Cleaning fluid recovery device for wet cleaning of semiconductor wafer

Abstract

The invention belongs to the technical field of wastewater recovery, and discloses a cleaning fluid recovery device for wet cleaning of semiconductor wafers, which comprises an evaporation tank, a feed pipe fixedly arranged on the side surface of the evaporation tank, and a discharge pipe fixedly mounted at the bottom of the evaporation tank, the valve is arranged on the discharge pipe, the mounting bracket is fixedly arranged outside the evaporation tank and the condensation tank, and one side, close to the evaporation tank, of the condensation tank is fixedly connected with a transmission pipe communicated with the evaporation tank; the cleaning mechanism is arranged in the evaporation tank and used for cleaning the inner wall of the evaporation tank, and through cooperation of a heater, a scraping plate, a cleaning plate and other structures, the interior of the evaporation tank can be conveniently and rapidly heated and cleaned; the problems that when an existing cleaning liquid recycling device is used for removing and recycling impurities through distillation, a large amount of impurity scale is prone to remaining in a distillation chamber, and cleaning is not easy are solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of wastewater recovery, and specifically relates to a cleaning liquid recovery device for wet cleaning of semiconductor wafers. Background Art

[0002] In the semiconductor manufacturing process, wafer cleaning is a crucial step, the purpose of which is to remove contaminants (such as particles, metal ions, organic substances, etc.) on the wafer surface to ensure the quality and yield of subsequent processes. Wet cleaning is one of the main methods for wafer cleaning, and usually uses cleaning liquids containing acids, alkalis, oxidants or halogen organic compounds (such as hydrofluoric acid, hydrochloric acid, ammonium fluoride, etc.). However, the used cleaning liquid will contain a large amount of contaminants. Direct discharge will not only cause waste of resources, but also cause serious pollution to the environment. Therefore, the recovery and reuse of cleaning liquid have become an indispensable part of semiconductor manufacturing. At present, the cleaning liquid recovery devices for wet cleaning of semiconductor wafers mainly use technologies such as distillation, membrane separation, and ion exchange to treat the waste liquid to recover valuable components (such as acids, alkalis, halogen organic compounds, etc.).

[0003] For example, the utility model with the publication number CN212610090U discloses a fine distillation wastewater purification and recovery device, which includes a distillation tank. The upper end of the distillation tank is connected to a first conduit, one end of the first conduit is connected to a shunt pipe, both ends of the shunt pipe are connected to condensers, the outlet of each condenser is connected to a second conduit, the bottom end of each second conduit is connected to a box body, the upper end of the box body is connected with a cover, both sides inside the box body are connected with support blocks, the upper end of the support block is connected with a purification mechanism, the bottom end of the box body is connected to a liquid outlet pipe, and the bottom end of the liquid outlet pipe is connected to a collection box. After the heater is powered on and started in the present utility model, the temperature in the distillation tank is increased. The high temperature inside the distillation tank causes the wastewater to vaporize and evaporate. The condenser condenses the water vapor. After being purified by the purification mechanism, it is recovered by the collection box. Through evaporation, the water content in the wastewater is reduced, which is convenient for treating the wastewater and reducing the usage amount of reagents.

[0004] When the existing cleaning liquid recovery device uses distillation for wastewater treatment, most of them need to add additives to the wastewater to cause a chemical reaction to remove impurities in the wastewater. However, this easily leads to a large amount of residue remaining in the device after distillation of the wastewater, and when used again, it is very easy to form a thick layer of scale on the inner wall of the evaporation tank. When the water level in the distillation chamber drops, the scale adhering to the inner wall tightly combines with the inner wall under the baking of the heating mechanism, and it is very troublesome to clean. Even more so is the scale at the bottom of the distillation chamber. At the same time, when the existing wastewater distillation and recovery device distills, the heat of the steam is not fully utilized, but the steam is directly input into the condensation chamber. On the one hand, it causes heat waste, and on the other hand, it makes the power consumption of the heating structure and the condensation mechanism relatively high.

