Method, system and apparatus for grinding and polishing

Abstract

The application discloses a grinding and polishing method, system and device, wherein the grinding and polishing method rotates a dividing table along a first direction to rotate a worktable fixed with a workpiece to a first grinding mechanism, a second grinding mechanism and a polishing mechanism in sequence for grinding; after polishing, the top surface of the workpiece is cleaned and dried; the dividing table is rotated along a second direction to drive the workpiece to rotate to the second grinding mechanism, and the worktable is driven to rotate; when it is determined that the workpiece moves through a roughness detection assembly, a signal of the roughness detection assembly is acquired to determine whether the surface roughness of the workpiece meets the requirements; when it is determined that the workpiece moves through a thickness detection assembly at the second grinding mechanism, a signal of the thickness detection assembly is acquired to determine whether the total thickness variation of the workpiece meets the requirements; and after the worktable moves back to the second grinding mechanism, the worktable is moved to the upper and lower positions of the workpiece along the first direction. The application can realize online detection of the surface roughness and total thickness variation of the workpiece.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor device processing, in particular to a grinding and polishing method, system and grinding and polishing equipment. BACKGROUND

[0002] A thinning machine is a special equipment for wafer processing.

[0003] The patent document with the application publication number US10154794A1 discloses a usable thinning machine.

[0004] The thinning machine has four worktables and is provided with two grinding mechanisms and a polishing mechanism to simultaneously process wafers on three worktables.

[0005] In the thinning machine, after the polishing of the wafer is completed at the polishing mechanism and the wafer is cleaned, the wafer is loaded back into the magazine, and the magazine needs to be transported to a downstream detection station for detection of the total thickness variation and surface roughness of the workpiece in the magazine, etc.

[0006] In this way, when the wafer is detected, the wafer needs to be taken out from the magazine again, and since the wafer is already very thin, the additional transfer process greatly increases the risk of wafer damage. SUMMARY

[0007] The purpose of the present application is to solve the above-mentioned problems existing in the prior art and provide a grinding and polishing method, system and grinding and polishing equipment.

[0008] The purpose of the present application is achieved by the following technical solutions:

[0009] The grinding and polishing method comprises the following steps:

[0010] Rotating the indexing table in a first direction to rotate the worktable with the workpiece fixed on the top surface to the first grinding mechanism, the second grinding mechanism and the polishing mechanism in turn for grinding;

[0011] After the grinding is completed at the polishing mechanism, the top surface of the workpiece on the worktable at the polishing mechanism is cleaned and dried by the cleaning mechanism;

[0012] Rotating the indexing table in a second direction to drive the worktable to move to the second grinding mechanism, and rotating the worktable, the second direction being opposite to the first direction;

[0013] During the process that the roughness detection assembly beside the polishing mechanism detects the surface roughness of the workpiece on the worktable, the signal of the roughness detection assembly is acquired to determine whether the surface roughness of the workpiece on the worktable meets the requirements;

[0014] The thickness measuring assembly at the second grinding mechanism can detect the workpiece on the worktable, acquire signals of the thickness measuring assembly, and determine whether the total thickness variation of the workpiece on the worktable meets the requirements.

[0015] When the worktable moves back to the second grinding mechanism, the indexing table is rotated in the first direction to move the worktable to the workpiece loading / unloading position.

[0016] Preferably, the thickness measuring assembly at the second grinding mechanism is located on the side of the second grinding mechanism close to the polishing mechanism.

[0017] Preferably, the roughness detecting assembly is located on the side of the polishing mechanism close to the second grinding mechanism.

[0018] Preferably, the axis of the detection head of the roughness detecting assembly passes through a group of circles with centers at the table surfaces of the worktables, and the axis of the detection head of the thickness measuring assembly at the second grinding mechanism passes through a group of circles with centers at the table surfaces of the worktables.

[0019] Preferably, the speed of the indexing table rotating in the first direction is greater than the speed of the indexing table rotating in the second direction.

[0020] Preferably, the speed of the indexing table driving the worktable to move from the second grinding mechanism to the workpiece loading / unloading position is greater than the speed of the indexing table driving the worktable to move from the workpiece loading / unloading position to the first grinding mechanism, the second grinding mechanism, and the polishing mechanism in sequence.

[0021] Preferably, the polishing mechanism and the second grinding mechanism are arranged on opposite sides of the indexing table; a centering mechanism is arranged on the side of the polishing mechanism; a first connecting line connecting the axis of a wafer table of the centering mechanism and the axis of the worktable in the workpiece loading / unloading position extends in direction one, which is perpendicular to direction two, and direction two is the extension direction of a second connecting line connecting the centers of the table surfaces of the two worktables at the first grinding mechanism and the second grinding mechanism; the workpiece at the centering mechanism is moved to the worktable in the workpiece loading / unloading position by a suspended loading mechanism, and the workpiece on the worktable in the workpiece loading / unloading position is transferred to a cleaning device by an unloading mechanism, and the cleaning device is arranged on the side of the centering mechanism deviated from the polishing mechanism.

[0022] Preferably, a tool setting mechanism is arranged on the side of the first grinding mechanism and / or the second grinding mechanism and / or the polishing mechanism.

