Design method, device and equipment of crystallizer copper plate water seam and medium

Abstract

The invention discloses a crystallizer copper plate water seam design method, device and equipment and a medium, and belongs to the technical field of metallurgy. The method comprises the steps that the old size of an old copper plate water seam of a crystallizer, the crack state of an old copper plate and the temperature during operation are obtained; the crack state comprises a crack state and a crack-free state; and if the crack state is that the crack exists or the temperature variation in the set time period is larger than a preset temperature threshold value, the old size is adjusted, and the adjusted old size serves as the new size of the new copper plate water seam of the crystallizer. According to the method, when the old copper plate has cracks or temperature fluctuation is large, the size of the water seam of the old copper plate is adjusted, and the adjusted size serves as the new size of the water seam of the new copper plate, so that the water seam of the new copper plate has better heat transfer uniformity, and the solidification uniformity of a blank shell is improved.

Description

Technical Field

[0001] The present invention relates to the field of metallurgical technology, and in particular to a design method, device, equipment and medium for the water gap of a mold copper plate. Background Art

[0002] In the process of steel metallurgy, the continuous caster plays a crucial role. The mold, as the most important equipment of the continuous caster, is called the heart of the continuous caster. Under the cooling effect of the mold, the molten steel forms a shell to wrap the molten steel and provide support for it.

[0003] In the prior art, the cooling method of the mold is water cooling. To avoid potential safety hazards caused by direct contact between the cooling water and the molten steel, generally, water gaps are opened in the copper plate of the mold, and the water gaps are sealed with a back plate to make the cooling water flow in the water gaps, playing a role in cooling the molten steel.

[0004] However, the heat transfer uniformity of the existing water gaps in the mold copper plate is poor, resulting in uneven solidification of the shell. Summary of the Invention

[0005] In view of the above problems, the present invention is proposed to provide a design method, device, equipment and medium for the water gap of a mold copper plate to solve the above problems. When there are cracks or large temperature fluctuations in the old copper plate, the size of the water gap of the old copper plate can be adjusted, and the adjusted size is used as the new size of the water gap of the new copper plate, so that the new copper plate water gap has better heat transfer uniformity and improves the uniformity of shell solidification.

[0006] In a first aspect, the present invention provides a design method for the water gap of a mold copper plate, the method comprising:

[0007] Obtaining the old size of the water gap of the old copper plate of the mold, as well as the crack state and the temperature during operation of the old copper plate; the crack state includes having cracks and no cracks;

[0008] If the crack state is having cracks or the change amount of the temperature within a set time period is greater than a preset temperature threshold, then adjust the old size, and use the adjusted old size as the new size of the water gap of the new copper plate of the mold.

[0009] Optionally, the old size includes at least one of an old width and an old depth.

[0010] Optionally, the old copper plate is divided into multiple regions, and temperature detection points are provided in each region. If the crack state is having cracks or the change amount of the temperature within a set time period is greater than a preset temperature threshold, then adjusting the old size includes:

[0011] If the change in temperature within a set time period is greater than a preset temperature threshold, determine the region where the temperature detection point with the change in temperature greater than the temperature threshold is located, and denote it as the first target region;

[0012] Increase the old width of the old copper plate water gap within the first target region or decrease the old depth of the old copper plate water gap within the first target region.

[0013] Optionally, the old copper plate includes a wide - face old copper plate and a narrow - face old copper plate, the old copper plate is divided into multiple regions, the mold includes an immersion nozzle. If the crack state is "having cracks" or the change in temperature within a set time period is greater than a preset temperature threshold, adjusting the old dimensions includes:

[0014] If the change in temperature within a set time period is greater than a preset temperature threshold, determine the region where the corner where the wide - face old copper plate and the narrow - face old copper plate are joined or the region closest to the immersion nozzle as the first target region;

[0015] Increase the old width of the old copper plate water gap within the first target region or decrease the old depth of the old copper plate water gap within the first target region.

[0016] Optionally, the old copper plate is divided into multiple regions. If the crack state is "having cracks" or the change in temperature within a set time period is greater than a preset temperature threshold, adjusting the old dimensions includes:

[0017] If the crack state is "having cracks", determine the region where the crack is located, and denote it as the second target region;

[0018] Decrease the old width of the old copper plate water gap within the second target region or increase the old depth of the old copper plate water gap within the second target region.