[0005] Therefore, a cleaning liquid recovery device for wet cleaning of semiconductor wafers is proposed to solve the problems raised in the background technology. Summary of the Invention

[0006] To solve the problem that in the existing cleaning liquid recovery device, when removing and recovering impurities by distillation, a large amount of impurity scale remains in the distillation chamber and is not easy to clean, as mentioned in the above background technology, the present invention provides a cleaning liquid recovery device for wet cleaning of semiconductor wafers.

[0007] To achieve the above object, the present invention provides the following technical solution: A cleaning liquid recovery device for wet cleaning of semiconductor wafers, including an evaporation tank, a feed pipe fixedly arranged on the side of the evaporation tank, a discharge pipe fixedly installed at the bottom of the evaporation tank, a valve arranged on the discharge pipe, and a mounting bracket fixedly arranged outside the evaporation tank and the condensation tank. It further includes:

[0008] A condensation tank, one side of the condensation tank close to the evaporation tank is fixedly connected with a transmission pipe communicating with the evaporation tank;

[0009] A cleaning mechanism, the cleaning mechanism is arranged inside the evaporation tank and is used for cleaning the inner wall of the evaporation tank;

[0010] Among them, the cleaning mechanism includes a heater, an extension plate fixedly arranged on the side wall of the heater, a cleaning plate fixedly installed at the bottom of the extension plate, a spraying assembly arranged at the bottom of the heater for spraying cleaning, and a driving assembly arranged at the center inside the evaporation tank for adjusting the position of the heater;

[0011] A stirring rod is fixedly arranged on the side of the heater away from the extension plate, and an electric heating wire is arranged inside the stirring rod.

[0012] Preferably, a plurality of scraping plates arranged in a linear array are fixedly connected to the side of the cleaning plate close to the inner wall of the heater. Each of the plurality of scraping plates is arc-shaped and is used for scraping impurities on the inner wall of the evaporation tank.

[0013] Preferably, the spraying assembly includes a water tank fixedly arranged at the bottom of the heater and a spray head fixedly installed on the outer wall of the water tank close to the heater;

[0014] The water tank is also provided with a crescent-shaped hollowed-out turntable. The crescent-shaped hollowed-out turntable is arranged in the middle of the pipeline for opening and closing the pipeline. A gear tooth is sleeved on the outer circumferential surface of the crescent-shaped hollowed-out turntable. The gear tooth is connected to one end of a reduction gear set, and the other end of the reduction gear set is connected to a heating pipe gear.

[0015] Preferably, a piston in contact with the inner wall thereof is slidably arranged inside the water tank, an electric cylinder fixedly connected to the bottom of the water tank is fixedly arranged at the bottom of the piston, and a connecting snap ring is fixedly connected to the bottom of the water tank.

[0016] Preferably, the driving assembly includes a screw rod screwed on the heater, a fixing ring sleeved on the screw rod and bearing-connected to the connecting snap ring, electric telescopic rods fixedly installed at the bottom of the fixing ring on both sides, and a fixing circular plate fixedly arranged at the bottom of the electric telescopic rods and fixedly connected to the bottom of the evaporation tank.

[0017] Preferably, the water tank is in a circular ring shape, and both the water tank and the connecting snap ring are screwed to the screw rod.

[0018] Preferably, a rotating plate is fixedly connected to the top of the screw rod, and the top of the rotating plate is fixedly connected to the top of the evaporation tank.

[0019] Preferably, a transmission mechanism for quickly transmitting the steam inside the evaporation tank to the condensation tank is arranged inside the transmission pipe.

[0020] Preferably, the transmission mechanism includes an inner rotating fan blade arranged inside the transmission pipe, a connecting plate fixedly arranged on the inner rotating fan blade, an outer rotating fan blade fixedly installed on the side of the connecting plate away from the inner rotating fan blade and sleeved on the outside of the transmission pipe, and the inner rotating fan blade and the connecting plate are installed at one end of the transmission pipe located inside the condensation tank.

