Water-swellable semiconductor tape
By adopting a water-swellable semiconductor material with a multi-layer structure, the crosslinked superwater-absorbent polymer matrix and conductive particles, the problems of large thickness and poor conductivity in the prior art are solved, and the double improvement of thickness reduction and conductivity are achieved.
Patent Information
- Application Number
- CN202380072774.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2022-10-28
- Filing Date
- 2023-10-27
- Publication Date
- 2025-05-27
AI Technical Summary
The existing water-swellable semiconductor tape has a large thickness and poor conductivity, making it difficult to meet the needs of reduced thickness and improved conductivity.
A water-swellable semiconductor material adopting a multi-layer structure consists of a substrate, a first and a second semiconductor layer, on which the semiconductor water-swellable layer is located, and contains a crosslinked superwater-absorbing polymer matrix and conductive particles.
It achieves a reduction in thickness by 50% or more while improving conductivity, and has many advantages such as wear resistance, fire resistance, and high conductivity.
Smart Images
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Abstract
Description
[0001] Cross - reference to related applications
[0002] This application claims the benefit of U.S. Provisional Application No. 63 / 420,517, filed on October 28, 2022, the entire disclosure of which is incorporated herein by reference for all purposes. Technical Field
[0003] Described herein are semiconductor tapes, particularly semiconductor tapes for use with cables (e.g., power cables), and more particularly water - swellable semiconductor tapes. Background Art
[0004] Commercially available water - swellable tapes, also known as water - blocking tapes, are, for example, three - layer tapes composed of a polyester non - woven fabric as the outer layer and a superabsorbent powder as the intermediate layer. An exemplary three - layer water - blocking tape is shown in Figure 1. When water enters a cable protected by a water - blocking (water - swellable) tape, the superabsorbent component within the tape rapidly absorbs water and rapidly swells to prevent any further intrusion. This can minimize and localize any cable damage caused by water and assist in repair. Water - blocking tapes are widely used in various cables and other applications.
[0005] Semiconductor tapes are made of a substrate coated with a semiconductor compound on one or both sides. These tapes help to equalize the field current around a power conductor or core and ensure electrical contact with the grounding system, thereby reducing the electrical stress on the insulation material and improving performance. Semiconductor tapes can also be used to prevent electrolytic corrosion of the metal layer in high - voltage cables.
[0006] Various water - swellable tapes are known in the art, including water - swellable semiconductor tapes. Examples of such tapes include adhering a three - layer water - swellable tape to a semiconductor tape to form a double - tape composite, and sandwiching a powdered superabsorbent polymer mixed with carbon black between non - woven fabrics. However, known water - swellable semiconductor tapes may have an undesired thickness, e.g., > 0.25 mm, and / or may not have as good conductivity as a semi - conductive grade tape.
[0007] Accordingly, there is a need in the art for a water - swellable semiconductor tape with reduced thickness and improved conductive properties. Summary of the Invention
[0008] The following provides a brief overview of the claimed subject matter in order to provide a basic understanding of certain aspects of the claimed subject matter. This overview is not an exhaustive review of the claimed subject matter. Its purpose is neither to identify key or critical elements of the claimed subject matter nor to delineate the scope of the claimed subject matter. Its purpose is only to present some concepts of the claimed subject matter in a simplified form as a prelude to a more detailed description that follows.
[0009] According to one aspect of the present disclosure, a water-swellable semiconductor material with reduced thickness and superior performance is provided. The water-swellable semiconductor material consists of a substrate and first and second semiconductor layers located on opposite surfaces of the substrate. A semiconductor water-swellable layer is located on one of the first or second semiconductor coatings, thereby forming a multilayer structure. The semiconductor water-swellable polymer layer is a crosslinked superabsorbent polymer matrix in which conductive particles are dispersed in the polymer matrix. The conductive particles can be carbon black particles or other suitable conductive particles. The conductive particles are dispersed in the crosslinked acrylate / salt polymer matrix to form a conductive path within the crosslinked acrylate / salt polymer matrix.
[0010] The water-swellable semiconductor material can be in the form of a multilayer tape, where the substrate is an elongated material of different sizes and materials, such as non-woven fabric or woven fabric, including woven polymer fabrics such as nylon 6,6. In one embodiment, the water-swellable semiconductor material as described herein is connected to a conductor to form a waterproof cable, such as an electric cable. In another embodiment, the conductor is an electric cable and the water-swellable semiconductor material is in the form of a tape applied to the cable.
