Heat dissipation structure
By designing the heat dissipation structure of metal alloy plates, heat transfer fins and blower in the test equipment, the problem of shortening the life of electronic components in high-temperature testing is solved, and a lower operating temperature and a more stable test environment is achieved.
Patent Information
- Application Number
- CN202311643990.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-11-27
- Filing Date
- 2023-12-01
- Publication Date
- 2025-05-27
AI Technical Summary
Existing test equipment lacks effective heat dissipation measures during high-temperature testing of electronic components, resulting in shortening of the life of electronic components and early damage.
A heat dissipation structure is designed, including a metal alloy plate, heat transfer fin and air blower, which absorbs the heat energy generated by the electronic components through the joint, and accelerates the heat dissipation through the heat transfer and air blower.
Effectively reduce the temperature of electronic components, extend their life, ensure the stability and reliability of temperature-sensitive components during testing, and avoid plate warping.
Smart Images
Figure CN120050891A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a heat dissipation structure, particularly a heat dissipation structure disposed in a test device. Background Art
[0002] Currently, many electronic devices (such as smart phones) transmit signals through wireless communication technologies (such as 4G, 5G wireless communication technologies, etc.). When these electronic devices transmit and receive electromagnetic energy, they often interfere with each other due to their signal frequencies and power spectral densities. Therefore, these electronic devices must comply with the specifications of various wireless communication technology standards.
[0003] Therefore, when designing these electronic devices, it is necessary to ensure compliance with each standard-based specification stipulated by mobile communication technologies. Moreover, when these electronic devices enter mass production, they need to pass high-standard tests to avoid problems such as defective products due to defects during the manufacturing process.
[0004] Figure 1 As shown in the schematic diagram of the existing test device 1, the test device 1 includes a handler 11, a test socket 12 connected to the handler 11, and an electronic carrier board 13 disposed on the test socket 12. In the existing test device 1, electronic components 14 are disposed on the electronic carrier board 13 for testing. However, the electronic components 14 generate high temperatures during testing. If the electronic components 14 are in a high-temperature test environment for a long time without the assistance of heat dissipation components, it is easy to cause the disadvantages of shortened lifespan and early damage.
[0005] Therefore, how to overcome the above-mentioned problems of the existing technology has actually become an urgent issue to be solved currently. Summary of the Invention
[0006] In view of the above-mentioned deficiencies of the existing technology, the present invention provides a heat dissipation structure for a test device, including: a bonding part disposed on an electronic component on an electronic carrier board of the test device; and a plate body having opposite first and second sides, with the first side disposed on the bonding part, and a heat transfer member formed on the second side.
[0007] In the heat dissipation structure as described above, the material of the plate body is a metal alloy.
[0008] In the heat dissipation structure as described above, the metal alloy is an aluminum alloy.
[0009] In the heat dissipation structure as described above, the bonding part is heat dissipation silica gel.
[0010] In the heat dissipation structure as described above, it further includes a frame disposed around the plate body.
[0011] In the heat dissipation structure as described above, the frame has a clamping hole for installing the thermocouple meter circuit.
[0012] In the heat dissipation structure as described above, the heat transfer member is a plurality of fins spaced apart from each other and parallel to each other.
[0013] In the heat dissipation structure as described above, it further includes a blowing member disposed above the second side of the plate body and blowing air toward the heat transfer member.
[0014] In summary, the heat dissipation structure of the present invention can be disposed on the electronic components of the electronic carrier board of the test equipment, can effectively reduce the temperature of the electronic components, enable the electronic components to operate at a lower operating temperature, and can slow down the shortening of the lifespan and damage caused by temperature to the electronic components. At the same time, it ensures the stability and reliability of the temperature-sensitive components during testing. In addition, the plate body of the heat dissipation structure of the present invention adopts a metal alloy, which can also avoid warping. Description of the Drawings
[0015] Figure 1 It is a schematic diagram of an existing test equipment.
[0016] Figure 2 It is an overall schematic diagram of the heat dissipation structure of the present invention disposed on the test equipment.
[0017] Figure 3 It is a top view schematic diagram of the heat dissipation structure of the present invention.
[0018] Figure 4A It is a top view schematic diagram of another embodiment of the heat dissipation structure of the present invention.
[0019] Figure 4B For Figure 4A partial enlarged schematic diagram.
[0020] Description of the Main Component Symbols
[0021] 1 Test equipment
[0022] 11 Actuating member
[0023] 12 Test socket
[0024] 13 Electronic carrier board
[0025] 14 Electronic component
[0026] 2 Heat dissipation structure
[0027] 20 Plate body
[0028] 20a First side
[0029] 20b Second side
[0030] 21 Heat transfer member
[0031] 22 Junction
[0032] 23 Frame
[0033] 231 Latching Hole
[0034] 24 Blowing Component. Detailed Implementation Manner
[0035] The following describes the implementation manners of the present invention through specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.
[0036] It should be noted that the structures, ratios, sizes, etc. shown in the attached drawings of this specification are only used to cooperate with the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present invention can be implemented. Therefore, they do not have a substantial technical meaning. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present invention. At the same time, the terms such as "upper", "first", "second", etc. cited in this specification are only for the convenience of clear description and are not used to limit the scope under which the present invention can be implemented. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope within which the present invention can be implemented.