[0019] Optionally, the old copper plate is divided into multiple regions, the mold includes an immersion nozzle. If the crack state is "having cracks" or the change in temperature within a set time period is greater than a preset temperature threshold, adjusting the old dimensions includes:

[0020] If the crack state is "having cracks", determine the region corresponding to the position where the molten steel flows back at the immersion nozzle as the second target region;

[0021] Decrease the old width of the old copper plate water gap within the second target region or increase the old depth of the old copper plate water gap within the second target region.

[0022] Optionally, the old dimensions further include an old shape, and adjusting the old dimensions includes:

[0023] Adjust the old width or the old thickness while keeping the old shape unchanged.

[0024] In a second aspect, the present invention provides a design device for the water gap of a mold copper plate, the device comprising:

[0025] An acquisition module for acquiring the old dimensions of the old copper plate water gap of the mold, as well as the crack state of the old copper plate and the temperature during operation; the crack state includes having cracks and no cracks;

[0026] An adjustment module for, if the crack state is having cracks or the change amount of the temperature within a set time period is greater than a preset temperature threshold, adjusting the old dimensions and taking the adjusted old dimensions as the new dimensions of the new copper plate water gap of the mold.

[0027] In a third aspect, the present invention provides an electronic device, comprising: a memory and a processor, the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor executes the computer instructions to execute the method as described in the first aspect.

[0028] In a fourth aspect, the present invention provides a computer-readable storage medium, the computer-readable storage medium stores computer instructions, and the computer instructions are used to cause the computer to execute the method as described in the first aspect.

[0029] The technical solutions provided in the embodiments of the present invention at least have the following technical effects or advantages:

[0030] A design method, device, equipment and medium for the water gap of a mold copper plate provided in the embodiments of the present invention acquire the old dimensions of the old copper plate water gap of the mold, as well as the crack state of the old copper plate and the temperature during operation, and understand the heat transfer uniformity of the old copper plate; if the crack state is having cracks or the change amount of the temperature within a set time period is greater than a preset temperature threshold, indicating that the heat transfer uniformity of the old copper plate is poor, then adjust the old dimensions and take the adjusted old dimensions as the new dimensions of the new copper plate water gap of the mold, and improve the heat transfer uniformity of the new copper plate through the new dimensions, improve the solidification uniformity of the billet shell, thereby reducing the cracks on the copper plate.

[0031] The above description is only an overview of the technical solutions of the present invention. In order to be able to understand the technical means of the present invention more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention are specifically exemplified below. Description of the Drawings

[0032] Various other advantages and benefits will become clear to those of ordinary skill in the art by reading the following detailed description of the preferred embodiments. The drawings are only for the purpose of showing the preferred embodiments and are not considered to be a limitation of the present invention. Also, throughout the drawings, the same reference symbols are used to represent the same components. In the drawings:

[0033] Figure 1 is a flowchart of a design method for the water gap of the crystallizer copper plate provided by an embodiment of the present invention;

[0034] Figure 2 is a structural block diagram of a design device for the water gap of the crystallizer copper plate provided by an embodiment of the present invention. Detailed Embodiments

[0035] To make the objectives, technical solutions, and advantages of the present application clearer, the following will further describe the embodiments of the present application in detail with reference to the drawings. It should be understood that the embodiments of the present disclosure and the specific features in the embodiments are detailed descriptions of the technical solutions of the present application, rather than limitations on the technical solutions of the present application. Without conflict, the technical features in the embodiments of the present application and the embodiments can be combined with each other.

[0036] Before introducing in detail the design method for the water gap of the crystallizer copper plate provided by an embodiment of the present invention, a brief introduction to the implementation environment involved will be given first.

[0037] The crystallizer is used to cool the molten steel so that the molten steel gradually solidifies into a shell with the required specifications and shapes. The crystallizer includes a copper plate and an immersion nozzle. The copper plate is arranged on the inner wall of the crystallizer. A water gap is formed on the copper plate, and the water gap is sealed by a back plate so that the cooling water flows in the water gap to play a role in cooling the molten steel. The immersion nozzle is a refractory casting sleeve inserted below the molten steel surface in the crystallizer and is used to introduce the molten steel into the crystallizer. The immersion nozzle has side holes, and the molten steel flows into the crystallizer through the side holes.