[0011] According to another aspect of the present disclosure, a method for preparing a water-swellable semiconductor material is provided. The method includes applying a semiconductor coating to a substrate to form a semiconductor substrate. Then, an aqueous composition containing an acrylate / salt polymer or an acrylate prepolymer and conductive particles is applied to the semiconductor substrate, and subsequently, the aqueous composition on the semiconductor substrate is dried and cured, thereby crosslinking the acrylate / salt polymer or the acrylate prepolymer, thus forming a semiconductor water-swellable polymer layer on the semiconductor substrate. After drying and curing, the semiconductor water-swellable polymer layer consists of a crosslinked superabsorbent polymer matrix in which conductive particles are dispersed.
[0012] The aqueous composition can be applied to one side of the substrate. In some embodiments, the aqueous composition can be applied to both sides of the substrate. In other embodiments, the aqueous composition includes separate components that are mixed together before application.
[0013] It should be understood that the foregoing general description and the following detailed description are both exemplary and explanatory and do not limit the present disclosure. Other features of the present disclosure will be partly set forth in the following description or may be learned by practicing the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The drawings are incorporated into and constitute a part of this specification, which illustrate several embodiments and are used together with the specification to explain certain principles.
[0015] FIG. 1 is an illustration of a prior art water-swellable tape; and
[0016] Figure 2 A side view illustration of an embodiment of a water-swellable semiconductor (SC) tape according to the present disclosure. Detailed Description
[0017] This specification and the drawings illustrate exemplary embodiments and should not be considered restrictive. The scope of the present disclosure is defined by the claims (including equivalents). Various mechanical, compositional, structural, and operational changes may be made without departing from the scope of this specification and the claims (including equivalents). In some cases, well-known structures and techniques are not shown or described in detail to avoid obscuring the disclosure. The same reference numerals in two or more figures represent the same or similar elements. Additionally, elements and their related aspects described in detail with reference to one embodiment may, where practical, also be included in other embodiments not specifically shown or described. For example, if an element is described in detail with reference to one embodiment but not described with reference to a second embodiment, it may still be asserted that the element is included in the second embodiment. Moreover, the descriptions herein are for illustrative purposes only and do not necessarily reflect the actual shape, size, or dimensions of the system or the illustrated components.
[0018] It should be noted that, as used in this specification and the appended claims, the singular forms "a", "an", and "the", as well as any singular use of any word, include plural referents unless explicitly and unambiguously limited to one referent. As used herein, the term "comprising" and its grammatical variants are intended to be non-restrictive, such that items listed in a list do not preclude other similar items that may be substituted or added to the listed items.
[0019] Unless otherwise specified, any quantity values are approximate, whether or not the words "about" or "approximately" are noted. The materials, methods, and examples described herein are illustrative only and are not intended to be limiting.
[0020] According to one aspect of the present disclosure, a water-swellable semiconductor (SC) material is provided. The material can be incorporated into tapes or cable sheaths for various conductors (including cables) and used in other applications, such as for connection and protection. The water-swellable semiconductor material as described herein can effectively absorb moisture and rapidly swell to prevent water intrusion while promoting good electrical contact. In some embodiments, the water-swellable semiconductor tape can be used to prevent electrolytic corrosion of the metal layer in medium-voltage to extra-high-voltage cables. The water-swellable material can also be used to equalize the field current around a power conductor or core and ensure electrical contact with the grounding system, thereby reducing the electrical stress on the insulation material and improving performance.
[0021] According to one embodiment, the water-swellable semiconductor material includes a tape. The water-swellable semiconductor tape includes a semiconductor substrate, such as a woven substrate (typically nylon). The semiconductor water-swellable layer is located on the outer surface of the semiconductor substrate. In addition to the above advantages, the water-swellable semiconductor tape according to the specification also has many physical and electrical properties and is suitable for various cable manufacturing applications. Some of the properties and advantages of the water-swellable semiconductor tape are as follows: high abrasion resistance, excellent fire resistance, fast application speed, halogen-free, high conductivity, less slippage, good adhesion, and good long-term temperature stability. In addition, according to the specification, the thickness of the semiconductor water-swellable tape is reduced by 50% compared to ordinary cable cladding.
[0022] According to one embodiment, a water-swellable semiconductor polymer material is provided. The water-swellable semiconductor polymer material includes conductive particles dispersed within a crosslinked superabsorbent polymer matrix.