[0021] Preferably, a rotating shaft is fixedly connected to the center of the inner rotating fan blade, a fixing frame is fixedly connected to the side of the rotating shaft close to the evaporation tank, and the fixing frame is triangular and fixedly connected to the inner wall of the transmission pipe.

[0022] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0023] Through the cooperation of structures such as the heater, the scraper, and the cleaning plate, the present invention facilitates the rapid heating and cleaning of the inside of the evaporation tank. The cleaning liquid to be recycled is injected into the evaporation tank through the feed pipe, and at the same time, an additive is added to the evaporation tank. Subsequently, the driving assembly is started to drive the heater to rotate and adjust its height simultaneously, so as to realize the uniform heating and evaporation of the wastewater in the evaporation tank. During the evaporation process, the stirring rod rotates synchronously to stir the wastewater, which not only improves the heating efficiency but also further enhances the heating effect. In addition, during the process of driving the heater to rotate, the driving assembly will also synchronously drive the extension plate and the cleaning plate to rotate, so that the scraper reciprocates along the inner wall of the evaporation tank, effectively scraping off the impurities attached to the inner wall, thereby realizing the automatic cleaning function of the inside of the evaporation tank, and solving the problem that when the existing cleaning liquid recovery device removes and recovers impurities through distillation, a large amount of impurity scale remains in the distillation chamber and is not easy to clean.

[0024] Through the cooperation of structures such as a water tank, a piston, and a driving component, the present invention facilitates the synchronous progress of the heater, the water tank, and the rotation and movement of the scraper. The electric telescopic rod drives the fixed ring to rise and fall, thereby driving the connecting snap ring engaged with it to move synchronously. During the process of the connecting snap ring sliding along the screw rod, it can rotate synchronously, thereby driving the water tank and the heater to rotate and move synchronously, realizing uniform heating and cleaning inside the evaporation tank. After use, the treated cleaning liquid is discharged along the discharge pipe. After discharge, the driving component drives the water tank and the scraper to rotate, rise, and move reciprocally inside the evaporation tank. During this process, in order to prevent scale that is relatively difficult to clean from forming on the inner wall of the evaporation tank, the electric cylinder can be used to squeeze the piston to spray the water flow inside the water tank along the nozzle, thereby achieving the effect of spraying and scraping simultaneously. The corrugated pipe can extend and contract accordingly, and in cooperation with an external water pump connected through a connecting pipe, sufficient water supply to the water tank is realized.

[0025] Through the cooperation of structures such as an inner rotating fan blade, a connecting plate, and an outer rotating fan blade, the present invention facilitates the uniform and rapid transfer of heat, improving the recovery efficiency. The hot gas after evaporation enters the condensation tank through the transmission pipe for condensation. In order to prevent the heat from being transferred slowly and unevenly during the transmission process, the transmission mechanism can be used to achieve rapid heat transfer. When the water vapor enters the condensation tank through the transmission pipe, the airflow drives the inner rotating fan blade inside the transmission pipe to rotate, thereby accelerating the transfer of heat to the condensation tank. At the same time, the rotation of the inner rotating fan blade will synchronously drive the connecting plate and the outer rotating fan blade to rotate, stirring the heat entering the condensation tank to make it quickly and evenly distributed, thereby achieving efficient and rapid cooling. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic structural diagram of the present invention;

[0027] Figure 2 is a schematic perspective sectional structural diagram of the present invention;

[0028] Figure 3 is Figure 2 a partially enlarged schematic diagram of the structure at A in

[0029] Figure 4 is Figure 2 a partially enlarged schematic diagram of the structure at B in

[0030] Figure 5 is a schematic diagram of the structural cooperation relationship between the evaporation tank and the cleaning mechanism of the present invention;

[0031] Figure 6 is Figure 5 a partially enlarged schematic diagram of the structure at C in

[0032] Figure 7Schematic diagram of the structural cooperation relationship between the spraying component and the driving component of the present invention;

[0033] Figure 8 is Figure 7 Schematic diagram of the enlarged partial structure at D in

[0034] Figure 9 Schematic diagram of the structural cooperation relationship between the water tank and the piston of the present invention;

[0035] Figure 10 Schematic diagram of the three-dimensional structure of the transmission mechanism of the present invention;

[0036] Figure 11 Schematic diagram of the structure of the crescent-shaped hollow turntable of the present invention.