[0037] Figure 2 This is an overall schematic diagram of the heat dissipation structure 2 of the present invention provided in the test device 1. Figure 3 This is a top view schematic diagram of the heat dissipation structure 2 of the present invention. The heat dissipation structure 2 of the present invention includes a plate body 20 and a junction 22 provided on the plate body 20.
[0038] The junction 22 is provided on the electronic component 14 on the electronic carrier board 13 of the test device 1.
[0039] In this embodiment, the junction 22 is a heat dissipation silicone (Thermal Pad) with high thermal conductivity. In other embodiments, the junction 22 can also be a substance with high thermal conductivity such as graphite, thermal paste, metal strip, etc. The function of the junction 22 is to completely cover and conform to the surface of the electronic component 14 to effectively absorb the heat energy generated by the electronic component 14.
[0040] In this embodiment, the electronic carrier board 13 can be a printed circuit board, and the electronic component 14 can be an active component, a passive component, or a packaged module, etc. Among them, the active component is, for example, a semiconductor wafer, and the passive component is, for example, a resistor, a capacitor, and an inductor.
[0041] In one embodiment, the number of junctions 22 can correspond to the number of electronic components 14, but the present invention is not limited thereto.
[0042] Furthermore, the plate body 20 is generally square, and has opposite first side 20a and second side 20b. The first side 20a is disposed on the joint portion 22, and the heat transfer member 21 is formed on the second side 20b. Therefore, the heat energy generated by the electronic component 14 can be transmitted to the plate body 20 through the joint portion 22, and then transmitted from the plate body 20 to the heat transfer member 21.
[0043] In this embodiment, the material of the plate body 20 is a metal alloy, such as aluminum alloy (model 5083), with a thermal conductivity of 155 W / mk, an elastic modulus of 72 GPa, a yield strength of 225 MPa, a tensile strength of 325 MPa, a fatigue strength of 160 MPa, an elongation at break of 16%, a hardness of 77 HB, and a thermal expansion rate of 23.4 ppm / °C. The metal alloy can also be aluminum alloy (model 6061), with a thermal conductivity of 167 W / mk, an elastic modulus of 70 GPa, a yield strength of 280 MPa, a tensile strength of 315 MPa, a fatigue strength of 100 MPa, an elongation at break of 12%, a hardness of 95 HB, and a thermal expansion rate of 23.6 ppm / °C.
[0044] In this embodiment, the heat transfer member 21 is a plurality of fins spaced apart from each other and parallel to each other, and can be used to dissipate the heat energy generated by the electronic component 14. The fins can be, for example, skived fins, or other fins in columnar, sheet-like, or even irregular shapes, as long as they can increase the contact area with air. The present invention is not limited thereto.
[0045] The heat dissipation structure 2 of the present invention further includes a blowing member 24. The blowing member 24 is disposed above the second side 20b of the plate body 20, and can blow cold air toward the heat transfer member 21 to accelerate the dissipation of the heat energy transmitted from the joint portion 22 to the heat transfer member 21.
[0046] Please refer to Figure 4A and Figure 4B , the heat dissipation structure 2 of the present invention further includes a frame 23. The frame 23 can be a hollow ring, and is disposed around the periphery of the plate body 20, and has a clamping hole 231 formed by bending from the frame 23. The clamping hole 231 can be used to install the thermocouple line to avoid damaging the line when installing the plate body 20 on the test device 1.
[0047] In summary, the heat dissipation structure of the present invention is provided on the electronic components of the electronic carrier board of the test equipment, which can effectively reduce the temperature of the electronic components. Compared with the prior art, the present invention can reduce the surface temperature of the electronic components by about 3.55 °C (49.27 °C in the prior art, 45.72 °C in the present invention). Therefore, the present invention enables the electronic components to operate at a lower operating temperature, and can slow down the shortening of the lifespan and damage caused by temperature to the electronic components, while ensuring the stability and reliability of the temperature-sensitive components during testing. In addition, the plate body of the heat dissipation structure of the present invention uses a metal alloy, which can also avoid warping.
[0048] The above embodiments are only used to illustrate the principle and its effects of the present invention by way of example, rather than to limit the present invention. Any person skilled in the art can modify the above embodiments without departing from the inventive concept and scope of the present invention. Therefore, the scope of the protection of the present invention should be as listed in the claims.
Claims
1. A heat dissipation structure for testing equipment, include: A coupling portion is provided on the electronic component on the electronic carrier of the test equipment; as well as The plate body has a first side and a second side opposite to each other, and the first side is arranged on the combining portion, and a heat transfer element is formed on the second side.
2. The heat dissipation structure according to claim 1, in, The material of the plate body is metal alloy.
3. The heat dissipation structure according to claim 2, in, The metal alloy is an aluminum alloy.
4. The heat dissipation structure according to claim 1, in, The joint is made of heat dissipating silicone.
5. The heat dissipation structure according to claim 1, in, The heat dissipation structure also includes a frame arranged around the plate body.
6. The heat dissipation structure according to claim 5, in, The frame has a mounting hole for mounting a thermocouple circuit.
7. The heat dissipation structure according to claim 1, in, The heat transfer element is a plurality of fins which are spaced apart from each other and parallel to each other.
8. The heat dissipation structure according to claim 1, in, The heat dissipation structure also includes a blowing member which is arranged above the second side of the plate body and blows air toward the heat transfer member.