[0023] Water-swellable superabsorbent polymers (SAPs) are a class of polymers capable of absorbing large amounts of water. Generally, SAPs consist of a network of crosslinked polymer chains that diffuse water into and store it within the polymer network. The type and degree of crosslinking determine the ability of the superabsorbent polymer to absorb and retain large amounts of water. Examples of suitable superabsorbent polymers are acrylate / salt polymers and aqueous solutions of prepolymers formed from water-soluble monomers such as acrylic acid, methacrylic acid, and 2-acrylamido-2-methylpropanesulfonic acid (DAA). Other comonomers such as acrylamide and N-isopropylacrylamide can also be added to the SAP. Examples of crosslinking agents include a variety of polyfunctional monomers. They can be difunctional, trifunctional, or tetrafunctional and can have a mixed type of polymerizable groups such as methacrylate.
[0024] According to one embodiment, the crosslinked superabsorbent polymer matrix is a crosslinked acrylate / salt polymer. The crosslinked acrylate / salt polymer can be formed by applying an aqueous acrylate / salt polymer or prepolymer (i.e., liquid SAP) to a substrate and curing it by applying heat. After curing, the acrylate / salt polymer or prepolymer undergoes chemical crosslinking to form a crosslinked superabsorbent polymer matrix. Suitable aqueous solutions of acrylate / salt polymers include Aquaswell 50, Aquaswell 75, and Aquaswell 100, which are commercially available from H&R ChemPharm (UK) Ltd. (Tipton, West Midlands, UK). The suitable crosslinked superabsorbent polymer formed on the substrate can also have an adhesive effect. In a specific embodiment, the liquid SAP can be divided into two parts and mixed before use to improve stability during large-scale use.
[0025] The water-swellable semiconductor polymer material has conductive particles dispersed within a cross-linked superabsorbent polymer matrix. In some embodiments, the conductive particles are premixed with an aqueous acrylate / salt polymer or prepolymer in solution and applied to a substrate. After curing, the semiconductor particles are dispersed within the cross-linked acrylate / salt polymer matrix to form conductive pathways within the cross-linked acrylate / salt polymer matrix. In some embodiments, the conductive particles include carbon black particles. In one embodiment, the conductive particles are carbon black, present in the aqueous composition in an amount of 5 wt% to 50 wt%, preferably about 25 wt%. Examples of suitable carbon black particles include granular activated carbon having a mesh size of 0.06 - 0.25 mm, such as FY5 30x60, commercially available from CPL Industries LTD (Killamarsh, Sheffield, UK).
[0026] According to another embodiment, a water-swellable semiconductor material is provided. The water-swellable semiconductor material includes a semiconductor substrate, and a semiconductor water-swellable polymer material located on the semiconductor substrate.
[0027] In one embodiment, the substrate has first and second semiconductor layers located on the surface of the substrate. The substrate can be a cloth, such as a non-woven or a woven fabric. A variety of materials can be used as the substrate, including polymer materials such as nylon and polyester, and other suitable materials such as glass fabric, burlap, and cotton fabric. In one embodiment, the substrate is nylon 6,6. The semiconductor layer is applied to the surface by applying a semiconductor liquid mixture to the surface of the substrate in one or more coatings, whereby the semiconductor layer is positioned on the surface of the substrate. The surface is coated on one side of the substrate. Of course, it is contemplated that in certain embodiments, the surface can be coated on both (opposite) sides of the substrate. Additionally, depending on the desired weight and product specifications, the substrate can be coated multiple times. When multiple coatings are employed, the coatings are dried after each coating. The first and second semiconductor layers can also be applied by impregnating the substrate with the semiconductor liquid mixture and then drying.
[0028] In one embodiment, the semiconductor layer includes carbon black particles, which are applied to the substrate in the form of an aqueous mixture and then dried. The aqueous mixture of semiconductor particles can include various additives (e.g., latex, dispersant, and stabilizer) to assist in the application of the particles. In one embodiment, the aqueous mixture of semiconductor particles is a mixture of carbon black particles with water, latex, dispersant, and stabilizer in an aqueous solution. In another embodiment, the particle size of the carbon black particles in the aqueous mixture is about 150 μm to about 400 μm.
[0029] In some embodiments, the weight of the water-swellable semiconductor material conforms to the specifications shown in Table 1 below:
[0030] Table 1.