[0037] In the figure: 1, evaporation tank; 11, feed pipe; 12, discharge pipe; 121, valve; 2, condensation tank; 3, mounting bracket; 4, transmission pipe; 5, cleaning mechanism; 51, heater; 511, stirring rod; 512, heating wire; 52, extension plate; 53, cleaning plate; 531, scraping plate; 54, spraying component; 541, water tank; 542, spray head; 543, piston; 544, electric cylinder; 545, connecting clamp; 55, driving component; 551, screw; 5511, rotating plate; 552, fixed ring; 553, electric telescopic rod; 554, fixed circular plate; 56, bellows; 561, connecting pipe; 6, transmission mechanism; 61, inner rotating fan blade; 611, rotating shaft; 62, connecting plate; 63, outer rotating fan blade; 64, fixed frame. 7, crescent-shaped hollow turntable; 71, crescent-shaped hollow area. Detailed implementation manners

[0038] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0039] As Figures 1 to 10 shown, the present invention provides a cleaning liquid recovery device for semiconductor wafer wet cleaning, including an evaporation tank 1, a feed pipe 11 fixedly arranged on the side of the evaporation tank 1, a discharge pipe 12 fixedly installed at the bottom of the evaporation tank 1, a valve 121 arranged on the discharge pipe 12, and a mounting bracket 3 fixedly arranged outside the evaporation tank 1 and the condensation tank 2. It further includes:

[0040] A condensation tank 2, and one side of the condensation tank 2 close to the evaporation tank 1 is fixedly connected with a transmission pipe 4 communicating with the evaporation tank 1;

[0041] The cleaning mechanism 5 is arranged inside the evaporation tank 1 and is used for cleaning the inner wall of the evaporation tank 1;

[0042] Among them, the cleaning mechanism 5 includes a heater 51, an extension plate 52 fixedly arranged on the side wall of the heater 51, a cleaning plate 53 fixedly installed at the bottom of the extension plate 52, a spraying assembly 54 arranged at the bottom of the heater 51 for spraying and cleaning, and a driving assembly 55 arranged at the center inside the evaporation tank 1 for adjusting the position of the heater 51. A plurality of scraping plates 531 arranged in a linear array are fixedly connected to one side of the cleaning plate 53 close to the inner wall of the heater 51. The plurality of scraping plates 531 are all arc-shaped and are used for scraping impurities on the inner wall of the evaporation tank 1;

[0043] A stirring rod 511 is fixedly arranged on the side of the heater 51 away from the extension plate 52, and an electric heating wire 512 is arranged inside the stirring rod 511.

[0044] Adopting the above scheme: During use, the cleaning liquid to be recycled is poured into the evaporation tank 1 along the feed pipe 11, and the additive is synchronously put into the evaporation tank 1. At this time, the driving assembly 55 drives the heater 51 to rotate while realizing height adjustment, so as to uniformly heat and evaporate the wastewater inside the evaporation tank 1. During the evaporation process, the stirring rod 511 realizes the stirring function, and at the same time, the internal stirring rod 511 is convenient for further heating, achieving an improved heating effect. During the process of driving the heater 51 to rotate by one end by the driving assembly 55, the extension plate 52 and the cleaning plate 53 can be synchronously driven to rotate, so that the scraping plates 531 reciprocally scrape the impurities on the inner wall of the evaporation tank 1, thereby realizing reasonable cleaning.