[0023] A polishing system, comprising:

[0024] The grinding unit is used for controlling the indexing table to rotate in a first direction to rotate the worktable fixed with the workpiece on the top surface to the first grinding mechanism, the second grinding mechanism and the polishing mechanism in sequence for grinding;

[0025] The cleaning unit is used for controlling the cleaning mechanism to clean and dry the top surface of the workpiece on the worktable at the polishing mechanism after the grinding at the polishing mechanism is completed;

[0026] The reverse driving unit is used for controlling the indexing table to rotate in a second direction to drive the worktable to rotate to the second grinding mechanism and to rotate the worktable, wherein the second direction is opposite to the first direction;

[0027] The roughness detection unit is used for acquiring a signal of the roughness detection assembly beside the polishing mechanism and determining whether the surface roughness of the workpiece on the worktable meets the requirement in the process that the roughness detection assembly can detect the workpiece on the worktable;

[0028] The total thickness variation detection unit is used for acquiring a signal of the thickness measurement assembly at the second grinding mechanism and determining whether the total thickness variation of the workpiece on the worktable meets the requirement in the process that the thickness measurement assembly can detect the workpiece on the worktable;

[0029] The feeding and discharging position returning unit is used for controlling the indexing table to rotate in the first direction to drive the worktable to move to the workpiece feeding and discharging position for feeding and discharging when the worktable moves back to the second grinding mechanism.

[0030] The polishing equipment comprises a memory and a processor, the memory stores a program executable by the processor, and the program is executed to implement the polishing method.

[0031] The technical scheme of the present application has the following advantages:

[0032] The roughness detection assembly is arranged beside the polishing mechanism, the indexing table is driven to rotate reversely after polishing, the worktable is rotated, the surface roughness of the workpiece on the worktable is measured when the workpiece passes through the roughness detection assembly, the total thickness variation of the workpiece on the worktable is detected when the workpiece rotates to the thickness measurement assembly at the second grinding mechanism, the on-line detection is effectively realized, the process that the polished workpiece is loaded into a box and then conveyed to the downstream for detection is omitted, the risk of wafer damage during detection is avoided, the polished workpiece can be cleaned and dried by using relatively less polishing time, the dirt on the top surface of the workpiece is effectively removed, and the subsequent detection accuracy is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 is a top view of the polishing equipment of the present application;

[0034] Figure 2 is a flow chart of the polishing method of the present application;

[0035] Figure 3 is a schematic diagram of the workpiece being fixed on the worktable at the upper and lower positions of the workpiece and starting to rotate towards the first grinding mechanism of the present application;

[0036] Figure 4 is a schematic diagram of the worktable with the workpiece fixed thereon rotating to the first grinding mechanism of the present application;

[0037] Figure 5 is a schematic diagram of the worktable with the workpiece fixed thereon rotating to the second grinding mechanism of the present application;

[0038] Figure 6 is a schematic diagram of the worktable with the workpiece fixed thereon rotating to the polishing mechanism of the present application;

[0039] Figure 7 is a schematic diagram of the indexing table rotating in the second direction to move the worktable with the workpiece fixed thereon towards the second grinding mechanism of the present application;

[0040] Figure 8 is a schematic diagram of the worktable with the workpiece fixed thereon rotating back to the second grinding mechanism of the present application;

[0041] Figure 9 is a schematic diagram of the worktable with the workpiece fixed thereon rotating in the first direction to the upper and lower positions of the workpiece of the present application;

[0042] Figure 10 is a schematic diagram of the tool setting mechanism of the present application;

[0043] Figure 11 is a front view of the tool setting detection assembly of the present application;

[0044] Figure 12 is a partial exploded perspective view of the tool setting detection assembly of the present application;

[0045] Figure 13 is a sectional view of the grinding wheel receiving assembly of the present application;

[0046] Figure 14 is an end view of the tool setting detection assembly of the present application;

[0047] Figure 15 is a schematic diagram of the tool setting detection assembly of the present application for tool setting of the grinding wheel and the worktable. DETAILED DESCRIPTION

[0048] The objects, advantages and features of the present application will be illustrated and explained by the following non-limiting description of preferred embodiments. These embodiments are only typical examples of the application, and any technical solution formed by equivalent substitution or equivalent transformation falls within the scope of the present application.

[0049] In the description of the schemes, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description and simplification of description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for the purpose of description and cannot be understood as indicating or implying relative importance.

[0050] Embodiment 1

[0051] The polishing method disclosed in the present application will be described below in conjunction with the drawings. The polishing method is based on a polishing device, such as the polishing device shown in Fig. 1, which comprises a dividing table 100, four worktables 200 arranged equidistantly on the dividing table 100, a first grinding mechanism 300, a second grinding mechanism 400 and a polishing mechanism 500 distributed along the circumference of the dividing table 100, and when a workpiece on one worktable 200 is processed at the first grinding mechanism 300, a workpiece on another worktable 200 is processed at the second grinding mechanism 400, a workpiece on another worktable 200 is processed at the polishing mechanism 500, and the last worktable 200 is located at the upper and lower positions of the workpiece for loading and unloading. Figure 1 Unlike the prior art, as shown in Fig. 1, the present application is provided with a roughness detection assembly 600 beside the polishing mechanism 500 for detecting the surface roughness of the workpiece on the worktable 200. The roughness detection assembly 600 is preferably a white light interference scanner, and its specific structure and detection principle are known technology, which will not be described here. The white light interference scanner can be hung in the polishing device by a suspension member, and the white light interference scanner can also be connected to a height adjustment mechanism for driving it to move up and down, such as a servo module or an electric cylinder.

[0052] Figure 1 As shown in Fig. 1, the polishing device of the present application is provided with a roughness detection assembly 600 beside the polishing mechanism 500 for detecting the surface roughness of the workpiece on the worktable 200. The roughness detection assembly 600 is preferably a white light interference scanner, and its specific structure and detection principle are known technology, which will not be described here. The white light interference scanner can be hung in the polishing device by a suspension member, and the white light interference scanner can also be connected to a height adjustment mechanism for driving it to move up and down, such as a servo module or an electric cylinder.