[0031]
[0032] *BSI standard
[0033] **Harmonized document HD 605S2:2008, chapter 2.5.9
[0034] Now referring to Figure 2 , which shows a water-swellable semiconductor multi-layer tape 100. The multi-layer tape 100 has a first layer 102 including a substrate 104 and first and second semiconductor layers 106. A second layer 108 containing a semiconductor water-swellable polymer material is located on top of one of the first or second semiconductor layers 106. In one embodiment, the substrate 104 is an elongated material having opposite first and second surfaces, and the first and second semiconductor layers 106 are located on the opposite first and second surfaces of the woven substrate 102, as shown.
[0035] The water-swellable semiconductor tape according to the present disclosure can be made of a variety of substrate materials, as described herein, and has a variety of widths, lengths, and thicknesses, and the tape can be made in the form of gaskets or long reels of various widths.
[0036] In another embodiment, a waterproof conductor is provided. The waterproof conductor has a conductor inner core and a water-swellable semiconductor material connected to the conductor inner core. The water-swellable semiconductor material has a substrate 104, wherein first and second semiconductor coatings 106 are located on opposite sides of the substrate and surround the inner core. A semiconductor water-swellable polymer layer 108 is located on the outer surface of the first or second semiconductor coating 106. Other layers can include a protective cover layer or sheath. In some embodiments, the conductor is a cable, and in other embodiments, the conductor is a cable and the water-swellable semiconductor material is in the form of a tape applied to the cable.
[0037] According to another embodiment, a method for preparing a water-swellable semiconductor material is provided. The method includes providing a substrate as described herein. A semiconductor coating is applied to the substrate to form a semiconductor layer on the substrate. The semiconductor coating can be applied in the form of an aqueous mixture of semiconductor particles and dried to form a layer. The particles can be applied to the surface or embedded (impregnated) into the substrate. Then an aqueous composition containing an acrylate / salt polymer or acrylate prepolymer and conductive particles is applied to the semiconductor substrate. Then the aqueous composition on the semiconductor substrate is dried and cured, thereby crosslinking the acrylate / salt polymer or acrylate prepolymer to form a water-swellable semiconductor polymer layer on the semiconductor substrate. The water-swellable semiconductor polymer layer is composed of a crosslinked superabsorbent polymer matrix in which conductive particles are dispersed.
[0038] Example
[0039] Prepare test samples and laboratory samples of the water-swellable semiconductor tape as described herein. Analyze the samples according to the test protocol shown in Table 2. The data of the test samples are more reliable than those of the laboratory samples, as the laboratory samples are hand-made (A4) laboratory samples. The test data of the test samples and laboratory samples are shown in comparison with those of the competing products.
[0040] Table 2.
[0041]
[0042] *BSI standard
[0043] **Harmonized document HD 605S2:2008, Chapter 2.5.9
[0044] Although the foregoing written description enables one of ordinary skill in the art to make and use what is currently considered to be the best mode, one of ordinary skill in the art will understand and recognize that there are variations, combinations, and equivalents of specific embodiments, methods, and examples. By considering the specification and the practice of the embodiments disclosed herein, other embodiments will be apparent to those of ordinary skill in the art. The specification and examples are to be considered only as exemplary, and the true scope and spirit of the embodiments are to be indicated by the appended claims.
[0045] For example, according to one aspect, in a first embodiment, a water-swellable semiconductor material is provided. The material may include a substrate, first and second semiconductor layers positioned on opposite surfaces of the substrate, and a semiconductor water-swellable layer positioned on an outer surface of one of the first or second semiconductor coatings, the semiconductor water-swellable polymer layer comprising conductive particles dispersed within a crosslinked superabsorbent polymer matrix.
[0046] The second embodiment is the first embodiment of the water-swellable semiconductor material, wherein the conductive particles include conductive carbon black particles.
[0047] The third embodiment is any combination of the previous two embodiments, wherein the conductive particles include carbon black particles having a particle mesh of about 0.06 mm to 0.25 mm.
[0048] The fourth embodiment is any combination of the previous three embodiments, wherein the crosslinked superabsorbent polymer matrix comprises a crosslinked acrylate / salt polymer.
[0049] The fifth embodiment is any combination of the first four, wherein the superabsorbent polymer matrix comprises a crosslinked acrylate / salt polymer matrix and the conductive particles comprise carbon black particles, and wherein the carbon black particles are dispersed within the crosslinked acrylate / salt polymer matrix, thereby forming a conductive path within the crosslinked acrylate / salt polymer matrix.
[0050] The sixth embodiment is any combination of the first five embodiments, wherein the superabsorbent polymer matrix is a coating located on top of the first or second semiconductor coating.