[0038] Among them, the copper plate covers the inner wall of the crystallizer, and multiple water gaps will be formed on the copper plate. The multiple water gaps are distributed on the copper plate so that the four sides of the crystallizer can be cooled. The size of each water gap in the prior art is the same, so that the cooling intensity in different areas of the copper plate is the same.

[0039] Figure 1 is a flowchart of a design method for the water gap of the crystallizer copper plate provided by an embodiment of the present invention. As Figure 1 shown, the method includes:

[0040] Step S110: Obtain the old size of the water gap of the old copper plate of the crystallizer, as well as the crack state and the temperature during operation of the old copper plate.

[0041] Among them, the crack state includes having cracks and no cracks.

[0042] In the design method of the embodiment of the present application, based on the old dimensions of the old copper plate water gap, the new dimensions of the new copper plate water gap are designed to minimize the changes and save the design cost. The old dimensions can be obtained from the design scheme of the old copper plate water gap. During the operation of the old copper plate, the temperature of the copper plate is detected in real time through a thermocouple. Check the surface condition of the old copper plate to obtain the crack state to understand whether there are cracks on the old copper plate.

[0043] Step S120: If the crack state is cracked or the change amount of the temperature within a set time period is greater than a preset temperature threshold, adjust the old dimensions, and use the adjusted old dimensions as the new dimensions of the new copper plate water gap of the mold.

[0044] In the embodiment of the present application, if the crack state is cracked, it indicates that the old copper plate is unevenly heated during operation, resulting in cracks on the old copper plate. If the change amount of the temperature within a set time period is greater than a preset temperature threshold, it indicates that the temperature of the old copper plate fluctuates greatly for a long time during operation and is unevenly heated. If the old copper plate has an uneven heating situation, it means that the old dimensions of the old copper plate water gap are not reasonably designed, resulting in the cooling intensity not meeting the production requirements. Therefore, the old dimensions can be adjusted to obtain new dimensions, and the new copper plate water gap is designed according to the new dimensions, so as to improve the heating uniformity of the new copper plate, thereby improving the solidification uniformity of the billet shell and the casting stability, further reducing the cracks on the new copper plate, reducing the grinding amount of the new copper plate when it is taken off the production line, and increasing the number of times the new copper plate can be used.

[0045] Among them, the duration of the set time period can be set according to the situation. For example, divide the entire operation cycle of the old copper plate into multiple set time periods, and then check the temperature fluctuation situation within each set time period.

[0046] Optionally, the old dimensions include at least one of the old width and the old depth.

[0047] In the embodiment of the present application, by adjusting the old width or the old depth of the water gap, the cooling intensity of the water gap can be changed, thereby improving the heating uniformity of the copper plate.

[0048] Optionally, the old dimensions further include the old shape, and adjusting the old dimensions includes: adjusting the old width or the old thickness while keeping the old shape unchanged.

[0049] In the embodiment of the present application, the old width or the old depth of the water gap can be adjusted, but the old shape needs to be kept unchanged, that is, the shape of the new copper plate water gap should be the same as that of the old copper plate water gap, so as to ensure that the cooling effect brought by the adjusted old dimensions can be closer to the expected value.

[0050] In the embodiments of the present application, the old copper plate can also be divided into multiple regions, and a temperature detection point is provided in each region. A thermocouple is arranged at each temperature detection point, and the temperature of the temperature detection point is detected by the thermocouple. The temperature of this region is reflected by the temperature of the temperature detection point in each region. Each region may correspond to one or more water gaps of the old copper plate.

[0051] Optionally, step S120 includes:

[0052] If the change amount of the temperature within the set time period is greater than the preset temperature threshold, determine the region where the temperature detection point with the change amount greater than the temperature threshold is located, denoted as the first target region; increase the old width of the water gap of the old copper plate in the first target region or decrease the old depth of the water gap of the old copper plate in the first target region.

[0053] In the embodiments of the present application, if the change amount of the temperature within the set time period is greater than the preset temperature threshold, it indicates that the temperature fluctuates for a long time. Then, determine which temperature detection points have long-term temperature fluctuations, and then determine the regions where these temperature detection points are located, denoted as the first target regions, that is, the temperatures of the first target regions fluctuate for a long time. Next, adjust the old dimensions of the water gaps of the old copper plates corresponding to the first target regions.