[0053] As shown in Fig. 1, the polishing device of the present application is provided with a roughness detection assembly 600 beside the polishing mechanism 500 for detecting the surface roughness of the workpiece on the worktable 200. The roughness detection assembly 600 is preferably a white light interference scanner, and its specific structure and detection principle are known technology, which will not be described here. The white light interference scanner can be hung in the polishing device by a suspension member, and the white light interference scanner can also be connected to a height adjustment mechanism for driving it to move up and down, such as a servo module or an electric cylinder. Figure 1 ​As shown, the roughness detection component 600 is positioned on the side of the polishing mechanism 500 close to the second grinding mechanism 400. Its specific position can be determined as needed. For example, the roughness detection component 600 can be located between the polishing mechanism 500 and the second grinding mechanism, and the axis of the detection head of the roughness detection component 600 passes through the circle O1 where the center of the table surface of the set of worktables 200 is located. This allows the roughness detection component 600 to cover as much area of ​​the workpiece as possible, thereby maximizing the reliability of roughness detection.

[0054] The thickness measuring component 700 at the second grinding mechanism 400 uses a known non-contact thickness measuring device for thickness measurement, such as a distance sensor, which is not limited here. The thickness measuring component 700 at the second grinding mechanism 400 is located on the side of the second grinding mechanism 400 closer to the polishing mechanism 500, and the axis of its detection head passes through the circle O1 where the center of the table surface of the set of worktables 200 is located. This also allows the thickness measuring component 700 to cover as much area of ​​the workpiece as possible, thereby maximizing the reliability of the detection of total thickness changes.

[0055] As attached Figure 1 As shown, a cleaning mechanism 800 is provided next to the polishing mechanism 500 for cleaning and drying the top surface of the workpiece on the worktable 200 located at the polishing mechanism 500. The cleaning mechanism 800 includes, for example, at least one nozzle or spray block that sprays cleaning fluid toward the workpiece on the worktable 200 located at the polishing mechanism 500. The spray block has a row of nozzles so that the coverage width of the sprayed liquid and / or gas can reach the radius of the workpiece as much as possible, thereby better cleaning the rotating workpiece. Furthermore, the nozzle or spray block can be connected not only to a liquid supply system but also to an air supply system, so that the workpiece can be dried by blowing air after rinsing. Of course, a separate air-purifying nozzle or spray block can also be used for drying the workpiece; this is not limited here.

[0056] Meanwhile, the grinding and polishing equipment may include three material box placement positions. One material box placement position 900 is equipped with a defective part material box, which is used to recycle workpieces that fail the total thickness change detection or surface roughness test. The other two material box placement positions are used to place material boxes containing workpieces to be processed and recycled qualified workpieces.

[0057] Correspondingly, as shown in the appendix Figure 2 As shown, the polishing method includes the following steps:

[0058] After a workpiece N is concentrically placed on the worktable 200 located above and below the workpiece, the worktable 200 fixes the workpiece in place, as shown in the attached figure. Figure 3 As shown.

[0059] The indexing table is controlled to rotate in the first direction D1, thereby driving the worktable 200 to rotate to the first grinding mechanism 300, the second grinding mechanism 400 and the polishing mechanism 500 in sequence for grinding; that is, the indexing table 100 is first rotated by 90° in the first direction. At this time, as shown in FIG. 2, the worktable 200 with the workpiece fixed thereon is rotated to the first grinding mechanism 300, and the first grinding mechanism 300 grinds the workpiece for a period of time. After the grinding is completed at the first grinding mechanism 300, the indexing table 100 is again rotated by 90° in the first direction. At this time, as shown in FIG. 3, the worktable 200 is rotated to the second grinding mechanism 400 for grinding. After the grinding is completed at the second grinding mechanism 400, the indexing table 100 is again rotated by 90° in the first direction. As shown in FIG. 4, the worktable 200 is rotated to the polishing mechanism 500 for polishing. The polishing mechanism adopts a dry polishing manner to polish the workpiece on the worktable 200. Figure 4 Figure 5 Figure 6

[0060] After the grinding is completed at the polishing mechanism 500, the top surface of the workpiece on the worktable 200 is cleaned and dried by the cleaning mechanism 800; that is, water is sprayed to the top surface of the workpiece on the worktable 200 by a nozzle or a spray block while the worktable 200 is kept rotating. After a period of time, air is sprayed to the top surface of the workpiece to dry the workpiece. In addition, hot air can be sprayed to the workpiece to accelerate the drying of the workpiece.

[0061] After the drying is completed, as shown in FIG. 5, the indexing table 100 is controlled to rotate in the second direction D2 to drive the worktable 200 to rotate to the second grinding mechanism 400. While the indexing table 100 rotates in the second direction, the worktable 200 rotates. The second direction is opposite to the first direction. The speed of the indexing table 100 rotating in the second direction is less than the speed of the indexing table 100 rotating in the first direction. For example, the speed of the indexing table 100 rotating in the first direction is 90° / s, and the speed of the indexing table 100 rotating in the second direction is 15° / s, which is not limited herein. Meanwhile, the speed of the worktable 200 rotating can be set according to requirements, for example, between 1-5 revolutions / s, so as to effectively ensure that the roughness detection assembly 600 can detect more areas of the top surface of the workpiece, thereby improving the coverage of detection. Figure 6

[0062] Figure 7 ​​​​​As shown, if it is determined that the roughness detection assembly 600 can detect the workpiece on the worktable, the signal of the roughness detection assembly 600 can be started to be acquired, for example, a proximity sensor can be arranged beside the roughness detection assembly 600 to detect the workpiece on the worktable, the proximity sensor can be arranged side by side on the side of the detection head of the roughness detection assembly 600 away from the axis of the indexing table, when the proximity sensor detects the workpiece, it can be determined that the workpiece starts to move to the detection range of the roughness detection assembly 600, at this time, the signal of the roughness detection assembly 600 can be started to be acquired. Of course, it can also be determined in advance that the worktable at the polishing mechanism can detect the workpiece on the worktable when the indexing table rotates in the second direction by a certain angle, for example, when the indexing table rotates in the second direction by 30°-80°, the workpiece will move through the measurement range of the roughness detection assembly 600, at this time, the angle range of the indexing table rotating in the second direction is stored, and subsequently when it is determined that the indexing table rotates in the second direction by an angle within the above angle range, the signal of the roughness detection assembly 600 is continuously acquired.

