate is provided with a first air flow channel, and the heat dissipating plate is provided with a second air flow channel; The air inlet end of the first air flow channel is configured to be connected to the air supply system, and the air outlet end is configured to be able to communicate with the air duct of the air conditioner to deliver cold air to the air duct of the air conditioner; The air inlet end of the second air flow channel is configured to be connected to the air supply system, and the air outlet end is configured to be able to communicate with the air duct of the air conditioner to transport hot air to the air duct of the air conditioner.

6. The inverter according to claim 5, It is characterized in that The heat absorbing plate comprises a first shell with openings at both ends and a plurality of first partition ribs arranged in parallel in the first shell, wherein the first shell and the plurality of first partition ribs enclose a plurality of the first air flow channels; and / or The heat sink includes a second shell with openings at both ends and a plurality of second partition ribs disposed in the second shell and arranged in a wave shape, wherein the second shell and the plurality of second partition ribs enclose a plurality of second air flow channels.

7. The inverter according to any one of claims 1 to 3, It is characterized in that The air cooling system further comprises an air outlet nozzle arranged at the air outlet, the air outlet nozzle comprises a joint portion and an air guide portion connected to the joint portion, the joint portion is connected to the air outlet, the air guide portion is connected to the joint portion, and is configured to disperse and spray the airflow output by the joint portion; The air guide portion includes an air guide cone, the cross-sectional area of ​​which gradually increases in a direction away from the joint portion, an air inlet hole is provided at one end of the air guide cone close to the joint portion, the air inlet hole is arranged relatively spaced apart from the joint portion, and a plurality of guide slits are provided along the circumferential direction of the air guide cone, the guide slits pass through one end of the air guide cone away from the joint portion.

8. An energy management system, It is characterized in that The invention comprises the inverter according to any one of claims 1 to 7.

9. The energy management system according to claim 8, It is characterized in that It also includes an air conditioner, which is configured to be controllable in conjunction with the inverter.

10. A control method, It is characterized in that For use in the energy management system according to claim 8 or 9, the control method comprises: Obtaining operating parameters of the inverter; The heat dissipation system and / or the inverter body are controlled according to the operating parameters of the inverter.

11. The control method according to claim 10, It is characterized in that The controlling the heat dissipation system and / or the inverter body according to the operating parameters of the inverter includes: Determining a heat dissipation requirement level of the inverter body according to operating parameters of the inverter; The heat dissipation system and / or the inverter body is controlled according to the heat dissipation requirement level of the inverter body.

12. The control method according to claim 11, It is characterized in that The heat dissipation demand level includes: level zero; the energy management system also includes air conditioning; The control method further includes: judging whether there is a need for indoor temperature adjustment based on that the heat dissipation requirement level of the inverter body is zero; The controlling the heat dissipation system according to the heat dissipation requirement level of the inverter body comprises: Based on the fact that the heat dissipation demand level of the inverter body is zero, it is determined that there is a temperature adjustment demand indoors and the temperature adjustment demand is a cooling demand, then the control valve assembly of the inverter is controlled to connect the air supply system with the cold air channel of the inverter and the cold air channel with the air duct of the air conditioner, and the semiconductor refrigeration system and the air supply system are started to deliver cold air to the air duct of the air conditioner, so as to deliver cold air to the indoors through the air conditioner; Based on the fact that the heat dissipation demand level of the inverter body is zero, it is determined that there is a temperature control demand indoors and the temperature control demand is a heating demand, then the control valve assembly of the inverter is controlled to connect the air supply system with the hot air channel of the inverter and connect the hot air channel with the air duct of the air conditioner, and the semiconductor refrigeration system and the air supply system are started to deliver hot air to the air duct of the air conditioner, so as to deliver hot air to the indoor through the air conditioner.

13. The control method according to claim 11, It is characterized in that The heat dissipation requirement levels include: low level; The controlling the heat dissipation system according to the heat dissipation requirement level of the inverter body comprises: Based on the low heat dissipation requirement level of the inverter body, the control valve assembly of the inverter is controlled to connect the air supply system of the inverter with the first air inlet, and the semiconductor refrigeration system and the air supply system are started to dissipate heat for the inverter body.

14. The control method according to claim 11, It is characterized in that The heat dissipation requirement level includes: advanced; the energy management system also includes air conditioning; The control method further includes: obtaining status information of an air conditioner based on the fact that the heat dissipation requirement level of the inverter body is high; determining that the air conditioner is in a non-heating mode according to the status information of the air conditioner, and controlling the air conditioner to operate in a cooling mode so as to supply air to an air cooling channel of the inverter; The controlling the heat dissipation system and / or the inverter body according to the heat dissipation requirement level of the inverter body comprises: Based on the heat dissipation requirement level of the inverter body being high, and determining that the air conditioner is in a non-heating mode according to the state information of the air conditioner, the control valve assembly of the inverter is controlled to connect the air duct of the air conditioner with the second air inlet, and the semiconductor refrigeration system is started to dissipate heat for the inverter body; Based on the fact that the heat dissipation requirement level of the inverter body is high, it is determined according to the state information of the air conditioner that the air conditioner is in a heating mode, and the inverter body is controlled to operate at a reduced rating.

15. The control method according to any one of claims 11 to 14, It is characterized in that The operating parameters include the operating power of the inverter, and determining the heat dissipation requirement level of the inverter body according to the operating parameters of the inverter includes: Based on the operating power of the inverter being less than or equal to the first set power, determining that the heat dissipation requirement level of the inverter body is zero; Based on the fact that the operating power of the inverter body is greater than the first set power and less than or equal to the second set power, it is determined that the heat dissipation requirement level of the inverter body is low, and the first set power is less than the second set power; Based on the operating power of the inverter main body being greater than the second set power, it is determined that the heat dissipation requirement level of the inverter main body is high.

16. A control device, It is characterized in that The system comprises a processor and a memory storing a computer program, wherein when the processor executes the computer program, the steps of the control method according to any one of claims 10 to 15 are implemented.

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