[0054] Specifically, increase the old width of the water gap of the old copper plate in the first target region, so that the water flow velocity in the water gap in the first target region decreases, reducing the heat transfer effect, thereby reducing the cooling intensity of the first target region. Or, decrease the old depth of the water gap of the old copper plate in the first target region, so that the distance between the cooling water in the water gap and the molten steel becomes farther, thereby reducing the cooling intensity of the first target region. Because the long-term temperature fluctuation in the first target region may be caused by too strong cooling intensity in the first target region, reducing the cooling intensity of the first target region can reduce the temperature fluctuation in the first target region, making the sizes of the water gaps of the new copper plates in different regions different, adapting to the different requirements for cooling intensity in different regions, and improving the heat absorption uniformity and shell solidification uniformity of the entire copper plate.

[0055] It should be noted that during the production process, affected by the molten steel flow field in the mold, the cooling intensity required in different regions of the mold may be different, while the sizes of all the water gaps on the old copper plate are the same, resulting in the same cooling intensity in all regions of the mold. Therefore, the water gaps with the same size can no longer meet the requirements for stable production in the current environment. Therefore, adjust the old dimensions of the regions with too strong cooling intensity to reduce the cooling intensity of the over-strong regions, so that the size of the water gap in each region matches the cooling intensity requirement of each region.

[0056] In the embodiments of the present application, the old copper plate includes a wide-side old copper plate and a narrow-side old copper plate, and the wide-side old copper plate and the narrow-side old copper plate are spliced together to cover the inside of the mold with copper plates.

[0057] Optionally, step S120 includes:

[0058] If the change in temperature within a set time period is greater than a preset temperature threshold, then the area where the corner formed by the combination of the wide-side old copper plate and the narrow-side old copper plate is located or the area closest to the submerged entry nozzle is determined as the first target area; increase the old width of the water gap of the old copper plate within the first target area or decrease the old depth of the water gap of the old copper plate within the first target area.

[0059] In the embodiment of the present application, if the change in temperature within a set time period is greater than a preset temperature threshold, it indicates that the temperature fluctuates for a long time and the heat transfer of the copper plate is too fast, resulting in uneven solidification of the billet shell. The areas most likely to have this situation are the area where the corner formed by the combination of the wide-side old copper plate and the narrow-side old copper plate is located or the area closest to the submerged entry nozzle. Because the corner where the wide-side old copper plate and the narrow-side old copper plate are combined is not easy to conduct heat, and the demand for cooling intensity is poor. And the gap formed between the copper plate in the area closest to the submerged entry nozzle and the submerged entry nozzle is small, the molten steel contained is less, and the required cooling intensity is less. Therefore, these two areas are used as the first target areas. Reducing the cooling intensity of these two areas can make the heat uniformity of the mold better.

[0060] Optionally, step S120 includes:

[0061] If the crack state is cracked, then determine the area where the crack is located, denoted as the second target area; reduce the old width of the water gap of the old copper plate within the second target area or increase the old depth of the water gap of the old copper plate within the second target area.

[0062] In the embodiment of the present application, if there is a crack on the old copper plate, it indicates that the old copper plate is locally overheated, resulting in cracks due to long-term fatigue. Then determine the area where the crack is located, thereby determining the overheated area, and denote it as the second target area; reduce the old width of the water gap of the old copper plate within the second target area, increase the water flow rate of the water gap, improve the cooling intensity of the second target area, and reduce the temperature of the copper plate in the second target area; or increase the old depth of the water gap of the old copper plate within the second target area, making the distance between the cooling water and the molten steel closer, which is more conducive to cooling the molten steel, that is, improving the cooling intensity, thereby reducing the temperature of the copper plate in the second target area and further reducing the cracks.

[0063] Optionally, step S120 includes:

[0064] If the crack state is cracked, then determine the area corresponding to the position where the molten steel flows back at the submerged entry nozzle as the second target area; reduce the old width of the water gap of the old copper plate within the second target area or increase the old depth of the water gap of the old copper plate within the second target area.