[0063] Alternatively, the roughness detection assembly 600 itself is located above the worktable at the polishing mechanism, when the worktable is located at the polishing mechanism, the workpiece thereon is located in the detection range of the roughness detection assembly 600, therefore, when the worktable moves to the polishing mechanism to complete cleaning and drying, the signal of the roughness detection assembly can be started to be acquired.

[0064] When the roughness detection assembly 600 starts to detect the workpiece on the worktable rotating to the second grinding mechanism, the signal of the roughness detection assembly 600 is continuously acquired and the surface roughness of the workpiece on the worktable 200 is determined according to the signal, that is, whether the surface roughness exceeds the threshold value, if it exceeds, it means that the surface roughness does not meet the requirements, otherwise, it means that the surface roughness meets the requirements; and when it is determined that the roughness detection assembly 600 cannot detect the workpiece, the signal of the roughness detection assembly 600 is stopped to be acquired.

[0065] When the indexing table rotates in the second direction, the workpiece on the worktable rotates past the thickness measuring component 700 at the second grinding mechanism 400. During the process of the workpiece on the worktable 200 moving past the thickness measuring component, the signal from the thickness measuring component 700 is acquired, and it is determined whether the total thickness change of the workpiece on the worktable 200 meets the requirements. Specifically, the thickness measured by the thickness measuring component 700 can be compared with the desired workpiece thickness to determine whether the workpiece has moved to the thickness measuring component 700. That is, when the thickness measured by the thickness measuring component 700 is the same as or the difference is within a threshold range, it can be determined that the workpiece has started to pass the thickness measuring component. Alternatively, the thickness measuring component uses a distance sensor to measure the thickness. In this case, the distance measured by the thickness measuring component can be used to determine whether the workpiece has passed the thickness measuring component. When an area on the worktable with a workpiece passes the thickness measuring component, the thickness measuring component measures the distance from the workpiece to the top surface of the workpiece. When the worktable surface or the indexing table passes the thickness measuring component, the thickness measuring component measures the distance from the worktable or the indexing table to the worktable or the indexing table. Of course, the angle range of the indexing table rotating in the second direction during the process of the workpiece passing through the thickness measuring component can also be determined in advance, so that when the angle of rotation of the indexing table is determined to be within the predetermined angle range, the signal of the thickness measuring component can be obtained.

[0066] Once the workpiece is detected by the thickness measuring component, the signal of the thickness measuring component can be acquired in real time. When the thickness measuring component 700 cannot detect the workpiece, it can be determined whether the difference between the maximum and minimum values ​​in the data measured by the thickness measuring component during the period when the thickness measuring component 700 can detect the workpiece exceeds a threshold to determine whether the total thickness change meets the requirements. If the difference exceeds the threshold, it indicates that the total thickness change does not meet the requirements; otherwise, it can be determined that the total thickness change meets the requirements.

[0067] As attached Figure 8 Appendix Figure 9 As shown, after the worktable 200 moves back to the second grinding mechanism 400, the indexing table 100 rotates along the first direction to move the worktable 200 to the upper / lower position of the workpiece for loading and unloading. Furthermore, after the worktable 200 moves back to the second grinding mechanism, it can continue to rotate several times before stopping and moving along the first direction to the upper / lower position of the workpiece for loading and unloading.

[0068] Example 2

[0069] Unlike Embodiment 1 described above, in this embodiment, as shown in the appendix... Figure 1As shown, the polishing mechanism 500 and the second grinding mechanism 400 are arranged on opposite sides of the indexing table 100. That is, the first grinding mechanism 300 and the second grinding mechanism 400 are arranged on one side of the indexing table 100, and the polishing mechanism 500 is arranged on the other side of the indexing table 100 opposite the second grinding mechanism 400.

[0070] As shown in the accompanying drawings, the polishing mechanism 500 is arranged on the indexing table 100. Figure 1 As shown, a centering mechanism A00 is arranged on the side of the polishing mechanism 500 of the indexing table 100. The centering mechanism A00 includes a slide A10 and a set of centering rods that contract or expand towards the axis of the slide A10. The specific structure of the centering mechanism A00 is known and will not be described here. The axis of the slide A10 of the centering mechanism A00 and the first connecting line B00 between the axes of the worktables 200 in the upper and lower positions of the workpiece extend in a direction F1, which is perpendicular to a direction F2, which is the extension direction of the second connecting line C00 between the centers of the table surfaces of the two worktables 200 in the first grinding mechanism 300 and the second grinding mechanism 400.

[0071] The polishing apparatus further includes a feeding mechanism D00 suspended above the centering mechanism A00 and the indexing table 100. The feeding mechanism D00 includes a translation assembly D10, a lifting assembly D20 driven by the translation assembly D10 to move in the direction F1, and a suction cup assembly D30 driven by the lifting assembly D20 to move up and down. The translation assembly D10 is, for example, a linear module. The lifting assembly D20 can also be a linear module or a structure composed of a motor and a lead screw. The specific structure of the suction cup assembly D30 is known and will not be described here. The axis of the suction cup D31 of the suction cup assembly D30 intersects perpendicularly with the first connecting line B00. The feeding mechanism D00 is used to transfer the workpiece centered in the centering mechanism A00 to the worktable 200 in the upper and lower positions of the workpiece.