[0051] The seventh embodiment is any combination of the first six embodiments, wherein the semiconductor water-swellable polymer layer is formed by applying an aqueous composition comprising an acrylate / salt polymer or an acrylate prepolymer and conductive particles onto the first or second semiconductor coating, and then drying the aqueous composition to form a superabsorbent polymer matrix in which the conductive particles are dispersed.
[0052] The eighth embodiment is any combination of the first seven embodiments, wherein the conductive particles are carbon black present in the aqueous composition in an amount of 5 wt% to 50 wt%.
[0053] The ninth embodiment is any combination of the first eight embodiments, wherein the conductive particles are carbon black present in the aqueous composition in an amount of about 25 wt%.
[0054] The tenth embodiment is any combination of the first nine embodiments, wherein the first and second semiconductor layers comprise carbon black particles.
[0055] The eleventh embodiment is any combination of the first ten embodiments, wherein the first and second semiconductor layers comprise carbon black particles having a particle size of about 150 μm to about 400 μm.
[0056] The twelfth embodiment is any combination of the first eleven embodiments, wherein the substrate is impregnated with super-conductive particles to form the first and second semiconductor layers on opposite surfaces of the woven substrate.
[0057] The thirteenth embodiment is any combination of the first twelve embodiments, wherein the water-swellable semiconductor material is a multi-layer tape, and the multi-layer tape comprises a first layer, and the first layer comprises a substrate and the first and second semiconductor layers. The substrate may be an elongate material. The elongate material may have opposite first and second surfaces. The first and second semiconductor layers may be located on opposite first and second surfaces of the woven substrate. The tape may further comprise a second layer, and the second layer comprises a semiconductor water-swellable polymer layer. The second layer may be located on top of one of the first or second semiconductor layers.
[0058] The fourteenth embodiment is any combination of the first thirteen embodiments, wherein the elongate material is a woven fabric.
[0059] Embodiment 15 is any combination of the first 14 embodiments, where the elongate material is a polymeric material.
[0060] In a second aspect, there is provided a first embodiment of a waterproof cable. The waterproof cable may include a conductor, a water-swellable semiconductor material connected to the conductor, the water-swellable semiconductor material including a substrate having opposite first and second faces, first and second semiconductor coatings located on opposite faces of the woven substrate, and a semiconductor water-swellable polymer layer located on an outer surface of one of the first or second semiconductor coatings, the semiconductor water-swellable polymer layer including conductive particles dispersed within a superabsorbent polymer matrix.
[0061] Embodiment 2 is the first embodiment of the waterproof cable, where the conductor is a cable.
[0062] Embodiment 3 is any combination of the first 2 embodiments, where the conductor is a cable and the water-swellable semiconductor material is in the form of a tape applied to the cable.
[0063] In a third aspect, there is provided a first embodiment of a method for preparing a water-swellable semiconductor material. The method may include: providing a substrate; applying a semiconductor coating to the substrate to form a semiconductor substrate; applying an aqueous composition including an acrylate / salt polymer or an acrylate prepolymer and conductive particles to the semiconductor substrate; and drying the aqueous composition on the semiconductor substrate to crosslink the acrylate / salt polymer or the acrylate prepolymer to form a semiconductor water-swellable polymer layer on the semiconductor substrate, where the semiconductor water-swellable polymer layer is composed of a crosslinked superabsorbent polymer matrix in which conductive particles are dispersed.
[0064] Embodiment 2 is the first embodiment of the method, where the semiconductor coating is applied to opposite surfaces of the substrate to form coatings.
[0065] Embodiment 3 is any combination of the first 2 embodiments, where the semiconductor coating is impregnated within the substrate.
[0066] Embodiment 4 is any combination of the first 3 embodiments, where the aqueous composition is applied to one side of the substrate.
[0067] Embodiment 5 is any combination of the first 4 embodiments, where the aqueous composition is applied to both sides of the substrate.
[0068] Embodiment 6 is any combination of the first 5 embodiments, where the aqueous composition includes separate components mixed together before application.
Claims
1. A water-swellable semiconductor material, which comprises: a substrate; a first semiconductor layer and a second semiconductor layer located on opposite surfaces of the substrate; and a semiconductor water-swellable layer located on the outer surface of one of the first semiconductor layer or the second semiconductor coating, the semiconductor water-swellable polymer layer comprising conductive particles dispersed within a crosslinked superabsorbent polymer matrix.
2. The water-swellable semiconductor material according to claim 1, wherein the conductive particles comprise conductive carbon black particles.