[0065] In the embodiment of the present application, if there are cracks in the old copper plate, it indicates that the old copper plate is locally overheated. The most likely area where overheating occurs is the area corresponding to the position of the upward steel flow in the flow field of the submerged nozzle. Because the steel liquid flow velocity in the upward flow area is relatively fast and a stronger cooling intensity is required, the cooling intensity of the water gap with the old size cannot meet the cooling demand. Therefore, this area is determined as the second target area, and then the old width of the water gap of the old copper plate in the second target area is reduced or the old depth of the water gap of the old copper plate in the second target area is increased to improve the cooling intensity of the second target area, so that the temperature of the copper plate in the second target area is reduced, overheating does not occur, and the occurrence of cracks is reduced.

[0066] In the embodiment of the present application, by adjusting the old size of the water gap in the first target area or the second target area, the size of the water gap in different areas is matched with the cooling intensity requirements of different areas, thereby improving the heat uniformity of the steel plate and the solidification uniformity of the billet shell, and reducing the occurrence of cracks.

[0067] Of course, the old sizes of other areas except the first target area and the second target area may not be adjusted, or may be slightly adjusted according to the actual situation to make the cooling effect better.

[0068] It should be noted that the water gap size of the new copper plate can be designed individually according to the conditions of different old copper plates.

[0069] In the embodiment of the present application, after designing the new size of the water gap of the new copper plate, the new copper plate can be directly produced and processed. However, since there may be a difference between the expected effect of the designed new size and the actual application effect, when the new copper plate is processed and the actual application does not meet the expectation, the new copper plate may face the risk of being scrapped, resulting in a large economic loss. Therefore, a cover plate with a certain size can be processed, and the old size of the water gap of the old steel plate can be adjusted through the cover plate.

[0070] For example, the cover plate is directly covered above the water gap of the old steel plate, and the old size of the water gap of the old steel plate is adjusted by the thickness, width or shape of the cover plate, which not only achieves the purpose of optimizing the water gap structure, but also reduces the risk of scrapping when directly processing the water gap of the new copper plate, and has high feasibility.

[0071] Based on the same inventive concept, the embodiment of the present invention also provides a design device for the water gap of the mold copper plate. Figure 2 It is a structural block diagram of a design device for the water gap of the mold copper plate provided by the embodiment of the present invention, as Figure 2 shown. The device 200 includes an acquisition module 201 and an adjustment module 202.

[0072] The acquisition module 201 is used to acquire the old size of the water gap of the old copper plate of the mold, as well as the crack state and the temperature during operation of the old copper plate; the crack state includes having cracks and no cracks.

[0073] The adjustment module 202 is configured to adjust the old dimensions if the crack state is cracked or the change in temperature within a set time period is greater than a preset temperature threshold, and use the adjusted old dimensions as the new dimensions of the water gap of the new copper plate of the mold.

[0074] Optionally, the old dimensions include at least one of an old width and an old depth.

[0075] Optionally, a plurality of temperature detection points are arranged on the old copper plate, and the old copper plate is divided into a plurality of regions. The adjustment module 202 is further configured to:

[0076] If the change in temperature within a set time period is greater than a preset temperature threshold, determine the region where the temperature detection point with a change in temperature greater than the temperature threshold is located, and denote it as the first target region;

[0077] Increase the old width of the water gap of the old copper plate in the first target region or decrease the old depth of the water gap of the old copper plate in the first target region.

[0078] Optionally, the old copper plate includes a wide-side old copper plate and a narrow-side old copper plate, the old copper plate is divided into a plurality of regions, and the mold includes a submerged nozzle. The adjustment module 202 is further configured to:

[0079] If the change in temperature within a set time period is greater than a preset temperature threshold, determine the region where the corner formed by combining the wide-side old copper plate and the narrow-side old copper plate is located or the region closest to the submerged nozzle as the first target region;

[0080] Increase the old width of the water gap of the old copper plate in the first target region or decrease the old depth of the water gap of the old copper plate in the first target region.

[0081] Optionally, the old copper plate is divided into a plurality of regions. The adjustment module 202 is further configured to:

[0082] If the crack state is cracked, determine the region where the crack is located, and denote it as the second target region;

[0083] Decrease the old width of the water gap of the old copper plate in the second target region or increase the old depth of the water gap of the old copper plate in the second target region.