[0072] Meanwhile, a cleaning device E00 is arranged on the side of the centering mechanism A00 away from the polishing mechanism 500. The cleaning device E00 is used to clean the top surface of the workpiece, and the specific structure of the cleaning device E00 is known and will not be described here. Meanwhile, a discharging mechanism F00 is arranged on the side of the centering mechanism A00 away from the polishing mechanism 500. The discharging mechanism F00 is located between the cleaning device E00 and the indexing table 100. The discharging mechanism F00 is used to transfer the workpiece that has completed grinding and detection on the worktable 200 in the upper and lower positions of the workpiece to the cleaning device E00 for cleaning. The specific structure of the discharging mechanism F00 is known and will not be described here.

[0073] Further, the polishing and grinding equipment further comprises a loading and unloading robot G00 which is located beside the centering mechanism A00 and on the side of the polishing mechanism 500 away from the second grinding mechanism 400. The loading and unloading robot G00 is used to transfer the workpieces in the box to the centering mechanism A00 and transfer the workpieces cleaned in the cleaning device E00 to the box. The specific structure of the loading and unloading robot G00 is known in the art, and thus will not be described here. After cleaning, the workpieces are loaded into the box by the loading and unloading robot G00. When loaded into the box, the workpieces can be determined to be loaded into which box according to whether the total thickness variation and the surface roughness of the workpieces meet the requirements. For example, when at least one of the total thickness variation and the surface roughness of the workpieces does not meet the requirements, the workpieces are loaded into the unqualified workpiece box, and otherwise, the workpieces are loaded into the box where the workpieces originally come from.

[0074] As shown in FIG. 1, a tool setting mechanism H00 can be arranged beside the first grinding mechanism 300, the second grinding mechanism 400 and the polishing mechanism. Figure 1

[0075] As shown in FIG. 1, the tool setting mechanism comprises a base frame H01 which comprises a column H02. The bottom of the column H02 is provided with a base plate which is arranged on a rotating mechanism H03 which drives the column H02 to rotate around the axis of the column H02. The rotating mechanism H03 is preferably a rotating cylinder, and of course, other feasible structures can also be used, for example, a rotating table, and a pneumatic motor can be used to drive the rotating mechanism H03. Figure 10

[0076] The top of the column H02 is connected to one end of a horizontal plate H04. The other end of the horizontal plate H04 is provided with a tool setting detection assembly H05. The rotating mechanism H03 drives the tool setting detection assembly H05 to move between a waiting position and a tool setting position. In the waiting position, the tool setting detection assembly H05 is located in a protective cover H06 outside the workbench 200. The protective cover H06 can be a rectangular cover with a door which can be automatically opened and closed. Meanwhile, the top of the protective cover H06 is provided with a cleaning nozzle H07 which is used to clean the receiving disc H26 of the tool setting detection assembly H05 located in the protective cover H06.

[0077] As shown in FIG. 1, a tool setting mechanism H00 can be arranged beside the first grinding mechanism 300, the second grinding mechanism 400 and the polishing mechanism. Figure 11 ​​As shown, the tool detection assembly H05 includes a guide frame H08, the guide frame H08 includes a fixed block H09 connected with the horizontal plate H04, the fixed block H09 is provided with a horizontally extending first clamping groove H10 on the side facing the horizontal plate H04, the horizontal plate H04 is inserted in the first clamping groove H10 away from the stand H02, and both are screwed and fixed. The side of the fixed block H09 away from the horizontal plate H04 is provided with a horizontally extending second clamping groove, and a horizontal limiting plate H11 is arranged at the second clamping groove. The limiting plate H11 is also fixed with the fixed block H09 by screwing.

[0078] As shown in the accompanying drawings, Figure 11 The limiting plate H11 abuts against the movable block H13 of the elastic up-down mechanism H12, and the movable block H13 can move up and down relative to the limiting plate H11. Specifically, the end of the limiting plate H11 is embedded in the groove H14 inside the movable block H13, and the limiting plate H11 connects the connecting shaft H16 inside the movable block H13 through the elastic connecting piece H15. The elastic connecting piece H15 is preferably a tension spring, of course, it can also be other devices with elastic deformation ability, such as elastic band, etc. And a group of the tension spring is arranged on both sides of the limiting plate H11, each group is provided with three tension springs, the upper end of the tension spring is hung in the hanging hole arranged at the end of the flat plate H17 on the top of the limiting plate H11, and the connecting shaft H16 is provided with a ring groove corresponding to the hook of the lower end of each tension spring.

[0079] As shown in the accompanying drawings, Figure 12 In order to ensure the integrity of the movable block H13 and the fixed block H09, the movable block H13 is connected with the fixed block H09 through at least one elastic sheet H18, which can be a metal sheet or a plastic sheet. Preferably, an elastic sheet H18 is fixed between the top of the movable block H13 and the top of the fixed block H09, and another elastic sheet H18 is fixed between the bottom of the movable block H13 and the bottom of the fixed block H09. The movable block H13 is connected with the elastic sheet H18 through the first fastening plate H19 screwed on the top and the bottom thereof, and the fixed block H09 is connected with the elastic sheet H18 through the second fastening plate H20 screwed on the top and the bottom thereof.

[0080] As shown in the accompanying drawings, Figure 12 In order to improve the rigidity of the two elastic sheets H18, each elastic sheet H18 is clamped between two reinforcing plates H21, and the two reinforcing plates H21 are located between the movable block H13 and the fixed block H09. Specifically, each elastic sheet H18 is screwed with the two reinforcing plates H21 above and below it to form an integral whole, and the two ends of the reinforcing plate H21 are close to the movable block H13 and the fixed block H09 with a small gap.