[0045] Such as Figures 6 to 10 As shown, the spraying assembly 54 includes a water tank 541 fixedly arranged at the bottom of the heater 51 and a spray head 542 fixedly installed on the outer wall of the water tank 541 close to one side of the heater 51. The water tank is also provided with a crescent-shaped hollow turntable 7. The crescent-shaped hollow turntable 7 is arranged in the middle of the pipeline and is used for opening and closing the pipeline. Gear teeth are sleeved on the outer circumferential surface of the crescent-shaped hollow turntable 7. The gear teeth are connected to one end of a reduction gear set, and the other end of the reduction gear set is connected to a heating pipe gear. A piston 543 in contact with the inner wall of the water tank 541 is slidably arranged inside the water tank 541. An electric cylinder 544 fixedly connected to the bottom of the water tank 541 is fixedly arranged at the bottom of the piston 543. A connecting snap ring 545 is fixedly connected to the bottom of the water tank 541;

[0046] The driving assembly 55 includes a screw rod 551 screwed onto the heater 51, a fixed ring 552 sleeved on the screw rod 551 and bearing-connected to the connecting clamping ring 545, electric telescopic rods 553 fixedly installed at the bottom of the fixed ring 552 on both sides, and a fixed circular plate 554 fixedly arranged at the bottom of the electric telescopic rods 553 and fixedly connected to the bottom of the evaporation tank 1. The water tank 541 is in a circular ring shape. Both the water tank 541 and the connecting clamping ring 545 are screwed onto the screw rod 551. The top of the screw rod 551 is fixedly connected with a rotating plate 5511, and the top of the rotating plate 5511 is fixedly connected with the top of the evaporation tank 1.

[0047] Adopting the above scheme: The fixed ring 552 is driven to rise or fall by the electric telescopic rod 553, and the connecting clamping ring 545 clamped to it moves synchronously. The connecting clamping ring 545 can rotate synchronously while sliding along the screw rod 551, thereby driving the water tank 541 and the heater 51 to rotate and move synchronously, realizing uniform heating and cleaning inside the evaporation tank 1. After use, the treated cleaning liquid is discharged through the discharge pipe 12. Subsequently, the driving assembly 55 is started to drive the water tank 541 and the scraper 531 to rotate back and forth and move up and down in the evaporation tank 1. To avoid the formation of scale that is difficult to clean on the inner wall of the evaporation tank 1, the electric cylinder 544 pushes the piston 543 to spray the water flow in the water tank 541 through the nozzle 542, achieving the effect of scraping while spraying. During this process, the corrugated pipe 56 can extend or shorten with the telescopic movement, and at the same time, an external water pump is connected through the connecting pipe 561 to ensure the continuous water supply of the water tank 541, thereby ensuring the high efficiency and thoroughness of the cleaning effect.

[0048] A crescent-shaped hollow turntable 7 is added in the middle of the pipeline for connecting the water source of the water tank 541 to the bottom, which is used to conduct and close the pipeline. Gear teeth are installed on the outside of the crescent-shaped hollow turntable 7. One end of the gear teeth is connected to the reduction gear set. The bottom of the heater 51 is sleeved with gear teeth, and the other end of the reduction gear set is connected and meshed with the gear teeth of the heater. It is installed on the top surface of the water tank 541. By setting the gear transmission ratio, when the horizontal liquid level of the evaporation tank 1 is at a low level, the water pipe is connected to the crescent-shaped hollow area, the water pipe is conducted, and the bottom nozzle is supplied with water. When the horizontal liquid level of the evaporation tank 1 is at a high level, the water pipe is connected to the non-crescent-shaped hollow area, the water pipe channel is blocked, and the bottom nozzle is not supplied with water. The length of the crescent-shaped hollow area 71 can be adjusted according to the size of the evaporation tank. The gear transmission ratio can be set according to the operating cycle law of the equipment and in coordination with the horizontal liquid level of the evaporation tank 1. Compared with a single float or liquid level sensor, this design has a low cost and simple means.

[0049] Adopting the above scheme, aiming at the blind area at the bottom of the evaporation tank of this cleaning mechanism, it avoids the problem that it is inconvenient to use mechanical means to clean due to the presence of the corrugated pipe 56 in the lower layer of the water tank 541. Multiple high-pressure nozzles are added at the bottom of the water tank 541 to wash the sediment with high pressure, and the water spraying is controlled by the high and low horizontal liquid level of the evaporation tank, effectively saving water.