[0084] Optionally, the old copper plate is divided into a plurality of regions, and the mold includes a submerged nozzle. The adjustment module 202 is further configured to:

[0085] If the crack state is cracked, determine the region corresponding to the position where the molten steel backflows at the submerged nozzle as the second target region;

[0086] Decrease the old width of the water gap of the old copper plate in the second target region or increase the old depth of the water gap of the old copper plate in the second target region.

[0087] Optionally, the old size further includes an old shape, and the adjustment module 202 is further configured to:

[0088] Adjust the old width or the old thickness while keeping the old shape unchanged.

[0089] It can be understood that the devices provided in the above embodiments are only illustrated by dividing the above function modules. In actual applications, the above functions can be allocated to different function modules according to needs, that is, the internal structure of the device is divided into different function modules to complete all or part of the functions described above.

[0090] An embodiment of the present invention further provides an electronic device, which may include a processor and a memory, and the processor and the memory may be communicatively connected to each other through a bus or other means.

[0091] The processor may be a central processing unit (CPU), or an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present application, or may also be other general purpose processors, digital signal processors (DSPs), application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. chips, or a combination of the above types of chips.

[0092] The memory may include a mass storage for data or instructions. By way of example and not limitation, the memory may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disc, a magneto-optical disc, a magnetic tape, or a universal serial bus (USB) drive, or a combination of two or more of these. In a suitable case, the memory may include a removable or non-removable (or fixed) medium. In a suitable case, the memory may be internal or external to the electronic device. In a particular embodiment, the memory may be a non-volatile solid state memory.

[0093] In one example, the memory may be a Read Only Memory (ROM). In one example, the ROM may be a mask-programmed ROM, a Programmable ROM (PROM), an Erasable PROM (EPROM), an Electrically Erasable PROM (EEPROM), an Electrically Alterable ROM (EAROM), or a flash memory, or a combination of two or more of these.

[0094] The processor reads and executes the computer program instructions stored in the memory to implement any one of the design methods of the crystallizer copper plate water gap in the above embodiments.

[0095] In one example, the electronic device may further include a communication interface and a bus. Among them, the processor, the memory, and the communication interface are connected through the bus and complete communication with each other. The communication interface is mainly used to implement communication between various modules, devices, units, and / or devices in the embodiments of the present application. In a suitable case, the bus may include one or more buses.

[0096] In addition, in combination with the design method of the crystallizer copper plate water gap in the above embodiments, the embodiments of the present invention can be implemented by providing a computer-readable storage medium. Computer program instructions are stored on the computer-readable storage medium; when the computer program instructions are executed by the processor, any one of the design methods of the crystallizer copper plate water gap in the above embodiments is implemented.

[0097] Those skilled in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The program can be stored in a computer-readable storage medium. When the program is executed, it may include the processes of the embodiments of the above methods. Among them, the storage medium may be a Read-Only Memory (ROM), a Random Access Memory (RAM), a Flash Memory, a Hard Disk Drive (HDD), or a Solid-State Drive (SSD), etc.; the storage medium may also include a combination of the above types of memories.

[0098] The technical solutions in the embodiments of the present application at least have the following technical effects or advantages:

[0099] A design method, device, equipment and medium for the water gap of a mold copper plate provided by an embodiment of the present invention. Obtain the old dimensions of the water gap of the old copper plate of the mold, as well as the crack state of the old copper plate and the temperature during operation, and understand the heat transfer uniformity of the old copper plate. If the crack state is cracked or the change in temperature within a set time period is greater than a preset temperature threshold, it indicates that the heat transfer uniformity of the old copper plate is poor. Then adjust the old dimensions, and use the adjusted old dimensions as the new dimensions of the water gap of the new copper plate of the mold. Improve the heat transfer uniformity of the new copper plate through the new dimensions, improve the solidification uniformity of the billet shell, and thus reduce the cracks on the copper plate.

[0100] In the specification provided herein, a large number of specific details are set forth. It is, however, understood that embodiments of the present invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail so as not to obscure an understanding of this description.

[0101] Similarly, it should be understood that in order to streamline this disclosure and assist in understanding one or more of the various inventive aspects, in the foregoing description of the exemplary embodiments of the present invention, the various features of the present invention are sometimes grouped together in a single embodiment, figure, or description thereof. However, the disclosed method should not be construed as reflecting an intention that: the claimed invention requires more features than are expressly recited in each claim. Rather, as the following claims reflect, the inventive aspects lie in less than all the features of the single foregoing disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of the present invention.