3. The water-swellable semiconductor material according to claim 1, wherein the conductive particles comprise carbon black particles having a sieve particle size of about 0.06 mm to 0.25 mm.
4. The water-swellable semiconductor material according to claim 1, wherein the crosslinked superabsorbent polymer matrix comprises a crosslinked acrylate / salt polymer.
5. The water-swellable semiconductor material according to claim 1, wherein the superabsorbent polymer matrix comprises a crosslinked acrylate / salt polymer matrix and the conductive particles comprise carbon black particles, wherein the carbon black particles are dispersed within the crosslinked acrylate / salt polymer matrix to form a conductive path within the crosslinked acrylate / salt polymer matrix.
6. The water-swellable semiconductor material according to claim 1, wherein the superabsorbent polymer matrix is a coating located on top of the first semiconductor coating or the second semiconductor coating.
7. The water-swellable semiconductor material according to claim 1, wherein the semiconductor water-swellable polymer layer is formed by: applying an aqueous composition comprising an acrylate / salt polymer or an acrylate prepolymer and the conductive particles onto the first semiconductor coating or the second semiconductor coating, and then drying the aqueous composition to form a superabsorbent polymer matrix in which the conductive particles are dispersed.
8. The water-swellable semiconductor material according to claim 7, wherein the conductive particles are carbon black present in the aqueous composition in an amount of 5 wt% to 50 wt%.
9. The water-swellable semiconductor material according to claim 7, wherein the conductive particles are carbon black present in the aqueous composition in an amount of about 25 wt%.
10. The water-swellable semiconductor material according to claim 1, wherein the first semiconductor layer and the second semiconductor layer comprise carbon black particles.
11. The water-swellable semiconductor material according to claim 1, wherein the first semiconductor layer and the second semiconductor layer contain carbon black particles having a particle size of about 150 μm to about 400 μm.
12. The water-swellable semiconductor material according to claim 1, wherein the substrate is impregnated with superconducting particles to form the first semiconductor layer and the second semiconductor layer located on opposite surfaces of the woven substrate.
13. The water-swellable semiconductor material according to claim 1, wherein the water-swellable semiconductor material is a multi-layer tape, the multi-layer tape comprises: A first layer, which includes the substrate and the first and second semiconductor layers, wherein the substrate is an elongate material having a first surface and an opposite second surface, and the first and second semiconductor layers are located on the first surface and the opposite second surface of the woven substrate; and A second layer, which includes the semiconductor water-swellable polymer layer, wherein the second layer is located on one of the first semiconductor layer or the second semiconductor layer.
14. The water-swellable semiconductor material according to claim 10, wherein the elongate material is a woven fabric.
15. The water-swellable semiconductor material according to claim 10, wherein the elongate material is a polymer material.
16. A waterproof cable, which comprises: a conductor; and a water-swellable semiconductor material connected to the conductor, the water-swellable semiconductor material comprising: a substrate having a first face and an opposite second face; a first semiconductor coating and a second semiconductor coating located on opposite faces of the woven substrate; and a semiconductor water-swellable polymer layer located on the outer surface of one of the first semiconductor coating or the second semiconductor coating, the semiconductor water-swellable polymer layer comprising conductive particles dispersed within a crosslinked superabsorbent polymer matrix.
17. The waterproof cable according to claim 16, wherein the conductor is an electrical conductor.
18. The waterproof cable according to claim 16, wherein the conductor is a cable and the water-swellable semiconductor material is in the form of a tape applied to the cable.
19. A method of preparing a water-swellable semiconductor material, the method comprises: providing a substrate; applying a semiconductor coating to the substrate to form a semiconductor substrate; applying an aqueous composition comprising an acrylate / salt polymer or an acrylate prepolymer and conductive particles to the semiconductor substrate; and drying the aqueous composition on the semiconductor substrate and crosslinking the acrylate / salt polymer or the acrylate prepolymer to form a semiconductor water-swellable polymer layer on the semiconductor substrate, wherein the semiconductor water-swellable polymer layer consists of a crosslinked superabsorbent polymer matrix in which conductive particles are dispersed.
20. The method according to claim 19, wherein the semiconductor coating is applied to opposite surfaces of the substrate as a coating.
21. The method according to claim 19, wherein the semiconductor coating is spread throughout the substrate.
22. The method according to claim 19, wherein the aqueous composition is applied to one side of the substrate.
23. The method according to claim 19, wherein the aqueous composition is applied to both sides of the substrate.
24. The method according to claim 19, wherein the aqueous composition comprises separate components that are mixed together before application.