[0050] As shown Figure 10 in the figure, a transmission mechanism 6 for quickly transmitting the steam inside the evaporation tank 1 to the condensation tank 2 is provided inside the transmission pipe 4;

[0051] The transmission mechanism 6 includes an inner rotating fan blade 61 arranged inside the transmission pipe 4, a connecting plate 62 fixedly arranged on the inner rotating fan blade 61, an outer rotating fan blade 63 fixedly installed on the side of the connecting plate 62 away from the inner rotating fan blade 61 and sleeved outside the transmission pipe 4. The inner rotating fan blade 61 and the connecting plate 62 are installed at one end of the transmission pipe 4 inside the condensation tank 2. A rotating shaft 611 is fixedly connected to the center of the inner rotating fan blade 61. A fixing frame 64 is fixedly connected to the side of the rotating shaft 611 close to the evaporation tank 1. The fixing frame 64 is triangular and fixedly connected to the inner wall of the transmission pipe 4.

[0052] Adopting the above scheme: The hot gas after evaporation enters the inside of the condensation tank 2 through the transmission pipe 4 for condensation. In order to avoid slow heat transfer and uneven heat distribution during the transmission process, the transmission mechanism 6 can be used to achieve rapid heat transfer. When water vapor enters the condensation tank 2 through the transmission pipe 4, it will generate an air flow to drive the inner rotating fan blade 61 inside the transmission pipe 4 to rotate, thereby transferring the heat inside the transmission pipe 4 to the condensation tank 2. During the rotation of the inner rotating fan blade 61, the connecting plate 62 and the outer rotating fan blade 63 will be driven to rotate synchronously, stirring the heat transferred to the condensation tank 2 and quickly transmitting the internal heat evenly, which is convenient for achieving rapid cooling.

[0053] The working principle and usage process of the present invention: When using this device, first, the cleaning liquid to be processed is injected into the evaporation tank 1 through the feed pipe 11 for evaporation treatment. During the evaporation process, the driving component 55 is started to drive the heater 51 to rotate and move, so as to realize uniform heating of the cleaning liquid and avoid local overheating or insufficient heating. The heat generated by heating is quickly and evenly transferred to the condensation tank 2 through the cooperation of the transmission pipe 4 and the transmission mechanism 6 for condensation, significantly improving the recovery efficiency.

[0054] When the device is used up, the electric telescopic rod 553 is started to push the fixed ring 552 to move up or down. Since the fixed ring 552 and the connecting clamping ring 545 are connected through a clamping structure, the connecting clamping ring 545 can rotate synchronously while sliding on the screw rod 551, thereby driving the cleaning plate 53 and the water tank 541 to rotate and move together. During this process, the water in the water tank 541 is sprayed out through the nozzle 542 to achieve comprehensive cleaning of the inside of the evaporation tank 1, ensuring the cleanliness of the equipment and extending its service life.

[0055] It should be noted that in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variation thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or elements inherent to such process, method, article or device.

[0056] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cleaning liquid recovery device for wet cleaning of semiconductor wafers, comprising an evaporation tank (1), a feed pipe (11) fixedly arranged on the side of the evaporation tank (1), a discharge pipe (12) fixedly arranged on the bottom of the evaporation tank (1), a valve (121) arranged on the discharge pipe (12), and a mounting bracket (3) fixedly arranged outside the evaporation tank (1) and a condensation tank (2), characterized in that: Also includes: A condensing tank (2), wherein a transmission pipe (4) communicating with the evaporating tank (1) is fixedly connected to a side of the condensing tank (2) close to the evaporating tank (1); A cleaning mechanism (5), wherein the cleaning mechanism (5) is arranged inside the evaporation tank (1) and is used to clean the inner wall of the evaporation tank (1); The cleaning mechanism (5) comprises a heater (51), an extension plate (52) fixedly arranged on a side wall of the heater (51), a cleaning plate (53) fixedly installed on the bottom of the extension plate (52), a spraying assembly (54) arranged at the bottom of the heater (51) for spraying and cleaning, and a driving assembly (55) arranged at the center of the evaporation tank (1) for adjusting the position of the heater (51); A stirring rod (511) is fixedly arranged on one side of the heater (51) away from the extension plate (52), and a heating wire (512) is arranged inside the stirring rod (511).