[0081] As attached Figure 11 As shown, the limiting plate H11 has a forward protrusion H22 at one end facing the movable block H13. The forward protrusion H22 is embedded in the groove H14. The elastic connector H15 makes the lower groove wall of the groove H14 fit against the bottom surface of the forward protrusion H22. At the same time, the reinforcing plate H21 is kept in an inclined state, and the side of the reinforcing plate H21 closer to the movable block H13 is higher than its opposite side. The inclination angle of the reinforcing plate H21 does not exceed 5°.

[0082] As attached Figure 11 As shown, the movable block H13 is provided with grinding wheel receiving components H23 and contact detection devices H24 distributed vertically.

[0083] As attached Figure 13 Appendix Figure 14 As shown, the grinding wheel receiving assembly H23 is located on the side of the movable block H13 facing away from the fixed block H09. It includes a mounting block H25 fixed to the fixed block H09. The mounting block H25 is L-shaped and located near the top of the fixed block H09. A receiving plate H26 protruding above the movable block is provided on the mounting block H25. To better maintain the receiving plate H26 in a horizontal position, three triangularly distributed support members are provided on the mounting block H25. The receiving plate H26 is held horizontally by elastic members H28 that apply a downward pulling force to it against the three support members, meaning the axis of the receiving plate H26 extends vertically.

[0084] Specifically, a connecting post H39 is coaxially disposed at the bottom of the receiving plate H26. The connecting post H39 passes through a countersunk hole H29 on the mounting block H25. The diameter of the upper section of the countersunk hole H29 is smaller than the diameter of the lower section. An abutment plate H30 is sleeved on the connecting post H39, located below the mounting block H25. The diameter of the abutment plate H30 is larger than the diameter of the lower section of the countersunk hole H29. The abutment plate H30 is threadedly connected to a limiting screw located below the connecting post H39. The female H31 is defined on the connecting post H39. The large hole section of the countersunk hole H29 is provided with the elastic element H28. The elastic element H28 is preferably a spring, but it can also be a leaf spring, etc. The spring is fitted on the outer periphery of the connecting post H39, with one end connected to the stepped surface of the countersunk hole H29 and the other end connected to the abutment plate H30. The spring is normally kept in a compressed state, so that the spring applies downward pressure to the abutment plate H30, thereby keeping the receiving plate H26 abutting against the three support members.

[0085] The three support members can be three columns or three platforms, preferably, the three support members are three spheres, one sphere is embedded in the first limiting groove H32 at the bottom of the receiving disc H26, the groove surface of the first limiting groove H32 is a conical surface or a spherical surface, another sphere is embedded in the radial groove H33 at the bottom of the receiving disc H26 and extending along the radial direction of the receiving disc H26, and the last sphere abuts against the bottom surface of the receiving disc H26.

[0086] For the convenience of description, the three spheres are defined as a first sphere H34, a second sphere H35 and a third sphere H36, the first sphere H34 is directly embedded in the second limiting groove H37 provided on the top surface of the mounting block H25, the groove surface of the second limiting groove H37 is a conical surface or a spherical surface, the first sphere H34 is also embedded in the first limiting groove H32 at the bottom of the receiving disc H26, the diameter of the first sphere H34 is greater than the diameters of the second sphere H35 and the third sphere H36, and the gap between the receiving disc H26 and the mounting block H25 is maintained. The second sphere H35 is arranged at the top of the height-adjusting column H38, the height-adjusting column H38 is threadedly connected in the screw hole of the mounting block H25, and the second sphere H35 is embedded in the radial groove H33, which can be a V-shaped groove or an arc-shaped groove. The third sphere H36 is also arranged at the top of a height-adjusting column H38, the height-adjusting column H38 is threadedly connected to the mounting block H25, and the third sphere H36 abuts against the bottom surface of the mounting block H25. Embedding the first sphere H34 in the second limiting groove H37 of the mounting block H25 can effectively simplify the mounting structure of the first sphere H34, and embedding the second sphere H35 in the radial groove H33 can effectively cooperate with the first sphere H34 embedded in the bottom of the receiving disc H26 to limit the rotation and translation of the receiving disc H26 relative to the three support members. Meanwhile, the heights of the second sphere H35 and the third sphere H36 can be conveniently adjusted, and the heights of the second sphere H35 and the third sphere H36 can be adjusted to ensure that the receiving disc H26 is in a horizontal state, i.e., the axis of the receiving disc H26 extends along the vertical direction. Meanwhile, the connecting column can be locked by a nut and the mounting block to ensure the stability of the heights of the second sphere H35 and the third sphere H36.

[0087] The contact detection device H24 can adopt different devices according to the needs, for example, the contact detection device H24 can be a known pressure sensor, and the axis of the probe H40 extends along the vertical direction and downward; or the contact detection device H24 is a known normally open contact sensor or a normally closed contact sensor, and the probe thereof also faces downward. Moreover, the axis of the receiving disc H26 is coaxial with the axis of the probe.

[0088] When the above-mentioned tool setting mechanism H00 is used for tool setting, the process is as follows:

[0089] The tool setting detection assembly H05 is located at a tool setting position, at which the receiving disc H26 of the tool setting detection assembly H05 is located below the grinding wheel J00 and within the projection range of the grinding wheel on the horizontal plane, and the probe H40 gap of the contact detection device H24 of the tool setting detection assembly H05 is located above the workbench 200 and within the tabletop range of the workbench 200, and the distance between the probe and the workbench 200 is less than the moving stroke of the movable block H13, as shown in FIG. 6. Figure 15