[0102] It should be noted that the above embodiments illustrate the present invention rather than limit the present invention, and those skilled in the art can design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present invention can be implemented by means of hardware including several different elements and by means of a suitably programmed computer. In the unit claims listing several means, several of these means may be embodied by one and the same item of hardware. The use of the words first, second, and third, etc. does not denote any order. These words may be interpreted as names.

Claims

1. A design method for a water seam of a crystallizer copper plate, characterized in that: The method comprises: Obtaining the old size of the water gap of the old copper plate of the crystallizer, the crack state of the old copper plate and the temperature during operation; the crack state includes cracks and no cracks; If the crack state is that there is a crack or the temperature change within the set time period is greater than a preset temperature threshold, the old size is adjusted, and the adjusted old size is used as the new size of the new copper plate water seam of the crystallizer.

2. The method for designing a water seam of a crystallizer copper plate according to claim 1, characterized in that: The old size includes at least one of an old width and an old depth.

3. The design method of the water seam of the crystallizer copper plate according to claim 2 is characterized in that: The old copper plate is divided into a plurality of regions, each region is provided with a temperature detection point, and if the crack state is that there is a crack or the temperature change in a set time period is greater than a preset temperature threshold, the old size is adjusted, including: If the temperature variation within the set time period is greater than a preset temperature threshold, then determine the area where the temperature detection point where the variation is greater than the temperature threshold is located, and record it as the first target area; Increase the old width of the old copper plate water seam in the first target area or reduce the old depth of the old copper plate water seam in the first target area.

4. The method for designing a water gap of a crystallizer copper plate according to claim 2, characterized in that: The old copper plate includes a wide old copper plate and a narrow old copper plate, the old copper plate is divided into a plurality of regions, the crystallizer includes an immersion nozzle, and if the crack state is that there is a crack or the temperature change in a set time period is greater than a preset temperature threshold, then adjusting the old size includes: If the temperature variation within the set time period is greater than a preset temperature threshold, the area where the corner of the wide-surface old copper plate and the narrow-surface old copper plate are combined or the area closest to the immersion nozzle is determined as the first target area; Increase the old width of the old copper plate water gap in the first target area or reduce the old depth of the old copper plate water gap in the first target area.

5. The method for designing a water seam of a crystallizer copper plate according to claim 2, characterized in that: The old copper plate is divided into a plurality of regions, and if the crack state is that there is a crack or the temperature change in a set time period is greater than a preset temperature threshold, then adjusting the old size includes: If the crack state is the cracked state, determining the area where the crack is located and recording it as the second target area; Reduce the old width of the old copper plate water gap in the second target area or increase the old depth of the old copper plate water gap in the second target area.

6. The method for designing a water gap of a crystallizer copper plate according to claim 2, characterized in that: The old copper plate is divided into a plurality of regions, the crystallizer includes an immersion nozzle, and if the crack state is that there is a crack or the temperature change in a set time period is greater than a preset temperature threshold, adjusting the old size includes: If the crack state is the cracked state, determining the area corresponding to the position of the molten steel upper backflow at the submerged nozzle as the second target area; Reduce the old width of the old copper plate water gap in the second target area or increase the old depth of the old copper plate water gap in the second target area.

7. The method for designing a water gap of a crystallizer copper plate according to claim 2, characterized in that: The old size also includes an old shape, and adjusting the old size includes: The old width or the old thickness is adjusted to keep the old shape unchanged.

8. A design device for a water gap in a crystallizer copper plate, characterized in that: The device comprises: An acquisition module is used to acquire the old size of the water gap of the old copper plate of the crystallizer, the crack state of the old copper plate and the temperature during operation; the crack state includes cracks and no cracks; The adjustment module is used to adjust the old size if the crack state is that there is a crack or the temperature change within a set time period is greater than a preset temperature threshold, and use the adjusted old size as the new size of the new copper plate water seam of the crystallizer.

9. An electronic device, characterized in that: include: A memory and a processor, wherein the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor executes the method according to any one of claims 1 to 7 by executing the computer instructions.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to cause the computer to execute the method according to any one of claims 1 to 7.

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