2. The semiconductor wafer wet cleaning cleaning liquid recovery device according to claim 1, characterized in that: A plurality of scrapers (531) arranged in a linear array are fixedly connected to one side of the cleaning plate (53) close to the inner wall of the heater (51); the plurality of scrapers (531) are all in an arc shape and are used to scrape impurities on the inner wall of the evaporation tank (1).

3. The semiconductor wafer wet cleaning cleaning liquid recovery device according to claim 1, characterized in that: The spray assembly (54) comprises a water tank (541) fixedly arranged at the bottom of the heater (51) and a spray head (542) fixedly installed on the outer wall of the water tank (541) on a side close to the heater (51); The water tank is also provided with a crescent hollow turntable, which is arranged in the middle of the pipeline and is used to open and close the conducting pipeline. The outer circumferential surface of the crescent hollow turntable is sleeved with gear teeth, and the gear teeth are connected to one end of the reduction gear set, and the other end of the reduction gear set is connected to the heating tube gear.

4. The semiconductor wafer wet cleaning cleaning liquid recovery device according to claim 3, characterized in that: The water tank (541) is provided with a piston (543) slidingly disposed inside and in contact with the inner wall thereof, the bottom of the piston (543) is fixedly provided with an electric cylinder (544) fixedly connected to the bottom of the water tank (541), and the bottom of the water tank (541) is fixedly connected with a connecting clamp (545).

5. The semiconductor wafer wet cleaning cleaning liquid recovery device according to claim 4, characterized in that: The driving assembly (55) comprises a screw rod (551) screwed onto the heater (51), a fixing ring (552) sleeved on the screw rod (551) and connected to a bearing of a connecting clamp ring (545), an electric telescopic rod (553) fixedly mounted on both sides of the bottom of the fixing ring (552), and a fixing circular plate (554) fixedly arranged at the bottom of the electric telescopic rod (553) and fixedly connected to the bottom of the evaporation tank (1).

6. The semiconductor wafer wet cleaning cleaning liquid recovery device according to claim 3, characterized in that: The water tank (541) is in the shape of a ring, and the water tank (541) and the connecting clamp ring (545) are both screwed to the screw rod (551).

7. The semiconductor wafer wet cleaning cleaning liquid recovery device according to claim 5, characterized in that: The top of the screw rod (551) is fixedly connected to a rotating plate (5511), and the top of the rotating plate (5511) is fixedly connected to the top of the evaporation tank (1).

8. The semiconductor wafer wet cleaning cleaning liquid recovery device according to claim 1, characterized in that: The interior of the transmission pipe (4) is provided with a transmission mechanism (6) for quickly transmitting the steam inside the evaporation tank (1) to the condensation tank (2).

9. The semiconductor wafer wet cleaning cleaning liquid recovery device according to claim 8, characterized in that: The transmission mechanism (6) comprises an inwardly rotating fan blade (61) arranged inside the transmission tube (4), a connecting plate (62) fixedly arranged on the inwardly rotating fan blade (61), and an outwardly rotating fan blade (63) fixedly mounted on a side of the connecting plate (62) away from the inwardly rotating fan blade (61) and sleeved on the outside of the transmission tube (4); the inwardly rotating fan blade (61) and the connecting plate (62) are mounted on one end of the transmission tube (4) located inside the condensation tank (2).

10. The semiconductor wafer wet cleaning cleaning liquid recovery device according to claim 9, characterized in that: A rotating shaft (611) is fixedly connected at the center of the inwardly rotating fan blade (61), and a fixing frame (64) is fixedly connected to a side of the rotating shaft (611) close to the evaporation tank (1); the fixing frame (64) is triangular in shape and fixedly connected to the inner wall of the transmission pipe (4).

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