[0090] The spindle on which the grinding wheel is located is driven downward by a lifting mechanism, at which time the grinding wheel can be moved downward at a relatively fast speed, and the signal of the contact detection device H24 is acquired in real time during the downward movement of the grinding wheel. During the downward movement of the grinding wheel, the grinding wheel is pressed on the receiving disc H26, at which time, as the grinding wheel continues to move downward, the elastic sheet H18 can be deformed, so that the movable block H13 can move downward relative to the guide frame H08. As the movable block H13 moves downward, the probe of the contact detection device H24 on the movable block H13 moves downward and contacts the top surface of the workbench 200 and generates a trigger signal, as shown in FIG. 7. When the contact detection device H24 is a pressure sensor, the trigger signal is the signal that the pressure sensor starts to generate pressure; when the contact detection device H24 is a normally open contact sensor, the trigger signal is the signal that the normally open contact sensor is closed. Because the movable block H13 has a certain elasticity and the probe of the contact detection device H24 has a certain buffering capacity, the problem caused by the hard contact between the grinding wheel and the receiving disc H26 and between the workbench 200 and the tool setting detection assembly H05 when the grinding wheel moves downward at a relatively fast speed can be effectively avoided. Figure 15

[0091] When it is determined according to the signal of the pressure sensor that the contact detection device H24 contacts the top surface of the workbench 200, it is determined that the grinding wheel is moved downward from the original height to the downward movement height H1 corresponding to the current position, as shown in FIG. 8; at the same time, the grinding wheel can be stopped from moving downward, or the grinding wheel can be moved upward in the reverse direction. Figure 15

[0092] According to the downward movement height H1 and the distance H2 between the top surface of the receiving disc H26 and the lower end of the probe of the contact detection device H24, it is determined that the distance by which the grinding wheel needs to be moved downward from the original height when the grinding wheel starts to contact the workbench 200. That is, the downward movement height H1 plus the distance H2 between the top surface of the receiving disc H26 and the lower end of the probe of the contact detection device H24 is the distance by which the grinding wheel needs to be moved downward from the original height when the grinding wheel starts to contact the workbench 200.

[0093] ​​​After the alignment of the tool is completed, the alignment detection assembly H05 is moved to the outside of the workbench by the rotating mechanism, and then the grinding can be performed.

[0094] Embodiment 3

[0095] The embodiment discloses a grinding and polishing system, comprising:

[0096] A grinding unit is configured to control the indexing table to rotate in a first direction to sequentially rotate the workbench with the workpiece fixed on the top surface to the first grinding mechanism, the second grinding mechanism and the polishing mechanism for grinding.

[0097] A cleaning unit is configured to control the cleaning mechanism to clean and dry the top surface of the workpiece on the workbench at the polishing mechanism after the grinding is completed at the polishing mechanism.

[0098] A reverse driving unit is configured to control the indexing table to rotate in a second direction to drive the workbench to rotate to the second grinding mechanism and to rotate the workbench, the second direction being opposite to the first direction.

[0099] A roughness detection unit is configured to acquire a signal of a roughness detection assembly at the polishing mechanism and determine whether the surface roughness of the workpiece on the workbench meets the requirements during the process that the roughness detection assembly can detect the workpiece on the workbench.

[0100] A total thickness variation detection unit is configured to acquire a signal of a thickness measurement assembly at the second grinding mechanism and determine whether the total thickness variation of the workpiece on the workbench meets the requirements during the process that the thickness measurement assembly can detect the workpiece on the workbench.

[0101] A workpiece loading and unloading position returning unit is configured to control the indexing table to rotate in the first direction to drive the workbench to move to the workpiece loading and unloading position for loading and unloading when the workbench moves back to the second grinding mechanism.

[0102] Embodiment 4

[0103] The embodiment discloses a grinding and polishing device, comprising a memory and a processor, the memory stores a program executable by the processor, and the program is executed to implement the grinding and polishing method as any of the above.

[0104] The present application has various embodiments, and all technical solutions formed by equivalent transformation or equivalent transformation fall within the protection scope of the present application.

Claims

1. A polishing method, characterized by, It comprises the following steps: The workbench with the workpiece fixed on the top surface is rotated to the first grinding mechanism, the second grinding mechanism and the polishing mechanism in sequence for grinding by rotating the indexing table in the first direction; a tool setting mechanism is arranged beside the first grinding mechanism and / or the second grinding mechanism and / or the polishing mechanism, the tool setting mechanism comprises a base frame, the base frame is connected with a rotating mechanism, a tool setting detection assembly is arranged on the base frame, the rotating mechanism drives the tool setting detection assembly to move between a waiting position and a tool setting position, the tool setting detection assembly comprises a guide frame, the guide frame comprises a fixed block, a horizontal limiting plate is arranged on the side of the fixed block away from the base frame, the limiting plate abuts against a movable block of an elastic up-down mechanism, the end of the limiting plate is embedded in the groove on the inner side of the movable block, the limiting plate is connected with the connecting shaft on the inner side of the movable block through an elastic connecting piece, the elastic connecting piece makes the lower groove wall of the groove and the bottom surface of the front convex part of the limiting plate fit, and the movable block can move up and down relative to the limiting plate, the movable block is connected with the fixed block through the elastic sheets on the top and bottom thereof, the movable block is connected with the elastic sheets through the first fastening plates screwed on the top and bottom thereof, and the fixed block is connected with the elastic sheets through the second fastening plates screwed on the top and bottom thereof; An up-down distributed grinding wheel receiving assembly and a contact detection device are arranged on the movable block, the grinding wheel receiving assembly comprises a mounting block fixed on the fixed block, a receiving disc protruding above the movable block is arranged on the mounting block, three support pieces distributed in a triangular shape are arranged on the mounting block, the receiving disc abuts against the three support pieces and keeps horizontal through the elastic force of the elastic pieces applying downward pulling force thereto; the probe gap of the contact detection device is located above the workbench, and the distance between the probe and the workbench is less than the moving stroke of the movable block; After the grinding at the polishing mechanism is completed, the top surface of the workpiece on the workbench at the polishing mechanism is cleaned and dried through a cleaning mechanism; The workbench is driven to move to the second grinding mechanism and self-rotate by rotating the indexing table in the second direction, and the second direction is opposite to the first direction; During the process that the roughness detection assembly beside the polishing mechanism can detect the workpiece on the workbench, the signal of the roughness detection assembly is acquired to determine whether the surface roughness of the workpiece on the workbench meets the requirements; During the process that the thickness measuring assembly at the second grinding mechanism can detect the workpiece on the workbench, the signal of the thickness measuring assembly is acquired to determine whether the total thickness variation of the workpiece on the workbench meets the requirements; After the workbench moves back to the second grinding mechanism, the workbench is moved to the workpiece up-down position by rotating the indexing table in the first direction for up-down feeding.

2. The method of claim 1, wherein: The thickness measuring assembly at the second grinding mechanism is located on the side of the second grinding mechanism close to the polishing mechanism.

3. The method of claim 1, wherein: The roughness detection assembly is located on the side of the polishing mechanism close to the second grinding mechanism.

4. The method of claim 1, wherein: The axis of the detection head of the roughness detection assembly passes through a circle of the centers of the table surfaces of the worktables, and the axis of the detection head of the thickness detection assembly at the second grinding mechanism passes through a circle of the centers of the table surfaces of the worktables.

5. The method of claim 1, wherein: The speed of the indexing table rotating in the first direction is greater than the speed of the indexing table rotating in the second direction.

6. The method of claim 5, wherein: The speed of the indexing table driving the worktable to move to the workpiece upper and lower positions at the second grinding mechanism is greater than the speed of the indexing table driving the worktable to move to the workpiece upper and lower positions at the first grinding mechanism, the second grinding mechanism and the polishing mechanism in sequence.

7. The method of any of claims 1-6, wherein: The polishing mechanism and the second grinding mechanism are arranged on opposite sides of the indexing table; a centering mechanism is arranged on the side of the polishing mechanism; a first connecting line connecting the axis of a slide table of the centering mechanism and the axis of the worktable at the workpiece upper and lower position extends in a direction one, the direction one is perpendicular to a direction two, the direction two is the extending direction of a second connecting line connecting the centers of the table surfaces of the two worktables at the first grinding mechanism and the second grinding mechanism; the workpiece at the centering mechanism is moved to the worktable at the workpiece upper and lower position by a suspension feeding mechanism, and the workpiece on the worktable at the workpiece upper and lower position is transferred to a cleaning device by a discharging mechanism, the cleaning device is arranged on the side of the centering mechanism deviating from the polishing mechanism.

8. A polishing system characterized by, The grinding unit is used to control the indexing table to rotate in the first direction to rotate the worktable with the workpiece fixed on the top surface to the first grinding mechanism, the second grinding mechanism and the polishing mechanism in sequence for grinding; a tool setting detection assembly is arranged on the side of the first grinding mechanism and / or the second grinding mechanism and / or the polishing mechanism; the tool setting detection assembly comprises a base frame, a rotating mechanism connected to the base frame, a tool setting detection assembly arranged on the base frame, and a rotating mechanism driving the tool setting detection assembly to move between a waiting position and a tool setting position; the tool setting detection assembly comprises a guide frame comprising a fixed block, a horizontal limiting plate arranged on the side of the fixed block away from the base frame, a movable block of an elastic up-down mechanism abutting against the limiting plate, an end of the limiting plate embedded in a groove on the inner side of the movable block, a connecting shaft on the inner side of the movable block connected to the limiting plate through an elastic connecting piece, the elastic connecting piece making the lower groove wall of the groove and the bottom surface of the front convex part of the limiting plate fit, and the movable block being movable up and down relative to the limiting plate, the movable block being connected to the fixed block through elastic sheets on the top and bottom of the movable block, and the movable block being connected to the elastic sheets through first fastening plates screwed on the top and bottom of the movable block; the fixed block is connected to the elastic sheets through second fastening plates screwed on the top and bottom of the fixed block. ​ The movable block is provided with an upper and lower distribution of grinding wheel receiving assembly and contact detection device, the grinding wheel receiving assembly includes a mounting block fixed at the fixed block, the mounting block is provided with a receiving disc protruding above the movable block, the mounting block is provided with three triangularly distributed supports, the receiving disc is abutted on the three supports by the elastic force of the downward pulling force applied thereto and kept in a horizontal state; the probe gap of the contact detection device is located above the workbench, and the spacing between the probe and the workbench is less than the movement stroke of the movable block; a cleaning unit is used to control the cleaning mechanism to clean and dry the top surface of the workpiece on the workbench at the polishing mechanism after the grinding is completed at the polishing mechanism; A reverse driving unit is used to control the indexing table to rotate in a second direction to drive the workbench to rotate to the second grinding mechanism and make the workbench rotate, the second direction is opposite to the first direction; A roughness detection unit is used to obtain the signal of the roughness detection assembly and determine whether the surface roughness of the workpiece on the workbench meets the requirements during the process that the roughness detection assembly beside the polishing mechanism can detect the workpiece on the workbench; A total thickness variation detection unit is used to obtain the signal of the thickness measurement assembly and determine whether the total thickness variation of the workpiece on the workbench meets the requirements during the process that the thickness measurement assembly at the second grinding mechanism can detect the workpiece on the workbench; A back-up and down-loading position unit is used to control the indexing table to rotate in a first direction to drive the workbench to move to the workpiece up and down position for up and down loading when the workbench moves back to the second grinding mechanism.

9. A polishing apparatus comprising a memory and a processor, the memory having stored therein a program executable by the processor, characterized by: The program is executed to realize the grinding and polishing method of any one of claims 1-7.

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